WO2023123909A1 - Pcb processing method and pcb - Google Patents

Pcb processing method and pcb Download PDF

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Publication number
WO2023123909A1
WO2023123909A1 PCT/CN2022/100059 CN2022100059W WO2023123909A1 WO 2023123909 A1 WO2023123909 A1 WO 2023123909A1 CN 2022100059 W CN2022100059 W CN 2022100059W WO 2023123909 A1 WO2023123909 A1 WO 2023123909A1
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drilling
depth
pcb
drilled
processing method
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PCT/CN2022/100059
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French (fr)
Chinese (zh)
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罗伟俊
文贵宜
陶逸
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生益电子股份有限公司
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Publication of WO2023123909A1 publication Critical patent/WO2023123909A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Definitions

  • the present application relates to the technical field of PCB processing, for example, to a PCB processing method and PCB.
  • PCBs printed circuit boards
  • High-density interconnection has become one of the development directions of PCB in the industry, which makes the board thicker and the wiring denser, which requires the holes to be smaller and finer.
  • the small hole drilling accuracy in related technologies is limited, which has become a stumbling block for the industry to improve and develop.
  • the back-drill processed on the exit face of a drill is often easily offset from the first drill, resulting in the hole wall copper not being drilled and resulting in short inside.
  • This application proposes a PCB processing method, which can solve the problem that when the same hole is back-drilled on both sides of a thick plate, the back-drilling corresponding to the tool surface of one drill is easily offset from the back-drilling of the first drill.
  • the present application also proposes the PCB prepared by the above processing method.
  • an embodiment of the present application proposes a PCB processing method, including:
  • the first drilling corresponds to the double-sided back drilling and the tool diameter is equal, and the depth of the double-sided back drilling is equal or unequal; if If the depths of the double-sided back-drilled holes are equal, the step formed during the control-one drilling process is located in any one-sided back-drilled hole; The step is located inside the back-drilled hole with a deep back-drilled depth; and the back-drilled hole is processed and the step is drilled off.
  • the depths of the back-drilled holes are not equal, and the double-sided drilled holes control the depth of a drilled hole on both sides according to the depths of the back-drilled holes on both sides:
  • the controlled depth of a drilled hole is A1, and the back-drilling depth is H1.
  • the value of a is as follows: 0.1mm ⁇ a ⁇ 0.3mm;
  • the thickness of the PCB to be drilled is H
  • the angle length of the tool nose, the value of b is as follows: 0.05 ⁇ b ⁇ 0.1.
  • the value of a is as follows: 0.15mm ⁇ a ⁇ 0.25mm.
  • the a is about 0.2 mm.
  • the value of b is as follows: 0.07 ⁇ b ⁇ 0.09.
  • the b is about 0.08.
  • the H >4.0mm.
  • the diameter of the drilled hole is D, and the H/D ⁇ 20.
  • the diameter of the back-drilled hole is D+c, wherein, 152.40 ⁇ m ⁇ c ⁇ 254.00 ⁇ m.
  • c is about 203.20 ⁇ m.
  • an embodiment of the present application provides a PCB, which is prepared by the above method.
  • Fig. 1 is conventional processing flow in the related art
  • Figure 2 is a PCB processed by related technologies
  • Fig. 3 is the hole structure on the PCB processed by the related technology
  • Fig. 4 is the operation process of processing PCB in the embodiment 1 ⁇ 3 of the present application.
  • Fig. 5 is a partial view of the PCB processed in Example 1 of the present application.
  • Fig. 6 is the processing operation process of the comparative example 1 of the present application.
  • FIG. 7 is a partial view of the PCB obtained in the comparative example 1 of the present application.
  • FIG. 8 is a flowchart of a PCB processing method provided by an embodiment of the present application.
  • a PCB is prepared, which is prepared by a CCD drill referring to the flow shown in Figure 4 and Figure 8, and the specific process is as follows:
  • S1 take the PCB to be drilled with a thickness of H, and use double-sided drilling in the first drilling process.
  • One drill hole corresponds to double-sided back-drilled holes with equal tool diameters, and the drilling depths of double-sided back-drilled holes are not equal.
  • a step is formed during drilling, and the step is controlled to be located inside the back-drilled hole with a deeper back-drilled depth;
  • the back-drilling process is processed through conventional depth control (use a drill with conductive depth control function, and finally cover the PCB that needs back-drilling with an aluminum sheet and cold stamping tape to complete the back-drilling process). Drill off the drill step on the side with a deeper drilling depth, and the resulting PCB is shown in Figure 5.
  • the double-sided drilling in S1 specifically controls the depths of the first hole and the back-drilling on both sides according to the depths of the back-drilling on both sides.
  • the controlled depth of a drilled hole is A1
  • the back-drilling depth is H1.
  • the value of a is as follows: 0.15mm ⁇ a ⁇ 0.25mm, and in an embodiment of the present application, the value of a is 0.2mm.
