WO2023123909A1 - Procédé de traitement de pcb et pcb - Google Patents

Procédé de traitement de pcb et pcb Download PDF

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Publication number
WO2023123909A1
WO2023123909A1 PCT/CN2022/100059 CN2022100059W WO2023123909A1 WO 2023123909 A1 WO2023123909 A1 WO 2023123909A1 CN 2022100059 W CN2022100059 W CN 2022100059W WO 2023123909 A1 WO2023123909 A1 WO 2023123909A1
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WO
WIPO (PCT)
Prior art keywords
drilling
depth
pcb
drilled
processing method
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PCT/CN2022/100059
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English (en)
Chinese (zh)
Inventor
罗伟俊
文贵宜
陶逸
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生益电子股份有限公司
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Publication of WO2023123909A1 publication Critical patent/WO2023123909A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes

Definitions

  • the present application relates to the technical field of PCB processing, for example, to a PCB processing method and PCB.
  • PCBs printed circuit boards
  • High-density interconnection has become one of the development directions of PCB in the industry, which makes the board thicker and the wiring denser, which requires the holes to be smaller and finer.
  • the small hole drilling accuracy in related technologies is limited, which has become a stumbling block for the industry to improve and develop.
  • the back-drill processed on the exit face of a drill is often easily offset from the first drill, resulting in the hole wall copper not being drilled and resulting in short inside.
  • This application proposes a PCB processing method, which can solve the problem that when the same hole is back-drilled on both sides of a thick plate, the back-drilling corresponding to the tool surface of one drill is easily offset from the back-drilling of the first drill.
  • the present application also proposes the PCB prepared by the above processing method.
  • an embodiment of the present application proposes a PCB processing method, including:
  • the first drilling corresponds to the double-sided back drilling and the tool diameter is equal, and the depth of the double-sided back drilling is equal or unequal; if If the depths of the double-sided back-drilled holes are equal, the step formed during the control-one drilling process is located in any one-sided back-drilled hole; The step is located inside the back-drilled hole with a deep back-drilled depth; and the back-drilled hole is processed and the step is drilled off.
  • the depths of the back-drilled holes are not equal, and the double-sided drilled holes control the depth of a drilled hole on both sides according to the depths of the back-drilled holes on both sides:
  • the controlled depth of a drilled hole is A1, and the back-drilling depth is H1.
  • the value of a is as follows: 0.1mm ⁇ a ⁇ 0.3mm;
  • the thickness of the PCB to be drilled is H
  • the angle length of the tool nose, the value of b is as follows: 0.05 ⁇ b ⁇ 0.1.
  • the value of a is as follows: 0.15mm ⁇ a ⁇ 0.25mm.
  • the a is about 0.2 mm.
  • the value of b is as follows: 0.07 ⁇ b ⁇ 0.09.
  • the b is about 0.08.
  • the H >4.0mm.
  • the diameter of the drilled hole is D, and the H/D ⁇ 20.
  • the diameter of the back-drilled hole is D+c, wherein, 152.40 ⁇ m ⁇ c ⁇ 254.00 ⁇ m.
  • c is about 203.20 ⁇ m.
  • an embodiment of the present application provides a PCB, which is prepared by the above method.
  • Fig. 1 is conventional processing flow in the related art
  • Figure 2 is a PCB processed by related technologies
  • Fig. 3 is the hole structure on the PCB processed by the related technology
  • Fig. 4 is the operation process of processing PCB in the embodiment 1 ⁇ 3 of the present application.
  • Fig. 5 is a partial view of the PCB processed in Example 1 of the present application.
  • Fig. 6 is the processing operation process of the comparative example 1 of the present application.
  • FIG. 7 is a partial view of the PCB obtained in the comparative example 1 of the present application.
  • FIG. 8 is a flowchart of a PCB processing method provided by an embodiment of the present application.
  • a PCB is prepared, which is prepared by a CCD drill referring to the flow shown in Figure 4 and Figure 8, and the specific process is as follows:
  • S1 take the PCB to be drilled with a thickness of H, and use double-sided drilling in the first drilling process.
  • One drill hole corresponds to double-sided back-drilled holes with equal tool diameters, and the drilling depths of double-sided back-drilled holes are not equal.
  • a step is formed during drilling, and the step is controlled to be located inside the back-drilled hole with a deeper back-drilled depth;
  • the back-drilling process is processed through conventional depth control (use a drill with conductive depth control function, and finally cover the PCB that needs back-drilling with an aluminum sheet and cold stamping tape to complete the back-drilling process). Drill off the drill step on the side with a deeper drilling depth, and the resulting PCB is shown in Figure 5.
  • the double-sided drilling in S1 specifically controls the depths of the first hole and the back-drilling on both sides according to the depths of the back-drilling on both sides.
  • the controlled depth of a drilled hole is A1
  • the back-drilling depth is H1.
  • the value of a is as follows: 0.15mm ⁇ a ⁇ 0.25mm, and in an embodiment of the present application, the value of a is 0.2mm.
  • the value is as follows: 0.07 ⁇ b ⁇ 0.09, in an embodiment of the present application, the value of b is 0.08.
  • the control depth of a drill hole is shallower than the depth of the back drilling (shallow depth is a), and the depth of the back drilling is shallower
