CN101578697B - 高频封装件 - Google Patents

高频封装件 Download PDF

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CN101578697B
CN101578697B CN2008800017522A CN200880001752A CN101578697B CN 101578697 B CN101578697 B CN 101578697B CN 2008800017522 A CN2008800017522 A CN 2008800017522A CN 200880001752 A CN200880001752 A CN 200880001752A CN 101578697 B CN101578697 B CN 101578697B
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frequency
high frequency
signal
conductor pad
multilayer dielectricity
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CN101578697A (zh
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八十冈兴祐
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Mitsubishi Electric Corp
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Abstract

一种高频封装件，包括：高频器件(2)、在表层上装载有高频器件(2)的多层介质基板(20)、以及作为覆盖该多层介质基板的表层的一部分及高频器件(2)的电磁屏蔽部件的密封环(3)及盖板(4)，对内部导体焊盘(5)，设置具有无用波的波长的近似1/4长度的前端开放线路(50)。由于在腔室空间内传播的无用辐射与连线耦合，通过多层介质基板内层的偏置线向外部辐射，可以减少与连线的耦合量，可以降低向外部辐射的无用辐射量。

Description

高频封装件
技术领域
本发明涉及装载有在微波频带或者毫米波频带等高频带下工作的高频器件的高频封装件，更详细而言，涉及可以制止从高频器件发出的高频信号(无用波)向外部泄漏的高频封装件。
背景技术
车载毫米波雷达使用毫米波频带的电磁波，可应用于通过检测与前方车辆的距离、和相对速度进行巡航控制或在碰撞不可避免时减轻对驾驶员的伤害等的安全性措施。在这样的车载毫米波雷达中，为了得到发送信号，较多采用从较低的频率倍增的方式，但此时，由于在模块内存在很多频率分量，因此非常难以满足国际的EMI(抗电磁干扰)标准(FCC(联邦通信委员会)等)。
在车载毫米波雷达中，雷达模块通常包括：装载有雷达装置用的高频器件的高频封装件、向该高频封装件提供偏置信号及控制信号的控制/接口基板、以及波导板等而构成，但为了满足上述的EMI标准，以往多将整个雷达模块用金属盖板覆盖而构成。
然而，在用金属盖板覆盖整个雷达模块时，由于需要高价的壳体等，因此也为了低成本化，期望一种在高频封装件内满足上述EMI标准的应对方法。
在专利文献1中，在金属制的底座部件上安装高频信号用集成电路元器件及介质基板，在介质基板上形成微带线，将其用金属制的框架部件及盖状部件覆盖，对安装在底座部件上的高频信号用集成电路元器件通过偏置端子提供偏压。
专利文献1：日本专利特开2000-31712号公报
发明内容
在上述专利文献1所披露的以往技术中，由于用金属制底座部件、金属制框架部件、金属的盖状部件包围高频封装件，因此高频分量向外部的泄漏在某种程度上被抑制，但对于通过偏置端子泄漏的高频分量却没有采取任何对策。因此存在这样的问题：高频封装件内的与偏置端子电磁耦合的无用波即高频分量会通过偏置端子原样地向外部辐射。
即，在这种高频封装件中，在多层介质基板的表层装载高频器件，用电磁屏蔽部件覆盖该多层介质基板的表层的一部分及高频器件，为了从外部向被该电磁屏蔽部件覆盖的高频器件提供偏压或控制信号，将配置在电磁屏蔽部件的外侧的外部端子通过多层介质基板内的信号通孔、内层信号线路、信号通孔，与电磁屏蔽部件的内侧的内部端子连接，进一步将该内部端子通过连线与高频器件电连接。因此，在以往的高频封装件中，存在的问题是：在电磁屏蔽部件的内部空间传播的无用辐射与连线耦合，通过介质基板内层的偏置线向外部辐射。
本发明鉴于上述情况而作，其目的在于得到一种高频封装件，该高频封装件减少与连线的耦合量，在高频封装件内制止向外部辐射的无用辐射量，成本低，高频屏蔽性能好。
为解决上述问题，达到目的，本发明的高频封装件包括：高频器件、在表层上装载有上述高频器件的多层介质基板、以及覆盖该多层介质基板的表层的一部分及上述高频器件的电磁屏蔽部件，其特征是，在上述多层介质基板中，包括：配设在电磁屏蔽部件的内侧的多层介质基板的表层、与上述高频器件通过连线连接的偏压/控制信号用的内部导体焊盘；与上述内部导体焊盘连接、配设在上述电磁屏蔽部件的内侧的第一信号通孔；配设在上述电磁屏蔽部件的外侧的偏压/控制信号用的外部导体焊盘；与该外部导体焊盘连接、配设在上述电磁屏蔽部件的外侧的第二信号通孔；以及将第一信号通孔和第二信号通孔连接的内层信号线路，并且对上述内部导体焊盘，设置具有上述高频器件所使用的高频信号的波长的近似1/4长度的前端开放线路。
根据本发明，对偏压/控制信号用的内部导体焊盘，设置具有高频器件所使用的高频信号(无用波)的波长的近似1/4长度的前端开放线路，由于与连线耦合的无用波在内部导体焊盘的前端开放线路的部位被反射，因此可以减少与连线的耦合量，据此，可以减少向外部的漏出量。因此，可以确实制止无用波分量向高频封装件外部的泄漏。这样，由于在高频封装件内部可以制止高频分量向高频封装件外部的泄漏，因此可以降低制造成本。
附图说明
图1是表示装载有本发明的实施方式所涉及的高频封装件的收发模块的结构的剖视图。
图2是表示本发明的实施方式所涉及的高频封装件的结构例的剖视图。
图3是表示高频封装件的多层介质基板的表层的俯视图。
图4是表示高频封装件的多层介质基板的表层的其他例的俯视图。
图5是表示无用波向外部的泄漏量的仿真特性的图，是表示不设置前端开放线路时的特性的图。
