CN101043042B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN101043042B
CN101043042B CN2006101257314A CN200610125731A CN101043042B CN 101043042 B CN101043042 B CN 101043042B CN 2006101257314 A CN2006101257314 A CN 2006101257314A CN 200610125731 A CN200610125731 A CN 200610125731A CN 101043042 B CN101043042 B CN 101043042B
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transparent component
formation portion
groove formation
state image
solid
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Expired - Fee Related
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CN2006101257314A
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English (en)
Chinese (zh)
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CN101043042A (zh
Inventor
森屋晋
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Fujitsu Semiconductor Ltd
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Fujitsu Semiconductor Ltd
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    • H01L27/144—Devices controlled by radiation
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CN2006101257314A 2006-03-22 2006-08-29 半导体装置 Expired - Fee Related CN101043042B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006079062A JP4838609B2 (ja) 2006-03-22 2006-03-22 半導体装置
JP2006-079062 2006-03-22
JP2006079062 2006-03-22

Publications (2)

Publication Number Publication Date
CN101043042A CN101043042A (zh) 2007-09-26
CN101043042B true CN101043042B (zh) 2012-08-22

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CN2006101257314A Expired - Fee Related CN101043042B (zh) 2006-03-22 2006-08-29 半导体装置

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US (1) US20070222875A1 (ko)
JP (1) JP4838609B2 (ko)
KR (1) KR100824514B1 (ko)
CN (1) CN101043042B (ko)
TW (1) TWI340462B (ko)

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JP2013055160A (ja) * 2011-09-01 2013-03-21 Canon Inc 光透過性部材、光学装置およびそれらの製造方法
JP2013143520A (ja) * 2012-01-12 2013-07-22 Sony Corp 撮像装置および撮像装置の製造方法
JP2014045142A (ja) * 2012-08-28 2014-03-13 Sony Corp 半導体装置及び半導体装置の製造方法
US9608029B2 (en) * 2013-06-28 2017-03-28 Stmicroelectronics Pte Ltd. Optical package with recess in transparent cover
US10976205B2 (en) * 2015-09-30 2021-04-13 Hitachi Automotive Systems, Ltd. Dynamic quantity measuring apparatus having a strain sensor disposed in a groove
CN110337804A (zh) * 2017-04-12 2019-10-15 宁波舜宇光电信息有限公司 摄像模组及其模塑感光组件和制造方法以及电子设备
CN107968908A (zh) * 2017-12-19 2018-04-27 广东欧珀移动通信有限公司 摄像头及具有其的电子设备
US11011576B2 (en) * 2018-06-28 2021-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Resistive random access memory device
US11601575B2 (en) 2018-09-14 2023-03-07 Gopro, Inc. Electrical connectivity between detachable components
CN111131663B (zh) * 2018-10-31 2021-12-24 中芯集成电路（宁波）有限公司 感光组件及其形成方法、镜头模组、电子设备
CN110797450A (zh) * 2019-10-29 2020-02-14 长春希龙显示技术有限公司 基于模压技术的表面一致性封装led显示单元
JP2022189647A (ja) * 2021-06-11 2022-12-22 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器

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JP2005109092A (ja) * 2003-09-30 2005-04-21 Konica Minolta Opto Inc 固体撮像装置及び該固体撮像装置を備えた撮像装置
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TW200737504A (en) 2007-10-01
CN101043042A (zh) 2007-09-26
TWI340462B (en) 2011-04-11
KR100824514B1 (ko) 2008-04-22
JP2007258936A (ja) 2007-10-04
JP4838609B2 (ja) 2011-12-14
US20070222875A1 (en) 2007-09-27
KR20070095742A (ko) 2007-10-01

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