WO2016154919A1 - Slice grinding device - Google Patents

Slice grinding device Download PDF

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Publication number
WO2016154919A1
WO2016154919A1 PCT/CN2015/075585 CN2015075585W WO2016154919A1 WO 2016154919 A1 WO2016154919 A1 WO 2016154919A1 CN 2015075585 W CN2015075585 W CN 2015075585W WO 2016154919 A1 WO2016154919 A1 WO 2016154919A1
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WO
WIPO (PCT)
Prior art keywords
grinding
threaded rod
adjusting
driving
slice
Prior art date
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PCT/CN2015/075585
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French (fr)
Chinese (zh)
Inventor
刘洋
丁海幸
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN201580029070.2A priority Critical patent/CN106664797B/en
Priority to PCT/CN2015/075585 priority patent/WO2016154919A1/en
Publication of WO2016154919A1 publication Critical patent/WO2016154919A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Definitions

  • Embodiments of the present invention relate to the technical field of electronic product failure analysis, and in particular, to a grinding device.
  • FIG. 1 shows a schematic view of a prior art slice at the time of grinding, which is obtained by manually grasping the sliced sample 1 and then grinding it on the grinding device 2. Specifically, firstly, the sliced sample 1 is prepared, and the electronic board is placed in the mold, and the liquid glue is poured into the mold. When the liquid glue is solidified, it is adhered to the electronic board to form a slice sample 1, and the solidified glue can be Convenient for workers to control.
  • FIG. 2a to FIG. 2c show the steps of the worker when holding the grinding piece.
  • the invention provides a grinding device for improving the flatness of a slice after grinding and improving the effect of the grinding plate.
  • a grinding apparatus comprising: a support base, a clamping device for holding a sliced sample, and a grinding device for grinding the sliced sample, wherein
  • the clamping device and the grinding device are respectively disposed on the support base, and the slice sample held by the clamping device faces the grinding disk of the polishing device; further includes a driving device, the driving device driving device At least one of the gripping device and the grinding device is moved toward the other device to cause the grinding disc to grind the sliced sample.
  • the driving device is a screw
  • the clamping device is screwed to the support through the lead screw.
  • the driving device is a driving cylinder
  • the cylinder of the driving cylinder is fixed to the support base
  • the piston rod of the driving cylinder and the clamping The device is fixedly connected.
  • the clamping device includes a base and a plurality of jaws that are fixedly coupled to the base for engaging the sliced sample.
  • an adjustment device is further included, the polishing device is coupled to the support base by an adjustment device, and the adjustment device is configured to adjust an angle between a polishing surface of the polishing device and a horizontal surface.
  • the adjusting device includes at least three adjusting rods, and each adjusting rod includes a fixed connection with the grinding device a threaded rod, a second threaded rod fixedly coupled to the support device, and a threaded tube threadedly coupled to the first threaded rod and the second threaded rod, wherein the first threaded rod and the second threaded rod The threads on the rod are reversed in opposite directions.
  • the method further includes: disposed on the polishing device, and configured to detect an angle between a polishing surface of the polishing device and a horizontal surface Level.
  • the adjusting device further includes an adjusting device connected to the driving device by the adjusting device, and the adjusting device is configured to adjust an angle between a slice clamped by the clamping device and a horizontal plane.
  • the adjusting device includes at least three adjusting rods, and each adjusting rod includes a fixed connection with the clamping device a first threaded rod, a second threaded rod fixedly coupled to the driving device, and respectively a threaded pipe spirally connected to the first threaded rod and the second threaded rod, and the first threaded rod and the second threaded rod are oppositely rotated.
  • the method further includes a level device disposed on the clamping device and configured to detect an angle between the slice and a horizontal plane.
  • the holding device and the grinding device are supported by using the supporting seat, and in use, the clamping device and the grinding device can realize relative movement, so that the sliced sample is evenly stressed during grinding, thereby It ensures that when the sliced sample is ground, it can grind out the flat surface, improve the grinding effect of the sliced sample, and at the same time improve the grinding efficiency.
  • FIG. 1 is a schematic view of a prior art slice at the time of grinding
  • FIG. 3 is a schematic structural view of a grinding device according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a grinding apparatus according to another embodiment of the present invention.
  • the embodiment of the invention provides a grinding tool.
  • the supporting device is supported by using the supporting seat. Grinding device and limiting the direction of relative movement of the clamping device and the grinding device, thereby improving the effect of the sliced sample on the grinding plate and improving the grinding effect of the sliced sample rate.
  • FIG. 3 is a schematic structural view of a grinding apparatus according to an embodiment of the present invention
  • FIG. 4 is a schematic structural view of a grinding apparatus according to another embodiment of the present invention.
  • the embodiment of the present invention provides a grinding device including: a support base, a clamping device 20 for holding the slice sample 60, and a grinding device 30 for grinding the slice sample 60, wherein
  • the clamping device 20 and the polishing device 30 are respectively disposed on the support base 10, and the slice sample clamped by the clamping device 20 faces the grinding disk of the polishing device 30; further includes a driving device 40 that drives the clamping device 20 and grinds At least one of the devices 30 is moved toward the other device, causing the abrasive disk to grind the sliced sample.
  • the clamping device and the grinding device can achieve relative motion, so that the sliced sample 60 is evenly stressed during grinding, thereby It is ensured that when the sliced sample 60 is polished, the flat surface can be polished, the polishing effect of the sliced sample 60 is improved, and the polishing efficiency is also improved.
  • the placement direction of the refining device shown in FIG. 2 and FIG. 3 is the reference direction, and the direction of the placement is the placement direction of the refining device during use, and FIG. 2 and FIG. 3 can be used. It can be seen that when the clamping device and the grinding device 30 are relatively moved, the relative movement in the vertical direction is now.
  • the direction in which the grinding device 30 and the clamping device 20 are relatively moved is defined, that is, in use, the two devices can only achieve relative motion in the vertical direction.
  • the clamping device 20 can be moved in the vertical direction, or the grinding device 30 can be moved in the vertical direction, and the clamping device 20 and the grinding device 30 can be used in the vertical direction.
  • Different sports such as sports. The details will be described in detail below with reference to specific embodiments.
  • the grinding device provided in this embodiment includes a support base 10 and a clamping device for clamping the slice sample 60.
  • the polishing device 30 for polishing the sliced sample 60, the clamping device 20 and the polishing device 30 are respectively disposed on the support base 10 and disposed at opposite positions; and the driving device 40 that drives the clamping device 20 to move toward the polishing device 30.