  • the value is as follows: 0.07 ⁇ b ⁇ 0.09, in an embodiment of the present application, the value of b is 0.08.
  • the control depth of a drill hole is shallower than the depth of the back drilling (shallow depth is a), and the depth of the back drilling is shallower
  • the control depth of one drilling hole is controlled by deducting the depth of the other side from the plate thickness and then compensating according to a certain coefficient (coefficient control is b) of the plate thickness, which can eliminate the drilling depth caused by plate thickness fluctuations Error; in the back drilling process, it is enough to use the conventional controlled depth drilling method to process, and the counter-drilling step will be drilled off on the side where the back drilling depth is deeper.
  • the solution of this application is especially suitable for the deviation problem of the double-sided back drilling of the same hole in a thick plate (the diameter of a drilling tool does not exceed 0.2mm).
  • the method in the related art usually uses one-time drilling. Controlled depth drilling is used to process a hole, and then conventional back drilling can be used to ingeniously ensure high-precision alignment of first drilling and back drilling, and at the same time, the step of drilling will be eliminated to reduce the risk of open circuit quality caused by broken copper.
  • the diameter of the drilled hole is D, and the H/D ⁇ 20.
  • the diameter of the back-drilled hole is D+c, wherein, 152.40 ⁇ m ⁇ c ⁇ 254.00 ⁇ m.
  • c is about 203.20 ⁇ m.
  • the drilling machine used for drilling holes in the PCB processing process is a CCD drilling machine. Use the CCD drill to complete the entire drilling process to ensure that the expansion and contraction of the process match.
  • the processing of the back-drilled hole is carried out by conventional controlled depth drilling.
  • Back drilling can be done in conventional way. For example, set the required back-drilling depth in the back-drilling program, then choose a drilling machine with conductive depth control function for production and processing, and finally cover the PCB that needs back-drilling processing with aluminum sheet and cold stamping tape to complete the back-drilling process. Drill processing.
  • the scheme of this embodiment uses double-sided depth control drilling to process a drill hole, but the step position of a drill hole changes with the depth of the back-drilling hole, and it is always guaranteed that the step of the counter-drilling tool will be drilled off by the back-drilling tool. Guarantee high-precision first-drill and back-drill alignment, and at the same time eliminate the alignment step to reduce the risk of open circuit quality caused by broken copper.
  • the PCB prepared by the solution of the present application does not have steps, is not easy to break copper, has good processing effect, and is especially suitable for processing small holes in thick plates.
  • double-sided drilling is used.
  • One drilling corresponds to double-sided back drilling and the tool diameter is equal.
  • the depth of double-sided one drilling can also be equal.
  • it should be located in the middle of the plate thickness as much as possible to minimize the deviation of a drill.
  • the depth of the first hole on both sides can be equal or not, and it should be controlled according to the depth of the back drilling.
  • it should be ensured that the step formed during the first drilling is located inside the back drilling with a deeper back drilling depth.
  • the depths of the back-drilled holes can also be equal. When equal, the step formed by a drilled hole is located in the back-drilled hole on either side, and the step is removed during the back-drilled process.
  • the PCB processing method of the present application it has at least the following beneficial effects: Different from the processing methods in the related art, there are always counter-drilling steps that will cause copper breakage, and the method of the present application can be used to control the depth of both sides.
  • the design of the drill can effectively realize the processing of small holes in thick plates.
  • the step of this application scheme changes with the depth of the back drill, and always ensures that the step of the counter-drill will be drilled off by the back drill, ensuring high-precision alignment between the first drill and the back-drill, and eliminating the drill step can reduce the risk of copper breakage open circuit quality risk.
  • the scheme of this application divides the machining process into a drilling process and a back drilling process.
  • a drilling hole is split into double-sided depth control and equal large tool diameter counter-drilling.
  • the steps can also be removed during the back drilling process, and there will be no problem of broken copper plating caused by the steps.
  • the double-sided back-drilled bar of the same hole is split into two-sided depth control and other large-diameter counter-drilling.
  • a PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.1 mm, and the value of b is 0.05.
  • the back drill and the first drill prepared by the method of the present application are not prone to misalignment, the drilling precision is high, and small holes can be accurately processed on thick plates effectively.
  • a PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.3mm, and the value of b is 0.1.
  • a PCB is prepared, as shown in FIG. 6 , the difference from Example 1 is that S1 uses conventional double-sided equal depth and equal size drills. Using this method will make the step exist in the hole, and the step produced by the first drill hole is located on the deeper side of the back drill depth, but the depth of the first drill is greater than the back drill depth, and the step is formed in the back drill hole with a deeper back drill depth Additionally, this will result in stepped holes that cannot be removed.
