CN103782365A - 掩模版吸盘洁净器及掩模版吸盘清洁方法 - Google Patents
掩模版吸盘洁净器及掩模版吸盘清洁方法 Download PDFInfo
- Publication number
- CN103782365A CN103782365A CN201280043092.0A CN201280043092A CN103782365A CN 103782365 A CN103782365 A CN 103782365A CN 201280043092 A CN201280043092 A CN 201280043092A CN 103782365 A CN103782365 A CN 103782365A
- Authority
- CN
- China
- Prior art keywords
- mask
- sucker
- cleaner
- mentioned
- mask sucker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0014—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by incorporation in a layer which is removed with the contaminants
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0028—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by adhesive surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011192595 | 2011-09-05 | ||
JP2011-192595 | 2011-09-05 | ||
PCT/JP2012/066041 WO2013035415A1 (ja) | 2011-09-05 | 2012-06-22 | レチクルチャッククリーナー及びレチクルチャッククリーニング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103782365A true CN103782365A (zh) | 2014-05-07 |
CN103782365B CN103782365B (zh) | 2016-10-05 |
Family
ID=47831869
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201280043092.0A Active CN103782365B (zh) | 2011-09-05 | 2012-06-22 | 掩模版吸盘洁净器及掩模版吸盘清洁方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9808841B2 (zh) |
JP (1) | JP5875197B2 (zh) |
KR (1) | KR101583167B1 (zh) |
CN (1) | CN103782365B (zh) |
TW (1) | TWI574114B (zh) |
WO (1) | WO2013035415A1 (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105988308A (zh) * | 2015-03-03 | 2016-10-05 | 上海凸版光掩模有限公司 | 一种掩模版上残胶的去除方法 |
CN109023241A (zh) * | 2018-09-18 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | 掩膜版和掩膜版的清洗方法 |
CN109513691A (zh) * | 2017-09-20 | 2019-03-26 | 台湾积体电路制造股份有限公司 | 晶圆座的清洁方法、半导体制作方法与清洁*** |
CN109782549A (zh) * | 2017-11-13 | 2019-05-21 | 佳能株式会社 | 基板处理装置以及物品制造方法 |
CN110899246A (zh) * | 2018-09-14 | 2020-03-24 | 长鑫存储技术有限公司 | 光罩缺陷的清洁装置及清洁方法 |
CN112210750A (zh) * | 2019-07-10 | 2021-01-12 | 佳能特机株式会社 | 成膜装置及方法、掩模的清洁方法及电子器件的制造方法 |
CN112934859A (zh) * | 2021-01-29 | 2021-06-11 | 泉芯集成电路制造(济南)有限公司 | 光罩杂质去除设备和光罩杂质去除方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10459353B2 (en) | 2013-03-15 | 2019-10-29 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithography system with an embedded cleaning module |
DE102014020027B3 (de) * | 2013-03-15 | 2023-03-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Lithographiesystem mit eingebettetem reinigungsmodul sowie verfahren |
JP6196123B2 (ja) * | 2013-10-18 | 2017-09-13 | 東芝メモリ株式会社 | チャッククリーナ及びクリーニング方法 |
JP2015176934A (ja) * | 2014-03-13 | 2015-10-05 | 株式会社東芝 | 静電チャッククリーナ、クリーニング方法、および露光装置 |
JP6419635B2 (ja) * | 2014-04-23 | 2018-11-07 | 株式会社アルバック | 保持装置、真空処理装置 |
JP6942117B2 (ja) * | 2015-08-14 | 2021-09-29 | エム キューブド テクノロジーズ, インコーポレイテッド | チャック面から汚染を除去するための方法 |
US11953838B2 (en) | 2018-11-09 | 2024-04-09 | Asml Holding N.V. | Lithography support cleaning with cleaning substrate having controlled geometry and composition |
KR20210107694A (ko) * | 2018-12-28 | 2021-09-01 | 에이에스엠엘 홀딩 엔.브이. | 리소그래피 시스템에서 지지 구조물을 세정하기 위한 장치 및 방법 |
US11199562B2 (en) | 2019-08-08 | 2021-12-14 | Western Digital Technologies, Inc. | Wafer testing system including a wafer-flattening multi-zone vacuum chuck and method for operating the same |
TW202331426A (zh) * | 2020-06-01 | 2023-08-01 | 荷蘭商Asml控股公司 | 用於清潔微影設備之一部分之清潔工具及方法 |
Citations (4)
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---|---|---|---|---|
JPH08274058A (ja) * | 1995-03-29 | 1996-10-18 | Nitto Denko Corp | 精密電子部品の異物除去用粘着テ―プ |
JP2007165699A (ja) * | 2005-12-15 | 2007-06-28 | Nikon Corp | 静電チャックのパーティクル除去方法、静電チャックのパーティクル除去装置および露光装置 |
CN100395661C (zh) * | 2002-05-01 | 2008-06-18 | Asml荷兰有限公司 | 吸盘,光刻投影设备,制造吸盘的方法和器件制造方法 |
US20110159440A1 (en) * | 2009-12-25 | 2011-06-30 | Yumi Nakajima | Cleaning reticle, method for cleaning reticle stage, and method for manufacturing semiconductor device |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL128894C (zh) * | 1961-04-25 | 1900-01-01 | ||
