ATE225568T1 - Leistung-mosfet aus siliziumkarbid - Google Patents

Leistung-mosfet aus siliziumkarbid

Info

Publication number
ATE225568T1
ATE225568T1 AT94900484T AT94900484T ATE225568T1 AT E225568 T1 ATE225568 T1 AT E225568T1 AT 94900484 T AT94900484 T AT 94900484T AT 94900484 T AT94900484 T AT 94900484T AT E225568 T1 ATE225568 T1 AT E225568T1
Authority
AT
Austria
Prior art keywords
region
drain
silicon carbide
conductivity type
source
Prior art date
Application number
AT94900484T
Other languages
English (en)
Inventor
John W Palmour
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Application granted granted Critical
Publication of ATE225568T1 publication Critical patent/ATE225568T1/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/7801DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
    • H01L29/7802Vertical DMOS transistors, i.e. VDMOS transistors
    • H01L29/7813Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/16Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
    • H01L29/1608Silicon carbide
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/24Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only semiconductor materials not provided for in groups H01L29/16, H01L29/18, H01L29/20, H01L29/22

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Recrystallisation Techniques (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
AT94900484T 1992-11-24 1993-10-27 Leistung-mosfet aus siliziumkarbid ATE225568T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/980,753 US5506421A (en) 1992-11-24 1992-11-24 Power MOSFET in silicon carbide
PCT/US1993/010490 WO1994013017A1 (en) 1992-11-24 1993-10-27 Power mosfet in silicon carbide

Publications (1)

Publication Number Publication Date
ATE225568T1 true ATE225568T1 (de) 2002-10-15

Family

ID=25527819

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94900484T ATE225568T1 (de) 1992-11-24 1993-10-27 Leistung-mosfet aus siliziumkarbid

Country Status (8)

Country Link
US (1) US5506421A (de)
EP (1) EP0671056B1 (de)
JP (1) JPH08505492A (de)
KR (1) KR100271106B1 (de)
AT (1) ATE225568T1 (de)
AU (1) AU5545894A (de)
DE (1) DE69332358T2 (de)
WO (1) WO1994013017A1 (de)

