CN109152239A - A kind of preparation method of printed circuit board hole blackening solution - Google Patents
A kind of preparation method of printed circuit board hole blackening solution Download PDFInfo
- Publication number
- CN109152239A CN109152239A CN201710503829.7A CN201710503829A CN109152239A CN 109152239 A CN109152239 A CN 109152239A CN 201710503829 A CN201710503829 A CN 201710503829A CN 109152239 A CN109152239 A CN 109152239A
- Authority
- CN
- China
- Prior art keywords
- solution
- follows
- circuit board
- printed circuit
- fatty alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
Abstract
The invention discloses a kind of preparation methods of printed circuit board hole blackening solution, include the following steps: (1) by carbon dust, Na2SiO3、NH4OH and water are heated at reflux 20 hours after being mixed, and obtain the first mixed solution；(2) anionic surfactant is added in above-mentioned first mixed solution, and the second mixed solution is obtained after mechanical stirring is uniform；(3) nonionic surfactant and anion non-ionic composite surfactant are successively added in above-mentioned second mixed solution, is heated at reflux after stirring 10 hours；(4) to solution one side mechanical stirring after completion step (3), room temperature is naturally cooled on one side, obtains hole blackening solution.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, a kind of printed circuit board hole blackening solution is related in particular to
Preparation method.
Background technique
Flexible printed circuit board is made of film, has the significant superiority such as flexible structure, small in size, light-weight, no
But static it can bend, moreover it is possible to make Dynamic flexural, curling and folding.It is continuous fast with printed circuit board (PCB) processing technology
Speed development, the appearance of rigid-flexible combination printed circuit board provide to solve the interconnection problems between electronic functionalities module
A kind of new solution.Rigid-flexible combination printed circuit board refers to using flexible parent metal and in different zones and rigidity
Substrate interconnects and manufactured printed circuit board.In rigid flexible system area, the conductive pattern on flexible parent metal and rigid substrate is usually logical
Plated through-hole is crossed to be interconnected.Rigid-flexible combination printed circuit board can connect the circuit between Different Plane, can fold,
It is bent, crispaturas, also can connect movable part, realize three dimensional wiring, to solve originally restricted in many encapsulation ask
Topic, improves Connection Density and reliability.In order to realize the metallization of hole wall, the main side using " black holes " in the field of business at present
Method is realized.
" black holes " method is to impregnate printed circuit board by using hole blackening solution, makes to have using the attracting effect of positive and negative charge
There are the carbon particle of conducting function and organic matter high molecular material (polyimide film, epobond epoxyn, the acrylic acid tree of hole wall
The substances such as rouge adhesive, epoxy glass fiber cloth) it combines closely, one layer of reliable electric conductivity medium is provided for subsequent electro-coppering.
But the performance of hole blackening solution still has deficiency at present, makees reducing agent for example, by using formaldehyde, due to being more toxic for formaldehyde, not only
Ecological environment is endangered, and has carcinogenic danger.The stability of hole blackening solution is poor, and operation is careless slightly just to will appear solution
It decomposes.Black holes chemical industry skill long flow path, operation and maintenance is extremely inconvenient, and quality control is relatively difficult and operating cost is high.
Summary of the invention
The object of the invention is that overcome the deficiencies in the prior art, a kind of printed circuit board that can be used for is provided
The preparation method of hole blackening solution carries out plated through-hole using the hole blackening solution that this method is prepared, and not only safety has
It is greatly improved, and the discharge amount of waste water can have been efficiently controlled, simplify production technology, reduce being produced into for printed board
This.
The preparation method of hole blackening solution proposed by the present invention includes the following steps:
(1) by carbon dust, Na2SiO3、NH4OH and water are heated at reflux 20 hours after being mixed, and obtain the first mixed solution；
(2) anionic surfactant is added in above-mentioned first mixed solution, and it is mixed that second is obtained after mechanical stirring is uniform
Close solution；
(3) nonionic surfactant and anion non-ionic composite surface are successively added in above-mentioned second mixed solution
Activating agent is heated at reflux 10 hours after stirring；
(4) to solution one side mechanical stirring after completion step (3), room temperature is naturally cooled on one side, it is molten to obtain black holesization
Liquid.
