CN103293159B - A kind of method checking pcb board interlaminar separation - Google Patents
A kind of method checking pcb board interlaminar separation Download PDFInfo
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- CN103293159B CN103293159B CN201210042415.6A CN201210042415A CN103293159B CN 103293159 B CN103293159 B CN 103293159B CN 201210042415 A CN201210042415 A CN 201210042415A CN 103293159 B CN103293159 B CN 103293159B
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Abstract
The embodiment of the invention discloses a kind of method checking pcb board interlaminar separation, comprise the steps: the pcb board of required detection is made micro-cutting sheet；Tentatively distinguish exception: use micro-cutting sheet observational method that the micro-cutting sheet of sampling observation is tentatively distinguished; to judge that electro-coppering is connected the junction of ring and whether there is exception with internal layer; there is the most abnormal or doubtful exception as being found to have the junction of micro-cutting sheet, then enter next step；Plain grinding junction: the junction upper and lower surface that the electro-coppering of the most abnormal for discovery existence or doubtful abnormal micro-cutting sheet is connected ring with internal layer polishes；Judge interlaminar separation: be refitted on facilities for observation by the micro-cutting sheet after plain grinding, utilize backlight to irradiate micro-cutting sheet, observe the junction that two sides polishes, utilize the lighttight material behavior of resin printing opacity, copper to judge whether junction connects completely.The method of the inspection pcb board interlaminar separation of the embodiment of the present invention, improves the detection accuracy of pcb board, and can save production cost.
Description
Technical field
The present invention relates to PCB product detection technique field, particularly relate to the method for inspection of a kind of pcb board interlaminar separation.
Background technology
PCB industry electro-coppering is connected with internal layer ring connect imperfect defect be defined as pcb board interlaminar separation, this defect mainly due to boring after cull hole pre-treatment do not process cause completely electro-coppering be connected with internal layer ring connection exception, affect electrical property.When pcb board is detected, in prior art, the method of detection interlaminar separation typically uses micro-cutting sheet observational method the most directly to observe, but the color after being aoxidized by microetch with copper in micro-cutting sheet manufacturing process due to the cull of electro-coppering with internal layer junction all shows as black, microscope is observed and often cannot accurately be judged, being easily caused erroneous judgement and missing inspection, the detection accuracy of pcb board is relatively low, owing to erroneous judgement also results in unnecessary the scrapping and cause the loss of production cost of product.
Summary of the invention
The embodiment of the present invention is to be solved be technical problem is that: provide a kind of method detecting interlaminar separation, to improve the detection accuracy of PCB, and can save production cost.
In order to solve above-mentioned technical problem, the embodiment of the present invention proposes a kind of method checking pcb board interlaminar separation, it is characterised in that comprise the steps:
Make micro-cutting sheet: the pcb board of required detection is made micro-cutting sheet；
Tentatively distinguish exception: use micro-cutting sheet observational method that the micro-cutting sheet of sampling observation is tentatively distinguished, to judge that electro-coppering is connected the junction of ring and whether there is exception, such as all micro-cutting sheets equal Non Apparent Abnormality junction checked, then test ending with internal layer；There is the most abnormal or doubtful exception as being found to have the junction of micro-cutting sheet, then enter next step；
Plain grinding junction: the junction upper and lower surface that the electro-coppering of the most abnormal for discovery existence or doubtful abnormal micro-cutting sheet is connected ring with internal layer polishes；
Judge interlaminar separation: be refitted on facilities for observation by the micro-cutting sheet after plain grinding, utilize backlight to irradiate micro-cutting sheet, observe the junction that two sides polishes, utilize the lighttight material behavior of resin printing opacity, copper to judge whether junction connects completely.
Further, described facilities for observation is microscope.
Further, it is characterised in that described backlight irradiates described micro-cutting sheet from the bottom up.
Further, micro-amplification when described microscope is observed is at least 200 times.
Further, the method that it is determined that the presence of interlaminar separation is: has examined under a microscope white aperture and has represented internal layer and connect ring and electro-coppering junction and have resin residue, if without white aperture, representing internal layer connection ring has the copper oxide after microetch with electro-coppering junction, without resin residue.