  • the control depth of one drilling hole is controlled by deducting the depth of the other side from the plate thickness and then compensating according to a certain coefficient (coefficient control is b) of the plate thickness, which can eliminate the drilling depth caused by plate thickness fluctuations Error; in the back drilling process, it is enough to use the conventional controlled depth drilling method to process, and the counter-drilling step will be drilled off on the side where the back drilling depth is deeper.
  • the solution of this application is especially suitable for the deviation problem of the double-sided back drilling of the same hole in a thick plate (the diameter of a drilling tool does not exceed 0.2mm).
  • the method in the related art usually uses one-time drilling. Controlled depth drilling is used to process a hole, and then conventional back drilling can be used to ingeniously ensure high-precision alignment of first drilling and back drilling, and at the same time, the step of drilling will be eliminated to reduce the risk of open circuit quality caused by broken copper.
  • the diameter of the drilled hole is D, and the H/D ⁇ 20.
  • the diameter of the back-drilled hole is D+c, wherein, 152.40 ⁇ m ⁇ c ⁇ 254.00 ⁇ m.
  • c is about 203.20 ⁇ m.
  • the drilling machine used for drilling holes in the PCB processing process is a CCD drilling machine. Use the CCD drill to complete the entire drilling process to ensure that the expansion and contraction of the process match.
  • the processing of the back-drilled hole is carried out by conventional controlled depth drilling.
  • Back drilling can be done in conventional way. For example, set the required back-drilling depth in the back-drilling program, then choose a drilling machine with conductive depth control function for production and processing, and finally cover the PCB that needs back-drilling processing with aluminum sheet and cold stamping tape to complete the back-drilling process. Drill processing.
  • the scheme of this embodiment uses double-sided depth control drilling to process a drill hole, but the step position of a drill hole changes with the depth of the back-drilling hole, and it is always guaranteed that the step of the counter-drilling tool will be drilled off by the back-drilling tool. Guarantee high-precision first-drill and back-drill alignment, and at the same time eliminate the alignment step to reduce the risk of open circuit quality caused by broken copper.
  • the PCB prepared by the solution of the present application does not have steps, is not easy to break copper, has good processing effect, and is especially suitable for processing small holes in thick plates.
  • double-sided drilling is used.
  • One drilling corresponds to double-sided back drilling and the tool diameter is equal.
  • the depth of double-sided one drilling can also be equal.
  • it should be located in the middle of the plate thickness as much as possible to minimize the deviation of a drill.
  • the depth of the first hole on both sides can be equal or not, and it should be controlled according to the depth of the back drilling.
  • it should be ensured that the step formed during the first drilling is located inside the back drilling with a deeper back drilling depth.
  • the depths of the back-drilled holes can also be equal. When equal, the step formed by a drilled hole is located in the back-drilled hole on either side, and the step is removed during the back-drilled process.
  • the PCB processing method of the present application it has at least the following beneficial effects: Different from the processing methods in the related art, there are always counter-drilling steps that will cause copper breakage, and the method of the present application can be used to control the depth of both sides.
  • the design of the drill can effectively realize the processing of small holes in thick plates.
  • the step of this application scheme changes with the depth of the back drill, and always ensures that the step of the counter-drill will be drilled off by the back drill, ensuring high-precision alignment between the first drill and the back-drill, and eliminating the drill step can reduce the risk of copper breakage open circuit quality risk.
  • the scheme of this application divides the machining process into a drilling process and a back drilling process.
  • a drilling hole is split into double-sided depth control and equal large tool diameter counter-drilling.
  • the steps can also be removed during the back drilling process, and there will be no problem of broken copper plating caused by the steps.
  • the double-sided back-drilled bar of the same hole is split into two-sided depth control and other large-diameter counter-drilling.
  • a PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.1 mm, and the value of b is 0.05.
  • the back drill and the first drill prepared by the method of the present application are not prone to misalignment, the drilling precision is high, and small holes can be accurately processed on thick plates effectively.
  • a PCB is prepared in this embodiment, and the difference from Embodiment 1 is only that the value of a is 0.3mm, and the value of b is 0.1.
  • a PCB is prepared, as shown in FIG. 6 , the difference from Example 1 is that S1 uses conventional double-sided equal depth and equal size drills. Using this method will make the step exist in the hole, and the step produced by the first drill hole is located on the deeper side of the back drill depth, but the depth of the first drill is greater than the back drill depth, and the step is formed in the back drill hole with a deeper back drill depth Additionally, this will result in stepped holes that cannot be removed.
  • a drilled hole is shown in Figure 7, the hole diameter can reach 0.56mm (usually need to be above 0.4mm). In this processing method, the diameter of a drilled hole is relatively large, and the steps cannot be effectively removed, which makes it very easy to break copper at this position, resulting in the failure of the inner opening.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