  • the support base 10 includes two opposite first support plates 12 and second support plates 11 , and a vertical plate 13 is adopted between the first support plate 12 and the second support plate 11 .
  • the fixed connection forms a C-shaped support base 10 structure, wherein the clamping device 20 is disposed on the first support base 10 and can be driven by the driving device 40 to move the clamping device 20 toward the grinding device 30.
  • the grinding device 30 is disposed at the Two support plates 11 are provided.
  • the driving device 40 can adopt different structures to drive the clamping device 20.
  • the driving device 40 is a screw 41, and the clamping device 20 is screwed to the support base 10 through the screw 41, that is, the clamp The holding device 20 is screwed to the first support plate 12 via the lead screw 41.
  • the lead screw 41 is rotated to move the clamping device 20 toward the polishing device 30.
  • a handle can be provided at the end of the lead screw 41, the screw 41 can be rotated by manually rotating the handle, or the lead screw 41 can be rotated by a mechanical pusher.
  • the speed reducer is connected through the drive motor and passed through The speed reducing device drives the screw 41 to rotate.
  • the lead screw 41 can be replaced by a rack.
  • the driving device 40 can also be driven by a cylinder, and the cylinder for driving the cylinder is fixed to the support base 10, and the piston rod of the driving cylinder is fixedly connected with the clamping device 20.
  • the purpose of pushing the gripping device 20 is achieved by the reciprocating movement of the piston rod in the cylinder. It should be understood that the same applies to the principle of using a cylinder or a hydraulic cylinder, and the hydraulic cylinder can also be applied in the present embodiment.
  • the slice sample 60 when the slice sample 60 is subjected to the grinding, the slice sample 60 needs to be first fixed in the clamping device, wherein the clamping device 20 can hold the slice sample 60 with a different structure, in order to facilitate the understanding of the embodiment, First, the structure of the sliced sample 60 will be described first. First, the electronic board is placed in a mold, and liquid glue is poured into the mold. When the liquid glue is solidified, it is adhered to the electronic board to form a slice sample 60, which is convenient for clamping. When the device 20 holds the sliced sample 60, the clamping of the holding device 20 can be facilitated by changing the shape of the formed fixing glue.
  • the gripping device 20 includes a base and a plurality of jaws of the clip sample 60 that are fixedly coupled to the base.
  • the base has a cylindrical shape, and the claws are disposed around the cylindrical base.
  • the number of the claws is greater than two.
  • the number of the claws is three or three.
  • the jaws are evenly placed around the base.
  • the solid glue of the sliced sample 60 is provided with a groove that fits with each of the claws, thereby fixing the sliced sample 60 to the clamping device 20. To facilitate grinding.
  • the clamping device 20 includes a base, and a plurality of protrusions disposed on the base, each of which is screwed with a screw, and the slice sample 60 is fixed to the clamping device 20 by screws. connection. When such a connection is employed, the sliced sample 60 can be firmly fixed to the holding device 20.
  • the grinding device 30 is the same as the grinding device 30 of the prior art, and includes a grinding disc and a motor for driving the grinding disc to rotate, which will not be described in detail herein.
  • the refining device further includes an adjustment device 50 connected to the support base 10 by the adjustment device 50, and the adjustment device 50 is used to adjust the angle between the abrasive surface of the polishing device 30 and the horizontal plane. That is, the angle of the polishing surface of the polishing apparatus 30 can be adjusted by the adjusting device 50.
  • the clamping device 20 is holding the slice. After the sample 60, the bottom surface (abrasive surface) of the slice sample 60 is parallel to the horizontal direction. Therefore, in order to adjust the angle of the polishing, the polishing apparatus 30 adjusts the angle between the grinding disc and the horizontal by the adjusting device 50, thereby realizing the adjustment of the grinding angle. .
  • the adjusting device 50 can be implemented by using different structures.
  • the adjusting device 50 includes a spherical structure disposed on the second supporting plate 11.
  • the grinding device 30 is provided with a spherical sleeve that is sleeved on the spherical structure to form a universal joint. Section structure.
  • the adjusting device 50 comprises at least three adjusting rods, and each adjusting rod comprises a first threaded rod fixedly connected with the grinding device 30, a second threaded rod fixedly connected with the supporting device, and the first threaded rod and The second threaded rod is threadedly connected to the threaded tube, wherein the threads on the first threaded rod and the second threaded rod are opposite in direction of rotation.
  • the grinding angle of the grinding device 30 is adjusted by at least three adjusting rods provided, wherein the number of adjusting rods is preferably three. And the three adjusting rods are arranged in an equilateral triangle. When adjustment is needed, the adjustment of the grinding surface can be realized only by adjusting the threaded tube.
  • the grinding device further includes a level device disposed on the grinding device 30 and used to detect the angle between the grinding surface of the grinding device 30 and the horizontal plane. 70. Therefore, the angle between the adjusted polishing surface and the horizontal plane can be accurately known.
  • the clamping device 20 and the grinding device 30 define the moving direction between the two through the support base 10 and the driving device 40, thereby ensuring the grinding time.
  • the user can adjust the angle of the grinding surface as needed to improve the grinding effect and at the same time improve the quality of the grinding.
  • the structure of the clamping device 20, the polishing device 30 and the driving device 40 in the polishing device provided in this embodiment is the same as the clamping device 20 and the polishing device 30 provided in the first embodiment.
  • the structure is the same and will not be described again here.
  • the difference between Embodiment 1 and Embodiment 2 is that the arrangement of the adjusting device 90 is different.
  • the present embodiment will be described in detail below with respect to the adjusting device 90 of the present embodiment.
  • the adjustment device 90 provided in this embodiment is disposed on the clamping device 20.
  • the refining device further includes an adjustment device 90, and the clamping device 20 is adjusted.
  • the device 90 is coupled to the drive unit 40, and the adjustment device 90 is used to adjust the angle between the slice held by the clamping device 20 and the horizontal plane.
  • the clamping device 20 is connected to the adjustment device 90
  • the adjustment device 90 is connected to the driving device 40
  • the driving device 40 is connected to the second support plate 11.
  • the structure shown in the structural embodiment 1 of the adjusting device 90 includes at least three adjusting rods, and each adjusting rod includes a first threaded rod fixedly coupled to the holding device 20, and The second threaded rod of the driving device 40 is fixedly connected, and the threaded tube respectively screwed to the first threaded rod and the second threaded rod, and the first threaded rod and the second threaded rod are oppositely rotated.
