CN106332473A - Backboard processing method, adopted die and backboard manufactured by use of processing method - Google Patents
Backboard processing method, adopted die and backboard manufactured by use of processing method Download PDFInfo
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- CN106332473A CN106332473A CN201510330870.XA CN201510330870A CN106332473A CN 106332473 A CN106332473 A CN 106332473A CN 201510330870 A CN201510330870 A CN 201510330870A CN 106332473 A CN106332473 A CN 106332473A
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- backboard
- lower mold
- target
- processing method
- rivet
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insertion Pins And Rivets (AREA)
Abstract
The invention provides a backboard processing method and an adopted die. The backboard processing method comprises following steps of: 1) manufacturing multiple sets of rivet holes and multiple target graphs in/on each sub core board, wherein each set of the rivet holes comprise at least three linearly arranged rivet holes; 2) browning the sub core boards; 3) laminating and riveting the sub core boards to form a backboard, wherein each set of the rivet holes are riveted to two rivet holes; 4) using a target drilling machine to grab target graphs on the backboard and drilling target holes in positions of the target graphs; and 5) using a CCD drilling machine to drill target holes so as to use the target holes as targets, and carrying out front-back face equal-size opposite drilling of functional holes on the backboard in a mode of conductive depth controlling. The method can improve the alignment precision control of the overlapping of all sub core boards in a manufacturing process of the backboard, and improves the machining precision and yield of the backboard.
Description
Technical field
The present invention relates to the manufacture method of circuit board, particularly relate to adding of a kind of multilamellar large scale thickness backboard
Work method and the mould of employing, and the backboard that the method prepares.
Background technology
In PCB industry, backboard is mainboard conventional in Denso, is provided with interface, it is simple to various models
Substrate be inserted in above, such as the mainboard of computer, video card, internal memory, hard disk, CPU is to be inserted into the back of the body
On plate.Backboard powerful, is folded by many sub-core layer and is formed.Each sub-central layer is at layer
Folded when combining, generally pass through rivet.The most conventional riveted uses fixing equally distributed rivet,
Spacing between rivet is big, when make high multilamellar (more than 38 layers) large scale (long limit ＞ 42,
For mile, 1=25.4mm) thick backboard (thickness of slab ＞ 7mm) time there is rivet and fix
It is poor to act on, and the easy layer producing local fixation difference and cause is scrapped, partially especially during moving
Each layer is fixing incessantly easily to be loosened.And the boring method of the backboard of existing thickness of slab ＞ 7mm without
Method ensures to be satisfied by backboard crimping and the requirement of non-depressed junction back drill into knife face with going out position, knife face hole precision,
Therefore cause crimping to be lost efficacy and the residual copper of back drill causes short circuit.Comprehensive above reason, current high multilamellar is big
Size thickness backboard cannot meet Aligning degree and control (mil, mile, 1mil within 7mil
=0.001 English) requirement.
Summary of the invention
In view of the above, the present invention is necessary to provide one can improve multilamellar large scale thickness backboard alignment
The backboard processing method of degree so that high multilamellar large scale thickness backboard can meet Aligning degree and control at 7mil
Within requirement.
A kind of backboard processing method improving multilamellar large scale thickness backboard Aligning degree, described processing method bag
Include following steps,
1) on sub-central layer, process many set rivet holes and some target figures, every suit rivet hole include in
At least three rivet hole of straight line arrangement；
2) sub-central layer brown；
3) some sub-core layer press to close and form backboard, every suit rivet hole at least two rivet holes of riveted；
4) use the target figure bored on target drone crawl backboard, get out target hole in target graph position；
5) use CCD rig, carry out as target, the employing deep mode of conduction control using the target hole got out
Positive and negatives etc. are big to the functional hole getting out backboard.
Further, in step 1) in, sub-central layer is rectangular slab, when plate face is smaller in size than 36
Time target figure 11 design 4, be evenly distributed on four plate Angle Position and away from edges of boards
10mm-20mm；It is designed as 6, on the basis of 4, plate angle when plate face size is more than 36
Two are increased in plate center.
