JPS62287696A - Manufacture of multilayer printed interconnection board - Google Patents
Manufacture of multilayer printed interconnection boardInfo
- Publication number
- JPS62287696A JPS62287696A JP13138486A JP13138486A JPS62287696A JP S62287696 A JPS62287696 A JP S62287696A JP 13138486 A JP13138486 A JP 13138486A JP 13138486 A JP13138486 A JP 13138486A JP S62287696 A JPS62287696 A JP S62287696A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- drill
- drilling
- wiring board
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 238000005553 drilling Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
λ 発明の詳細な説明
〔産業上の利用分野〕
本発明は多層印刷配線板（以後、多層基板と称す）の製
造方法に係わり、とくにスルーホール貫通孔の孔あけ方
法に関する。[Detailed Description of the Invention] λ Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a method for manufacturing a multilayer printed wiring board (hereinafter referred to as a multilayer board), and particularly relates to a method for drilling through-holes. Regarding.
近年、コンピューター、通信機等機器の小形化・軽量化
を目的として、これらの機器に使用される多層基板も回
路の高密度化、効率化をはかるため３層乃至６層の多層
基板から８層乃至２０層の多層基板へと高多層化の傾向
が見られる。このため、多層基板の厚さは通常の１．６
協から３乃至６駕と高板厚化されてきている。一方、こ
れに反してスルーホール（多層基板の内層と外層の回路
を導通させる貫通孔で基板を孔あけした後、無電解めっ
き等により、電気接続させて形成する）の孔径は０．３
乃至０．６φＩと小径化する傾向となってきている。In recent years, with the aim of making computers, communication devices, and other devices smaller and lighter, the multilayer boards used in these devices have changed from 3 to 6 layers to 8 layers in order to increase the density and efficiency of circuits. There is a trend toward higher multilayer substrates with 20 to 20 layers. Therefore, the thickness of the multilayer board is 1.6
Since then, the plate thickness has been increased to 3 to 6 pieces. On the other hand, on the other hand, the hole diameter of a through hole (formed by drilling a hole in the board and electrically connecting it by electroless plating etc. to connect the circuit between the inner layer and the outer layer of a multilayer board) is 0.3.
There is a trend toward smaller diameters, from 0.6φI to 0.6φI.
さらに回路パターンの高密度化、高精度化により当然な
がらスルーホールの孔あけ位置の精度の向上が必要とな
ってきている。従来、多層基板にスルーホール用の孔を
穿孔するには、数値制御装置付きのボール盤等を使用し
、多層基板の上面からドリルを往復１回上下動させて貫
通孔を形成していた。Furthermore, as circuit patterns become denser and more precise, it is naturally necessary to improve the accuracy of the drilling positions of through holes. Conventionally, in order to drill holes for through-holes in a multilayer board, a drill press or the like equipped with a numerical control device was used, and the drill was moved up and down once in a reciprocating manner from the top surface of the multilayer board to form the through-holes.
このため、０．３乃至０，６φ鴨の小径のドリルで高板
厚の多層基板を孔あけする際、小径ドリルの強度不足に
よりドリルが曲がり易く、孔位置精度の低下やドリルの
折損が発生し易いと云う欠点を有していた。For this reason, when drilling holes in multilayer boards with high thickness using a small diameter drill of 0.3 to 0.6φ, the drill tends to bend due to the lack of strength of the small diameter drill, resulting in a decrease in hole position accuracy and breakage of the drill. It had the disadvantage of being easy to use.
本発明の目的はこれら従来の欠点を解消した。多層基板
の製造方法を提供することにある。The object of the present invention is to overcome these conventional drawbacks. An object of the present invention is to provide a method for manufacturing a multilayer board.
本発明によれば、多層印刷配線板の対向する周辺部のほ
ぼ中央に穿孔した一対の孔に、断面十字状に貫通植立さ
せた位置決めピンと、上記位置決めピンの突出部と一致
する貫通孔を設けたテーブルに、上記位置決めピンと貫
通孔を基準として上記配線板を載置固定する工程と、上
記配線板の厚みの略１／２までドリルで穿孔して第１の
穴を孔あけする工程と、上記配線板を反転させて上記位
置決めピンと貫通孔とを基準に第１の穴と同位置に配線
板の他面より第１の穴の径よりわずかに大きな径のドリ
ルを用いて第２の穴を穿孔してスルーホール貫通孔を形
成する工程とを有することを特徴とする多層印刷配線板
の製造方法が得られる。According to the present invention, a pair of holes bored approximately at the center of opposing peripheral parts of a multilayer printed wiring board are provided with a positioning pin having a cross-shaped cross section and a through hole that coincides with the protrusion of the positioning pin. placing and fixing the wiring board on a provided table with reference to the positioning pins and through holes; and drilling a first hole to approximately 1/2 the thickness of the wiring board. , Turn the wiring board over and use a drill with a diameter slightly larger than the diameter of the first hole to drill a second hole from the other side of the wiring board at the same position as the first hole with reference to the positioning pin and through hole. A method for producing a multilayer printed wiring board is obtained, which comprises a step of drilling holes to form through-holes.