Wherein, in terms of by the hole blackening solution being finally completed for 100 parts by weight, in step (1), carbon dust, Na2SiO3、NH4OH
And the weight percent of water is respectively as follows: carbon dust: 2-4%, Na2SiO3:0.5-1%, NH4OH:3-4% and water: 88-93%.
Wherein, in step (2), the weight percent of anionic surfactant are as follows: 0.5-2%
Wherein, in step (3), the weight hundred of nonionic surfactant and anion non-ionic composite surfactant
Ratio is divided to be respectively as follows: 0.5-1%, 0.5-1.5%.
Wherein, anionic surfactant are as follows: lauryl sodium sulfate, neopelex, fatty alcohol polyoxy second
One or more of alkene ether sodium sulfate, pareth sulfate；
Nonionic surfactant are as follows: polysorbate, fatty alcohol polyoxyethylene ether.In the fatty alcohol polyoxyethylene ether
Fatty alcohol are as follows: carbon atom number be 10-20 fatty alcohol.
Anion non-ionic composite surfactant contains at least two functional groups, and the functional group is selected from hydroxyl
(OH), one or more of carboxyl (COOH), carbon-carbon double bond (C=C), epoxy group, itrile group (CN), sulfonic group, such as: it is poly-
Ethylene oxide ether sulfate, polyoxyethylene ether fatty acid salt.
Specific embodiment:
It is described in detail below by preparation method of the specific embodiment to hole blackening solution proposed by the present invention.
Embodiment 1
The preparation method of hole blackening solution proposed by the present invention includes the following steps:
(1) by carbon dust, Na2SiO3、NH4OH and water are heated at reflux 20 hours after being mixed, and obtain the first mixed solution；
(2) anionic surfactant is added in above-mentioned first mixed solution, and it is mixed that second is obtained after mechanical stirring is uniform
Close solution；
(3) nonionic surfactant and anion non-ionic composite surface are successively added in above-mentioned second mixed solution
Activating agent is heated at reflux 10 hours after stirring；
(4) to solution one side mechanical stirring after completion step (3), room temperature is naturally cooled on one side, it is molten to obtain black holesization
Liquid.
Wherein, in terms of by the hole blackening solution being finally completed for 100 parts by weight, in step (1), carbon dust, Na2SiO3、NH4OH
And the weight percent of water is respectively as follows: carbon dust: 2-4%, Na2SiO3: 0.5-1%, NH4OH:3-4% and water: 88-93%.
Wherein, in step (2), the weight percent of anionic surfactant are as follows: 0.5-2%；
Wherein, in step (3), the weight hundred of nonionic surfactant and anion non-ionic composite surfactant
Ratio is divided to be respectively as follows: 0.5-1%, 0.5-1.5%.
Wherein, anionic surfactant are as follows: lauryl sodium sulfate, neopelex, fatty alcohol polyoxy second
One or more of alkene ether sodium sulfate, pareth sulfate；
Nonionic surfactant are as follows: polysorbate, fatty alcohol polyoxyethylene ether.In the fatty alcohol polyoxyethylene ether
Fatty alcohol are as follows: carbon atom number be 10-20 fatty alcohol.
Anion non-ionic composite surfactant contains at least two functional groups, and the functional group is selected from hydroxyl
(OH), one or more of carboxyl (COOH), carbon-carbon double bond (C=C), epoxy group, itrile group (CN), sulfonic group, such as: it is poly-
Ethylene oxide ether sulfate, polyoxyethylene ether fatty acid salt.
Embodiment 2
The preferred embodiment of hole blackening solution preparation method proposed by the present invention is listed below,
The preparation method of hole blackening solution proposed by the present invention includes the following steps:
(1) by carbon dust, Na2SiO3、NH4OH and water are heated at reflux 20 hours after being mixed, and obtain the first mixed solution；
(2) anionic surfactant is added in above-mentioned first mixed solution, and it is mixed that second is obtained after mechanical stirring is uniform
Close solution；
(3) nonionic surfactant and anion non-ionic composite surface are successively added in above-mentioned second mixed solution
Activating agent is heated at reflux 10 hours after stirring；
(4) to solution one side mechanical stirring after completion step (3), room temperature is naturally cooled on one side, it is molten to obtain black holesization
Liquid.