Further, in step 1) in, every suit rivet hole is chosen as three rivet holes, including one
Conventional rivet hole and the increase spacing in conventional rivet hole both sides with conventional rivet hole are
The reinforcing rivet hole of 10mm-30mm.
Further, in step 4) in, the positive and negative of the through backboard in described target hole.
Further, in step 5) in, first select target hole as CCD on the front of backboard
The target of rig, is controlled deep blind brill by conduction, and the thickness of slab of the deep 55%-60% of single-surface drilling, then backboard turns over
Turn, using identical target hole as the target of CCD rig, the reverse side of backboard is carried out conduction control deeply
Boring, bores deep 55%-60% thickness of slab.
Additionally, the present invention is necessary to provide the backboard obtained by a kind of above-mentioned backboard processing method.
A kind of backboard, by the backboard processing method system of described raising multilamellar large scale thickness backboard Aligning degree
?.
Secondly, the present invention is necessary to provide the mould for riveted used in above-mentioned backboard processing method
Tool.
A kind of mould for riveted, including upper mold pin, lower mold pin and lower mold base, upper mold pin can
Moving up and down, lower mold pin is fixed on lower mold base, and lower mold base includes base body and protrudes out the end of at
Boss in seat main body, lower mold pin described in the center projection of boss upper surface, and accordingly at boss
Form the lower die cutter actinal surface of annular on upper surface, lower die cutter actinal surface is convexly equipped with and equidistantly radially extends
Some blade bars, the described mould for riveted also includes lower mold dust shield seat, lower mold dust shield seat
It is installed in base body around described boss, and the upper surface of lower mold dust shield seat exceeds described convex
The upper surface of platform.
A kind of mould for riveted, including upper mold pin, lower mold pin and lower mold base, upper mold pin can
Moving up and down, lower mold pin is fixed on lower mold base, and lower mold base includes base body and protrudes out the end of at
Boss in seat main body, lower mold pin described in the center projection of boss upper surface, and accordingly at boss
Form the lower die cutter actinal surface of annular on upper surface, lower die cutter actinal surface is convexly equipped with and equidistantly radially extends
Some blade bars, the described mould for riveted also include elasticity lower mold packing ring, described lower die-cushion
Circle pad is located on lower die cutter actinal surface.
Further, described lower mold packing ring is two, and one of them ring set is peripheral at boss and pad is located at
Base body, another ring set is peripheral at lower mold pin and pad is located on lower die cutter actinal surface.
Compared to prior art, backboard processing method of the present invention, in step 1) in design overlap rivet more
Riveted, increases rivet fixation, prevents the bad Aligning degree difference caused of single closing-up from causing
Scrap.In step 3) in, use special riveting die structure, i.e. use and touch suction base under cancelling,
Two packing rings are overlapped, it is ensured that thickness of slab is bloomed uniformly more than 7mm backboard riveted rivet, blooms on lower mold pin
Have good stability, without weighing the problem that central layer causes rivet to come off wounded.In step 5) in, use CBD
Conduction control combines CCD bore mode deeply, and to carry out two sides etc. big to brill, it is ensured that turnover position, knife face hole precision
Meet crimping simultaneously and back drill requires within 3mil, thus ensure that height is many by above integrated approach
Layer large scale thickness backboard Aligning degree controls within 7mil.
Accompanying drawing explanation
Described above is only the general introduction of technical solution of the present invention, in order to be illustrated more clearly that the skill of the present invention
Art scheme, will be situated between to the accompanying drawing used required in embodiment or description of the prior art below simply
Continuing, the accompanying drawing in description is only the specific embodiment corresponding to the present invention, skill common for this area
For art personnel, on the premise of not paying creative work, can also be according to this needs when
A little accompanying drawings obtain other accompanying drawing.
Fig. 1 is a kind of back of the body improving multilamellar large scale thickness backboard Aligning degree of present pre-ferred embodiments
The flow chart of plate processing method.
