WO2022199022A1 - 散热架构和显示装置 - Google Patents
散热架构和显示装置 Download PDFInfo
- Publication number
- WO2022199022A1 WO2022199022A1 PCT/CN2021/127286 CN2021127286W WO2022199022A1 WO 2022199022 A1 WO2022199022 A1 WO 2022199022A1 CN 2021127286 W CN2021127286 W CN 2021127286W WO 2022199022 A1 WO2022199022 A1 WO 2022199022A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat dissipation
- display device
- printed circuit
- circuit board
- dissipation structure
- Prior art date
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 132
- 239000003570 air Substances 0.000 description 61
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000002411 adverse Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000012080 ambient air Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
Definitions
- the invention relates to the field of display, in particular to a heat dissipation structure and a display device
- the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a heat dissipation structure and a display device.
- an embodiment of the present disclosure provides a heat dissipation structure, which is applied to a display device, including:
- a heat dissipation structure configured to dissipate heat generated by the light-emitting module in the display device
- the carrying structure includes: at least one carrying board, the carrying board has a carrying surface for carrying at least one printed circuit board in the display device, the carrying structure is configured to be fixed when assembled and fixed with the heat dissipation structure A space exists between the carrier plate and the heat dissipation plate to form a heat conduction channel.
- an opening is provided in the carrying area of the carrying plate for carrying the printed circuit board.
- the bearing structure further includes: a plurality of support columns, one end of the support columns is fixed to a surface of the bearing plate facing away from the bearing surface, and the other end of the support columns is configured to be supported on the heat dissipation structure.
- the support column is integrally formed with the carrier plate.
- the heat dissipation architecture further includes:
- the air outlet fan and the air inlet fan are configured to form airflow in the heat conduction channel and on the bearing surface.
- an embodiment of the present disclosure further provides a display device, including: the heat dissipation structure provided in the above-mentioned first aspect.
- the display device further includes: a backplane, one side of the backplane is used for fixing the light-emitting module;
- the heat dissipation structure is fixed on the side of the backplane facing away from the light emitting module, and the bearing structure is located on the side of the heat dissipation structure facing away from the backplane.
- the at least one printed circuit board carried on the carrying surface includes: a module printed circuit board for controlling the operation of the light-emitting module, a complete machine for controlling the operation of the display device as a whole At least one of a printed circuit board and a power printed circuit board for controlling the operation of the power supply.
- the modular printed circuit board is fixed on the heat dissipation structure
- the whole machine printed circuit board and the power supply printed circuit board are fixed on the bearing surface.
- the heat dissipation structure includes a light outlet fan and an air inlet fan, and the air outlet fan is fixed on a side of the backplane facing away from the light emitting module.
- the display device further comprises: a base for supporting the display device;
- the air outlet fan is located on a side of the heat dissipation structure and the bearing structure away from the base.
- the at least one printed circuit board carried on the carrying surface includes: a power printed circuit board for controlling the operation of the power supply;
- the air intake fan is arranged opposite to the power supply printed circuit board.
- the air intake fan is disposed opposite to a portion of the power supply printed circuit board away from the air outlet fan.
- the display device further includes: a casing, the casing is located on a side of the bearing structure away from the heat dissipation structure, and between the casing and the printed circuit board carried on the bearing surface Spaces exist to form thermally conductive channels;
- An air outlet hole is formed in an area of the casing opposite to the air outlet fan, and an air inlet hole is formed on the side of the casing away from the air outlet hole.
- the air intake fan is fixed on a side surface of the casing facing the bearing surface.
- the display device further includes: a support frame, the support frame is disposed between the casing and the bearing surface, and an end of the support frame close to the bearing surface and the bearing surface The end of the support frame close to the casing is fixed with the casing.
- FIG. 1 is a schematic cross-sectional view of a display device involved in the related art
- FIG. 2 is a schematic diagram of the heat transfer direction of the display device shown in FIG. 1;
- FIG. 3 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.
- FIG. 4 is a schematic cross-sectional view of a heat dissipation structure provided by the implementation of the present disclosure
- FIG. 5 is a schematic diagram of a heat transfer direction of a display device having a heat dissipation structure provided by an embodiment of the present disclosure
- FIG. 6 is a schematic top view of a heat dissipation structure and an air outlet fan in an embodiment of the disclosure
- FIG. 7 is a schematic top view of a module printed circuit fixed on a heat dissipation structure in an embodiment of the disclosure
- FIG. 8 is a schematic top view when the bearing structure and the heat dissipation structure are fixed in an embodiment of the disclosure
- Fig. 9 is a schematic top view when the printed circuit board of the whole machine and the power printed circuit board are fixed on the bearing surface.
- the pure electrical energy converted into heat energy after the power is increased not only is the pure electrical energy converted into heat energy after the power is increased, but also the blocked light energy or cannot pass through when the light radiation encounters the film or glass with low transmittance.
- the light energy accumulated continuously on the surface of the film or glass causing the temperature of the entire light-emitting module to rise continuously.
- the working temperature of the light-emitting module (normal working temperature is 20 °C ⁇ 80 °C) is a key parameter affecting the performance of the display product.
- the index parameters of the performance of various optical film materials are closely related to the temperature. Liquid crystal particles are extremely sensitive to temperature. Too high or high temperature will cause changes in the performance of liquid crystal particles, which in turn will cause changes in display performance, increase the color coordinate shift of the display device, and decrease color accuracy. The final display effect of the device is adversely affected.
- each printed circuit board inside the display device is generally provided with structures such as chips and capacitors.
- structures such as chips and capacitors.
- FIG. 1 is a schematic cross-sectional view of a display device involved in the related art.
