CN103304778B - 酚树脂和热固性树脂组合物 - Google Patents

酚树脂和热固性树脂组合物 Download PDF

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Publication number
CN103304778B
CN103304778B CN201310068714.1A CN201310068714A CN103304778B CN 103304778 B CN103304778 B CN 103304778B CN 201310068714 A CN201310068714 A CN 201310068714A CN 103304778 B CN103304778 B CN 103304778B
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CN
China
Prior art keywords
resin
phenol resin
compound
phenol
compositions
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310068714.1A
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English (en)
Chinese (zh)
Other versions
CN103304778A (zh
Inventor
泷本进
泷本进一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aica Kogyo Co Ltd
Original Assignee
Agfa Sdk Phenol Co Ltd
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Publication of CN103304778A publication Critical patent/CN103304778A/zh
Application granted granted Critical
Publication of CN103304778B publication Critical patent/CN103304778B/zh
Expired - Fee Related legal-status Critical Current
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G14/00—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00
    • C08G14/02—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes
    • C08G14/04—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols
    • C08G14/06—Condensation polymers of aldehydes or ketones with two or more other monomers covered by at least two of the groups C08G8/00 - C08G12/00 of aldehydes with phenols and monomers containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C08G59/46—Amides together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/20—Condensation polymers of aldehydes or ketones with only compounds containing hydrogen attached to nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201310068714.1A 2012-03-05 2013-03-05 酚树脂和热固性树脂组合物 Expired - Fee Related CN103304778B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP048048/2012 2012-03-05
JP2012048048A JP5845528B2 (ja) 2012-03-05 2012-03-05 フェノール樹脂組成物および熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
CN103304778A CN103304778A (zh) 2013-09-18
CN103304778B true CN103304778B (zh) 2016-09-28

Family

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Family Applications (1)

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CN201310068714.1A Expired - Fee Related CN103304778B (zh) 2012-03-05 2013-03-05 酚树脂和热固性树脂组合物

Country Status (3)

Country Link
JP (1) JP5845528B2 (ko)
KR (1) KR101989836B1 (ko)
CN (1) CN103304778B (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6368473B2 (ja) * 2013-10-23 2018-08-01 アイカＳｄｋフェノール株式会社 熱硬化性樹脂組成物及び硬化物
JP6232271B2 (ja) * 2013-12-06 2017-11-15 アイカＳｄｋフェノール株式会社 フェノール樹脂組成物、熱硬化性樹脂組成物、及び硬化物
JP2016108561A (ja) * 2014-12-04 2016-06-20 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム
WO2016088849A1 (ja) * 2014-12-04 2016-06-09 日東電工株式会社 軟磁性樹脂組成物および軟磁性フィルム
JP2017171839A (ja) * 2016-03-25 2017-09-28 住友化学株式会社 レゾルシン縮合物
CN109912780B (zh) * 2017-12-13 2021-08-06 深圳市百安百科技有限公司 一种低粘度耐热环氧树脂的制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08169937A (ja) * 1994-12-19 1996-07-02 Sumitomo Chem Co Ltd エポキシ樹脂組成物および銅張り積層板
JP3458557B2 (ja) * 1995-09-21 2003-10-20 大日本インキ化学工業株式会社 熱硬化性樹脂組成物、それを使用した積層板及びその製造方法
JPH1112267A (ja) * 1997-06-18 1999-01-19 Sumitomo Chem Co Ltd 多価フェノール化合物の製造法、エポキシ樹脂組成物、ならびに該組成物を用いた製品
JPH1149766A (ja) * 1997-07-31 1999-02-23 Sumitomo Chem Co Ltd 部分エーテル化化合物およびその製造法、エポキシ樹脂組成物、ならびに該組成物を用いた製品
JP3365725B2 (ja) 1997-08-29 2003-01-14 住友ベークライト株式会社 エポキシ樹脂組成物及び半導体装置
JP2001048959A (ja) 1999-08-09 2001-02-20 Sumitomo Durez Co Ltd エポキシ樹脂硬化剤
JP5159149B2 (ja) * 2007-04-18 2013-03-06 昭和電工株式会社 窒素含有フェノール樹脂
TW201011072A (en) * 2008-06-04 2010-03-16 Sumitomo Chemical Co Rubber composition
JP2010018784A (ja) * 2008-06-11 2010-01-28 Sumitomo Chemical Co Ltd スチールコード被覆用ゴム組成物

Also Published As

Publication number Publication date
JP2013181166A (ja) 2013-09-12
JP5845528B2 (ja) 2016-01-20
CN103304778A (zh) 2013-09-18
KR20130101474A (ko) 2013-09-13
KR101989836B1 (ko) 2019-06-17

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20151120

Address after: Gunma

Applicant after: Aqua SDK Phenol Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: SHOWA DENKO Kabushiki Kaisha

C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20190218

Address after: Aichi Prefecture, Japan

Patentee after: AICA KOGYO CO.,LTD.

Address before: Gunma

Patentee before: Aqua SDK Phenol Co.,Ltd.

TR01 Transfer of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160928

CF01 Termination of patent right due to non-payment of annual fee