CN103293159A - Method for testing printed circuit board (PCB) interlayer separation - Google Patents
Method for testing printed circuit board (PCB) interlayer separation Download PDFInfo
- Publication number
- CN103293159A CN103293159A CN2012100424156A CN201210042415A CN103293159A CN 103293159 A CN103293159 A CN 103293159A CN 2012100424156 A CN2012100424156 A CN 2012100424156A CN 201210042415 A CN201210042415 A CN 201210042415A CN 103293159 A CN103293159 A CN 103293159A
- Authority
- CN
- China
- Prior art keywords
- junction
- pcb board
- little section
- micro
- little
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The embodiment of the invention discloses a method for testing printed circuit board (PCB) interlayer separation. The method comprises the following steps of: manufacturing a PCB required to be detected into micro-sections; preliminarily distinguishing the abnormality, namely preliminarily distinguishing the sampled micro-section by employing a micro-section observation method so as to judge whether the joint between copper plating and an inner connecting ring is abnormal, and entering the next step if obvious abnormality or suspected abnormality exists at the joint of the micro-sections; smoothening the joint, namely smoothening the upper and lower sides of the joint between the copper plating and the inner connecting ring of the micro-section where the obvious abnormality or suspected abnormality exists; and determining the interlayer separation, namely resetting the smoothened micro-sections on observation equipment, irradiating the micro-sections by utilizing a backlight source, observing the joint of the two smoothened sides, and determining whether the joint is completely connected by utilizing the material characteristics that resin is light-transparent and copper is lighttight. According to the method for testing the PCB interlayer separation in the embodiment, the detection accuracy of the PCB is improved, and the production cost can be saved.
Description
Technical field
The present invention relates to PCB product detection technique field, relate in particular to the method for inspection that a kind of pcb board interlayer separates.
Background technology
The PCB industry is connected imperfect defective with electro-coppering and is defined as the pcb board interlayer and separates with the internal layer abutment ring, this defective mainly due to boring back cull the hole pre-treatment not processing cause electro-coppering to be connected unusually with the internal layer abutment ring fully, influence electrical property.When pcb board is detected, in the prior art, the method of separating between detection layers is general to adopt little sections observation method directly to observe at microscopically, but because the color of copper after by the microetch oxidation all shows as black in the cull of electro-coppering and internal layer junction and the little microsection manufacture process, microscopic examination can't accurately be judged often, cause erroneous judgement and omission easily, the detection accuracy of pcb board is lower, owing to erroneous judgement also can cause unnecessary the scrapping of product to cause the loss of production cost.
Summary of the invention
Embodiment of the invention technical matters to be solved is: the method for separating between a kind of detection layers is provided, with the detection accuracy of raising PCB, and can saves production cost.
In order to solve the problems of the technologies described above, the embodiment of the invention has proposed a kind of method of checking the pcb board interlayer to separate, it is characterized in that, comprises the steps:
Make little section: the pcb board of required detection is made little section;
The preliminary differentiation unusually: adopt little sections observation method that little section of sampling observation is tentatively distinguished, whether exist unusually with the junction of judging electro-coppering and internal layer abutment ring, as the equal Non Apparent Abnormality of all the little sections junction of checking, then test ending; Obviously unusual or doubtful unusual as finding that the junction existence of little section is arranged, then enter next step;
Plain grinding junction: will find to exist the electro-coppering of obviously unusual or doubtful unusual little section and the junction upper and lower surface of internal layer abutment ring to polish;
Judge that interlayer separates: the little section behind the plain grinding is refitted on the facilities for observation, utilizes backlight to shine little section, observe the junction that the two sides polishes, utilize the resin printing opacity, that the lighttight material behavior of copper judges whether the junction connects is complete.
Further, described facilities for observation is microscope.
Further, it is characterized in that described backlight shines described little section from the bottom up.
Further, the micro-enlargement factor during described microscopic examination is at least 200 times.
Further, judge that the method exist interlayer to separate is: examine under a microscope that the adularescent aperture represents the internal layer abutment ring and there is resin residue the electro-coppering junction, if no white aperture then represents the cupric oxide after there is microetch internal layer abutment ring and electro-coppering junction, no resin residue.
Further, use the little section of plain grinding equipment plain grinding.
Further, plain grinding equipment is little section muller.
The beneficial effect of the embodiment of the invention is: the method that check pcb board interlayer of the present invention separates; whether the junction of electro-coppering and internal layer abutment ring exists exception in the little section of the preliminary differentiation of microscopically; as it is obviously unusual or doubtful unusual to find that the junction has; after the unusual junction upper and lower surface of electro-coppering and internal layer abutment ring in this little section polished; heavy placing earlier on the microscope shone from the bottom up with microscopical back light; whether complete to judge the junction; examine under a microscope that the adularescent aperture represents the internal layer abutment ring and there is resin residue the electro-coppering junction; if no white aperture then represents the cupric oxide after there is microetch internal layer abutment ring and electro-coppering junction; no resin residue, this method has improved the detection accuracy of pcb board.
