CN101496455A - 柔性印刷基板、安装有该柔性印刷基板的电子设备以及柔性印刷基板的折叠方法 - Google Patents
柔性印刷基板、安装有该柔性印刷基板的电子设备以及柔性印刷基板的折叠方法 Download PDFInfo
- Publication number
- CN101496455A CN101496455A CNA2007800286736A CN200780028673A CN101496455A CN 101496455 A CN101496455 A CN 101496455A CN A2007800286736 A CNA2007800286736 A CN A2007800286736A CN 200780028673 A CN200780028673 A CN 200780028673A CN 101496455 A CN101496455 A CN 101496455A
- Authority
- CN
- China
- Prior art keywords
- terminal
- baseplate part
- flexible printed
- printed board
- adjacency section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/053—Tails
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/055—Folded back on itself
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Telephone Set Structure (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006201448A JP2008028276A (ja) | 2006-07-25 | 2006-07-25 | フレキシブルプリント基板及びこれを実装した電子機器並びにフレキシブルプリント基板の折り畳み方法 |
JP201448/2006 | 2006-07-25 | ||
PCT/JP2007/063976 WO2008013070A1 (fr) | 2006-07-25 | 2007-07-13 | Plaque de circuit imprimé flexible, dispositif électronique monté avec celle-ci, et procédé de pliage de plaque de circuit imprimé flexible |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101496455A true CN101496455A (zh) | 2009-07-29 |
CN101496455B CN101496455B (zh) | 2013-05-22 |
Family
ID=38981383
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800286736A Expired - Fee Related CN101496455B (zh) | 2006-07-25 | 2007-07-13 | 柔性印刷基板、安装有该柔性印刷基板的电子设备以及柔性印刷基板的折叠方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8115103B2 (zh) |
EP (1) | EP2046103B1 (zh) |
JP (1) | JP2008028276A (zh) |
CN (1) | CN101496455B (zh) |
WO (1) | WO2008013070A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102480840A (zh) * | 2010-11-24 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
CN104837294A (zh) * | 2015-04-09 | 2015-08-12 | 京东方科技集团股份有限公司 | 一种柔性电路板及其制备方法和显示装置 |
WO2019080006A1 (zh) * | 2017-10-25 | 2019-05-02 | 深圳市大疆创新科技有限公司 | 柔性电路板及电子装置 |
CN112803180A (zh) * | 2019-10-25 | 2021-05-14 | 三菱电机株式会社 | 逆变器装置 |
CN113439490A (zh) * | 2019-03-04 | 2021-09-24 | 吉佳蓝科技股份有限公司 | 柔性电路板以及包括其的无线终端机 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8043115B2 (en) * | 2008-12-19 | 2011-10-25 | Nokia Corporation | Apparatus and methods |
TW201039520A (en) * | 2009-04-28 | 2010-11-01 | Adv Flexible Circuits Co Ltd | Flat signal transmission cable with bundling structure |
JP2010287658A (ja) * | 2009-06-10 | 2010-12-24 | Lenovo Singapore Pte Ltd | フレキシブルプリント基板 |
JP4916595B2 (ja) * | 2009-06-25 | 2012-04-11 | オリンパスメディカルシステムズ株式会社 | 撮像ユニット |
JP5446790B2 (ja) * | 2009-12-02 | 2014-03-19 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
KR101786512B1 (ko) * | 2010-07-26 | 2017-10-18 | 엘지전자 주식회사 | 다층 연성회로기판의 제조방법 |
US9084368B2 (en) * | 2011-06-15 | 2015-07-14 | Novatek Microelectronics Corp. | Single FPC board for connecting multiple modules and touch sensitive display module using the same |
US9131605B2 (en) * | 2012-05-25 | 2015-09-08 | Nitto Denko Corporation | Dynamic loop with fold |
CN103582317B (zh) * | 2013-10-16 | 2016-07-06 | 镇江华印电路板有限公司 | 挠性印制线路板漏锡半圆孔制作方法 |
JP6862754B2 (ja) * | 2016-10-17 | 2021-04-21 | 大日本印刷株式会社 | 回路基板、回路装置および情報記録装置 |
KR20210015563A (ko) * | 2019-08-02 | 2021-02-10 | 삼성전자주식회사 | Fpcb를 포함하는 전자 장치 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04263495A (ja) * | 1991-02-18 | 1992-09-18 | Ibiden Co Ltd | フレキシブル配線板 |
JP2744889B2 (ja) * | 1994-09-29 | 1998-04-28 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 磁気ディスク装置のフレキシブルケーブル構造 |
