CN110779782A - PCB micro-section analysis sample preparation method - Google Patents
PCB micro-section analysis sample preparation method Download PDFInfo
- Publication number
- CN110779782A CN110779782A CN201911142639.2A CN201911142639A CN110779782A CN 110779782 A CN110779782 A CN 110779782A CN 201911142639 A CN201911142639 A CN 201911142639A CN 110779782 A CN110779782 A CN 110779782A
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- sample wafer
- polishing
- pcb
- glue
- grinding
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- 238000004458 analytical method Methods 0.000 title claims abstract description 11
- 238000005464 sample preparation method Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 31
- 238000005498 polishing Methods 0.000 claims abstract description 28
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 24
- 238000000227 grinding Methods 0.000 claims abstract description 16
- 238000005530 etching Methods 0.000 claims abstract description 15
- 244000137852 Petrea volubilis Species 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 12
- 239000010432 diamond Substances 0.000 claims abstract description 8
- 229910003460 diamond Inorganic materials 0.000 claims abstract description 8
- 238000005070 sampling Methods 0.000 claims abstract description 8
- 230000000694 effects Effects 0.000 claims abstract description 5
- 229920000742 Cotton Polymers 0.000 claims abstract description 4
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 238000007598 dipping method Methods 0.000 claims abstract description 4
- 239000004744 fabric Substances 0.000 claims abstract description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- 208000032544 Cicatrix Diseases 0.000 claims description 3
- 239000012752 auxiliary agent Substances 0.000 claims description 3
- 239000003153 chemical reaction reagent Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 231100000241 scar Toxicity 0.000 claims description 3
- 230000037387 scars Effects 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims description 2
- 238000004880 explosion Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 10
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 239000010437 gem Substances 0.000 description 1
- 229910001751 gemstone Inorganic materials 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2866—Grinding or homogeneising
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/286—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q involving mechanical work, e.g. chopping, disintegrating, compacting, homogenising
- G01N2001/2873—Cutting or cleaving
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention relates to the field of printed circuit boards, in particular to a PCB micro-section analysis sample preparation method, which comprises the following steps: s1, cutting and sampling the PCB by a diamond saw to obtain a sample wafer; s2, performing glue pouring treatment on the obtained sample wafer; s3, grinding the sample wafer after glue pouring on a high-speed turntable of a grinding tester by using the cutting force of sand paper; s4, polishing the sample wafer by adopting a polishing machine matched with flocking polishing cloth; and S5, cleaning and wiping the polished surface, then carrying out hydrochloric acid etching treatment, dipping the cotton swab in the etching solution, lightly wiping the surface of the slice for 2-3 seconds, and then wiping the slice to obtain the polishing solution. According to the invention, the sample wafer is obtained by cutting the diamond saw, and the diamond saw generates smaller stress on the PCB, so that the phenomenon of board explosion of the PCB due to large stress is avoided; meanwhile, the sample wafer is etched by hydrochloric acid, the hydrochloric acid etching effect is obvious, and the sample wafer is not easy to corrode.
Description
Technical Field
The invention relates to the field of Printed Circuit Boards (PCBs), in particular to a PCB microtome analysis sample preparation method.
Background
In the production process of the printed circuit board, the occurrence and the solution of the product quality problem and the improvement of the manufacturing process need to use observation of the micro-slices as the basis for research and judgment, the good and the bad performance of the micro-slices, and the high reduction degree of the micro-slices is a key factor for judging and researching the quality and the manufacturing process of the PCB.
The conventional PCB slicing manufacturing method generally comprises the following six steps: sampling, sealing glue, grinding, polishing and micro-etching, then carrying out photographing detection, and observing the hole wall of the PCB slice by using the photographed picture so as to judge the quality of the PCB and the problems in the manufacturing process.
Wherein, the sampling is related to the quality of the PCB slice in the manufacturing process of the PCB slice. In the existing manufacturing method, the situation of uneven stress can occur in the cutting and sawing process of the sampling sheet, so that the PCB board edge is easy to be layered, is notched, and has the problems that the sampling trimming edge is not parallel to the horizontal axis of the hole to be detected.
Secondly, the glue sealing in the PCB slice manufacturing process often causes the sample wafer solidification speed to be too fast due to unreasonable reagent proportion, so that bubbles in the glue are difficult to remove, and the quality and the detection result of the sample wafer are influenced.
Finally, the microetching in the manufacturing process of the PCB slices mostly adopts ammonia water and hydrogen peroxide to mix to prepare microetching liquid, the copper surface obtained by the microetching liquid is relatively fine and smooth in crystallization, the tin-lead surface is clean, the sample wafer is easily corroded, and the quality and the detection result of the sample wafer are further influenced.
