JPH0983135A - Apparatus for manufacturing through-hole board - Google Patents
Apparatus for manufacturing through-hole boardInfo
- Publication number
- JPH0983135A JPH0983135A JP23811395A JP23811395A JPH0983135A JP H0983135 A JPH0983135 A JP H0983135A JP 23811395 A JP23811395 A JP 23811395A JP 23811395 A JP23811395 A JP 23811395A JP H0983135 A JPH0983135 A JP H0983135A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- board
- substrate
- support base
- moisture absorption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、各種電子機器に用いら
れるスルーホール基板の製造装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing through-hole substrates used in various electronic devices.
【０００２】[0002]
【従来の技術】従来の、この種製造装置は図３に示す様
な構成となっていた。2. Description of the Related Art A conventional manufacturing apparatus of this type has a structure as shown in FIG.
【０００３】すなわち図３に示すごとく通気性を有する
支持台１と、この支持台１に支持される基板２上に設け
られるスクリーンマスク３と、前記支持台１の下面に連
結された吸引装置４とを備えた構成となっていた。That is, as shown in FIG. 3, a supporting base 1 having air permeability, a screen mask 3 provided on a substrate 2 supported by the supporting base 1, and a suction device 4 connected to the lower surface of the supporting base 1. It was configured with and.
【０００４】基板２には、複数の貫通孔２ａが設けられ
ており、スクリーンマスク３上に設けた導電ペースト５
をスキージ６下方へ押圧しながら摺動させ、この間同時
に吸引装置４による吸引力を働かせることにより導電ペ
ースト５を貫通孔２ａ内に導入する。The substrate 2 is provided with a plurality of through holes 2a, and the conductive paste 5 provided on the screen mask 3 is formed.
Is pressed and slid downwardly of the squeegee 6, and during this time, the conductive paste 5 is introduced into the through hole 2a by simultaneously exerting a suction force by the suction device 4.
【０００５】これにより貫通孔２ａ内においてはその内
壁部に導電ペースト５が残り、これにより基板２の表裏
を導通する導電路が形成される。As a result, the conductive paste 5 remains on the inner wall portion of the through hole 2a, thereby forming a conductive path for conducting the front and back of the substrate 2.
【０００６】[0006]
【発明が解決しようとする課題】上記構成において一旦
貫通孔２ａ内に充填された導電ペースト５の大部分は吸
引装置４の吸引力により支持台１側に吸引排出されるこ
とになるのであるが、この時、その一部が基板２の裏面
の貫通孔２ａの外周に、にじみながら広がってしまい、
これが基板２の裏面側における不用意な導電路の形成と
いう事態を引き起こすという問題があった。In the above structure, most of the conductive paste 5 once filled in the through hole 2a is sucked and discharged to the support base 1 side by the suction force of the suction device 4. At this time, a part thereof spreads on the outer periphery of the through hole 2a on the back surface of the substrate 2 while bleeding,
There is a problem in that this causes a situation in which an inadvertent conductive path is formed on the back surface side of the substrate 2.
【０００７】そこで本発明は、基板の裏面側における不
用意な導電路の形成を防止することを目的とするもので
ある。Therefore, the present invention has an object to prevent the formation of an inadvertent conductive path on the back surface side of a substrate.
【０００８】[0008]
【課題を解決するための手段】そして、この目的を達成
するために、本発明は支持台と基板の間に吸湿体を介在
させたものである。In order to achieve this object, the present invention has a hygroscopic body interposed between a support and a substrate.
【０００９】[0009]
【作用】そして、この構成とすれば、基板の裏面側にお
いて貫通孔外周に広がろうとする導電ペーストを吸湿体
が吸い取ってしまうので、その結果として基板の裏面側
における不用意な導電路は形成されなくなる。With this structure, the hygroscopic body absorbs the conductive paste that tends to spread to the outer periphery of the through hole on the back surface side of the substrate, and as a result, an inadvertent conductive path is formed on the back surface side of the substrate. It will not be done.
【００１０】[0010]
【実施例】図１、図２において、７は印刷ステージで、
その中央部には長方形の開口部７ａが設けられている。
この開口部７ａ内には、鉄板にＣｒメッキを施して形成
した、支持台８が固定されている。この支持台８上に
は、吸湿体として用いた吸湿紙９が設けられている。こ
の吸湿紙９は、給紙ローラ１０に巻かれたものであって
後述する基板１枚毎に巻き取りローラ１１に巻かれて移
動するようになっている。さて支持台８上には複数の貫
通孔１２ａを有する基板１２が支持され、その上にスク
リーンマスク１３が対向位置させられるようになってい
る。この状態において基板１２の貫通孔１２ａと支持台
８に設けた貫通孔８ａは、その中心軸をほぼ一致させた
状態で対向位置させられた状態となっている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIGS. 1 and 2, 7 is a printing stage,
A rectangular opening 7a is provided at the center thereof.