- the display device includes: a light-emitting module 21 , a backplane 22 , various printed circuit boards 24 and a casing 25 ; in order to improve heat dissipation efficiency, a heat-dissipating plate 23 is generally installed in the display device, and the light-emitting module 21
- the heat dissipation plate 23 and the heat dissipation plate 23 are fixed on different sides of the back plate 22 , and various printed circuit boards 24 are fixed on the heat dissipation plate 23 .
- FIG. 2 is a schematic diagram of a heat transfer direction of the display device shown in FIG. 1 .
- the main direction of heat transfer in the display device shown in FIG. 1 is as follows: the heat dissipation plate 23 conducts the heat generated by the light emitting module 21 and various printed circuit boards 24 to the heat dissipation plate 23 between the casing 25 and the heat dissipation plate 23 .
- the heat is dissipated to the external environment through the heat dissipation holes on the casing 25 .
- the light-emitting modules 21 and various types of printed circuit boards 24 are located in relatively concentrated locations, and the heat dissipation space (including: the heat dissipation plate 23 and the extremely small interior space near the printed circuit board 24 ) is small.
- the light-emitting module 21 mainly dissipates heat through the heat-dissipating plate 23.
- the light-emitting module 21 will be affected by the heat-dissipating plate 23 to dissipate heat;
- the heat exchange is only carried out by relying on the free flow of ambient wind, and the heat dissipation efficiency is low. Therefore, in the display device related to the related art, the temperature of the light emitting module 21 and various printed circuit boards 24 is still relatively high during operation, which adversely affects the normal operation of the display device.
- the embodiments of the present disclosure provide a corresponding solution.
- FIG. 3 is a schematic cross-sectional view of a display device provided by an embodiment of the present disclosure
- FIG. 4 is a schematic cross-sectional view of a heat dissipation structure provided by an embodiment of the present disclosure
- FIG. 5 is a display device having the heat dissipation structure provided by the embodiment of the present disclosure.
- FIG. 6 is a schematic top view of a heat dissipation structure and an air outlet fan in an embodiment of the disclosure.
- FIG. 7 is a top schematic diagram of a module printed circuit fixed on the heat dissipation structure in an embodiment of the disclosure.
- 8 is a schematic top view when the carrying structure and the heat dissipation structure are fixed in the embodiment of the disclosure, and FIG.
- the display device includes: a light emitting module 21 , a backplane 22 , various printed circuit boards and a heat dissipation structure.
- the light-emitting module 21 generally includes a light bar (generally including a plurality of LED lights), a light guide plate, an optical film layer (such as a diffuser sheet, a prism sheet, etc.), and the light-emitting module 21 belongs to the conventional structure in the display device, and is not described here. Describe in detail.
- the back plate 22 is used for fixing the light emitting module 21, and the material of the back plate 22 is generally a metal material, such as aluminum.
- the display device is generally provided with the following three types of printed circuit boards: (1) the module printed circuit board 5 used to control the operation of the light-emitting module 21; (2) the whole machine printed circuit board used to control the operation of the display device circuit board 6; (3) a power supply printed circuit board 7 for controlling the operation of the power supply.
- the modular printed circuit board 5 generally includes two printed circuit boards, one of which is mounted with a Field Programmable Gate Array (FPGA for short) corresponding to the control of the light-emitting module 21 ) chip (also called “module FPGA”), and another printed circuit board is mounted with a logic board (also called module T-con) corresponding to the control of the light-emitting module 21 .
- FPGA Field Programmable Gate Array
- the printed circuit board 6 of the whole machine generally includes two printed circuit boards, one of which is installed with an FPGA chip (also called “complete machine FPGA”) corresponding to the control of the whole machine, and the other printed circuit board.
- FPGA chip also called “complete machine FPGA”
- a system-on-chip also called “complete machine SOC”
- the above three types of printed circuit boards are generally arranged on a heat dissipation structure.
- the heat dissipation structure can provide a larger heat dissipation space than the existing heat dissipation plate, which can provide a better heat dissipation effect, which will be described in detail later with reference to specific embodiments.
- an embodiment of the present disclosure provides a heat dissipation structure, which includes: a heat dissipation structure 1 and a bearing structure; wherein, the heat dissipation structure 1 is configured to dissipate heat generated by the light emitting module 21 in the display device;
- the structure includes: at least one carrying board 2, the carrying board 2 has a carrying surface for carrying at least one printed circuit board in the display device, and the carrying structure is configured to be between the carrying board 2 and the heat dissipating structure 1 when it is assembled and fixed with the heat sink Spaces exist to form thermally conductive channels.
- the heat dissipation structure 1 may adopt the heat dissipation plate involved in the related art; of course, other structures may also be adopted.
- the heat dissipation structure 1 includes a bottom heat dissipation plate 101 and a plurality of parallel heat dissipation fins 102 disposed on the bottom heat dissipation plate 101 , and the heat dissipation fins 102 are perpendicular to the bottom heat dissipation plate 101 .
- the material of the heat dissipation structure 1 can be a material with better thermal conductivity, such as aluminum, copper, and the like.
- the printed circuit board carried on the bearing surface may include: a modular printed circuit board 5 for controlling the operation of the light-emitting module 21, a complete printed circuit board 6 for controlling the operation of the display device as a whole, and a complete printed circuit board 6 for controlling the operation of the display device. At least one of the power supply printed circuit boards 7 for power supply operation.
- the printed circuit board can be fixed on the bearing surface by screws.
- the main transfer directions of heat in the display device are as follows: the heat dissipation structure 1 conducts the heat generated by the light emitting module 21 and the printed circuit board located on the heat dissipation structure 1 to the heat conduction channel, and the heat dissipation structure located on the carrier board 2
- the printed circuit board exchanges heat with the air to conduct the heat to the internal space environment, and then dissipates the heat to the external environment through the heat dissipation holes on the casing 25 .
