JP2000318711A - Liquid filling method - Google Patents

Liquid filling method

Info

Publication number
JP2000318711A
JP2000318711A JP11132016A JP13201699A JP2000318711A JP 2000318711 A JP2000318711 A JP 2000318711A JP 11132016 A JP11132016 A JP 11132016A JP 13201699 A JP13201699 A JP 13201699A JP 2000318711 A JP2000318711 A JP 2000318711A
Authority
JP
Japan
Prior art keywords
liquid
flow path
nozzle
filling
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11132016A
Other languages
Japanese (ja)
Inventor
Yoshihiro Araki
義博 荒木
Mikio Kobayashi
三喜雄 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kao Corp
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Priority to JP11132016A priority Critical patent/JP2000318711A/en
Publication of JP2000318711A publication Critical patent/JP2000318711A/en
Pending legal-status Critical Current

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  • Supply Of Fluid Materials To The Packaging Location (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Nozzles (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent a fluid flow path used for filling a liquid from being clogged by heating the flow path for use in a liquid filling method. SOLUTION: A liquid filling apparatus 10 fills a high temperature liquid (a liquid comprising a material which solidifies at an ordinary temperature) which is pressure-fed from a tank by a pump into a container 1 by a filling nozzle 11. The nozzle 11 has a heating wire 12 (heating means) embedded along a full length L of its flow path 11A to allow the path 11A to be heated. That is, the flow path 11A of the filling nozzle 11 is heated by the heating wire 12 for use. Therefore, even if supply of the high temperature liquid is stopped by interruption of filling or the like, the flow path 11A does not lower in temperature, so that the liquid attaching to the vicinity of an exit of the flow path 11A may not solidify nor the liquid left in the flow path 11A may solidify, resulting in no clogging in the nozzle 11. In addition, by heating the flow path 11A only when the liquid does not flow, deterioration in liquid quality due to overheat of the flow path 11A while the liquid flows can be avoided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は油脂製品、石鹸等の
ための液体充填方法及び液体充填ノズルに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid filling method and a liquid filling nozzle for oil and fat products, soaps and the like.

【０００２】[0002]

【従来の技術】従来、常温で固化する液体を充填ノズル
等を用いて充填する充填装置では、充填の中断等に際し
て高温液体の供給が止まると、充填ノズル等が低温にな
り、ノズルの流路の出口の周辺に付着した液体が固化
し、或いはノズルの流路の中に留められた液体が固化す
る等により、ノズルのつまりを生じ易い。2. Description of the Related Art Conventionally, in a filling apparatus for filling a liquid which solidifies at room temperature by using a filling nozzle or the like, when the supply of a high-temperature liquid is stopped when the filling is interrupted or the like, the temperature of the filling nozzle or the like becomes low and the flow path of the nozzle becomes low. The liquid adhering around the outlet of the nozzle is solidified, or the liquid retained in the flow path of the nozzle is solidified.

【０００３】尚、液体充填ノズルの流路の出口に溶剤を
供給して該流路の出口における液体の付着固化を防止す
るもの（特開平6-170292 ）があるが、溶剤を供給する
複雑な構成を必要とする他、流路の内部でのつまりは防
止できない。また、液体供給管に２つの充填ノズルを並
列に接続し、それら２つのノズルを交互に用いることに
より、液体供給管の流れを止めないようにしてつまりを
防止するもの（特公昭51-45265）があるが、液体供給管
のつまりを充填の停止時には防止できないし、ノズルの
つまりは防止できない。There is a liquid supply nozzle which supplies a solvent to the outlet of a flow channel to prevent the liquid from adhering and solidifying at the outlet of the flow channel (JP-A-6-170292). In addition to requiring a configuration, clogging inside the flow channel cannot be prevented. In addition, two filling nozzles are connected in parallel to the liquid supply pipe, and the two nozzles are used alternately to prevent the flow of the liquid supply pipe from being stopped to prevent clogging (Japanese Patent Publication No. 51-45265). However, clogging of the liquid supply pipe cannot be prevented when filling is stopped, and clogging of the nozzle cannot be prevented.