Disclosure of Invention
The invention aims to provide a PCB microtome analysis sample preparation method.
The purpose of the invention is realized by the following technical scheme: a PCB microtome analysis sample preparation method comprises the following steps,
s1, cutting and sampling the PCB by a diamond saw to obtain a sample wafer;
s2, performing glue pouring treatment on the obtained sample wafer, uniformly mixing the crystal glue, the curing agent and the catalyst in a certain proportion, pouring the mixture into a glue box filled with the sample wafer, placing the glue box under the negative pressure condition of 0.8-1.0 MPa for storage for 5-10 min, and then taking out the glue box to naturally solidify the crystal glue;
s3, grinding the sample wafer after glue pouring on a high-speed turntable of a grinding tester by using the cutting force of sand paper;
s4, polishing the sample wafer by adopting a polishing machine matched with flocking polishing cloth, and adding a carborundum polishing agent as a polishing auxiliary agent, wherein the rotating speed of the polishing machine is 200-300 r/min;
and S5, cleaning and wiping the polished surface, then carrying out hydrochloric acid etching treatment, dipping the cotton swab in the etching solution, lightly wiping the surface of the slice for 2-3 seconds, and then wiping the slice to obtain the polishing solution.
The invention is further configured to: the ratio of the crystal glue, the curing agent and the catalyst in the step S2 is 100: 0.5-1: 0.5 to 1.
The invention is further configured to: the sandpaper used in step S3 is numbered and sequenced as follows:
I) firstly, roughly grinding a sample wafer by using 120-mesh sand paper until two rows of hole walls of the through holes are about to appear;
II) grinding the surface of the inclined ground surface again by using 450-mesh abrasive paper until an indication line preset in the center of the hole appears, and performing servo-correction to correct the inclined ground surface;
III) sequentially adopting 1500 meshes, 3000 meshes and 4500 meshes of fine sand paper to grind the sample wafer to eliminate the scars on the cut surface so as to reduce the polishing time and increase the true flat effect.
The invention is further configured to: in step S5, the etching solution is prepared by uniformly mixing 2ml of 5% hydrochloric acid and 50ml of deionized water.
Compared with the prior art, the invention provides a PCB microtome analysis sample preparation method, which has the following beneficial effects:
1. according to the invention, the sample wafer is obtained by cutting the diamond saw, and compared with cutting tools such as a jewel saw, a miniature band saw, an abrasive wheel saw and the like, the diamond saw generates smaller stress on the PCB, so that the phenomenon of board explosion of the PCB due to large stress is avoided;
2. the ratio of the crystal glue, the curing agent and the catalyst used in the glue filling process can avoid the problem that bubbles are difficult to remove due to high curing speed of the sample wafer, and is beneficial to manufacturing the transparent bubble-free sample wafer;
3. in the invention, the sample wafer is ground by adopting the 120-mesh, 450-mesh, 1500-mesh, 3000-mesh and 4000-mesh combined sand paper, so that the grinding efficiency and quality are improved;
4. according to the invention, the sample wafer is etched by using hydrochloric acid, and compared with an etching solution prepared by using ammonia water and hydrogen peroxide, the hydrochloric acid etching effect is obvious, and the sample wafer is not easy to corrode.
Detailed Description
Example (b): the embodiment provides a PCB microtome analysis sample preparation method, which comprises the following steps:
s1, cutting and sampling at any position on the PCB by a diamond saw to obtain a sample wafer;
s2, performing glue filling treatment on the obtained sample, vertically placing the sample into a glue box, and mixing the reagents in a ratio of 100: 1: 0.5 of crystal glue, curing agent and catalyst are uniformly mixed and poured into a glue box filled with a sample wafer, the sample can be crystal glue (matched with the curing agent and the catalyst) sold by Shenzhen Yong and Fengshen Limited, the glue box is placed in a vacuum drier and is stored for 5-10 min under the negative pressure condition of 0.8-1.0 MPa, and then the glue box is taken out to naturally solidify the crystal glue for 15-20 min;
s3, grinding the sample wafer after glue pouring on a high-speed turntable of a grinding tester by using the cutting force of sand paper; the sand paper used therein has the following numbers and sequence:
I) firstly, roughly grinding a sample wafer by using 120-mesh sand paper until two rows of hole walls of the through holes are about to appear;
II) grinding the surface of the inclined ground surface again by using 450-mesh abrasive paper until an indication line preset in the center of the hole appears, and performing servo-correction to correct the inclined ground surface;
III) sequentially adopting 1500-mesh, 3000-mesh and 4500-mesh fine sand paper to grind the sample wafer to eliminate the scars on the cut surface so as to reduce the polishing time and increase the true flat effect;
s4, polishing the sample wafer by adopting a polishing machine matched with flocking polishing cloth, and adding a carborundum polishing agent as a polishing auxiliary agent, wherein the rotating speed of the polishing machine is 200-300 r/min;
and S5, cleaning and wiping the polished surface, then carrying out hydrochloric acid etching treatment, uniformly mixing 2ml of 5% hydrochloric acid and 50ml of deionized water to obtain hydrochloric acid etching solution, dipping the etching solution by using a cotton swab, lightly wiping the surface of the slice for 2-3 seconds, and then wiping the slice to dry.