- the heat dissipation structure is The corresponding heat dissipation space includes: the heat dissipation structure 1, the heat conduction channel between the heat dissipation structure 1 and the carrier board 2, and the space on the side of the carrier surface away from the heat dissipation structure 1. Therefore, compared with the related art, the heat dissipation provided by the embodiment of the present disclosure is The architecture has a larger space for heat dissipation, which is conducive to improving heat dissipation efficiency.
- the number of the bearing boards 2 included in the bearing structure may be one, two or more.
- the disclosed technical solutions create limitations.
- the two or more carrier boards 2 may be stacked and arranged, and there is a gap between adjacent carrier boards 2 to form a heat conduction channel, so as to further increase the Large heat dissipation space; however, with the increase of the number of carrier plates 2, the overall size (thickness) of the heat dissipation structure 1 will also increase accordingly, and the overall thickness of the display device will be too large when the heat dissipation structure 1 is applied to a display device.
- the number of the carrier plates 2 can be set according to actual needs.
- openings 201 are provided in the carrying area of the carrier board 2 for carrying the printed circuit board. These openings 201 are designed to facilitate heat dissipation of the printed circuit on the carrier board 2 .
- one end of the support columns 11 is fixed to the side surface of the carrier plate 2 facing away from the bearing surface, and the other end of the support columns 11 is configured to be supported on the heat dissipation structure 1 .
- the support column 11 is integrally formed with the carrier plate 2 .
- the material of the bearing structure may be a metal material, such as aluminum; the one-piece bearing structure may be prepared by a stamping process.
- screw holes are also provided on at least one of the support column 11 and the carrier plate 2 , so that the carrier structure and the heat dissipation structure 1 can be fixed by screws.
- the heat dissipation structure further includes: an air outlet fan 3 and an air inlet fan 4, and the two types of fans are configured to form airflow in the heat conduction channel and on the bearing surface.
- the air outlet fan 3 and the air inlet fan 4 By arranging the air outlet fan 3 and the air inlet fan 4, the air circulation speed of the heat conduction channel and the surface of the bearing surface can be accelerated, so that the cold air is introduced while the hot air is exported, which is beneficial to the exchange of heat, and the heat dissipation efficiency is improved.
- the air outlet fan 3 and the air inlet fan 4 the flow direction of the air flow in the display device can be limited (from the air inlet fan 4 to the air outlet fan 3), thereby limiting the heat transfer direction.
- FIGS. 7-9 only the case of four air outlet fans 3 is exemplarily drawn, which will not limit the technical solution of the present disclosure. In practical applications, an appropriate model and quantity of fans can be selected according to the actual heat dissipation requirements of the display device as a whole.
- the thermal power W heat of the circuit board 7 is generally 87%, so the power supply printed
- the air outlet fan 3 and the air inlet fan 4 configured for the power supply printed circuit board 7 need to satisfy the formed air flow of 0.3 m 2 /min.
- an embodiment of the present invention further provides a display device, which includes the heat dissipation structure provided in the previous embodiment.
- a display device which includes the heat dissipation structure provided in the previous embodiment.
- the heat dissipation structure refer to the corresponding content in the previous embodiment. It is not repeated here.
- the heat dissipation structure 1 is fixed on the side of the backplane 22 facing away from the light emitting module 21 , and the bearing structure is located on the side of the heat dissipation structure 1 facing away from the backplane 22 .
- At least one of the modular printed circuit board 5 , the complete printed circuit board 6 and the power printed circuit board 7 is carried on the carrying surface of the carrying board 2 .
- the printed circuit boards that are not carried on the carrier board 2 among the above three types of printed circuit boards can be fixed on the heat dissipation structure 1 .
- the module printed circuit board 5 is fixed on the heat dissipation structure 1; the whole machine printed circuit board 6 and the power supply printed circuit board 7 are fixed on the bearing surface.
- the module printed circuit The board 5 can be fixed on the heat dissipation structure 1 without being moved to the bearing surface; the whole printed circuit board 6 and the power supply printed circuit board 7 generate more heat, and either of the two is fixed on the heat dissipation structure. 1 will seriously affect the heat dissipation of the light emitting module 21 through the heat dissipation structure 1, so the printed circuit board 6 of the whole machine and the power printed circuit board 7 are fixed on the bearing surface.
- the printed circuit board to be placed on the bearing surface can also be adjusted according to actual needs.
- the air outlet fan 3 when the air inlet fan 4 and the air outlet fan 3 are arranged in the heat dissipation structure, the air outlet fan 3 is fixed on the side of the back panel 22 facing away from the light emitting module 21 .
- the display device further includes: a base 8 for supporting the display device; the air outlet fan 3 is located on the side of the heat dissipation structure 1 and the bearing structure away from the base 8 . That is, the air outlet fan 3 is provided at a relatively upper position in the entire display device.
- the air outlet fan 3 in view of the principle of cold air sinking and hot air rising, the air outlet fan 3 is arranged at a relatively upper position in the entire display device, so that the hot air that has undergone heat exchange can be removed from the interior space in time. Blow out, always ensure the continuous circulation and exchange of air to improve the heat dissipation efficiency.
- the power supply printed circuit board 7 is carried on the bearing surface, and the air intake fan 4 is disposed opposite to the power supply printed circuit board 7 .
- the heat generated by the power printed circuit board 7 during the working process is far more than the module printed circuit board 5 and the whole machine printed circuit board 6, and the heat dissipation requirement of the power printed circuit board 7 is greater than that of the module. Due to the heat dissipation requirements of the printed circuit board 5 and the printed circuit board 6 of the whole machine, the air intake fan 4 is arranged opposite the power printed circuit board 7 to improve the heat dissipation efficiency of the power printed circuit board 7 (the intake fan 4 The nearby heat dissipation efficiency is relatively high).
