US6592776B1
(en)
*
|
1997-07-28 |
2003-07-15 |
Cabot Microelectronics Corporation |
Polishing composition for metal CMP
|
IL147039A0
(en)
*
|
1999-07-07 |
2002-08-14 |
Cabot Microelectronics Corp |
Cmp composition containing silane modified abrasive particles
|
JP2003522424A
(ja)
|
2000-02-02 |
2003-07-22 |
ロデール ホールディングス インコーポレイテッド |
研磨組成物
|
US6646348B1
(en)
*
|
2000-07-05 |
2003-11-11 |
Cabot Microelectronics Corporation |
Silane containing polishing composition for CMP
|
WO2002061810A1
(en)
*
|
2001-01-16 |
2002-08-08 |
Cabot Microelectronics Corporation |
Ammonium oxalate-containing polishing system and method
|
US6656241B1
(en)
*
|
2001-06-14 |
2003-12-02 |
Ppg Industries Ohio, Inc. |
Silica-based slurry
|
TW591089B
(en)
*
|
2001-08-09 |
2004-06-11 |
Cheil Ind Inc |
Slurry composition for use in chemical mechanical polishing of metal wiring
|
US6953389B2
(en)
*
|
2001-08-09 |
2005-10-11 |
Cheil Industries, Inc. |
Metal CMP slurry compositions that favor mechanical removal of oxides with reduced susceptibility to micro-scratching
|
EP1296443B1
(de)
|
2001-09-19 |
2006-10-04 |
Parker Hannifin Corporation |
Motorantrieb und System
|
TW200300168A
(en)
*
|
2001-10-31 |
2003-05-16 |
Hitachi Chemical Co Ltd |
Polishing fluid and polishing method
|
JP2003277731A
(ja)
*
|
2002-03-26 |
2003-10-02 |
Catalysts & Chem Ind Co Ltd |
研磨用粒子および研磨材
|
US6716771B2
(en)
*
|
2002-04-09 |
2004-04-06 |
Intel Corporation |
Method for post-CMP conversion of a hydrophobic surface of a low-k dielectric layer to a hydrophilic surface
|
US6833186B2
(en)
|
2002-04-10 |
2004-12-21 |
Ppg Industries Ohio, Inc. |
Mineral-filled coatings having enhanced abrasion resistance and wear clarity and methods for using the same
|
JP4554142B2
(ja)
*
|
2002-04-30 |
2010-09-29 |
日揮触媒化成株式会社 |
基板洗浄用粒子および該基板洗浄用粒子を含む洗浄材、基材の洗浄方法
|
US6706398B1
(en)
*
|
2002-09-13 |
2004-03-16 |
Dow Corning Corporation |
Organosilicon compounds and blends for treating silica
|
KR100442549B1
(ko)
*
|
2002-10-16 |
2004-07-30 |
제일모직주식회사 |
연마성능이 우수하고 안정성이 향상된, 금속 연마를 위한cmp용 슬러리 조성물 및 그 제조방법
|
US6893476B2
(en)
|
2002-12-09 |
2005-05-17 |
Dupont Air Products Nanomaterials Llc |
Composition and associated methods for chemical mechanical planarization having high selectivity for metal removal
|
US7044836B2
(en)
|
2003-04-21 |
2006-05-16 |
Cabot Microelectronics Corporation |
Coated metal oxide particles for CMP
|
US20070015448A1
(en)
*
|
2003-08-07 |
2007-01-18 |
Ppg Industries Ohio, Inc. |
Polishing pad having edge surface treatment
|
IL157681A0
(en)
|
2003-09-01 |
2004-03-28 |
J G Systems Inc |
Improved abrasives for chemical-mechanical polishing applications
|
US7247567B2
(en)
*
|
2004-06-16 |
2007-07-24 |
Cabot Microelectronics Corporation |
Method of polishing a tungsten-containing substrate
|
FR2872823B1
(fr)
*
|
2004-07-08 |
2006-10-06 |
Kemesys |
Composition de polissage mecano chimique, procede de preparation, et utilisation
|
US20060096179A1
(en)
*
|
2004-11-05 |
2006-05-11 |
Cabot Microelectronics Corporation |
CMP composition containing surface-modified abrasive particles
|
KR100704831B1
(ko)
*
|
2005-06-01 |
