CN101113388B - Black-hole carbon powder cleaning agent composition and cleaning method thereof - Google Patents
Black-hole carbon powder cleaning agent composition and cleaning method thereof Download PDFInfo
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- CN101113388B CN101113388B CN2006100995570A CN200610099557A CN101113388B CN 101113388 B CN101113388 B CN 101113388B CN 2006100995570 A CN2006100995570 A CN 2006100995570A CN 200610099557 A CN200610099557 A CN 200610099557A CN 101113388 B CN101113388 B CN 101113388B
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Abstract
The invention relates to a black hole carbon powder cleaning agent combination, wherein, the combination contains surfactant, emulsion dispersant and metal complexing agent that is contained selectively. One sort or a plurality of sorts of anionic surfactant, non-ionic surfactant and complex anionic and non-ionic surfactant is/are taken as the surfactant. The black hole carbon powder cleaning agent combination provided by the invention can effectively remove the black hole carbon powder on the surface of the organic materials (e.g. polyimide film, epoxy adhesive, acrylic resin adhesive and epoxy glass fibre cloth) at the surface of various base materials, e.g. a printed-circuit board without causing any unfavorable influence to the base materials.
Description
Technical field
The invention relates to a kind of cleansing composition and using method thereof, especially reach the purging method of black hole carbon dust about a kind of black hole carbon dust cleansing composition.
Background technology
Flexible printed circuit board (FPC) is made of film, have significant superiority such as structure is flexible, volume is little, in light weight, not only can static deflection, can also do dynamic deflection, curl and fold, can expand to three-dimensional space, thereby can improve the degree of freedom and the handiness of the design of circuit layout and physical construction, make it possible to connect up on the plane at X, Y, Z, reduce the interface tie point, can either reduce complete machine workload and assembling error rate, can improve the reliability and stability of whole electric equipment system greatly again, thereby obtain using widely.The Application Areas of FPC mainly is included in the application of aspects such as computer, communication equipment, instrument, medicine equipment, military and space.
Along with the continuous development and the innovation of printed circuit board (PCB) (PCB) processing technology, hard and soft board arises at the historic moment.The appearance of hard and soft board is for the interconnection problems that solves between the electronic functionalities module has been brought new opportunity.Hard and soft board is meant the printed circuit board (PCB) that utilizes flexible parent metal and make in the interconnection of different zones and rigid substrate.In hard and soft land, the conductive pattern on flexible parent metal and the rigid substrate interconnects by plated through-hole usually.Hard and soft board can connect the circuit between Different Plane, can fold, crooked, crispatura, also can connect movable part, realize three dimensional wiring, thereby solved the restricted problem of script in many encapsulation, improved Connection Density, strengthened the reliability of electronics, and be applied to base plate and son, on the motherboard, weight saving, the volume of electronics reduced, assembly cost reduces, maintenance speed improves, and can substitute connector, guarantee the high reliability under severe environment such as vibration, impact, humidity.
For the multiwalled printed circuit board (PCB), (PlatedThrough Hole, PTH) technology realizes the connection between each layer line road figure all to adopt " electroless copper " in the PCB industry usually.In order to realize the metallization of hole wall, the main metallization of adopting the method that is called as " black hole " to realize hole wall in the FPC industry at present.This method has advantages such as environmental friendliness, cost are low, easy to operate, thereby is promoted rapidly and come, and especially is widely used especially in the FPC industry.
" black hole " method is that the effect that utilizes positive and negative charge to inhale is mutually combined closely the carbon particles with conducting function and the organism macromolecular material (materials such as polyimide film, epoxy resin binder, acrylic resin adhesive, epoxy glass fiber cloth) of hole wall, for follow-up electro-coppering provides one deck reliable electroconductibility media.But in the process of making hard and soft board and some flexible printed circuit board, using " black hole " method to realize to run in the metallization processes in hole the situation of directly contact of large area flexible printed circuit board surface (as polyimide film) " black hole " carbon dust.Because strong electrostatic effect, the carbon dust that sticks to the polyimide film surface is difficult to dispose, and these adherent carbon dusts of zone institute must be removed in the manufacture craft of hard and soft board and some flexible printed circuit board.For disposing this layer carbon dust, people attempt to adopt the processing mode of routines such as pickling, alkali cleaning, mechanical polish-brush, but effect is all undesirable.