- the air inlet fan 4 is disposed opposite to a part of the power supply printed circuit board 7 that is far away from the air outlet fan 3 . That is, the air intake fan 4 is arranged at a relatively lower position in the entire display device; this design can suck as much cold air as possible into the display device.
- the display device further includes: a casing 25, the casing 25 is located on the side of the bearing structure away from the heat dissipation structure 1, and a space exists between the casing 25 and the printed circuit board carried on the bearing surface to form a heat conduction channel; the casing The area on the 25 opposite to the air outlet fan 3 is formed with an air outlet hole 9, and the side of the casing 25 away from the air outlet hole 9 is formed with an air inlet hole 10 to ensure that the display device can efficiently suck the ambient air into the machine, and The hot air inside the display device is effectively exhausted to achieve high-efficiency heat exchange.
- the air outlet 9 is disposed toward one side of the base 9 in the form of a "blind shutter” to prevent falling water from directly above the display device from entering the interior of the display device.
- the air intake fan 4 is fixed on the side surface of the casing 25 facing the carrier plate 2 .
- the support frame 12 is disposed between the housing 25 and the bearing surface, the end of the support frame 12 near the bearing surface is fixed to the bearing surface, and the end of the support frame 12 near the housing 25 is fixed to the housing 25 .
- the casing 25 can be effectively prevented from being deformed by the temperature change.
- the heat sources in the display device can be more dispersed, and the heat exchange space is enlarged, which is beneficial to improve the heat dissipation efficiency.
- the air outlet fan 3/inlet fan 4 the air flow velocity in the display device can be increased, and the heat dissipation efficiency can be further improved.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本公开提供了一种散热架构，应用于显示装置，包括：散热结构，配置为将显示装置内的发光模组产生的热量导出；承载结构，包括：至少一个承载板，承载板具有承载面以用于承载显示装置内的至少一个印制电路板，承载结构配置为在与散热板装配固定时承载板与散热板之间存在间隔以形成导热通道。通过设置承载结构并利用承载结构来承载显示装置内的至少一个印制电路板，此时发光模组和各类印制电路板的设置位置相对分散，散热架构所对应的散热空间包括：散热结构、位于散热结构与承载板之间的导热通道以及位于承载面远离散热结构一侧的空间，因此与相关技术相比，本公开实施例提供的散热架构具有更大的散热空间，有利于提高散热效率。
Description
本发明涉及显示领域，特别涉及一种散热架构和显示装置
随着人们对于电子产品需求的不断提升，对于显示装置的高亮度、高对比对、高色域有了更高的需求；往往一款产品的好坏，是否受到消费者的追捧，就取决于显示产品的色彩是否更真实，清晰度是否更高。但上述参数的提升带来的是产品亮度和功率的增加，这会使得显示装置内部发热情况十分严重，对显示装置的正常工作造成不利影响。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一，提出了一种散热架构和显示装置。
第一方面，本公开实施例提供了一种散热架构，应用于显示装置，包括：
散热结构，配置为将所述显示装置内的发光模组产生的热量导出；
承载结构，包括：至少一个承载板，所述承载板具有承载面以用于承载所述显示装置内的至少一个印制电路板，所述承载结构配置为在与所述散热结构装配固定时所述承载板与所述散热板之间存在间隔以形成导热通道。
在一些实施例中，所述承载板上用于承载印制电路板的承载区域内设置有开口。
在一些实施例中，所述承载结构还包括：多个支撑柱，所述支撑柱的一端与所述承载板上背向所述承载面的一侧表面固定，所述支撑柱的 另一端配置为支撑于所述散热结构上。