2007-04-09 |
주식회사 아이너스기술 |
3차원 스캐너를 이용한 실시간 검사 안내 시스템 및 방법
|
US7294049B2
(en)
|
2005-09-01 |
2007-11-13 |
Micron Technology, Inc. |
Method and apparatus for removing material from microfeature workpieces
|
US9074118B2
(en)
|
2006-07-12 |
2015-07-07 |
Cabot Microelectronics Corporation |
CMP method for metal-containing substrates
|
US7691287B2
(en)
*
|
2007-01-31 |
2010-04-06 |
Dupont Air Products Nanomaterials Llc |
Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
|
CN101338082A
(zh)
*
|
2007-07-06 |
2009-01-07 |
安集微电子(上海)有限公司 |
改性二氧化硅溶胶及其制备方法和应用
|
US7994057B2
(en)
*
|
2007-09-21 |
2011-08-09 |
Cabot Microelectronics Corporation |
Polishing composition and method utilizing abrasive particles treated with an aminosilane
|
KR101232442B1
(ko)
*
|
2007-09-21 |
2013-02-12 |
캐보트 마이크로일렉트로닉스 코포레이션 |
아미노실란으로 처리된 연마제 입자를 이용한 연마 조성물 및 방법
|
TW201346019A
(zh)
|
2008-04-18 |
2013-11-16 |
Saint Gobain Abrasives Inc |
製造經塗佈研磨產物或經黏結研磨產物之方法
|
EP2389417B1
(de)
|
2009-01-20 |
2017-03-15 |
Cabot Corporation |
Zusammensetzungen mit silanmodifzierten metalloxiden
|
CN107083233A
(zh)
*
|
2010-02-24 |
2017-08-22 |
巴斯夫欧洲公司 |
研磨制品,其制备方法及其应用方法
|
KR101243331B1
(ko)
*
|
2010-12-17 |
2013-03-13 |
솔브레인 주식회사 |
화학 기계적 연마 슬러리 조성물 및 이를 이용하는 반도체 소자의 제조 방법
|
US8758461B2
(en)
|
2010-12-31 |
2014-06-24 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive particles having particular shapes and methods of forming such particles
|
CN103702800B
(zh)
|
2011-06-30 |
2017-11-10 |
圣戈本陶瓷及塑料股份有限公司 |
包括氮化硅磨粒的磨料制品
|
US8840694B2
(en)
|
2011-06-30 |
2014-09-23 |
Saint-Gobain Ceramics & Plastics, Inc. |
Liquid phase sintered silicon carbide abrasive particles
|
CA2850147A1
(en)
|
2011-09-26 |
2013-04-04 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming
|
JP6033886B2
(ja)
|
2011-12-30 |
2016-11-30 |
サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド |
成形研磨粒子および同粒子を形成する方法
|
CN104114327B
(zh)
|
2011-12-30 |
2018-06-05 |
圣戈本陶瓷及塑料股份有限公司 |
复合成型研磨颗粒及其形成方法
|
JP5847331B2
(ja)
|
2011-12-30 |
2016-01-20 |
サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド |
成形研磨粒子の形成
|
AU2013207946B2
(en)
|
2012-01-10 |
2016-07-07 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive particles having complex shapes and methods of forming same
|
US8840696B2
(en)
|
2012-01-10 |
2014-09-23 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive particles having particular shapes and methods of forming such particles
|
EP2830829B1
(de)
|
2012-03-30 |
2018-01-10 |
Saint-Gobain Abrasives, Inc. |
Schleifmittel mit fibrillierten fasern
|
US8778212B2
(en)
*
|
2012-05-22 |
2014-07-15 |
Cabot Microelectronics Corporation |
CMP composition containing zirconia particles and method of use
|
KR102360055B1
(ko)
|
2012-05-23 |
2022-02-09 |
생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 |
형상화 연마입자들 및 이의 형성방법
|
CN104411459B
(zh)
|
2012-06-29 |
2018-06-15 |
圣戈本陶瓷及塑料股份有限公司 |
具有特定形状的磨粒和形成这种粒子的方法
|
CA2887561C
(en)
|
2012-10-15 |
2019-01-15 |
Saint-Gobain Abrasives, Inc. |
Abrasive particles having particular shapes and methods of forming such particles
|
JP6057706B2
(ja)
*
|
2012-12-28 |
2017-01-11 |