  • a drilled hole is shown in Figure 7, the hole diameter can reach 0.56mm (usually need to be above 0.4mm). In this processing method, the diameter of a drilled hole is relatively large, and the steps cannot be effectively removed, which makes it very easy to break copper at this position, resulting in the failure of the inner opening.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

A PCB processing method and a PCB. The PCB processing method comprises: a PCB to be drilled is taken, and in processing of first drilled holes, double-sided back drilling is adopted, wherein the first drilled holes correspond to double-sided back-drilled holes and have tool diameters equal thereto, and the double-sided back-drilled holes have equal or unequal depths; if the depths of the double-sided back-drilled holes are equal, steps formed in the processing of the first drilled holes are controlled to be located in the back-drilled holes on either side; if the depths of the double-sided back-drilled holes are unequal, the steps formed in the processing of the first drilled holes are controlled to be located inside the back-drilled holes with higher back-drilling depths; and the back-drilled holes are processed, and the steps are drilled out.

Description

PCB加工方法及PCBPCB processing method and PCB
本申请要求申请日为2021年12月27日、申请号为202111617711.X的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。This application claims priority to a Chinese patent application with a filing date of December 27, 2021 and application number 202111617711.X, the entire contents of which are incorporated herein by reference.
技术领域technical field
本申请涉及PCB加工技术领域，例如涉及一种PCB加工方法及PCB。The present application relates to the technical field of PCB processing, for example, to a PCB processing method and PCB.
背景技术Background technique
相关技术中，随着电子产品功能的日益复杂及性能需求的提高，印制电路板(PCB)的密度不断攀升。高密度互连已成为行业内PCB发展方向之一，这使得板越来越厚，布线越来越密集，这要求孔越来越小且越来越精细。然而，相关技术中的小孔钻孔精度有限，已成为了行业提升发展的绊脚石。尤其是在加工厚板同一孔双面背钻孔时，在一钻的出刀面所加工的背钻经常容易与一钻存在偏位而导致孔壁铜未钻掉导致内短。即在钻孔加工时，厚径比过高导致钻孔的出刀面精度差，背钻加工一钻精度差的出刀面容易出现背钻与一钻偏位的情形，偏位则导致孔壁铜未能完全钻除，进而导致背钻加工失效(如图1～3所示，从图1中可以看出，相关技术中采用的是一次钻穿的方式，而从图3可以看出，采用该方法加工得到的孔径在0.39mm且偏位较严重)。In related technologies, with the increasingly complex functions of electronic products and the improvement of performance requirements, the density of printed circuit boards (PCBs) continues to increase. High-density interconnection has become one of the development directions of PCB in the industry, which makes the board thicker and the wiring denser, which requires the holes to be smaller and finer. However, the small hole drilling accuracy in related technologies is limited, which has become a stumbling block for the industry to improve and develop. Especially when processing double-sided back-drilled holes in the same hole in thick plates, the back-drill processed on the exit face of a drill is often easily offset from the first drill, resulting in the hole wall copper not being drilled and resulting in short inside. That is to say, in the drilling process, if the thickness-to-diameter ratio is too high, the accuracy of the drilling surface will be poor, and the back-drilling and one-drilling precision of the cutting surface will easily cause the back-drilling and one-drilling deviation, and the deviation will lead to the hole The wall copper was not completely drilled out, which led to the failure of the back drilling process (as shown in Figures 1 to 3, it can be seen from Figure 1 that the related technology uses a one-time drilling method, and it can be seen from Figure 3 , the diameter of the hole processed by this method is 0.39mm and the deviation is serious).
发明内容Contents of the invention
本申请提出了一种PCB加工方法，能够解决厚板同一孔双面背钻时，一钻出刀面对应所加工的背钻容易与一钻存在偏位的问题。This application proposes a PCB processing method, which can solve the problem that when the same hole is back-drilled on both sides of a thick plate, the back-drilling corresponding to the tool surface of one drill is easily offset from the back-drilling of the first drill.
本申请还提出了上述加工方法制得的PCB。The present application also proposes the PCB prepared by the above processing method.
一个方面，本申请一实施例提出了一种PCB加工方法，包括：In one aspect, an embodiment of the present application proposes a PCB processing method, including:
取待钻孔PCB，在一钻孔加工时，采用双面钻孔，所述一钻孔对应双面背钻孔且刀径相等，所述双面背钻孔的深度相等或不等；若所述双面背钻孔的深度相等，则控制一钻孔加工时形成的阶梯位于任一面背钻孔中；若所述双面背钻孔的深度不等，则控制一钻孔加工时形成的阶梯位于背钻深度较深的背钻孔内部；及加工背钻孔，并将阶梯钻掉。Take the PCB to be drilled, and use double-sided drilling during a drilling process, the first drilling corresponds to the double-sided back drilling and the tool diameter is equal, and the depth of the double-sided back drilling is equal or unequal; if If the depths of the double-sided back-drilled holes are equal, the step formed during the control-one drilling process is located in any one-sided back-drilled hole; The step is located inside the back-drilled hole with a deep back-drilled depth; and the back-drilled hole is processed and the step is drilled off.