Description of drawings
Fig. 1 is the cutting plane synoptic diagram of the little section of pcb board of the embodiment of the invention.
Fig. 2 is synoptic diagram behind the unusual junction plain grinding of the little section of pcb board of the embodiment of the invention.
Fig. 3 is the method flow diagram of the embodiment of the invention.
The explanation of part drawing reference numeral:
Junction, 50 vias of 10 electro-copperings, 20 internal layer abutment rings, 30 resins, 40 electro-copperings and internal layer abutment ring.
Embodiment
As shown in Figure 1 to Figure 3, the embodiment of the invention provides a kind of method of checking the pcb board interlayer to separate,
Make little section: the pcb board of required detection is made little section;
The preliminary differentiation unusually: preliminary differentiation is unusual: adopt little sections observation method that little section of sampling observation is tentatively distinguished, to judge whether electro-coppering 10 and the junction 40 of internal layer abutment ring 20 exist unusually, as the equal Non Apparent Abnormality of all the little sections junction of checking, then test ending; Obviously unusual or doubtful unusual as finding that the junction existence of little section is arranged, then enter next step;
Plain grinding junction: polish on the electro-coppering 10 that will have obviously unusual or doubtful unusual little section and unusual junction 40 upper and lower surfaces of internal layer abutment ring 20;
Judge that interlayer separates: the little section behind the plain grinding is refitted on the facilities for observation, utilizes backlight to shine little section, observe the junction 40 that the two sides polishes, it is complete to utilize resin 30 printing opacities, the lighttight material behavior of copper to judge accurately whether junction 40 connects.
In the unusual step of described preliminary differentiation, so-called doubtfully refer to unconspicuous unusually or suspect have unusually unusually, cause judging the situation that whether exists interlayer to separate.
In the step of described plain grinding junction, because the thickness of multilayer circuit board is bigger, more big its light transmission of thickness is more poor, therefore electro-coppering 10 all polishes with unusual junction 40 upper and lower surfaces of internal layer abutment ring 20 in the little section that needs multilayer circuit board is made, little section is better through effect when observing with assurance, it can utilize plain grinding equipment that plain grinding is carried out in little section, and this plain grinding equipment is little section muller.
In described judgement interlayer separation steps, the principle of judging defective is that to utilize resin 30 printing opacities, the lighttight material behavior of copper accurately to distinguish the electro-coppering 10 whether junction 40 connect complete, qualified PCB product are complete connections with the junction 40 of internal layer abutment ring 20.During observation, need utilize microscope to observe, need under described microscopical back light shines the state of described little section from the bottom up, to observe, be at least 200 times in the micro-enlargement factor of microscopically.As observe the adularescent aperture and represent junction 40 and have resin 30 residual, prove that there is detachment defects in interlayer; Judge the order of severity that resin 30 is residual according to the aperture angle, angle is more big, and resin 30 is residual more serious; As not having a color that there is the cupric oxide after the microetch junction 40 that white aperture represents electro-coppering 10 and internal layer abutment ring 20, no resin 30 is residual, does not have defective.
The method of check pcb board interlayer detachment defects of the present invention has improved the detection accuracy of pcb board, has reduced unnecessary product rejection rate, has saved production cost.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (7)
1. a method of checking the pcb board interlayer to separate is characterized in that, comprises the steps:
Make little section: the pcb board of required detection is made little section;
The preliminary differentiation unusually: adopt little sections observation method that little section of sampling observation is tentatively distinguished, whether exist unusually with the junction of judging electro-coppering and internal layer abutment ring, as the equal Non Apparent Abnormality of all the little sections junction of checking, then test ending; Obviously unusual or doubtful unusual as finding that the junction existence of little section is arranged, then enter next step;
Plain grinding junction: will find to exist the electro-coppering of obviously unusual or doubtful unusual little section and the junction upper and lower surface of internal layer abutment ring to polish;
Judge that interlayer separates: the little section behind the plain grinding is refitted on the facilities for observation, utilizes backlight to shine little section, observe the junction that the two sides polishes, utilize the resin printing opacity, that the lighttight material behavior of copper judges whether the junction connects is complete.
2. the method for check pcb board interlayer separation as claimed in claim 1 is characterized in that described facilities for observation is microscope.
3. the method for check pcb board interlayer separation as claimed in claim 1 or 2 is characterized in that described backlight shines described little section from the bottom up.