L'invention concerne un procédé de traitement de PCB et une PCB. Le procédé de traitement de PCB comprend : une PCB à percer est prise, et dans le traitement de premiers trous percés, un perçage arrière double face est adopté, les premiers trous percés correspondant à des trous percés en arrière double face et ayant des diamètres d'outil égaux à ceux-ci, et les trous percés en arrière double face ayant des profondeurs égales ou inégales ; si les profondeurs des trous percés en arrière double face sont égales, des marches formées dans le traitement des premiers trous percés sont commandées pour être situées dans les trous percés en arrière de chaque côté ; si les profondeurs des trous percés en arrière double face sont inégales, les marches formées dans le traitement des premiers trous percés sont commandées pour être situées à l'intérieur des trous percés en arrière avec des profondeurs de perçage en arrière plus élevées ; et les trous percés en arrière sont traités, et les marches sont percées.
PCT/CN2022/100059 2021-12-27 2022-06-21 Procédé de traitement de pcb et pcb WO2023123909A1 (fr)

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Application Number Priority Date Filing Date Title
CN202111617711.XA CN114423161A (zh) 2021-12-27 2021-12-27 一种pcb加工方法及pcb
CN202111617711.X 2021-12-27

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WO2023123909A1 true WO2023123909A1 (fr) 2023-07-06

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CN114423161A (zh) * 2021-12-27 2022-04-29 生益电子股份有限公司 一种pcb加工方法及pcb

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CN101765296A (zh) * 2009-12-31 2010-06-30 深圳崇达多层线路板有限公司 一种线路板母板的钻孔方法
JP2014187153A (ja) * 2013-03-22 2014-10-02 Via Mechanics Ltd 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置
CN106332473A (zh) * 2015-06-15 2017-01-11 东莞生益电子有限公司 背板加工方法及采用的模具、以及该加工方法制得的背板
CN106793577A (zh) * 2017-01-16 2017-05-31 生益电子股份有限公司 一种高速pcb的制作方法及pcb
CN108617094A (zh) * 2018-05-03 2018-10-02 深圳崇达多层线路板有限公司 一种防止线路板上正反面钻孔错位形成阶梯孔的方法
CN109348621A (zh) * 2018-09-12 2019-02-15 生益电子股份有限公司 一种pcb制作方法及pcb
CN114423161A (zh) * 2021-12-27 2022-04-29 生益电子股份有限公司 一种pcb加工方法及pcb

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Publication number Priority date Publication date Assignee Title
CN103025051B (zh) * 2012-11-20 2016-02-24 深圳崇达多层线路板有限公司 一种机械背钻孔结构的hdi板及其制作方法
CN106961798B (zh) * 2017-04-19 2019-02-22 广东工业大学 一种pcb孔加工控深方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101765296A (zh) * 2009-12-31 2010-06-30 深圳崇达多层线路板有限公司 一种线路板母板的钻孔方法
JP2014187153A (ja) * 2013-03-22 2014-10-02 Via Mechanics Ltd 多層プリント配線板のバックドリル加工方法、そのためのドリル及び基板穴明け装置
CN106332473A (zh) * 2015-06-15 2017-01-11 东莞生益电子有限公司 背板加工方法及采用的模具、以及该加工方法制得的背板
CN106793577A (zh) * 2017-01-16 2017-05-31 生益电子股份有限公司 一种高速pcb的制作方法及pcb
CN108617094A (zh) * 2018-05-03 2018-10-02 深圳崇达多层线路板有限公司 一种防止线路板上正反面钻孔错位形成阶梯孔的方法
CN109348621A (zh) * 2018-09-12 2019-02-15 生益电子股份有限公司 一种pcb制作方法及pcb
CN114423161A (zh) * 2021-12-27 2022-04-29 生益电子股份有限公司 一种pcb加工方法及pcb

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