CN106124532A - A kind of nickel corrosion tests of turmeric wiring board - Google Patents
A kind of nickel corrosion tests of turmeric wiring board Download PDFInfo
- Publication number
- CN106124532A CN106124532A CN201610737927.2A CN201610737927A CN106124532A CN 106124532 A CN106124532 A CN 106124532A CN 201610737927 A CN201610737927 A CN 201610737927A CN 106124532 A CN106124532 A CN 106124532A
- Authority
- CN
- China
- Prior art keywords
- nickel
- gold plate
- immersion gold
- layer
- turmeric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
- G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2223/00—Investigating materials by wave or particle radiation
- G01N2223/60—Specific applications or type of materials
- G01N2223/646—Specific applications or type of materials flaws, defects
- G01N2223/6462—Specific applications or type of materials flaws, defects microdefects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
The invention discloses the nickel corrosion tests of a kind of turmeric wiring board, comprise the steps: to prepare immersion gold plate sample；Layer gold plated surface last layer protective layer at described immersion gold plate sample；The immersion gold plate sample making immersion gold plate with described protective layer is cut into slices；Observe the nickel corrosion phenomenon of described immersion gold plate section.The nickel corrosion tests of above-mentioned turmeric wiring board; by at immersion gold plate sample layer gold surface configuration protective layer; protective layer is avoided that layer gold is not worn away in section process of lapping; and nickel dam edge also will not be disturbed by corrosion during immersion gold plate section microetch; thus can cut into slices than the immersion gold plate of Normal practice and be more easily observed nickel corrosion phenomenon, the meeting of the observing effect of nickel corrosion phenomenon is apparent, more accurate.
Description
Technical field
The present invention relates to wiring board techniques field, especially relate to the nickel corrosion tests of a kind of turmeric wiring board.
Background technology
Turmeric wiring board is obtained by sinking nickel and turmeric on substrate successively.Wherein, substrate sinks nickel process because of manual operation
The reasons such as improper, liquid medicine defect are easily corroded at substrate nickel dam and a pin hole or crack, i.e. nickel corrosion phenomenon.Nickel dam is produced
Pin hole or crack will make the deteriorated weldability of turmeric wiring board.
A lot of wiring board manufacturers start immersion gold plate under different working conditions is carried out nickel corrosion testing, and it is heavy i.e. to make
Gold plate section, then to immersion gold plate section be ground, microetch process, by scanning electron microscopic observation immersion gold plate section obtain turmeric line
The nickel etch state of road plate.So, manufacturer just can tackle manual operation according to the nickel extent of corrosion of turmeric wiring board mutually
The aspect such as mode and liquid medicine adjusts accordingly, to ensure the preferable welding performance of turmeric wiring board.But, corrode according to nickel
After test have adjusted the production technology of immersion gold plate accordingly, the weldability of turmeric wiring board is improved, but yet suffers from relatively
The turmeric wiring board that many weldabilities are poor.
Summary of the invention
Based on this, the invention reside in the defect overcoming prior art, it is provided that the nickel corrosion testing side of a kind of turmeric wiring board
Method, it can the nickel extent of corrosion of accurate observation turmeric wiring board.
Its technical scheme is as follows: the nickel corrosion tests of a kind of turmeric wiring board, comprises the steps: to prepare immersion gold plate
Sample；Layer gold plated surface last layer protective layer at described immersion gold plate sample；To have the immersion gold plate sample system of described protective layer
Make immersion gold plate section；Observe the nickel corrosion phenomenon of described immersion gold plate section.
Wherein in an embodiment, described protective layer is nickel dam, layer gold or layers of copper.
Wherein in an embodiment, the described layer gold plated surface last layer protective layer at described immersion gold plate sample concrete
Method is: put in nickel plating solution, gold plating solution or copper plating solution by described immersion gold plate sample, by plating mode by nickel,
Gold or copper are plated on the layer gold surface of described immersion gold plate sample and form described protective layer.
Wherein in an embodiment, the described layer gold plated surface last layer protective layer at described immersion gold plate sample concrete
Method is: put in nickel plating solution, gold plating solution or copper plating solution by described immersion gold plate sample, by nickel, gold or copper being sunk
Amass and form described protective layer on the layer gold surface of described immersion gold plate sample.
Wherein in an embodiment, molten described immersion gold plate sample is put into nickel plating solution, gold plating solution or copper facing
Before liquid, further comprise the steps of: the layer gold surface and oil contaminant to described immersion gold plate sample and be cleaned processing.