Families Citing this family (168)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6344663B1 (en) 1992-06-05 2002-02-05 Cree, Inc. Silicon carbide CMOS devices
US5399515A (en) * 1993-07-12 1995-03-21 Motorola, Inc. Method of fabricating a silicon carbide vertical MOSFET and device
JP3334290B2 (ja) * 1993-11-12 2002-10-15 株式会社デンソー 半導体装置
DE69534888T2 (de) * 1994-04-06 2006-11-02 Denso Corp., Kariya Herstellungsverfahren für Halbleiterbauelement mit Graben
US5723376A (en) * 1994-06-23 1998-03-03 Nippondenso Co., Ltd. Method of manufacturing SiC semiconductor device having double oxide film formation to reduce film defects
DE4423068C1 (de) * 1994-07-01 1995-08-17 Daimler Benz Ag Feldeffekt-Transistoren aus SiC und Verfahren zu ihrer Herstellung
US5686737A (en) * 1994-09-16 1997-11-11 Cree Research, Inc. Self-aligned field-effect transistor for high frequency applications
EP0718893A3 (de) * 1994-11-25 1999-07-14 Fuji Electric Co., Ltd. MOS-gesteuerter Thyristor mit zwei Gates und Verfahren zur Herstellung desselben
JPH08204179A (ja) * 1995-01-26 1996-08-09 Fuji Electric Co Ltd 炭化ケイ素トレンチmosfet
JPH08213607A (ja) * 1995-02-08 1996-08-20 Ngk Insulators Ltd 半導体装置およびその製造方法
US5661312A (en) * 1995-03-30 1997-08-26 Motorola Silicon carbide MOSFET
US6573534B1 (en) 1995-09-06 2003-06-03 Denso Corporation Silicon carbide semiconductor device
KR100199997B1 (ko) * 1995-09-06 1999-07-01 오카메 히로무 탄화규소 반도체장치
US5877515A (en) * 1995-10-10 1999-03-02 International Rectifier Corporation SiC semiconductor device
US5972801A (en) * 1995-11-08 1999-10-26 Cree Research, Inc. Process for reducing defects in oxide layers on silicon carbide
US6133587A (en) * 1996-01-23 2000-10-17 Denso Corporation Silicon carbide semiconductor device and process for manufacturing same
JP3471509B2 (ja) * 1996-01-23 2003-12-02 株式会社デンソー 炭化珪素半導体装置
SE9601172D0 (sv) * 1996-03-27 1996-03-27 Abb Research Ltd Insulated gate bipolar transistor having a trench and a method for procuction thereof
US5612232A (en) * 1996-03-29 1997-03-18 Motorola Method of fabricating semiconductor devices and the devices
US5909039A (en) * 1996-04-24 1999-06-01 Abb Research Ltd. Insulated gate bipolar transistor having a trench
US5719409A (en) * 1996-06-06 1998-02-17 Cree Research, Inc. Silicon carbide metal-insulator semiconductor field effect transistor
US5952679A (en) * 1996-10-17 1999-09-14 Denso Corporation Semiconductor substrate and method for straightening warp of semiconductor substrate
US6570185B1 (en) 1997-02-07 2003-05-27 Purdue Research Foundation Structure to reduce the on-resistance of power transistors
US6180958B1 (en) 1997-02-07 2001-01-30 James Albert Cooper, Jr. Structure for increasing the maximum voltage of silicon carbide power transistors
JP5054255B2 (ja) * 1997-02-07 2012-10-24 クーパー,ジェームズ・アルバート,ジュニアー シリコン・カーバイド・パワー・トランジスタの最大電圧を増大させるための構造
DE19705516C2 (de) * 1997-02-13 1999-01-07 Siemens Ag Halbleiter-Anordnung aus Siliziumcarbid und Verfahren zu ihrer Herstellung
US6057558A (en) * 1997-03-05 2000-05-02 Denson Corporation Silicon carbide semiconductor device and manufacturing method thereof
US5969378A (en) * 1997-06-12 1999-10-19 Cree Research, Inc. Latch-up free power UMOS-bipolar transistor
US6121633A (en) * 1997-06-12 2000-09-19 Cree Research, Inc. Latch-up free power MOS-bipolar transistor