  • the adjustment device 90 includes three adjustment levers, the three adjustment levers are coupled to the base of the clamp device 20.
  • a connection is connected to the driving device 40 for the connection between the adjusting device 90 and the driving device 40.
  • the connecting flanges and the three adjusting rods are connected to the driving device 40 through the connecting flanges.
  • the structure of the connecting flange is a relatively common structure in the mechanical field and will not be described in detail herein.
  • the refining device further comprises a level 80 disposed on the gripping device 20 and for detecting the angle between the slicing and the horizontal plane.
  • the clamping device 20 and the grinding device 30 define the moving direction between the two through the support base 10 and the driving device 40, thereby ensuring the grinding time.
  • the smoothness of the grinding the user can adjust the angle of the grinding surface as needed, improve the grinding effect, and at the same time improve the quality of the grinding.
  • the embodiment 1 and the embodiment 2 are only two specific embodiments of the refining device provided by the embodiment.
  • the structure of the refining device provided in this embodiment is not limited to the above specific structure, and any The structure in which the clamping device 20 and the grinding device 30 are moved in the opposite direction can be applied to the present embodiment, and the principle thereof is similar to the principle of the structure of the specific embodiments listed above, and details are not described herein again.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

Disclosed is a slice grinding device, comprising: a support base (10), a clamping device (20) for clamping a slice sample (1), and a grinding device (2) for grinding the slice sample, wherein the clamping device and the grinding device are respectively arranged on the support base, and the slice sample clamped by the clamping device faces a grinding disc of the grinding device; and further comprising a driving device (40), which drives at least one of the clamping device and the grinding device to move toward another device so as to enable the grinding disc to grind the slice sample. The slice grinding device uses the support base to support the clamping device and the grinding device, and when in use, the clamping device and the grinding device can achieve a relative movement, thereby ensuring that, when the slice sample is ground, a smooth surface can be ground, the grinding effect of the slice sample is improved, and at the same time, the grinding efficiency is also improved.

Description

一种磨片装置Grinding device 技术领域Technical field
本发明实施例涉及到电子产品失效分析的技术领域，尤其涉及到一种磨片装置。Embodiments of the present invention relate to the technical field of electronic product failure analysis, and in particular, to a grinding device.
背景技术Background technique
随之电子通讯产业的快速发展，电子产品的失效分析越来越重要，其中一个重要手段就是切片分析。如图1所示，图1示出了现有技术中的切片在磨片时的示意图，现有切片分析磨片是通过手工抓取切片样品1，然后在研磨装置2上打磨。具体的，首先是制作切片样品1，将电子板放在模具内，在模具内灌入液态胶，当液态胶凝固后，与电子板粘连在一起，形成一个切片样品1，凝固后的胶可以方便工人把持。如图2a～图2c，图2a～图2c示出了工人在手持磨片时的步骤，在工人对切片样品1进行磨片时，由于手工按压切片样品1存在受力不均，角度倾斜等状况，最终导致磨片不平整，甚至是球面。并且纯手工操作，即使经过培训的熟练员工，也可能存在上述操作失误的时候。造成切片磨片后不平整，影响检测的效果。With the rapid development of the electronic communication industry, the failure analysis of electronic products is becoming more and more important. One of the important means is slice analysis. As shown in FIG. 1, FIG. 1 shows a schematic view of a prior art slice at the time of grinding, which is obtained by manually grasping the sliced sample 1 and then grinding it on the grinding device 2. Specifically, firstly, the sliced sample 1 is prepared, and the electronic board is placed in the mold, and the liquid glue is poured into the mold. When the liquid glue is solidified, it is adhered to the electronic board to form a slice sample 1, and the solidified glue can be Convenient for workers to control. 2a to 2c, FIG. 2a to FIG. 2c show the steps of the worker when holding the grinding piece. When the worker grinds the sliced sample 1, there is uneven force, angle inclination, etc. due to manual pressing of the sliced sample 1. The situation eventually led to unevenness of the grinding plate, even the spherical surface. And purely manual operation, even if the trained skilled staff, there may be the above operational errors. It causes unevenness after slicing and affects the detection effect.
发明内容Summary of the invention
本发明提供了一种磨片装置，用以提高切片在磨片后的平整度，提高磨片的效果。The invention provides a grinding device for improving the flatness of a slice after grinding and improving the effect of the grinding plate.
第一方面，提供了一种磨片装置，该磨片装置包括：支撑座、用于夹持切片样品的夹持装置及用于研磨切片样品的研磨装置，其中，In a first aspect, a grinding apparatus is provided, the grinding apparatus comprising: a support base, a clamping device for holding a sliced sample, and a grinding device for grinding the sliced sample, wherein
所述夹持装置及所述研磨装置分别设置在所述支撑座上，且所述夹持装置夹持的切片样品朝向所述研磨装置的研磨盘；还包括驱动装置，所述驱动装置驱动所述夹持装置及所述研磨装置中的至少一个装置朝向另一个装置移动，使所述研磨盘研磨所述切片样品。 The clamping device and the grinding device are respectively disposed on the support base, and the slice sample held by the clamping device faces the grinding disk of the polishing device; further includes a driving device, the driving device driving device At least one of the gripping device and the grinding device is moved toward the other device to cause the grinding disc to grind the sliced sample.
结合上述第一方面、在第一种可能的实现方式中，所述驱动装置为丝杠，所述夹持装置通过所述丝杠与所述支撑座螺旋连接。In combination with the above first aspect, in a first possible implementation, the driving device is a screw, and the clamping device is screwed to the support through the lead screw.
结合上述第一方面、在第二种可能的实现方式中，所述驱动装置为驱动气缸，所述驱动气缸的缸体固定在所述支撑座，所述驱动气缸的活塞杆与所述夹持装置固定连接。In combination with the above first aspect, in a second possible implementation, the driving device is a driving cylinder, the cylinder of the driving cylinder is fixed to the support base, the piston rod of the driving cylinder and the clamping The device is fixedly connected.
结合上述第一方面、在第三种可能的实现方式中，所述夹持装置包括基座，以及与所述基座固定连接的多个卡装所述切片样品的卡爪。In conjunction with the first aspect described above, in a third possible implementation, the clamping device includes a base and a plurality of jaws that are fixedly coupled to the base for engaging the sliced sample.
