CN101043042A - 半导体装置 - Google Patents
半导体装置 Download PDFInfo
- Publication number
- CN101043042A CN101043042A CNA2006101257314A CN200610125731A CN101043042A CN 101043042 A CN101043042 A CN 101043042A CN A2006101257314 A CNA2006101257314 A CN A2006101257314A CN 200610125731 A CN200610125731 A CN 200610125731A CN 101043042 A CN101043042 A CN 101043042A
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- Engineering & Computer Science (AREA)
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- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006079062A JP4838609B2 (ja) | 2006-03-22 | 2006-03-22 | 半導体装置 |
JP2006-079062 | 2006-03-22 | ||
JP2006079062 | 2006-03-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101043042A true CN101043042A (zh) | 2007-09-26 |
CN101043042B CN101043042B (zh) | 2012-08-22 |
Family
ID=38532957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2006101257314A Expired - Fee Related CN101043042B (zh) | 2006-03-22 | 2006-08-29 | 半导体装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070222875A1 (zh) |
JP (1) | JP4838609B2 (zh) |
KR (1) | KR100824514B1 (zh) |
CN (1) | CN101043042B (zh) |
TW (1) | TWI340462B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107968908A (zh) * | 2017-12-19 | 2018-04-27 | 广东欧珀移动通信有限公司 | 摄像头及具有其的电子设备 |
CN110660909A (zh) * | 2018-06-28 | 2020-01-07 | 台湾积体电路制造股份有限公司 | 存储器装置 |
CN110797450A (zh) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | 基于模压技术的表面一致性封装led显示单元 |
CN111131663A (zh) * | 2018-10-31 | 2020-05-08 | 中芯集成电路(宁波)有限公司 | 感光组件及其形成方法、镜头模组、电子设备 |
CN112689794A (zh) * | 2018-09-14 | 2021-04-20 | 高途乐公司 | 可拆卸部件之间的电气连接 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7873760B2 (en) * | 2005-11-11 | 2011-01-18 | Versteeg William C | Expedited digital signal decoding |
JP2013055160A (ja) * | 2011-09-01 | 2013-03-21 | Canon Inc | 光透過性部材、光学装置およびそれらの製造方法 |
JP2013143520A (ja) * | 2012-01-12 | 2013-07-22 | Sony Corp | 撮像装置および撮像装置の製造方法 |
JP2014045142A (ja) * | 2012-08-28 | 2014-03-13 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
US9608029B2 (en) * | 2013-06-28 | 2017-03-28 | Stmicroelectronics Pte Ltd. | Optical package with recess in transparent cover |
US10976205B2 (en) * | 2015-09-30 | 2021-04-13 | Hitachi Automotive Systems, Ltd. | Dynamic quantity measuring apparatus having a strain sensor disposed in a groove |
CN110337804A (zh) * | 2017-04-12 | 2019-10-15 | 宁波舜宇光电信息有限公司 | 摄像模组及其模塑感光组件和制造方法以及电子设备 |
JP2022189647A (ja) * | 2021-06-11 | 2022-12-22 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および電子機器 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03203353A (ja) * | 1989-12-29 | 1991-09-05 | Nec Corp | 半導体装置のパッケージ |
US6492699B1 (en) * | 2000-05-22 | 2002-12-10 | Amkor Technology, Inc. | Image sensor package having sealed cavity over active area |
JP4313503B2 (ja) * | 2000-06-29 | 2009-08-12 | 京セラ株式会社 | 半導体装置 |
WO2004032274A1 (ja) * | 2002-10-03 | 2004-04-15 | Fujikura Ltd. | 電極基板、光電変換素子、導電性ガラス基板およびその製造方法、並びに色素増感太陽電池 |
JP2005109092A (ja) * | 2003-09-30 | 2005-04-21 | Konica Minolta Opto Inc | 固体撮像装置及び該固体撮像装置を備えた撮像装置 |
US7476955B2 (en) * | 2004-01-06 | 2009-01-13 | Micron Technology, Inc. | Die package having an adhesive flow restriction area |
US7129149B1 (en) * | 2004-06-07 | 2006-10-31 | Integrated Device Technology, Inc. | Method for forming shallow trench isolation structure with anti-reflective liner |
JP4382030B2 (ja) * | 2005-11-15 | 2009-12-09 | 富士通マイクロエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
-
2006
- 2006-03-22 JP JP2006079062A patent/JP4838609B2/ja not_active Expired - Fee Related
- 2006-08-08 US US11/500,439 patent/US20070222875A1/en not_active Abandoned
- 2006-08-09 TW TW095129196A patent/TWI340462B/zh not_active IP Right Cessation
- 2006-08-29 CN CN2006101257314A patent/CN101043042B/zh not_active Expired - Fee Related
- 2006-09-05 KR KR1020060085022A patent/KR100824514B1/ko active IP Right Grant
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN110660909A (zh) * | 2018-06-28 | 2020-01-07 | 台湾积体电路制造股份有限公司 | 存储器装置 |
CN110660909B (zh) * | 2018-06-28 | 2022-10-18 | 台湾积体电路制造股份有限公司 | 存储器装置 |
CN112689794A (zh) * | 2018-09-14 | 2021-04-20 | 高途乐公司 | 可拆卸部件之间的电气连接 |
US11601575B2 (en) | 2018-09-14 | 2023-03-07 | Gopro, Inc. | Electrical connectivity between detachable components |
CN111131663A (zh) * | 2018-10-31 | 2020-05-08 | 中芯集成电路(宁波)有限公司 | 感光组件及其形成方法、镜头模组、电子设备 |
CN110797450A (zh) * | 2019-10-29 | 2020-02-14 | 长春希龙显示技术有限公司 | 基于模压技术的表面一致性封装led显示单元 |
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TW200737504A (en) | 2007-10-01 |
TWI340462B (en) | 2011-04-11 |
KR100824514B1 (ko) | 2008-04-22 |
CN101043042B (zh) | 2012-08-22 |
JP2007258936A (ja) | 2007-10-04 |
JP4838609B2 (ja) | 2011-12-14 |
US20070222875A1 (en) | 2007-09-27 |
KR20070095742A (ko) | 2007-10-01 |
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