US6054752A (en) * 1997-06-30 2000-04-25 Denso Corporation Semiconductor device
US7365369B2 (en) 1997-07-25 2008-04-29 Nichia Corporation Nitride semiconductor device
WO1999009598A1 (de) 1997-08-20 1999-02-25 Siemens Aktiengesellschaft Halbleiterstruktur mit einem alpha-siliziumcarbidbereich sowie verwendung dieser halbleiterstruktur
US6011278A (en) * 1997-10-28 2000-01-04 Philips Electronics North America Corporation Lateral silicon carbide semiconductor device having a drift region with a varying doping level
US6559467B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. P-n heterojunction-based structures utilizing HVPE grown III-V compound layers
US6476420B2 (en) 1997-11-18 2002-11-05 Technologies And Devices International, Inc. P-N homojunction-based structures utilizing HVPE growth III-V compound layers
US6849862B2 (en) * 1997-11-18 2005-02-01 Technologies And Devices International, Inc. III-V compound semiconductor device with an AlxByInzGa1-x-y-zN1-a-bPaAsb non-continuous quantum dot layer
US6555452B2 (en) 1997-11-18 2003-04-29 Technologies And Devices International, Inc. Method for growing p-type III-V compound material utilizing HVPE techniques
US6599133B2 (en) 1997-11-18 2003-07-29 Technologies And Devices International, Inc. Method for growing III-V compound semiconductor structures with an integral non-continuous quantum dot layer utilizing HVPE techniques
US6472300B2 (en) 1997-11-18 2002-10-29 Technologies And Devices International, Inc. Method for growing p-n homojunction-based structures utilizing HVPE techniques
US20020047135A1 (en) * 1997-11-18 2002-04-25 Nikolaev Audrey E. P-N junction-based structures utilizing HVPE grown III-V compound layers
US6479839B2 (en) 1997-11-18 2002-11-12 Technologies & Devices International, Inc. III-V compounds semiconductor device with an AlxByInzGa1-x-y-zN non continuous quantum dot layer
US6890809B2 (en) * 1997-11-18 2005-05-10 Technologies And Deviles International, Inc. Method for fabricating a P-N heterojunction device utilizing HVPE grown III-V compound layers and resultant device
US6559038B2 (en) 1997-11-18 2003-05-06 Technologies And Devices International, Inc. Method for growing p-n heterojunction-based structures utilizing HVPE techniques
JP4192281B2 (ja) 1997-11-28 2008-12-10 株式会社デンソー 炭化珪素半導体装置
JPH11251592A (ja) * 1998-01-05 1999-09-07 Denso Corp 炭化珪素半導体装置
SE9800286D0 (sv) * 1998-02-02 1998-02-02 Abb Research Ltd A transistor of SiC
US6362495B1 (en) 1998-03-05 2002-03-26 Purdue Research Foundation Dual-metal-trench silicon carbide Schottky pinch rectifier
DE19918198B4 (de) * 1998-04-23 2008-04-17 International Rectifier Corp., El Segundo Struktur eines P-Kanal-Graben-MOSFETs
US6083806A (en) * 1998-07-06 2000-07-04 Motorola, Inc. Method of forming an alignment mark
US6221700B1 (en) 1998-07-31 2001-04-24 Denso Corporation Method of manufacturing silicon carbide semiconductor device with high activation rate of impurities
US6972436B2 (en) * 1998-08-28 2005-12-06 Cree, Inc. High voltage, high temperature capacitor and interconnection structures
US6246076B1 (en) * 1998-08-28 2001-06-12 Cree, Inc. Layered dielectric on silicon carbide semiconductor structures
JP3428459B2 (ja) * 1998-09-01 2003-07-22 富士電機株式会社 炭化けい素nチャネルMOS半導体素子およびその製造方法
US7462910B1 (en) 1998-10-14 2008-12-09 International Rectifier Corporation P-channel trench MOSFET structure