Wherein, in terms of by the hole blackening solution being finally completed for 100 parts by weight, in step (1), carbon dust, Na2SiO3、NH4OH
And the weight percent of water is respectively as follows: carbon dust: 3%, Na2SiO3:0.8%, NH4OH:3.5% and water: 89.9%.
Wherein, in step (2), the weight percent of anionic surfactant are as follows: 1%；
Wherein, in step (3), the weight hundred of nonionic surfactant and anion non-ionic composite surfactant
Ratio is divided to be respectively as follows: 0.8% and 1%；
Wherein, anionic surfactant are as follows: lauryl sodium sulfate；
Nonionic surfactant are as follows: polysorbate.
Anion non-ionic composite surfactant is polyoxyethylene ether sulfate or polyoxyethylene ether fatty acid salt.
Embodiment of above is described in detail the present invention, but above embodiment is not intended to limit this
The range of invention, protection scope of the present invention are defined by the appended claims.
Claims (3)
1. a kind of preparation method of printed circuit board hole blackening solution, it is characterised in that include the following steps:
(1) by carbon dust, Na2SiO3、NH4OH and water are heated at reflux 20 hours after being mixed, and obtain the first mixed solution；
(2) anionic surfactant is added in above-mentioned first mixed solution, and it is molten that the second mixing is obtained after mechanical stirring is uniform
Liquid；
(3) nonionic surfactant and anion non-ionic composite surface-active are successively added in above-mentioned second mixed solution
Agent is heated at reflux 10 hours after stirring；
(4) to solution one side mechanical stirring after completion step (3), room temperature is naturally cooled on one side, obtains hole blackening solution.
2. the preparation method of printed circuit board hole blackening solution as described in claim 1, it is characterised in that: wherein, with most
The hole blackening solution completed eventually is 100 parts by weight meters, in step (1), carbon dust, Na2SiO3、NH4The weight percent score of OH and water
Not are as follows: carbon dust: 2-4%, Na2SiO3: 0.5-1%, NH4OH:3-4% and water: 88-93%；In step (2), anionic surface
The weight percent of activating agent are as follows: 0.5-2%；In step (3), nonionic surfactant and anion non-ionic composite table
The weight percent of face activating agent is respectively as follows: 0.5-1%, 0.5-1.5%.
3. printed circuit board hole blackening solution as described in claim 1, it is characterised in that: wherein, the anionic surface
Activating agent are as follows: lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, alkyl polyoxyethylene
One or more of ether sodium sulfate；The nonionic surfactant are as follows: polysorbate, fatty alcohol polyoxyethylene ether.Institute
State the fatty alcohol in fatty alcohol polyoxyethylene ether are as follows: carbon atom number is the fatty alcohol of 10-20.The anion non-ionic composite
Surfactant contains at least two functional groups, and the functional group is selected from hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=
C), one or more of epoxy group, itrile group (CN), sulfonic group, such as: polyoxyethylene ether sulfate, polyoxyethylene ether rouge
Fat hydrochlorate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710503829.7A CN109152239A (en) | 2017-06-28 | 2017-06-28 | A kind of preparation method of printed circuit board hole blackening solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710503829.7A CN109152239A (en) | 2017-06-28 | 2017-06-28 | A kind of preparation method of printed circuit board hole blackening solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109152239A true CN109152239A (en) | 2019-01-04 |
Family
ID=64805325
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710503829.7A Withdrawn CN109152239A (en) | 2017-06-28 | 2017-06-28 | A kind of preparation method of printed circuit board hole blackening solution |
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| CN (1) | CN109152239A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825863A (en) * | 2019-03-28 | 2019-05-31 | 烟台恒诺新材料有限公司 | A kind of carbon nanotube conducting starches the application in black holesization is directly electroplated |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
-
2017
- 2017-06-28 CN CN201710503829.7A patent/CN109152239A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103160896A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN103167747A (en) * | 2013-03-01 | 2013-06-19 | 溧阳市新力机械铸造有限公司 | Manufacturing method of printed circuit board |
| CN104818506A (en) * | 2015-05-28 | 2015-08-05 | 哈尔滨工业大学 | Solution for metalizing printed circuit board hole |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825863A (en) * | 2019-03-28 | 2019-05-31 | 烟台恒诺新材料有限公司 | A kind of carbon nanotube conducting starches the application in black holesization is directly electroplated |
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| PB01 | Publication | ||
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Application publication date: 20190104 |