CN213462429U - Plate to be drilled and printed circuit board - Google Patents
Plate to be drilled and printed circuit board Download PDFInfo
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- CN213462429U CN213462429U CN202021627388.5U CN202021627388U CN213462429U CN 213462429 U CN213462429 U CN 213462429U CN 202021627388 U CN202021627388 U CN 202021627388U CN 213462429 U CN213462429 U CN 213462429U
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Abstract
The utility model discloses a treat drilling plate and printed wiring board, wherein, treat that drilling plate includes: a multi-layer base layer; the multilayer copper layer and the multilayer base layer are sequentially stacked and attached, and the multilayer copper layer comprises a to-be-drilled area and a pressing area; the drill bit comprises a copper layer, a drill bit and a guide structure, wherein the copper layer to be drilled is provided with the guide structure, and the thickness of the copper layer at the position of the guide structure is smaller than the thickness of the copper layer at other positions so as to guide the operation direction of the drill bit during drilling operation; through the structure, the utility model discloses a treat that drilling plate can reduce the phenomenon that the skew takes place among the drill bit drilling process through the drilling direction that sets up the guide bit of guide structure to the banded copper smear metal that produces when reducing the drilling, thereby reduce the extrusion to drill bit helicla flute and pore wall, prolong the life of drill bit.
Description
Technical Field
The utility model relates to a processing printed wiring board's technical field especially relates to a treat drilling plate and printed wiring board.
Background
Pcb (printed Circuit board), also known as printed Circuit board or printed Circuit board, is an important electronic component used in a wide range of applications, is a support for electronic components, and is also a carrier for electrical connection of electronic components. Printed circuit boards are widely used in various electronic products. At present, with the integration of electronic product functions, the structure of the printed circuit board is developing towards higher density, and the demand of the through hole structure is also developing towards higher thickness-to-diameter ratio.
Due to the fact that the demand of the through hole structure develops towards the direction of higher thickness-diameter ratio, the phenomenon of through hole deviation in the preparation process of the through hole is more and more obvious. The quality of the through holes with high thickness-diameter ratio is more and more difficult to ensure. Meanwhile, the plate similar to an automobile thick copper plate or a communication plate with a high thickness-diameter ratio has the copper layer becoming thicker and thicker due to the increasing heat dissipation requirement in the industry. And excessive copper layers can generate excessive copper cuttings during drilling, so that the cutting of a drill is influenced, and the quality of a copper hole is reduced.
At present, the problems of deviation of a through hole with a high thickness-diameter ratio and chip removal pressure of a thick copper plate are relieved by increasing pre-drilling and step-by-step drilling in the industry, but the improvement window of the method is narrow, and the improvement capacity is limited. The process greatly prolongs the processing time of the printed circuit board, and causes certain capacity waste.
SUMMERY OF THE UTILITY MODEL
The utility model provides a treat drilling plate and printed wiring board to solve the too big problem of high thickness ratio off normal and thick copper sheet chip removal pressure that exists among the prior art.
In order to solve the technical problem, the utility model provides a treat drilling plate treats drilling plate and includes: a multi-layer base layer; the multilayer copper layer and the multilayer base layer are sequentially stacked and attached, and the multilayer copper layer comprises a to-be-drilled area and a pressing area; the drill bit comprises a copper layer, a drill bit and a guide structure, wherein the copper layer to be drilled is provided with the guide structure, and the thickness of the copper layer at the position of the guide structure is smaller than the thickness of the copper layer at other positions so as to guide the operation direction of the drill bit during drilling operation.
The guide structure is symmetrical along the center of the axis of the area to be drilled and is uniformly distributed around or on the axis.
The guide structure comprises a plurality of substructures which are arranged along the axis center of the region to be drilled in a central symmetry mode.
The plurality of substructures comprise a plurality of through holes or a plurality of grooves which are arranged on the region to be drilled of each copper layer.
Wherein the shape of the radial section of the substructure along the region to be drilled is one or a combination of a circle, a square, a triangle, a torus and an irregular figure.
Wherein the sum of the areas of the plurality of substructures along the radial cross section of the region to be drilled is less than the area of the radial cross section of the region to be drilled and is greater than one third of the area of the radial cross section of the region to be drilled.
Wherein, the edge line of guide structure and the edge line interval setting of waiting to bore the district.
The guide structure is prepared by an inner layer pattern process.