JP3770014B2 (ja) 1999-02-09 2006-04-26 日亜化学工業株式会社 窒化物半導体素子
DE60043536D1 (de) * 1999-03-04 2010-01-28 Nichia Corp Nitridhalbleiterlaserelement
US6399506B2 (en) * 1999-04-07 2002-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Method for planarizing an oxide layer
US6368514B1 (en) 1999-09-01 2002-04-09 Luminous Intent, Inc. Method and apparatus for batch processed capacitors using masking techniques
US6420757B1 (en) 1999-09-14 2002-07-16 Vram Technologies, Llc Semiconductor diodes having low forward conduction voltage drop, low reverse current leakage, and high avalanche energy capability
CA2328628A1 (en) * 1999-12-21 2001-06-21 Cecile J. Schoenheider Moldable compositions
US6433370B1 (en) 2000-02-10 2002-08-13 Vram Technologies, Llc Method and apparatus for cylindrical semiconductor diodes
US6630746B1 (en) 2000-05-09 2003-10-07 Motorola, Inc. Semiconductor device and method of making the same
JP2003533050A (ja) * 2000-05-10 2003-11-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 半導体デバイス
US6429041B1 (en) 2000-07-13 2002-08-06 Cree, Inc. Methods of fabricating silicon carbide inversion channel devices without the need to utilize P-type implantation
US6610366B2 (en) 2000-10-03 2003-08-26 Cree, Inc. Method of N2O annealing an oxide layer on a silicon carbide layer
US6956238B2 (en) 2000-10-03 2005-10-18 Cree, Inc. Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel
US7067176B2 (en) 2000-10-03 2006-06-27 Cree, Inc. Method of fabricating an oxide layer on a silicon carbide layer utilizing an anneal in a hydrogen environment
US6767843B2 (en) 2000-10-03 2004-07-27 Cree, Inc. Method of N2O growth of an oxide layer on a silicon carbide layer
US6580150B1 (en) 2000-11-13 2003-06-17 Vram Technologies, Llc Vertical junction field effect semiconductor diodes
US6537921B2 (en) 2001-05-23 2003-03-25 Vram Technologies, Llc Vertical metal oxide silicon field effect semiconductor diodes
JPWO2003065459A1 (ja) * 2002-01-28 2005-05-26 三菱電機株式会社 半導体装置
US7022378B2 (en) * 2002-08-30 2006-04-04 Cree, Inc. Nitrogen passivation of interface states in SiO2/SiC structures
US7221010B2 (en) * 2002-12-20 2007-05-22 Cree, Inc. Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors
TW588460B (en) * 2003-01-24 2004-05-21 Ind Tech Res Inst Trench power MOSFET and method of making the same
JP3794637B2 (ja) 2003-03-07 2006-07-05 松下電器産業株式会社 固体撮像装置
US6958275B2 (en) * 2003-03-11 2005-10-25 Integrated Discrete Devices, Llc MOSFET power transistors and methods
US8133789B1 (en) 2003-04-11 2012-03-13 Purdue Research Foundation Short-channel silicon carbide power mosfet
US7074643B2 (en) * 2003-04-24 2006-07-11 Cree, Inc. Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same
US6979863B2 (en) * 2003-04-24 2005-12-27 Cree, Inc. Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same
US7015104B1 (en) 2003-05-29 2006-03-21 Third Dimension Semiconductor, Inc. Technique for forming the deep doped columns in superjunction
US6974720B2 (en) * 2003-10-16 2005-12-13 Cree, Inc. Methods of forming power semiconductor devices using boule-grown silicon carbide drift layers and power semiconductor devices formed thereby
TWI348219B (en) * 2003-12-19 2011-09-01 Third Dimension 3D Sc Inc A method for manufacturing a superjunction device with wide mesas