Wherein in an embodiment, described immersion gold plate sample is put into and obtains described sinking for nickel gold heavy on substrate
In the nickel plating solution of gold plate sample.
Wherein in an embodiment, the thickness of described protective layer is 3～10 μm.
Wherein in an embodiment, the thickness of described protective layer is 5～8 μm.
Wherein in an embodiment, described will have the immersion gold plate sample making immersion gold plate slicing step of described protective layer
Including step: described immersion gold plate sample is packaged in crystal colloid；The described immersion gold plate sample that will be packaged in crystal colloid
Make the immersion gold plate section that section is vertical with described immersion gold plate sample panel face；The section cutting into slices described immersion gold plate carries out beating
Grinding and polishing optical processing.
Wherein in an embodiment, the nickel corrosion phenomenon of described observation described immersion gold plate section method particularly includes: will
The camera lens of the section alignment Electronic Speculum of described immersion gold plate section, existing by the nickel corrosion of immersion gold plate section described in described electron microscopic observation
As.
Below in conjunction with technique scheme, principle, the effect of the present invention are further illustrated:
The nickel corrosion tests of above-mentioned turmeric wiring board, by immersion gold plate sample layer gold surface configuration protective layer,
Protective layer is avoided that layer gold is not worn away in section process of lapping, and during immersion gold plate section microetch, nickel dam edge also will not be subject to
Corrosion interference, thus can cut into slices than the immersion gold plate of Normal practice and be more easily observed nickel corrosion phenomenon, the sight of nickel corrosion phenomenon
The meeting examining effect is apparent, more accurate.
Accompanying drawing explanation
Fig. 1 is the structural representation being coated with protective layer of turmeric wiring board described in the embodiment of the present invention.
Description of reference numerals:
10, immersion gold plate sample, 20, nickel dam, 21, crack, 30, layer gold, 40, protective layer.
Detailed description of the invention
Below embodiments of the invention are described in detail:
As it is shown in figure 1, the nickel corrosion tests of turmeric wiring board of the present invention, comprise the steps:
Prepare immersion gold plate sample；
Layer gold plated surface last layer protective layer at described immersion gold plate sample；
The layer gold of existing immersion gold plate sample generally the thinnest (≤0.05 μm), so easily will in section process of lapping
The layer gold of turmeric sample panel outer surface grinds away, and the nickel dam of turmeric sample panel is owing to lacking the protection of layer gold, in section microetch mistake
Micro-corrosion liquid of cutting into slices in journey would generally produce corrosion in various degree to nickel dam edge, can cause the illusion that nickel corrodes, or see not
To nickel corrosion phenomenon, bring interference to nickel corrosion observation.So, the present invention is at immersion gold plate sample layer gold plated surface up-protective layer.
In embodiments of the present invention, described protective layer is nickel dam, layer gold or layers of copper.
The immersion gold plate sample making immersion gold plate with described protective layer is cut into slices；
In making immersion gold plate slicing processes, owing to immersion gold plate sample layer gold surface has protective layer, protective layer is avoided that
Layer gold is not worn away in section process of lapping, and during immersion gold plate section microetch, nickel dam edge also will not be disturbed by corrosion, this
Sample will be more easily observed nickel corrosion phenomenon than the section of Normal practice, the meeting of the observing effect of nickel corrosion phenomenon is apparent,
More accurate.
Observe the nickel corrosion phenomenon of described immersion gold plate section.
The nickel corrosion tests of above-mentioned turmeric wiring board, by immersion gold plate sample layer gold surface configuration protective layer,
Protective layer is avoided that layer gold is not worn away in section process of lapping, and during immersion gold plate section microetch, nickel dam edge also will not be subject to
Corrosion interference, thus can cut into slices than the immersion gold plate of Normal practice and be more easily observed nickel corrosion phenomenon, the sight of nickel corrosion phenomenon
The meeting examining effect is apparent, more accurate.So, related personnel just can preferably analyze the nickel corrosion phenomenon of turmeric wiring board with
Relation between manual operation mode and liquid medicine in turmeric wiring board production process, it is possible to tackle mutually according to nickel corrosion phenomenon
The aspects such as manual operation mode and liquid medicine adjust accordingly, to ensure the preferable welding performance of turmeric wiring board.