在一些实施例中，所述支撑柱与所述承载板一体成型。
在一些实施例中，所述散热架构还包括：
出风风扇和进风风扇，配置为在所述导热通道内以及所述承载面上形成气流。
第二方面，本公开实施例还提供了一种显示装置，包括：如上述第一方面中提供的散热架构。
在一些实施例中，所述显示装置还包括：背板，所述背板的一侧用于固定所述发光模组；
所述散热结构固定于所述背板背向所述发光模组的一侧，所述承载结构位于所述散热结构背向所述背板的一侧。
在一些实施例中，承载于所述承载面上的至少一个印制电路板包括：用于控制发光模组工作的模组印制电路板、用于控制所述显示装置整机工作的整机印制电路板以及用于控制电源工作的电源印制电路板中的至少之一。
在一些实施例中，所述模组印制电路板固定于所述散热结构上；
所述整机印制电路板和所述电源印制电路板固定于所述承载面上。
在一些实施例中，所述散热架构包括出光风扇和进风风扇，所述出风风扇固定于所述背板背向所述发光模组的一侧。
在一些实施例中，所述显示装置还包括：底座，所述底座用于支撑所述显示装置；
所述出风风扇位于所述散热结构和所述承载结构远离所述底座的一侧。
在一些实施例中，承载于所述承载面上的至少一个印制电路板包括：用于控制电源工作的电源印制电路板；
所述进风风扇与所述电源印制电路板相对设置。
在一些实施例中，所述进风风扇与所述电源印制电路板上远离所述出风风扇的一部分相对设置。
在一些实施例中，所述显示装置还包括：外壳，所述外壳位于所述承载结构远离所述散热结构的一侧，所述外壳与承载于所述承载面上的印制电路板之间存在间隔以形成导热通道；
所述外壳上与所述出风风扇相对设置的区域形成有出风孔，所述外壳远离所述出风孔的一侧形成有进风孔。
在一些实施例中，所述进风风扇固定于所述外壳朝向所述承载面的一侧表面上。
在一些实施例中，所述显示装置还包括：支撑架，所述支撑架设置于所述外壳与所述承载面之间，所述支撑架靠近所述承载面的端部与所述承载面固定，所述支撑架靠近所述外壳的端部与所述外壳固定。
图1为相关技术中所涉及的一种显示装置的截面示意图；
图2为图1所示显示装置的热量传递方向示意图；
图3为本公开实施例提供的一种显示装置的截面示意图；
图4为本公开实施提供的一种散热架构的截面示意图；
图5为具有本公开实施例提供散热架构的显示装置的一种热量传递方向示意图；
图6为本公开实施例中散热结构和出风风扇的一种俯视示意图；
图7为本公开实施例中模组印制电路固定于散热结构上的一种俯视示意图；
图8为本公开实施例中承载结构与散热结构固定时的一种俯视示意图；
图9为将整机印制电路板和电源印制电路板固定于承载面时的一种 俯视示意图。
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图对本发明提供的一种散热架构和显示装置进行详细描述。
随着显示装置亮度的大幅提升，不仅是功率提升后单纯的电能转换为热能，更多的是光辐射遇到透过率较低的膜材或者玻璃时，被阻挡的光能或者无法穿过的光能不断在膜材或者玻璃表面累计，造成整个发光模组的温度不断上升。发光模组的工作温度(正常工作温度为20℃～80℃)是影响显示产品的性能的关键参数，各种光学膜材性能的指标参数都与温度有着密切相关性，还有液晶面板中的液晶粒子对温度的敏感性极高，过高或者较高的温度都会引起液晶粒子性能的改变，进而引起显示性能的改变，使得显示装置的色坐标偏移量增加，色准确性下降，对显示装置最终显示效果造成不利影响。
另外，显示装置内部的各印制电路板上一般设有芯片、电容等结构，随着功率的的提升，印制电路板上电能转换为热能的情况十分严重，这使得印制电路板自身在工作过程中经常出现温度达到80℃以上的高温，进而影响了印制电路板的正常工作。
图1为相关技术中所涉及的一种显示装置的截面示意图。如图1所示，显示装置包括：发光模组21、背板22、各类印制电路板24和外壳25；为提升散热效率，一般会在显示装置内设置散热板23，发光模组21和散热板23固定于背板22的不同侧，各类印制电路板24均固定在散热板23上。
图2为图1所示显示装置的热量传递方向示意图。如图2所示，图1所示显示装置内热量的主要传递方向如下：散热板23将发光模组21和各类印制电路板24产生的热量传导至外壳25与散热板23之间的机内 空间环境中，再由外壳25上的散热孔将热量散发至外部环境中。
基于图1和图2可见，发光模组21和各类印制电路板24的设置位置相对集中，散热空间(包括：散热板23以及印制电路板24附近极小的机内空间)较小，发光模组21主要是通过散热板23进行散热，一旦位于散热板23上的各类印制电路板24所产生的热量较高时，会影响到发光模组21通过散热板23进行散热；另外，在热量的传递和散发过程中，单纯依靠环境风的自由流动进行热量的交换，热量的散发效率较低。因此，在相关技术所涉及的显示装置内，发光模组21和各类印制电路板24在工作过程中自身温度仍处于较高状态，从而对显示装置的正常工作造成不利影响。
为解决相关技术中存在的至少之一技术问题，本公开实施例提供了相应的解决方案。
图3为本公开实施例提供的一种显示装置的截面示意图，图4为本公开实施提供的一种散热架构的截面示意图，图5为具有本公开实施例提供散热架构的显示装置的一种热量传递方向示意图，图6为本公开实施例中散热结构和出风风扇的一种俯视示意图，图7为本公开实施例中模组印制电路固定于散热结构上的一种俯视示意图，图8为本公开实施例中承载结构与散热结构固定时的一种俯视示意图，图9为将整机印制电路板和电源印制电路板固定于承载面时的一种俯视示意图。如图3至图9所示，该显示装置包括：发光模组21、背板22、各类印制电路板和散热架构。
其中，发光模组21一般包括灯条(一般包括多个LED灯)、导光板、光学膜层(例如扩散片、棱镜片等)，发光模组21属于显示装置中的常规结构，此处不进行详细描述。
背板22用于固定发光模组21，其材料一般采用金属材料，例如铝。
显示装置内一般设有如下三类印制电路板：(1)用于控制发光模组 21工作的模组印制电路板5；(2)用于控制显示装置整机工作的整机印制电路板6；(3)用于控制电源工作的电源印制电路板7。其中，模组印制电路板5一般包括两块印制电路板，其中一块印制电路板上安装有与发光模组21控制相对应的现场可编程逻辑门阵列(Field Programmable Gate Array，简称FPGA)芯片(也称为“模组FPGA”)，另一块印制电路板上安装有与发光模组21控制相对应的逻辑板(也称为模组T-con)。整机印制电路板6一般包括两块印制电路板，其中一块印制电路板上安装与整机控制相对应的FPGA芯片(也称为“整机FPGA”)，另一块印制电路板上安装有与整机控制相对应的***级芯片(也称为“整机SOC”)。上述三类印制电路板一般均设置在散热架构上。