The region to be drilled is the position of a through hole on each copper layer needing to be drilled by a drill, and the positions of the regions to be drilled of each copper layer are the same.
The utility model also provides a printed wiring board, the drilling of waiting of printed wiring board by above-mentioned arbitrary one is made.
The utility model has the advantages that: be different from prior art's condition, the utility model discloses a treat drilling plate includes: a multi-layer base layer; the multilayer copper layer and the multilayer base layer are sequentially stacked and attached, and the multilayer copper layer comprises a to-be-drilled area and a pressing area; the drill bit comprises a copper layer, a drill bit and a guide structure, wherein the copper layer to be drilled is provided with the guide structure, and the thickness of the copper layer at the position of the guide structure is smaller than the thickness of the copper layer at other positions so as to guide the operation direction of the drill bit during drilling operation. Through the structure, the utility model discloses a treat that drilling plate can guide the drilling direction of drill bit through guide structure's setting, reduce the phenomenon that the skew takes place among the drill bit drilling process to the banded copper smear metal that produces when reducing the drilling, thereby reduce and extrude the life of extension drill bit to drill bit helicla flute and pore wall.
Drawings
Fig. 1 is a schematic structural diagram of an embodiment of a plate to be drilled according to the present invention;
fig. 2 is a schematic structural diagram of another embodiment of a plate to be drilled according to the present invention;
FIG. 3 is a schematic radial cross-sectional view of the region 211 to be drilled in the embodiment of FIG. 2;
fig. 4 is a schematic radial cross-sectional view of a further embodiment of a region to be drilled according to the present invention;
fig. 5 is a schematic structural diagram of an embodiment of a printed wiring board provided by the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that if directional indications (such as up, down, left, right, front, and back … …) are referred to in the embodiments of the present application, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present application, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present application.
Referring to fig. 1, fig. 1 is a schematic structural diagram of an embodiment of a plate to be drilled according to the present invention.
The plate member to be drilled 10 of the present embodiment includes: a multilayer copper layer 11 and a multilayer base layer 12. The multiple copper layers 11 and the multiple base layers 12 are sequentially stacked and attached to form the board 10 to be drilled. The "multilayer" described in the present invention includes two or more layers.
Each copper layer 11 includes a region to be drilled 111 and a bonding region 112. The region to be drilled 111 is a position on each copper layer 11 where a through hole needs to be drilled by a drill, and the position of the region to be drilled 111 of each copper layer 11 on the copper layer 11 is the same. Stitching region 112 is configured to be disposed in conformance with substrate 12.
Each region to be drilled 111 is provided with a guide structure 1111, and the guide structures 1111 are arranged in the region to be drilled 111 and are arranged in a central symmetry along the axis 1112 of the region to be drilled 111. The guide 1111 is formed by an inner pattern etching process and is formed simultaneously with an inner pattern (not shown) of the plate 10 to be drilled. The preparation method can utilize the inner layer pattern etching procedure required by the plate 10 to be drilled to prepare, so that the production capacity expenditure is reduced on the premise of not additionally adding a new procedure.
The guiding structure 1111 comprises a plurality of sub-structures 110 disposed on the copper layers 11 at the region 111 to be drilled, wherein the sub-structures of the embodiment are grooves. The plurality of substructures 110 are arranged centrosymmetrically along an axis 1112 of the region 111 to be drilled. In the present embodiment, the depth of the plurality of sub-structures 110 is determined by the thickness of the copper layer 11 and the thickness of the copper layer 11 to be etched in the inner layer patterning process, so as to achieve the purpose of satisfying the depth of the sub-structures 110 without increasing extra steps.
The plurality of sub-structures 110 in the guiding structure 1111 are uniformly and equidistantly distributed around the axis 1112 of the region 111 to be drilled and are centrosymmetric, so as to provide uniform supporting force for the drill bit, thereby reducing the occurrence of drilling deviation during the drilling process of the drill bit. The guide structure 1111 of the present embodiment is not provided with the substructure 110 on the axis 1112 of the region to be drilled 111, but in other embodiments, the substructure 110 may be provided on the axis 1112 of the region to be drilled 111 with a central symmetry to the axis 1112.