图6是表示无用波向外部的泄漏量的仿真特性的图，是表示设置前端开放线路时的特性的图。
标号说明
1高频封装件
2高频器件
3密封环
4盖板
5内部导体焊盘
6连线
7导体焊盘
10收发模块
11波导管
12波导板
13载体基板
14模块控制基板
15波导管
16电子电路
17外部端子
20多层介质基板
21外部导体焊盘
22、24信号通孔
23内层信号线路
27连线
28接地通孔
40凹部
50前端开放线路
具体实施方式
下面，基于附图详细说明本发明所涉及的高频封装件的实施方式。另外，本发明不限于本实施方式。
图1是表示装载有高频封装件1的收发模块10的结构的剖视图。图2是表示高频封装件1的结构的剖视图。该收发模块10例如使用毫米波频带的电磁波，可以应用于具有检测与前方的目标物(车辆等)的距离及相对速度的功能的FM-CW(调频连续波)雷达。FM-CW雷达将进行了频率调制的高频信号(发送信号)向目标发射，检测从目标反射的信号(接收信号)和发送信号的频率之差，使用该频率算出到达目标的距离及相对速度。
该收发模块10包括：形成有波导管11的波导板12、装载在波导板12上的金属制的载体基板13、装载在载体基板13上的高频封装件1、以及装载在波导板12上的模块控制基板(也称作控制/接口基板)14。在波导板12的下表面侧连接天线基板(未图示)。载体基板13被接地，在载体基板13也形成波导管15。在模块控制基板14上，装载构成控制电路、电源电路等的电子电路16、和外部端子17等。在载体基板13上装载高频封装件1的构成要素即多层介质基板20，在该多层介质基板20的表层侧的中心部，形成用于装载高频器件2的凹部40。
在多层介质基板20所形成的凹部40的底面上，容纳高频器件(MMIC)2。在多层介质基板20上，装载将从高频器件2向外部的无用辐射进行屏蔽的金属制的框形的密封环3，进一步在密封环3上设置金属制的盖板4。通过密封环3及盖板4构成覆盖多层介质基板20的表层的一部分及高频器件2的电磁屏蔽部件。即，在被多层介质基板20、密封环3、盖板4包围的、与外部隔断的腔室内，容纳高频器件2。这样，高频封装件1由多层介质基板20、高频器件2、密封环3及盖板4等构成。
另外，在电磁屏蔽部件的内部侧的多层介质基板20的表层，设置用于向高频器件2提供偏压、或者在与高频器件2之间输入输出控制信号的内部导体焊盘(称作偏压/控制信号用焊盘)5。在高频器件2一侧也设置导体焊盘7。在内部导体焊盘5与高频器件2的导体焊盘7之间，利用由金等制成的连线6进行引线键合连接。
在密封环3的外侧的多层介质基板20上，设置外部导体焊盘(外部端子)21。外部导体焊盘21通过形成于密封环3外侧的多层介质基板20内的信号通孔22、内层信号线路23、形成于密封环3内侧的多层介质基板20内的信号通孔24，与内部导体焊盘5电连接。外部导体焊盘21如图1所示，通过连线27与形成于模块控制基板14上的外部端子17连接。根据这样的连接结构，可以从配置在密封环3外侧的模块控制基板14向配置在密封环3内侧的高频器件2提供偏压或者控制信号。
另外，在密封环3的内侧，多层介质基板20的表层除了内部导体焊盘5周围的介质露出的部分以外，基本上形成作为表层接地导体的接地图案，防止作为无用波的高频信号通过表层进入多层介质基板20的内部。该表层接地导体通过接地通孔28等与载体基板13或者形成于多层介质基板20的内层的内层接地导体(未图示)适当连接。另外，在信号通孔24的周围，配置夹着介质的多个接地通孔(未图示)，通过这些多个接地通孔，屏蔽来自其他信号通孔的电场。
接下来，使用图3及图4说明本实施方式的主要部分。图3及图4是表示去除盖板4的状态下的多层介质基板20的表层的俯视图。如图3及图4所示，对由连线6与高频器件2连接的内部导体焊盘5，将具有高频器件2所使用的高频信号的波长λ的近似1/4长度、换言之具有腔室内的无用辐射的波长λ的近似1/4长度的前端开放线路50设置在多层介质基板20的表层。即，将从信号通孔24起的长度具有无用波的波长λ的近似1/4长度的前端开放线路50与内部导体焊盘5连接，以使与内部导体焊盘5连接的信号通孔24成为短路点。前端开放线路50的延伸方向如图3及图4所示，为任意的方向。
高频器件2所发出的无用辐射在腔室内部的空间传播，以往存在的问题是：该无用辐射与内部导体焊盘5和高频器件2之间的连线6耦合，如图1、图2的虚线所示，经由内部导体焊盘5及信号通孔24在由内层信号线路23、信号通孔22、外部导体焊盘21形成的例如偏置线传播，向外部辐射。
因此，在本实施方式中，由于对内部导体焊盘5连接λ/4长度的前端开放线路50，因此可以使与连线6耦合的无用辐射在前端开放线路50的部位被反射，据此，可以制止无用辐射通过内层信号线路23、信号通孔22、外部导体焊盘21向外部泄漏。即，通过设置前端开放线路50，可以使在腔室内的空间传播的无用辐射与连线6耦合的量减少，可以满足由电波法规定的EMI特性。
图5及图6表示使连线6的长度为λ/4时的无用波向外部的泄漏量的仿真特性、即连线6与外部导体焊盘21之间的高频分量的通过仿真特性，图5表示不设置前端开放线路50的情况，图6表示设置λ/4长度的前端开放线路50的情况。图5及图6中，fo是无用辐射的频率。
从这些仿真结果可知，如图5所示，在不设置前端开放线路50时，无用辐射频率fo向外部漏出的量为-50dB，与之不同的是，如图6所示，在设置前端开放线路50时，无用辐射频率fo向外部漏出的量是-64dB。即，在设置前端开放线路50时，带阻滤波器的功能起作用，在与无用波频率λ对应的频率fo的附近频带，可以使通过量大幅减少。因此，可以制止与连线6耦合的无用波分量由前端开放线路50通过而到达前端，据此，可以抑制高频分量向外部泄漏。
另外，在上述内容中，作为用于构成腔室的电磁屏蔽部件，是采用分开形成的密封环3及盖板4，但也可以采用将其一体构成的帽状部件作为电磁屏蔽部件。
这样，根据该实施方式，由于对偏压/控制信号用的内部导体焊盘5，设置具有与连线6耦合的无用波的波长的近似1/4长度的前端开放线路，所以与连线6耦合的无用波在内部导体焊盘的前端开放线路的部位被反射，因此可以减少与连线6的耦合量，据此可以减少向外部的漏出量。因而，可以确实制止无用波分量向高频封装件外部的泄漏。这样，由于在高频封装件内部可以制止高频分量向高频封装件外部的泄漏，因此可以降低制造成本。
工业上的实用性
如上所述，本发明所涉及的高频封装件对于在电磁屏蔽空间内装载有以微波、毫米波频带工作的高频器件的高频封装件是有用的。

