CN109206846A - A kind of nano-silicon dioxide modified epoxy resin composite material - Google Patents
A kind of nano-silicon dioxide modified epoxy resin composite material Download PDFInfo
- Publication number
- CN109206846A CN109206846A CN201710520237.6A CN201710520237A CN109206846A CN 109206846 A CN109206846 A CN 109206846A CN 201710520237 A CN201710520237 A CN 201710520237A CN 109206846 A CN109206846 A CN 109206846A
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- epoxy resin
- resin composite
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- silicon dioxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of nano-silicon dioxide modified epoxy resin composite materials, including silica, epoxy resin, silane coupling agent KH570 modified Nano SiO2 powder first, the preparation process of the SiO2 modified epoxy resin composite is as follows: taking 2 g lipophilicity SiO2 powders, ultrasonic disperse is in 80 mL dimethylbenzene, then 49 g epoxy resin are added, the polyamide curing agent of 49 g is added after mixing evenly, ultrasonic disperse stirs evenly, finally mixed system is poured into aluminium-making mould, prior to 120 DEG C 2 h of precuring are placed in baking oven, it is warming up to 150 DEG C of 3 h of solidification again, finally final sample is obtained in 180 DEG C of 1 h of solidification.For the performance for comparing various sample, high-performance SiO2EP resin composite materials are prepared for by blending method using the specimen coding as shown in table 1 that same process is prepared for being not added with the EP. difference composition of nanosized SiO_2.Nanosized SiO_2 mass fraction >=92%, 20 nm of partial size；Benzene (A.R.), dimethylbenzene (A.R.), dehydrated alcohol, H2O2 (35 %, A.R.), γ 2(methacryloxypropyl) propyl trimethoxy silicane (A.R. KH570), epoxy resin (E44,6101), curing agent polyimides (low molecule 650).
Description
Technical field
The present invention relates to chemical technology field, specially a kind of nano-silicon dioxide modified epoxy resin composite material.
Background technique
With the rapid development of information industry, human society just develops towards the direction of advanced IT application steadily, at information
Reason just constituted with information communication advanced IT application science and technology field developing two it is technology pillar big with high-speed computer, show
The information processing technology based on wave device, IC test equipment pursues the high speed of information processing, the increaseization of capacity and volume
Miniaturization；With mobile phone, satellite communication and Bluetooth technology etc. be representative Information and Communication Technology pursue multichannel number, high performance and
Multifunction, so that frequency of use is continuously improved, into high frequency even hyperfrequency field in high-frequency circuit, since substrate is situated between
Electric constant is lower, and signal is propagated faster；The dielectric constant of substrate is smaller, and loss factor is smaller, and the decaying that signal is propagated is smaller.
Summary of the invention
The purpose of the present invention is to provide a kind of nano-silicon dioxide modified epoxy resin composite materials, to solve above-mentioned back
The problem of existing technology proposed in scape technology.
To achieve the above object, the present invention provides the following technical solutions, and a kind of nano-silicon dioxide modified epoxy resin is multiple
Condensation material, including silica, epoxy resin, first silane coupling agent KH570 modified Nano SiO2 powder, by the way that legal system is blended
For high-performance SiO2EP resin composite materials.Nanosized SiO_2 mass fraction >=92%, 20 nm of partial size；Benzene (A.R.), dimethylbenzene
(A.R.), dehydrated alcohol, H2O2 (35 %, A.R.), γ 2(methacryloxypropyl) propyl trimethoxy silicane (A.R.
KH570), epoxy resin (E44,6101), curing agent polyimides (low molecule 650).
The preparation process of the SiO2 modified epoxy resin composite is as follows: taking 2 g lipophilicity SiO2 powders, ultrasound
It is scattered in 80 mL dimethylbenzene, 49 g epoxy resin is then added, add the polyamide curing agent of 49 g after mixing evenly,
Ultrasonic disperse stirs evenly, and finally mixed system is poured into aluminium-making mould, is placed in baking oven prior to 120 DEG C precuring 2
H, then 150 DEG C of 3 h of solidification are warming up to, finally final sample is obtained in 180 DEG C of 1 h of solidification.For the performance for comparing various sample, adopt
It is prepared with the specimen coding as shown in table 1 that same process is prepared for being not added with the EP. difference composition of nanosized SiO_2 by blending method
High-performance SiO2EP resin composite materials.
Compared with prior art, the beneficial effects of the present invention are: surface characteristic that this technology is due to nanoparticle to be had and
Crystal structure makes basis material show a series of excellent performances, and wherein nanosized SiO_2 modified resin matrix has many excellent
Different performance, but there are a large amount of hydroxyls to appear as hydrophily, easy to reunite on nanosized SiO_2 surface, and storage stability difference etc. lacks
Therefore evenly dispersed in resin of nano particle is a weight for preparing high-performance nano particle dispersion distribution organic resin to point
Want link.
Specific embodiment
Below in conjunction with the processing step in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear
Chu is fully described by, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts all
Other embodiments shall fall within the protection scope of the present invention.