Summary of the invention
The objective of the invention is in order to solve the problem that the lip-deep black hole of FPC carbon dust is difficult to dispose that sticks to, provide a kind of and can dispose the black hole carbon dust cleansing composition of the black hole carbon dust that sticks to base material such as FPC surface, especially polyimide film surface and the purging method of black hole carbon dust effectively.
In order thoroughly to solve the removing problem of the black hole carbon dust on polyimide film surface, the present inventor has sought out effective solution route from the principle in " black hole ".
Used " black hole " tank liquor of " black hole " method is made up of the suspension of carbon colloid, the size of wherein contained carbon colloid is about the 0.05-0.125 micron, and two main components of carbon colloid are to have the carbon particles of conductivity and the organism that has the negative electricity group of carbon coated particle.After changing the printed circuit board (PCB) after the boring over to black hole operation, earlier through cleaning/whole hole, utilize cleaning/whole hole agent to remove the dirt of hole wall and the organic materials (as polyimide film, epoxy resin binder, acrylic resin adhesive, epoxy glass fiber cloth) of hole wall is adjusted into positively charged, the principle of utilizing positive and negative charge to inhale mutually forms " carbon film " that one deck has conducting function at hole wall.
The carbon film and the hole wall that form have certain bonding force, to guarantee the reliability of follow-up electro-coppering.Equally, this layer carbon film that sticks to the polyimide film surface also has certain bonding force with the organic materials of printed circuit board surface.In addition, after after a while heating and pressure, carbon film layer and polyimide binding force of membrane are stronger, more not easy-clear.As mentioned above, preceding will passing through earlier cleaned/whole hole in " black hole ", and used cleaning/whole hole agent is a kind of tensio-active agent, and the hydrophobic group of tensio-active agent gos deep into hole wall, dirt is taken out of, to reach the effect of cleaning; Hydrophilic group then is adjusted into the organism material of hole wall positively charged.
Based on above-mentioned " black hole " principle, employing contains the clean-out system that can produce stronger bonding force with the organism that is wrapped in carbon black particle, the adsorbed organism of carbon black particle and surface is seized from cleaning/whole agent surface, hole, with reach remove the polyimide film surface the purpose of adherent carbon dust, obtain excellent cleaning effect, thereby solved on the organism material that carbon dust sticks to printed circuit board surface the not situation of easy-clear effectively.
Black hole provided by the invention carbon dust cleansing composition contains the metal chelating agent that tensio-active agent, emulsifying dispersant and selectivity contain, and described tensio-active agent is selected from one or more in anion surfactant, nonionogenic tenside, the negatively charged ion non-ionic composite tensio-active agent.
Black hole provided by the invention carbon dust purging method comprises black hole carbon dust cleansing composition solution is applied to substrate surface that wherein, described black hole carbon dust cleansing composition is a black hole provided by the invention carbon dust cleansing composition.
Black hole provided by the invention carbon dust cleansing composition can effectively be removed the black hole carbon dust on organic materials (as polyimide film, epoxy resin binder, acrylic resin adhesive, the epoxy glass fiber cloth) surface of various base materials such as printed circuit board surface, and can not cause any disadvantageous effect to base material.
Embodiment
According to the present invention, described tensio-active agent can be one or more in anion surfactant, nonionogenic tenside and the negatively charged ion non-ionic composite tensio-active agent.Total amount with cleansing composition is a benchmark, and the content of tensio-active agent is preferably 50-95 weight %, more preferably 60-92 weight %.
Described anion surfactant for example can be one or more in sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, alkaryl polyethenoxy ether sodium sulfate, polyoxyethylenated alcohol sodium sulfate, the alkyl polyoxyethylene ether sodium sulfate.Described alkaryl is preferably the alkaryl that carbonatoms is 10-24, and described alkaryl polyoxyethylene sodium sulfate for example can be that trade name is one or more among Disponil AES 25, DisponilAES 48, the Disponil60.Fatty Alcohol(C12-C14 and C12-C18) in the described polyoxyethylenated alcohol sodium sulfate can be that carbonatoms is the Fatty Alcohol(C12-C14 and C12-C18) of 5-25, and the example of concrete polyoxyethylenated alcohol sodium sulfate can be that trade name is Disponil FES32 IS or Disponil FES993.
Described nonionogenic tenside for example can be selected from polyoxyethylene nonylphenol ether, fatty alcohol-polyoxyethylene ether.Fatty Alcohol(C12-C14 and C12-C18) in the described fatty alcohol-polyoxyethylene ether can be that carbonatoms is the Fatty Alcohol(C12-C14 and C12-C18) of 5-25, and the object lesson of fatty alcohol-polyoxyethylene ether can be Disponil A 1080 and Disponil A3065.The object lesson of polyoxyethylene nonylphenol ether can be Disponil NP20, Disponil NP30, DisponilNP40.
