CN101765296A - Drilling method of motherboard of circuit board - Google Patents
Drilling method of motherboard of circuit board Download PDFInfo
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- CN101765296A CN101765296A CN200910238984A CN200910238984A CN101765296A CN 101765296 A CN101765296 A CN 101765296A CN 200910238984 A CN200910238984 A CN 200910238984A CN 200910238984 A CN200910238984 A CN 200910238984A CN 101765296 A CN101765296 A CN 101765296A
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- circuit board
- motherboard
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Abstract
The invention relates to a drilling method of a motherboard of a circuit board, which comprises the following steps of: determining drilling positions at the two opposite drilling faces of the motherboard of the circuit board; drilling at the first face of the motherboard of the circuit board: the determined position at the first face of the motherboard of the circuit board is drilled, and the drilling-in depth is 1/3 to 2/3 of the thickness of the motherboard of the circuit board; and drilling the second face of the motherboard of the circuit board: a position in the second face of the motherboard of the circuit board, which is superposed with a drill hole at the first face, is drilled with a through hole. The drilling method of the motherboard of the circuit board, which is provided by the invention, adopts the structure that the first face of the motherboard of the circuit board is firstly drilled, the drilling-in depth is 1/3 to 2/3 of the thickness of the motherboard of the circuit board, and then the second face of the motherboard of the circuit board is drilled with the through hole. For a mode of directly drilling the through hole at the thicker motherboard of the circuit board, the drilling method reduces the chip removal of drilling, solves the problem that a drill bit is broken in the drilling process, and enhances the drilling quality of the circuit board. Meanwhile, a method of drilling at both faces is adopted, and the problem of deviation in the drilling process is solved.
Description
Technical field
The present invention relates to a kind of boring method, relate in particular to a kind of boring method of motherboard of circuit board.
Background technology
In the wiring board generative process, need carry out a lot of drilling operations usually, in the prior art, when holing, adopt the one side of cutter slave plate directly to get into the method for another side usually for general plate.For thin plate, this method affect is little, but for thicker plate, then can surpass the problem that requires because of the bad breaking of rod, the boring aperture of causing of chip removal.And at the circuit board industry, when particularly holing for thicker motherboard of circuit board, the bad problem of chip removal can appear, thus cause the thick excessively problem of the breaking of rod, boring aperture, have a strong impact on the quality of wiring board.Simultaneously, for thicker motherboard of circuit board, the one side of employing cutter slave plate directly gets into the method for another side, also causes the problem of off normal in the boring procedure easily.
Summary of the invention
The technical problem that the present invention solves is: the boring method that a kind of motherboard of circuit board is provided, overcome in the prior art, when motherboard of circuit board is holed, adopt cutter directly to get into the method for another side and cause the thick excessively problem of the breaking of rod, boring aperture easily, thereby influence the technical problem of wiring board quality from the one side of backboard.
Technical scheme of the present invention is: a kind of boring method of motherboard of circuit board is provided, comprises the steps:
Bore position is determined on relative two sides in motherboard of circuit board boring;
First boring of motherboard of circuit board: in the allocation boring really of motherboard of circuit board first face, piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness;
Second boring of motherboard of circuit board: the position that overlaps with described first boring in second of motherboard of circuit board drills through the hole.
Further technical scheme of the present invention is: in first boring step of motherboard of circuit board, piercing the degree of depth is 1/2 to 2/3 of motherboard of circuit board thickness.
Further technical scheme of the present invention is: in first boring step of motherboard of circuit board, the aperture of first boring of described motherboard of circuit board is littler 0.05 millimeter to 0.1 millimeter than the aperture of motherboard of circuit board boring requirement, in second boring step of motherboard of circuit board, described boring aperture is the aperture of motherboard of circuit board boring requirement.
Further technical scheme of the present invention is: before first boring step of motherboard of circuit board, at least two location holes are set on motherboard of circuit board, described location hole is the axial symmetry setting, and described symmetry axis is that described motherboard of circuit board is turned to described second upset axis from described first face in boring.
Further technical scheme of the present invention is: the symmetry axis of described location hole is the upset axis of described motherboard of circuit board by the upset of long limit.
Further technical scheme of the present invention is: described location hole quantity is the even number greater than two.
Further technical scheme of the present invention is: the fool proof hole is set on described motherboard of circuit board.
Technique effect of the present invention is: the boring method of motherboard of circuit board provided by the invention, and adopt and earlier first face of motherboard of circuit board is holed, piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness, second face to motherboard of circuit board drills through the hole again.This boring method directly drills through the mode in hole for thicker motherboard of circuit board, has reduced the chip removal of boring, has reduced the problem that boring procedure interrupts drill bit, has improved the quality of wiring board boring.Simultaneously, adopt the method for holing, solved the problem of off normal in the boring procedure from the two sides.
