CN102186308A - Fabricating method for micro-slice and vacuuming device for fabricating micro-slice - Google Patents
Fabricating method for micro-slice and vacuuming device for fabricating micro-slice Download PDFInfo
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- CN102186308A CN102186308A CN2011100589328A CN201110058932A CN102186308A CN 102186308 A CN102186308 A CN 102186308A CN 2011100589328 A CN2011100589328 A CN 2011100589328A CN 201110058932 A CN201110058932 A CN 201110058932A CN 102186308 A CN102186308 A CN 102186308A
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Abstract
The invention relates to a fabricating method for micro-slice and a vacuuming device for fabricating the micro-slice. The invention provides the fabricating method for the micro-slice, comprising the following steps of sampling, sealing, vacuuming, solidifying, slice grinding and polishing, wherein during the vacuuming process, a slice die along with a sample is arranged in the vacuuming device so as to carry out the vacuuming operation so that the air in the hole of the sample can be pumped out; during the solidifying process, the slice die and the sample are taken out of the vacuuming device and polyester resin is solidified; during the slice grinding process, the sample is taken out of the slice die and is grinded to the half-hole position; and during the polishing process, the sample is polished. The fabricating method has the benefits that the air bubbles in the hole or in the polyester resin can be forced to overflow by vacuuming; the polyester resin can keep good transparency after being solidified; the phenomenon that the copper in the hole is separated from the wall of the hole can be avoided; the fabricating of high-quality micro-slice can be benefited; and true and exact basis can be provided for judging the production quality of a printing circuit board.
Description
Technical field
The present invention relates to printed circuit, relate in particular to the manufacture method of a kind of little section in the printed circuit and be used for the vacuum extractor of little section.
Background technology
PCB(Printed Circuit Board), Chinese is a printed circuit board, claims printed circuit board (PCB), printed substrate again, is the important electron parts, is the supporter of electronic devices and components, is the supplier that electronic devices and components are electrically connected.Because it is to adopt electron printing to make, so be called as " printing " circuit board.And the quality of board quality, the generation of problem and solution, the improved situation of processing procedure all needs the foundation of little section (microsectioning) as observational study and judgement, and can the quality of little microsection manufacture then can influence and obtain correct, real judgement.At present, under normal pressure, the bubble in the section is difficult to all overflow, and makes that the section transparency of being finished is not high; For less mechanical hole, aperture, because of the built-in air in hole, glue is difficult to pour in the hole, and owing to there is not the glue of filling in the hole, section is easy to generate burr when grinding, cause metric data inaccurate and can't make right judgement, then can cause the copper hole in to separate when serious and make and from the useful data of section acquisition even to cause result's erroneous judgement with hole wall; For the less laser hole in aperture, be difficult to especially grind and obtain product and detect data accurately, can't make normal process monitoring to the production process of product, product quality can't guarantee, therefore, the quality of the little section of existing making is lower, occurs erroneous judgement easily, and the making quality that how to improve little section is a problem demanding prompt solution.
Summary of the invention
Lower in order to solve in the prior art quality of making little section, the problem of erroneous judgement appears easily, and the invention provides a kind of manufacture method of little section and be used to make the vacuum extractor of little section.
The invention provides a kind of manufacture method of little section, may further comprise the steps:
A, sampling, the printed substrate do section sampling of getting test obtains sample;
B, sealing uprightly are placed on sample in the slice module, and polyester resin is injected in the described slice module, and the hole of sample is filled;
C, vacuumize, slice module is put into vacuum extractor together with sample vacuumize, the air in the hole of sample is extracted out;
D, curing are taken out slice module and sample in the vacuum extractor and polyester resin are cured;
E, abrasive disc take out sample in slice module, sample is ground to position, half hole;
F, polishing are polished sample.
As a further improvement on the present invention, step B comprises following substep:
B1, allotment polyester resin are got an amount of polyester resin, splash into 2 to 3 catalyst and curing agent respectively, stir;
B2, sealing uprightly are placed on sample in the slice module, and deployed polyester resin is injected in the described slice module, and the hole of sample is filled.
As a further improvement on the present invention, among the step B2, the polyester resin of injection covered described sample.
As a further improvement on the present invention, step C comprises following substep:
C1, vacuumize, slice module is put into vacuum extractor together with sample vacuumize;
Whether there is bubble to overflow in C2, the observation slice module,, then carries out next step if there is not bubble to overflow;
C3, stop to vacuumize, open the intake valve of vacuum extractor, slowly input air.