The schematic partial cross-sectional view of each sub-central layer of Fig. 2 present pre-ferred embodiments composition backboard；
Fig. 3 is the schematic surface after the sub-central layer graphic making shown in Fig. 2；
Fig. 4 is to be usually used in being laminated the schematic cross-section of the riveting die that sub-central layer uses (to include lower die cutter
The extraction schematic top plan view of actinal surface)；
Fig. 5 is the schematic cross-section that present pre-ferred embodiments is laminated the riveting die that sub-central layer uses；
The schematic diagram that the target of the Fig. 6 back plate surface by being obtained after sub-central layer pressing designs；
The schematic cross-section that Fig. 7 holes at front CCD by the backboard obtained after sub-central layer pressing；
Fig. 8 is that the cross section that the backboard shown in Fig. 7 carries out CCD boring at reverse side after holing in front shows
It is intended to.
Detailed description of the invention
In order to elaborate the technical scheme that the present invention is taked by reaching predetermined technique purpose, below
The accompanying drawing in the embodiment of the present invention will be combined, the technical scheme in the embodiment of the present invention is carried out clear,
Be fully described by, it is clear that described embodiment be only the present invention section Example rather than
Whole embodiments, and, on the premise of not paying creative work, in embodiments of the invention
Technological means or technical characteristic can replace, come below with reference to the accompanying drawings and in conjunction with the embodiments specifically
The bright present invention.
Refer to Fig. 1, a kind of backboard processing improving multilamellar large scale thickness backboard Aligning degree of the present invention
Method, comprises the steps.
1) sub-central layer graphic making, processes many set rivet holes and some target figures on sub-central layer,
Every suit rivet hole includes at least three rivet hole linearly arranged.Refer to Fig. 2, Fig. 3, figure
Five pieces of sub-central layers 10, each sub-central layer 10 odd number face (i.e. illustrating upper surface) it is provided with shown in 2
Design X-RAY target figure 11, in the present embodiment, sub-central layer 10 is rectangular slab, when plate face chi
Very little when being less than 36 target figure 11 design 4 (shown in Fig. 3), be evenly distributed on plate Angle Position,
Away from edges of boards 10mm-20mm；The design 6 when plate face size is more than 36, i.e. at 4, plate angle
On the basis of plate center increase by two (as shown in Figure 6).Each sub-central layer 10 is opened adjacent to edge
If some set rivet holes 12, every suit rivet hole 12 includes at least three rivet hole, linearly arranges
And with sub-central layer 10 sides aligned parallel.In the present embodiment, it is preferred that every suit rivet hole 12 is chosen as
Three rivet holes, including a conventional rivet hole 121 and increase in conventional rivet hole 121 both sides, with
The spacing of conventional rivet hole 121 is 10mm-30mm and wants with conventional rivet hole 121 same design
The reinforcing rivet hole 122 asked.During riveted, only riveted reinforces rivet hole 122, middle conventional rivet hole
121, as standby riveted rivet hole, use to reinforce on both sides when rivet hole 122 goes wrong, with
Fix use, single most riveted triplet during Shi Zuowei riveted temporarily, during riveted one group, need to be fixed it
The rivet hole of his non-riveted, prevents other position slide plate and off normals.
2) sub-central layer brown；I.e. antithetical phrase core plate surface carries out coarse, when overlapping with enhancer central layer two
Adhesion between two sub-central layers.Specifically, sub-core plate surface is smooth copper face, can pass through copper face oxygen
Change and become coarse.