结合上述第一方面、第一方面的第一种可能的实现方式、第一方面的第二种可能的实现方式、第一方面的第三种可能的实现方式，在第四种可能的实现方式中，还包括调整装置，所述研磨装置通过调整装置与所述支撑座连接，且所述调整装置用于调整所述研磨装置的研磨面与水平面的夹角。In combination with the first aspect, the first possible implementation of the first aspect, the second possible implementation of the first aspect, and the third possible implementation of the first aspect, in a fourth possible implementation Further, an adjustment device is further included, the polishing device is coupled to the support base by an adjustment device, and the adjustment device is configured to adjust an angle between a polishing surface of the polishing device and a horizontal surface.
结合上述第一方面的第四种可能的实现方式，在第五种可能的实现方式中，所述调整装置包括至少三个调整杆，且每个调整杆包括与所述研磨装置固定连接的第一螺纹杆、与所述支撑装置固定连接的第二螺纹杆，以及与所述第一螺纹杆及第二螺纹杆螺纹连接的螺纹管，其中，所述第一螺纹杆及所述第二螺纹杆上的螺纹的旋向相反。In conjunction with the fourth possible implementation of the foregoing first aspect, in a fifth possible implementation, the adjusting device includes at least three adjusting rods, and each adjusting rod includes a fixed connection with the grinding device a threaded rod, a second threaded rod fixedly coupled to the support device, and a threaded tube threadedly coupled to the first threaded rod and the second threaded rod, wherein the first threaded rod and the second threaded rod The threads on the rod are reversed in opposite directions.
结合上述第一方面的第四种可能的实现方式，在第六种可能的实现方式中，还包括设置在所述研磨装置上，并用于检测所述研磨装置的研磨面与水平面的夹角的水平仪。In conjunction with the fourth possible implementation of the foregoing first aspect, in a sixth possible implementation, the method further includes: disposed on the polishing device, and configured to detect an angle between a polishing surface of the polishing device and a horizontal surface Level.
结合上述第一方面、第一方面的第一种可能的实现方式、第一方面的第二种可能的实现方式、第一方面的第三种可能的实现方式，在第七种可能的实现方式中，还包括调整装置，所述夹持装置通过所述调整装置与所述驱动装置连接，且所述调整装置用于调整所述夹持装置夹持的切片与水平面的夹角。With reference to the foregoing first aspect, the first possible implementation manner of the first aspect, the second possible implementation manner of the first aspect, and the third possible implementation manner of the first aspect, in a seventh possible implementation manner The adjusting device further includes an adjusting device connected to the driving device by the adjusting device, and the adjusting device is configured to adjust an angle between a slice clamped by the clamping device and a horizontal plane.
结合上述第一方面的第七种可能的实现方式，在第八种可能的实现方式中，所述调整装置包括至少三个调整杆，且每个调整杆包括与所述夹持装置固定连接的第一螺纹杆、与所述驱动装置固定连接的第二螺纹杆，以及分别 与所述第一螺纹杆及第二螺纹杆螺旋连接的螺纹管，且所述第一螺纹杆及第二螺纹杆的旋向相反。In conjunction with the seventh possible implementation of the foregoing first aspect, in an eighth possible implementation, the adjusting device includes at least three adjusting rods, and each adjusting rod includes a fixed connection with the clamping device a first threaded rod, a second threaded rod fixedly coupled to the driving device, and respectively a threaded pipe spirally connected to the first threaded rod and the second threaded rod, and the first threaded rod and the second threaded rod are oppositely rotated.
结合上述第一方面的第七种可能的实现方式，在第九种可能的实现方式中，还包括设置在所述夹持装置上，并用于检测所述切片与水平面的夹角的水平仪。In conjunction with the seventh possible implementation of the foregoing first aspect, in a ninth possible implementation, the method further includes a level device disposed on the clamping device and configured to detect an angle between the slice and a horizontal plane.
根据第一方面提供的磨片装置，通过采用支撑座来支撑夹持装置及研磨装置，在使用时，夹片装置及磨片装置可以实现相对运动，使得切片样品在研磨时受力均匀，从而保证了在切片样品进行研磨时，能够研磨出平整的面，提高了切片样品的研磨效果，同时，也提高了研磨的效率。According to the grinding apparatus provided in the first aspect, the holding device and the grinding device are supported by using the supporting seat, and in use, the clamping device and the grinding device can realize relative movement, so that the sliced sample is evenly stressed during grinding, thereby It ensures that when the sliced sample is ground, it can grind out the flat surface, improve the grinding effect of the sliced sample, and at the same time improve the grinding efficiency.
附图说明DRAWINGS
图1为现有技术中的切片在磨片时的示意图；1 is a schematic view of a prior art slice at the time of grinding;
图2a～图2c为现有技术中切片在磨片时的步骤流程图；2a to 2c are flow charts showing the steps of the prior art in slicing;
图3为本发明一实施例提供的磨片装置的结构示意图；3 is a schematic structural view of a grinding device according to an embodiment of the present invention;
图4为本发明另一实施例提供的磨片装置的结构示意图。FIG. 4 is a schematic structural diagram of a grinding apparatus according to another embodiment of the present invention.
附图标记：Reference mark:
1-切片样品      2-研磨装置       10-支撑座1-Slice sample 2-grinding device 10-support
11-第二支撑板   12-第二支撑板    13-竖直板11-second support plate 12-second support plate 13-vertical plate
20-夹持装置     30-研磨装置      40-驱动装置20-clamping device 30-grinding device 40-driving device
41-丝杠         50-调整装置      60-切片样品41-screw 50-adjustment device 60-slice sample
70-水平仪       80-水平仪        90-调整装置70-level 80-level 90-adjustment device
具体实施方式detailed description
为了提高切片样品的磨片效果，提高切片样品的磨片效率，本发明实施例提供了一种磨片工具，在本发明实施例提供的技术方案中，通过采用支撑座来支撑夹持装置及研磨装置，并限制了夹持装置及研磨装置的相对运动的方向，从而提高了切片样品在磨片时的效果，并且提高了切片样品的磨片效 率。为使本发明的目的、技术方案和优点更加清楚，以下以非限制性的实施例为例对本发明作进一步详细说明。In order to improve the grinding effect of the sliced sample and improve the grinding efficiency of the sliced sample, the embodiment of the invention provides a grinding tool. In the technical solution provided by the embodiment of the invention, the supporting device is supported by using the supporting seat. Grinding device and limiting the direction of relative movement of the clamping device and the grinding device, thereby improving the effect of the sliced sample on the grinding plate and improving the grinding effect of the sliced sample rate. In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail by way of non-limiting examples.