4. the check pcb board interlayer as claimed in claim 2 method of separating is characterized in that, the micro-enlargement factor during described microscopic examination is at least 200 times.
5. the check pcb board interlayer as claimed in claim 2 method of separating, it is characterized in that, judge that the method exist interlayer to separate is: examine under a microscope that the adularescent aperture represents the internal layer abutment ring and there is resin residue the electro-coppering junction, if no white aperture then represents the cupric oxide after there is microetch internal layer abutment ring and electro-coppering junction, no resin residue.
6. the method for check pcb board interlayer separation as claimed in claim 1 is characterized in that, uses the little section of plain grinding equipment plain grinding.
7. the method for check pcb board interlayer separation as claimed in claim 6 is characterized in that described plain grinding equipment is little section muller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210042415.6A CN103293159B (en) | 2012-02-23 | 2012-02-23 | A kind of method checking pcb board interlaminar separation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210042415.6A CN103293159B (en) | 2012-02-23 | 2012-02-23 | A kind of method checking pcb board interlaminar separation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103293159A true CN103293159A (en) | 2013-09-11 |
| CN103293159B CN103293159B (en) | 2016-12-14 |
Family
ID=49094398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210042415.6A Active CN103293159B (en) | 2012-02-23 | 2012-02-23 | A kind of method checking pcb board interlaminar separation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103293159B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108548819A (en) * | 2018-05-10 | 2018-09-18 | 深圳市富利特科技有限公司 | A kind of method of printed circuit board backlight test |
| CN110763699A (en) * | 2019-10-12 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Analysis method of inner layer interconnection defect of circuit board and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
-
2012
- 2012-02-23 CN CN201210042415.6A patent/CN103293159B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
Non-Patent Citations (3)
| Title |
|---|
| TECHNICAL COMMITTEES OF THE IPC: "《IPC-TM-650 TEST METHODS MANUAL》", 31 December 1998 * |
| 周群: "显微剖切技术在印制板生产中的应用", 《印制电路信息》 * |
| 林敏: "PCB国标的探讨", 《第三届全国青年印制电路学术年会论文汇编》 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108548819A (en) * | 2018-05-10 | 2018-09-18 | 深圳市富利特科技有限公司 | A kind of method of printed circuit board backlight test |
| CN110763699A (en) * | 2019-10-12 | 2020-02-07 | 广州兴森快捷电路科技有限公司 | Analysis method of inner layer interconnection defect of circuit board and circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103293159B (en) | 2016-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Malge et al. | PCB defect detection, classification and localization using mathematical morphology and image processing tools | |
| CN113409245B (en) | Automatic identification method for electronic component X-ray inspection defects | |
| CN103064206B (en) | Glass substrate defect detection method | |
| Taha et al. | Automatic optical inspection for PCB manufacturing: a survey | |
| CN103293159A (en) | Method for testing printed circuit board (PCB) interlayer separation | |
| CN102798636B (en) | Detection method for detecting whether flaws exist in drilling holes of FPC (Flexible Printed Circuit) semi-finished product | |
| CN106550556A (en) | Aligning degree of multi-layer circuit board detecting system and its detection method | |
| CN103134778A (en) | Detection method of circuit board electroless plating copper quality and manufacturing process of circuit board | |
| CN103245300A (en) | Depth-control drill test device and test method for PCB (printed circuit board) | |
| US7279923B2 (en) | LSI inspection method and defect inspection data analysis apparatus | |
| KR20050001218A (en) | Test structure for detecting a defect size in a semiconductor device and test method using the same | |
| CN106714457A (en) | Monitoring method for aligning degree of laser drilling | |
| CN101750036A (en) | Method for detecting probe wear and probe | |
| KR102107362B1 (en) | Method for inspecting defects of substrates | |
| CN105682378B (en) | A kind of detection method of PCB internal layers interconnection defect | |
| US20120105623A1 (en) | System for Detecting Surface Variations on Engine Cylinder Head Valve Seats | |
| Ray et al. | A hybrid approach for detection and classification of the defects on printed circuit board | |
| Malge et al. | A survey: Automated visual pcb inspection algorithm | |
| TW202104876A (en) | Printed circuit board repair method and system thereof | |
| CN205561751U (en) | Multilayer PCB board dielectric layer thickness detection device based on capacitance measurement | |
| JPH11271233A (en) | Via hole inspecting device | |
| Dzetzit et al. | Research on importance of cleanliness in manufacturing reliable products for automotive | |
| JP4866263B2 (en) | Electronic device quality control method and electronic device quality control system | |
| CN105430869B (en) | The high hole position precision processing method of IC test boards and production method | |
| CN103619120B (en) | A kind of can the anti-golden finger card groove leakage wiring board of gong and making method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
|
| CP01 | Change in the name or title of a patent holder |