JPS54139065A - Resist for production of metalic through hole type printed circuit board - Google Patents
Resist for production of metalic through hole type printed circuit boardInfo
- Publication number
- JPS54139065A JPS54139065A JP4593578A JP4593578A JPS54139065A JP S54139065 A JPS54139065 A JP S54139065A JP 4593578 A JP4593578 A JP 4593578A JP 4593578 A JP4593578 A JP 4593578A JP S54139065 A JPS54139065 A JP S54139065A
- Authority
- JP
- Japan
- Prior art keywords
- metalic
- resist
- production
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4593578A JPS54139065A (en) | 1978-04-20 | 1978-04-20 | Resist for production of metalic through hole type printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4593578A JPS54139065A (en) | 1978-04-20 | 1978-04-20 | Resist for production of metalic through hole type printed circuit board |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS54139065A true JPS54139065A (en) | 1979-10-29 |
JPS5713160B2 JPS5713160B2 (en) | 1982-03-15 |
Family
ID=12733117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4593578A Granted JPS54139065A (en) | 1978-04-20 | 1978-04-20 | Resist for production of metalic through hole type printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54139065A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5599796A (en) * | 1979-01-26 | 1980-07-30 | Sanwa Kagaku Kogyo Kk | Method of fabricating copper throughhhole printed circuit board |
JPS55102290A (en) * | 1979-01-26 | 1980-08-05 | Sanwa Kagaku Kogyo Kk | Ink for filling hole of copper through hole printed circuit board |
JPS61212092A (en) * | 1985-03-18 | 1986-09-20 | サンワ化学工業株式会社 | Hole stopping ink for copper through hole printed wiring board |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
-
1978
- 1978-04-20 JP JP4593578A patent/JPS54139065A/en active Granted
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5599796A (en) * | 1979-01-26 | 1980-07-30 | Sanwa Kagaku Kogyo Kk | Method of fabricating copper throughhhole printed circuit board |
JPS55102290A (en) * | 1979-01-26 | 1980-08-05 | Sanwa Kagaku Kogyo Kk | Ink for filling hole of copper through hole printed circuit board |
JPS61212092A (en) * | 1985-03-18 | 1986-09-20 | サンワ化学工業株式会社 | Hole stopping ink for copper through hole printed wiring board |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
US6797224B2 (en) | 2000-05-31 | 2004-09-28 | Ttm Advanced Technologies, Inc. | Heated filling method |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
Also Published As
Publication number | Publication date |
---|---|
JPS5713160B2 (en) | 1982-03-15 |
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