如图3及图4所示，图3为本发明一实施例提供的磨片装置的结构示意图；图4为本发明另一实施例提供的磨片装置的结构示意图。3 and FIG. 4, FIG. 3 is a schematic structural view of a grinding apparatus according to an embodiment of the present invention; and FIG. 4 is a schematic structural view of a grinding apparatus according to another embodiment of the present invention.
本发明实施例提供了一种磨片装置，该磨片装置包括：支撑座、用于夹持切片样品60的夹持装置20及用于研磨切片样品60的研磨装置30，其中，The embodiment of the present invention provides a grinding device including: a support base, a clamping device 20 for holding the slice sample 60, and a grinding device 30 for grinding the slice sample 60, wherein
夹持装置20及研磨装置30分别设置在支撑座10上，且夹持装置20夹持的切片样品朝向研磨装置30的研磨盘；还包括驱动装置40，驱动装置40驱动夹持装置20及研磨装置30中的至少一个装置朝向另一个装置移动，使研磨盘研磨切片样品。The clamping device 20 and the polishing device 30 are respectively disposed on the support base 10, and the slice sample clamped by the clamping device 20 faces the grinding disk of the polishing device 30; further includes a driving device 40 that drives the clamping device 20 and grinds At least one of the devices 30 is moved toward the other device, causing the abrasive disk to grind the sliced sample.
在上述实施例中，通过采用支撑座10来支撑夹持装置20及研磨装置30，在使用时，夹片装置及磨片装置可以实现相对运动，使得切片样品60在研磨时受力均匀，从而保证了在切片样品60进行研磨时，能够研磨出平整的面，提高了切片样品60的研磨效果，同时，也提高了研磨的效率。In the above embodiment, by using the support base 10 to support the clamping device 20 and the grinding device 30, in use, the clamping device and the grinding device can achieve relative motion, so that the sliced sample 60 is evenly stressed during grinding, thereby It is ensured that when the sliced sample 60 is polished, the flat surface can be polished, the polishing effect of the sliced sample 60 is improved, and the polishing efficiency is also improved.
为了方便对本实施例提供的磨片装置的理解，下面结合附图及具体的实施例对其结构进行详细的说明。In order to facilitate the understanding of the grinding apparatus provided in this embodiment, the structure will be described in detail below with reference to the accompanying drawings and specific embodiments.
如图2及图3所示，以图2及图3所示的磨片装置的放置方向为参考方向，该放置的方向为磨片装置在使用时的放置方向，由图2及图3可以看出，在夹片装置及研磨装置30相对运动时，其实现在竖直方向上的相对运动。As shown in FIG. 2 and FIG. 3 , the placement direction of the refining device shown in FIG. 2 and FIG. 3 is the reference direction, and the direction of the placement is the placement direction of the refining device during use, and FIG. 2 and FIG. 3 can be used. It can be seen that when the clamping device and the grinding device 30 are relatively moved, the relative movement in the vertical direction is now.
在本实施例中，为了保证切片样品60的研磨效果，限定了研磨装置30及夹持装置20相对移动的方向，即在使用时，两个装置仅可实现在竖直方向上的相对运动，在具体的设置时，既可以采用夹持装置20在竖直方向上移动，也可以采用研磨装置30在竖直方向上运动，还可以采用夹持装置20及研磨装置30均可以在竖直方向运动等不同的运动方式。下面以具体的实施例进行详细的说明。In the present embodiment, in order to ensure the grinding effect of the slice sample 60, the direction in which the grinding device 30 and the clamping device 20 are relatively moved is defined, that is, in use, the two devices can only achieve relative motion in the vertical direction. In a specific arrangement, the clamping device 20 can be moved in the vertical direction, or the grinding device 30 can be moved in the vertical direction, and the clamping device 20 and the grinding device 30 can be used in the vertical direction. Different sports such as sports. The details will be described in detail below with reference to specific embodiments.
实施例1Example 1
本实施例提供的磨片装置包括支撑座10、用于夹持切片样品60的夹持装 置20及用于研磨切片样品60的研磨装置30，夹持装置20及研磨装置30分别设置在支撑座10上且设置位置相对；以及驱动夹持装置20朝向研磨装置30移动的驱动装置40。The grinding device provided in this embodiment includes a support base 10 and a clamping device for clamping the slice sample 60. The polishing device 30 for polishing the sliced sample 60, the clamping device 20 and the polishing device 30 are respectively disposed on the support base 10 and disposed at opposite positions; and the driving device 40 that drives the clamping device 20 to move toward the polishing device 30.
具体的，如图2所示，支撑座10包含两个相对设置的第一支撑板12及第二支撑板11，且第一支撑板12及第二支撑板11之间通过一竖直板13固定连接，形成一个C形的支撑座10结构，其中，夹持装置20设置在第一支撑座10上并可通过驱动装置40驱动夹持装置20朝向研磨装置30移动，研磨装置30设置在第二支撑板11上。Specifically, as shown in FIG. 2 , the support base 10 includes two opposite first support plates 12 and second support plates 11 , and a vertical plate 13 is adopted between the first support plate 12 and the second support plate 11 . The fixed connection forms a C-shaped support base 10 structure, wherein the clamping device 20 is disposed on the first support base 10 and can be driven by the driving device 40 to move the clamping device 20 toward the grinding device 30. The grinding device 30 is disposed at the Two support plates 11 are provided.