JPH08148461A (ja) * | 1994-11-18 | 1996-06-07 | Nitto Denko Corp | 半導体ウエハに付着した異物の除去方法 |
JP2003142370A (ja) * | 2001-10-31 | 2003-05-16 | Nitto Denko Corp | レチクルが接する装置のクリーニング方法 |
JP2003218063A (ja) * | 2002-01-24 | 2003-07-31 | Canon Inc | ウエハ貼着用粘着シート及び該シートを利用する加工方法 |
JP2003209034A (ja) | 2002-10-09 | 2003-07-25 | Toshiba Corp | 半導体基板処理装置のクリーニング方法 |
JP2006229122A (ja) * | 2005-02-21 | 2006-08-31 | Nikon Corp | チャック表面の異物除去方法、容器、及びテーブル |
JP2008226973A (ja) * | 2007-03-09 | 2008-09-25 | Nikon Corp | 露光装置 |
JP2009146959A (ja) | 2007-12-12 | 2009-07-02 | Canon Inc | 露光装置及び洗浄装置 |
NL1036769A1 (nl) * | 2008-04-23 | 2009-10-26 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, cleaning system and method for cleaning a patterning device. |
JP5167195B2 (ja) * | 2009-04-30 | 2013-03-21 | 日東電工株式会社 | クリーニングシート、クリーニング機能付搬送部材、基板処理装置のクリーニング方法、および基板処理装置 |
JP2011044490A (ja) * | 2009-08-19 | 2011-03-03 | Nikon Corp | 観察装置、露光装置及びデバイスの製造方法 |
US20120009394A1 (en) * | 2010-07-07 | 2012-01-12 | MOS Art Pack Corporation | Bonding method and bonding substrate |
JP5743450B2 (ja) * | 2010-07-28 | 2015-07-01 | 株式会社東芝 | レチクルチャッククリーナー |
-
2012
- 2012-06-22 KR KR1020147005424A patent/KR101583167B1/ko active IP Right Grant
- 2012-06-22 WO PCT/JP2012/066041 patent/WO2013035415A1/ja active Application Filing
- 2012-06-22 CN CN201280043092.0A patent/CN103782365B/zh active Active
- 2012-06-22 JP JP2013532482A patent/JP5875197B2/ja active Active
- 2012-06-22 US US14/342,718 patent/US9808841B2/en active Active
- 2012-06-29 TW TW101123457A patent/TWI574114B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08274058A (ja) * | 1995-03-29 | 1996-10-18 | Nitto Denko Corp | 精密電子部品の異物除去用粘着テ―プ |
CN100395661C (zh) * | 2002-05-01 | 2008-06-18 | Asml荷兰有限公司 | 吸盘,光刻投影设备,制造吸盘的方法和器件制造方法 |
JP2007165699A (ja) * | 2005-12-15 | 2007-06-28 | Nikon Corp | 静電チャックのパーティクル除去方法、静電チャックのパーティクル除去装置および露光装置 |
US20110159440A1 (en) * | 2009-12-25 | 2011-06-30 | Yumi Nakajima | Cleaning reticle, method for cleaning reticle stage, and method for manufacturing semiconductor device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105988308A (zh) * | 2015-03-03 | 2016-10-05 | 上海凸版光掩模有限公司 | 一种掩模版上残胶的去除方法 |
CN109513691A (zh) * | 2017-09-20 | 2019-03-26 | 台湾积体电路制造股份有限公司 | 晶圆座的清洁方法、半导体制作方法与清洁*** |
CN109782549A (zh) * | 2017-11-13 | 2019-05-21 | 佳能株式会社 | 基板处理装置以及物品制造方法 |
CN109782549B (zh) * | 2017-11-13 | 2021-09-07 | 佳能株式会社 | 基板处理装置以及物品制造方法 |
CN110899246A (zh) * | 2018-09-14 | 2020-03-24 | 长鑫存储技术有限公司 | 光罩缺陷的清洁装置及清洁方法 |
CN109023241A (zh) * | 2018-09-18 | 2018-12-18 | 武汉华星光电半导体显示技术有限公司 | 掩膜版和掩膜版的清洗方法 |
WO2020056816A1 (zh) * | 2018-09-18 | 2020-03-26 | 武汉华星光电半导体显示技术有限公司 | 掩膜版和掩膜版的清洗方法 |
CN112210750A (zh) * | 2019-07-10 | 2021-01-12 | 佳能特机株式会社 | 成膜装置及方法、掩模的清洁方法及电子器件的制造方法 |
CN112934859A (zh) * | 2021-01-29 | 2021-06-11 | 泉芯集成电路制造(济南)有限公司 | 光罩杂质去除设备和光罩杂质去除方法 |
CN112934859B (zh) * | 2021-01-29 | 2022-06-07 | 泉意光罩光电科技(济南)有限公司 | 光罩杂质去除设备和光罩杂质去除方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103782365B (zh) | 2016-10-05 |
KR101583167B1 (ko) | 2016-01-07 |
TWI574114B (zh) | 2017-03-11 |
KR20140047150A (ko) | 2014-04-21 |
JP5875197B2 (ja) | 2016-03-02 |
TW201312284A (zh) | 2013-03-16 |
WO2013035415A1 (ja) | 2013-03-14 |
US20140326278A1 (en) | 2014-11-06 |
JPWO2013035415A1 (ja) | 2015-03-23 |
US9808841B2 (en) | 2017-11-07 |
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Address after: Tokyo, Japan Patentee after: TOSHIBA MEMORY Corp. Address before: Tokyo, Japan Patentee before: Japanese businessman Panjaya Co.,Ltd. Address after: Tokyo, Japan Patentee after: Kaixia Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |
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Effective date of registration: 20211013 Address after: Tokyo, Japan Patentee after: Japanese businessman Panjaya Co.,Ltd. Address before: Tokyo, Japan Patentee before: TOSHIBA MEMORY Corp. |