JP3435245B2 (ja) * | 1995-02-21 | 2003-08-11 | ペンタックス株式会社 | フレキシブルプリント配線板 |
US6118666A (en) * | 1998-01-12 | 2000-09-12 | Asahi Kogaku Kogyo Kabushiki Kaisha | Flexible printed wiring board and connecting structure thereof |
US6153832A (en) * | 1999-02-08 | 2000-11-28 | Hewlett-Packard Company | Z-fold printhead carriage trailing cable for optimized panelization |
JP3773782B2 (ja) | 2000-10-31 | 2006-05-10 | 三洋電機株式会社 | 折畳式携帯電話端末 |
JP2003158355A (ja) * | 2001-11-20 | 2003-05-30 | Kenwood Corp | フレキシブルプリント基板の接続構造および電子機器 |
JP4319385B2 (ja) * | 2002-10-10 | 2009-08-26 | 株式会社東芝 | 移動通信端末装置及びフレキシブル基板 |
JP4136695B2 (ja) | 2003-02-10 | 2008-08-20 | 住友電工プリントサーキット株式会社 | フレキシブルプリント基板 |
JP4121391B2 (ja) | 2003-02-17 | 2008-07-23 | 三洋電機株式会社 | フレキシブルプリント基板及びフレキシブルプリント基板を有する折り畳み式電子機器 |
JP3098782U (ja) | 2003-06-24 | 2004-03-11 | 住友電工プリントサーキット株式会社 | フレキシブルプリント基板 |
JP4087311B2 (ja) | 2003-08-06 | 2008-05-21 | シャープ株式会社 | 携帯機器 |
JP4543772B2 (ja) * | 2003-09-19 | 2010-09-15 | セイコーエプソン株式会社 | 電気光学装置および電子機器 |
JP4206017B2 (ja) * | 2003-09-22 | 2009-01-07 | 住友電工プリントサーキット株式会社 | フレキシブルプリント基板 |
JP4159529B2 (ja) | 2004-10-07 | 2008-10-01 | 埼玉日本電気株式会社 | 折り畳み型機器のヒンジ部構造 |
TW200710672A (en) * | 2005-09-02 | 2007-03-16 | Adv Flexible Circuits Co Ltd | Circuit connection bus cable capable of changing corresponding pins |
JP2007109343A (ja) * | 2005-10-14 | 2007-04-26 | Hitachi Global Storage Technologies Netherlands Bv | フレキシブル・ケーブルの位置決め構造および磁気ディスク装置 |
-
2006
- 2006-07-25 JP JP2006201448A patent/JP2008028276A/ja active Pending
-
2007
- 2007-07-13 US US12/374,368 patent/US8115103B2/en not_active Expired - Fee Related
- 2007-07-13 EP EP07790757A patent/EP2046103B1/en not_active Expired - Fee Related
- 2007-07-13 CN CN2007800286736A patent/CN101496455B/zh not_active Expired - Fee Related
- 2007-07-13 WO PCT/JP2007/063976 patent/WO2008013070A1/ja active Application Filing
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102480840A (zh) * | 2010-11-24 | 2012-05-30 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
CN102480840B (zh) * | 2010-11-24 | 2014-06-25 | 富葵精密组件(深圳)有限公司 | 电路板的制作方法 |
CN104837294A (zh) * | 2015-04-09 | 2015-08-12 | 京东方科技集团股份有限公司 | 一种柔性电路板及其制备方法和显示装置 |
WO2016161762A1 (zh) * | 2015-04-09 | 2016-10-13 | 京东方科技集团股份有限公司 | 柔性电路板及其制备方法和显示装置 |
CN104837294B (zh) * | 2015-04-09 | 2017-07-11 | 京东方科技集团股份有限公司 | 一种柔性电路板及其制备方法和显示装置 |
US10028389B2 (en) | 2015-04-09 | 2018-07-17 | Boe Technology Group Co., Ltd. | Flexible printed circuit board, method for manufacturing the same, and display device |
WO2019080006A1 (zh) * | 2017-10-25 | 2019-05-02 | 深圳市大疆创新科技有限公司 | 柔性电路板及电子装置 |
CN113439490A (zh) * | 2019-03-04 | 2021-09-24 | 吉佳蓝科技股份有限公司 | 柔性电路板以及包括其的无线终端机 |
CN112803180A (zh) * | 2019-10-25 | 2021-05-14 | 三菱电机株式会社 | 逆变器装置 |
Also Published As
Publication number | Publication date |
---|---|
US20100016039A1 (en) | 2010-01-21 |
US8115103B2 (en) | 2012-02-14 |
EP2046103A1 (en) | 2009-04-08 |
CN101496455B (zh) | 2013-05-22 |
EP2046103B1 (en) | 2011-09-14 |
EP2046103A4 (en) | 2010-02-24 |
WO2008013070A1 (fr) | 2008-01-31 |
JP2008028276A (ja) | 2008-02-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: LENOVO INNOVATION CO., LTD. (HONGKONG) Free format text: FORMER OWNER: NEC CORP. Effective date: 20141202 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; TO: HONG KONG, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141202 Address after: Hongkong, China Patentee after: LENOVO INNOVATIONS Co.,Ltd.(HONG KONG) Address before: Tokyo, Japan Patentee before: NEC Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20170713 |