CN103228110B - The circuit welding resistance technique of printed circuit board (PCB) - Google Patents
The circuit welding resistance technique of printed circuit board (PCB) Download PDFInfo
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- CN103228110B CN103228110B CN201310066480.7A CN201310066480A CN103228110B CN 103228110 B CN103228110 B CN 103228110B CN 201310066480 A CN201310066480 A CN 201310066480A CN 103228110 B CN103228110 B CN 103228110B
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Abstract
The invention discloses a kind of circuit welding resistance technique of printed circuit board (PCB), it comprises the following steps sequentially: (1) is in the plate face of printed circuit board (PCB) printing Nano gold-tin-copper alloy conductive ink, wherein said nano gold-tin-copper alloy conductive ink, comprises following component: nano gold-tin-copper alloy powder body: 10% ~ 50%, solvent: 20% ~ 70%, auxiliary agent: 5% ~ 10%; The particle size range of this nano gold-tin-copper alloy powder body is: 20nm ~ 100nm; (2) to above-mentioned Jin-Xi-copper electrically conductive ink ablation solidification, to form conductive pattern on a printed circuit; (3) silk-screen solder mask on a printed circuit, to form the first solder mask after oven dry; (4) silk-screen solder mask on described first solder mask, to form the second solder mask after oven dry.
Description
Technical field:
The present invention relates to printing manufacturing technology, specifically a kind of circuit welding resistance technique of printed circuit board (PCB).
Background technology:
The solder mask of printed circuit board (PCB) is insulating material, and it forms solder mask by being printed on circuit board plate material, and plays the effect of insulation, prevention welding in the printed circuit boards.This solder mask is formed by permanent polymer welding resistance coating material, and solder mask covers on most printed wire, only exposes the pad for weld parts, electric performance test and circuit board grafting.And when the line thicknesses on printed circuit board (PCB) is greater than 100 microns, circuit surface and the substrate for printed circuit board of spacing will form step, and general all thin than the solder mask thickness at other positions due to the existence at turning at the solder mask thickness of the corner of step.Therefore, this will cause the phenomenon occurring that solder mask tilts, bubble or come off, thus affect the quality of final products.
Meanwhile, the electrically conductive ink forming printed circuit board circuitry in prior art is generally divided into gold system electrically conductive ink, silver system electrically conductive ink and copper system electrically conductive ink.Copper system conductive phase is the low price of electrically conductive ink than silver, but is easily oxidized, so the electric conductivity instability causing copper system to be conducted electricity due to copper.Although silver system electrically conductive ink electric conductivity is better, but the conducting wire that silver system electrically conductive ink is formed after drying is all softer, and the circuit that silver ink is formed is in the operational environment of D.C. high-current, owing to easily producing silver migration, therefore the electric property of circuit can not meet the operational environment demand of D.C. high-current completely.Compare with copper system ink with silver ink, the antioxygenic property of gold system electrically conductive ink is best, moderate strength.
But because the cost of gold system ink is higher, if the electrically conductive particles of ink all adopts gold to make, its cost disadvantage can not be ignored.Therefore, be necessary that research one can be adapted at steady operation under D.C. high-current, the electrically conductive ink that can reduce costs as far as possible again, by the conducting wire adopting this electrically conductive ink to make printed circuit board (PCB), and be combined with circuit welding resistance technique, thus promote the performance and used life of printed circuit board (PCB).
Summary of the invention:
For this reason, the invention provides a kind of circuit welding resistance technique of printed circuit board (PCB), it adopts Nano gold-tin-copper alloy conductive ink to form printed circuit board circuitry, and adopt circuit welding resistance technique of the present invention, thus not only reduce printed substrate line material cost, and the problem that existing printed circuit board (PCB) solder mask easily tilts, bubbles and come off can also be solved.