Further, plain grinding equipment plain grinding micro-cutting sheet is used.
Further, plain grinding equipment is micro-cutting slice lapping machine.
The embodiment of the present invention provides the benefit that: the method for the inspection pcb board interlaminar separation of the present invention, the most tentatively distinguish electro-coppering on micro-cutting sheet to be connected the junction of ring with internal layer and whether there is exception, as found, there is the most abnormal or doubtful exception junction, electro-coppering on this micro-cutting sheet is connected after the abnormal junction upper and lower surface of ring polishes with internal layer, weight is first placed on microscope and irradiates from the bottom up with microscopical back light, the most complete to judge junction, examine under a microscope white aperture to represent internal layer and connect ring and electro-coppering junction and have resin residue, if without white aperture, representing internal layer connection ring has the copper oxide after microetch with electro-coppering junction, without resin residue, it improves the detection accuracy of pcb board.
Accompanying drawing explanation
Fig. 1 is the cutting plane schematic diagram of the pcb board micro-cutting sheet of the embodiment of the present invention.
Fig. 2 be the pcb board micro-cutting sheet of the embodiment of the present invention abnormal junction plain grinding after schematic diagram.
Fig. 3 is the method flow diagram of the embodiment of the present invention.
Part drawing reference numeral illustrates:
10 electro-copperings, 20 internal layers connect ring, 30 resins, 40 electro-copperings and internal layer and connect the junction of ring, 50 vias.
Detailed description of the invention
As shown in Figure 1 to Figure 3, the embodiment of the present invention provides a kind of method checking pcb board interlaminar separation,
Make micro-cutting sheet: the pcb board of required detection is made micro-cutting sheet；
Tentatively distinguish exception: tentatively distinguish exception: use micro-cutting sheet observational method that the micro-cutting sheet of sampling observation is tentatively distinguished, to judge that electro-coppering 10 is connected the junction 40 of ring 20 and whether there is exception with internal layer, such as all micro-cutting sheets equal Non Apparent Abnormality junction checked, then test ending；There is the most abnormal or doubtful exception as being found to have the junction of micro-cutting sheet, then enter next step；
Plain grinding junction: the electro-coppering 10 of the most abnormal for existence or doubtful abnormal micro-cutting sheet is connected on abnormal junction 40 upper and lower surface of ring 20 with internal layer and polishes；
Judge interlaminar separation: be refitted on facilities for observation by the micro-cutting sheet after plain grinding, utilize backlight to irradiate micro-cutting sheet, observe the junction 40 that two sides polishes, utilize resin 30 printing opacity, the lighttight material behavior of copper accurately to judge whether junction 40 connects completely.
In the described abnormal step of preliminary differentiation, so-called doubtful exception refers to unconspicuous abnormal or suspects there is exception, causes the situation that cannot determine whether to there is interlaminar separation.
In the step of described plain grinding junction, owing to the thickness of multilayer circuit board is bigger, thickness its light transmission the biggest is the poorest, therefore abnormal junction 40 upper and lower surface needing electro-coppering 10 on the micro-cutting sheet made by multilayer circuit board to be connected ring 20 with internal layer all polishes, during to ensure to observe, micro-cutting sheet is preferable through effect, its available plain grinding equipment carries out plain grinding to micro-cutting sheet, and this plain grinding equipment is micro-cutting slice lapping machine.
In the step of described judgement interlaminar separation, the principle of judgement defect is to utilize resin 30 printing opacity, the lighttight material behavior of copper to accurately distinguish whether junction 40 connects completely, and it is complete connection that the electro-coppering 10 of qualified PCB product is connected the junction 40 of ring 20 with internal layer.During observation, microscope need to be utilized to observe, need to observe when described microscopical back light irradiates described micro-cutting sheet from the bottom up, micro-amplification under the microscope is at least 200 times.As observed, white aperture represents junction 40 and has resin 30 to remain, it was demonstrated that interlayer exists separation defect；Judging, according to aperture angle, the order of severity that resin 30 remains, angle is the biggest, and resin 30 remains the most serious；It is connected the junction 40 of ring 20 with internal layer has the color of the copper oxide after microetch as represented electro-coppering 10 without white aperture, remain without resin 30, not existing defects.