In embodiments of the present invention, the concrete side of the described layer gold plated surface last layer protective layer at described immersion gold plate sample
Method is: put in nickel plating solution, gold plating solution or copper plating solution by described immersion gold plate sample, by plating mode by nickel, gold
Or copper is plated on the layer gold surface of described immersion gold plate sample and forms described protective layer.
In embodiments of the present invention, the concrete side of the described layer gold plated surface last layer protective layer at described immersion gold plate sample
Method is: put in nickel plating solution, gold plating solution or copper plating solution by described immersion gold plate sample, by nickel, gold or copper being deposited
The layer gold surface of described immersion gold plate sample forms described protective layer.
In embodiments of the present invention, described immersion gold plate sample is being put into nickel plating solution, gold plating solution or copper plating solution
Before, further comprise the steps of: the layer gold surface and oil contaminant to described immersion gold plate sample to be cleaned processing.So can guarantee that layer gold surface
Adhesion between protective layer and the layer gold plated, it is to avoid immersion gold plate sample layer gold in process of lapping separates and shadow with protective layer
Ring nickel corrosion and observe phenomenon.
In embodiments of the present invention, described immersion gold plate sample is put into obtain described turmeric for nickel gold heavy on substrate
In the nickel plating solution of plate sample.
In embodiments of the present invention, the thickness of described protective layer is 3～10 μm.Preferably, the thickness of described protective layer is 5
～8 μm.The protective layer of this thickness ensure that the surface layer gold of immersion gold plate sample will not be milled away in section process of lapping.
In embodiments of the present invention, described will have the immersion gold plate sample making immersion gold plate slicing step bag of described protective layer
Include step: be packaged in crystal colloid by described immersion gold plate sample；The described immersion gold plate sample system that will be packaged in crystal colloid
Make the immersion gold plate section that section is vertical with described immersion gold plate sample panel face；The section cutting into slices described immersion gold plate is polished
Polishing.
In embodiments of the present invention, the nickel corrosion phenomenon that the described immersion gold plate of described observation is cut into slices method particularly includes: by institute
State the camera lens of the section alignment Electronic Speculum of immersion gold plate section, existing by the nickel corrosion of immersion gold plate section described in described electron microscopic observation
As.
Each technical characteristic of embodiment described above can combine arbitrarily, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic executed in example is all described, but, as long as the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope that this specification is recorded.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, but also
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that, come for those of ordinary skill in the art
Saying, without departing from the inventive concept of the premise, it is also possible to make some deformation and improvement, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (10)
1. the nickel corrosion tests of a turmeric wiring board, it is characterised in that comprise the steps:
Prepare immersion gold plate sample；
Layer gold plated surface last layer protective layer at described immersion gold plate sample；
The immersion gold plate sample making immersion gold plate with described protective layer is cut into slices；
Observe the nickel corrosion phenomenon of described immersion gold plate section.
The nickel corrosion tests of turmeric wiring board the most according to claim 1, it is characterised in that described protective layer is nickel
Layer, layer gold or layers of copper.
The nickel corrosion tests of turmeric wiring board the most according to claim 2, it is characterised in that described at described turmeric
The layer gold plated surface last layer protective layer of plate sample method particularly includes: described immersion gold plate sample is put into nickel plating solution, plating
In gold solution or copper plating solution, by plating mode, nickel, gold or copper is plated on shape on the layer gold surface of described immersion gold plate sample
Become described protective layer.
The nickel corrosion tests of turmeric wiring board the most according to claim 2, it is characterised in that described at described turmeric
The layer gold plated surface last layer protective layer of plate sample method particularly includes: described immersion gold plate sample is put into nickel plating solution, plating
In gold solution or copper plating solution, form described guarantor by nickel, gold or copper being deposited on the layer gold surface of described immersion gold plate sample
Sheath.
The nickel corrosion tests of turmeric wiring board the most according to claim 4, it is characterised in that by described immersion gold plate
Before sample puts into nickel plating solution, gold plating solution or copper plating solution, further comprise the steps of:
It is cleaned processing to the layer gold surface and oil contaminant of described immersion gold plate sample.
The nickel corrosion tests of turmeric wiring board the most according to claim 4, it is characterised in that by described immersion gold plate sample
Product are put into and are obtained in the nickel plating solution of described immersion gold plate sample for nickel gold heavy on substrate.
7. according to the nickel corrosion tests of the turmeric wiring board described in any one of claim 1～6, it is characterised in that described
The thickness of protective layer is 3～10 μm.
The nickel corrosion tests of turmeric wiring board the most according to claim 7, it is characterised in that the thickness of described protective layer
Degree is 5～8 μm.