在本申请一实施方式中，所述背钻孔深度不等，且所述双面钻孔为根据两面背钻孔的深度分别控制两面的一钻孔深度：In one embodiment of the present application, the depths of the back-drilled holes are not equal, and the double-sided drilled holes control the depth of a drilled hole on both sides according to the depths of the back-drilled holes on both sides:
在背钻孔深度较深的一面，控制一钻孔入刀的控深深度为A1，背钻孔深度为H1，A1与H1间满足如下关系式：A1＝H1-a+刀尖角长度，所述a的取值如下：0.1mm≤a≤0.3mm；On the side where the back-drilling depth is deeper, the controlled depth of a drilled hole is A1, and the back-drilling depth is H1. The value of a is as follows: 0.1mm≤a≤0.3mm;
在背钻孔深度较浅的一面，控制一钻孔入刀的控深深度为A2，待钻孔PCB的厚度为H，A2与H间满足如下关系式：A2＝H-A1+H*b+刀尖角长度，所述b的取值如下：0.05≤b≤0.1。在本申请一实施方式中，所述a的取值如下：0.15mm≤a≤0.25mm。On the side where the depth of the back drilling is shallower, the control depth of a drilled hole is A2, the thickness of the PCB to be drilled is H, and the relationship between A2 and H satisfies the following relationship: A2=H-A1+H*b+ The angle length of the tool nose, the value of b is as follows: 0.05≤b≤0.1. In an embodiment of the present application, the value of a is as follows: 0.15mm≤a≤0.25mm.
在本申请一实施方式中，所述a约为0.2mm。In one embodiment of the present application, the a is about 0.2 mm.
在本申请一实施方式中，所述b的取值如下：0.07≤b≤0.09。In an embodiment of the present application, the value of b is as follows: 0.07≤b≤0.09.
在本申请一实施方式中，所述b约为0.08。In one embodiment of the present application, the b is about 0.08.
在申请一实施方式中，所述H＞4.0mm。In one embodiment of the application, the H>4.0mm.
在本申请一实施方式中，所述一钻孔的孔径为D，所述H/D≥20。In an embodiment of the present application, the diameter of the drilled hole is D, and the H/D≧20.
在本申请一实施方式中，D≤0.2mm。In one embodiment of the present application, D≤0.2mm.
在本申请一实施方式中，所述背钻孔的孔径为D+c，其中，152.40μm≤c≤254.00μm。In an embodiment of the present application, the diameter of the back-drilled hole is D+c, wherein, 152.40 μm≤c≤254.00 μm.
在本申请一实施方式中，c约为203.20μm。In one embodiment of the present application, c is about 203.20 μm.
另一个方面，本申请一实施例提出了PCB，所述PCB通过上述方法制备得到。In another aspect, an embodiment of the present application provides a PCB, which is prepared by the above method.
附图说明Description of drawings
图1为相关技术中常规加工流程；Fig. 1 is conventional processing flow in the related art;
图2为相关技术加工的PCB；Figure 2 is a PCB processed by related technologies;
图3为相关技术加工的PCB上的孔结构；Fig. 3 is the hole structure on the PCB processed by the related technology;
图4为本申请实施例1～3加工PCB的操作流程；Fig. 4 is the operation process of processing PCB in the embodiment 1～3 of the present application;
图5为本申请实施例1加工得到的PCB的局部图；Fig. 5 is a partial view of the PCB processed in Example 1 of the present application;
图6为本申请对比例1的加工操作流程；Fig. 6 is the processing operation process of the comparative example 1 of the present application;
图7为本申请对比例1加工得到的PCB的局部图；FIG. 7 is a partial view of the PCB obtained in the comparative example 1 of the present application;
图8为本申请一实施例提供的一种PCB加工方法的流程图。FIG. 8 is a flowchart of a PCB processing method provided by an embodiment of the present application.
具体实施方式Detailed ways
本申请的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例 描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of this application, reference to the terms "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific examples," or "some examples" is intended to mean that the embodiments Specific features, structures, materials, or characteristics described in or examples are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
本申请的描述中，如无特殊规定，所述“约”的含义是指正负2％。In the description of the present application, unless otherwise specified, the meaning of "about" refers to plus or minus 2%.