In a specific implementation scenario, when drilling the region 111 to be drilled of the plate 10 to be drilled, the drill drills from the outer side of the plate 10 to be drilled to the inner side of the plate 10 to be drilled, wherein the drill tip of the drill drills in alignment with the axis 1112 of the region 111 to be drilled. At this time, the guiding structure 1111 is arranged on the region 111 to be drilled, so that the copper amount on the region 111 to be drilled is reduced, the amount of strip-shaped copper cuttings generated during drilling of the drill is further reduced, and the phenomenon of extruding the spiral groove and the hole wall of the drill is reduced, thereby ensuring the quality of the hole wall and reducing the abrasion of the drill. Meanwhile, the guiding structure 1111 is disposed inside the region to be drilled 111, so that the cutting force applied to the drill while drilling the region to be drilled 111 is reduced. Therefore, if the drill bit deviates in the drilling process, the drilling force difference opposite to the deviation direction is formed in the cutting process of the drill bit due to the fact that the drilling force of the pressing area 112 is larger than that of the area to be drilled 111, and the drill bit returns to the target hole position again to play a role in correcting the deviated drill bit.
The plate to be drilled of the embodiment is provided with the guide structures at the same positions of the regions to be drilled of the copper layers through the inner layer pattern process, so that the space of the regions to be drilled on the copper layers is reduced on the premise of not increasing an additional preparation process. When the drill bit drills the area to be drilled, the generation of strip-shaped copper cuttings can be reduced, the cutting direction of the drill bit can be guided, the drilling direction of the through hole with the high thickness-diameter ratio is ensured, the quality of the hole wall is improved, and the reliability of the through hole is improved. The abrasion of the drill bit is reduced, and the service life of the drill bit is prolonged.
Referring to fig. 2, fig. 2 is a schematic structural diagram of another embodiment of a plate to be drilled according to the present invention.
The plate member to be drilled 20 of the present embodiment includes: a multilayer copper layer 21 and a multilayer base layer 22. The multiple copper layers 21 and the multiple base layers 22 are sequentially stacked and attached to form the board 20 to be drilled. Each copper layer 21 comprises a region 211 to be drilled and a bonding region 212, the region 211 to be drilled is a position on each copper layer 21 where a through hole needs to be drilled by a drill, and the positions of the region 211 to be drilled of each copper layer 21 on the copper layer 21 where the region is located are the same. The nip 212 is configured to be disposed in close proximity to the substrate 22. The base layer 22 is a prepreg for connecting the copper layers 21. The guiding structures 2111 are provided only on the respective copper layers 21.
A guiding structure 2111 is disposed on each region 211 to be drilled on each copper layer 21, and the guiding structure 2111 includes a plurality of through holes 21111 symmetrically disposed along an axis 2112 of the region 211 to be drilled (the through holes 21111 are copper layer through holes disposed on each copper layer 21 before the drilling process, but not through holes drilled in the plate 20 to be drilled in the drilling process). The edge lines of the through holes 21111 in the guide structure 2111 and the edge line of the pressing area 212 are arranged at intervals to provide a certain supporting force to support the cutting of the drill, and a certain machining allowance is reserved to ensure that the drill does not damage the hole wall in the process of shifting and correcting, so that the quality of the hole wall is ensured to a certain extent.
In the embodiment, the axis 2112 of the region 211 to be drilled is provided with a through hole 21111, but in other embodiments, the axis 2112 may not be provided with the through hole 21111, but the through holes 21111 around the axis 2112 still need to be uniformly and equidistantly distributed.
The through holes 21111 are centrosymmetric along the axis 2112 of the region 211 to be drilled, the through holes 21111 are divided by the through holes 21111 arranged on the axis 2112 of the region 211 to be drilled, and the rest of the through holes 21111 are uniformly and equidistantly distributed around the through holes 21111 arranged on the axis 2112 of the region 211 to be drilled so as to provide uniform and stable supporting force for the drill, thereby reducing the phenomenon that the drill is shifted in the drilling process to a certain extent.
In one specific implementation scenario, a plurality of through-holes 21111, i.e., guide structures 2111, are prepared by an inner pattern etching process, and are prepared simultaneously with an inner pattern (not shown) of the plate member 20 to be drilled. The preparation method can utilize the inner layer pattern etching procedure required by the plate 20 to be drilled to prepare, and the production capacity expenditure is reduced under the condition of not additionally increasing a new procedure. Wherein, the inner layer pattern process comprises the following steps: pretreatment → dry film → exposure → development → etching → stripping. In the normal step of the interlayer patterning process, the guide structures 2111 are etched on each substrate by changing the coverage of the dry film, thereby minimizing the yield expenditure required for fabricating the guide structures 2111. After the inner layer patterns are formed on the substrates, the copper surface of each substrate is browned to form a uniform and dense browned film, and the substrates are laminated after the browned film is formed, so that the press-fit area 212 and the base layer 22 are tightly attached together to form the plate 20 to be drilled in the embodiment.