For realizing above-mentioned purpose of the present invention, the present invention by the following technical solutions:
A circuit welding resistance technique for printed circuit board (PCB), it comprises the following steps sequentially:
(1), in the plate face of printed circuit board (PCB) printing Nano gold-tin-copper alloy conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink by mass percentage, comprises following component:
Nano gold-tin-copper alloy powder body: 10% ~ 50%, solvent: 20% ~ 70%, auxiliary agent: 5% ~ 10%; The particle size range of this nano gold-tin-copper alloy powder body is: 20nm ~ 100nm; Further, in described nano gold-tin-copper alloy particulate, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%;
(2) to above-mentioned Jin-Xi-copper electrically conductive ink ablation solidification, to form conductive pattern on a printed circuit;
(3) silk-screen solder mask on a printed circuit, to form the first solder mask after oven dry;
(4) silk-screen solder mask on described first solder mask, to form the second solder mask after oven dry.
Wherein, the process conditions that step (3) dries formation first solder mask are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 80 degrees Celsius, baking time is 1 hour;
Wherein, the process conditions that step (4) dries formation second solder mask are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 70 degrees Celsius, baking time is 2 hours, make the first solder mask, second layer solder mask hardens completely.
Wherein, the technique of printing the first solder mask is:
Ground floor solder mask is printed on a printed circuit by silk screen printing process; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the first solder mask; Removed by the first solder mask development of sodium carbonate liquor by unexposed area afterwards.
Wherein, the technique of printing the second solder mask is:
The printed circuit board (PCB) having printed the first solder mask prints second layer solder mask on a printed circuit by silk screen printing process; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the second solder mask; Removed by the second solder mask development of sodium carbonate liquor by unexposed area afterwards.
The present invention makes printed circuit board circuitry by adopting Jin-Xi-copper electrically conductive ink, thus not only obtain qualified line pattern under economy but also the prerequisite ensureing circuit intensity, and by twice printing solder mask to form two-layer solder mask, thus increase solder mask thickness, and then thickeied the solder mask thickness at circuit turning, avoid the problem that welding resistance tilts, bubbles or come off.
Embodiment:
Below by embodiment, printed circuit board circuitry welding resistance technique of the present invention is described in detail.
Execution mode 1:
The circuit welding resistance technique of the printed circuit board (PCB) that the present invention proposes, it comprises the following steps sequentially: (1), the plate face of printed circuit board (PCB) printing Nano gold-tin-copper alloy conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink by mass percentage, comprises following component:
Nano gold-tin-copper alloy powder body: 10% ~ 50%, solvent: 20% ~ 70%, auxiliary agent: 5% ~ 10%; The particle size range of this nano gold-tin-copper alloy powder body is: 20nm ~ 100nm; Further, in described nano gold-tin-copper alloy particulate, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%;
Solvent comprises: one or more of water, alcohols, ethers and ester class; Wherein alcohols comprises: one or more in the group be made up of ethanol, isopropyl alcohol, butanols, ethylene glycol, phenmethylol.Ethers comprises: butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether composition group in one or more.Ester class comprises: butyl acetate or ethyl acetate.
Auxiliary agent comprise in surfactant, dispersant, reducing agent one or more; Wherein surfactant comprises: one or more in the group be made up of stearic acid, oleic acid, laurate, triethanolamine, sldium lauryl sulfate, pectic acid sodium, hydroxymethyl starch etc.; Dispersant comprises: one or more in the group be made up of alkyl hydrosulfide, alkyl acid, alkylamine, alkyl phosphoric acid; Reducing agent comprises: one or more in the group be made up of ascorbic acid, hydrazine hydrate, formic acid and formaldehyde;
(2) to above-mentioned Jin-Xi-copper electrically conductive ink ablation solidification, to form conductive pattern on a printed circuit.To the ablation of Jin-Xi-copper electrically conductive ink solidification by under the printed circuit board (PCB) having printed this Jin-Xi-copper electrically conductive ink is placed in the environment of 80 ~ 180 degrees Celsius, ablation 20 ~ 50 minutes, dry this electrically conductive ink of solvent Post RDBMS in electrically conductive ink, to form conducting wire;
(3) silk-screen ground floor solder mask on a printed circuit, to form the first solder mask after oven dry.The processing step of silk-screen ground floor solder mask is: print ground floor solder mask on a printed circuit; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the first solder mask; Removed by the first solder mask development of sodium carbonate liquor by unexposed area afterwards.After this, dry formation first solder mask, its process conditions are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 80 degrees Celsius, baking time is 1 hour;
(4) silk-screen second layer solder mask on described first solder mask, to form the second solder mask after oven dry.The processing step of silk-screen second layer solder mask is: on the first solder mask, print second layer solder mask; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the second solder mask; Removed by the second solder mask development of sodium carbonate liquor by unexposed area afterwards; After this, dry formation second solder mask, its process conditions are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 70 degrees Celsius, baking time is 2 hours, make the first solder mask, second layer solder mask hardens completely.