As a further improvement on the present invention, step D takes out slice module and sample in vacuum extractor, slice module and sample are put into 40 to 50 degrees centigrade insulating box, and polyester resin is cured.
As a further improvement on the present invention, step e when roughly grinding to bore edges, is finely ground to half hole position to sample for earlier sample being roughly ground.
As a further improvement on the present invention, further comprising the steps of:
G, the burnishing surface of sample is carried out microetch;
H, take pictures.
The present invention also provides a kind of vacuum extractor that is used to make little section, comprise vacuum-pumping container, be provided with cavity in the described vacuum-pumping container, described vacuum-pumping container is connected with the vacuum pumping pump that is communicated with described cavity, be provided with the demarcation strip that described cavity is divided into upper plenum and following cavity in the described vacuum-pumping container, described demarcation strip is provided with air vent hole, and described vacuum-pumping container is provided with intake valve.
As a further improvement on the present invention, described vacuum-pumping container comprises container body and lid, and described container body and described lid are tightly connected.
As a further improvement on the present invention, described air vent hole has two at least.
The invention has the beneficial effects as follows: pass through such scheme, can overflow by vacuumizing the bubble that forces in the sample aperture, also can force the bubble in the polyester resin to overflow, can guarantee that polyester resin keeps good transparency after curing, also can avoid the phenomenon that copper separates with hole wall in the hole, help making high-quality little section, for the judgement of the printed circuit board (PCB) quality of production provides truly, foundation accurately.
Description of drawings
Fig. 1 is a kind of structural representation that is used to make the vacuum extractor of little section of the present invention.
Embodiment
The present invention is further described below in conjunction with description of drawings and embodiment.
Drawing reference numeral among Fig. 1 is: vacuum pumping pump 1; Vacuum-pumping container 2; Demarcation strip 3; Air vent hole 31; Intake valve 4.
A kind of manufacture method of little section may further comprise the steps:
A, sampling, the printed substrate do section sampling of getting test obtains sample, wherein, can with special cut mould on printed circuit board (PCB) any place sampling this or with shearing machine sample cutting basis, but can not too approach the limit, hole, in case major structure becomes blind hole or through hole to be subjected to pulling force and is out of shape, also should note the method for taking a sample, should cut earlier and shear off, downcut the desired sample of cutting with diamond saw again, to reduce the influence of mechanical stress, avoid causing stress to concentrate;
B, sealing, uprightly be placed on sample in the slice module, and with polyester resin (polyester resin is by high-purity epoxy resin, curing agent and other upgradings are formed, its cured product has water-fast, resistance to chemical attack, glittering and translucent characteristics) inject in the described slice module, the hole of sample is filled, wherein, the purpose of sealing is that through hole or blind hole are filled, the hole wall that will observe is fixed to clamp, make and unlikelyly in the process of grinding extended and the distortion distortion by friction, the polyester resin of selecting for use usually is good with transparency, hardness is principle greatly, select for use bubble few, for the sealing that makes sample (promptly cutting sample) is conveniently carried out, correct method is the spring perch of the formula of scratching with a kind of volume, and sample is sandwiched, and makes the state of being kept upright when sealing, slice module then is a kind of blue rubber mould of cylinder;
C, vacuumize, slice module is put into vacuum extractor together with sample vacuumize, the air in the hole of sample is extracted out, wherein, when vacuumizing, can force the bubble in interior bubble of sample aperture and the polyester resin to overflow (polyester resin can produce bubble when stirring) simultaneously;
D, curing are taken out slice module and sample in the vacuum extractor and polyester resin are cured;
E, abrasive disc take out sample in slice module, sample is ground to position, half hole;
F, polishing, sample is polished, wherein, grind with 2500# sand paper and to scrape, scrape with the powder of scraping again, see the truth of little section, just must do careful polishing, to eliminate the scratch of sand paper, if amount is bigger, then can add aluminum oxide suspension and be used as auxiliary agent by the rotating disc type woollen blanket, do the polishing of changeing micro-contact, note when polishing, will changing often cut sample prescription to, made more effect of uniform, till husky trace complete obiteration, if measure lessly, then can use the general leftover of bolt of cloth and brass polish cream instead and can carry out, also to change often and throw moving direction, all around and circumference formula motion, it is light that the pressure of polishing is wanted, and it is many that reciprocal time is wanted, better effects if, and the truth of oiliness polishing gained copper face is better than water-based polished.
