CN108617094A - A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole - Google Patents
A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole Download PDFInfo
- Publication number
- CN108617094A CN108617094A CN201810413897.9A CN201810413897A CN108617094A CN 108617094 A CN108617094 A CN 108617094A CN 201810413897 A CN201810413897 A CN 201810413897A CN 108617094 A CN108617094 A CN 108617094A
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- China
- Prior art keywords
- wad cutter
- drilling
- plate
- hole
- multilayer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0214—Back-up or entry material, e.g. for mechanical drilling
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention relates to wiring board production technical fields, specially a kind of to prevent the method that positive and negative drilling dislocation forms stepped hole on wiring board.The present invention produces setting drilling wad cutter on plate by pressing ad hoc fashion in multilayer, allow uses same set of drilling wad cutter as location hole when multilayer produces the obverse and reverse drilling of plate, the position deviation when positive and negative drills can be reduced, positional precision is improved, the probability that through-hole forms stepped hole is reduced.
Description
Technical field
The present invention relates to wiring board production technical fields more particularly to one kind preventing positive and negative drilling dislocation shape on wiring board
At the method for stepped hole.
Background technology
During the manufacturing of assist side, each sandwich circuit board and prepreg are being superimposed on one by the sequence of design
After rising and being press-fitted together as one to form multilayer production plate, it need to be drilled out and be used on multilayer production plate by brill nozzle high speed rotation with drilling machine
Making connection different levels circuit and the hole for installing electronic component, (such as when the plate thickness that multilayer produces plate is long beyond brill nozzle sword
The super thick wiring board of plate thickness >=6.0mm), the tow sides that plate need to be produced in multilayer drill and are allowed to connection respectively forms through-hole.
In the prior art, the method and step that need to be drilled respectively to make through-hole in multilayer production plate tow sides is as follows：
1, it is drilled using the first quartile of numerically controlled drill, the edges of boards that plate is produced in multilayer bore three drilling wad cutters, such as
Shown in Fig. 1.The aperture of drilling wad cutter is generally 3.175mm, is used to bore the brill a length of 10.5mm of nozzle sword in the hole in the aperture in industry,
And the plate thickness of super thick wiring board is generally less than 10.5mm in industry, therefore can once be drilled when making drilling wad cutter.
2, multilayer production plate is face-up, and to drill, wad cutter 3 prevents plank anti-loaded as direction hole, with the wad cutter 1 that drills
With 2 positioning, the periphery holes that five apertures are 3.175mm are bored respectively on multilayer production plate, and periphery holes 1,2,4,5 are given birth to multilayer
Point is symmetrical on the basis of producing the center of plate, as shown in Fig. 2, and needing to make at the through-hole position of through-hole on multilayer production plate
Drilling blind hole, the hole depth of blind hole are about 2/3rds of plate thickness, as shown in Figure 3.
3, it is drilled using the fourth quadrant of numerically controlled drill, multilayer produces the reverse side of plate upward, using periphery holes 3 as side
It prevents plank anti-loaded to hole, is positioned with periphery holes 1,2,5, and drill at the through-hole position that multilayer produces plate, the depth of drilling
About 2/3rds of plate thickness make hole be connected to form through-hole with the blind hole previously made.
The production method of above-mentioned through-hole has the following defects：Due to being made using two sets of different holes when tow sides drill
It being positioned for location hole, deviation is susceptible in boring procedure, the hole dislocation of positive and negative causes to be formed by through-hole to be stepped hole,
As shown in Figure 4.
Invention content
The present invention is susceptible to asking for stepped hole for existing by the method to drill respectively to make through-hole in positive and negative
Topic, provide a kind of prevents from making through-hole by positive and negative drilling in the circuit board by improving and optimizating the setting of location hole
When formed stepped hole method.
To achieve the above object, the present invention uses following technical scheme.
A method of it prevents positive and negative drilling dislocation on wiring board from forming stepped hole, includes the following steps：
S1, the long edges of boards that plate is produced in multilayer bore the first drilling wad cutter and the second drilling wad cutter, are bored in another long edges of boards
Third drills wad cutter and the 4th drilling wad cutter, the first line of the first drilling wad cutter and third the drilling wad cutter and described the
It is parallel that two drilling wad cutters and the second line of the 4th drilling wad cutter produce the short slab side of plate with multilayer respectively, and the first line and the
The long edges of boards that multilayer is produced plate by two lines are divided into trisection, the first drilling wad cutter and third drilling wad cutter and the second drilling
Wad cutter and the 4th drilling wad cutter are symmetrical with short side center line respectively；The short side center line passes through the midpoint of short side and hangs down with short side
Directly；
Direction wad cutter is bored on S2, the short slab side that plate is produced in multilayer；
Face-up, the plate face dress for being used to prevent multilayer from producing plate as direction hole using direction wad cutter of S3, multilayer production plate
Instead, it is positioned by location hole of the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter, at the through-hole position that multilayer produces plate
Drilling blind hole；The through-hole position is that multilayer produces the position for making through-hole on plate；
S4, multilayer produce the reverse side of plate upward, are that the plate face that direction hole is used to prevent multilayer from producing plate fills using direction wad cutter
Instead, it is positioned by location hole of the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter, at the through-hole position that multilayer produces plate
Drilling is extremely connected to the blind hole of the position and forms through-hole.