A support base 8, which is formed by plating an iron plate with Cr, is fixed in the opening 7a. A hygroscopic paper 9 used as a hygroscopic body is provided on the support base 8. This hygroscopic paper 9 is wound around a paper feed roller 10 and is wound around a take-up roller 11 and moved for each substrate described later. A substrate 12 having a plurality of through holes 12a is supported on the support 8, and a screen mask 13 is placed on the substrate 12 so as to face it. In this state, the through hole 12a of the substrate 12 and the through hole 8a provided in the support base 8 are in a state of being opposed to each other with their central axes substantially aligned.
【００１１】ただし、支持台８の貫通孔８ａの方が基板
１２の貫通孔１２ａよりも大きくしている。さて、この
状態において、印刷ステージ７の下面には吸引装置１４
が設けられており、従来と同様、スキージ１５で導電ペ
ースト１６をスクリーンマスク１３を介して基板１２側
に押圧するとともに、吸引装置１４による吸引を行なえ
ば、導電ペースト１６が基板１２の貫通孔１２ａ内に流
入することになる。貫通孔１２ａ内に流入した導電ペー
スト１６は、貫通孔１２ａの内壁面への付着を残して貫
通孔１２ａの下面方向に流出していくこととなる。However, the through hole 8a of the support base 8 is larger than the through hole 12a of the substrate 12. Now, in this state, the suction device 14 is provided on the lower surface of the printing stage 7.
When the conductive paste 16 is pressed by the squeegee 15 to the substrate 12 side through the screen mask 13 and suction is performed by the suction device 14, the conductive paste 16 is provided in the through hole 12a of the substrate 12 as in the conventional case. It will flow in. The conductive paste 16 that has flowed into the through hole 12a flows out toward the lower surface of the through hole 12a, leaving the adhesion to the inner wall surface of the through hole 12a.
【００１２】この時、貫通孔１２ａの下面側には、吸湿
紙９が設けられており、この吸湿紙９は不織布のように
たくさんの吸湿空間を持っており、よってここに貫通孔
１２ａから流出する導電ペーストは、吸収されることに
なる。この結果、基板１２の裏面側においては不用意な
導電路の形成がされなくなるのである。そして次工程に
おいてはこの基板１２が移動させられ、新たな基板１２
が支持台８上に支持されることになるのであるが、その
前に、巻き取りローラ１１により、吸湿済の吸湿紙９部
分が巻き取られ、新たな吸湿紙が支持台８上に位置させ
られることになっており、以後同じような動作が繰り返
されるのである。At this time, the hygroscopic paper 9 is provided on the lower surface side of the through hole 12a, and the hygroscopic paper 9 has a lot of hygroscopic space like non-woven fabric, and therefore flows out through the through hole 12a. The conductive paste to be absorbed will be absorbed. As a result, inadvertent formation of the conductive path is not formed on the back surface side of the substrate 12. Then, in the next step, this substrate 12 is moved and a new substrate 12
Will be supported on the support base 8, but before that, the take-up roller 11 winds up the part of the absorbent paper 9 that has been absorbed, and a new absorbent paper is placed on the support base 8. The same operation is repeated thereafter.
【００１３】[0013]
【発明の効果】以上のように、本発明は支持台と基板の
間に吸湿体を介在させたものであり、この構成とすれ
ば、基板の裏面側において貫通孔外周に広がろうとする
導電ペーストを吸湿体が吸い取ってしまうので、その結
果として基板の裏面側における不用意な導電路は形成さ
れなくなる。As described above, according to the present invention, the hygroscopic body is interposed between the support and the substrate. With this structure, the conductive material that tends to spread to the outer periphery of the through hole on the back side of the substrate. Since the hygroscopic body absorbs the paste, the careless conductive path on the back surface side of the substrate is not formed as a result.
【図１】本発明の実施例における斜視図FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】図１の断面図FIG. 2 is a sectional view of FIG.
【図３】従来例の断面図FIG. 3 is a sectional view of a conventional example.