其中，驱动装置40可以采用不同的结构来实现对夹持装置20驱动，如图2所示，驱动装置40为丝杠41，夹持装置20通过丝杠41与支撑座10螺旋连接，即夹持装置20通过丝杠41与第一支撑板12螺旋连接，在需要对切片样品60进行磨片时，旋转丝杠41，实现推动夹持装置20朝向研磨装置30移动。在丝杠41转动时，即可以在丝杠41的端部设置把手，通过人工旋转把手推动丝杠41转动，或者采用机械推动丝杠41转动，具体的，通过驱动电机连接减速装置，并通过减速装置带动丝杠41转动。采用在采用驱动电机带动减速装置的结构时，丝杠41可以采用齿条来替换，此种为机械传动里面较常规的结构，在此不再一一赘述。此外，驱动装置40还可以采用驱动气缸，驱动气缸的缸体固定在支撑座10，驱动气缸的活塞杆与夹持装置20固定连接。在具体使用时，通过气缸内的活塞杆的往返运动来实现推动夹持装置20移动的目的。应当理解的时，在采用气缸或液压缸的原理相同，液压缸也可应用在本实施中。The driving device 40 can adopt different structures to drive the clamping device 20. As shown in FIG. 2, the driving device 40 is a screw 41, and the clamping device 20 is screwed to the support base 10 through the screw 41, that is, the clamp The holding device 20 is screwed to the first support plate 12 via the lead screw 41. When the sliced sample 60 needs to be ground, the lead screw 41 is rotated to move the clamping device 20 toward the polishing device 30. When the lead screw 41 rotates, a handle can be provided at the end of the lead screw 41, the screw 41 can be rotated by manually rotating the handle, or the lead screw 41 can be rotated by a mechanical pusher. Specifically, the speed reducer is connected through the drive motor and passed through The speed reducing device drives the screw 41 to rotate. When the structure of the driving device is used to drive the speed reducing device, the lead screw 41 can be replaced by a rack. This is a conventional structure in the mechanical transmission, and will not be further described herein. In addition, the driving device 40 can also be driven by a cylinder, and the cylinder for driving the cylinder is fixed to the support base 10, and the piston rod of the driving cylinder is fixedly connected with the clamping device 20. In the specific use, the purpose of pushing the gripping device 20 is achieved by the reciprocating movement of the piston rod in the cylinder. It should be understood that the same applies to the principle of using a cylinder or a hydraulic cylinder, and the hydraulic cylinder can also be applied in the present embodiment.
此外，在对切片样品60进行磨片时，首先需要将切片样品60固定在夹片装置中，其中夹持装置20可以采用不同的结构来夹持切片样品60，为了方便对本实施例的理解，下面首先说明切片样品60的结构，首先将电子板放在模具内，在模具内灌入液态胶，当液态胶凝固后，与电子板粘连在一起，形成一个切片样品60，在为了方便夹持装置20夹持切片样品60时，可以通过改变形成的固定胶的形状，以方便夹持装置20的夹持。其中的夹持装置20 可以采用如下结构：夹持装置20包括基座，以及与基座固定连接的多个卡装切片样品60的卡爪。具体的，基座为圆柱形状，卡爪环绕圆柱形基座设置，较佳的，卡爪的个数大于两个，作为一种优选的实施例，卡爪的个数为三个，三个卡爪环绕基座均匀设置。此外，为了方便卡爪将切片样品60抓牢，较佳的，切片样品60的固态胶上设置有与每个卡爪卡装配合的凹槽，从而将切片样品60固定在夹持装置20上，以便于研磨。或者，夹持装置20包括以下结构：基座，以及设置在基座上的多个凸起，每个凸起上螺旋连接有螺钉，所述切片样品60通过螺钉与所述夹持装置20固定连接。在采用此种连接方式时，可以牢固的将切片样品60与夹持装置20固定。In addition, when the slice sample 60 is subjected to the grinding, the slice sample 60 needs to be first fixed in the clamping device, wherein the clamping device 20 can hold the slice sample 60 with a different structure, in order to facilitate the understanding of the embodiment, First, the structure of the sliced sample 60 will be described first. First, the electronic board is placed in a mold, and liquid glue is poured into the mold. When the liquid glue is solidified, it is adhered to the electronic board to form a slice sample 60, which is convenient for clamping. When the device 20 holds the sliced sample 60, the clamping of the holding device 20 can be facilitated by changing the shape of the formed fixing glue. Holding device 20 therein A configuration may be employed in which the gripping device 20 includes a base and a plurality of jaws of the clip sample 60 that are fixedly coupled to the base. Specifically, the base has a cylindrical shape, and the claws are disposed around the cylindrical base. Preferably, the number of the claws is greater than two. As a preferred embodiment, the number of the claws is three or three. The jaws are evenly placed around the base. In addition, in order to facilitate the gripping of the sliced sample 60 by the claws, preferably, the solid glue of the sliced sample 60 is provided with a groove that fits with each of the claws, thereby fixing the sliced sample 60 to the clamping device 20. To facilitate grinding. Alternatively, the clamping device 20 includes a base, and a plurality of protrusions disposed on the base, each of which is screwed with a screw, and the slice sample 60 is fixed to the clamping device 20 by screws. connection. When such a connection is employed, the sliced sample 60 can be firmly fixed to the holding device 20.
其中的研磨装置30与现有技术中的研磨装置30相同，其包括磨盘及驱动磨盘转动的电机，在此不再详细赘述。The grinding device 30 is the same as the grinding device 30 of the prior art, and includes a grinding disc and a motor for driving the grinding disc to rotate, which will not be described in detail herein.
此外，在研磨装置30与第二支撑板11的连接方式中，可以采用不同的连接方式，如：将研磨装置30直接固定在第二支撑板11。作为一种优选的实施例，该磨片装置还包括调整装置50，研磨装置30通过调整装置50与支撑座10连接，且调整装置50用于调整研磨装置30的研磨面与水平面的夹角。即通过调整装置50可以实现调整研磨装置30的研磨面的角度，在需要对切片样品60进行不同角度的研磨时，如图3所示，由于本实施例中，夹持装置20在夹持切片样品60后，切片样品60的底面(研磨面)平行于水平方向，因此，为了实现调整研磨的角度，研磨装置30通过调整装置50调整磨盘与水平的夹角，从而实现了对研磨角度的调整。In addition, in the connection mode of the polishing device 30 and the second support plate 11, different connection manners may be employed, such as fixing the polishing device 30 directly to the second support plate 11. As a preferred embodiment, the refining device further includes an adjustment device 50 connected to the support base 10 by the adjustment device 50, and the adjustment device 50 is used to adjust the angle between the abrasive surface of the polishing device 30 and the horizontal plane. That is, the angle of the polishing surface of the polishing apparatus 30 can be adjusted by the adjusting device 50. When the slice sample 60 needs to be polished at different angles, as shown in FIG. 3, in the present embodiment, the clamping device 20 is holding the slice. After the sample 60, the bottom surface (abrasive surface) of the slice sample 60 is parallel to the horizontal direction. Therefore, in order to adjust the angle of the polishing, the polishing apparatus 30 adjusts the angle between the grinding disc and the horizontal by the adjusting device 50, thereby realizing the adjustment of the grinding angle. .