The present invention provides a kind of technical solution: a kind of nano-silicon dioxide modified epoxy resin composite material, including dioxy
SiClx, epoxy resin, first silane coupling agent KH570 modified Nano SiO2 powder, are prepared for high-performance by blending method
SiO2EP resin composite materials.Nanosized SiO_2 mass fraction >=92%, 20 nm of partial size；It is benzene (A.R.), dimethylbenzene (A.R.), anhydrous
Ethyl alcohol, H2O2 (35 %, A.R.), γ 2(methacryloxypropyl) propyl trimethoxy silicane (A.R. KH570), epoxy resin
(E44,6101), curing agent polyimides (low molecule 650).
The preparation process of the SiO2 modified epoxy resin composite is following (by taking 2% SiO2EP as an example): taking 2 g close
Then oiliness SiO2 powder, ultrasonic disperse are added 49 g epoxy resin, add 49 after mixing evenly in 80 mL dimethylbenzene
The polyamide curing agent of g, ultrasonic disperse stir evenly, and finally mixed system is poured into aluminium-making mould, are placed in baking oven first
In 120 DEG C of 2 h of precuring, then 150 DEG C of 3 h of solidification are warming up to, finally obtain final sample in 180 DEG C of 1 h of solidification.For comparison
The performance of various sample is prepared for being not added with specimen coding such as 1 institute of table of the EP. difference composition of nanosized SiO_2 using same process
Show that is prepared for high-performance SiO2EP resin composite materials by blending method.
There is baseplane in the rough machined orientation, horizontal flange, top flange face, respectively opens shelves, while adding to each
There are the surpluses of 4mm~6mm on work surface.After roughing, in addition to for bearing box of steam turbine machining work process
The stress of middle generation will carry out outside processing in time, and the work also to be carried out has the process of carrying out flaw detection, sandblasting etc., according to different
Design requirement carries out different adjustment, but must be completed according to correct technological specification, it is ensured that bearing housing process
In required precision.
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art,
It is still possible to modify the technical solutions described in the foregoing embodiments, or part of technical characteristic is carried out etc.
With replacement, all within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in this
Within the protection scope of invention.
Claims (2)
1. a kind of nano-silicon dioxide modified epoxy resin composite material, including silica, epoxy resin, silane coupled first
Agent KH570 modified Nano SiO2 powder, is prepared for high-performance SiO2EP resin composite materials, nanosized SiO_2 quality by blending method
Score >=92%, 20 nm of partial size；Benzene (A.R.), dimethylbenzene (A.R.), dehydrated alcohol, H2O2 (35 %, A.R.), γ 2(methyl
Acryloyl-oxy) propyl trimethoxy silicane (A.R. KH570), epoxy resin (E44,6101), (low point of curing agent polyimides
Son is 650).
2. a kind of nano-silicon dioxide modified epoxy resin composite material according to claim 1, it is characterised in that: described
: 2 g lipophilicity SiO2 powders are taken, then ultrasonic disperse is added 49 g epoxy resin, stirs evenly in 80 mL dimethylbenzene
The polyamide curing agent of 49 g is added afterwards, and ultrasonic disperse stirs evenly, and finally mixed system is poured into aluminium-making mould, places
Prior to 120 DEG C 2 h of precuring in baking oven, then 150 DEG C of 3 h of solidification are warming up to, finally in 180 DEG C of 1 h of solidification.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520237.6A CN109206846A (en) | 2017-06-30 | 2017-06-30 | A kind of nano-silicon dioxide modified epoxy resin composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710520237.6A CN109206846A (en) | 2017-06-30 | 2017-06-30 | A kind of nano-silicon dioxide modified epoxy resin composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109206846A true CN109206846A (en) | 2019-01-15 |
Family
ID=64976869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710520237.6A Withdrawn CN109206846A (en) | 2017-06-30 | 2017-06-30 | A kind of nano-silicon dioxide modified epoxy resin composite material |
Country Status (1)
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| CN (1) | CN109206846A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111925539A (en) * | 2020-07-10 | 2020-11-13 | 中国航空工业集团公司北京长城航空测控技术研究所 | Preparation method of oil corrosion resistant dynamic absorbing-dehydrating high polymer material |
| CN116178901A (en) * | 2023-03-17 | 2023-05-30 | 大连理工大学 | Preparation method of novel high-strength and high-brittleness 3D printing material for rock reconstruction |
-
2017
- 2017-06-30 CN CN201710520237.6A patent/CN109206846A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111925539A (en) * | 2020-07-10 | 2020-11-13 | 中国航空工业集团公司北京长城航空测控技术研究所 | Preparation method of oil corrosion resistant dynamic absorbing-dehydrating high polymer material |
| CN111925539B (en) * | 2020-07-10 | 2022-07-12 | 中国航空工业集团公司北京长城航空测控技术研究所 | Preparation method of oil corrosion resistant dynamic absorbing-dehydrating high polymer material |
| CN116178901A (en) * | 2023-03-17 | 2023-05-30 | 大连理工大学 | Preparation method of novel high-strength and high-brittleness 3D printing material for rock reconstruction |
| CN116178901B (en) * | 2023-03-17 | 2023-08-18 | 大连理工大学 | Preparation method of high-strength and high-brittleness 3D printing material for rock reconstruction |
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Legal Events
| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190115 |