CN103167747B - A kind of preparation method of printed circuit board (PCB) - Google Patents
A kind of preparation method of printed circuit board (PCB) Download PDFInfo
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- CN103167747B CN103167747B CN201310067015.5A CN201310067015A CN103167747B CN 103167747 B CN103167747 B CN 103167747B CN 201310067015 A CN201310067015 A CN 201310067015A CN 103167747 B CN103167747 B CN 103167747B
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- circuit board
- printed circuit
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Abstract
The invention discloses a kind of preparation method of printed circuit board (PCB), comprise the steps: that (1) provides printed circuit board (PCB), hole to obtain through hole to this printed circuit board (PCB); (2) deionized water is adopted to clean above-mentioned printed circuit board (PCB), to remove the impurity in described through hole; (3) adopt temperature to be that the warm braw of 50 degrees Celsius carries out air-dry to the printed circuit board (PCB) after cleaning, to remove on printed circuit board (PCB) remaining water, and remove the impurity particle on printed circuit board (PCB) further; (4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, with obtained black holes plate; (5) drying process is carried out to black holes plate, thus make the hole blackening solution being coated in printed circuit board surface form black thin film; (6) black thin film of printed circuit board surface is removed; (7) adopt electric plating method to carry out electro-coppering process to the printed circuit board (PCB) after step (6), thus form electro-coppering coating in described through hole.
Description
Technical field
The invention belongs to field of printed circuit board fabrication, relate in particular to a kind of preparation method of printed circuit board (PCB).
Background technology
Flexible printed circuit board is made up of film, has the significant superiority such as flexible structure, volume are little, lightweight, not only can static bend, and can also make Dynamic flexural, curling and folding.Along with the continuous fast development of printed circuit board (PCB) (PCB) process technology, rigid-flexible provides a kind of new solution in conjunction with the interconnection problems solved between electronic functionalities module that appears as of printed circuit board (PCB).Rigid-flexible refers in conjunction with printed circuit board (PCB) and utilizes flexible parent metal and the printed circuit board (PCB) interconnecting in zones of different and rigid substrate and make.In rigid flexible system district, the conductive pattern on flexible parent metal and rigid substrate is interconnected by plated-through hole usually.Rigid-flexible can connect the circuit between Different Plane in conjunction with printed circuit board (PCB), can fold, bend, crispatura, also can movable part connecting part, realize three dimensional wiring, thus solve the restricted problem of script in many encapsulation, improve Connection Density and reliability.In order to realize the metallization of hole wall, the method for current main employing " black holes " in the field of business realizes.
" black holes " method is by adopting hole blackening solution dipping printed circuit board (PCB), the effect utilizing positive and negative charge attracting makes the organic substance macromolecular material (material such as polyimide film, epobond epoxyn, acrylic resin adhesive, epoxy glass fiber cloth) of the carbon particle and hole wall with conducting function combine closely, for follow-up electro-coppering provides one deck reliable conductivity medium.But the performance of hole blackening solution still has deficiency at present, such as, adopt formaldehyde to make reducing agent, because the toxicity of formaldehyde is comparatively large, not only endangers biological environment, and have carcinogenic danger.The less stable of hole blackening solution, operates and careless slightlyly just there will be solution decomposes.Black holes metallization processes long flow path, operation and maintenance is extremely inconvenient, and quality control is more difficult and operating cost is high.
Summary of the invention
Object of the present invention is just to overcome the deficiencies in the prior art, a kind of method adopting hole blackening solution to manufacture printed circuit board (PCB) is provided, utilize the method, not only fail safe is greatly improved, and effectively can control the discharge capacity of waste water, simplify production technology, reduce the production cost of printed circuit board (PCB).
The method that the employing hole blackening solution that the present invention proposes manufactures printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), hole to obtain through hole to this printed circuit board (PCB), wherein printed wiring board is copper clad laminate.