The method of inspection pcb board interlaminar separation defect of the present invention, improves the detection accuracy of pcb board, decreases unnecessary product rejection rate, saved production cost.
The above is the detailed description of the invention of the present invention; it should be pointed out that, for those skilled in the art, under the premise without departing from the principles of the invention; can also make some improvements and modifications, these improvements and modifications are also considered as protection scope of the present invention.
Claims (5)
1. the method checking pcb board interlaminar separation, it is characterised in that comprise the steps:
Make micro-cutting sheet: the pcb board of required detection is made micro-cutting sheet；
Tentatively distinguish exception: use micro-cutting sheet observational method that the micro-cutting sheet of sampling observation is tentatively distinguished, to judge that electro-coppering is connected the junction of ring and whether there is exception, such as all micro-cutting sheets equal Non Apparent Abnormality junction checked, then test ending with internal layer；There is the most abnormal or doubtful exception as being found to have the junction of micro-cutting sheet, then enter next step；
Plain grinding junction: the junction upper and lower surface that the electro-coppering of the most abnormal for discovery existence or doubtful abnormal micro-cutting sheet is connected ring with internal layer polishes；
Judge interlaminar separation: be refitted under microscope by the micro-cutting sheet after plain grinding, backlight is utilized to irradiate micro-cutting sheet, observe the junction that two sides polishes, utilize the lighttight material behavior of resin printing opacity, copper to judge whether junction connects completely, examine under a microscope white aperture to represent internal layer and connect ring and electro-coppering junction and have resin residue, if without white aperture, representing internal layer connection ring has the copper oxide after microetch with electro-coppering junction, without resin residue.
2. the method checking pcb board interlaminar separation as claimed in claim 1, it is characterised in that described backlight irradiates described micro-cutting sheet from the bottom up.
3. the method checking pcb board interlaminar separation as claimed in claim 1, it is characterised in that micro-amplification when described microscope is observed is at least 200 times.
4. the method for the inspection pcb board interlaminar separation as described in claim 1, it is characterised in that use plain grinding equipment plain grinding micro-cutting sheet.
5. the method checking pcb board interlaminar separation as claimed in claim 4, it is characterised in that described plain grinding equipment is micro-cutting slice lapping machine.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210042415.6A CN103293159B (en) | 2012-02-23 | 2012-02-23 | A kind of method checking pcb board interlaminar separation |
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| CN201210042415.6A CN103293159B (en) | 2012-02-23 | 2012-02-23 | A kind of method checking pcb board interlaminar separation |
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| CN103293159A CN103293159A (en) | 2013-09-11 |
| CN103293159B true CN103293159B (en) | 2016-12-14 |
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| CN108548819A (en) * | 2018-05-10 | 2018-09-18 | 深圳市富利特科技有限公司 | A kind of method of printed circuit board backlight test |
| CN110763699B (en) * | 2019-10-12 | 2022-12-20 | 广州兴森快捷电路科技有限公司 | Analysis method for inner layer interconnection defects of circuit board and circuit board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102186308A (en) * | 2011-03-11 | 2011-09-14 | 深圳市崇达电路技术股份有限公司 | Fabricating method for micro-slice and vacuuming device for fabricating micro-slice |
Non-Patent Citations (2)
| Title |
|---|
| PCB国标的探讨;林敏;《第三届全国青年印制电路学术年会论文汇编》;20061231;155-163 * |
| 显微剖切技术在印制板生产中的应用;周群;《印制电路信息》;20061231(第12期);60-63 * |
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Address after: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518000 Nanshan District, Guangdong, overseas Chinese town, No. East Road, No. 99 Patentee before: Shenzhen Shennan Circuits Co., Ltd. |
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