JPH08191184A - Manufacture of printed wiring board and manufacturing equipment - Google Patents
Manufacture of printed wiring board and manufacturing equipmentInfo
- Publication number
- JPH08191184A JPH08191184A JP271995A JP271995A JPH08191184A JP H08191184 A JPH08191184 A JP H08191184A JP 271995 A JP271995 A JP 271995A JP 271995 A JP271995 A JP 271995A JP H08191184 A JPH08191184 A JP H08191184A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- substrate
- printed
- suction stage
- conductive paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体ＬＳＩ，チップ
部品などを搭載し、かつそれらを相互配線するためのプ
リント配線板の製造方法およびその製造装置に関するも
のである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a printed wiring board for mounting semiconductor LSIs, chip parts, etc., and interconnecting them, and a manufacturing apparatus therefor.
【０００２】[0002]
【従来の技術】近年、電子機器の小型化，高密度化に伴
い、産業用にとどまらず、民生用の分野においても高密
度配線可能な基板が強く要望されるようになってきた。2. Description of the Related Art In recent years, with the miniaturization and high density of electronic equipment, there has been a strong demand for a board capable of high-density wiring not only in the industrial field but also in the consumer field.
【０００３】以下、従来の両面回路基板の製造方法につ
いて説明する。図３(A)〜(G)は従来の両面回路基板の各
製造工程における製品の断面を示したもので、10はプリ
プレグシートであり、例えば芳香族ポリアミド繊維の不
織布に熱硬化性エポキシ樹脂を含浸させた複合材からな
る基材が用いられる。11は片面にＳi系の離型剤を塗布
したプラスチックシートであり、例えばポリエチレンテ
レフタレート(以下、ＰＥＴシートと称する)が用いられ
る。12は貫通孔であり、プリプレグシート10の両面に貼
り付ける銅などの金属箔14と電気的に接続する導電ペー
スト13が充填される。A conventional method for manufacturing a double-sided circuit board will be described below. FIGS. 3 (A) to 3 (G) are cross-sectional views of products in each manufacturing process of a conventional double-sided circuit board, in which 10 is a prepreg sheet, for example, a nonwoven fabric of aromatic polyamide fiber and a thermosetting epoxy resin. A base material made of an impregnated composite material is used. Reference numeral 11 denotes a plastic sheet coated with a Si-based release agent on one side, and for example, polyethylene terephthalate (hereinafter referred to as PET sheet) is used. Reference numeral 12 is a through hole, and is filled with a conductive paste 13 that is electrically connected to a metal foil 14 such as copper attached to both surfaces of the prepreg sheet 10.
【０００４】まず、両面にＰＥＴシート11を貼り付けた
プリプレグシート10の所定の箇所に、図３(B)に示した
ように、レーザ加工法などを利用して複数の貫通孔12が
形成され、次に、図３(C)に示したように、貫通孔12に
導電ペースト13が充填される。導電ペースト13を充填す
る印刷装置を図４に示す。吸引ステージ18の上に紙シー
ト17を敷き、その上にプリプレグシート10をセットし、
ＰＥＴシート11の上に供給した導電ペースト13をスキー
ジ19で印刷する。導電ペースト13は貫通孔12内に入り込
み、充填される。First, as shown in FIG. 3 (B), a plurality of through holes 12 are formed at predetermined positions of the prepreg sheet 10 having the PET sheets 11 attached to both sides thereof, as shown in FIG. 3 (B). Then, as shown in FIG. 3C, the through holes 12 are filled with the conductive paste 13. A printing apparatus for filling the conductive paste 13 is shown in FIG. Spread the paper sheet 17 on the suction stage 18, set the prepreg sheet 10 on it,
The conductive paste 13 supplied on the PET sheet 11 is printed with a squeegee 19. The conductive paste 13 enters and is filled in the through holes 12.
【０００５】次に、図３(D)に示したように、ＰＥＴシ
ート11を剥離し、さらに、図３(E)に示したように、プ
リプレグシート10の両面に銅箔などの金属箔14を重ね
る。この状態で熱プレスにより加熱加圧することで、図
３(F)に示したように、プリプレグシート10と金属箔14
が接着され、両面の金属箔14は所定箇所に設けられた貫
通孔12に充填の導電ペースト13により電気的に接続され
る。そして、図３(G)に示したように、両面の金属箔14
を選択的にエッチングして、回路パターン15が形成さ
れ、両面回路基板16が得られる。Next, as shown in FIG. 3 (D), the PET sheet 11 is peeled off, and as shown in FIG. 3 (E), a metal foil 14 such as a copper foil is formed on both surfaces of the prepreg sheet 10. Pile up. By heating and pressurizing with a hot press in this state, as shown in FIG. 3 (F), the prepreg sheet 10 and the metal foil 14 are
Are adhered, and the metal foils 14 on both sides are electrically connected to the through holes 12 provided at predetermined positions by the filled conductive paste 13. Then, as shown in FIG. 3 (G), the metal foil 14 on both sides is
Is selectively etched to form a circuit pattern 15, and a double-sided circuit board 16 is obtained.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記従
来の印刷装置では、吸引ステージ18がプリプレグシート
10を全面で吸引固定するため、印刷しようとするプリプ
レグシート10のサイズが大きくなると、吸引ステージ18
の平面度の均一性を保つことが難しくなる。したがっ
て、スキージ19の圧力分布がプリプレグシート10の中で
ばらつくことになり、導電ペースト13の充填量のばらつ
きが生じ、抵抗値不良が発生する。However, in the above-mentioned conventional printing apparatus, the suction stage 18 has the prepreg sheet.
Since the entire surface of 10 is fixed by suction, when the size of the prepreg sheet 10 to be printed becomes large, the suction stage 18
It becomes difficult to maintain the uniformity of the flatness. Therefore, the pressure distribution of the squeegee 19 will vary within the prepreg sheet 10, and the filling amount of the conductive paste 13 will vary, resulting in a defective resistance value.
【０００７】また、貫通孔12の径が小さくなると、導電
ペースト13を埋めるためには、埋め込む圧力を大きくし
なければならないが、スキージ19の圧力分布のばらつき
が、さらに充填量を不安定にし、品質問題がしばしば発
生することが予想される。When the diameter of the through hole 12 becomes smaller, the filling pressure must be increased in order to fill the conductive paste 13. However, the variation in the pressure distribution of the squeegee 19 makes the filling amount more unstable, It is expected that quality problems will often occur.
【０００８】また、紙シート17を透過して導電ペースト
13が吸引ステージ18に付着するので、吸引能力が落ち
て、印刷不良を起こすことがあり、時々ステージを洗浄
する必要があるなどの問題があった。Further, the conductive paste is transmitted through the paper sheet 17.
Since 13 adheres to the suction stage 18, there is a problem in that the suction ability is deteriorated, printing failure may occur, and it is necessary to wash the stage from time to time.
【０００９】本発明は、上記従来技術の問題点を解決し
ようとするもので、信頼性の高い貫通孔への導電ペース
トの充填を得るプリント配線板の製造方法およびその製
造装置を提供することを目的とする。SUMMARY OF THE INVENTION The present invention is intended to solve the above-mentioned problems of the prior art, and provides a method of manufacturing a printed wiring board and a manufacturing apparatus therefor in which a highly reliable through-hole can be filled with a conductive paste. To aim.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明のプリント配線板の製造方法は、(1) 予め穿
設された１つ以上の貫通孔を有する基板を用意する工程
と、弾力性および通気性を有するシートを敷き、その上
に基板をセットする工程と、シートの下面より吸引しな
がら、貫通孔に導電ペーストを充填する工程とからなる
ことを特徴とするものである。In order to achieve the above object, a method for manufacturing a printed wiring board according to the present invention comprises (1) a step of preparing a substrate having one or more through holes preliminarily drilled; , A step of laying a sheet having elasticity and breathability and setting a substrate on the sheet, and a step of filling the through holes with the conductive paste while sucking from the lower surface of the sheet. .
【００１１】また、(2) 予め穿設された１つ以上の貫通
孔を有する基板を用意する工程と、吸引ステージの上に
弾力性および通気性を有するシートおよび紙シートを順
次重ねて敷き、その上に基板をセットする工程と、吸引
ステージで吸引しながら、貫通孔に導電ペーストを充填
する工程とからなることを特徴とするものである。Further, (2) a step of preparing a substrate having one or more through holes preliminarily drilled, and laying a sheet having elasticity and breathability and a paper sheet on the suction stage in sequence, It is characterized in that it comprises a step of setting a substrate thereon and a step of filling the through-hole with a conductive paste while sucking with a suction stage.