８ 支持台 ９ 吸湿紙 １２ 基板 １２ａ 貫通孔 １３ スクリーンマスク １４ 吸引装置 8 Support Base 9 Moisture Absorption Paper 12 Substrate 12a Through Hole 13 Screen Mask 14 Suction Device
───────────────────────────────────────────────────── フロントページの続き (72)発明者 遠藤 謙二 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kenji Endo 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (3)
支持される基板上に設けられるスクリーンマスクと、前
記支持台の下面に連結された吸引装置とを備え、前記支
持台と基板との間に吸湿体を介在させたスルーホール基
板の製造装置。1. A support base having air permeability, a screen mask provided on a substrate supported by the support base, and a suction device connected to a lower surface of the support base, the support base and the substrate. Equipment for manufacturing through-hole boards with a hygroscopic body interposed between them.
けた請求項１に記載のスルーホール基板の製造装置。2. The manufacturing apparatus for a through-hole substrate according to claim 1, wherein the hygroscopic body is provided on the support base in a replaceable state.
巻き取りローラに巻き取られる構成となっている請求項
１又は２に記載のスルーホール基板の製造装置。3. The through-hole substrate manufacturing apparatus according to claim 1, wherein the hygroscopic body is wound around a paper feed roller, and the leading end side is wound around a winding roller.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23811395A JPH0983135A (en) | 1995-09-18 | 1995-09-18 | Apparatus for manufacturing through-hole board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23811395A JPH0983135A (en) | 1995-09-18 | 1995-09-18 | Apparatus for manufacturing through-hole board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0983135A true JPH0983135A (en) | 1997-03-28 |
Family
ID=17025375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23811395A Pending JPH0983135A (en) | 1995-09-18 | 1995-09-18 | Apparatus for manufacturing through-hole board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0983135A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| KR101021222B1 (en) * | 2010-01-28 | 2011-03-11 | 한국생산기술연구원 | Wafer through via hole filling apparatus and filling method using the same |
| WO2013009064A2 (en) * | 2011-07-12 | 2013-01-17 | 한국생산기술연구원 | Apparatus for filling a wafer via with solder and having a pressure unit, and method for filling a wafer via with solder using same |
-
1995
- 1995-09-18 JP JP23811395A patent/JPH0983135A/en active Pending
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6454154B1 (en) | 2000-05-31 | 2002-09-24 | Honeywell Advanced Circuits, Inc. | Filling device |
| US6506332B2 (en) | 2000-05-31 | 2003-01-14 | Honeywell International Inc. | Filling method |
| US6793852B2 (en) | 2000-05-31 | 2004-09-21 | Ttm Advanced Circuits, Inc. | Scavenging method |
| US6800232B2 (en) | 2000-05-31 | 2004-10-05 | Ttm Advanced Circuits, Inc. | PCB support plate method for PCB via fill |
| US6832714B2 (en) | 2000-05-31 | 2004-12-21 | Ttm Advanced Circuits, Inc. | Heated filling device |
| US6840425B2 (en) | 2000-05-31 | 2005-01-11 | Ttm Advanced Circuits, Inc. | Scavenging system |
| US6855385B2 (en) | 2000-05-31 | 2005-02-15 | Ttm Advanced Circuits, Inc. | PCB support plate for PCB via fill |
| US6921505B2 (en) | 2000-05-31 | 2005-07-26 | Ttm Advanced Circuits, Inc. | Hole filling using an etched hole-fill stand-off |
| US6995321B2 (en) | 2000-05-31 | 2006-02-07 | Honeywell Advanced Circuits | Etched hole-fill stand-off |
| US7066378B2 (en) | 2000-05-31 | 2006-06-27 | Ttm Advanced Circuits, Inc. | Filling device |
| KR101021222B1 (en) * | 2010-01-28 | 2011-03-11 | 한국생산기술연구원 | Wafer through via hole filling apparatus and filling method using the same |
| WO2013009064A2 (en) * | 2011-07-12 | 2013-01-17 | 한국생산기술연구원 | Apparatus for filling a wafer via with solder and having a pressure unit, and method for filling a wafer via with solder using same |
| WO2013009064A3 (en) * | 2011-07-12 | 2013-03-14 | 한국생산기술연구원 | Apparatus for filling a wafer via with solder and having a pressure unit, and method for filling a wafer via with solder using same |
| US9603254B2 (en) | 2011-07-12 | 2017-03-21 | Korea Institute Of Industrial Technology | Apparatus for filling a wafer via with solder |
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