在本公开实施例中，散热架构能够提供相较于现有散热板更大的散热空间，其能够提供更佳的散热效果，后面将结合具体实施例进行详细描述。
参见图4所示，本公开实施例提供了一种散热架构，散热架构包括：散热结构1和承载结构；其中，散热结构1配置为将显示装置内的发光模组21产生的热量导出；承载结构包括：至少一个承载板2，承载板2具有承载面以用于承载显示装置内的至少一个印制电路板，承载结构配置为在与散热板装配固定时承载板2与散热结构1之间存在间隔以形成导热通道。
在本公开实施例中，散热结构1可以采用相关技术中所涉及的散热板；当然也可以采用其他结构。作为一个示例，散热结构1包括位于底散热板101和位于底散热板101上的平行设置的多个散热片102，散热片102与底散热板101垂直设置。散热结构1的材料可采用导热性能较佳的材料，例如铝、铜等。
承载于承载面上的印制电路板可以包括：用于控制发光模组21工作的模组印制电路板5、用于控制显示装置整机工作的整机印制电路板6 以及用于控制电源工作的电源印制电路板7中的至少之一。印制电路板可通过螺丝固定于承载面上。
参见图5所示，显示装置内热量的主要传递方向如下：散热结构1将发光模组21和位于散热结构1上的印制电路板产生的热量传导至导热通道，以及位于承载板2上的印制电路板与空气进行热交换以将热量传导至机内空间环境，再由外壳25上的散热孔将热量散发至外部环境中。
在本公开实施例中，通过设置承载结构并利用承载结构来承载显示装置内的至少一个印制电路板，此时发光模组21和各类印制电路板的设置位置相对分散，散热架构所对应的散热空间包括：散热结构1、位于散热结构1与承载板2之间的导热通道以及位于承载面远离散热结构1一侧的空间，因此与相关技术相比，本公开实施例提供的散热架构具有更大的散热空间，有利于提高散热效率。
需要说明的是，承载结构中所包含的承载板2的数量可以为1个、2个或多个，附图中仅示例性画出了承载结构包括一个承载板2的情况，其不会对本公开的技术方案产生限制。
在本公开实施例中，当承载板2的数量为2个或多个时，2个或多个承载板2可以层叠设置，相邻承载板2之间存在间隔以形成导热通道，以进一步增大散热空间；但是，随着承载板2数量的增多，散热结构1的整体尺寸(厚度)也会相应增加，在将该散热结构1应用至显示装置时会使得显示装置的整体厚度过大。在实际应用中，可根据实际需要来设置承载板2的数量。
在一些实施例中，承载板2上用于承载印制电路板的承载区域内设置有开口201，这些开口201设计有利于位于承载板2上的承载印制电路进行散热。
在一些实施例中，多个支撑柱11，支撑柱11的一端与承载板2上背向承载面的一侧表面固定，支撑柱11的另一端配置为支撑于散热结构 1上。
在一些实施例中，支撑柱11与承载板2一体成型。其中，承载结构的材料可以采用金属材料，例如铝；可采用冲压工艺来制备一体式的承载结构。另外，还在支撑柱11和承载板2中的至少一者上设置螺孔，以使得承载结构与散热结构1可通过螺丝固定。
在一些实施例中，散热架构还包括：出风风扇3和进风风扇4，两种风扇配置为在导热通道内以及承载面上形成气流。通过设置出风风扇3和进风风扇4可加快导热通道和承载面表面的空气流通速度，使得将冷空气导入的同时将热空气导出，有利于热量的交换，热量的散发效率提升。通过设置出风风扇3和进风风扇4可以限定显示装置机内气流的流动方向(由进风风扇4处流向出风风扇3)，从而对热量的传递方向进行限定。
需要说明的是，附图7-9中仅示例性画出了4个出风风扇3的情况，其不会对本公开的技术方案产生限制。在实际应用中，可根据显示装置整体的实际散热需求来选择合适的风扇型号和数量。
以仅考虑电源印制电路板7的散热情况为例。其中，电源的输出电压为U＝24V；输出电流I＝7A，电源的有用功率W
有＝U*I＝24V*7A＝168W(瓦特)，电源的工作效率η一般为87％，因此电源印制电路板7的热功率W
热：
W
热＝(1-η)*W
有/η≈0.15**W
有＝25.2W
电源印制电路板7在1分钟产生的热量Q
热：
Q
热＝W
热*60s＝25.2W*60s＝1512J(焦耳)
在进行散热时，Q
热＝ξ*Q
风，Q
风为气流吸热量；假设置换温度△t控制在10℃，散热效率因数为0.4，则每分钟流过的空气体积CMF
风：
CMF
风＝Q
热/(ρ
空气*η*△t)≈0.3m
2/分钟
即，为电源印制电路板7所需配置的出风风扇3和进风风扇4需满 足所形成的气流在0.3m
2/分钟。
需要说明的是，本公开技术方案对于出风风扇3和进风风扇4的设置位置不作限制，后面将结合具体示例进行详细描述。
继续参见图3所示，本发明实施例还提供了一种显示装置，该显示装置包括前面实施例提供的散热架构，对于该散热架构的具体描述，可参见前面实施例中的相应内容，此处不再赘述。
在一些实施例中，散热结构1固定于背板22背向发光模组21的一侧，承载结构位于散热结构1背向背板22的一侧。
在一些实施例中，模组印制电路板5、整机印制电路板6以及电源印制电路板7中的至少之一承载于承载板2的承载面上。上述三类印制电路板中未承载于承载板2上的印制电路板可固定于散热结构1上。
参见图6至9所示，作为一个优选实施方案，模组印制电路板5固定于散热结构1上；整机印制电路板6和电源印制电路板7固定于承载面上。在实际应用中发现，模组印制电路板5上集成的芯片比较少，因而产生的热量较少，其对发光模组21通过散热结构1散热的影响相对较小，故模组印制电路板5可固定于在散热结构1上，而无需移至承载面上；整机印制电路板6以及电源印制电路板7产生的热量比较多，将二者中的任一固定于散热结构1上时会严重影响到发光模组21通过散热结构1进行散热，故将整机印制电路板6和电源印制电路板7固定于承载面上。
当然在实际应用中，也可根据实际需要来对需放置于承载面上的印制电路板进行调整。
在一些实施例中，当散热架构内设置有进风风扇4和出风风扇3时，出风风扇3固定于背板22背向发光模组21的一侧。进一步地，显示装置还包括：底座8，底座8用于支撑显示装置；出风风扇3位于散热结构1和承载结构远离底座8的一侧。即，出风风扇3设置于整个显示装 置内相对靠上的位置。在本公开实施例中，鉴于冷空气下沉、热空气上升的原理，将出风风扇3设置于整个显示装置内相对靠上的位置，可将已经进行热交换的热空气及时从机内空间吹出，时刻保证空气的不断循环交换，以提升散热效率。
在一些实施例中，电源印制电路板7承载于承载面上，进风风扇4与电源印制电路板7相对设置。在实际应用中发现，电源印制电路板7在工作过程中产生的热量远多于模组印制电路板5和整机印制电路板6，电源印制电路板7的散热需求大于模组印制电路板5和整机印制电路板6的散热需求，故将进风风扇4与电源印制电路板7相对设置，以提升电源印制电路板7处的散热效率(进风风扇4附近的散热效率相对较高)。