实施例1Example 1
本实施例制备了一种PCB，通过CCD钻机参照如图4及图8所示流程进行制备，具体过程为：In this embodiment, a PCB is prepared, which is prepared by a CCD drill referring to the flow shown in Figure 4 and Figure 8, and the specific process is as follows:
S1中，取厚度为H的待钻孔PCB，在一钻孔加工时，采用双面钻孔，一钻孔对应双面背钻孔且刀径相等，双面背钻孔的钻深不相等；一钻时形成阶梯，且控制所述阶梯位于背钻深度较深的背钻孔内部；In S1, take the PCB to be drilled with a thickness of H, and use double-sided drilling in the first drilling process. One drill hole corresponds to double-sided back-drilled holes with equal tool diameters, and the drilling depths of double-sided back-drilled holes are not equal. ; A step is formed during drilling, and the step is controlled to be located inside the back-drilled hole with a deeper back-drilled depth;
S2中，通过常规控深加工背钻孔(采用具有导电控深功能的钻机，最后在需要背钻加工的PCB上盖上铝片、冷冲板胶带贴牢即可完成背钻加工)，在背钻深度较深的一侧将钻阶梯钻掉，制得的PCB如图5所示。In S2, the back-drilling process is processed through conventional depth control (use a drill with conductive depth control function, and finally cover the PCB that needs back-drilling with an aluminum sheet and cold stamping tape to complete the back-drilling process). Drill off the drill step on the side with a deeper drilling depth, and the resulting PCB is shown in Figure 5.
其中，S1中双面钻孔具体为根据两面背钻的深度分别控制两面的一钻孔与背钻孔深度。Among them, the double-sided drilling in S1 specifically controls the depths of the first hole and the back-drilling on both sides according to the depths of the back-drilling on both sides.
在背钻孔深度较深的一面，控制一钻孔入刀的控深深度为A1，背钻孔深度为H1，A1与H1间满足如下关系式：A1＝H1-a+刀尖角长度，所述a的取值如下：0.15mm≤a≤0.25mm，在本申请一实施方式中，a的取值为0.2mm。On the side where the back-drilling depth is deeper, the controlled depth of a drilled hole is A1, and the back-drilling depth is H1. The value of a is as follows: 0.15mm≤a≤0.25mm, and in an embodiment of the present application, the value of a is 0.2mm.
在背钻孔深度较浅的一面，控制一钻孔入刀的控深深度为A2，A2与H间满足如下关系式：A2＝H-A1+H*b+刀尖角长度，所述b的取值如下：0.07≤b≤0.09，在本申请一实施方式中，b的取值为0.08。以H为基础计算A2，以充分考虑板厚的波动。一钻孔的孔径为0.2mm，背钻孔孔径为0.4mm。On the side where the depth of the back drilling is shallower, the control depth of a drill hole entering the tool is A2, and the relationship between A2 and H satisfies the following relationship: A2=H-A1+H*b+ tool nose angle length, the b The value is as follows: 0.07≤b≤0.09, in an embodiment of the present application, the value of b is 0.08. Calculate A2 on the basis of H to fully consider the fluctuation of plate thickness. The diameter of one drilled hole is 0.2 mm, and the diameter of the back drilled hole is 0.4 mm.
根据双面背钻孔的深度，在背钻孔深度较深的一侧，一钻孔入刀的控深深度比背钻孔深度浅(浅的深度为a)，在背钻孔深度较浅的一侧，一钻孔入刀的控深深度控制为在板厚中扣除另一面深度后再按一定系数(系数控制为b)的板厚进行补偿，可以消除板厚波动带来的钻深误差；在背钻孔加工时，采用常规控深钻的方式进行加工即可，在背钻深度较深的一侧将对钻阶梯钻掉。According to the depth of double-sided back drilling, on the side where the depth of the back drilling is deeper, the control depth of a drill hole is shallower than the depth of the back drilling (shallow depth is a), and the depth of the back drilling is shallower On one side, the control depth of one drilling hole is controlled by deducting the depth of the other side from the plate thickness and then compensating according to a certain coefficient (coefficient control is b) of the plate thickness, which can eliminate the drilling depth caused by plate thickness fluctuations Error; in the back drilling process, it is enough to use the conventional controlled depth drilling method to process, and the counter-drilling step will be drilled off on the side where the back drilling depth is deeper.
在申请一实施方式中，所述H＞4.0mm。本申请方案尤其适用于厚板的同一孔双面背钻的偏位问题(一钻孔取刀直径不超过0.2mm)，相关技术中的方法通常采用一次钻穿，本申请的方案通过双面控深钻的方式加工一钻孔，再通过常规背 钻即可，巧妙地保证高精度的一钻和背钻对位，同时将对钻阶梯消除减少断铜带来的开路品质风险。In one embodiment of the application, the H>4.0mm. The solution of this application is especially suitable for the deviation problem of the double-sided back drilling of the same hole in a thick plate (the diameter of a drilling tool does not exceed 0.2mm). The method in the related art usually uses one-time drilling. Controlled depth drilling is used to process a hole, and then conventional back drilling can be used to ingeniously ensure high-precision alignment of first drilling and back drilling, and at the same time, the step of drilling will be eliminated to reduce the risk of open circuit quality caused by broken copper.