The foregoing is a detailed description of the invention, which is described in greater detail and not intended to limit the scope of the invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention, and that such obvious alternatives fall within the scope of the invention.
Claims (4)
1. A PCB microtome analysis sample preparation method is characterized by comprising the following steps:
s1, cutting and sampling the PCB by a diamond saw to obtain a sample wafer;
s2, performing glue pouring treatment on the obtained sample wafer, uniformly mixing the crystal glue, the curing agent and the catalyst in a certain proportion, pouring the mixture into a glue box filled with the sample wafer, placing the glue box under the negative pressure condition of 0.8-1.0 MPa for storage for 5-10 min, and then taking out the glue box to naturally solidify the crystal glue;
s3, grinding the sample wafer after glue pouring on a high-speed turntable of a grinding tester by using the cutting force of sand paper;
s4, polishing the sample wafer by adopting a polishing machine matched with flocking polishing cloth, and adding a carborundum polishing agent as a polishing auxiliary agent, wherein the rotating speed of the polishing machine is 200-300 r/min;
and S5, cleaning and wiping the polished surface, then carrying out hydrochloric acid etching treatment, dipping the cotton swab in the etching solution, lightly wiping the surface of the slice for 2-3 seconds, and then wiping the slice to obtain the polishing solution.
2. The PCB microtome analysis sample preparation method of claim 1, wherein the ratio of the reagents of the crystal gel, the curing agent and the catalyst in step S2 is 100: 0.5-1: 0.5 to 1.
3. The method as claimed in claim 1, wherein the sandpaper used in step S3 has the following numbers and sequence:
I) firstly, roughly grinding a sample wafer by using 120-mesh sand paper until two rows of hole walls of the through holes are about to appear;
II) grinding the surface of the inclined ground surface again by using 450-mesh abrasive paper until an indication line preset in the center of the hole appears, and performing servo-correction to correct the inclined ground surface;
III) sequentially adopting 1500 meshes, 3000 meshes and 4500 meshes of fine sand paper to grind the sample wafer to eliminate the scars on the cut surface so as to reduce the polishing time and increase the true flat effect.
4. The PCB microtome analysis and sample preparation method of claim 1, wherein the etching solution in step S5 is prepared by uniformly mixing 2ml of 5% hydrochloric acid and 50ml of deionized water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911142639.2A CN110779782B (en) | 2019-11-20 | 2019-11-20 | PCB micro-slice analysis sample preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911142639.2A CN110779782B (en) | 2019-11-20 | 2019-11-20 | PCB micro-slice analysis sample preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110779782A true CN110779782A (en) | 2020-02-11 |
| CN110779782B CN110779782B (en) | 2024-02-27 |
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| CN201911142639.2A Active CN110779782B (en) | 2019-11-20 | 2019-11-20 | PCB micro-slice analysis sample preparation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111537312A (en) * | 2020-06-18 | 2020-08-14 | 西安微电子技术研究所 | Metallographic test sample and manufacturing method thereof |
| CN111879579A (en) * | 2020-06-16 | 2020-11-03 | 深圳市大族数控科技有限公司 | Slice manufacturing method |
| CN113235092A (en) * | 2021-05-08 | 2021-08-10 | 九江德福科技股份有限公司 | Micro-etching solution for copper foil slice observation, preparation method thereof and micro-etching method |
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| CN111537312A (en) * | 2020-06-18 | 2020-08-14 | 西安微电子技术研究所 | Metallographic test sample and manufacturing method thereof |
| CN113235092A (en) * | 2021-05-08 | 2021-08-10 | 九江德福科技股份有限公司 | Micro-etching solution for copper foil slice observation, preparation method thereof and micro-etching method |
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