具体的，调整装置50可以采用不同的结构来实现，如调整装置50包含设置在第二支撑板11上的球形结构，研磨装置30上设置有套装在球形结构上的球形套从而形成一个万向节结构。较佳的，调整装置50包括至少三个调整杆，且每个调整杆包括与研磨装置30固定连接的第一螺纹杆、与支撑装置固定连接的第二螺纹杆，以及与第一螺纹杆及第二螺纹杆螺纹连接的螺纹管，其中，第一螺纹杆及第二螺纹杆上的螺纹的旋向相反。通过设置的至少三根调整杆来调整研磨装置30的研磨角度，其中，调整杆的个数较佳的采用三根， 且三根调整杆围成正三角形，在需要调整时，只需通过调整螺纹管即可实现对研磨面的调整。Specifically, the adjusting device 50 can be implemented by using different structures. For example, the adjusting device 50 includes a spherical structure disposed on the second supporting plate 11. The grinding device 30 is provided with a spherical sleeve that is sleeved on the spherical structure to form a universal joint. Section structure. Preferably, the adjusting device 50 comprises at least three adjusting rods, and each adjusting rod comprises a first threaded rod fixedly connected with the grinding device 30, a second threaded rod fixedly connected with the supporting device, and the first threaded rod and The second threaded rod is threadedly connected to the threaded tube, wherein the threads on the first threaded rod and the second threaded rod are opposite in direction of rotation. The grinding angle of the grinding device 30 is adjusted by at least three adjusting rods provided, wherein the number of adjusting rods is preferably three. And the three adjusting rods are arranged in an equilateral triangle. When adjustment is needed, the adjustment of the grinding surface can be realized only by adjusting the threaded tube.
在选用调整装置50调整研磨角度时，为了提高研磨的准确性，较佳的，该磨片装置还包括设置在研磨装置30上，并用于检测研磨装置30的研磨面与水平面的夹角的水平仪70。从而能够准确的知道调整后的研磨面与水平面的夹角。In order to improve the grinding accuracy when the adjusting device 50 is selected to adjust the grinding angle, preferably, the grinding device further includes a level device disposed on the grinding device 30 and used to detect the angle between the grinding surface of the grinding device 30 and the horizontal plane. 70. Therefore, the angle between the adjusted polishing surface and the horizontal plane can be accurately known.
通过上述描述可以看出，在本实施例提供的磨片装置中，夹持装置20及研磨装置30通过支撑座10及驱动装置40限定两者之间的运动方向，从而保证了在研磨时的研磨平整度，使用者可以根据需要调整研磨面的角度，提高了研磨的效果，同时，也提高了研磨的质量。It can be seen from the above description that in the grinding device provided in this embodiment, the clamping device 20 and the grinding device 30 define the moving direction between the two through the support base 10 and the driving device 40, thereby ensuring the grinding time. With the flatness of the grinding, the user can adjust the angle of the grinding surface as needed to improve the grinding effect and at the same time improve the quality of the grinding.
实施例2Example 2
如图4所示的磨片装置，本实施例提供的磨片装置中的夹持装置20、研磨装置30及驱动装置40的结构与实施例1中提供的夹持装置20及研磨装置30的结构相同，在此不再一一赘述，实施例1及实施例2的区别在于调整装置90的设置不同，下面针对本实施例的调整装置90对本实施例进行详细的说明。The structure of the clamping device 20, the polishing device 30 and the driving device 40 in the polishing device provided in this embodiment is the same as the clamping device 20 and the polishing device 30 provided in the first embodiment. The structure is the same and will not be described again here. The difference between Embodiment 1 and Embodiment 2 is that the arrangement of the adjusting device 90 is different. The present embodiment will be described in detail below with respect to the adjusting device 90 of the present embodiment.
继续参考图4，由图4中可以看出，本实施例中提供的调整装置90设置在了夹持装置20上，具体的，该磨片装置还包括调整装置90，夹持装置20通过调整装置90与驱动装置40连接，且调整装置90用于调整夹持装置20夹持的切片与水平面的夹角。在具体的连接方式中，首先夹持装置20与调整装置90连接，调整装置90与驱动装置40连接，驱动装置40与第二支撑板11连接。在具体的设置时，调整装置90的结构实施例1所示的结构，即调整装置90包括至少三个调整杆，且每个调整杆包括与夹持装置20固定连接的第一螺纹杆、与驱动装置40固定连接的第二螺纹杆，以及分别与第一螺纹杆及第二螺纹杆螺旋连接的螺纹管，且第一螺纹杆及第二螺纹杆的旋向相反。在调整装置90包含三个调整杆时，三个调整杆与夹持装置20的基座连接。此外，对于调整装置90与驱动装置40之间的连接，在驱动装置40上连接一 个连接法兰，三个调整杆通过连接法兰与驱动装置40连接。在具体的驱动装置40选用不同的结构时，连接法兰的结构为机械领域比较常见的结构在此不再详细赘述。With continued reference to FIG. 4, it can be seen from FIG. 4 that the adjustment device 90 provided in this embodiment is disposed on the clamping device 20. Specifically, the refining device further includes an adjustment device 90, and the clamping device 20 is adjusted. The device 90 is coupled to the drive unit 40, and the adjustment device 90 is used to adjust the angle between the slice held by the clamping device 20 and the horizontal plane. In a specific connection mode, first, the clamping device 20 is connected to the adjustment device 90, the adjustment device 90 is connected to the driving device 40, and the driving device 40 is connected to the second support plate 11. In a specific arrangement, the structure shown in the structural embodiment 1 of the adjusting device 90, that is, the adjusting device 90 includes at least three adjusting rods, and each adjusting rod includes a first threaded rod fixedly coupled to the holding device 20, and The second threaded rod of the driving device 40 is fixedly connected, and the threaded tube respectively screwed to the first threaded rod and the second threaded rod, and the first threaded rod and the second threaded rod are oppositely rotated. When the adjustment device 90 includes three adjustment levers, the three adjustment levers are coupled to the base of the clamp device 20. In addition, for the connection between the adjusting device 90 and the driving device 40, a connection is connected to the driving device 40. The connecting flanges and the three adjusting rods are connected to the driving device 40 through the connecting flanges. When the specific driving device 40 selects a different structure, the structure of the connecting flange is a relatively common structure in the mechanical field and will not be described in detail herein.
此外，为了检测调整的角度，该磨片装置还包括设置在夹持装置20上，并用于检测切片与水平面的夹角的水平仪80。Furthermore, in order to detect the adjusted angle, the refining device further comprises a level 80 disposed on the gripping device 20 and for detecting the angle between the slicing and the horizontal plane.