在本申请一实施方式中，所述一钻孔的孔径为D，所述H/D≥20。In an embodiment of the present application, the diameter of the drilled hole is D, and the H/D≧20.
在本申请一实施方式中，D≤0.2mm。In one embodiment of the present application, D≤0.2mm.
在本申请一实施方式中，所述背钻孔的孔径为D+c，其中，152.40μm≤c≤254.00μm。In an embodiment of the present application, the diameter of the back-drilled hole is D+c, wherein, 152.40 μm≤c≤254.00 μm.
在本申请一实施方式中，c约为203.20μm。In one embodiment of the present application, c is about 203.20 μm.
在本申请一实施方式中，所述PCB加工过程中钻孔使用的钻机为CCD钻机。使用CCD钻机完成整个钻孔过程，保证过程涨缩匹配。In one embodiment of the present application, the drilling machine used for drilling holes in the PCB processing process is a CCD drilling machine. Use the CCD drill to complete the entire drilling process to ensure that the expansion and contraction of the process match.
根据本申请一实施方式，所述加工背钻孔，采用常规控深钻进行背钻孔加工。采用常规方式进行背钻加工即可。如在背钻程序中设置需要的背钻深度，然后生产加工则选取具有导电控深功能的钻机，最后在需要背钻加工的PCB上盖上铝片、冷冲板胶带贴牢即可完成背钻加工。According to an embodiment of the present application, the processing of the back-drilled hole is carried out by conventional controlled depth drilling. Back drilling can be done in conventional way. For example, set the required back-drilling depth in the back-drilling program, then choose a drilling machine with conductive depth control function for production and processing, and finally cover the PCB that needs back-drilling processing with aluminum sheet and cold stamping tape to complete the back-drilling process. Drill processing.
本实施例方案使用双面控深钻的方式加工一钻孔，但一钻孔的阶梯位置随着背钻孔深度的变化而变化，且始终保证对钻的阶梯会被背钻刀钻掉，保证高精度的一钻和背钻对位，同时把对钻阶梯消除减少断铜带来的开路品质风险。通过本申请方案制备的PCB中不存在阶梯，不易出现断铜，具有良好的加工效果，尤其适用于厚板小孔加工。The scheme of this embodiment uses double-sided depth control drilling to process a drill hole, but the step position of a drill hole changes with the depth of the back-drilling hole, and it is always guaranteed that the step of the counter-drilling tool will be drilled off by the back-drilling tool. Guarantee high-precision first-drill and back-drill alignment, and at the same time eliminate the alignment step to reduce the risk of open circuit quality caused by broken copper. The PCB prepared by the solution of the present application does not have steps, is not easy to break copper, has good processing effect, and is especially suitable for processing small holes in thick plates.
在一钻孔加工时，采用双面钻孔，一钻孔对应双面背钻孔且刀径相等，双面一钻孔的深度也可以相等，背钻孔的深度不相等，可以保证一钻时形成阶梯尽可能地位于板厚的中间位置，最大限度地减少一钻偏位的情况。双面一钻孔的深度可以相等也可以不相等，具体还要根据背钻的深度进行控制，首先应保证一钻孔时形成阶梯位于背钻深度较深的背钻孔内部。(背钻孔的深度也可以相等，相等时，则一钻孔形成的阶梯位于任一面背钻孔中，在背钻加工过程中将阶梯去除。)In one drilling process, double-sided drilling is used. One drilling corresponds to double-sided back drilling and the tool diameter is equal. The depth of double-sided one drilling can also be equal. When forming a step, it should be located in the middle of the plate thickness as much as possible to minimize the deviation of a drill. The depth of the first hole on both sides can be equal or not, and it should be controlled according to the depth of the back drilling. First, it should be ensured that the step formed during the first drilling is located inside the back drilling with a deeper back drilling depth. (The depths of the back-drilled holes can also be equal. When equal, the step formed by a drilled hole is located in the back-drilled hole on either side, and the step is removed during the back-drilled process.)
根据本申请的PCB加工方法的实施方式，至少具有以下有益效果：区别于相关技术中的加工方法中始终存在会导致断铜的对钻阶梯，通过本申请的方法进行双面控深等大对钻的设计，可有效实现厚板小孔加工。本申请方案的阶梯随背钻深度变化而变化，始终保证对钻的阶梯会被背钻刀钻掉，保证高精度的一钻和背钻对位，同时将钻阶梯消除可减少断铜带来的开路品质风险。本申请的方案将加工过程具体分为一钻孔加工和背钻孔加工，在一钻孔加工时，将一钻 孔拆分为双面控深等大刀径对钻，等大对钻即使存在阶梯亦可在背钻加工时去除，不会存在阶梯导致电镀断铜的问题，将同一孔双面背钻的扎拆分为两面控深等大刀径对钻。According to the implementation of the PCB processing method of the present application, it has at least the following beneficial effects: Different from the processing methods in the related art, there are always counter-drilling steps that will cause copper breakage, and the method of the present application can be used to control the depth of both sides. The design of the drill can effectively realize the processing of small holes in thick plates. The step of this application scheme changes with the depth of the back drill, and always ensures that the step of the counter-drill will be drilled off by the back drill, ensuring high-precision alignment between the first drill and the back-drill, and eliminating the drill step can reduce the risk of copper breakage open circuit quality risk. The scheme of this application divides the machining process into a drilling process and a back drilling process. During a drilling process, a drilling hole is split into double-sided depth control and equal large tool diameter counter-drilling. The steps can also be removed during the back drilling process, and there will be no problem of broken copper plating caused by the steps. The double-sided back-drilled bar of the same hole is split into two-sided depth control and other large-diameter counter-drilling.