【０００４】[0004]

【発明が解決しようとする課題】本発明の課題は、液体
の充填に用いられる流路のつまりを防止することにあ
る。SUMMARY OF THE INVENTION An object of the present invention is to prevent clogging of a flow path used for filling a liquid.

【０００５】[0005]

【課題を解決するための手段】請求項１に記載の本発明
に係る液体充填方法は、液体流路を加熱して用いるよう
にしたものである。According to a first aspect of the present invention, there is provided a liquid filling method in which a liquid flow path is heated and used.

【０００６】[0006]

【発明の実施の形態】液体充填装置１０は、図１に示す
如く、不図示のタンクから不図示のポンプにより圧送さ
れてくる高温液体（常温では固化する物質からなる液
体）を充填ノズル１１により容器１に充填する。尚、容
器１に充填された液体は、その後凝固点以下の常温に降
温し、容器１内で固化する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS As shown in FIG. 1, a liquid filling apparatus 10 uses a filling nozzle 11 to supply a high-temperature liquid (a liquid that solidifies at room temperature) pumped from a tank (not shown) by a pump (not shown). Fill container 1. The liquid filled in the container 1 is cooled to a room temperature below the freezing point and solidified in the container 1.

【０００７】然るに、充填ノズル１１は、図２に示す如
く、その流路１１Ａの全長Ｌに渡り、ニクロム線等の電
熱線１２（加熱手段）を埋設され、流路１１Ａを加熱可
能としている。電熱線１２は、ノズル１１の外周面に連
続するように設けた溝１１Ｂに埋設され、接着剤１１Ｃ
で固定化される。このとき、充填ノズル１１が金属等の
通電性材料からなるときには、電熱線１２もしくは溝１
１Ｂに電気絶縁処理を行なう。他方、充填ノズル１１が
セラミック等の非通電性材料からなるときには、電熱線
１２、溝１１Ｂに電気絶縁処理は必要ない。尚、電熱線
１２は、溶融金属を溝１１Ｂに流し込んで溝１１Ｂに埋
設されるものであっても良い。However, as shown in FIG. 2, the filling nozzle 11 has a heating wire 12 such as a nichrome wire embedded therein over the entire length L of the flow path 11A, so that the flow path 11A can be heated. The heating wire 12 is embedded in a groove 11B provided so as to be continuous with the outer peripheral surface of the nozzle 11, and an adhesive 11C
Is fixed. At this time, when the filling nozzle 11 is made of a conductive material such as metal, the heating wire 12 or the groove 1
1B is subjected to an electrical insulation treatment. On the other hand, when the filling nozzle 11 is made of a non-conductive material such as a ceramic, the heating wire 12 and the groove 11B do not need to be electrically insulated. The heating wire 12 may be such that molten metal is poured into the groove 11B and is buried in the groove 11B.

【０００８】また、充填ノズル１１に埋設した電熱線１
２は、給電線１３を介して不図示の通電制御装置に接続
される。これにより、充填ノズル１１の表面温度を検出
し、この検出温度に応じて電熱線１２への通電タイミン
グ、通電電力を制御でき、電熱線１２は必要なタイミン
グで、必要な温度に加熱されてノズル１１の流路１１Ａ
を加熱する。このようにすることで、消費電力を節約で
きる。また、表面温度を検出せずに、目標温度に達する
電圧を予測して、一定電圧を常時加えるという方法も考
えられる。例えば、電熱線１２は、液体の非流通時にお
いてだけ流路１１Ａを加熱するものであっても良い。The heating wire 1 embedded in the filling nozzle 11
2 is connected to a power supply control device (not shown) via a power supply line 13. Thereby, the surface temperature of the filling nozzle 11 is detected, and the energizing timing and energizing power to the heating wire 12 can be controlled in accordance with the detected temperature, and the heating wire 12 is heated to a necessary temperature at a necessary timing, and the nozzle is heated. 11 flow paths 11A
Heat. By doing so, power consumption can be saved. Further, a method is also conceivable in which a voltage reaching the target temperature is predicted without detecting the surface temperature, and a constant voltage is constantly applied. For example, the heating wire 12 may heat the flow path 11A only when the liquid is not flowing.