Description of drawings
Fig. 1 is a flow chart of the present invention.
Fig. 2 is provided with the schematic diagram of location hole for axial symmetry of the present invention.
Fig. 3 is the schematic diagram that is provided with in fool proof of the present invention hole.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1, the specific embodiment of the present invention is: a kind of boring method of motherboard of circuit board is provided, comprises the steps:
Step 100: bore position is determined on the relative two sides in motherboard of circuit board boring.The boring method of motherboard of circuit board of the present invention adopts respectively the method for holing in the face of wiring board from two, in order to ensure bore position accurately, prevent the off normal of holing, determine the position of boring in the mode of coordinate from the two sides.Determining the drill center on two sides earlier with coordinate, is circle is determined boring by the requirement of boring aperture then with the center.
Step 200: first boring of motherboard of circuit board: in first definite position boring of motherboard of circuit board, piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness.The boring method of motherboard of circuit board of the present invention is after having determined bore position to the two sides of motherboard of circuit board boring with coordinate, earlier to first of motherboard of circuit board definite coordinate position boring, when first boring of motherboard of circuit board, adopt drilling depth only to bore the hole of described motherboard of circuit board part thickness.In the specific embodiment of the present invention, piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness, and in the embodiment of the invention, piercing the degree of depth is 1/2 to 2/3 of motherboard of circuit board thickness.
Step 300: second boring of motherboard of circuit board: the position that overlaps with described first boring in second of motherboard of circuit board drills through the hole.After first boring to motherboard of circuit board, promptly second of motherboard of circuit board definite boring coordinate position holed, described second definite position is described first position that boring overlaps.Because first face of motherboard of circuit board has carried out boring for the first time, drilling depth is 1/3 to 2/3 of a motherboard of circuit board thickness, when motherboard of circuit board second face carries out holing the second time, face the bore shoulder hole problems that easily occur from two in order to overcome in the boring procedure in the first time, also prevent simultaneously the phenomenon of off normal, when holing for the second time, adopt the mode that drills through the hole, promptly directly hole second face is got into first.
The boring method of motherboard of circuit board provided by the invention adopts and earlier first face of motherboard of circuit board is holed, and piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness, and second face to motherboard of circuit board drills through the hole again.This boring method directly drills through the mode in hole for thicker motherboard of circuit board, has reduced the chip removal of boring, has reduced the problem that boring procedure interrupts drill bit, has improved the quality of wiring board boring.Simultaneously, adopt the method for holing, solved the problem of off normal in the boring procedure from the two sides.
Preferred implementation of the present invention is: in first boring step of motherboard of circuit board, the aperture of first boring of described motherboard of circuit board is littler 0.05 millimeter to 0.1 millimeter than the aperture of motherboard of circuit board boring requirement, in second boring step of motherboard of circuit board, described boring aperture is the aperture of motherboard of circuit board boring requirement.The present invention is owing to adopt the method for holing from the two sides that motherboard of circuit board is holed, the offset problem of positive and negative boring direction appears in this method easily in the boring procedure second second time, therefore, in the preferred implementation of the present invention, the aperture of adopting first boring of described motherboard of circuit board is littler 0.05 millimeter to 0.1 millimeter than the aperture of motherboard of circuit board boring requirement, in second boring step of motherboard of circuit board, described boring aperture is the aperture of motherboard of circuit board boring requirement, promptly the aperture of boring is bigger than the aperture of boring for the first time for the second time, even at second offset problem that occurs for the second time positive and negative boring direction in the boring procedure, also can be because promptly the aperture of boring is bigger and proofread and correct the offset problem of this positive and negative boring direction than the aperture of boring for the first time for the second time.
As shown in Figure 2, preferred implementation of the present invention is: before first boring step of motherboard of circuit board, at least two location holes are set on motherboard of circuit board, described location hole is the axial symmetry setting, and described symmetry axis is that described motherboard of circuit board is turned to described second upset axis from described first face in boring.Specifically: location hole 1 and location hole 2 be with upset axis 8 symmetries, be to overturn in the center with upset axis 8 during upset; Location hole 3 and location hole 4 are with upset axis 8 symmetries, be to overturn in the center with upset axis 8 during upset, after turning like this, all location holes all can be inserted in equally when holing for the first time and go in the used pin, so just reduce the aligning accuracy decline that change pin position causes, improved aligning accuracy.In like manner, location hole 1 and location hole 4 be with upset axis 7 symmetries, be to overturn in the center with upset axis 7 during upset; Location hole 3 and location hole 2 are with upset axis 7 symmetries, be to overturn in the center with upset axis 7 during upset, after turning like this, all location holes all can be inserted in equally when holing for the first time and go in the used pin, so just reduce the aligning accuracy decline that change pin position causes, improved aligning accuracy.In the embodiment of the invention, the symmetry axis of described location hole is the upset axis of described motherboard of circuit board by the upset of long limit.Among the present invention, described location hole quantity is the even number greater than two, and in the embodiment of the invention, described location hole quantity is four.
