FR2684836B3 - METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. - Google Patents
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES.Info
- Publication number
- FR2684836B3 FR2684836B3 FR9115007A FR9115007A FR2684836B3 FR 2684836 B3 FR2684836 B3 FR 2684836B3 FR 9115007 A FR9115007 A FR 9115007A FR 9115007 A FR9115007 A FR 9115007A FR 2684836 B3 FR2684836 B3 FR 2684836B3
- Authority
- FR
- France
- Prior art keywords
- printed circuit
- circuit boards
- via holes
- manufacturing printed
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0126—Dispenser, e.g. for solder paste, for supplying conductive paste for screen printing or for filling holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0763—Treating individual holes or single row of holes, e.g. by nozzle
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9115007A FR2684836B3 (en) | 1991-12-04 | 1991-12-04 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR9115007A FR2684836B3 (en) | 1991-12-04 | 1991-12-04 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2684836A1 FR2684836A1 (en) | 1993-06-11 |
FR2684836B3 true FR2684836B3 (en) | 1994-03-18 |
Family
ID=9419651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR9115007A Expired - Lifetime FR2684836B3 (en) | 1991-12-04 | 1991-12-04 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS WITH VIA HOLES. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2684836B3 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6276055B1 (en) * | 1998-09-02 | 2001-08-21 | Hadco Santa Clara, Inc. | Method and apparatus for forming plugs in vias of a circuit board layer |
US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
DE10196259T1 (en) | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | filling |
JP2004501513A (en) | 2000-05-31 | 2004-01-15 | ハネウエル・インターナシヨナル・インコーポレーテツド | Filling method |
US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
DE102008056299A1 (en) * | 2008-11-07 | 2010-05-12 | Novo-Tech Gmbh & Co. Kg | Structural element, particularly for separating wall or box, has pole made of extruded material containing mixture of lignocellulose-containing fiber and plastic |
EP2844044A1 (en) * | 2013-09-03 | 2015-03-04 | Mass GmbH | System and method for filling cavities in a printed circuit board |
-
1991
- 1991-12-04 FR FR9115007A patent/FR2684836B3/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2684836A1 (en) | 1993-06-11 |
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