Step B comprises following substep:
B1, allotment polyester resin are got an amount of polyester resin, splash into 2 to 3 catalyst and curing agent respectively, stir, and wherein, need slowly support to mix, and produce a large amount of bubbles to avoid polyester resin in the process that stirs, and influence little chipping qualities;
B2, sealing uprightly are placed on sample in the slice module, and deployed polyester resin is injected in the described slice module, and the hole of sample is filled.
Among the step B2, the polyester resin of injection must cover described sample, promptly wraps up described sample by polyester resin.
Step C comprises following substep:
C1, vacuumize, slice module is put into vacuum extractor together with sample vacuumize;
C2, observe in the slice module and whether have bubble to overflow,, then carry out next step if there is not bubble to overflow (promptly vacuumize need to guarantee to no longer include bubble overflow again stop);
C3, stop to vacuumize, open the intake valve of vacuum extractor, slowly input air.
Step D takes out slice module and sample in vacuum extractor, slice module and sample are put into 40 to 50 degrees centigrade insulating box, and polyester resin is cured.
Step e is for roughly grinding sample earlier, when roughly grinding to bore edges, sample is finely ground to position, half hole, wherein, sand paper with 320# is roughly ground on grinder, to the approaching position, hole that will grind, and then 500# sand paper grinds perpendicular to former polishing scratch, expose copper in the hole to the hole that will grind, grind perpendicular to former polishing scratch with 800# sand paper again, to position, half hole (can see that from the section side hole that this half Kong Yuqi image forms is an elliptical aperture) near this hole, grind with 1200# sand paper again, (can see that from the section side this half Kong Yuqi image forms a complete hole) to this Kong Bankong position.
A kind of manufacture method of little section, further comprising the steps of:
G, the burnishing surface of sample is carried out microetch, wherein, after burnishing surface water or Diluted Alcohol cleaned and dry up, can carry out microetch,, can repeat to polish and microetch improves the quality of little section to find out each aspect and the crystalline condition of metal;
H, take pictures.
The manufacture method of a kind of little section provided by the invention, under vacuum condition, the bubble that helps producing when interior air of sample aperture and polyester resin stir overflows fully, polyester resin is cut into slices after curing keep good transparency; During microsection manufacture, extract the air in the aperture out, polyester resin also can normally be poured in the aperture, after the curing, when section was ground, copper can not produce burr or separate the feasible foundation that can be used as correct judgement product quality by the information of little section gained with hole wall in the hole; Under vacuum condition, can carry out the encapsulating of the less hole of diameter (for example diameter is approximately the hole of 0.05mm), realize little microsection manufacture of laser hole, in time grasp product and detect data.
As shown in Figure 1, the present invention also provides a kind of vacuum extractor that is used to make little section, comprise vacuum-pumping container 2, be provided with cavity in the described vacuum-pumping container 2, described vacuum-pumping container 2 is connected with the vacuum pumping pump 1 that is communicated with described cavity, be provided with the demarcation strip 3 that described cavity is divided into upper plenum and following cavity in the described vacuum-pumping container 2, described demarcation strip 3 is provided with air vent hole 31, and described vacuum-pumping container 2 is provided with intake valve 4.
As shown in Figure 1, described vacuum-pumping container 2 comprises container body and lid, and described container body and described lid are tightly connected.
As shown in Figure 1, described air vent hole 31 has two at least, five air vent holes 31 of the preferred evenly layout of the present invention.
A kind of vacuum extractor that is used to make little section provided by the invention, when making little section, slice module and sample can be put on the demarcation strip 3, vacuumize then, when slice module and polyester resin no longer overflow bubble, stop to vacuumize, open intake valve 4, slowly carry out, when the air pressure in the cavity is consistent with the external world, open vacuum-pumping container 2, take out slice module and sample, finish vacuum pumping sample, wherein, can put into a plurality of slice modules and sample simultaneously,, improve the making of little section simultaneously a plurality of slice modules and sample are carried out vacuum pumping.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (10)
1. the manufacture method of a little section is characterized in that, may further comprise the steps:
A, sampling, the printed substrate do section sampling of getting test obtains sample;
B, sealing uprightly are placed on sample in the slice module, and polyester resin is injected in the described slice module, and the hole of sample is filled;
C, vacuumize, slice module is put into vacuum extractor together with sample vacuumize, the air in the hole of sample is extracted out;
D, curing are taken out slice module and sample in the vacuum extractor and polyester resin are cured;
E, abrasive disc take out sample in slice module, sample is ground to position, half hole;
F, polishing are polished sample.
2. according to the manufacture method of the described little section of claim 1, it is characterized in that step B comprises following substep:
B1, allotment polyester resin are got an amount of polyester resin, splash into catalyst and curing agent respectively, stir;
B2, sealing uprightly are placed on sample in the slice module, and deployed polyester resin is injected in the described slice module, and the hole of sample is filled.