Claims (3)

1.一种高频封装件，包括：高频器件、在表层上装载有所述高频器件的多层介质基板、以及覆盖该多层介质基板的表层的一部分及所述高频器件的电磁屏蔽部件，其特征在于，
在所述多层介质基板中，包括：
配设在电磁屏蔽部件的内侧的多层介质基板的表层、与所述高频器件通过连线连接的偏压/控制信号用的内部导体焊盘；
与所述内部导体焊盘连接、配设在所述电磁屏蔽部件的内侧的第一信号通孔；
配设在所述电磁屏蔽部件的外侧的偏压/控制信号用的外部导体焊盘；
与该外部导体焊盘连接、配设在所述电磁屏蔽部件的外侧的第二信号通孔；以及
将第一信号通孔和第二信号通孔连接的内层信号线路，
并且对所述内部导体焊盘，连接具有所述高频器件所使用的高频信号的波长的近似1/4长度的前端开放线路。
2.如权利要求1所述的高频封装件，其特征在于，所述前端开放线路从第一信号通孔起具有所述高频信号的波长的近似1/4的长度。
3.如权利要求1所述的高频封装件，其特征在于，所述高频器件容纳在所述多层介质基板所形成的凹部底面上。
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EP2124253A4 (en) 2010-08-04
CN101578697A (zh) 2009-11-11
EP2124253B1 (en) 2019-05-22
EP2124253A1 (en) 2009-11-25
WO2008111391A1 (ja) 2008-09-18

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