Described negatively charged ion non-ionic composite tensio-active agent preferably contains at least two functional groups, and described functional group is selected from hydroxyl (OH), carboxyl (COOH), carbonyl (CO), carbon-carbon double bond (C=C), carbon-carbon triple bond (C ≡ C), amino (NH
2), in the epoxide group, itrile group (CN), sulfonic group one or more, for example can be polyoxyethylene ether sulfate, Soxylat A 25-7 soap, that concrete can be AES 2403, AES2503 (AEKYUNG SPECIAL CHEMICALS), EMAL20C, EMAL20CM, LEVENOL WX (KAO CORPORATION).
Described emulsifying dispersant can be various have dispersion and emulsion, solid dispersed, thereby can prevent that the carbon powder particle that is cleaned is deposited on the reagent on fpc film surface once more.According to the present invention, described emulsifying dispersant is preferably one or more in carboxymethyl cellulose (CMC), the silicon ether copolymer (trade(brand)name BD-3071,561PL).Described silicon ether copolymer is meant introduces the polyether siloxane copolymers that polyether segment makes in siloxane molecule.Total amount with cleansing composition is a benchmark, and the content of described emulsifying dispersant is preferably 2-50 weight %, more preferably 5-15 weight %.
Cleansing composition of the present invention can also contain metal chelating agent.Described metal chelating agent can be the various reagent that can prevent the anion surfactant inactivation, and calcium, the magnesium ion in the especially anti-sealing causes the anion surfactant inactivation to improve the reagent of tensio-active agent utilization ratio.According to the present invention, described metal chelating agent is preferably tripoly phosphate sodium STPP (STPP) and/or Sodium hexametaphosphate 99 (NaPO
3)
6Total amount with cleansing composition is a benchmark, and the content of metal complex can be 0-30 weight %, is preferably 5-25 weight %, more preferably 10-25 weight %.
Black hole provided by the invention carbon dust cleansing composition for example can be polyimide film, epoxy resin binder, acrylic resin adhesive or the epoxy glass fiber cloth that is used for flexible printed circuit board and hard and soft board applicable to the black hole carbon dust that cleans on the various base materials.
The preparation of cleansing composition of the present invention is simple, and the various components that can will form cleansing composition by the method for routine mix and obtain.
According to the present invention, the purging method of described black hole carbon dust preferably includes black hole carbon dust cleansing composition is dissolved in the solvent, obtain uniform cleansing composition solution, then this solution is applied to substrate surface, the two fully acts on the back with non-dust cloth wiping polyimide film surface gently, carbon dust can be washed fully.The described method that gained solution is applied to substrate surface is preferably uses the solution soaking base material, and the consumption of solution is had no particular limits, and base material all can be immersed in the solution, and also the base material part that can only will need to clean black hole carbon dust is immersed in the solution.
After cleaning finishes, preferably base material is immersed in the deionized water so that remain in the cleansing composition composition on surface and can try one's best moltenly in water, takes out then, through spray washing, acid solution washing, spray washing, dry up, residual to guarantee the no clean-out system in surface.Wherein the used water of spray washing preferably is deionized water before and after the acid solution washing, and spray pressure preferably is 0.5-1.5 kilogram force/square centimeter, and the washing time is preferably 10-30 second; The acid solution washing step preferably uses dilute sulphuric acid, dilute hydrochloric acid solution, and the concentration of described dilute sulphuric acid, dilute hydrochloric acid solution is preferably 1-10 volume %, and the present invention more preferably working concentration is that the dilution heat of sulfuric acid of 1-5 volume % carries out the acid solution washing; The time of described acid solution washing is preferably 10-50 second.
Described solvent can be the various solvents that cleansing composition effectively can be dissolved and base material do not caused damage, considers production cost and environmental requirement, and the preferred described solvent of the present invention is a water, is preferably deionized water or distilled water.Consumption to described solvent is not particularly limited, as long as can be with effectively dissolving of cleansing composition.Under the preferable case, the consumption of described solvent makes the concentration of black hole carbon dust cleansing composition solution be preferably 0.5-20 weight %, more preferably 1-10 weight %, more preferably 2-5 weight %.
