AU2001264968A1 - Filling device - Google Patents
Filling deviceInfo
- Publication number
- AU2001264968A1 AU2001264968A1 AU2001264968A AU6496801A AU2001264968A1 AU 2001264968 A1 AU2001264968 A1 AU 2001264968A1 AU 2001264968 A AU2001264968 A AU 2001264968A AU 6496801 A AU6496801 A AU 6496801A AU 2001264968 A1 AU2001264968 A1 AU 2001264968A1
- Authority
- AU
- Australia
- Prior art keywords
- filling device
- filling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10204—Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0139—Blade or squeegee, e.g. for screen printing or filling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0147—Carriers and holders
- H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0182—Using a temporary spacer element or stand-off during processing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0548—Masks
- H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20845400P | 2000-05-31 | 2000-05-31 | |
US60208454 | 2000-05-31 | ||
US09752629 | 2000-12-28 | ||
US09/752,629 US6454154B1 (en) | 2000-05-31 | 2000-12-28 | Filling device |
PCT/US2001/016986 WO2001093648A2 (en) | 2000-05-31 | 2001-05-24 | Filling device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001264968A1 true AU2001264968A1 (en) | 2001-12-11 |
Family
ID=26903209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001264968A Abandoned AU2001264968A1 (en) | 2000-05-31 | 2001-05-24 | Filling device |
Country Status (8)
Country | Link |
---|---|
US (3) | US6832714B2 (en) |
JP (1) | JP2003535465A (en) |
KR (1) | KR20030007755A (en) |
CN (1) | CN1444840A (en) |
AU (1) | AU2001264968A1 (en) |
DE (1) | DE10196259T1 (en) |
TW (1) | TW486782B (en) |
WO (1) | WO2001093648A2 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10196259T1 (en) * | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | filling |
WO2009147936A1 (en) * | 2008-06-02 | 2009-12-10 | イビデン株式会社 | Method for manufacturing multilayer printed wiring board |
TWI419282B (en) * | 2009-10-05 | 2013-12-11 | Advance Materials Corp | Method for forming window bga substrate |
WO2012074563A2 (en) * | 2010-01-21 | 2012-06-07 | Henkel Corporation | Ultrasonic assisted filling of cavities |
JP2013171862A (en) * | 2012-02-17 | 2013-09-02 | Tokyo Electron Ltd | Metal paste filling method, metal paste filling device, and via plug manufacturing method |
DE102012216101B4 (en) * | 2012-09-12 | 2016-03-24 | Festo Ag & Co. Kg | Method for producing a coil integrated in a substrate, method for producing a multilayer printed circuit board and electronic device |
CN105873709B (en) * | 2013-12-05 | 2018-09-28 | 富士机械制造株式会社 | Solder feedway |
CN105792971B (en) * | 2013-12-05 | 2018-09-28 | 富士机械制造株式会社 | Solder feedway |
EP3085484B1 (en) * | 2013-12-18 | 2019-01-30 | FUJI Corporation | Solder supply device |
JP6532475B2 (en) | 2014-02-13 | 2019-06-19 | ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. | Compressible thermal interface material |
US9878391B2 (en) | 2014-03-07 | 2018-01-30 | Fuji Machine Mfg. Co., Ltd. | Solder supply device |
US9974170B1 (en) | 2015-05-19 | 2018-05-15 | Apple Inc. | Conductive strands for fabric-based items |
CN105499710B (en) * | 2016-01-13 | 2017-11-14 | 浙江大学台州研究院 | Scraper with complex track |
BR112018067991A2 (en) | 2016-03-08 | 2019-01-15 | Honeywell Int Inc | thermal interface material, and electronic component |
US20170266948A1 (en) * | 2016-03-16 | 2017-09-21 | Intel Corporation | Modular squeegee head apparatus for printing materials |
