CN102735884B - Bracket for measuring head of flying-probe tester and design method of bracket - Google Patents
Bracket for measuring head of flying-probe tester and design method of bracket Download PDFInfo
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- CN102735884B CN102735884B CN201210206989.2A CN201210206989A CN102735884B CN 102735884 B CN102735884 B CN 102735884B CN 201210206989 A CN201210206989 A CN 201210206989A CN 102735884 B CN102735884 B CN 102735884B
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201210206989.2A CN102735884B (en) | 2012-06-21 | 2012-06-21 | Bracket for measuring head of flying-probe tester and design method of bracket |
Applications Claiming Priority (1)
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CN201210206989.2A CN102735884B (en) | 2012-06-21 | 2012-06-21 | Bracket for measuring head of flying-probe tester and design method of bracket |
Publications (2)
Publication Number | Publication Date |
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CN102735884A CN102735884A (en) | 2012-10-17 |
CN102735884B true CN102735884B (en) | 2014-09-10 |
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CN201210206989.2A Active CN102735884B (en) | 2012-06-21 | 2012-06-21 | Bracket for measuring head of flying-probe tester and design method of bracket |
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CN (1) | CN102735884B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103049607A (en) * | 2012-12-17 | 2013-04-17 | 深圳市大族激光科技股份有限公司 | Improved method for gantry type support connection mode and gantry type support |
CN104251923B (en) * | 2014-09-17 | 2017-06-30 | 大族激光科技产业集团股份有限公司 | Measure with two cable probe unit and its application process |
CN105652178B (en) * | 2014-11-13 | 2018-11-27 | 大族激光科技产业集团股份有限公司 | A kind of design method of flying probe tester movement girder construction |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337109A (en) * | 2000-05-26 | 2001-12-07 | Hioki Ee Corp | Contact probe |
US6614245B1 (en) * | 1998-04-28 | 2003-09-02 | Fujitsu Limited | Probe for bumps between printed wiring board and circuit component |
JP2006330006A (en) * | 2006-09-04 | 2006-12-07 | Hioki Ee Corp | Contact probe device and circuit board inspection device |
JP2008045969A (en) * | 2006-08-14 | 2008-02-28 | Hioki Ee Corp | Probe for four-terminal measurement |
CN201170789Y (en) * | 2008-02-28 | 2008-12-24 | 邱增喜 | Probe device |
JP2010101821A (en) * | 2008-10-27 | 2010-05-06 | Ricoh Co Ltd | Board inspecting device and board inspecting system |
CN101804581A (en) * | 2010-03-23 | 2010-08-18 | 四川普什宁江机床有限公司 | Implementation method of automatic compensation for thermal deformation of machine tool |
CN202204842U (en) * | 2011-08-30 | 2012-04-25 | 蔡小涛 | Four-wire test pin module |
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2012
- 2012-06-21 CN CN201210206989.2A patent/CN102735884B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6614245B1 (en) * | 1998-04-28 | 2003-09-02 | Fujitsu Limited | Probe for bumps between printed wiring board and circuit component |
JP2001337109A (en) * | 2000-05-26 | 2001-12-07 | Hioki Ee Corp | Contact probe |
JP2008045969A (en) * | 2006-08-14 | 2008-02-28 | Hioki Ee Corp | Probe for four-terminal measurement |
JP2006330006A (en) * | 2006-09-04 | 2006-12-07 | Hioki Ee Corp | Contact probe device and circuit board inspection device |
CN201170789Y (en) * | 2008-02-28 | 2008-12-24 | 邱增喜 | Probe device |
JP2010101821A (en) * | 2008-10-27 | 2010-05-06 | Ricoh Co Ltd | Board inspecting device and board inspecting system |
CN101804581A (en) * | 2010-03-23 | 2010-08-18 | 四川普什宁江机床有限公司 | Implementation method of automatic compensation for thermal deformation of machine tool |
CN202204842U (en) * | 2011-08-30 | 2012-04-25 | 蔡小涛 | Four-wire test pin module |
Non-Patent Citations (2)
Title |
---|
基于ANSYS的结构设计优化;赵霞等;《辽宁工程技术大学学报》;20061130;第25卷;第144页-145页第1-2部分 * |
赵霞等.基于ANSYS的结构设计优化.《辽宁工程技术大学学报》.2006,第25卷 |
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Publication number | Publication date |
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CN102735884A (en) | 2012-10-17 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Co-patentee after: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee after: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. Address before: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Co-patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: Han's Laser Technology Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200612 Address after: 518101 workshop 5 / F, 1 / 2 / F, 14 / F, 17 / F, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Address before: 518000 No. 9 West West Road, Nanshan District hi tech park, Shenzhen, Guangdong Co-patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. Patentee before: HAN'S LASER TECHNOLOGY INDUSTRY GROUP Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Han's CNC Technology Co.,Ltd. Address before: 518101 5 / F, 1 / 2 / F, 14 / F, 17 / F, No.3 Factory building, antuoshan hi tech Industrial Park, Xinsha Road, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: HAN'S CNC SCIENCE AND TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |