JP2662440B2 - Method of manufacturing blind through hole multilayer substrate - Google Patents
Method of manufacturing blind through hole multilayer substrateInfo
- Publication number
- JP2662440B2 JP2662440B2 JP13992289A JP13992289A JP2662440B2 JP 2662440 B2 JP2662440 B2 JP 2662440B2 JP 13992289 A JP13992289 A JP 13992289A JP 13992289 A JP13992289 A JP 13992289A JP 2662440 B2 JP2662440 B2 JP 2662440B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- blind
- substrate
- manufacturing
- multilayer substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、ブラインドスルホール多層基板の製造方法
の改良に関する。Description: TECHNICAL FIELD The present invention relates to an improvement in a method for manufacturing a blind through-hole multilayer substrate.
（従来の技術） 従来、ブラインドスルホール多層基板、例えばブライ
ンド四層基板を作るには、第１図に示す如く両面に銅箔
1aの接合された基板１に穴明けして貫通孔２を形成した
後、第２図に示す如く両面及び貫通孔２に銅めっき３を
施してスルホール２′を形成し、次に第３図に示す如く
一面にエッチングによりパターン４を形成すると共にス
ルホール２′の開口縁にランド５を形成し、次いでこの
基板を二枚第４図に示す如くパターン４側を対向させて
ガラスエポキシ、BTレジン、ポリイミド、その他いずれ
かの樹脂６を介して積層し且つスルホール２′に樹脂６
を充填し、次にこの積層板７に第５図を示す如く穴明け
して貫通孔８を形成した後、第６図に示す如く両面及び
貫通孔８に銅めっき９を施してスルホール８′を形成
し、次の第７図の示す如く両面にエッチングによりパタ
ーン10を形成すると共に銅めっきしたブラインドスルホ
ール２″の開口縁にランド11を形成し、然る後積層板７
の両面に第８図に示す如く熱硬化型エポキシ樹脂又は光
硬化型エポキシ樹脂のいずれかより成るソルダーレジス
ト12を塗布して、ブラインドスルホール四層基板13を作
っていた。(Prior Art) Conventionally, in order to make a blind through-hole multilayer substrate, for example, a blind four-layer substrate, as shown in FIG.
After drilling a through hole 2 in the bonded substrate 1a of FIG. 1a, copper plating 3 is applied to both sides and the through hole 2 to form a through hole 2 'as shown in FIG. As shown in FIG. 4, a pattern 4 is formed on one surface by etching, and a land 5 is formed on the opening edge of the through hole 2 '. Then, as shown in FIG. , Polyimide, or any other resin 6 with the resin 6 in the through hole 2 '.
Then, through holes 8 are formed in the laminated plate 7 as shown in FIG. 5 to form through holes 8, and as shown in FIG. 6, copper plating 9 is applied to both sides and through holes 8 to form through holes 8 '. Then, as shown in FIG. 7, a pattern 10 is formed on both sides by etching, and a land 11 is formed at an opening edge of the copper-plated blind through-hole 2 ″.
As shown in FIG. 8, a solder resist 12 made of either a thermosetting epoxy resin or a photocurable epoxy resin was applied to both surfaces of the substrate to form a blind through-hole four-layer substrate 13.
（発明が解決しようとする課題） ところで、上記の製造方法では、銅めっき９を施した
積層板７に第７図に示す如くパターン10、ランド11を形
成した後、直ちに第８図に示す如くソルダーレジスト12
を塗布しているので、その後ソルダーコーター、部品を
載せた後の半田フロー、半田リフロー等の熱を加える工
程があると、ブラインドスルホール２″の中にある水
分、揮発分がガス化したり、基板中の水分がガス化した
りする為、ソルダーレジスト12が剥がれたり、ふくれた
りするものである。(Problems to be Solved by the Invention) In the above-described manufacturing method, a pattern 10 and a land 11 are formed on the laminated plate 7 on which the copper plating 9 is applied as shown in FIG. 7 and immediately thereafter, as shown in FIG. Solder resist 12
Then, if there is a step of applying heat such as a solder coater, a solder flow after mounting components, and a solder reflow, the moisture and volatiles in the blind through hole 2 ″ are gasified, Since the moisture in the inside gasifies, the solder resist 12 peels off or bulges.
そこで本発明は、ソルダーレジストの塗布後熱を加え
る工程があっても、ソルダーレジストが剥がれたりふく
れたりしないようにしたブラインドスルホール多層基板
の製造方法を提供しようとするものである。Accordingly, an object of the present invention is to provide a method for manufacturing a blind through-hole multilayer substrate in which the solder resist is prevented from peeling or bulging even when a step of applying heat after the application of the solder resist is provided.
（課題を解決するための手段） 上記課題を解決するための本発明のブラインドスルホ
ール多層基板の製造方法は、前記従来のブラインドスル
ホール基板の製造方法に於いて、最終工程である積層板
の両面にソルダーレジストを塗布する工程の前にベーキ
ング（乾燥）を行うことを特徴とするものである。(Means for Solving the Problems) The method for manufacturing a blind through-hole multi-layer substrate of the present invention for solving the above-mentioned problems is the same as the conventional method for manufacturing a blind through-hole substrate, except that both sides of the laminated board, which is the final step, are formed. Baking (drying) is performed before the step of applying a solder resist.
（作用） 上述の如く本発明のブラインドスルホール多層基板の
製造方法は、積層板の両面にソルダーレジストを塗布す
る工程の前にベーキング（乾燥）を行うので、ブライン
ドスルホールの水分、その他の揮発分及び基板中の水分
が蒸発する。従って、積層板の表面にソルダーレジスト
を塗布した後、ソルダーコーター、部品を載せた後の半
田フロー、半田リフロー等の熱を加える工程があって
も、ソルダーレジストが剥がれたり、ふくれたりするこ
とが無いものである。(Operation) As described above, in the method for manufacturing a blind through-hole multilayer substrate according to the present invention, baking (drying) is performed before the step of applying a solder resist to both surfaces of the laminated board. The moisture in the substrate evaporates. Therefore, even after applying a solder resist on the surface of the laminated board, there is a step of applying heat such as a solder coater, a solder flow after placing components, and a solder reflow, the solder resist may be peeled off or swollen. There is nothing.
（実施例） 本発明のブラインドスルホール多層基板の製造方法の
実施例を説明する。本発明のブラインドスルホール多層
基板の製造方法は、第１図に示す如く両面に銅箔1aの接
合された基板１に穴明けして貫通孔２を形成してから第
７図に示す如く積層板７の両面の銅めっき９にエッチン
グによりパターン10を形成すると共に銅めっきしたブラ
インドスルホール２″の開口縁にランド11を形成する迄
の工程が従来の製造方法と等しいのでその説明を省略す
る。(Example) An example of the method for manufacturing a blind through-hole multilayer substrate of the present invention will be described. As shown in FIG. 1, the method for manufacturing a blind through-hole multilayer substrate according to the present invention comprises forming a through hole 2 in a substrate 1 having copper foils 1a bonded to both sides thereof, and forming a laminated plate as shown in FIG. The process of forming the pattern 10 by etching on the copper plating 9 on both surfaces of the 7 and forming the land 11 at the opening edge of the copper-plated blind through hole 2 "is the same as the conventional manufacturing method, and therefore the description thereof will be omitted.
さて本発明のブラインドスルホール多層基板の製造方
法の実施例は、前述の第７図に示す工程を終えた後、積
層板７を90〜150℃で30〜90分間、本例では、130℃、60
分間ベーキング（乾燥）を行って、ブラインドスルホー
ル２″の水分、その他の揮発分及び基板中の水分を蒸発
させる。然る後第８図に示す如く熱硬化型エポキシ樹脂
（又は光硬化型エポキシ樹脂）より成るソルダーレジス
ト12を積層板７を両面に塗布して、ブラインドスルホー
ル四層基板13を作った。Now, in the embodiment of the method for manufacturing a blind through hole multilayer substrate of the present invention, after finishing the process shown in FIG. 7, the laminated plate 7 is heated at 90 to 150 ° C. for 30 to 90 minutes, in this example, 130 ° C. 60
The baking (drying) is performed for one minute to evaporate the moisture in the blind through hole 2 ″, other volatile components, and the moisture in the substrate. Thereafter, as shown in FIG. 8, a thermosetting epoxy resin (or a photocurable epoxy resin) is used. ) Was applied to both sides of the laminate 7 to form a blind through-hole four-layer substrate 13.
こうして作ったブラインドスルホール四層基板13を、
その後ソルダーコーターの為熱を加え、さらに部品を載
せた後半田フローのため熱を加えたが、ソルダーレジス
ト12は剥がれたり、ふくれたりすることがなかった。The blind through hole four-layer substrate 13 made in this way is
Thereafter, heat was applied for a solder coater, and further, heat was applied for solder flow after mounting components. However, the solder resist 12 did not peel off or bulge.
（発明の効果） 以上の説明で判るように本発明のブラインドスルホー
ル多層基板の製造方法によれば、ソルダーレジストの塗
布前にブラインドスルホールの水分や揮発分及び基板中
の水分等が除去されるので、ソルダーレジストを塗布し
てブラインドスルホール多層基板を作った後で、熱の加
わる工程があってもソルダーレジストが剥がれたり、ふ
くれたりすることの無いものである。(Effects of the Invention) As can be seen from the above description, according to the method for manufacturing a blind through-hole multilayer substrate of the present invention, moisture and volatiles in the blind through-hole and moisture in the substrate are removed before the application of the solder resist. After a solder resist is applied to form a blind through-hole multilayer substrate, the solder resist does not peel off or bulge even if there is a step of applying heat.
第１図乃至第８図はブラインドスルホール四層基板の製
造方法の工程を示す図である。1 to 8 are views showing steps of a method for manufacturing a four-layered blind through-hole substrate.
Claims (1)
及び貫通孔に銅めっきを施してスルホールを形成し、次
に一面にエッチングによりパターンを形成すると共にス
ルホールの開口縁にランドを形成し、次いでこの基板の
パターン側を対向させ樹脂を介して積層し且つスルホー
ルに樹脂を充填し、次にこの積層板に穴明けして貫通孔
を形成した後両面及び貫通孔に銅めっきを施してスルホ
ールを形成し、次に両面にエッチングによりパターンを
形成すると共に銅めっきしたブラインドスルホールの開
口縁にランドを形成し、然る後積層板の両面にソルダー
レジストを塗布乾燥するブラインドスルホール多層基板
の製造方法に於いて、前記積層板の両面にソルダーレジ
ストを塗布する最終工程の前にベーキングを行うことを
特徴とするブラインドスルホール多層基板の製造方法。After forming a through hole in a substrate, copper plating is applied to both surfaces and the through hole to form a through hole, and then a pattern is formed on one surface by etching, and a land is formed at an opening edge of the through hole. After that, the pattern side of this substrate is opposed to be laminated with a resin interposed therebetween, and the through hole is filled with the resin. Next, a hole is formed in the laminated plate to form a through hole, and then copper plating is applied to both surfaces and the through hole. To form a through hole, then form a pattern by etching on both sides, form a land at the opening edge of the copper plated blind through hole, and then apply and dry a solder resist on both sides of the laminate. Baking before the final step of applying a solder resist to both surfaces of the laminate. Method of manufacturing a Dosuruhoru multilayer substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992289A JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13992289A JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH034595A JPH034595A (en) | 1991-01-10 |
| JP2662440B2 true JP2662440B2 (en) | 1997-10-15 |
Family
ID=15256783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13992289A Expired - Lifetime JP2662440B2 (en) | 1989-06-01 | 1989-06-01 | Method of manufacturing blind through hole multilayer substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2662440B2 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| DE10196259T1 (en) | 2000-05-31 | 2003-05-15 | Honeywell Int Inc | filling |
| JP2004501513A (en) | 2000-05-31 | 2004-01-15 | ハネウエル・インターナシヨナル・インコーポレーテツド | Filling method |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| JP2003090391A (en) * | 2001-09-17 | 2003-03-28 | Keihin Corp | Rotatively driven shaft driving device |
| JP5306797B2 (en) * | 2008-12-26 | 2013-10-02 | 日本特殊陶業株式会社 | Manufacturing method of wiring board with built-in components |
| JP5387042B2 (en) * | 2009-02-24 | 2014-01-15 | 株式会社オートネットワーク技術研究所 | Circuit structure |
-
1989
- 1989-06-01 JP JP13992289A patent/JP2662440B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH034595A (en) | 1991-01-10 |
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