3) some sub-core layer press conjunction, every suit rivet hole at least two rivet hole riveted.Riveted
Shi Caiyong mould, with the some sub-central layer riveted by lamination.Refer to Fig. 4, Fig. 5, shown in Fig. 4
The riveted mould commonly used for a kind of the applicant of present invention offer, including upper mold pin 21, lower mold
Pin 22, lower mold base 23 and lower mold dust shield seat 24.Upper mold pin 21 can move up and down, lower mold
Pin 22 is fixed on lower mold base 23, and lower mold base 23 includes base body 231 and protrudes out the end of at
Boss 232 in seat main body 231, lower mold pin 22 described in the center projection of boss 232 upper surface, and
And on boss 232 upper surface, form annular lower die cutter actinal surface 233, lower die cutter actinal surface 233 accordingly
On be formed with the some blade bars 2331 equidistantly radially extended, blade bar 2331 is protruding small
Contract type body, in order to be cut into some by the perisporium of rivet lower end so that rivet when by rivet punching press
Bottom bloom formation some affixed bar bendings be fixed to sub-central layer bottom surface.Lower mold dust shield seat 24 is fixed
Around described boss 232 in base body 231, in order to hold the some sub-central layer of stacking, and
The upper surface of lower mold dust shield seat 24 is slightly higher than described boss 232 upper surface, to be reserved at the bottom of rivet
The affixed bar wider space of end Post flowering.During punching press, it is provided that some sub-central layers 25, by some sub-cores
Plate 25 stacking, rivet hole 12 position on each sub-central layer 25 aligns, and is carried on lower mold dust suction
On cover seat 24, lower mold pin 22 is through the rivet hole 12 of sub-central layer 25；Rivet 26, rivet are provided
26 lower ends are hollow sleeve structure, and rivet 26 lower end is set on lower mold pin 22, then upper mold 21
Punching press downwards, the head of a nail face of rivet 26 is fixed on the sub-central layer end face of top, the bottom of rivet 26
The some affixed bar bendings of formation of blooming are fixed to the sub-central layer bottom surface of lowermost end.So by rivet 24 riveting
It is combined on the some sub-central layer 25 of stacking, some sub-central layers 25 are connected into holistic backboard.
But, conventional riveted mould is fixed component due to lower mold dust shield seat 24, in punching press
Time relatively exceed the distance of described boss 232 upper surface and fix, during riveted, upper mold pin 21 is in cylinder pressure
Rivet head of a nail face is impacted, owing to lower mold dust shield 24 is fixing, when rivet 26 drives the most folded under power
When the sub-central layer got togather is pressed for 25 times, lower mold dust shield 24 can be to the strongest instead the making of sub-central layer 25 1
Firmly, the common left and right of the pressure of this active force and upper mold pin 21 cylinder can cause sub-central layer 25 to weigh wounded broken
Damaging, final rivet fixation lost efficacy, and affected the active force of rivet and lower die cutter actinal surface 233 simultaneously,
Rivet is caused to be bloomed uneven.
Fig. 5 show the riveted mould of a kind of improvement that the present invention provides, and thes improvement is that, will
Lower mold dust shield 24 removes, and replaces with the resilient lower mold packing ring 27 of tool, and lower mold packing ring 27 pad sets
On lower die cutter actinal surface 233.It is preferred that select two lower mold packing rings 27, for rubber in the present embodiment
Glue material is made, and one of them ring set is peripheral at boss 232 and pad is located at base body 231, can be right
Boss 232 plays a protective role, and another ring set is peripheral at lower mold pin 22 and pad is located at the lower mold edge of a knife
On face 233.When upper mold 21 downward punching press, owing to rubber has good compression performance, do not deposit
Weighing wounded of antithetical phrase central layer, meanwhile, the formation if will not be bloomed in the bottom of rivet 26 by lower mold packing ring 27
The solid extension connecing bar is formed and stops, affixed bar bending can extend to the sub-central layer bottom surface of lowermost end, nail
Cap does not comes off, simultaneously rivet bloom stablize controlled.Improve pressing stability further, in punching press
Also pressing time can be extended to 1.5 seconds-2.0 seconds.
4) use x-ray to bore target drone and capture target figure 11 by ray, bore in target graph position
Bid wad cutter 13.Specifically, the backboard obtained is fixed to an x-ray bores on target drone after lamination riveted,
Use x-ray ray to capture target, the mode that face can be used to compensate, calculate target figure 11
Center, then gets out the x-ray target hole 13 of edges of boards (in conjunction with referring to accordingly in target graph position
Fig. 6), the through backboard in target hole 13.