Preferably, in step S2, the direction wad cutter includes first direction wad cutter and second direction wad cutter.
Preferably, the first direction wad cutter and second direction wad cutter are located at the both sides of short side center line, and first direction
The difference of the vertical range of wad cutter and second direction wad cutter and short side center line is 5mm.
Preferably, in step S3, using first direction wad cutter as direction hole.
Preferably, in step S3, the depth of the blind hole is that multilayer produces 2/3rds of plate plate thickness.
Preferably, it in above-mentioned steps S1 to S3, is drilled using the first quartile of digital control drilling machine.
Preferably, in step S4, using second direction wad cutter as direction hole.
Preferably, in step S4, drilling when institute drilling depth is that multilayer produces 2/3rds of plate plate thickness.
Preferably, it in step S4, is drilled using the fourth quadrant of digital control drilling machine.
Preferably, the aperture of direction wad cutter described above, the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter is equal
For 3.175mm.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention is produced in multilayer on plate by pressing ad hoc fashion
Setting drilling wad cutter so that same set of drilling wad cutter can be used as positioning when multilayer produces the obverse and reverse drilling of plate
Hole can reduce the position deviation when positive and negative drills, and improve positional precision, reduce the probability that through-hole forms stepped hole.
Description of the drawings
Fig. 1 is the schematic diagram of the multilayer production plate after drilling wad cutter in the prior art；
Fig. 2 is the schematic diagram of the multilayer production plate after boring periphery holes in the prior art；
Fig. 3 is the schematic diagram that the multilayer after the drilling blind hole of front produces plate in the prior art；
Fig. 4 is after overleaf drilling in the prior art because dislocation deviation makes through-hole be the schematic diagram of stepped hole.
Fig. 5 is to produce the schematic diagram on plate after drilling wad cutter in multilayer in embodiment；
Fig. 6 is to produce the schematic diagram after boring direction wad cutter on plate in multilayer in embodiment.
Specific implementation mode
In order to more fully understand the technology contents of the present invention, with reference to specific embodiment to technical scheme of the present invention
It is described further and illustrates.
Embodiment
A kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole is present embodiments provided, including following
Step：
It is drilled using the first quartile of digital control drilling machine in following steps 1-3, multilayer produces the face-up of plate.
(1) as shown in figure 5, the first drilling wad cutter and that the long edges of boards hole diameter for producing plate in multilayer is 3.175mm
Two drilling wad cutters, in the third drilling wad cutter and the 4th drilling wad cutter that another long edges of boards hole diameter is 3.175mm, described first bores
Hole wad cutter and the first line of third drilling wad cutter and the second line point of the second drilling wad cutter and the 4th drilling wad cutter
It is parallel with the multilayer production short slab side of plate, and the first line and the second line multilayer is produced plate long edges of boards be divided into it is third
Point, the first drilling wad cutter is with third drilling wad cutter and the second drilling wad cutter and the 4th drilling wad cutter respectively with short side center line pair
Claim；The short side center line is by the midpoint of short side and vertical with short side.
(2) the direction wad cutter that the short slab side hole diameter of plate is 3.175mm is produced in multilayer.In the present embodiment, such as Fig. 6 institutes
Show, direction wad cutter includes first direction wad cutter and second direction wad cutter, and first direction wad cutter and second direction wad cutter are positioned at short
The difference of the vertical range of the both sides of side center line, first direction wad cutter and second direction wad cutter and short side center line is 5mm.
(3) multilayer production plate is face-up, the plate for being used to prevent multilayer from producing plate as direction hole using first direction wad cutter
Face is anti-loaded, is positioned by location hole of the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter, and the through-hole of plate is produced in multilayer
The depth of drilling blind hole at position, blind hole is that multilayer produces 2/3rds of plate plate thickness.The through-hole position is to be used on multilayer production plate
Make the position of through-hole.
(4) it is drilled using the fourth quadrant of digital control drilling machine, multilayer produces the reverse side of plate upward, with second direction target
Hole is that the plate face that direction hole is used to prevent multilayer from producing plate is anti-loaded, with the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter
It is positioned for location hole, drills to the blind hole with the position at the through-hole position that multilayer produces plate and be connected to and form through-hole, when drilling
Institute's drilling depth is that multilayer produces 2/3rds of plate plate thickness.
Through-hole is made by producing the positive and negative drilling of plate in multilayer in a manner of the present embodiment, is inspected by random samples made by 100
Only there are 4 stepped holes in through-hole.