【００１２】次に、本発明のプリント配線板の製造装置
は、(3) 被印刷基板を載置する弾力性および通気性を有
するシートと、このシート上にセットした前記被印刷基
板をシートの下面より吸引して固定，セットする吸引手
段と、被印刷基板へ印刷する手段とからなることを特徴
とするものである。Next, in the printed wiring board manufacturing apparatus of the present invention, (3) a sheet having elasticity and breathability on which a printed substrate is placed, and the printed substrate set on this sheet It is characterized by comprising suction means for sucking from the lower surface to fix and set, and means for printing on the substrate to be printed.
【００１３】さらに、(4) 吸引ステージ、その上に順次
載置された弾力性および通気性を有するシートおよび紙
シートと、紙シート上にセットし吸引ステージで吸引し
た被印刷基板へ印刷する手段とからなることを特徴とす
るものである。Further, (4) a suction stage, a sheet and a paper sheet having elasticity and breathability which are sequentially placed on the suction stage, and means for printing on the substrate to be printed which is set on the paper sheet and sucked by the suction stage It consists of and.
【００１４】[0014]
【作用】上記構成によれば、被印刷基板の下に、弾力性
および通気性を有するシートを敷くことでステージの平
面性が直接スキージや基板に影響を与えず、スキージの
圧力が基板全面にわたり均一に保たれる。また、ステー
ジと基板の間に入ることで、導電ペーストがステージに
触れることがなくなる。According to the above construction, the flatness of the stage does not directly affect the squeegee or the substrate by laying a sheet having elasticity and breathability under the substrate to be printed, and the pressure of the squeegee is applied to the entire surface of the substrate. It is kept uniform. Further, the conductive paste does not come into contact with the stage by entering between the stage and the substrate.
【００１５】[0015]
【実施例】以下、図面を参照して実施例を詳細に説明す
る。図１は、本発明の一実施例を示したもので、１はプ
リプレグシートを固定，セットするための吸引ステー
ジ、２は弾力性および通気性を有するシート、例えば厚
手の濾紙である。３はプリプレグシート、４はプリプレ
グシート３の両面に貼り付けられたＰＥＴシート、５は
導電ペースト、６は導電ペースト５を印刷してプリプレ
グシート３に穿設した貫通孔７に充填するスキージであ
る。Embodiments will be described in detail below with reference to the drawings. FIG. 1 shows an embodiment of the present invention, in which 1 is a suction stage for fixing and setting a prepreg sheet, and 2 is a sheet having elasticity and breathability, for example, thick filter paper. 3 is a prepreg sheet, 4 is a PET sheet attached to both sides of the prepreg sheet 3, 5 is a conductive paste, and 6 is a squeegee for printing the conductive paste 5 and filling the through holes 7 formed in the prepreg sheet 3. .
【００１６】貫通孔７はレーザ加工等で開けられる。シ
ート２の厚みは0.4mmのものを使用した。プリプレグシ
ート３は、ＰＥＴシート４を貼り付けたアラミドエポキ
シ樹脂基材を使用した。The through hole 7 can be opened by laser processing or the like. The sheet 2 used had a thickness of 0.4 mm. As the prepreg sheet 3, an aramid epoxy resin base material to which the PET sheet 4 was attached was used.
【００１７】次に、本実施例の印刷動作を説明する。ま
ず、予め穿設された複数の貫通孔７を有するプリプレグ
シート３を用意する。そこで、吸引ステージ１の上に弾
力性および通気性を有するシート、ここではシート２を
敷き、その上に前記プリプレグシート３をセットする。
そして、吸引ステージ１で吸引しながら、プリプレグシ
ート３上に供給した導電ペースト５をスキージ６で印刷
し、貫通孔７に導電ペースト５を充填する。Next, the printing operation of this embodiment will be described. First, a prepreg sheet 3 having a plurality of through holes 7 formed in advance is prepared. Therefore, a sheet having elasticity and breathability, here a sheet 2 is laid on the suction stage 1, and the prepreg sheet 3 is set on the sheet.
Then, the conductive paste 5 supplied onto the prepreg sheet 3 is printed with a squeegee 6 while being sucked by the suction stage 1, and the through holes 7 are filled with the conductive paste 5.
【００１８】以上のように構成された本実施例では、厚
手のシート２が吸引ステージ１の微妙な凹凸の差を緩和
するように働き、しかも吸引力を落とさないだけの通気
性を備え、導電ペースト５の液状成分を吸収する。凹凸
の差を緩和するので導電ペースト５の充填力のばらつき
を小さくすることができ、したがって、貫通孔７への導
電ペースト５の充填量が一定となる。In the present embodiment constructed as described above, the thick sheet 2 works so as to alleviate the slight difference in the unevenness of the suction stage 1, and has the air permeability so as not to reduce the suction force, and it is electrically conductive. The liquid component of paste 5 is absorbed. Since the difference in the unevenness is relaxed, the variation in the filling force of the conductive paste 5 can be reduced, so that the filling amount of the conductive paste 5 into the through holes 7 becomes constant.
【００１９】図２は本発明の他の実施例を示したもの
で、図１と同一符号のものは同一のものを示しており、
また、８は弾力性および通気性を有するシート、例えば
ポリウレタン、９は紙シート、例えば薄葉紙である。シ
ート８の厚みは１cmのものを使用した。FIG. 2 shows another embodiment of the present invention, in which the same reference numerals as those in FIG. 1 denote the same elements.
Further, 8 is a sheet having elasticity and breathability, for example, polyurethane, and 9 is a paper sheet, for example, thin paper. The sheet 8 used had a thickness of 1 cm.
【００２０】印刷動作は図１の実施例と同じである。本
実施例においても、シート８が吸引ステージ１の微妙な
凹凸の差を緩和するように働く。また、通気性について
も全く問題なく、プリプレグシート３を固定するだけの
吸引力を生んでいる。紙シート９を用いたのは導電ペー
スト５の液状成分を吸収し易くするためである。またプ
リプレグシート３を移動させるための手段としても使用
する。The printing operation is the same as in the embodiment of FIG. Also in this embodiment, the sheet 8 works so as to alleviate a slight difference in the unevenness of the suction stage 1. In addition, there is no problem with the air permeability, and the suction force sufficient to fix the prepreg sheet 3 is produced. The reason why the paper sheet 9 is used is to make it easier to absorb the liquid component of the conductive paste 5. It is also used as a means for moving the prepreg sheet 3.
【００２１】[0021]
【発明の効果】以上説明したように、本発明によれば、
第１に、弾力性および通気性を有するシートの上に、予
め所定の箇所に貫通孔を穿設した被印刷物をセットし、
シートの下面より吸引しながら、貫通孔に導電ペースト
を充填する方法、第２に、吸引ステージの上に弾力性お
よび通気性を有するシートおよび紙シートを順次重ねて
敷き、その上に、予め所定の箇所に貫通孔を穿設した被
印刷物をセットし、吸引ステージで吸引しながら、貫通
孔に導電ペーストを充填する方法を採用することによ
り、貫通孔への導電ペーストの充填が充填度合いの高い
ところで安定して行われ、その結果、プリント配線板の
両面導通孔における抵抗値不良が低減するので歩留まり
の高いプリント配線板が得られるようになり、また吸引
ステージへの導電ペーストの付着がほとんどなくなるの
で、吸引ステージが恒久的に使用でき、メンテナンス
性，信頼性の高い、かつ生産コストの低減が可能なプリ
ント配線板を製造することができる。As described above, according to the present invention,
First, on a sheet having elasticity and breathability, a print object having through holes previously set at predetermined positions is set,
A method of filling the through holes with the conductive paste while sucking from the lower surface of the sheet. Secondly, a sheet having elasticity and air permeability and a paper sheet are sequentially laid on the suction stage, and the sheet is preliminarily predetermined. By filling the through-hole with conductive paste while setting the printing object with through-holes drilled at the locations and sucking with the suction stage, the filling of the through-hole with conductive paste is highly filled. By the way, it is carried out stably, and as a result, the resistance value defect in the double-sided conductive holes of the printed wiring board is reduced, so that the printed wiring board with a high yield can be obtained, and the adhesion of the conductive paste to the suction stage is almost eliminated. Therefore, the suction stage can be used permanently, the maintainability and reliability are high, and the production cost can be reduced. Door can be.
【図１】本発明の一実施例の印刷方法を示す図である。FIG. 1 is a diagram showing a printing method according to an embodiment of the present invention.
【図２】本発明の他の実施例の印刷方法を示す図であ
る。FIG. 2 is a diagram showing a printing method according to another embodiment of the present invention.
【図３】従来の両面回路基板の各製造工程における製品
の断面を示す図である。FIG. 3 is a diagram showing a cross section of a product in each manufacturing process of a conventional double-sided circuit board.
【図４】従来例の印刷方法を示す図である。FIG. 4 is a diagram illustrating a conventional printing method.