US7023069B2 (en) * 2003-12-19 2006-04-04 Third Dimension (3D) Semiconductor, Inc. Method for forming thick dielectric regions using etched trenches
EP1706899A4 (de) * 2003-12-19 2008-11-26 Third Dimension 3D Sc Inc Planarisierungsverfahren zur herstellung eines superjunction-bauelements
WO2005065179A2 (en) 2003-12-19 2005-07-21 Third Dimension (3D) Semiconductor, Inc. Method of manufacturing a superjunction device
JP2007515079A (ja) * 2003-12-19 2007-06-07 サード ディメンジョン (スリーディ) セミコンダクタ インコーポレイテッド 従来の端子を備えた超接合装置の製造方法
US7118970B2 (en) 2004-06-22 2006-10-10 Cree, Inc. Methods of fabricating silicon carbide devices with hybrid well regions
AU2005333516B2 (en) * 2004-07-08 2011-04-21 Mississippi State University Monolithic vertical junction field effect transistor and Schottky barrier diode fabricated from silicon carbide and method for fabricating the same
US7439583B2 (en) * 2004-12-27 2008-10-21 Third Dimension (3D) Semiconductor, Inc. Tungsten plug drain extension
TWI401749B (zh) * 2004-12-27 2013-07-11 Third Dimension 3D Sc Inc 用於高電壓超接面終止之方法
US20060214268A1 (en) * 2005-03-25 2006-09-28 Shindengen Electric Manufacturing Co., Ltd. SiC semiconductor device
JP2008538659A (ja) * 2005-04-22 2008-10-30 アイスモス テクノロジー コーポレイション 酸化物で内面が覆われた溝を有する超接合素子と酸化物で内面を覆われた溝を有する超接合素子を製造するための方法
DE102005019157A1 (de) 2005-04-25 2006-10-26 Robert Bosch Gmbh Anordnung von MOSFETs zur Steuerung von demselben
US7414268B2 (en) 2005-05-18 2008-08-19 Cree, Inc. High voltage silicon carbide MOS-bipolar devices having bi-directional blocking capabilities
US20060261346A1 (en) * 2005-05-18 2006-11-23 Sei-Hyung Ryu High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same
US7391057B2 (en) * 2005-05-18 2008-06-24 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US7615801B2 (en) * 2005-05-18 2009-11-10 Cree, Inc. High voltage silicon carbide devices having bi-directional blocking capabilities
US7528040B2 (en) 2005-05-24 2009-05-05 Cree, Inc. Methods of fabricating silicon carbide devices having smooth channels
US7446018B2 (en) * 2005-08-22 2008-11-04 Icemos Technology Corporation Bonded-wafer superjunction semiconductor device
US7727904B2 (en) * 2005-09-16 2010-06-01 Cree, Inc. Methods of forming SiC MOSFETs with high inversion layer mobility
EP2674966B1 (de) 2006-06-29 2019-10-23 Cree, Inc. Siliciumcarbid-Schaltvorrichtungen mit P-Kanälen
US7728402B2 (en) * 2006-08-01 2010-06-01 Cree, Inc. Semiconductor devices including schottky diodes with controlled breakdown
US8432012B2 (en) 2006-08-01 2013-04-30 Cree, Inc. Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same
WO2008020911A2 (en) * 2006-08-17 2008-02-21 Cree, Inc. High power insulated gate bipolar transistors
JP2008078604A (ja) * 2006-08-24 2008-04-03 Rohm Co Ltd Mis型電界効果トランジスタおよびその製造方法
US7476932B2 (en) * 2006-09-29 2009-01-13 The Boeing Company U-shape metal-oxide-semiconductor (UMOS) gate structure for high power MOS-based semiconductor devices
US7598567B2 (en) * 2006-11-03 2009-10-06 Cree, Inc. Power switching semiconductor devices including rectifying junction-shunts
US8835987B2 (en) 2007-02-27 2014-09-16 Cree, Inc. Insulated gate bipolar transistors including current suppressing layers
US8580651B2 (en) * 2007-04-23 2013-11-12 Icemos Technology Ltd. Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