5) using the target hole 13 that gets out as the target of CCD rig, used by CCD rig
Conduction controls deep mode, and to carry out positive and negative etc. big to the functional hole getting out backboard.Specifically, will get out
Backboard behind target hole 13 is placed and is fixed on a CCD rig, the photographic head scanning of CCD rig
To the position (can be any three target holes 13) in target hole 13, in this, as datum mark, then
According to datum mark, calculate and move the position needing boring to backboard, backboard gets out needs
Functional hole.Blocked up in view of back plate thickness, the blade of drill may fall short of and drill is drilled the deepest
Stress is the biggest, it is possible to be damaged to get into blade, during boring, uses conduction to control deep mode and carries out positive and negative
Faces etc. are big to brill.Refer to Fig. 7, Fig. 8, using target hole 13 as the target of CCD rig, first
Deep blind brill is controlled by conduction in the front 31 of backboard, it is ensured that the thickness of slab of the deep 55%-60% of single-surface drilling, so
Backed off after random drill, overturns rearmounted on CCD rig by backboard, with identical X-RAY target hole
13, as the target of CCD rig, carry out conduction control gun drilling to the reverse side 32 of backboard, bore deep
55%-60% thickness of slab, positive and negative etc. is greatly to brill, and very grave folded 5%-10% is bored on two sides.So, on backboard
Get out functional hole 33.Positive and negative etc. is carried out greatly to brill by using CCD rig conduction to control deep mode
Hole, it is ensured that the registration at two face centers of holing, and it is long to reduce drill sword, can make
Bore the slab of 8mm-10mm, and drill sword length by the drill of common sword length, then rigidity is strong,
The risk of breaking can be reduced, it is ensured that borehole accuracy controls within 3mil.
6) functional hole after getting out is electroplated and follow-up flow process.
To sum up, backboard processing method of the present invention is by design many sets rivet hole riveted, every suit rivet hole
Including at least three rivet hole linearly arranged, rivet fixation can be reinforced, prevent single rivet
The Aligning degree that defective to staking causes is poor and causes scrapping of backboard.When riveted, use brand-new riveted
Mould, by cancelling lower mold dust shield seat, overlaps packing ring, it is ensured that thickness of slab is more than 7mm on lower mold pin
In backboard riveted, rivet is bloomed uniformly, blooms and has good stability, and causes rivet to come off without weighing central layer wounded
Problem；Additionally, use the deep two sides etc. of carrying out with CCD bore mode of CBD conduction control greatly to brill,
Use pin to fix after backboard by the way of normal drill bit machining functions hole compared to traditional, protect
Card turnover position, knife face hole precision, meets crimping simultaneously and back drill requires within 3mil；By using
Above-mentioned steps flow process processing backboard, it is ensured that high multilamellar large scale thickness backboard Aligning degree controls at 7mil
Within.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any form
On restriction, although the present invention is disclosed above with preferred embodiment, but is not limited to this
Bright, any those skilled in the art, in the range of without departing from technical solution of the present invention, when can
The technology contents utilizing the disclosure above is made a little change or is modified to the Equivalent embodiments of equivalent variations,
In every case it is without departing from technical solution of the present invention content, according to the technical spirit of the present invention, the present invention's
Within spirit and principle, any simple amendment, equivalent and the improvement that above example is made
Deng, within all still falling within the protection domain of technical solution of the present invention.
Claims (9)
1. a backboard processing method, it is characterised in that: described processing method comprises the following steps,
1) on sub-central layer, process many set rivet holes and some target figures, every suit rivet hole include in
At least three rivet hole of straight line arrangement；
2) sub-central layer brown；
3) some sub-core layer press to close and form backboard, every suit rivet hole at least two rivet holes of riveted；
4) use the target figure bored on target drone crawl backboard, get out target hole in target graph position；
5) use CCD rig, carry out as target, the employing deep mode of conduction control using the target hole got out
Positive and negatives etc. are big to the functional hole getting out backboard.
Backboard processing method the most according to claim 1, it is characterised in that: step 1) in, sub-core
Plate is rectangular slab, and when plate face is smaller in size than 36, target figure 11 designs 4, is evenly distributed on
Four plate Angle Position and away from edges of boards 10mm-20mm；It is designed as 6 when plate face size is more than 36
Individual, on the basis of 4, plate angle, increase by two in plate center.