3. according to the manufacture method of the described little section of claim 2, it is characterized in that: among the step B2, the polyester resin of injection covered described sample.
4. according to the manufacture method of the described little section of claim 1, it is characterized in that step C comprises following substep:
C1, vacuumize, slice module is put into vacuum extractor together with sample vacuumize;
Whether there is bubble to overflow in C2, the observation slice module,, then carries out next step if there is not bubble to overflow;
C3, stop to vacuumize, open the intake valve of vacuum extractor, slowly input air.
5. according to the manufacture method of the described little section of claim 1, it is characterized in that: step D puts into 40 to 50 degrees centigrade insulating box for take out slice module and sample in vacuum extractor with slice module and sample, and polyester resin is cured.
6. according to the manufacture method of the described little section of claim 1, it is characterized in that: step e when roughly grinding to bore edges, is finely ground to half hole position to sample for earlier sample being roughly ground.
7. according to the manufacture method of the described little section of claim 1, it is characterized in that, further comprising the steps of:
G, the burnishing surface of sample is carried out microetch;
H, take pictures.
8. vacuum extractor that is used to make little section, it is characterized in that: comprise vacuum-pumping container, be provided with cavity in the described vacuum-pumping container, described vacuum-pumping container is connected with the vacuum pumping pump that is communicated with described cavity, be provided with the demarcation strip that described cavity is divided into upper plenum and following cavity in the described vacuum-pumping container, described demarcation strip is provided with air vent hole, and described vacuum-pumping container is provided with intake valve.
9. the vacuum extractor that is used to make little section according to claim 8 is characterized in that: described vacuum-pumping container comprises container body and lid, and described container body and described lid are tightly connected.
10. the vacuum extractor that is used to make little section according to claim 8 is characterized in that: described air vent hole has two at least.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100589328A CN102186308A (en) | 2011-03-11 | 2011-03-11 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2011100589328A CN102186308A (en) | 2011-03-11 | 2011-03-11 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
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| CN102186308A true CN102186308A (en) | 2011-09-14 |
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| CN2011100589328A Pending CN102186308A (en) | 2011-03-11 | 2011-03-11 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
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Cited By (7)
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| CN102539204A (en) * | 2011-10-19 | 2012-07-04 | 深圳市金洲精工科技股份有限公司 | Method for manufacturing printed circuit board (PCB) section and PCB section |
| CN103293159A (en) * | 2012-02-23 | 2013-09-11 | 深南电路有限公司 | Method for testing printed circuit board (PCB) interlayer separation |
| WO2016154919A1 (en) * | 2015-03-31 | 2016-10-06 | 华为技术有限公司 | Slice grinding device |
| CN106124532A (en) * | 2016-08-26 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of nickel corrosion tests of turmeric wiring board |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
| CN107328999A (en) * | 2017-07-31 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant |
| CN110779782A (en) * | 2019-11-20 | 2020-02-11 | 江苏三亿检测技术有限公司 | PCB micro-section analysis sample preparation method |
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|---|---|---|---|---|
| CN102539204A (en) * | 2011-10-19 | 2012-07-04 | 深圳市金洲精工科技股份有限公司 | Method for manufacturing printed circuit board (PCB) section and PCB section |
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| CN103293159A (en) * | 2012-02-23 | 2013-09-11 | 深南电路有限公司 | Method for testing printed circuit board (PCB) interlayer separation |
| CN103293159B (en) * | 2012-02-23 | 2016-12-14 | 深南电路有限公司 | A kind of method checking pcb board interlaminar separation |
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| CN106664797A (en) * | 2015-03-31 | 2017-05-10 | 华为技术有限公司 | Slice grinding device |
| CN106664797B (en) * | 2015-03-31 | 2019-04-23 | 华为技术有限公司 | A kind of grinding device |
| CN106124532A (en) * | 2016-08-26 | 2016-11-16 | 广州兴森快捷电路科技有限公司 | A kind of nickel corrosion tests of turmeric wiring board |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
| CN107328999A (en) * | 2017-07-31 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant |
| CN110779782A (en) * | 2019-11-20 | 2020-02-11 | 江苏三亿检测技术有限公司 | PCB micro-section analysis sample preparation method |
| CN110779782B (en) * | 2019-11-20 | 2024-02-27 | 江苏三亿检测技术有限公司 | PCB micro-slice analysis sample preparation method |
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Application publication date: 20110914 |