When the area 211 to be drilled of the plate 20 to be drilled of the present embodiment is drilled, the drill drills a hole from one side of the plate 20 to be drilled to the other side of the plate 20 to be drilled, and specifically, the drill tip of the drill drills in alignment with the axis 2112 of the area 211 to be drilled. At this moment, because be provided with guide structure 2111 on waiting to drill the district 211 for the copper volume on waiting to drill the district 211 reduces, thereby has reduced the banding copper smear metal that the drilling was drilled when the drill bit drilling, reduces the pressure of the chip removal of drill bit, and has indirectly reduced the extrusion of waiting to drill the district 211 to drill bit helicla flute and pore wall, thereby guarantee the quality of pore wall and reduce the wearing and tearing between drill bit and waiting to drill the district 211 and the copper smear metal to a certain extent. Meanwhile, the guide structure 2111 is disposed inside the region to be drilled 211, so that the cutting force from the region to be drilled 211 to which the drill is subjected when drilling the region to be drilled 211 is reduced. If the drill bit is deviated during drilling, the drilling force of the pressing area 212 is larger than that of the to-be-drilled area 211 provided with the guide structure 2111, so that the drill bit is subjected to a drilling force difference opposite to the deviation direction during deviation, and the drilling force difference enables the drill bit to return to the target hole position again. Thereby enabling corrective action of steering structure 2111 on the offset drill bit.
Referring to fig. 3, fig. 3 is a schematic radial cross-sectional view of the region 211 to be drilled in the embodiment of fig. 2.
The guide structure 2111 includes a plurality of five through holes 21111 arranged centrosymmetrically along the axis 2112 of the region to be drilled 211. The radial cross section of the through hole 21111 in the present embodiment is circular, but in other embodiments, the radial cross section of the through hole 21111 may have a shape of one or a combination of a square, a triangle, a circle, and an irregular figure, which is not limited herein. The number of the through holes 21111 can be adjusted according to actual requirements, and the number range of the through holes 21111 is as follows: greater than or equal to 4 to satisfy the condition that the through holes 21111 need to be uniformly and equidistantly distributed around the axis 2112.
The area of the radial cross section of the guide structure 2111 is greater than one third of the area of the radial cross section of the region to be drilled 211 and less than the area of the radial cross section of the region to be drilled 211. Thereby not only ensuring that the region 211 to be drilled can provide a certain supporting force when the drill bit drills, but also ensuring that the guiding structure 2111 provides a guiding function when the drill bit drills and reducing copper scraps drilled by the drill bit.
The plate to be drilled of the embodiment is provided with the guide structure on the region to be drilled of each copper layer through the inner layer pattern process, so that the space of the region to be drilled on the copper layer is reduced on the premise of not increasing an additional preparation process. When the drill bit drills the area to be drilled, the generation of strip-shaped copper cuttings can be reduced, the cutting direction of the drill bit can be guided through the guide structure, the perpendicularity of high-thickness-to-diameter ratio through hole preparation is guaranteed, the quality of the hole wall is improved, and the reliability of the through hole is improved. The abrasion of the drill bit is reduced, and the service life of the drill bit is prolonged.
Referring to fig. 4, fig. 4 is a schematic radial cross-sectional view of another embodiment of a region to be drilled according to the present invention.
The region 311 to be drilled of this embodiment is provided with a circular ring-shaped guide structure 3111, and the circular ring-shaped guide structure 3111 is a circular ring through hole disposed around the axis 3112 of the region 311 to be drilled. The edge line of the circular guide structure 3111 and the edge line of the stitching area (not shown in the figure) are arranged at intervals to reserve a certain machining allowance, so that the drill bit does not damage the hole wall in the process of shifting and correcting, and the quality of the hole wall is ensured.
The circular ring-shaped guide structure 3111 is also prepared by an inner layer pattern etching process, and the circular ring-shaped guide structure 3111 is prepared without considering the internal space and distribution of the guide structure 3111, and only needs to be arranged at intervals uniformly with the stitching area, which is simpler and more convenient than the arrangement of the guide structure with a plurality of through holes and/or grooves in the previous embodiment.