US7723172B2 (en) * 2007-04-23 2010-05-25 Icemos Technology Ltd. Methods for manufacturing a trench type semiconductor device having a thermally sensitive refill material
US20080272429A1 (en) * 2007-05-04 2008-11-06 Icemos Technology Corporation Superjunction devices having narrow surface layout of terminal structures and methods of manufacturing the devices
JP2009044035A (ja) * 2007-08-10 2009-02-26 Sanken Electric Co Ltd 電界効果半導体装置
US20090085148A1 (en) * 2007-09-28 2009-04-02 Icemos Technology Corporation Multi-directional trenching of a plurality of dies in manufacturing superjunction devices
CN101447429B (zh) * 2007-11-27 2012-07-11 上海华虹Nec电子有限公司 双扩散场效应晶体管制造方法
US9048302B2 (en) * 2008-01-11 2015-06-02 The Furukawa Electric Co., Ltd Field effect transistor having semiconductor operating layer formed with an inclined side wall
US7846821B2 (en) * 2008-02-13 2010-12-07 Icemos Technology Ltd. Multi-angle rotation for ion implantation of trenches in superjunction devices
US8030133B2 (en) * 2008-03-28 2011-10-04 Icemos Technology Ltd. Method of fabricating a bonded wafer substrate for use in MEMS structures
US8035112B1 (en) 2008-04-23 2011-10-11 Purdue Research Foundation SIC power DMOSFET with self-aligned source contact
TWI362769B (en) * 2008-05-09 2012-04-21 Univ Nat Chiao Tung Light emitting device and fabrication method therefor
US8232558B2 (en) 2008-05-21 2012-07-31 Cree, Inc. Junction barrier Schottky diodes with current surge capability
US7800196B2 (en) * 2008-09-30 2010-09-21 Northrop Grumman Systems Corporation Semiconductor structure with an electric field stop layer for improved edge termination capability
US8288220B2 (en) * 2009-03-27 2012-10-16 Cree, Inc. Methods of forming semiconductor devices including epitaxial layers and related structures
US8294507B2 (en) 2009-05-08 2012-10-23 Cree, Inc. Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits
US8629509B2 (en) * 2009-06-02 2014-01-14 Cree, Inc. High voltage insulated gate bipolar transistors with minority carrier diverter
US8193848B2 (en) 2009-06-02 2012-06-05 Cree, Inc. Power switching devices having controllable surge current capabilities
US8541787B2 (en) * 2009-07-15 2013-09-24 Cree, Inc. High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability
US8314462B2 (en) * 2009-07-28 2012-11-20 Cree, Inc. Semiconductor devices including electrodes with integrated resistances
US8841682B2 (en) 2009-08-27 2014-09-23 Cree, Inc. Transistors with a gate insulation layer having a channel depleting interfacial charge and related fabrication methods
US20110147764A1 (en) 2009-08-27 2011-06-23 Cree, Inc. Transistors with a dielectric channel depletion layer and related fabrication methods
US8354690B2 (en) 2009-08-31 2013-01-15 Cree, Inc. Solid-state pinch off thyristor circuits
US9117739B2 (en) 2010-03-08 2015-08-25 Cree, Inc. Semiconductor devices with heterojunction barrier regions and methods of fabricating same
US8415671B2 (en) 2010-04-16 2013-04-09 Cree, Inc. Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
JP5611653B2 (ja) 2010-05-06 2014-10-22 株式会社東芝 窒化物半導体素子
US8674439B2 (en) 2010-08-02 2014-03-18 Microsemi Corporation Low loss SiC MOSFET
US8436367B1 (en) 2010-08-02 2013-05-07 Microsemi Corporation SiC power vertical DMOS with increased safe operating area
JP5707770B2 (ja) * 2010-08-03 2015-04-30 住友電気工業株式会社 半導体装置およびその製造方法