【０００９】従って、本実施形態によれば、以下の作用
がある。 （請求項１、２、３に対応する作用効果） 液体充填ノズル１１の流路１１Ａが電熱線１２により
加熱されて用いられる。従って、充填の中断等により高
温流体の供給が止まっても、その流路１１Ａが低温にな
らず、流路１１Ａの出口の周辺に付着した液体が固化す
ることがなく、また流路１１Ａの中に留められた液体も
固化せず、ノズル１１のつまりを生じない。Therefore, according to the present embodiment, the following operations are provided. (Operation and Effect Corresponding to Claims 1, 2, and 3) The flow path 11A of the liquid filling nozzle 11 is used by being heated by the heating wire 12. Therefore, even if the supply of the high-temperature fluid is stopped due to interruption of filling or the like, the temperature of the flow channel 11A does not become low, and the liquid attached around the outlet of the flow channel 11A does not solidify. The liquid retained in the nozzle 11 does not solidify, and the nozzle 11 does not clog.

【００１０】液体充填ノズル１１は、通常、細くて長い
ため、大気中での放熱により冷えて液体の固化を生じ易
い。更に、本実施形態の充填ノズル１１は、容器１の開
口部に挿入して充填に供され、その充填終了時には容器
１の開口部から引抜かれるから、その引抜き時の大気中
での放熱により冷えて液体の固化を生じ易い。ところ
が、本実施形態では、充填ノズル１１に電熱線１２を付
帯したため、上述により、液体の固化を確実に防止で
きる。Since the liquid filling nozzle 11 is usually thin and long, it is likely to be cooled by heat radiation in the atmosphere and solidify the liquid. Furthermore, the filling nozzle 11 of the present embodiment is inserted into the opening of the container 1 and is used for filling, and is withdrawn from the opening of the container 1 when the filling is completed. Liable to solidify the liquid. However, in the present embodiment, since the heating wire 12 is attached to the filling nozzle 11, the solidification of the liquid can be reliably prevented as described above.

【００１１】（請求項４に対応する作用効果） 上述の流路１１Ａの加熱を液体の非流通時にのみ行
なうことにより、液体の流通時の流路１１Ａのオーバー
ヒートによる液体品質の劣化を回避できる。(Operation and Effect Corresponding to Claim 4) By heating the flow path 11A only when the liquid is not flowing, deterioration of the liquid quality due to overheating of the flow path 11A during the flow of the liquid can be avoided.

【００１２】また、本実施形態では、充填ノズル１１の
加熱手段として電熱線１２を採用したので、下記〜
の作用がある。In this embodiment, the heating wire 12 is used as a heating means for the filling nozzle 11, so that
Has the effect of

【００１３】電熱線１２をノズル１１の溝１１Ｂに埋
設した結果、ノズル１１の外面に電熱線１２を巻付ける
ときのような凹凸がなく、このノズル１１を容器１の開
口部に挿入して用いるとき、容器１の開口部の内面を擦
過せず、容器１の開口部と電熱線１２の電気絶縁被覆の
双方にキズを付けない。As a result of embedding the heating wire 12 in the groove 11B of the nozzle 11, there is no irregularity as when the heating wire 12 is wound around the outer surface of the nozzle 11, and this nozzle 11 is inserted into the opening of the container 1 and used. At this time, the inner surface of the opening of the container 1 is not rubbed, and both the opening of the container 1 and the electrically insulating coating of the heating wire 12 are not scratched.