For checking the cleaning performance of black hole carbon dust composition to black hole carbon dust, the present invention adopts following two kinds of methods to characterize:
1, examine under a microscope through clearing up the substrate surface of carbon dust, if it is residual to find no atrament, then the black hole of explanation carbon dust is cleaned out; If the film surface has atrament residual, then the black hole of explanation carbon dust is not cleaned out.The base material that to clear up and the same substrate of handling through the black hole observation of putting together simultaneously judges whether the cleaning agent composition has damage to base material, if the two indifference in appearance then illustrates not damaged; If the base material appearance of clearing up has phenomenons such as foaming, then explanation has damage.
2, will not appear on the base material if there is nickel/gold through observing again behind aforesaid way treated base material such as the polyimide film process chemical nickel plating/gold, illustrate that then carbon dust is disposed fully; If nickel/deposition of gold is arranged on the position that is stained with carbon dust originally in chemical nickel plating/metal working preface, then explanation still has carbon dust to remain on the substrate surface, because carbon dust has electroconductibility, can deposit nickel/gold on the carbon dust in chemical nickel plating/metal working preface.
The method of described chemical nickel plating/gold is the method for this area routine, comprises base material is contacted with the chemical plating fluid that contains metal-salt and reductive agent.Metal-salt is selected from the water-soluble hydrochloride salt of metal and in the vitriol one or more, is preferably in nickelous chloride, single nickel salt, cupric chloride and the copper sulfate one or more.Reductive agent is selected from one or more in hypophosphite, formaldehyde and the hydroborate, and described hypophosphite is preferably sodium hypophosphite and/or potassium hypophosphite.The reaction conditions of electroless plating comprises that the electroless plating temperature is 40-90 ℃, is preferably 40-80 ℃; Chemical plating fluid pH value is 4-12; The electroless plating time is 0.05-0.5 hour, is preferably 0.1-0.2 hour; The concentration of reductive agent described in the chemical plating fluid is the 0.2-1.0 mol, and the concentration of metal-salt is the 0.1-0.25 mol.
Wherein, before carrying out electroless plating, can need the surface of electroless plating to activate to base material, the activatory method can be existing various activation methods, for example can use the colloidal palladium activation method, under 35-45 ℃ base material being handled 4 minutes in LH8305A activation solution (Guangzhou international chemical company produce), is the processing 100 seconds under 35-45 ℃ of the sulphuric acid soln of 40-60 grams per liter with concentration then.
The following examples will the present invention is further illustrated.
Embodiment 1
Present embodiment is used to illustrate the purging method of black hole provided by the invention carbon dust cleansing composition and preparation method thereof and black hole carbon dust.
30 weight part Sodium dodecylbenzene sulfonatees, 5 weight part tripoly phosphate sodium STPPs and 2 weight part carboxymethyl celluloses are mixed, make black hole carbon dust cleansing composition S1.
Whole above-mentioned compositions and 1000 parts by weight of deionized water are carried out composite, stir, make cleansing composition solution.The polyimide film that is stained with carbon dust was all flooded 5 minutes in gained cleansing composition solution, then with non-dust cloth wiping polyimide film surface gently, dispose carbon powder particle, successively through the spray washing, the acid solution washing, the spray washing, after drying up the polyimide film taking-up is placed on observation under 10000 power microscopes, it is residual to find no atrament, and with the observation of putting together without the polyimide film that cleans, indifference in appearance, the used water of spray washing is deionized water before and after the acid solution washing, spray washing pressure is 1.0 kilogram force/square centimeters, the washing time is 20 seconds, the acid solution washing step uses the dilution heat of sulfuric acid of 3 volume %, and washing time is 20 seconds; In addition, this polyimide film is carried out after chemical nickel plating/gold handles, the polyimide film surface does not have nickel/gold appearance.Can judge thus, the carbon dust of polyimide film surface adhesion can be washed fully with this kind method preparation cleansing composition.Chemical nickel plating/gold comprises and will contact with the chemical plating fluid that contains nickelous chloride, copper sulfate and formaldehyde through the base material after the activation of colloidal palladium activation method.The reaction conditions of electroless plating comprises that the electroless plating temperature is 50 ℃; Chemical plating fluid pH value is 8; The time of electroless plating is 0.2 hour; The concentration of formaldehyde is 0.2 mol in the chemical plating fluid, and the concentration of nickelous chloride, copper sulfate is 0.2 mol.
Embodiment 2
Present embodiment is used to illustrate the purging method of black hole provided by the invention carbon dust cleansing composition and preparation method thereof and black hole carbon dust.