JP4965754B2 (ja) * 2010-10-29 2012-07-04 パナソニック株式会社 半導体素子
JP5637916B2 (ja) * 2011-03-31 2014-12-10 トヨタ自動車株式会社 半導体装置及びその製造方法
US9029945B2 (en) 2011-05-06 2015-05-12 Cree, Inc. Field effect transistor devices with low source resistance
US9673283B2 (en) 2011-05-06 2017-06-06 Cree, Inc. Power module for supporting high current densities
US9142662B2 (en) 2011-05-06 2015-09-22 Cree, Inc. Field effect transistor devices with low source resistance
US9984894B2 (en) 2011-08-03 2018-05-29 Cree, Inc. Forming SiC MOSFETs with high channel mobility by treating the oxide interface with cesium ions
US9373617B2 (en) 2011-09-11 2016-06-21 Cree, Inc. High current, low switching loss SiC power module
US8680587B2 (en) 2011-09-11 2014-03-25 Cree, Inc. Schottky diode
US8618582B2 (en) 2011-09-11 2013-12-31 Cree, Inc. Edge termination structure employing recesses for edge termination elements
US9640617B2 (en) 2011-09-11 2017-05-02 Cree, Inc. High performance power module
US8664665B2 (en) 2011-09-11 2014-03-04 Cree, Inc. Schottky diode employing recesses for elements of junction barrier array
JP5745997B2 (ja) * 2011-10-31 2015-07-08 トヨタ自動車株式会社 スイッチング素子とその製造方法
JP5852863B2 (ja) * 2011-11-28 2016-02-03 株式会社日立製作所 4h−SiC半導体素子及び半導体装置
US9343383B2 (en) * 2012-03-02 2016-05-17 Cree, Inc. High voltage semiconductor devices including electric arc suppression material and methods of forming the same
US8946814B2 (en) 2012-04-05 2015-02-03 Icemos Technology Ltd. Superjunction devices having narrow surface layout of terminal structures, buried contact regions and trench gates
JP2013243180A (ja) * 2012-05-18 2013-12-05 Sumitomo Electric Ind Ltd 炭化珪素半導体装置およびその製造方法
JP2013243179A (ja) * 2012-05-18 2013-12-05 Sumitomo Electric Ind Ltd 炭化珪素半導体装置
US8901639B2 (en) 2012-07-26 2014-12-02 Cree, Inc. Monolithic bidirectional silicon carbide switching devices
TWI520337B (zh) 2012-12-19 2016-02-01 財團法人工業技術研究院 階梯溝渠式金氧半場效電晶體及其製造方法
TWI469341B (zh) * 2012-12-20 2015-01-11 Ind Tech Res Inst 碳化矽溝槽式蕭基能障元件
US9306061B2 (en) 2013-03-13 2016-04-05 Cree, Inc. Field effect transistor devices with protective regions
US9240476B2 (en) 2013-03-13 2016-01-19 Cree, Inc. Field effect transistor devices with buried well regions and epitaxial layers
WO2014204491A1 (en) 2013-06-21 2014-12-24 Microsemi Corporation Low loss sic mosfet
US9748341B2 (en) * 2013-07-02 2017-08-29 General Electric Company Metal-oxide-semiconductor (MOS) devices with increased channel periphery
US9893176B2 (en) 2014-12-26 2018-02-13 Fairchild Semiconductor Corporation Silicon-carbide trench gate MOSFETs
WO2017047286A1 (ja) * 2015-09-16 2017-03-23 富士電機株式会社 半導体装置
WO2018048972A1 (en) * 2016-09-09 2018-03-15 United Silicon Carbide Inc. Trench vertical jfet with improved threshold voltage control
WO2018063165A1 (en) * 2016-09-27 2018-04-05 Intel Corporation Non-planar gate thin film transistor
KR101875638B1 (ko) * 2016-10-14 2018-07-06 현대자동차 주식회사 반도체 소자 및 그 제조 방법
US10615292B2 (en) * 2018-03-27 2020-04-07 Hong Kong Applied Science And Technology Research Institute Co., Ltd. High voltage silicon carbide Schottky diode flip chip array
US11158703B2 (en) * 2019-06-05 2021-10-26 Microchip Technology Inc. Space efficient high-voltage termination and process for fabricating same
JP7229428B2 (ja) * 2020-04-17 2023-02-27 三菱電機株式会社 電力用半導体装置、電力用半導体装置の製造方法および電力変換装置