Execution mode 2:
The circuit welding resistance technique of the printed circuit board (PCB) that the present invention proposes, it comprises the following steps sequentially: (1), the plate face of printed circuit board (PCB) printing Nano gold-tin-copper alloy conductive ink, wherein said nm of gold-Xi-copper electrically conductive ink by mass percentage, comprises following component:
Nano gold-tin-copper alloy powder body 40%, solvent: 52%, auxiliary agent: 8%; The particle size range of this nano gold-tin-copper alloy powder body is: 30nm; Further, in described nano gold-tin-copper alloy particulate, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%;
Solvent comprises: one or more of water, alcohols, ethers and ester class; Wherein alcohols comprises: by ethanol, isopropyl alcohol, butanols, ethylene glycol, phenmethylol.Ethers comprises: butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether composition group in one or more.Ester class comprises: butyl acetate or ethyl acetate.
Auxiliary agent comprise in surfactant, dispersant, reducing agent one or more; Wherein surfactant comprises: one or more in the group be made up of stearic acid, oleic acid, laurate, triethanolamine, sldium lauryl sulfate, pectic acid sodium, hydroxymethyl starch etc.; Dispersant comprises: one or more in the group be made up of alkyl hydrosulfide, alkyl acid, alkylamine, alkyl phosphoric acid; Reducing agent comprises: one or more in the group be made up of ascorbic acid, hydrazine hydrate, formic acid and formaldehyde;
(2) to above-mentioned Jin-Xi-copper electrically conductive ink ablation solidification, to form conductive pattern on a printed circuit.To the ablation of Jin-Xi-copper electrically conductive ink solidification by under the printed circuit board (PCB) having printed this Jin-Xi-copper electrically conductive ink is placed in the environment of 150 degrees Celsius, ablation 30 minutes, dries this electrically conductive ink of solvent Post RDBMS in electrically conductive ink, to form conducting wire;
(3) silk-screen ground floor solder mask on a printed circuit, to form the first solder mask after oven dry.The processing step of silk-screen ground floor solder mask is: print ground floor solder mask on a printed circuit; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the first solder mask; Removed by the first solder mask development of sodium carbonate liquor by unexposed area afterwards.After this, dry formation first solder mask, its process conditions are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 80 degrees Celsius, baking time is 1 hour;
(4) silk-screen second layer solder mask on described first solder mask, to form the second solder mask after oven dry.The processing step of silk-screen second layer solder mask is: on the first solder mask, print second layer solder mask; Adopt ultraviolet exposure machine to above-mentioned printed circuit board to explosure and development, to form the second solder mask; Removed by the second solder mask development of sodium carbonate liquor by unexposed area afterwards; After this, dry formation second solder mask, its process conditions are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 70 degrees Celsius, baking time is 2 hours, make the first solder mask, second layer solder mask hardens completely.