以下、本発明について図面を参照して説明する。 Hereinafter, the present invention will be explained with reference to the drawings.
第１図は多層基板をボール盤等のテーブルに位置決め固
定した状態を説明する平面図であり、第２図はその側面
図である。先ず一対の位置決めピン１を多層基板２の下
面より突出するように植立させ、この位置決めピン１を
ボール盤等のテーブル３に設けた一対の基準孔４に挿入
して、多層基板２をテーブル３上に位置決めした状態で
固定する。FIG. 1 is a plan view illustrating a state in which a multilayer board is positioned and fixed on a table such as a drilling machine, and FIG. 2 is a side view thereof. First, a pair of positioning pins 1 are planted so as to protrude from the bottom surface of the multilayer board 2, and the positioning pins 1 are inserted into a pair of reference holes 4 provided in a table 3 of a drilling machine, etc., and the multilayer board 2 is placed on the table 3. Fix it in the upper position.
次に、第３図の如く多層基板２の板厚の略１／２までド
リル５によ、？＠１の穴６の穴あけを行う。Next, as shown in FIG. 3, use the drill 5 to approximately 1/2 the thickness of the multilayer board 2. Drill hole 6 in @1.
次に、多層基板２をテーブル３より取り外し、位置決め
ピン１を反対方向、すなわち上面部に突出する様に移動
させた後、多層基板２を反転して再びテーブル３上に位
置決め固定する。従ってテーブル３上の多層基板２のセ
ット状態は第１の穴６の穴あけ時と較べ、上下両面の位
置は逆となるが、それ以外は第１図および第２図と同じ
状態である。Next, the multilayer substrate 2 is removed from the table 3, the positioning pins 1 are moved in the opposite direction, that is, so as to protrude toward the upper surface, and then the multilayer substrate 2 is reversed and positioned and fixed on the table 3 again. Therefore, the set state of the multilayer substrate 2 on the table 3 is the same as that shown in FIGS. 1 and 2, except that the positions of the upper and lower surfaces are reversed compared to when the first hole 6 is made.
次に第４図の如く第１の穴６と同位置く第２の貫通孔７
の孔あけを行う。Next, as shown in FIG. 4, a second through hole 7 is formed at the same position as the first hole 6.
Drill the holes.
この際、第１の穴６の穴あけ時と同じ径のドリル５を使
用するとドリル５の曲がりやボール盤のテーブル３の位
置決め精度の誤差などにより第５図の如く孔壁内に段差
部８が生じる。この現象を避けるため、本発明による孔
あけ方法に於いて第２の貫通孔７の孔あけに使用するド
リル５は第１の穴あけに使用したドリル５の径よりわず
かに大きな径のものを用いる。At this time, if a drill 5 with the same diameter as that used when drilling the first hole 6 is used, a stepped portion 8 will occur in the hole wall as shown in Fig. 5 due to bending of the drill 5 or errors in positioning accuracy of the table 3 of the drilling machine. . In order to avoid this phenomenon, in the drilling method according to the present invention, the drill 5 used for drilling the second through hole 7 is of a diameter slightly larger than that of the drill 5 used for drilling the first hole. .
本方法によれば従来の孔あけ方法に較べ貫通孔７の孔あ
け時のドリル５の切削抵抗は未貫通の穴６がおいている
ために軽減され、かつ切粉の量も半減する。従ってドリ
ル折れが生じて令名困難であった極めて小径のスルーホ
ール用孔あけも容易に可能となる。また、従来の孔あけ
方法によればドリル５の曲がり作用により上面の孔の位
置精度より下面の孔の位置精度が極端に悪化する傾向が
見られるが、本発明による灯あけ方法によれば第１の穴
６が第２の貫通孔７の案内の役目をするため、ドリル５
の曲がりが矯正される効果がある。According to this method, compared to conventional drilling methods, the cutting resistance of the drill 5 when drilling the through hole 7 is reduced due to the presence of the unpierced hole 6, and the amount of chips is also halved. Therefore, it is now possible to easily drill through-holes with extremely small diameters, which has been difficult to achieve due to drill breakage. Furthermore, according to the conventional drilling method, the positional accuracy of the hole on the bottom surface tends to be extremely worse than the positional accuracy of the hole on the top surface due to the bending action of the drill 5, but according to the method for drilling holes according to the present invention, Since the first hole 6 serves as a guide for the second through hole 7, the drill 5
It has the effect of correcting the curvature of.