【００１４】充填ノズル１１の溝１１Ｂに電熱線１２
を埋設したから、ノズル１１に一定の強度と剛性を確保
しながら、ノズル１１の肉厚をそれほど増加させず加熱
手段を付帯できた。ノズル１１の肉厚を増加させないこ
とは、ノズル１１の熱容量を小として加熱応答性を向上
できること、ノズル１１の外径に対し内径をできるだけ
大きくすることにより液体の流速を遅くして充填時の泡
の発生を抑えることができ、製品の品質を向上できる。The heating wire 12 is inserted into the groove 11B of the filling nozzle 11.
, The heating means could be attached without increasing the thickness of the nozzle 11 so much while securing a certain strength and rigidity in the nozzle 11. By not increasing the thickness of the nozzle 11, it is possible to improve the heat responsiveness by reducing the heat capacity of the nozzle 11, and to reduce the flow velocity of the liquid by making the inner diameter as large as possible with respect to the outer diameter of the nozzle 11 so as to reduce the bubble during filling. Can be suppressed, and the quality of the product can be improved.

【００１５】加熱手段としては、熱線（赤外線、近赤
外線等）（熱源を別設置）をノズル１１に放射する方
法、ノズル１１を誘導加熱する方法（コイルを熱設置）
等も採用できるが、電熱線１２を採用したことにより、
ノズル１１の内部にコンパクトに加熱手段を装備でき、
また温度調節も簡易となる。As a heating means, a method of radiating a heat ray (infrared ray, near infrared ray, etc.) (a heat source is separately installed) to the nozzle 11 and a method of inductively heating the nozzle 11 (heat installation of a coil)
Can be adopted, but by adopting the heating wire 12,
The heating means can be equipped compactly inside the nozzle 11,
In addition, temperature adjustment is simplified.

【００１６】[0016]

【発明の効果】以上のように本発明によれば、液体の充
填に用いられる流路のつまりを防止することができる。As described above, according to the present invention, clogging of the flow path used for filling the liquid can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図１】図１は液体充填装置を示す模式図である。FIG. 1 is a schematic diagram showing a liquid filling device.

【図２】図２は液体充填ノズルに付帯した電熱線を示す
模式図である。FIG. 2 is a schematic diagram showing a heating wire attached to a liquid filling nozzle.

【符号の説明】[Explanation of symbols]

１０ 液体充填装置 １１ 充填ノズル １２ 電熱線（加熱手段） Reference Signs List 10 Liquid filling device 11 Filling nozzle 12 Heating wire (heating means)

Claims (5)

【特許請求の範囲】[Claims] 【請求項１】 液体流路を加熱して用いる液体充填方
法。1. A liquid filling method for heating and using a liquid flow path. 【請求項２】 液体が常温で固化する物質からなる請求
項１記載の液体充填方法。2. The liquid filling method according to claim 1, wherein the liquid comprises a substance which solidifies at room temperature. 【請求項３】 液体の非流通時に液体流路を加熱する請
求項１又は２記載の液体充填方法。3. The liquid filling method according to claim 1, wherein the liquid flow path is heated when the liquid is not flowing. 【請求項４】 液体流路に加熱手段を付帯してなる液体
充填ノズル。4. A liquid filling nozzle having a heating means attached to a liquid flow path. 【請求項５】 加熱手段をノズルの壁面に埋め込んだ液
体充填ノズル。5. A liquid filling nozzle in which a heating means is embedded in a wall surface of the nozzle.
JP11132016A 1999-05-12 1999-05-12 Liquid filling method Pending JP2000318711A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11132016A JP2000318711A (en) 1999-05-12 1999-05-12 Liquid filling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11132016A JP2000318711A (en) 1999-05-12 1999-05-12 Liquid filling method

Publications (1)

Publication Number Publication Date
JP2000318711A true JP2000318711A (en) 2000-11-21

Family

ID=15071568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11132016A Pending JP2000318711A (en) 1999-05-12 1999-05-12 Liquid filling method

Country Status (1)

Country Link
JP (1) JP2000318711A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832714B2 (en) * 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
JP2014008990A (en) * 2012-06-28 2014-01-20 Kose Corp Filling nozzle of oil-based cosmetics

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832714B2 (en) * 2000-05-31 2004-12-21 Ttm Advanced Circuits, Inc. Heated filling device
JP2014008990A (en) * 2012-06-28 2014-01-20 Kose Corp Filling nozzle of oil-based cosmetics

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