在一些实施例中，进风风扇4与电源印制电路板7上远离出风风扇3的一部分相对设置。即，进风风扇4设置于整个显示装置内相对靠下的位置；此设计可将尽可能多的冷空气吸入显示装置内部。
在一些实施例中，显示装置还包括：外壳25，外壳25位于承载结构远离散热结构1的一侧，外壳25与承载于承载面上的印制电路板之间存在间隔以形成导热通道；外壳25上与出风风扇3相对设置的区域形成有出风孔9，外壳25远离出风孔9的一侧形成有进风孔10，以保证显示装置能够高效的将环境风吸入机内，以及将显示装置机内热空气有效排出，实现高效率的热量交换。
在一些实施例中，出风孔9采用“百叶窗”形态朝底座9一侧设置，以防止位于显示装置正上方落水进入显示装置内部。
在一些实施例中，进风风扇4固定于外壳25朝向承载板2的一侧表面上。
在一些实施例中，支撑架12，支撑架12设置于外壳25与承载面之间，支撑架12靠近承载面的端部与承载面固定，支撑架12靠近外壳25的端部与外壳25固定。通过设置支撑架12，可有效防止外壳25受温度 变化影响而发生形变。
在本公开实施例中，通过设置散热结构1和承载结构可使得显示装置内的热源更为分散，并增大了热交换空间，有利于提升散热效率。此外，通过设置出风风扇3/进风风扇4，可提升显示装置机内的空气流体速度，能进一步提升散热效率。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。
Claims (16)
- 一种散热架构，应用于显示装置，其特征在于，包括：散热结构，配置为将所述显示装置内的发光模组产生的热量导出；承载结构，包括：至少一个承载板，所述承载板具有承载面以用于承载所述显示装置内的至少一个印制电路板，所述承载结构配置为在与所述散热板装配固定时所述承载板与所述散热结构之间存在间隔以形成导热通道。
- 根据权利要求1所述散热架构，其特征在于，所述承载板上用于承载印制电路板的承载区域内设置有开口。
- 根据权利要求1所述的散热架构，其特征在于，所述承载结构还包括：多个支撑柱，所述支撑柱的一端与所述承载板上背向所述承载面的一侧表面固定，所述支撑柱的另一端配置为支撑于所述散热结构上。
- 根据权利要求3所述的散热架构，其特征在于，所述支撑柱与所述承载板一体成型。
- 根据权利要求1至4中任一所述的散热架构，其特征在于，还包括：出风风扇和进风风扇，配置为在所述导热通道内以及所述承载面上形成气流。
- 一种显示装置，其特征在于，包括：如上述权利要求1至5中任一所述的散热架构。
- 根据权利要求6所述的显示装置，其特征在于，所述显示装置还包括：背板，所述背板的一侧用于固定所述发光模组；所述散热结构固定于所述背板背向所述发光模组的一侧，所述承载结构位于所述散热结构背向所述背板的一侧。
- 根据权利要求7所述的显示装置，其特征在于，承载于所述承载面上的至少一个印制电路板包括：用于控制发光模组工作的模组印制电路板、用于控制所述显示装置整机工作的整机印制电路板以及用于控制电源工作的电源印制电路板中的至少之一。
- 根据权利要求8所述的显示装置，其特征在于，所述模组印制电路板固定于所述散热结构上；所述整机印制电路板和所述电源印制电路板固定于所述承载面上。
- 根据权利要求7所述的显示装置，其特征在于，所述散热架构为权利要求5中所述散热架构，所述出风风扇固定于所述背板背向所述发光模组的一侧。
- 根据权利要求10所述的显示装置，其特征在于，所述显示装置还包括：底座，所述底座用于支撑所述显示装置；所述出风风扇位于所述散热结构和所述承载结构远离所述底座的一侧。
- 根据权利要求11所述的显示装置，其特征在于，承载于所述承载面上的至少一个印制电路板包括：用于控制电源工作的电源印制电路 板；所述进风风扇与所述电源印制电路板相对设置。
- 根据权利要求12所述的显示装置，其特征在于，所述进风风扇与所述电源印制电路板上远离所述出风风扇的一部分相对设置。
- 根据权利要求10至13中任一所述的显示装置，其特征在于，所述显示装置还包括：外壳，所述外壳位于所述承载结构远离所述散热结构的一侧，所述外壳与承载于所述承载面上的印制电路板之间存在间隔以形成导热通道；所述外壳上与所述出风风扇相对设置的区域形成有出风孔，所述外壳远离所述出风孔的一侧形成有进风孔。
- 根据权利要求14所述的显示装置，其特征在于，所述进风风扇固定于所述外壳朝向所述承载面的一侧表面上。
- 根据权利要求14所述的显示装置，其特征在于，所述显示装置还包括：支撑架，所述支撑架设置于所述外壳与所述承载面之间，所述支撑架靠近所述承载面的端部与所述承载面固定，所述支撑架靠近所述外壳的端部与所述外壳固定。
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110303341.6A CN113056176B (zh) | 2021-03-22 | 2021-03-22 | 散热架构和显示装置 |
| CN202110303341.6 | 2021-03-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2022199022A1 true WO2022199022A1 (zh) | 2022-09-29 |
Family
ID=76514543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2021/127286 WO2022199022A1 (zh) | 2021-03-22 | 2021-10-29 | 散热架构和显示装置 |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113056176B (zh) |
| WO (1) | WO2022199022A1 (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115840312A (zh) * | 2022-12-26 | 2023-03-24 | 合肥鑫晟光电科技有限公司 | 背板、背光模组和显示装置 |
| CN117320422A (zh) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | 一种智能座舱域控制器及车辆 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056176B (zh) * | 2021-03-22 | 2023-03-14 | 京东方科技集团股份有限公司 | 散热架构和显示装置 |