株式会社フジミインコーポレーテッド |
研磨用組成物
|
KR101818946B1
(ko)
|
2012-12-31 |
2018-01-17 |
생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 |
미립자 소재 및 이의 형성방법
|
KR101427883B1
(ko)
|
2013-02-08 |
2014-08-07 |
주식회사 케이씨텍 |
표면 개질된 연마입자, 그의 제조 방법 및 그를 포함하는 슬러리 조성물
|
BR112015024901B1
(pt)
|
2013-03-29 |
2022-01-18 |
Saint-Gobain Abrasifs |
Partículas abrasivas tendo formas particulares e métodos para formar essas partículas
|
KR102217580B1
(ko)
*
|
2013-06-24 |
2021-02-22 |
쓰리엠 이노베이티브 프로퍼티즈 컴파니 |
연마 입자, 연마 입자의 제조 방법, 및 연마 용품
|
TW201502263A
(zh)
|
2013-06-28 |
2015-01-16 |
Saint Gobain Ceramics |
包含成形研磨粒子之研磨物品
|
CN104371553B
(zh)
*
|
2013-08-14 |
2017-10-13 |
安集微电子(上海)有限公司 |
一种化学机械抛光液以及应用
|
CN104371551B
(zh)
*
|
2013-08-14 |
2018-01-12 |
安集微电子(上海)有限公司 |
一种碱性阻挡层化学机械抛光液
|
CN105555901A
(zh)
*
|
2013-09-20 |
2016-05-04 |
福吉米株式会社 |
研磨用组合物
|
CN105764653B
(zh)
|
2013-09-30 |
2020-09-11 |
圣戈本陶瓷及塑料股份有限公司 |
成形磨粒及其形成方法
|
WO2015087771A1
(ja)
*
|
2013-12-13 |
2015-06-18 |
株式会社フジミインコーポレーテッド |
金属酸化物膜付き物品
|
CN104745083B
(zh)
*
|
2013-12-25 |
2018-09-14 |
安集微电子(上海)有限公司 |
一种化学机械抛光液以及抛光方法
|
CN104745087B
(zh)
*
|
2013-12-25 |
2018-07-24 |
安集微电子(上海)有限公司 |
一种化学机械抛光液以及抛光方法
|
BR112016015029B1
(pt)
|
2013-12-31 |
2021-12-14 |
Saint-Gobain Abrasifs |
Artigo abrasivo incluindo partículas abrasivas moldadas
|
US9771507B2
(en)
|
2014-01-31 |
2017-09-26 |
Saint-Gobain Ceramics & Plastics, Inc. |
Shaped abrasive particle including dopant material and method of forming same
|
US9238754B2
(en)
|
2014-03-11 |
2016-01-19 |
Cabot Microelectronics Corporation |
Composition for tungsten CMP
|
US9303189B2
(en)
|
2014-03-11 |
2016-04-05 |
Cabot Microelectronics Corporation |
Composition for tungsten CMP
|
US9303188B2
(en)
|
2014-03-11 |
2016-04-05 |
Cabot Microelectronics Corporation |
Composition for tungsten CMP
|
US9309442B2
(en)
|
2014-03-21 |
2016-04-12 |
Cabot Microelectronics Corporation |
Composition for tungsten buffing
|
US9303190B2
(en)
|
2014-03-24 |
2016-04-05 |
Cabot Microelectronics Corporation |
Mixed abrasive tungsten CMP composition
|
US9127187B1
(en)
|
2014-03-24 |
2015-09-08 |
Cabot Microelectronics Corporation |
Mixed abrasive tungsten CMP composition
|
CA3123554A1
(en)
|
2014-04-14 |
2015-10-22 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive article including shaped abrasive particles
|
JP6484647B2
(ja)
|
2014-04-14 |
2019-03-13 |
サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド |
成形研磨粒子を含む研磨物品
|
WO2015184355A1
(en)
|
2014-05-30 |
2015-12-03 |
Saint-Gobain Abrasives, Inc. |
Method of using an abrasive article including shaped abrasive particles
|
US9567491B2
(en)
|
2014-06-25 |
2017-02-14 |
Cabot Microelectronics Corporation |
Tungsten chemical-mechanical polishing composition
|
SG11201610328YA
(en)
|
2014-06-25 |
2017-01-27 |
Cabot Microelectronics Corp |
Colloidal silica chemical-mechanical polishing composition
|
EP3161095B8
(de)
*
|
2014-06-25 |
2021-07-07 |
CMC Materials, Inc. |
Chemisch-mechanische polierzusammensetzung mit kupferbarriere
|
CN104263248B
(zh)
*
|
2014-09-26 |
2016-06-29 |
深圳市力合材料有限公司 |
一种适用于低下压力的弱酸性铜抛光液
|
US9707529B2
(en)
|
2014-12-23 |
2017-07-18 |