25 weight part octadecyl polyoxyethylenated alcohol, 8 weight part Sodium hexametaphosphate 99s and 3 weight part carboxymethyl celluloses are mixed, make black hole carbon dust cleansing composition S2.
Whole above-mentioned compositions and 1200 parts by weight of deionized water are carried out composite, stir, make cleansing composition solution.The epoxy glass fiber cloth that is stained with carbon dust was all flooded 10 minutes in gained cleansing composition solution, then with non-dust cloth wiping epoxy glass fiber cloth surface gently, dispose carbon powder particle, successively through spray washing, acid solution washing, spray washing, polyimide film taken out after drying up and is placed on observation 10000 power microscopes under, it is residual to find no atrament, and with put together without the polyimide film that cleans observation, indifference in appearance.The used water of spray washing is deionized water before and after the acid solution washing, and spray washing pressure is 0.5 kilogram force/square centimeter, and the washing time is the dilute hydrochloric acid solution that 5 volume % are used in 30 seconds, acid solution washing step, and washing time is 40 seconds.
In addition, this epoxy glass fiber cloth is sunk after nickel/gold process handles, epoxy glass fiber cloth surface does not have nickel/gold appearance.Can judge thus, the carbon dust of epoxy glass fiber cloth surface adhesion can be washed fully with this kind method preparation cleansing composition.Chemical nickel plating/gold comprises and will contact with the chemical plating fluid that contains nickelous chloride, copper sulfate and formaldehyde through the base material after the activation of colloidal palladium activation method.The reaction conditions of electroless plating comprises that the electroless plating temperature is 70 ℃; Chemical plating fluid pH value is 4; The time of electroless plating is 0.1 hour; The concentration of formaldehyde is 0.1 mol in the chemical plating fluid, and the concentration of nickelous chloride, copper sulfate is 0.5 mol.
Embodiment 3
Present embodiment is used to illustrate the purging method of black hole provided by the invention carbon dust cleansing composition and preparation method thereof and black hole carbon dust.
20 weight part dodecyl alcohol polyoxyethylene ether sodium sulfates, 10 weight part dodecyl alcohol polyoxyethylene ethers and 3 weight part carboxymethyl celluloses are mixed, make black hole carbon dust cleansing composition S3.
Whole above-mentioned compositions and 1500 weight parts are carried out composite through the distilled water of distillation and ion exchange treatment, stir, make cleansing composition solution.The polyimide film that is stained with carbon dust was flooded 5 minutes in gained cleansing composition solution, then with non-dust cloth wiping polyimide film surface gently, dispose carbon powder particle, successively through spray washing, acid solution washing, spray washing, polyimide film taken out after drying up and is placed on observation 10000 power microscopes under, it is residual to find no atrament, and with put together without the polyimide film that cleans observation, indifference in appearance.The used water of spray washing is deionized water before and after the acid solution washing, and spray washing pressure is 1.0 kilogram force/square centimeters, and the washing time is the dilution heat of sulfuric acid that 1 volume % is used in 20 seconds, acid solution washing step, and washing time is 10 seconds.
In addition, this polyimide film is sunk after nickel/gold process handles, the polyimide film surface does not have nickel/gold appearance.Can judge thus, the carbon dust of polyimide film surface adhesion can be washed fully with this kind method preparation cleansing composition.Chemical nickel plating/gold comprises and will contact with the chemical plating fluid that contains nickelous chloride, copper sulfate and formaldehyde through the base material after the activation of colloidal palladium activation method.The reaction conditions of electroless plating comprises that the electroless plating temperature is 50 ℃; Chemical plating fluid pH value is 10; The time of electroless plating is 0.2 hour; The concentration of formaldehyde is 0.2 mol in the chemical plating fluid, and the concentration of nickelous chloride, copper sulfate is 0.2 mol.
Claims (7)
1. black hole carbon dust cleansing composition, it is characterized in that, said composition is by tensio-active agent, the metal chelating agent that emulsifying dispersant and selectivity contain is formed, described tensio-active agent is selected from anion surfactant, nonionogenic tenside, in the negatively charged ion non-ionic composite tensio-active agent one or more, described anion surfactant is selected from sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, the alkaryl polyethenoxy ether sodium sulfate, polyoxyethylenated alcohol sodium sulfate, in the alkyl polyoxyethylene ether sodium sulfate one or more, described nonionogenic tenside is selected from polyoxyethylene nonylphenol ether, fatty alcohol-polyoxyethylene ether, described negatively charged ion non-ionic composite tensio-active agent is selected from the sulfuric acid with Soxylat A 25-7 chain, soap with Soxylat A 25-7; Described emulsifying dispersant is selected from one or more in carboxymethyl cellulose, the silicon ether copolymer; Described metal chelating agent is tripoly phosphate sodium STPP and/or Sodium hexametaphosphate 99, is benchmark with the gross weight of composition, and the content of tensio-active agent is 50-95 weight %, and the content of emulsifying dispersant is 2-50 weight %, and the content of metal chelating agent is 0-30 weight %.
