CN107328999A - A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant - Google Patents
A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant Download PDFInfo
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- CN107328999A CN107328999A CN201710641252.6A CN201710641252A CN107328999A CN 107328999 A CN107328999 A CN 107328999A CN 201710641252 A CN201710641252 A CN 201710641252A CN 107328999 A CN107328999 A CN 107328999A
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- sheet material
- dielectric constant
- parameter value
- value needed
- polishing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2617—Measuring dielectric properties, e.g. constants
- G01R27/2623—Measuring-systems or electronic circuits
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- General Physics & Mathematics (AREA)
- Measurement Of Resistance Or Impedance (AREA)
Abstract
The present invention relates to the calculating field of dielectric constant values, the method of parameter value needed for specially a kind of acquisition calculates sheet material dielectric constant, the present invention, come the top line width of the thickness of sheet material measurement dielectric layer, the thickness of impedance line, the bottom line width of impedance line and impedance line, then calculates the dielectric constant of material by the physical method of micro- section by above-mentioned parameter.Allow to assess the validity for the dielectric constant values that supplier provides, the prepreg sheet material of prepreg mixed pressure sheet material and different gel contents for some different sizes, effective dielectric constant can be calculated, accurate parameter is provided for PCB design, it is ensured that the quality of pcb board.
Description
Technical field
Ginseng needed for sheet material dielectric constant is calculated the present invention relates to the calculating field of dielectric constant values, more particularly to a kind of obtain
The method of numerical value.
Background technology
Dielectric constant (dielectric constant) just refers to the Dk values of material, also known as capacitivity or relative permitivity,
Characterize a significant data of dielectric or insulating materials electrical property.It refers to that in same capacitor be electric Jie with same substance
The ratio of electric capacity when matter and vacuum, represents that dielectric stores the relative ability of electrostatic energy in the electric field, relative dielectric constant is cured
Small insulating properties is better.
Dielectric constant also illustrates that material increases the measurement of condenser capacitance ability for vacuum for another aspect.
When the capacitivity of insulating materials is larger, the transmission energy in signal wire, which has much to be stored, to be held in sheet material, causes signal complete
The problems such as whole property is poor, signal quality is not good and transmission rate slows down.
In the PCB using high-frequency transmission, the Dk values of material are to influence the factor of signal velocity.Dk values are smaller to letter
Number propagation it is more favourable.Because Dk values influence the impedance of PCB upward wirings, join so Dk values are critically important in PCB design one
Number.
At present, the Dk values of all core plates and PP pieces (prepreg) are all provided by supplier, the Dk values that supplier provides
Mostly it is theoretical value, therefore the validity of the Dk values of supplier's offer has to be assessed.Proved by our long-term calculating, for
What sheet material and the PP pieces of different gel contents that the PP pieces of different size are combined, the True Data of calculating and supplier provided
Dk values are generally widely different, and the error of Dk values have impact on the degree of accuracy of the impedance of PCB upward wirings, and the degree of accuracy of impedance have impact on again
The spread speed of signal, therefore, it is necessary to reappraise dielectric constant in PCB design, just can guarantee that the signal of pcb board is passed
Speed is broadcast, can just meet the demand that market is propagated at a high speed PCB signals.
The content of the invention
The present invention is in view of the above-mentioned problems, provide a kind of physical method by micro- section come needed for survey calculation dielectric constant
The method of parameter value.
To achieve the above object, the present invention uses following technical scheme：
The method of parameter value, comprises the following steps needed for a kind of acquisition calculates sheet material dielectric constant：
S1, the micro- section of section making for intercepting sheet material, wherein sheet material are provided with impedance line, cut during interception section along impedance line
Face is intercepted；
S2, the thickness of sheet material measurement dielectric layer, the thickness of impedance line, the bottom line width and the top line of impedance line of impedance line
Width, obtains calculating the parameter value needed for sheet material dielectric constant.
Further, in S1 steps, micro- section makes in accordance with the following steps：
S1, sheet material is intercepted by saw or shearing machine, sample is cut in acquisition；
S2, using sand paper the section for cutting sample is polished, form flat surface grinding；
S3, flat surface grinding is processed by shot blasting, forms burnishing surface, obtain micro- section.
Further, after polishing, in addition to microetch processing is carried out to burnishing surface.
Further, microetch processing is performed such：It is stained with cotton rod after micro-corrosion liquid is wiped 2~3 seconds along burnishing surface at once
Dry.
Further, micro-corrosion liquid includes ammoniacal liquor, water and hydrogen peroxide, and wherein ammoniacal liquor is that 45~55cc, water are 45~55cc, dioxygen
Water is 5~10 drops, and the concentration of the hydrogen peroxide is 1~8g/L, and the concentration of the ammoniacal liquor is 25%~28%.