As shown in Figure 3, preferred implementation of the present invention is: on described motherboard of circuit board 5 fool proof hole 6 is set.In the specific embodiments of the invention, in order to prevent that carrying out the boring of motherboard of circuit board two sides misplaces the plate face, when boring, adds a fool proof hole 6.Fool proof hole 6 and location hole be not on same position, the fool proof hole only just adds the pin that is used for fool proof when boring first face, when being drilled into second of plate, after pin must being transferred to, plank just can be put in the location hole, so just can play the effect of fool proof well.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (7)
1. the boring method of a motherboard of circuit board comprises the steps:
Bore position is determined on relative two sides in motherboard of circuit board boring;
First boring of motherboard of circuit board: in the allocation boring really of motherboard of circuit board first face, piercing the degree of depth is 1/3 to 2/3 of motherboard of circuit board thickness;
Second boring of motherboard of circuit board: the position that overlaps with described first boring in second of motherboard of circuit board drills through the hole.
2. according to the boring method of the described motherboard of circuit board of claim 1, it is characterized by: in first boring step of motherboard of circuit board, piercing the degree of depth is 1/2 to 2/3 of motherboard of circuit board thickness.
3. according to the boring method of the described motherboard of circuit board of claim 1, it is characterized by: in first boring step of motherboard of circuit board, the aperture of first boring of described motherboard of circuit board is littler 0.05 millimeter to 0.1 millimeter than the aperture of motherboard of circuit board boring requirement, in second boring step of motherboard of circuit board, described boring aperture is the aperture of motherboard of circuit board boring requirement.
4. according to the boring method of the described motherboard of circuit board of claim 1, it is characterized by: before first boring step of motherboard of circuit board, at least two location holes are set on motherboard of circuit board, described location hole is the axial symmetry setting, and described symmetry axis is that described motherboard of circuit board is turned to described second upset axis from described first face in boring.
5. according to the boring method of the described motherboard of circuit board of claim 4, it is characterized by: the symmetry axis of described location hole is the upset axis of described motherboard of circuit board by the upset of long limit.
6. according to the boring method of the described motherboard of circuit board of claim 4, it is characterized by: described location hole quantity is the even number greater than two.
7. according to the boring method of the described motherboard of circuit board of claim 1, it is characterized by: the fool proof hole is set on described motherboard of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910238984A CN101765296A (en) | 2009-12-31 | 2009-12-31 | Drilling method of motherboard of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910238984A CN101765296A (en) | 2009-12-31 | 2009-12-31 | Drilling method of motherboard of circuit board |
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| Publication Number | Publication Date |
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| CN101765296A true CN101765296A (en) | 2010-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200910238984A Pending CN101765296A (en) | 2009-12-31 | 2009-12-31 | Drilling method of motherboard of circuit board |
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Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
| CN102886546A (en) * | 2012-10-17 | 2013-01-23 | 无锡江南计算技术研究所 | Through hole machining method |
| CN103008975A (en) * | 2012-11-27 | 2013-04-03 | 天长缸盖有限公司 | Processing method for fabrication holes in bottom surface and top surface of cylinder cover |
| CN103281878A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Manufacturing method for printed circuit board with penetrating-through holes |
| CN103687316A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling board with high aspect ratio |
| CN103753643A (en) * | 2014-01-22 | 2014-04-30 | 广州杰赛科技股份有限公司 | Method for drilling in front face and back face |
| CN103874326A (en) * | 2012-12-18 | 2014-06-18 | 三星电机株式会社 | Printed circuit board and method of manufacturing printed circuit board |
| CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
| CN105407623A (en) * | 2014-09-16 | 2016-03-16 | 深南电路有限公司 | Method for processing cooling hole of circuit board |
