CN101621902B - 固定装置及使用该固定装置的散热装置 - Google Patents

固定装置及使用该固定装置的散热装置 Download PDF

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CN101621902B
CN101621902B CN2008100683281A CN200810068328A CN101621902B CN 101621902 B CN101621902 B CN 101621902B CN 2008100683281 A CN2008100683281 A CN 2008100683281A CN 200810068328 A CN200810068328 A CN 200810068328A CN 101621902 B CN101621902 B CN 101621902B
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CN101621902A (zh
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陈金贤
陈荣安
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Fuzhun Precision Industry Shenzhen Co Ltd
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    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
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    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
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    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
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Abstract

一种散热装置，包括一座体及设于该座体上的一弹片，该弹片包括与座体相结合的一结合部及由该结合部的两端分别延伸形成的两个锁合部，该座体上设有一凸柱，该凸柱包括设于座体上的一颈部及位于该颈部顶端的一头部，该结合部上设有一固定孔，该弹片通过该固定孔松动地套置于该颈部上，该固定孔的孔径小于该头部的最大外径。该散热装置的弹片可松动地套置于该颈部上，使弹片能很好的定位于电路板上。

Description

固定装置及使用该固定装置的散热装置
技术领域
本发明是关于一种固定装置，特别是使用该固定装置固定散热体至发热电子元件上的散热装置。
背景技术
一般电子元件(特别是中央处理器)运行时产生大量热，而使其本身及***温度升高，过高的温度会导致其运行性能的下降。为此，业界通常在电子元件上安装散热器，排出其所产生的大量热量，为确保散热器与电子元件能够紧密接触而传热充分，通常需借助固定装置将散热器辅助扣合。
然而，随着计算机产业的快速发展，计算机厂商考量***的小型化、散热问题的改善及噪音的降低等多方面的因素，对现有***进行不断的改进而提出诸多不同架构及尺寸的***，使得电子元件在电路板上的水平布置及高度等改变很大。但是，现有散热器往往只能搭配特定的固定装置锁固于电路板上，当电路板上的电子元件的布置及尺寸改变而又因考量电容、板卡等的干涉其上的固定孔位改变时，使得其位置与固定装置上的锁合孔不相对应，固定装置无法适用于变化后的***。
因此，如何提供一种能够适用于多种不同计算机***架构的固定装置成为业界需解决的重要问题之一。
发明内容
有鉴于此，有必要提供一种能很好定位至发热电子元件上的固定装置及使用该固定装置的散热装置。
一种固定装置，包括一座体及设于座体上的一弹片，该弹片包括与座体相结合的一结合部及由该结合部的两端分别延伸形成的两个锁合部，该座体上设有一凸柱，该凸柱包括与座体连接的一颈部及位于该颈部顶端的一头部，该结合部上设有一固定孔，该弹片通过该固定孔而松动地套置于该颈部上，该固定孔的孔径小于该头部的最大外径。
一种散热装置，包括一座体及设于该座体上的一弹片，其特征在于：该弹片包括与座体相结合的一结合部及由该结合部的两端分别延伸形成的两个锁合部，该座体上设有一凸柱，该凸柱包括设于座体上的一颈部及位于该颈部顶端的一头部，该结合部上设有一固定孔，该弹片通过该固定孔而松动地套置于该颈部上，该固定孔的孔径小于该头部的最大外径。
与现有技术相比，将散热装置固定至发热电子元件上时，由于该散热装置的弹片松动地套置于该颈部上，适应于不同位置开孔的电路板，从而使散热体可固定于多种不同架构的计算机***的电路板上，提升散热装置的通用性。
附图说明
下面参照附图结合实施例作进一步描述：
图1为本发明散热模组一实施例的分解图。
图2为图1的倒置立体组合图。
图3为图1中设有弹片的座体的侧面剖视图。
具体实施方式
如图1及图2所示为本发明散热装置的一个较佳实施例，该散热装置包括一热管10、一散热器20以及通过一弹片30将热管10固定至电路板40上的一座体50。
该热管10为扁平热管，大致呈L型，其包括一蒸发端12及一冷凝端14，该蒸发端12与电路板40上的一发热电子元件60接触，并吸收其热量传至冷凝端14。该热管10的冷凝端14与散热器20相连接，用于将传导至冷凝端14的热量进一步散发出去。该散热器20由若干平行相间排列的鳍片22组成，该散热器20于一侧设有一槽状的收容部(图未标)，该收容部将该热管10的冷凝端14收容其内。
该座体50由导热性能好的金属材料制成的板状结构，可作为一散热体对发热电子元件60进行散热。该座体50的底端向上凹进形成一凹槽52，该凹槽52用于将热管10的蒸发端12收容其内，为增加热管10与座体50的热传效果，二者之间可以通过锡焊或导热膏相接触。该座体50贴设于发热电子元件60上并使热管10的蒸发端12与发热电子元件60相接触，使热管10与座体50共同吸收并散发发热电子元件60的热量。该座体50的顶端与凹槽52对应向上凸出形成一凸台54，该座体50于凸台54的两侧的部分向上延伸形成若干的导热柱56，该导热柱56进一步将传导至座体50上的热量散发。请同时参考图3，该凸台54向上延伸形成一凸柱58，该凸柱58包括与座体50相连接的一颈部580以及位于该颈部580顶端的一头部582。在本实施例中，该头部582是通过设于凸柱58顶端的一扩孔584使之向外扩大变形而形成，该头部582呈椭圆形，且该头部582的最大外径大于该颈部580的外径。该凸柱58可由座体50一体形成，也可为螺钉或铆钉等固定部件设置在座体50上形成，该头部582也可为圆形或其他形状。
该弹片30包括与座体50相结合的一结合部32及用于将座体50锁固于发热电子元件60上的二锁合部34。该弹片30呈细长状，该锁合部34是由该结合部32的两端先向下再向外弯折延伸形成，使该结合部32相对于该二锁合部34向上凸出设置。该结合部32对应跨设于凸台54上，二锁合部34分别位于凸台54的两侧。该结合部32上对应凸柱58设有一固定孔320，通过该固定孔320使该弹片30套置于凸柱58的颈部580上。该固定孔320的孔径大于该颈部580的外径且小于该头部582的外径，可使该弹片30活动的套置于颈部580上而不会从头部582脱下。该锁合部34的末端各设有一装配孔340，通过一螺钉80穿过该装配孔340与电路板40上的锁固孔42将弹片30固定在电路板40上，并使座体50的底端与发热电子元件60相接触。由于该弹片30可相对于座体50旋转，避免弹片30与座体50锁死的状况，减小座体50上连接点对结合部32的结合应力，防止弹片30的结合部32发生变形而影响散热装置与发热电子元件60的接触。此外，这种设置的散热装置通过旋转弹片30，使其自由端部可相对座体50位置变化，可方便地实现装配孔340与电路板40上的锁固孔42的对齐，便于组装，适应于不同位置开孔的电路板40，从而提升散热装置的通用性。
工作时，该发热电子元件60产生的热量一方面通过热管10的蒸发端12传导至其冷凝端14，再通过散热器20向外散发，另一方面直接通过座体50及设于其上的导热柱56散发。