US10722964B2 (en) * | 2016-03-18 | 2020-07-28 | Fuji Corporation | Viscous fluid supply device |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
CN116217258B (en) * | 2023-01-03 | 2024-01-16 | 东阳东磁自动化科技有限公司 | Full-automatic hole filling equipment for ceramic substrate and hole filling method thereof |
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JP3410639B2 (en) * | 1997-07-23 | 2003-05-26 | 株式会社日立製作所 | Paste filling method, soldering method and paste printing machine |
JPH1154909A (en) * | 1997-08-04 | 1999-02-26 | Tdk Corp | Method and apparatus for charging paste for through-holes |
JP3017485B2 (en) | 1998-01-23 | 2000-03-06 | アピックヤマダ株式会社 | Resin sealing method and resin sealing device for semiconductor device |
US6079100A (en) | 1998-05-12 | 2000-06-27 | International Business Machines Corporation | Method of making a printed circuit board having filled holes and fill member for use therewith |
US6009620A (en) | 1998-07-15 | 2000-01-04 | International Business Machines Corporation | Method of making a printed circuit board having filled holes |
US6090474A (en) | 1998-09-01 | 2000-07-18 | International Business Machines Corporation | Flowable compositions and use in filling vias and plated through-holes |
US6276055B1 (en) | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
GB9903146D0 (en) * | 1998-09-10 | 1999-04-07 | Williams David G | Method and apparatus for applying a viscous or paste material onto a substrate |
US6281488B1 (en) * | 1998-12-09 | 2001-08-28 | Sandia Corporation | Fiber optic coupled optical sensor |
JP4110663B2 (en) * | 1999-04-13 | 2008-07-02 | 旭硝子株式会社 | Vacuum degassing method for molten glass flow |
JP2000318711A (en) * | 1999-05-12 | 2000-11-21 | Kao Corp | Liquid filling method |
US6491204B1 (en) * | 1999-11-30 | 2002-12-10 | Gunter Erdmann | Stencil wiping device |
DE10196259T1 (en) * | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | filling |
JP2004501513A (en) * | 2000-05-31 | 2004-01-15 | ハネウエル・インターナシヨナル・インコーポレーテツド | Filling method |
US6454154B1 (en) * | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6589594B1 (en) * | 2000-08-31 | 2003-07-08 | Micron Technology, Inc. | Method for filling a wafer through-via with a conductive material |
US6638363B2 (en) * | 2000-11-22 | 2003-10-28 | Gunter Erdmann | Method of cleaning solder paste |
-
2001
- 2001-05-24 DE DE10196259T patent/DE10196259T1/en not_active Withdrawn
- 2001-05-24 CN CN01813666A patent/CN1444840A/en active Pending
- 2001-05-24 KR KR1020027016198A patent/KR20030007755A/en not_active Application Discontinuation
- 2001-05-24 JP JP2001588300A patent/JP2003535465A/en not_active Withdrawn
- 2001-05-24 AU AU2001264968A patent/AU2001264968A1/en not_active Abandoned
- 2001-05-24 WO PCT/US2001/016986 patent/WO2001093648A2/en active Application Filing
- 2001-08-28 TW TW090113057A patent/TW486782B/en active
- 2001-12-20 US US10/026,135 patent/US6832714B2/en not_active Expired - Fee Related
- 2001-12-20 US US10/026,338 patent/US6840425B2/en not_active Expired - Fee Related
-
2002
- 2002-01-03 US US10/039,942 patent/US6995321B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
KR20030007755A (en) | 2003-01-23 |
US20020084305A1 (en) | 2002-07-04 |
US20020088840A1 (en) | 2002-07-11 |
DE10196259T1 (en) | 2003-05-15 |
US6832714B2 (en) | 2004-12-21 |
CN1444840A (en) | 2003-09-24 |
TW486782B (en) | 2002-05-11 |
US6840425B2 (en) | 2005-01-11 |
JP2003535465A (en) | 2003-11-25 |
WO2001093648A3 (en) | 2002-05-23 |
US20020084306A1 (en) | 2002-07-04 |
US6995321B2 (en) | 2006-02-07 |
WO2001093648A2 (en) | 2001-12-06 |
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