It is described above only with embodiment come the technology contents that further illustrate the present invention, in order to which reader is easier to understand,
But embodiments of the present invention are not represented and are only limitted to this, any technology done according to the present invention extends or recreation, is sent out by this
Bright protection.
Claims (10)
1. a kind of preventing the method that positive and negative drilling dislocation forms stepped hole on wiring board, which is characterized in that include the following steps：
S1, the long edges of boards that plate is produced in multilayer bore the first drilling wad cutter and the second drilling wad cutter, and third is bored in another long edges of boards
Drill wad cutter and the 4th drilling wad cutter, and the first drilling wad cutter is bored with the first line of third drilling wad cutter and described second
Hole wad cutter and the second line of the 4th drilling wad cutter are parallel with the multilayer production short slab side of plate respectively, and the first line and second connects
The long edges of boards that multilayer is produced plate by line are divided into trisection, the first drilling wad cutter and third drilling wad cutter and the second drilling wad cutter
It is symmetrical with short side center line respectively with the 4th drilling wad cutter；The short side center line is by the midpoint of short side and vertical with short side；
Direction wad cutter is bored on S2, the short slab side that plate is produced in multilayer；
S3, multilayer produce the face-up of plate, are that the plate face that direction hole is used to prevent multilayer from producing plate is anti-loaded using direction wad cutter, with
First wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter position for location hole, are bored at the through-hole position that multilayer produces plate blind
Hole；The through-hole position is that multilayer produces the position for making through-hole on plate；
S4, multilayer produce the reverse side of plate upward, are that the plate face that direction hole is used to prevent multilayer from producing plate is anti-loaded using direction wad cutter, with
First wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter be location hole positioning, multilayer produce plate through-hole position at drill to
It is connected to the blind hole of the position and forms through-hole.
2. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 1, special
Sign is：In step S2, the direction wad cutter includes first direction wad cutter and second direction wad cutter.
3. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 2, special
Sign is：The first direction wad cutter and second direction wad cutter are located at the both sides of short side center line, and first direction wad cutter and
The difference of the vertical range of two direction wad cutters and short side center line is 5mm.
4. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 1, special
Sign is：In step S3, using first direction wad cutter as direction hole.
5. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 4, special
Sign is：In step S3, the depth of the blind hole is that multilayer produces 2/3rds of plate plate thickness.
6. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 1, special
Sign is：In step S1 to S3, drilled using the first quartile of digital control drilling machine.
7. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 1, special
Sign is：In step S4, using second direction wad cutter as direction hole.
8. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 7, special
Sign is：In step S4, drilling when institute drilling depth is that multilayer produces 2/3rds of plate plate thickness.
9. a kind of method for preventing the drilling dislocation of positive and negative on wiring board from forming stepped hole according to claim 8, special
Sign is：In step S4, drilled using the fourth quadrant of digital control drilling machine.
10. preventing positive and negative drilling dislocation on wiring board from forming stepped hole according to claim 1-9 any one of them is a kind of
Method, it is characterised in that：The direction wad cutter, the first wad cutter, the second wad cutter, third wad cutter and the 4th wad cutter aperture be
3.175mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810413897.9A CN108617094A (en) | 2018-05-03 | 2018-05-03 | A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810413897.9A CN108617094A (en) | 2018-05-03 | 2018-05-03 | A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617094A true CN108617094A (en) | 2018-10-02 |
Family
ID=63661712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810413897.9A Pending CN108617094A (en) | 2018-05-03 | 2018-05-03 | A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108617094A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110461096A (en) * | 2019-08-23 | 2019-11-15 | 深圳市星河电路股份有限公司 | A kind of processing method of segmentation conducting stepped hole |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4898636A (en) * | 1989-05-04 | 1990-02-06 | Rigling Walter S | Multilayer printed wiring registration method and apparatus |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN107318222A (en) * | 2017-08-25 | 2017-11-03 | 郑州云海信息技术有限公司 | A kind of prevention PCB throws reverse PCB Mark points, pcb board card and the method for line |
-
2018
- 2018-05-03 CN CN201810413897.9A patent/CN108617094A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4898636A (en) * | 1989-05-04 | 1990-02-06 | Rigling Walter S | Multilayer printed wiring registration method and apparatus |
| CN101765296A (en) * | 2009-12-31 | 2010-06-30 | 深圳崇达多层线路板有限公司 | Drilling method of motherboard of circuit board |
| CN107318222A (en) * | 2017-08-25 | 2017-11-03 | 郑州云海信息技术有限公司 | A kind of prevention PCB throws reverse PCB Mark points, pcb board card and the method for line |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110461096A (en) * | 2019-08-23 | 2019-11-15 | 深圳市星河电路股份有限公司 | A kind of processing method of segmentation conducting stepped hole |
| CN114423161A (en) * | 2021-12-27 | 2022-04-29 | 生益电子股份有限公司 | PCB processing method and PCB |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181002 |