Claims (10)

1.一种固定装置，包括一座体及设于座体上的一弹片，其特征在于：该弹片包括与座体相结合的一结合部及由该结合部的两端分别弯折延伸形成的两个锁合部，该结合部相对于该两个锁合部向上凸出设置，该座体上设有一凸柱，该凸柱包括与座体连接的一颈部及位于该颈部顶端的一头部，该结合部上设有一固定孔，该弹片通过该固定孔而松动地套置于该颈部上，该固定孔的孔径小于该头部的最大外径。
2.如权利要求1所述的固定装置，其特征在于：该凸柱由该座体向上一体延伸形成。
3.如权利要求1所述的固定装置，其特征在于：该凸柱的顶端设有一扩孔，该头部通过该扩孔向外变形后形成。
4.一种散热装置，包括一座体及设于该座体上的一弹片，其特征在于：该弹片包括与座体相结合的一结合部及由该结合部的两端分别弯折延伸形成的两个锁合部，该结合部相对于该两个锁合部向上凸出设置，该座体上设有一凸柱，该凸柱包括设于座体上的一颈部及位于该颈部顶端的一头部，该结合部上设有一固定孔，该弹片通过该固定孔而松动地套置于该颈部上，该固定孔的孔径小于该头部的最大外径。
5.如权利要求4所述的散热装置，其特征在于：该凸柱由该座体向上一体延伸形成。
6.如权利要求4所述的散热装置，其特征在于：该凸柱的顶端设有一扩孔，该头部通过该扩孔向外变形后形成。
7.如权利要求4至6任何一项所述的散热装置，其特征在于：该散热装置还包括一热管，该座体的底端对应凸柱的位置形成一凹槽，该凹槽将热管的蒸发端收容其内。
8.如权利要求7所述的散热装置，其特征在于：该座体上对应凹槽的位置向上凸出形成一凸台，该凸柱设于该凸台上。
9.如权利要求8所述的散热装置，其特征在于：该结合部跨置于凸台上，该两个锁合部位于凸台的两侧。
10.如权利要求4所述的散热装置，其特征在于：该座体上于凸台的两侧位置延伸形成若干导热柱。
CN2008100683281A 2008-07-04 2008-07-04 固定装置及使用该固定装置的散热装置 Expired - Fee Related CN101621902B (zh)

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CN2008100683281A CN101621902B (zh) 2008-07-04 2008-07-04 固定装置及使用该固定装置的散热装置
US12/256,437 US7701719B2 (en) 2008-07-04 2008-10-22 Fastening device for thermal module

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