(2) deionized water is adopted to clean above-mentioned printed circuit board (PCB), to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees Celsius carries out air-dry to the printed circuit board (PCB) after cleaning, to remove on printed circuit board (PCB) remaining water, and remove the impurity particle on printed circuit board (PCB) further;
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, with obtained black holes plate;
(5) drying process is carried out to black holes plate, thus make the hole blackening solution being coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering process to the printed circuit board (PCB) after step (6), thus form electro-coppering coating in described through hole.
Wherein, described hole blackening solution by weight percentage, is made up of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1%
2siO
3, 3-4% NH
4the anion non-ionic composite surfactant of the anion surfactant of OH, 0.5-2%, the non-ionic surface active agent of 0.5-1%, 0.5-1.5% and the water of 88-93%.
Wherein, anion surfactant is: one or more in lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, pareth sulfate;
Non-ionic surface active agent is: polysorbate, AEO.Fatty alcohol in described AEO is: carbon number is the fatty alcohol of 10-20.
Anion non-ionic composite surfactant contains at least Liang Ge functional group, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, such as: polyoxyethylene ether sulfate, APEO soap.
Embodiment:
Below by embodiment, the preparation method to the printed circuit board (PCB) that the present invention proposes is described in detail.
Embodiment 1
The method that the employing hole blackening solution that the present invention proposes manufactures printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), hole to obtain through hole to this printed circuit board (PCB); Wherein printed wiring board is copper clad laminate.
(2) deionized water is adopted to clean above-mentioned printed circuit board (PCB), to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees Celsius carries out air-dry to the printed circuit board (PCB) after cleaning, to remove on printed circuit board (PCB) remaining water, and remove the impurity particle on printed circuit board (PCB) further;
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, with obtained black holes plate;
(5) drying process is carried out to black holes plate, thus make the hole blackening solution being coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering process to the printed circuit board (PCB) after step (6), thus form electro-coppering coating in described through hole.
Wherein, described hole blackening solution by weight percentage, is made up of the raw material of following ratio: the carbon dust of 2-4%, the Na of 0.5-1%
2siO
3, 3-4% NH
4the anion non-ionic composite surfactant of the anion surfactant of OH, 0.5-2%, the non-ionic surface active agent of 0.5-1%, 0.5-1.5% and the water of 88-93%.
Wherein, anion surfactant is: one or more in lauryl sodium sulfate, neopelex, sodium sulfate of polyethenoxy ether of fatty alcohol, pareth sulfate;
Non-ionic surface active agent is: polysorbate, AEO.Fatty alcohol in described AEO is: carbon number is the fatty alcohol of 10-20.
Anion non-ionic composite surfactant contains at least Liang Ge functional group, described functional group is selected from one or more in hydroxyl (OH), carboxyl (COOH), carbon-carbon double bond (C=C), epoxide group, itrile group (CN), sulfonic group, such as: polyoxyethylene ether sulfate, APEO soap.
Embodiment 2
Introduce the preferred embodiment of the printed circuit board (PCB) preparation method that the present invention proposes below,
The method that the employing hole blackening solution that the present invention proposes manufactures printed circuit board (PCB) comprises the steps:
(1) provide printed circuit board (PCB), hole to obtain through hole to this printed circuit board (PCB); Wherein printed wiring board is copper clad laminate.
(2) deionized water is adopted to clean above-mentioned printed circuit board (PCB), to remove the impurity in described through hole.
(3) adopt temperature to be that the warm braw of 50 degrees Celsius carries out air-dry to the printed circuit board (PCB) after cleaning, to remove on printed circuit board (PCB) remaining water, and remove the impurity particle on printed circuit board (PCB) further;
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, with obtained black holes plate;
(5) drying process is carried out to black holes plate, thus make the hole blackening solution being coated in printed circuit board surface form black thin film
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering process to the printed circuit board (PCB) after step (6), thus form electro-coppering coating in described through hole.
Wherein, according to weight percent meter, the content of each component of hole blackening solution of the present invention is: carbon dust: 3%, Na
2siO
3: 0.8%, NH
4oH:3.5%, anion surfactant: 1%, non-ionic surface active agent: 0.8%, anion non-ionic composite surfactant: 1%, Yi Jishui: 89.9%.