实施例2Example 2
本实施例制备了一种PCB，与实施例1的区别仅在于：a的取值为0.1mm，b的取值为0.05。A PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.1 mm, and the value of b is 0.05.
根据本申请的PCB，至少具有以下有益效果：通过本申请方法制备得到的钻背钻与一钻不易出现偏位问题，钻孔精度高，可有效地在厚板上精准加工出小孔。According to the PCB of the present application, it has at least the following beneficial effects: the back drill and the first drill prepared by the method of the present application are not prone to misalignment, the drilling precision is high, and small holes can be accurately processed on thick plates effectively.
实施例3Example 3
本实施例制备了一种PCB，与实施例1的区别仅在于：a的取值为0.3mm，b的取值为0.1。A PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.3mm, and the value of b is 0.1.
实施例2和3制得的PCB的孔加工效果与图5类似，为避免冗余，未逐一示出。The hole processing effects of the PCBs prepared in Examples 2 and 3 are similar to those in FIG. 5 , and are not shown one by one to avoid redundancy.
对比例1Comparative example 1
本对比例制备了一种PCB，如图6所示，与实施例1的区别在于：S1采用的是常规的双面等深等大对钻。采用该方法将使得阶梯存在于孔内，且一钻孔产生的阶梯位于背钻深度较深一侧，但一钻的深度大于背钻的深度，阶梯形成于背钻深度较深的背钻孔之外，这将导致阶梯孔无法被去除。一钻孔如图7所示，孔径可达0.56mm(通常需在0.4mm以上)。该加工方法的一钻孔孔径较大，且阶梯无法有效去除，使得该位置极易出现断铜，从而导致内开失效。In this comparative example, a PCB is prepared, as shown in FIG. 6 , the difference from Example 1 is that S1 uses conventional double-sided equal depth and equal size drills. Using this method will make the step exist in the hole, and the step produced by the first drill hole is located on the deeper side of the back drill depth, but the depth of the first drill is greater than the back drill depth, and the step is formed in the back drill hole with a deeper back drill depth Additionally, this will result in stepped holes that cannot be removed. A drilled hole is shown in Figure 7, the hole diameter can reach 0.56mm (usually need to be above 0.4mm). In this processing method, the diameter of a drilled hole is relatively large, and the steps cannot be effectively removed, which makes it very easy to break copper at this position, resulting in the failure of the inner opening.

Claims (10)

  1. 一种PCB加工方法，包括：A PCB processing method, comprising:
    取待钻孔PCB，在一钻孔加工时，采用双面钻孔，所述一钻孔对应双面背钻孔且刀径相等，所述双面背钻孔的深度相等或不等；若所述双面背钻孔的深度相等，则控制一钻孔加工时形成的阶梯位于任一面背钻孔中；若所述双面背钻孔的深度不等，则控制一钻孔加工时形成的阶梯位于背钻深度较深的背钻孔内部；及Take the PCB to be drilled, and use double-sided drilling during a drilling process, the first drilling corresponds to the double-sided back drilling and the tool diameter is equal, and the depth of the double-sided back drilling is equal or unequal; if If the depths of the double-sided back-drilled holes are equal, the step formed during the control-one drilling process is located in any one-sided back-drilled hole; The step is located inside the backdrilled hole with a deeper backdrilled depth; and
    加工背钻孔，并将阶梯钻掉。Process the back drill holes and drill out the steps.