2. composition according to claim 1 wherein, is a benchmark with the gross weight of composition, and the content of tensio-active agent is 60-92 weight %, and the content of emulsifying dispersant is 5-15 weight %, and the content of metal chelating agent is 5-25 weight %.
3. the purging method of a black hole carbon dust, wherein, this method comprises black hole carbon dust cleansing composition solution is applied to substrate surface that wherein said black hole carbon dust cleansing composition is any described black hole carbon dust cleansing composition among the claim 1-2.
4. method according to claim 3 wherein, describedly will be deceived method that hole carbon dust cleansing composition solution is applied to substrate surface and comprise and use the solution soaking base material.
5. method according to claim 3, wherein, the concentration of described black hole carbon dust cleansing composition solution is 0.5-20 weight %.
6. according to claim 3 or 5 described methods, wherein, the solvent that forms black hole carbon dust cleansing composition solution is deionized water or distilled water.
7. according to claim 3 or 4 described methods, wherein, described base material is a flexible printed circuit board or hard and soft in conjunction with printed circuit board (PCB).
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| CN102296318B (en) * | 2011-08-31 | 2013-06-05 | 蚌埠市钰诚五金工贸有限公司 | Non-phosphorus degreasing agent and preparation method thereof |
| CN102438405B (en) * | 2011-11-29 | 2013-08-14 | 电子科技大学 | Method for cleaning through hole smears of rigid-flexible printed circuit board |
| CN103173824A (en) * | 2013-03-01 | 2013-06-26 | 溧阳市新力机械铸造有限公司 | Black hole solution for printed circuit board |
| CN103167747B (en) * | 2013-03-01 | 2016-01-06 | 溧阳市新力机械铸造有限公司 | A kind of preparation method of printed circuit board (PCB) |
| CN103160896B (en) * | 2013-03-01 | 2015-06-10 | 溧阳市新力机械铸造有限公司 | Preparing method of black hole solution for printed circuit board |
| CN104388996A (en) * | 2014-10-30 | 2015-03-04 | 苏州禾川化学技术服务有限公司 | Black hole liquid and preparation method thereof |
| CN105670816A (en) * | 2016-02-24 | 2016-06-15 | 苏州龙腾万里化工科技有限公司 | Multi-color efficient water-based cleaning agent |
| CN111044666B (en) * | 2019-12-31 | 2022-03-25 | 无锡殷达尼龙有限公司 | Analysis method for trace carbon powder and salt residue in dibasic acid |
| CN112105173B (en) * | 2020-09-21 | 2022-01-18 | 广东硕成科技有限公司 | Carbon nano composition for soft board hole metallization and preparation method thereof |
| CN114196484B (en) * | 2021-11-17 | 2023-09-29 | 广东世运电路科技股份有限公司 | Hole-forming agent for manufacturing printed circuit board |
| CN114349010B (en) * | 2022-02-23 | 2023-07-14 | 新疆大全新能源股份有限公司 | Method for removing carbon from waste silicon powder after copper extraction |
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| CN1040051A (en) * | 1989-07-12 | 1990-02-28 | 金颖逵 | Multifunction detergent and preparation method thereof |
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Assignee: Shenzhen BYD Electronic Component Co., Ltd. Assignor: Biyadi Co., Ltd. Contract record no.: 2011440020248 Denomination of invention: Black-hole carbon powder cleaning agent composition and cleaning method thereof Granted publication date: 20101103 License type: Exclusive License Open date: 20080130 Record date: 20110623 |
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Effective date of registration: 20211025 Address after: 214500 No. 18 Shannan Road, Chengbei Park, Jingjiang City, Taizhou City, Jiangsu Province Patentee after: Jingjiang City Huaxin Technology Park Co.,Ltd. Address before: 214500 No. 18 Shannan Road, Chengbei Park, Jingjiang City, Taizhou City, Jiangsu Province Patentee before: Jiangdong Aerospace new materials (Jiangsu) Co., Ltd |
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