The nickel corrosion tests of turmeric wiring board the most according to claim 1, it is characterised in that described will have described
The immersion gold plate sample making immersion gold plate slicing step of protective layer includes step:
Described immersion gold plate sample is packaged in crystal colloid；
Vertical with described immersion gold plate sample panel face for the described immersion gold plate sample making section being packaged in crystal colloid is sunk
Gold plate section；
The section cutting into slices described immersion gold plate carries out sanding and polishing process.
The nickel corrosion tests of turmeric wiring board the most according to claim 1, it is characterised in that described in described observation
The nickel corrosion phenomenon of immersion gold plate section method particularly includes: the camera lens of the section alignment Electronic Speculum that described immersion gold plate is cut into slices, logical
Cross the nickel corrosion phenomenon of immersion gold plate section described in described electron microscopic observation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737927.2A CN106124532A (en) | 2016-08-26 | 2016-08-26 | A kind of nickel corrosion tests of turmeric wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610737927.2A CN106124532A (en) | 2016-08-26 | 2016-08-26 | A kind of nickel corrosion tests of turmeric wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106124532A true CN106124532A (en) | 2016-11-16 |
Family
ID=57273976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610737927.2A Pending CN106124532A (en) | 2016-08-26 | 2016-08-26 | A kind of nickel corrosion tests of turmeric wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106124532A (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060046501A1 (en) * | 2004-08-27 | 2006-03-02 | Texas Instruments Incorporated | Screening of electroless nickel/immersion gold-plated substrates with black pad defect |
| CN201229173Y (en) * | 2008-07-08 | 2009-04-29 | 深圳崇达多层线路板有限公司 | Mold device for detecting multilayer circuit board slicer |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
| CN202216856U (en) * | 2011-09-26 | 2012-05-09 | 深圳市深联电路有限公司 | Micro-slice sampling device of ultra-thick multilayer circuit board |
| CN102706802A (en) * | 2012-06-04 | 2012-10-03 | 汕头超声印制板公司 | Quick detection method for nickel coating erosion adopting immersion gold technique |
| CN103076216A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Preparation method, grinding method and device for microsection sample |
| CN203443837U (en) * | 2013-09-03 | 2014-02-19 | 广东生益科技股份有限公司 | Visual cross-section grinding device |
| CN103728512A (en) * | 2013-12-26 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Reliability test board and PCB inter-hole CAF failure analysis method |
| CN103884726A (en) * | 2014-03-04 | 2014-06-25 | 工业和信息化部电子第五研究所 | Mmeasuring method of thickness of OSP (Organic Solderability Preservatives) film |
| CN104911614A (en) * | 2015-07-03 | 2015-09-16 | 深圳市迅捷兴电路技术有限公司 | Anti-oxidation method for nickel layer of chemical nickel-plating gold-leaching plate |
| CN104955262A (en) * | 2014-03-27 | 2015-09-30 | 浙江德汇电子陶瓷有限公司 | Circuit board and manufacturing method thereof |
| CN105813393A (en) * | 2016-03-21 | 2016-07-27 | 东莞美维电路有限公司 | Fabrication method of selective gold deposition plate |
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
-
2016
- 2016-08-26 CN CN201610737927.2A patent/CN106124532A/en active Pending
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060046501A1 (en) * | 2004-08-27 | 2006-03-02 | Texas Instruments Incorporated | Screening of electroless nickel/immersion gold-plated substrates with black pad defect |
| CN201229173Y (en) * | 2008-07-08 | 2009-04-29 | 深圳崇达多层线路板有限公司 | Mold device for detecting multilayer circuit board slicer |
| CN101525744A (en) * | 2009-04-27 | 2009-09-09 | 深圳市成功化工有限公司 | Superficial treatment method of printed wiring board |
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
| CN202216856U (en) * | 2011-09-26 | 2012-05-09 | 深圳市深联电路有限公司 | Micro-slice sampling device of ultra-thick multilayer circuit board |
| CN102706802A (en) * | 2012-06-04 | 2012-10-03 | 汕头超声印制板公司 | Quick detection method for nickel coating erosion adopting immersion gold technique |