  2. 根据权利要求1所述的PCB加工方法，其中：所述背钻孔深度不等，且所述双面钻孔具体为根据两面背钻孔的深度分别控制两面的一钻孔深度：The PCB processing method according to claim 1, wherein: the depth of the back drilling is not equal, and the double-sided drilling is specifically to control the depth of a drilling on both sides according to the depth of the back drilling on both sides:
    在背钻孔深度较深的一面，控制一钻孔入刀的控深深度为A1，背钻孔深度为H1，A1与H1间满足如下关系式：A1＝H1-a+刀尖角长度，所述a的取值如下：0.1mm≤a≤0.3mm；及On the side where the back-drilling depth is deeper, the controlled depth of a drilled hole is A1, and the back-drilling depth is H1. The value of a is as follows: 0.1mm≤a≤0.3mm; and
    在背钻孔深度较浅的一面，控制一钻孔入刀的控深深度为A2，待钻孔PCB的厚度为H，A2与H间满足如下关系式：A2＝H-A1+H*b+刀尖角长度，所述b的取值如下：0.05≤b≤0.1。On the side where the depth of the back drilling is shallower, the control depth of a drilled hole is A2, the thickness of the PCB to be drilled is H, and the relationship between A2 and H satisfies the following relationship: A2=H-A1+H*b+ The angle length of the tool nose, the value of b is as follows: 0.05≤b≤0.1.
  3. 根据权利要求2所述的PCB加工方法，其中：所述a的取值如下：0.15mm≤a≤0.25mm。The PCB processing method according to claim 2, wherein: the value of a is as follows: 0.15mm≤a≤0.25mm.
  4. 根据权利要求3所述的PCB加工方法，其中：所述a约为0.2mm。The PCB processing method according to claim 3, wherein: said a is about 0.2mm.
  5. 根据权利要求2所述的PCB加工方法，其中：所述b的取值如下：0.07≤b≤0.09。The PCB processing method according to claim 2, wherein: the value of b is as follows: 0.07≤b≤0.09.
  6. 根据权利要求5所述的PCB加工方法，中：所述b约为0.08。The PCB processing method according to claim 5, wherein: said b is about 0.08.
  7. 根据权利要求1至6任一项所述的PCB加工方法，其中：所述H＞4.0mm。The PCB processing method according to any one of claims 1 to 6, wherein: said H>4.0mm.
  8. 根据权利要求1至6任一项所述的PCB加工方法，其中：所述一钻孔的孔径为D，D≤0.2mm。The PCB processing method according to any one of claims 1 to 6, wherein: the diameter of the drilled hole is D, and D≤0.2mm.
  9. 根据权利要求8所述的PCB加工方法，其中：所述背钻孔的孔径为D+c，其中，152.40μm≤c≤254.00μm。The PCB processing method according to claim 8, wherein: the diameter of the back-drilled hole is D+c, wherein, 152.40 μm≤c≤254.00 μm.
  10. 一种PCB，其中：所述PCB通过如权利要求1至9任一项所述的方法制备得到。A PCB, wherein: the PCB is prepared by the method according to any one of claims 1 to 9.
PCT/CN2022/100059 2021-12-27 2022-06-21 Pcb processing method and pcb WO2023123909A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765296A (en) * 2009-12-31 2010-06-30 深圳崇达多层线路板有限公司 Drilling method of motherboard of circuit board
JP2014187153A (en) * 2013-03-22 2014-10-02 Via Mechanics Ltd Back drilling method for multilayer printed wiring board, drill therefor and board drilling device
CN106332473A (en) * 2015-06-15 2017-01-11 东莞生益电子有限公司 Backboard processing method, adopted die and backboard manufactured by use of processing method
CN106793577A (en) * 2017-01-16 2017-05-31 生益电子股份有限公司 The preparation method and PCB of a kind of High-Speed PCB
CN108617094A (en) * 2018-05-03 2018-10-02 深圳崇达多层线路板有限公司 A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole
CN109348621A (en) * 2018-09-12 2019-02-15 生益电子股份有限公司 A kind of PCB production method and PCB
CN114423161A (en) * 2021-12-27 2022-04-29 生益电子股份有限公司 PCB processing method and PCB

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103025051B (en) * 2012-11-20 2016-02-24 深圳崇达多层线路板有限公司 HDI plate of a kind of mechanical back drill pore structure and preparation method thereof
CN106961798B (en) * 2017-04-19 2019-02-22 广东工业大学 A kind of deep method of PCB aperture processing control

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765296A (en) * 2009-12-31 2010-06-30 深圳崇达多层线路板有限公司 Drilling method of motherboard of circuit board
JP2014187153A (en) * 2013-03-22 2014-10-02 Via Mechanics Ltd Back drilling method for multilayer printed wiring board, drill therefor and board drilling device
CN106332473A (en) * 2015-06-15 2017-01-11 东莞生益电子有限公司 Backboard processing method, adopted die and backboard manufactured by use of processing method
CN106793577A (en) * 2017-01-16 2017-05-31 生益电子股份有限公司 The preparation method and PCB of a kind of High-Speed PCB
CN108617094A (en) * 2018-05-03 2018-10-02 深圳崇达多层线路板有限公司 A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole
CN109348621A (en) * 2018-09-12 2019-02-15 生益电子股份有限公司 A kind of PCB production method and PCB
CN114423161A (en) * 2021-12-27 2022-04-29 生益电子股份有限公司 PCB processing method and PCB

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