The circular ring-shaped guide structure 3111 of the embodiment can also provide uniform and stable supporting force for the drill bit during the drilling process of the drill bit, so as to reduce the occurrence of the drilling deviation phenomenon during the drilling process of the drill bit.
Through the mode, the area to be drilled of the embodiment further reduces the preparation difficulty and the processing cost. Therefore, the plate preparation efficiency is accelerated and the productivity expenditure is saved under the condition that the verticality of the through holes is guaranteed.
Referring to fig. 5, fig. 5 is a schematic structural diagram of an embodiment of a printed circuit board provided by the present invention.
The printed wiring board 30 of the present embodiment includes: a multilayer copper layer 31 and a multilayer base layer 32. The multiple copper layers 31 and the multiple base layers 32 are sequentially stacked and attached to form the printed wiring board 30. The printed wiring board 30 is provided with a through hole 33. Wherein the through hole 33 is formed by drilling and guiding based on the guiding structure of the plate to be drilled as described above.
The inner wall of the through hole 33 is straight, so that the phenomenon of drilling deviation does not exist, and the drilling trace of pre-drilling or step-by-step drilling does not exist. The through hole 33 is drilled once by the drill based on the guide structure.
Through the structure, the quality of the hole wall with the through hole 33 with the straight inner wall is improved to a certain extent, so that the structural quality of the printed circuit board 30 is enhanced, and the reliability and the quality of the printed circuit board 30 are improved.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A plate to be drilled, comprising:
a multi-layer base layer;
the multilayer copper layer and the multiple base layers are sequentially stacked and attached, and the multilayer copper layer comprises a to-be-drilled area and a pressing area;
the copper layer to be drilled of each copper layer is provided with a guide structure, and the thickness of the copper layer at the position of the guide structure is smaller than the thickness of the copper layer at other positions so as to guide the operation direction of a drill bit during drilling operation.
2. A plate to be drilled according to claim 1,
the guide structures are centrosymmetric along the axis of the region to be drilled and are uniformly distributed around or on the axis.
3. A plate to be drilled according to claim 2,
the guide structure comprises a plurality of substructures which are arranged along the axial center of the region to be drilled in a central symmetry mode.
4. A plate to be drilled according to claim 3,
the plurality of substructures comprise a plurality of through holes or a plurality of grooves arranged on the region to be drilled of each copper layer.
5. Panel to be drilled according to claim 3 or 4,
the shape of the radial section of the substructure along the region to be drilled is one or a combination of more of circular, square, triangular and circular.
6. A plate to be drilled according to claim 5,
the sum of the areas of the substructures along the radial cross section of the region to be drilled is smaller than the area of the radial cross section of the region to be drilled and larger than one third of the area of the radial cross section of the region to be drilled.
7. A plate to be drilled according to claim 1,
the edge line of the guide structure and the edge line of the area to be drilled are arranged at intervals.
8. A plate to be drilled according to claim 1,
the guide structure is prepared by an inner layer pattern process.
9. A plate to be drilled according to claim 1,
the region to be drilled is the position of a through hole on each copper layer needing to be drilled by the drill, and the positions of the regions to be drilled of each copper layer are the same.
10. A printed wiring board, characterized in that it is made by drilling a plate to be drilled according to claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021627388.5U CN213462429U (en) | 2020-08-05 | 2020-08-05 | Plate to be drilled and printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021627388.5U CN213462429U (en) | 2020-08-05 | 2020-08-05 | Plate to be drilled and printed circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN213462429U true CN213462429U (en) | 2021-06-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021627388.5U Active CN213462429U (en) | 2020-08-05 | 2020-08-05 | Plate to be drilled and printed circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745853A (en) * | 2022-03-30 | 2022-07-12 | 金禄电子科技股份有限公司 | Hole machining method for ultra-thick copper plate |
-
2020
- 2020-08-05 CN CN202021627388.5U patent/CN213462429U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745853A (en) * | 2022-03-30 | 2022-07-12 | 金禄电子科技股份有限公司 | Hole machining method for ultra-thick copper plate |
| CN114745853B (en) * | 2022-03-30 | 2023-07-21 | 金禄电子科技股份有限公司 | Hole processing method of ultra-thick copper plate |
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