Wherein, anion surfactant is: lauryl sodium sulfate;
Non-ionic surface active agent is: polysorbate.
Anion non-ionic composite surfactant is polyoxyethylene ether sulfate or APEO soap.
Above execution mode is to invention has been detailed introduction, but above-mentioned execution mode is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (2)
1. a preparation method for printed circuit board (PCB), is characterized in that, comprises the steps:
(1) provide printed circuit board (PCB), hole to obtain through hole to this printed circuit board (PCB), wherein, printed wiring board is copper clad laminate;
(2) deionized water is adopted to clean above-mentioned printed circuit board (PCB), to remove the impurity in described through hole;
(3) adopt temperature to be that the warm braw of 50 degrees Celsius carries out air-dry to the printed circuit board (PCB) after cleaning, to remove on printed circuit board (PCB) remaining water, and remove the impurity particle on printed circuit board (PCB) further;
(4) printed circuit board (PCB) after air-dry is impregnated into hole blackening solution, with obtained black holes plate;
(5) drying process is carried out to black holes plate, thus make the hole blackening solution being coated in printed circuit board surface form black thin film;
(6) black thin film of printed circuit board surface is removed;
(7) adopt electric plating method to carry out electro-coppering process to the printed circuit board (PCB) after step (6), thus form electro-coppering coating in described through hole;
Wherein, described hole blackening solution by weight percentage, is made up of the raw material of following ratio: the carbon dust of 3%, the Na of 0.8%
2siO
3, 3.5% NH
4oH, 1% anion surfactant, the non-ionic surface active agent of 0.8%, the anion non-ionic composite surfactant of 1% and 89.9% water.
2. the preparation method of printed circuit board (PCB) as claimed in claim 1, is characterized in that:
Wherein, described anion surfactant is: lauryl sodium sulfate;
Described non-ionic surface active agent is: polysorbate;
Described anion non-ionic composite surfactant is polyoxyethylene ether sulfate or APEO soap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310067015.5A CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310067015.5A CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
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| Publication Number | Publication Date |
|---|---|
| CN103167747A CN103167747A (en) | 2013-06-19 |
| CN103167747B true CN103167747B (en) | 2016-01-06 |
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| CN201310067015.5A Active CN103167747B (en) | 2013-03-01 | 2013-03-01 | A kind of preparation method of printed circuit board (PCB) |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104302124A (en) * | 2014-08-27 | 2015-01-21 | 无锡长辉机电科技有限公司 | Manufacturing technology of double-faced flexibility printed board |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN106231815A (en) * | 2016-08-22 | 2016-12-14 | 台山市精诚达电路有限公司 | A kind of HDI soft or hard plate hole metallization processes |
| CN109152239A (en) * | 2017-06-28 | 2019-01-04 | 聂菲菲 | A kind of preparation method of printed circuit board hole blackening solution |
| CN110300495A (en) * | 2018-03-23 | 2019-10-01 | 睿明科技股份有限公司 | Substrate film coating method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100451178C (en) * | 2004-08-02 | 2009-01-14 | 吕桂生 | Electricity conductive liquid capable of directly galvanizing the printed board |
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2013
- 2013-03-01 CN CN201310067015.5A patent/CN103167747B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622108A (en) * | 1986-05-05 | 1986-11-11 | Olin Hunt Specialty Products, Inc. | Process for preparing the through hole walls of a printed wiring board for electroplating |
| CN101113388A (en) * | 2006-07-28 | 2008-01-30 | 比亚迪股份有限公司 | Black-hole carbon powder cleaning agent composition and cleaning method thereof |
| CN101394712A (en) * | 2007-09-21 | 2009-03-25 | 清华大学 | Hole blackening solution and preparation thereof |
Non-Patent Citations (1)
| Title |
|---|
| 印制板直接电镀工艺;王丽丽;《电镀与精饰》;19981115;第20卷(第6期);第10-12页 * |
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| CN103167747A (en) | 2013-06-19 |
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