Further, polishing is performed such：Polishing flannelet is drenched, polishing fluid polishing flannelet is poured into, repeatedly
Flat surface grinding is wiped, burnishing surface is formed.
Further, polishing fluid includes polishing powder and water, and the wherein volume ratio of polishing powder and water is 1:5.
Further, the wherein maximum particle diameter of polishing powder is below 0.3 μm, and the hardness of polishing powder is in Mohs' hardness below 9.
Further, fully shaken up before using polishing fluid.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is cutd open sheet material by the physical method of micro- section
Open, accurately obtain the section of micro- section, then thickness by sheet material measurement dielectric layer, the thickness of impedance line, the bottom of impedance line
The top line width of line width and impedance line, accurately obtains above-mentioned data, and the dielectric constant of material is then calculated by above-mentioned parameter.
It is more accurate by the dielectric constant values after calculating compared with the data that supplier provides, provide accurate number for PCB design
According to, it is ensured that ensure the signal velocity of pcb board.
Brief description of the drawings
The invention will be further described below in conjunction with the accompanying drawings：
Fig. 1 is the structural representation that sample is cut described in embodiment.
Embodiment
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme
It is described further and illustrates.
Embodiment
Reference picture 1, the present invention provides a kind of method of parameter value needed for obtaining calculating sheet material dielectric constant, including following step
Suddenly：
S1, by shearing machine intercept sheet material 1, wherein sheet material 1 be provided with impedance line 2, interception section when enter along the section of impedance line 2
Sample is cut in row interception, acquisition；
S2, using sand paper the section for cutting sample is polished, first roughly ground, washed by water in right amount in process of lapping with 800 sand paper, used
To reduce the heat of friction generation and play a part of lubrication；Then 2500 fine grindings, and the oblique surface of the askew mill of equating mill are used instead,
Form flat surface grinding；
S3, flat surface grinding is processed by shot blasting, what polishing was performed such：It is 1 by the volume ratio of polishing powder and water:
5 mixing, the wherein maximum particle diameter of polishing powder is below 0.3 μm, and the hardness of polishing powder is in Mohs' hardness below 9；Using polishing
Fully shaken up before liquid；Polishing flannelet is drenched, the polishing fluid after shaking up is poured into polishing flannelet, is wiped repeatedly and polishes
Face, forms burnishing surface；
After S4, polishing, in addition to microetch processing is carried out to burnishing surface.Microetch processing is performed such：Allotment is micro-
Lose liquid：50cc pure water, 50cc ammoniacal liquor (concentration 26%), 8 drop hydrogen peroxide (concentration is 6g/L) are mixed, micro-corrosion liquid is obtained；Use cotton
Hedysarum scoparium is stained with after micro-corrosion liquid is wiped 2~3 seconds along burnishing surface to be dried at once, obtains micro- section.
S5, the thickness H1 with the dielectric layer of impedometer sheet material measurement 1, the thickness T1 of impedance line 2, the bottom of impedance line 2
Line width W1 and impedance line 2 top line width W2, obtain calculating the parameter value needed for the dielectric constant of sheet material 1.
S6, by the thickness H1 of the dielectric layer of sheet material 1, the thickness T1 of impedance line 2, impedance line 2 bottom line width W1, impedance line 2
Top line width W2 and the dielectric layer dielectric constant ε of sheet material 1rThe software for calculation of input meter dielectric constant, calculates sheet material 1 after pressing
Dielectric constant.
Comparative example：A kind of Dk values for sheet material that supplier provides are 4.5, and we are by measuring and calculating actual Dk
Value is 4.8, and actual Dk values differ 0.3 with the Dk values that supplier provides, if not calculating the Dk values of design, and supplier is provided
Dk values bring formula calculating simulation impedance into, then the calculating of impedance will be badly influenced, thus have influence on PCB signal pass
Defeated speed.Therefore, 4.8 actual Dk values are chosen when calculating simulation impedance, as a result can be more accurate.
The present invention is by the physical method of micro- section come the thickness of the dielectric layer of sheet material measurement 1, the thickness of impedance line 2, impedance
The bottom line width of line 2 and the top line width of impedance line 2, then calculate the dielectric constant of material by above-mentioned parameter.So that can
With the validity for the dielectric constant values for assessing supplier's offer, prepreg mixed pressure sheet material 1 for some different sizes and not
With the prepreg sheet material 1 of gel content, effective dielectric constant can be calculated, accurate parameter is provided for PCB design so that
There is no the producer of Dk measuring instruments, effective Dk values can also be calculated, it is ensured that the quality of pcb board.
The technology contents described above that the present invention is only further illustrated with embodiment, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, and any technology done according to the present invention extends or recreated, and is sent out by this
Bright protection.