通过上述实施例可以看出，在本实施例提供的磨片装置中，夹持装置20及研磨装置30通过支撑座10及驱动装置40限定两者之间的运动方向，从而保证了在研磨时的研磨平整度，使用者可以根据需要调整研磨面的角度，提高了研磨的效果，同时，也提高了研磨的质量。It can be seen from the above embodiment that in the grinding device provided in this embodiment, the clamping device 20 and the grinding device 30 define the moving direction between the two through the support base 10 and the driving device 40, thereby ensuring the grinding time. The smoothness of the grinding, the user can adjust the angle of the grinding surface as needed, improve the grinding effect, and at the same time improve the quality of the grinding.
应当理解的是，实施例1及实施例2仅仅是提供了本实施例提供的磨片装置的两个具体的实施例，本实施例提供的磨片装置的结构不仅限于上述具体的结构，任何采用实现夹持装置20及研磨装置30相向运动的结构均可应用在本实施例中，其原理与上述列举的具体实施例的结构的原理相近似，在此不再赘述。It should be understood that the embodiment 1 and the embodiment 2 are only two specific embodiments of the refining device provided by the embodiment. The structure of the refining device provided in this embodiment is not limited to the above specific structure, and any The structure in which the clamping device 20 and the grinding device 30 are moved in the opposite direction can be applied to the present embodiment, and the principle thereof is similar to the principle of the structure of the specific embodiments listed above, and details are not described herein again.
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。 It is apparent that those skilled in the art can make various modifications and variations to the invention without departing from the spirit and scope of the invention. Thus, it is intended that the present invention cover the modifications and modifications of the invention

Claims (10)

  1. 一种磨片装置，其特征在于，包括：支撑座、用于夹持切片样品的夹持装置及用于研磨切片样品的研磨装置，其中，A grinding device comprising: a support base, a clamping device for holding a sliced sample, and a grinding device for grinding the sliced sample, wherein
    所述夹持装置及所述研磨装置分别设置在所述支撑座上，且所述夹持装置夹持的切片样品朝向所述研磨装置的研磨盘；还包括驱动装置，所述驱动装置驱动所述夹持装置及所述研磨装置中的至少一个装置朝向另一个装置移动，使所述研磨盘研磨所述切片样品。The clamping device and the grinding device are respectively disposed on the support base, and the slice sample held by the clamping device faces the grinding disk of the polishing device; further includes a driving device, the driving device driving device At least one of the gripping device and the grinding device is moved toward the other device to cause the grinding disc to grind the sliced sample.
  2. 如权利要求1所述的磨片装置，其特征在于，所述驱动装置为丝杠，所述夹持装置通过所述丝杠与所述支撑座螺旋连接。A sharpening apparatus according to claim 1, wherein said driving means is a screw, and said holding means is screwed to said support by said lead screw.
  3. 如权利要求1所述的磨片装置，其特征在于，所述驱动装置为驱动气缸，所述驱动气缸的缸体固定在所述支撑座，所述驱动气缸的活塞杆与所述夹持装置固定连接。A plate grinding apparatus according to claim 1, wherein said driving means is a driving cylinder, said cylinder of said driving cylinder is fixed to said support base, said piston rod of said driving cylinder and said holding means Fixed connection.
  4. 如权利要求1所述的磨片装置，其特征在于，所述夹持装置包括基座，以及与所述基座固定连接的多个卡装所述切片样品的卡爪。A sharpening apparatus according to claim 1, wherein said holding means comprises a base, and a plurality of claws that are fixedly coupled to said base and that hold said sliced sample.
  5. 如权利要求1～4任一项所述的磨片装置，其特征在于，还包括调整装置，所述研磨装置通过调整装置与所述支撑座连接，且所述调整装置用于调整所述研磨装置的研磨面与水平面的夹角。A polishing apparatus according to any one of claims 1 to 4, further comprising adjustment means, said grinding means being coupled to said support base by an adjustment means, and said adjustment means for adjusting said grinding The angle between the abrasive surface of the device and the horizontal plane.
  6. 如权利要求5所述的磨片装置，其特征在于，所述调整装置包括至少三个调整杆，且每个调整杆包括与所述研磨装置固定连接的第一螺纹杆、与所述支撑装置固定连接的第二螺纹杆，以及与所述第一螺纹杆及第二螺纹杆螺纹连接的螺纹管，其中，所述第一螺纹杆及所述第二螺纹杆上的螺纹的旋向相反。A sharpening apparatus according to claim 5, wherein said adjusting means comprises at least three adjusting levers, and each of said adjusting levers includes a first threaded rod fixedly coupled to said grinding means, and said supporting means a second threaded rod fixedly coupled, and a threaded tube threadedly coupled to the first threaded rod and the second threaded rod, wherein the threads on the first threaded rod and the second threaded rod are opposite in direction of rotation.
  7. 如权利要求5所述的磨片装置，其特征在于，还包括设置在所述研磨装置上，并用于检测所述研磨装置的研磨面与水平面的夹角的水平仪。A plate apparatus according to claim 5, further comprising a level provided on said polishing means for detecting an angle between said abrasive surface of said polishing means and a horizontal plane.
  8. 如权利要求1～4所述的磨片装置，其特征在于，还包括调整装置，所述夹持装置通过所述调整装置与所述驱动装置连接，且所述调整装置用于调 整所述夹持装置夹持的切片与水平面的夹角。A polishing apparatus according to any one of claims 1 to 4, further comprising adjustment means, said holding means being coupled to said driving means by said adjusting means, and said adjusting means for adjusting The angle between the slice held by the clamping device and the horizontal plane.
  9. 如权利要求8所述的磨片装置，其特征在于，所述调整装置包括至少三个调整杆，且每个调整杆包括与所述夹持装置固定连接的第一螺纹杆、与所述驱动装置固定连接的第二螺纹杆，以及分别与所述第一螺纹杆及第二螺纹杆螺旋连接的螺纹管，且所述第一螺纹杆及第二螺纹杆的旋向相反。A sharpening apparatus according to claim 8, wherein said adjusting means comprises at least three adjusting levers, and each of said adjusting levers includes a first threaded rod fixedly coupled to said holding means, and said driving a second threaded rod fixedly connected to the device, and a threaded tube respectively screwed to the first threaded rod and the second threaded rod, and the first threaded rod and the second threaded rod are oppositely rotated.
  10. 如权利要求8所述的磨片装置，其特征在于，还包括设置在所述夹持装置上，并用于检测所述切片与水平面的夹角的水平仪。 A sharpening apparatus according to claim 8, further comprising a level provided on said holding means for detecting an angle of said slice to a horizontal plane.
PCT/CN2015/075585 2015-03-31 2015-03-31 Slice grinding device WO2016154919A1 (en)

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