Saint-Gobain Ceramics & Plastics, Inc. |
Composite shaped abrasive particles and method of forming same
|
US9914864B2
(en)
|
2014-12-23 |
2018-03-13 |
Saint-Gobain Ceramics & Plastics, Inc. |
Shaped abrasive particles and method of forming same
|
CN105985522B
(zh)
*
|
2014-12-24 |
2019-06-28 |
财团法人工业技术研究院 |
高分支聚硅氧烷与混成材料及其形成方法
|
US9676981B2
(en)
|
2014-12-24 |
2017-06-13 |
Saint-Gobain Ceramics & Plastics, Inc. |
Shaped abrasive particle fractions and method of forming same
|
TWI634200B
(zh)
|
2015-03-31 |
2018-09-01 |
聖高拜磨料有限公司 |
固定磨料物品及其形成方法
|
CN116967949A
(zh)
|
2015-03-31 |
2023-10-31 |
圣戈班磨料磨具有限公司 |
固定磨料制品和其形成方法
|
CN115781499A
(zh)
|
2015-06-11 |
2023-03-14 |
圣戈本陶瓷及塑料股份有限公司 |
包括经成形研磨颗粒的研磨制品
|
JP6408453B2
(ja)
*
|
2015-11-16 |
2018-10-17 |
信越化学工業株式会社 |
研磨組成物及び研磨方法
|
EP3455320A4
(de)
|
2016-05-10 |
2019-11-20 |
Saint-Gobain Ceramics&Plastics, Inc. |
Schleifpartikel und verfahren zur formung davon
|
EP4071224A3
(de)
|
2016-05-10 |
2023-01-04 |
Saint-Gobain Ceramics and Plastics, Inc. |
Verfahren zur formung von schleifpartikeln
|
US11152208B2
(en)
*
|
2016-09-15 |
2021-10-19 |
Flosfia Inc. |
Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping
|
EP4349896A2
(de)
|
2016-09-29 |
2024-04-10 |
Saint-Gobain Abrasives, Inc. |
Feste schleifartikel und verfahren zur formung davon
|
US9803108B1
(en)
|
2016-10-19 |
2017-10-31 |
Rohm And Haas Electronic Materials Cmp Holdings, Inc. |
Aqueous compositions of stabilized aminosilane group containing silica particles
|
US10759024B2
(en)
|
2017-01-31 |
2020-09-01 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive article including shaped abrasive particles
|
US10563105B2
(en)
|
2017-01-31 |
2020-02-18 |
Saint-Gobain Ceramics & Plastics, Inc. |
Abrasive article including shaped abrasive particles
|
WO2018236989A1
(en)
|
2017-06-21 |
2018-12-27 |
Saint-Gobain Ceramics & Plastics, Inc. |
PARTICULATE MATERIALS AND METHODS OF FORMATION THEREOF
|
SG11202000246QA
(en)
*
|
2017-07-11 |
2020-02-27 |
3M Innovative Properties Co |
Abrasive articles including conformable coatings and polishing system therefrom
|
JP7031485B2
(ja)
*
|
2018-05-11 |
2022-03-08 |
昭和電工マテリアルズ株式会社 |
Cmp研磨剤及びその製造方法、並びにcmp研磨方法
|
WO2020205723A1
(en)
*
|
2019-03-29 |
2020-10-08 |
The Coretec Group Inc. |
Method of preparing cyclosilane
|
KR102525287B1
(ko)
*
|
2019-10-18 |
2023-04-24 |
삼성에스디아이 주식회사 |
구리 막 연마용 cmp 슬러리 조성물 및 이를 이용한 구리 막 연마 방법
|
CN111087930A
(zh)
*
|
2019-12-23 |
2020-05-01 |
长江存储科技有限责任公司 |
一种化学机械抛光研磨剂的制备方法及化学机械抛光方法
|
KR20220116556A
(ko)
|
2019-12-27 |
2022-08-23 |
세인트-고바인 세라믹스 앤드 플라스틱스, 인크. |
연마 물품 및 이의 형성 방법
|
KR102589505B1
(ko)
*
|
2020-03-03 |
2023-10-13 |
삼성에스디아이 주식회사 |
구리 연마용 cmp 슬러리 조성물 및 이를 이용한 구리 막 연마 방법
|
KR102619857B1
(ko)
*
|
2020-05-20 |
2023-12-29 |
삼성에스디아이 주식회사 |
텅스텐 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 연마 방법
|
KR102415203B1
(ko)
*
|
2020-08-24 |
2022-06-30 |
에스케이씨솔믹스 주식회사 |
연마패드 및 이를 이용한 반도체 소자의 제조방법
|
KR102577164B1
(ko)
*
|
2020-12-29 |
2023-09-08 |
에스케이엔펄스 주식회사 |
반도체 공정용 연마 조성물 및 연마 조성물을 적용한 기판의 연마방법
|
CN112680187A
(zh)
*
|
2021-01-04 |
2021-04-20 |
上海晖研材料科技有限公司 |
一种表面改性的二氧化硅及含其的磨料组合物
|