| CN103076216A (en) * | 2012-12-28 | 2013-05-01 | 广州杰赛科技股份有限公司 | Preparation method, grinding method and device for microsection sample |
| CN203443837U (en) * | 2013-09-03 | 2014-02-19 | 广东生益科技股份有限公司 | Visual cross-section grinding device |
| CN103728512A (en) * | 2013-12-26 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Reliability test board and PCB inter-hole CAF failure analysis method |
| CN103884726A (en) * | 2014-03-04 | 2014-06-25 | 工业和信息化部电子第五研究所 | Mmeasuring method of thickness of OSP (Organic Solderability Preservatives) film |
| CN104955262A (en) * | 2014-03-27 | 2015-09-30 | 浙江德汇电子陶瓷有限公司 | Circuit board and manufacturing method thereof |
| CN104911614A (en) * | 2015-07-03 | 2015-09-16 | 深圳市迅捷兴电路技术有限公司 | Anti-oxidation method for nickel layer of chemical nickel-plating gold-leaching plate |
| CN105813393A (en) * | 2016-03-21 | 2016-07-27 | 东莞美维电路有限公司 | Fabrication method of selective gold deposition plate |
| CN105848423A (en) * | 2016-05-20 | 2016-08-10 | 江门崇达电路技术有限公司 | PCB manufacturing method having electrogilding surface treatment and chemical immersion gold surface treatment |
Non-Patent Citations (6)
| Title |
|---|
| HERBSOMMER JUAN ET AL.: "The Electrochemical Effects of Immersion Gold on Electroless Nickel and its Consequences on the Hermetic Reliability of a Semiconductor Device", 《IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY》 * |
| HYIE KOAY MEI ET AL.: "Corrosion study of electrodeposited Co-Ni-Fe protective coating on Electroless Nickel Immersion Gold (ENIG) flexible printed circuit", 《PROCEDIA TECHNOLOGY》 * |
| 孔学东等: "《电子信息技术的理论与应用——中国电子学会第十四届青年学术年会论文集》", 28 February 2009, 国防工业出版社 * |
| 李伏等: "化镍浸金工艺之黑盘特征、测试方法介绍", 《印刷电路信息》 * |
| 詹世敬等: "印制电路板电镀铜颗粒缺陷的成因分析", 《电镀与涂饰》 * |
| 郑凡: "一种PCB电镀铜颗粒成因及机理分析", 《印制电路信息》 * |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE102005034120B4 (en) | Method for producing a semiconductor wafer | |
| US20120016630A1 (en) | Method of measuring defect density of single crystal | |
| CN107498263B (en) | Martensitic stain less steel engine crankcase ultrasonic impact assists argon arc welding restorative procedure | |
| CN103837557A (en) | Method of representing microstructure of scale on section of hot-rolled steel plate by adoption of EBSD | |
| CN103075986A (en) | Method for measuring film thickness | |
| CN106525532A (en) | Transmission electron microscope sample preparation method | |
| CN103792245A (en) | Method for judging melted mark of copper conductor through backscattered electron diffraction test method | |
| CN106596587B (en) | A kind of test evaluating method of coppered welding wire layer quality | |
| CN105259002A (en) | Preparation method of high-magnetic-induction grain-oriented silicon steel EBSD samples | |
| KR102327328B1 (en) | Method for evaluating surface defects of substrates for bonding | |
| CN102646566B (en) | The SEM sample clamp observed for online SEM and SEM sample observation method | |
| CN106124532A (en) | A kind of nickel corrosion tests of turmeric wiring board | |
| US9059097B2 (en) | Inhibiting propagation of imperfections in semiconductor devices | |
| CN107567200B (en) | Board pads restorative procedure | |
| CN106814093A (en) | A kind of aerospace nickel electrode ceramic capacitor reliability determines method | |
| CN104215482A (en) | Preparation method of failure analysis sample | |
| CN105651787A (en) | Analysis method for opening of laser blind hole | |
| CN107894435B (en) | Manufacturing method of PCB (printed circuit board) half-hole slice | |
| TW202336847A (en) | Method for evaluating silicon wafer and method for removing process-affected layer of silicon wafer | |
| CN108061736B (en) | Method for analyzing glass defects using a reflected electron probe | |
| KR20210037113A (en) | Method of fabricating specimens for electron backscattering diffraction (ebsd) and analysis method of scale structure of hot rolled steel sheet using the same | |
| CN104034659B (en) | A kind of electroless copper plating backlight method of testing | |
| Perminov et al. | Automated image analysis for evaluation of wafer backside chipping | |
| CN107402146B (en) | Preparation method of hot-dip coating section transmission sample | |
| TW201545221A (en) | Ingot cutting method capable of reducing wafer damage percentage |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161116 |