SE9601172D0 - Insulated gate bipolar transistor having a trench and a method for procuction thereof - Google Patents

Insulated gate bipolar transistor having a trench and a method for procuction thereof

Info

Publication number
SE9601172D0
SE9601172D0 SE9601172A SE9601172A SE9601172D0 SE 9601172 D0 SE9601172 D0 SE 9601172D0 SE 9601172 A SE9601172 A SE 9601172A SE 9601172 A SE9601172 A SE 9601172A SE 9601172 D0 SE9601172 D0 SE 9601172D0
Authority
SE
Sweden
Prior art keywords
layer
trench
type
highly doped
source region
Prior art date
Application number
SE9601172A
Other languages
English (en)
Inventor
Mietek Bakowski
Christopher Harris
Ulf Gustafsson
Original Assignee
Abb Research Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Abb Research Ltd filed Critical Abb Research Ltd
Priority to SE9601172A priority Critical patent/SE9601172D0/sv
Publication of SE9601172D0 publication Critical patent/SE9601172D0/sv
Priority to US08/637,105 priority patent/US5763902A/en
Priority to EP97915821A priority patent/EP0890191A1/en
Priority to PCT/SE1997/000531 priority patent/WO1997036329A1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66234Bipolar junction transistors [BJT]
    • H01L29/66325Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
    • H01L29/66333Vertical insulated gate bipolar transistors
    • H01L29/6634Vertical insulated gate bipolar transistors with a recess formed by etching in the source/emitter contact region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • H01L29/0642Isolation within the component, i.e. internal isolation
    • H01L29/0649Dielectric regions, e.g. SiO2 regions, air gaps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1095Body region, i.e. base region, of DMOS transistors or IGBTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7393Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
    • H01L29/7395Vertical transistors, e.g. vertical IGBT
    • H01L29/7396Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Transistors (AREA)
SE9601172A 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof SE9601172D0 (sv)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof
US08/637,105 US5763902A (en) 1996-03-27 1996-04-24 Insulated gate bipolar transistor having a trench and a method for production thereof
EP97915821A EP0890191A1 (en) 1996-03-27 1997-03-26 Insulated gate bipolar transistor having a trench and a method for production thereof
PCT/SE1997/000531 WO1997036329A1 (en) 1996-03-27 1997-03-26 Insulated gate bipolar transistor having a trench and a method for production thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof
US08/637,105 US5763902A (en) 1996-03-27 1996-04-24 Insulated gate bipolar transistor having a trench and a method for production thereof

Publications (1)

Publication Number Publication Date
SE9601172D0 true SE9601172D0 (sv) 1996-03-27

Family

ID=26662558

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9601172A SE9601172D0 (sv) 1996-03-27 1996-03-27 Insulated gate bipolar transistor having a trench and a method for procuction thereof

Country Status (3)

Country Link
US (1) US5763902A (sv)
SE (1) SE9601172D0 (sv)
WO (1) WO1997036329A1 (sv)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6180958B1 (en) * 1997-02-07 2001-01-30 James Albert Cooper, Jr. Structure for increasing the maximum voltage of silicon carbide power transistors
SE9800286D0 (sv) * 1998-02-02 1998-02-02 Abb Research Ltd A transistor of SiC
CN117457731B (zh) * 2023-12-22 2024-05-28 深圳天狼芯半导体有限公司 一种栅极下方具有P型空间层的SiC垂直IGBT及制备方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542077A (en) * 1977-06-08 1979-01-09 Hitachi Ltd Semiconductor switching element
US4466173A (en) * 1981-11-23 1984-08-21 General Electric Company Methods for fabricating vertical channel buried grid field controlled devices including field effect transistors and field controlled thyristors utilizing etch and refill techniques
JPH0817233B2 (ja) * 1987-11-11 1996-02-21 三菱電機株式会社 絶縁ゲート型バイポーラトランジスタ
US5173435A (en) * 1987-11-11 1992-12-22 Mitsubishi Denki Kabushiki Kaisha Insulated gate bipolar transistor
US5233215A (en) * 1992-06-08 1993-08-03 North Carolina State University At Raleigh Silicon carbide power MOSFET with floating field ring and floating field plate
US5506421A (en) * 1992-11-24 1996-04-09 Cree Research, Inc. Power MOSFET in silicon carbide
US5396087A (en) * 1992-12-14 1995-03-07 North Carolina State University Insulated gate bipolar transistor with reduced susceptibility to parasitic latch-up
US5397717A (en) * 1993-07-12 1995-03-14 Motorola, Inc. Method of fabricating a silicon carbide vertical MOSFET

Also Published As

Publication number Publication date
WO1997036329A1 (en) 1997-10-02
US5763902A (en) 1998-06-09

Similar Documents

Publication Publication Date Title
DE69718477D1 (de) Siliciumcarbid-metall-isolator-halbleiter-feldeffekttransistor
GB2383190B (en) Bipolar junction transistor compatible with vertical replacement gate transistors
DE69821105D1 (de) Bipolar mos-leistungstransistor ohne latch-up
US8129785B2 (en) Semiconductor device
CA2381530A1 (en) Bipolar mosfet device
DE69315424D1 (de) Feldeffekttransistor mit fermi-schwellenspannung und verminderter gate- und diffusions-kapazitaet
KR970702583A (ko) 2 레벨의 매입 영역을 갖는 반도체 구조물의 구성 및 제조 방법(configuration and fabrication of semiconductor structure having two levels of buried regions)
WO2006025035A3 (en) Vertical semiconductor devices and methods of manufacturing such devices
WO2001045142A3 (en) Lateral insulated-gate bipolar transistor (ligbt) device in silicon-on-insulator (soi) technology
CA2336933A1 (en) Silicon carbide horizontal channel buffered gate semiconductor devices
KR950034769A (ko) 절연 게이트형 전계 효과 트랜지스터 제조 방법 및 절연 게이트형 반도체 소자
KR920001655A (ko) 바이폴라 트랜지스터용 자기정렬된 콜렉터 구조 및 이를 주입하는 방법
JPH08213598A (ja) 電界効果により制御可能の半導体デバイス
SE9900358D0 (sv) A lateral field effect transistor of SiC, a method for production thereof and a use of such a transistor
ES8104639A1 (es) Un dispositivo transistor mejorado
DE69841384D1 (de) Leistungshalbleiteranordnung mit halbisolierendem Substrat
SE0302594D0 (sv) Vertical DMOS transistor device, integrated circuit, and fabrication method thereof
WO1996029741A3 (en) Semiconductor device provided with an ligbt element
EP1081768A3 (en) Insulated gate field-effect transistor and method of making the same
SE9601179D0 (sv) A field controlled semiconductor device of SiC and a method for production thereof
DE50014606D1 (de) Igbt mit pn-isolation
SE9601172D0 (sv) Insulated gate bipolar transistor having a trench and a method for procuction thereof
KR19990006170A (ko) 수평 바이폴라형 전계 효과 트랜지스터 및 그 제조 방법
WO2000031776A3 (en) Lateral thin-film silicon-on-insulator (soi) device having multiple doping profile slopes in the drift region
KR960002889A (ko) 반도체 장치 및 그 제조방법