１…吸引ステージ、 ２，８…弾力性および通気性を有
するシート、 ３…プリプレグシート、 ４…ＰＥＴシ
ート、 ５…導電ペースト、 ６…スキージ、７…貫通
孔、 ９…紙シート。1 ... Suction stage, 2, 8 ... Elastic and breathable sheet, 3 ... Prepreg sheet, 4 ... PET sheet, 5 ... Conductive paste, 6 ... Squeegee, 7 ... Through hole, 9 ... Paper sheet.
Claims (4)
る基板を用意する工程と、弾力性および通気性を有する
シートを敷き、その上に前記基板をセットする工程と、
前記シートの下面より吸引しながら、前記貫通孔に導電
ペーストを充填する工程とからなることを特徴とするプ
リント配線板の製造方法。1. A step of preparing a substrate having one or more through-holes formed in advance, a step of laying a sheet having elasticity and breathability, and setting the substrate on the sheet.
A method of manufacturing a printed wiring board, comprising the step of filling the through holes with a conductive paste while sucking from the lower surface of the sheet.
る基板を用意する工程と、吸引ステージの上に弾力性お
よび通気性を有するシートおよび紙シートを順次重ねて
敷き、その上に前記基板をセットする工程と、前記吸引
ステージで吸引しながら、前記貫通孔に導電ペーストを
充填する工程とからなることを特徴とするプリント配線
板の製造方法。2. A step of preparing a substrate having one or more through holes preliminarily drilled, and a sheet having elasticity and breathability and a paper sheet are sequentially laid on the suction stage, and the sheet is laid on the sheet. A method of manufacturing a printed wiring board, comprising: a step of setting the substrate; and a step of filling the through hole with a conductive paste while sucking with the suction stage.
性を有するシートと、該シート上にセットした前記被印
刷基板を前記シートの下面より吸引して固定，セットす
る吸引手段と、前記被印刷基板へ印刷する手段とからな
ることを特徴とするプリント配線板の製造装置。3. A sheet having elasticity and breathability for mounting a substrate to be printed, suction means for sucking and fixing and setting the substrate to be printed set on the sheet from the lower surface of the sheet, An apparatus for manufacturing a printed wiring board, comprising: means for printing on a printed substrate.
弾力性および通気性を有するシートおよび紙シートと、
前記紙シート上にセットし前記吸引ステージで吸引した
被印刷基板へ印刷する手段とからなることを特徴とする
プリント配線板の製造装置。4. A suction stage, and an elastic and breathable sheet and a sheet which are sequentially placed on the suction stage,
An apparatus for manufacturing a printed wiring board, comprising: means for setting on the paper sheet and printing on the substrate to be printed sucked by the suction stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP271995A JPH08191184A (en) | 1995-01-11 | 1995-01-11 | Manufacture of printed wiring board and manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP271995A JPH08191184A (en) | 1995-01-11 | 1995-01-11 | Manufacture of printed wiring board and manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08191184A true JPH08191184A (en) | 1996-07-23 |
Family
ID=11537126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP271995A Pending JPH08191184A (en) | 1995-01-11 | 1995-01-11 | Manufacture of printed wiring board and manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08191184A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000021347A1 (en) * | 1998-10-07 | 2000-04-13 | Matsushita Electric Industrial Co., Ltd. | Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| JP2007123375A (en) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | Conductive paste composition, printed wiring board using the same, and manufacturing method therefor |
| JP2011071153A (en) * | 2009-09-24 | 2011-04-07 | Tanaka Kikinzoku Kogyo Kk | Method of forming through electrode of circuit board |
-
1995
- 1995-01-11 JP JP271995A patent/JPH08191184A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6598292B1 (en) | 1998-10-07 | 2003-07-29 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a circuit board using a porous sheet composed of cellulose |
| WO2000021347A1 (en) * | 1998-10-07 | 2000-04-13 | Matsushita Electric Industrial Co., Ltd. | Manufacturing method of circuit board, manufacturing apparatus for it, and porous sheet used in it |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6797224B2 (en) | 2000-05-31 | 2004-09-28 | Ttm Advanced Technologies, Inc. | Heated filling method |
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
| JP2007123375A (en) * | 2005-10-26 | 2007-05-17 | Matsushita Electric Ind Co Ltd | Conductive paste composition, printed wiring board using the same, and manufacturing method therefor |
| JP2011071153A (en) * | 2009-09-24 | 2011-04-07 | Tanaka Kikinzoku Kogyo Kk | Method of forming through electrode of circuit board |
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