従って多層基板の表裏面共にほぼ同等の孔の位置精度が
得られる。Therefore, substantially the same hole position accuracy can be obtained on both the front and back surfaces of the multilayer substrate.
以上説明したように本発明によれば、高板厚の多層基板
の比較的小径のスルーホール貫通孔の孔あけにおいての
ドリル折れを低減することができ、多層基板の表裏面の
孔の位置精度の向上ができる等の効果がある。As explained above, according to the present invention, it is possible to reduce drill breakage when drilling relatively small-diameter through-holes in a thick multilayer board, and to improve the positional accuracy of holes on the front and back surfaces of the multilayer board. This has the effect of improving
【図面の簡単な説明】
第１図は多層基板をボール盤等のテーブルに位置決め固
定した状態を説明する平面図、第２図は第１図の側面図
、第３図および第４図は本発明による孔あけ方法を説明
した断面図、第５図は従来例の段差部を有する貫通孔の
拡大断面図である。
図中の符号、１・・・・・・位置決めピン、２・・・・
・・多層基板、３・・・・・・テーブル、４−−−−−
−基準孔、５・・・・・・ドリル、６・・・・・・穴、
７・・・・・・貫通孔、８・・・・・・段差部。
牛 １ 図
第２ 図
第 ３ 図
牛４ ■[BRIEF DESCRIPTION OF THE DRAWINGS] Figure 1 is a plan view illustrating the state in which the multilayer board is positioned and fixed on a table such as a drilling machine, Figure 2 is a side view of Figure 1, and Figures 3 and 4 are according to the present invention. FIG. 5 is an enlarged sectional view of a conventional through hole having a stepped portion. Symbols in the diagram: 1...Positioning pin, 2...
...Multilayer board, 3...Table, 4------
-Reference hole, 5... drill, 6... hole,
7...Through hole, 8...Step part. Cow 1 Figure 2 Figure 3 Cow 4 ■
Claims (1)
た一対の孔に、断面十字状に貫通植立させた位置決めピ
ンと、前記位置決めピンの突出部と一致する貫通孔を設
けたテーブルに、前記位置決めピンと貫通孔を基準とし
て前記配線板を載置固定する工程と、前記配線板の厚み
の略１／２までドリルで穿孔して第１の穴を孔あけする
工程と、前記配線板を反転させて前記位置決めピンと貫
通孔とを基準に第１の穴と同位置に配線板の他面より第
１の穴の径よりわずかに大きな径のドリルを用いて第２
の穴を穿孔してスルーホール貫通孔を形成する工程とを
有することを特徴とする多層印刷配線板の製造方法。A pair of holes drilled approximately at the center of opposing peripheral areas of a multilayer printed wiring board are provided with a positioning pin having a cross-shaped cross section and a through hole that matches the protrusion of the positioning pin. a step of mounting and fixing the wiring board using the positioning pins and through holes as a reference; a step of drilling a first hole by drilling to approximately 1/2 of the thickness of the wiring board; and a step of reversing the wiring board. Then, using a drill with a diameter slightly larger than the diameter of the first hole, drill a second hole from the other side of the wiring board at the same position as the first hole based on the positioning pin and the through hole.
1. A method for manufacturing a multilayer printed wiring board, comprising the step of: forming a through hole by drilling a hole in the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13138486A JPS62287696A (en) | 1986-06-05 | 1986-06-05 | Manufacture of multilayer printed interconnection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13138486A JPS62287696A (en) | 1986-06-05 | 1986-06-05 | Manufacture of multilayer printed interconnection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62287696A true JPS62287696A (en) | 1987-12-14 |
Family
ID=15056694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13138486A Pending JPS62287696A (en) | 1986-06-05 | 1986-06-05 | Manufacture of multilayer printed interconnection board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62287696A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
-
1986
- 1986-06-05 JP JP13138486A patent/JPS62287696A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6797224B2 (en) | 2000-05-31 | 2004-09-28 | Ttm Advanced Technologies, Inc. | Heated filling method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
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