Above execution mode is to invention has been detailed introduction, but above-mentioned execution mode is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (1)
1. a circuit welding resistance technique for printed circuit board (PCB), it comprises the following steps sequentially:
(1) in the plate face of printed circuit board (PCB) printing Nano gold-tin-copper alloy conductive ink;
(2) to described Nano gold-tin-copper alloy conductive ink ablation solidification, to form conductive pattern on a printed circuit;
(3) silk-screen solder mask on a printed circuit, to form the first solder mask after oven dry, the process conditions of oven dry are: be placed into by printed circuit board (PCB) in baking box, and keep oven temperature to be 80 degrees Celsius, baking time is 1 hour;
(4) silk-screen solder mask on described first solder mask, to form the second solder mask after oven dry, the process conditions of drying are: be placed into by printed circuit board (PCB) in baking box, oven temperature is kept to be 70 degrees Celsius, baking time is 2 hours, makes the first solder mask, second layer solder mask hardens completely;
Wherein, described nano gold-tin-copper alloy conductive ink, comprises following component: nano gold-tin-copper alloy powder body: 10% ~ 50%, solvent: 20% ~ 70%, auxiliary agent: 5% ~ 10%; Wherein,
The particle size range of this nano gold-tin-copper alloy powder body is: 20nm ~ 100nm; Further, in described nano gold-tin-copper alloy powder body, the content of gold, tin and copper by mass percentage, is respectively: 3%, 7%, 90%;
Wherein, solvent comprises: one or more of water, alcohols, ethers and ester class; Wherein alcohols comprises: one or more in the group be made up of ethanol, isopropyl alcohol, butanols, ethylene glycol, phenmethylol; Ethers comprises: butyl glycol ether, butyl, diethylene glycol dimethyl ether, diethylene glycol ether composition group in one or more; Ester class comprises: butyl acetate or ethyl acetate; Wherein, auxiliary agent comprises one or more in surfactant, dispersant, reducing agent; Wherein surfactant comprises: one or more in the group be made up of stearic acid, oleic acid, laurate, triethanolamine, sldium lauryl sulfate, pectic acid sodium, hydroxymethyl starch; Dispersant comprises: one or more in the group be made up of alkyl hydrosulfide, alkyl acid, alkylamine, alkyl phosphoric acid; Reducing agent comprises: one or more in the group be made up of ascorbic acid, hydrazine hydrate, formic acid and formaldehyde.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310066480.7A CN103228110B (en) | 2013-03-01 | 2013-03-01 | The circuit welding resistance technique of printed circuit board (PCB) |
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| CN201310066480.7A CN103228110B (en) | 2013-03-01 | 2013-03-01 | The circuit welding resistance technique of printed circuit board (PCB) |
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| CN103228110A CN103228110A (en) | 2013-07-31 |
| CN103228110B true CN103228110B (en) | 2016-01-06 |
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| CN115124351B (en) * | 2022-07-18 | 2023-10-20 | 合肥圣达电子科技实业有限公司 | High-temperature solder resist slurry for aluminum nitride multilayer and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1571855A (en) * | 2001-10-18 | 2005-01-26 | 加拿大电子粉末公司 | Powder for laminated ceramic capacitor internal electrode |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| WO2010109465A1 (en) * | 2009-03-24 | 2010-09-30 | Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. | Process for sintering nanoparticles at low temperatures |
| CN102675960A (en) * | 2011-03-08 | 2012-09-19 | 深圳市尊业纳米材料有限公司 | Nano copper-tin alloy conductive ink and preparation method and usage of nano copper-tin alloy conductive ink |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1571855A (en) * | 2001-10-18 | 2005-01-26 | 加拿大电子粉末公司 | Powder for laminated ceramic capacitor internal electrode |
| WO2010109465A1 (en) * | 2009-03-24 | 2010-09-30 | Yissum Research Development Company Of The Hebrew University Of Jerusalem, Ltd. | Process for sintering nanoparticles at low temperatures |
| CN101560349A (en) * | 2009-04-22 | 2009-10-21 | 北京印刷学院 | Jet conductive ink |
| CN102675960A (en) * | 2011-03-08 | 2012-09-19 | 深圳市尊业纳米材料有限公司 | Nano copper-tin alloy conductive ink and preparation method and usage of nano copper-tin alloy conductive ink |
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