Claims (9)
1. a kind of method of parameter value needed for acquisition calculates sheet material dielectric constant, it is characterised in that comprise the following steps：
S1, the micro- section of section making for intercepting sheet material, wherein the sheet material is provided with impedance line, cut during interception section along impedance line
Face is intercepted；
S2, the thickness of sheet material measurement dielectric layer, the thickness of impedance line, the top line width of the bottom line width of impedance line and impedance line,
Obtain calculating the parameter value needed for sheet material dielectric constant.
The method of parameter value needed for 2. acquisition according to claim 1 calculates sheet material dielectric constant, it is characterised in that in institute
State in S1 steps, micro- section makes in accordance with the following steps：
S1, sheet material is intercepted by saw or shearing machine, sample is cut in acquisition；
S2, using sand paper the section for cutting sample is polished, form flat surface grinding；
S3, flat surface grinding is processed by shot blasting, forms burnishing surface, obtain micro- section.
The method of parameter value needed for 3. acquisition according to claim 2 calculates sheet material dielectric constant, it is characterised in that：Throwing
After light processing, in addition to microetch processing is carried out to burnishing surface.
The method of parameter value needed for 4. acquisition according to claim 3 calculates sheet material dielectric constant, it is characterised in that：It is described
Microetch processing is performed such：It is stained with after micro-corrosion liquid is wiped 2~3 seconds along burnishing surface and is dried at once with cotton rod.
The method of parameter value needed for 5. acquisition according to claim 4 calculates sheet material dielectric constant, it is characterised in that：It is described
Micro-corrosion liquid includes ammoniacal liquor, water and hydrogen peroxide, and wherein ammoniacal liquor is that 45~55cc, water are that 45~55cc, hydrogen peroxide are 5~10 drops, institute
The concentration for stating hydrogen peroxide is 1~8g/L, and the concentration of the ammoniacal liquor is 25%~28%.
The method of parameter value needed for 6. acquisition according to claim 2 calculates sheet material dielectric constant, it is characterised in that：It is described
What polishing was performed such：Polishing flannelet is drenched, polishing fluid is poured into polishing flannelet, flat surface grinding is wiped repeatedly, is formed
Burnishing surface.
The method of parameter value needed for 7. acquisition according to claim 6 calculates sheet material dielectric constant, it is characterised in that：It is described
Polishing fluid includes polishing powder and water, and the wherein volume ratio of polishing powder and water is 1:5.
The method of parameter value needed for 8. acquisition according to claim 7 calculates sheet material dielectric constant, it is characterised in that：Wherein
The maximum particle diameter of polishing powder is below 0.3 μm, and the hardness of polishing powder is in Mohs' hardness below 9.
The method of parameter value needed for 9. acquisition according to claim 6 calculates sheet material dielectric constant, it is characterised in that：Make
Fully shaken up with before polishing fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710641252.6A CN107328999A (en) | 2017-07-31 | 2017-07-31 | A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant |
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| CN201710641252.6A CN107328999A (en) | 2017-07-31 | 2017-07-31 | A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109241692A (en) * | 2018-11-14 | 2019-01-18 | 郑州云海信息技术有限公司 | A kind of method and apparatus of data processing |
| CN109275259A (en) * | 2018-09-20 | 2019-01-25 | 郑州云海信息技术有限公司 | A kind of production method of pcb board and a kind of pcb board |
| CN109581068A (en) * | 2018-11-27 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A kind of effective dielectric constant assessment test method and system |
| CN113033140A (en) * | 2021-03-02 | 2021-06-25 | 深圳市一博科技股份有限公司 | Simulation method for accurately obtaining difference of dielectric constants of upper layer and lower layer of PCB (printed Circuit Board) wiring |
| CN114076886A (en) * | 2020-08-20 | 2022-02-22 | 深南电路股份有限公司 | Establishing method for correcting PCB dielectric constant model, correcting method and correcting system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109275259A (en) * | 2018-09-20 | 2019-01-25 | 郑州云海信息技术有限公司 | A kind of production method of pcb board and a kind of pcb board |
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| CN114076886A (en) * | 2020-08-20 | 2022-02-22 | 深南电路股份有限公司 | Establishing method for correcting PCB dielectric constant model, correcting method and correcting system |
| CN113033140A (en) * | 2021-03-02 | 2021-06-25 | 深圳市一博科技股份有限公司 | Simulation method for accurately obtaining difference of dielectric constants of upper layer and lower layer of PCB (printed Circuit Board) wiring |
| CN113033140B (en) * | 2021-03-02 | 2023-12-29 | 深圳市一博科技股份有限公司 | Simulation method for accurately obtaining dielectric constant difference of upper and lower layers of PCB wiring |
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Application publication date: 20171107 |
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