| CN105964828A (en) * | 2016-03-25 | 2016-09-28 | 哈尔滨飞机工业集团有限责任公司 | Method for determining machining positioning datum of metal honeycomb plate |
| CN106162389A (en) * | 2015-03-23 | 2016-11-23 | 比亚迪股份有限公司 | A kind of boring method, shell and electronic equipment |
| CN106304625A (en) * | 2016-10-17 | 2017-01-04 | 奥士康精密电路（惠州）有限公司 | A kind of high Tg printed wiring board and processing method thereof |
| CN108617094A (en) * | 2018-05-03 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole |
| CN108848623A (en) * | 2018-07-02 | 2018-11-20 | 广州美维电子有限公司 | A kind of foolproof method and system preventing pcb board welding resistance deviation |
| CN110936434A (en) * | 2019-12-10 | 2020-03-31 | 苏州市惠利华电子有限公司 | Drilling method for circuit board body |
| CN112230123A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Flying probe testing device for thin plate and manufacturing method thereof |
| CN112752404A (en) * | 2020-11-09 | 2021-05-04 | 奥士康科技股份有限公司 | Manufacturing method of high-aspect-ratio step back drill |
| CN114952366A (en) * | 2022-05-13 | 2022-08-30 | 智恩电子(大亚湾)有限公司 | Drilling method of circuit board motherboard |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
-
2009
- 2009-12-31 CN CN200910238984A patent/CN101765296A/en active Pending
Cited By (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102036492B (en) * | 2010-12-28 | 2012-11-14 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN102036492A (en) * | 2010-12-28 | 2011-04-27 | 东莞生益电子有限公司 | Drilling method for printed circuit board (PCB) |
| CN102159033A (en) * | 2011-03-28 | 2011-08-17 | 冠锋电子科技(梅州)有限公司 | Method for making flared hole on circuit board |
| CN102886546B (en) * | 2012-10-17 | 2014-10-22 | 无锡江南计算技术研究所 | Through hole machining method |
| CN102886546A (en) * | 2012-10-17 | 2013-01-23 | 无锡江南计算技术研究所 | Through hole machining method |
| CN103008975A (en) * | 2012-11-27 | 2013-04-03 | 天长缸盖有限公司 | Processing method for fabrication holes in bottom surface and top surface of cylinder cover |
| CN103008975B (en) * | 2012-11-27 | 2016-05-11 | 天长缸盖有限公司 | End face fabrication hole processing method at the bottom of a kind of cylinder head |
| CN103874326A (en) * | 2012-12-18 | 2014-06-18 | 三星电机株式会社 | Printed circuit board and method of manufacturing printed circuit board |
| CN103281878A (en) * | 2013-06-13 | 2013-09-04 | 汕头超声印制板（二厂）有限公司 | Manufacturing method for printed circuit board with penetrating-through holes |
| CN103687316A (en) * | 2013-12-12 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Method for drilling board with high aspect ratio |
| CN103687316B (en) * | 2013-12-12 | 2016-07-27 | 广州兴森快捷电路科技有限公司 | A kind of boring manufacture method of high thickness to diameter ratio plate |
| CN103753643A (en) * | 2014-01-22 | 2014-04-30 | 广州杰赛科技股份有限公司 | Method for drilling in front face and back face |
| CN103753643B (en) * | 2014-01-22 | 2016-09-28 | 广州杰赛科技股份有限公司 | The boring method that a kind of tow sides bore |
| CN105407623A (en) * | 2014-09-16 | 2016-03-16 | 深南电路有限公司 | Method for processing cooling hole of circuit board |
| CN106162389A (en) * | 2015-03-23 | 2016-11-23 | 比亚迪股份有限公司 | A kind of boring method, shell and electronic equipment |
| CN104972511A (en) * | 2015-07-08 | 2015-10-14 | 沪士电子股份有限公司 | Drilling method improving PCB plate counter-drilling precision |
| CN105964828A (en) * | 2016-03-25 | 2016-09-28 | 哈尔滨飞机工业集团有限责任公司 | Method for determining machining positioning datum of metal honeycomb plate |
| CN106304625A (en) * | 2016-10-17 | 2017-01-04 | 奥士康精密电路（惠州）有限公司 | A kind of high Tg printed wiring board and processing method thereof |
| CN108617094A (en) * | 2018-05-03 | 2018-10-02 | 深圳崇达多层线路板有限公司 | A method of prevent positive and negative drilling dislocation on wiring board from forming stepped hole |
| CN108848623A (en) * | 2018-07-02 | 2018-11-20 | 广州美维电子有限公司 | A kind of foolproof method and system preventing pcb board welding resistance deviation |
| CN108848623B (en) * | 2018-07-02 | 2020-12-22 | 广州美维电子有限公司 | Fool-proof method and system for preventing PCB (printed circuit board) from solder mask deviation |
| CN110936434A (en) * | 2019-12-10 | 2020-03-31 | 苏州市惠利华电子有限公司 | Drilling method for circuit board body |
| CN112230123A (en) * | 2020-09-02 | 2021-01-15 | 湖北金禄科技有限公司 | Flying probe testing device for thin plate and manufacturing method thereof |
| CN112752404A (en) * | 2020-11-09 | 2021-05-04 | 奥士康科技股份有限公司 | Manufacturing method of high-aspect-ratio step back drill |
| WO2023123909A1 (en) * | 2021-12-27 | 2023-07-06 | 生益电子股份有限公司 | Pcb processing method and pcb |
| CN114952366A (en) * | 2022-05-13 | 2022-08-30 | 智恩电子(大亚湾)有限公司 | Drilling method of circuit board motherboard |
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Application publication date: 20100630 |