Backboard processing method the most according to claim 1, it is characterised in that: step 1) in, each
Set rivet hole be chosen as three rivet holes, including a conventional rivet hole and increase at conventional rivet hole two
Side and the reinforcing rivet hole that spacing is 10mm-30mm of conventional rivet hole.
Backboard processing method the most according to claim 1, it is characterised in that: step 4) in, described
The positive and negative of the through backboard in target hole.
Backboard processing method the most according to claim 1, it is characterised in that: step 5) in, first exist
Select target hole as the target of CCD rig on the front of backboard, conduction control deep blind brill, one side
Bore the thickness of slab of deep 55%-60%, then backboard upset, using identical target hole as CCD rig
Target, carries out conduction control gun drilling to the reverse side of backboard, bores deep 55%-60% thickness of slab.
6. a backboard, it is characterised in that described backboard is by the back of the body described in any one of claim 1 to 5
Plate processing method prepares.
7. the backboard processing method described in an any one of claim 1 to 5 uses for riveted
Mould, including upper mold pin (21), lower mold pin (22) and lower mold base (23), upper mold pin (21)
Can move up and down, lower mold pin (22) is fixed on lower mold base (23), it is characterised in that: lower mold
Base (23) includes base body (231) and the boss (232) protruding out in base body (231),
Lower mold pin (22) described in the center projection of boss (232) upper surface, and accordingly in boss (232)
Forming the lower die cutter actinal surface (233) of annular on upper surface, lower die cutter actinal surface is convexly equipped with on (233)
Some blade bars (2331) that spacing radially extends, the described mould for riveted also includes lower mold
Dust shield seat (24), lower mold dust shield seat (24) is installed in base body (231) around described
Boss (232), and the upper surface of lower mold dust shield seat (24) exceeds described boss (232)
Upper surface.
8. the backboard processing method described in an any one of claim 1 to 5 uses for riveted
Mould, including upper mold pin (21), lower mold pin (22) and lower mold base (23), upper mold pin (21)
Can move up and down, lower mold pin (22) is fixed on lower mold base (23), it is characterised in that: lower mold
Base (23) includes base body (231) and the boss (232) protruding out in base body (231),
Lower mold pin (22) described in the center projection of boss (232) upper surface, and accordingly in boss (232)
Forming the lower die cutter actinal surface (233) of annular on upper surface, lower die cutter actinal surface is convexly equipped with on (233)
Some blade bars (2331) that spacing radially extends, the described mould for riveted also includes elasticity
Lower mold packing ring (27), described lower mold packing ring (27) pad be located on lower die cutter actinal surface (233).
Mould for riveted the most according to claim 8, it is characterised in that: described lower mold packing ring
(27) being two, one of them ring set is peripheral at boss (232) and pad is located at base body (231),
Another ring set is peripheral at lower mold pin (22) and pad is located on lower die cutter actinal surface (233).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510330870.XA CN106332473B (en) | 2015-06-15 | 2015-06-15 | Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510330870.XA CN106332473B (en) | 2015-06-15 | 2015-06-15 | Back plate processing method, mold adopted by back plate processing method and back plate manufactured by back plate processing method |
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| CN106332473B CN106332473B (en) | 2019-12-20 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110788927A (en) * | 2019-11-13 | 2020-02-14 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
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| CN110788927A (en) * | 2019-11-13 | 2020-02-14 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
| CN110788927B (en) * | 2019-11-13 | 2021-12-28 | 莆田市涵江区依吨多层电路有限公司 | Hole opening method for printed circuit board thickness core combined product of 5G high-end server |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
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Address after: 523127, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee after: SHENGYI ELECTRONICS Co.,Ltd. Address before: 523127, Guangdong, Dongcheng District province (the same sand) science and Technology Industrial Park, No. 33, vibration road, Dongguan Patentee before: DONGGUAN SHENGYI ELECTRONICS Ltd. |