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3844029A (en) * 1972-02-02 1974-10-29 Trw Inc High power double-slug diode package
US4219835A (en) * 1978-02-17 1980-08-26 Siliconix, Inc. VMOS Mesa structure and manufacturing process
US5191396B1 (en) * 1978-10-13 1995-12-26 Int Rectifier Corp High power mosfet with low on-resistance and high breakdown voltage
US4705759B1 (en) * 1978-10-13 1995-02-14 Int Rectifier Corp High power mosfet with low on-resistance and high breakdown voltage
JPS58106870A (ja) * 1981-12-18 1983-06-25 Nissan Motor Co Ltd パワ−mosfet
US4974059A (en) * 1982-12-21 1990-11-27 International Rectifier Corporation Semiconductor high-power mosfet device
JPS59231862A (ja) * 1983-06-13 1984-12-26 Nissan Motor Co Ltd 縦型mosトランジスタ
US4762806A (en) * 1983-12-23 1988-08-09 Sharp Kabushiki Kaisha Process for producing a SiC semiconductor device
EP0159663A3 (de) * 1984-04-26 1987-09-23 General Electric Company Thyristoren, Feldeffekttransistoren mit isoliertem Gate und MOSFETs hoher Dichte gesteuert durch eine in einer V-Nut angebrachte MOS-Struktur und Verfahren zur Herstellung
JPS6161441A (ja) * 1984-09-03 1986-03-29 Toshiba Corp 半導体装置の製造方法
JP2615390B2 (ja) * 1985-10-07 1997-05-28 工業技術院長 炭化シリコン電界効果トランジスタの製造方法
US4767722A (en) * 1986-03-24 1988-08-30 Siliconix Incorporated Method for making planar vertical channel DMOS structures
EP0279403A3 (de) * 1987-02-16 1988-12-07 Nec Corporation Vertikaler MOS-Feldeffekttransistor mit hoher Spannungsfestigkeit und hoher Schaltgeschwindigkeit
US4977439A (en) * 1987-04-03 1990-12-11 Esquivel Agerico L Buried multilevel interconnect system
US4945394A (en) * 1987-10-26 1990-07-31 North Carolina State University Bipolar junction transistor on silicon carbide
US4947218A (en) * 1987-11-03 1990-08-07 North Carolina State University P-N junction diodes in silicon carbide
US4865685A (en) * 1987-11-03 1989-09-12 North Carolina State University Dry etching of silicon carbide
JP2500807B2 (ja) * 1988-03-04 1996-05-29 日産自動車株式会社 縦型パワ―mosトランジスタ
US4967245A (en) * 1988-03-14 1990-10-30 Siliconix Incorporated Trench power MOSFET device
JPH0777262B2 (ja) * 1988-04-19 1995-08-16 日本電気株式会社 縦型電界効果トランジスタ
JPH01290266A (ja) * 1988-05-18 1989-11-22 Fujitsu Ltd 化合物半導体素子
JPH0783119B2 (ja) * 1988-08-25 1995-09-06 日本電気株式会社 電界効果トランジスタ
US4994871A (en) * 1988-12-02 1991-02-19 General Electric Company Insulated gate bipolar transistor with improved latch-up current level and safe operating area
US5164218A (en) * 1989-05-12 1992-11-17 Nippon Soken, Inc. Semiconductor device and a method for producing the same
JPH0334573A (ja) * 1989-06-30 1991-02-14 Sharp Corp 炭化珪素電界効果トランジスタ
US4931408A (en) * 1989-10-13 1990-06-05 Siliconix Incorporated Method of fabricating a short-channel low voltage DMOS transistor
JP2542448B2 (ja) * 1990-05-24 1996-10-09 シャープ株式会社 電界効果トランジスタおよびその製造方法
JP2917532B2 (ja) * 1991-01-24 1999-07-12 富士電機株式会社 電界効果トランジスタ
US5168331A (en) * 1991-01-31 1992-12-01 Siliconix Incorporated Power metal-oxide-semiconductor field effect transistor
US5225032A (en) * 1991-08-09 1993-07-06 Allied-Signal Inc. Method of producing stoichiometric, epitaxial, monocrystalline films of silicon carbide at temperatures below 900 degrees centigrade
US5233215A (en) * 1992-06-08 1993-08-03 North Carolina State University At Raleigh Silicon carbide power MOSFET with floating field ring and floating field plate

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WO1994013017A1 (en) 1994-06-09
DE69332358T2 (de) 2003-07-31
AU5545894A (en) 1994-06-22
KR950704815A (ko) 1995-11-20
EP0671056A1 (de) 1995-09-13
US5506421A (en) 1996-04-09
EP0671056B1 (de) 2002-10-02
KR100271106B1 (ko) 2000-11-01
JPH08505492A (ja) 1996-06-11

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