| CN113835488B (zh) * | 2021-09-24 | 2024-03-26 | 北京百度网讯科技有限公司 | 处理器模组及服务器 |
| CN115574303B (zh) * | 2022-09-26 | 2023-06-16 | 深圳市瀚达美电子有限公司 | 一种具有高散热性的大尺寸led背光源 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208445667U (zh) * | 2018-08-01 | 2019-01-29 | 广州长嘉电子有限公司 | 一种直下式发光电视 |
| US20190215948A1 (en) * | 2018-01-09 | 2019-07-11 | Searete Llc | Systems and methods for thermal dissipation |
| CN210130059U (zh) * | 2019-06-29 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | 散热装置及电子设备 |
| CN112530283A (zh) * | 2020-11-30 | 2021-03-19 | 筑波电子(福建)有限公司 | 一种用于显示器高承载和散热新型背板及其加工装置 |
| CN113056176A (zh) * | 2021-03-22 | 2021-06-29 | 京东方科技集团股份有限公司 | 散热架构和显示装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811435B (zh) * | 2012-11-14 | 2017-02-22 | 华为技术有限公司 | 一种可插拔热源的散热器 |
| CN204494231U (zh) * | 2015-04-10 | 2015-07-22 | 北京京东方视讯科技有限公司 | 背板、背光模组及液晶显示器 |
| CN204536695U (zh) * | 2015-04-24 | 2015-08-05 | 京东方科技集团股份有限公司 | 一种显示装置 |
| CN110806620A (zh) * | 2018-08-06 | 2020-02-18 | 华为技术有限公司 | 单板及网络设备 |
| CN110441962B (zh) * | 2018-12-05 | 2022-04-26 | 友达光电股份有限公司 | 背光模块 |
| CN209914176U (zh) * | 2019-04-03 | 2020-01-07 | 昆山龙腾光电有限公司 | 印制电路板及显示装置 |
-
2021
- 2021-03-22 CN CN202110303341.6A patent/CN113056176B/zh active Active
- 2021-10-29 WO PCT/CN2021/127286 patent/WO2022199022A1/zh unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190215948A1 (en) * | 2018-01-09 | 2019-07-11 | Searete Llc | Systems and methods for thermal dissipation |
| CN208445667U (zh) * | 2018-08-01 | 2019-01-29 | 广州长嘉电子有限公司 | 一种直下式发光电视 |
| CN210130059U (zh) * | 2019-06-29 | 2020-03-06 | Oppo（重庆）智能科技有限公司 | 散热装置及电子设备 |
| CN112530283A (zh) * | 2020-11-30 | 2021-03-19 | 筑波电子(福建)有限公司 | 一种用于显示器高承载和散热新型背板及其加工装置 |
| CN113056176A (zh) * | 2021-03-22 | 2021-06-29 | 京东方科技集团股份有限公司 | 散热架构和显示装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115840312A (zh) * | 2022-12-26 | 2023-03-24 | 合肥鑫晟光电科技有限公司 | 背板、背光模组和显示装置 |
| CN117320422A (zh) * | 2023-11-28 | 2023-12-29 | 合众新能源汽车股份有限公司 | 一种智能座舱域控制器及车辆 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113056176A (zh) | 2021-06-29 |
| CN113056176B (zh) | 2023-03-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2022199022A1 (zh) | 散热架构和显示装置 | |
| WO2020118629A1 (zh) | 电子设备 | |
| JP2006032890A (ja) | 閉ループ循環式放熱装置およびそれを使用するスクリーンモジュール | |
| CN110389474B (zh) | 液晶显示装置 | |
| WO2024021428A1 (zh) | 背光模组的背板、背光模组和显示装置 | |
| WO2018090433A1 (zh) | 户外电子设备 | |
| US10251319B2 (en) | Heat radiation apparatus using modular cooling apparatus | |
| CN112034667A (zh) | 一种激光投影设备 | |
| JP2016012516A (ja) | Ｌｅｄ投光器 | |
| JP2019003014A (ja) | 表示装置 | |
| CN209707859U (zh) | 一种具有散热结构的液晶显示模组 | |
| TWI386712B (zh) | 液晶顯示器之散熱結構 | |
| KR0136070B1 (ko) | 전자장치 | |
| CN209879240U (zh) | 一种投影仪的散热机构 | |
| CN215729249U (zh) | 一种具有循环散热***的投影仪 | |
| CN212970620U (zh) | 交换机 | |
| CN213482808U (zh) | 一种风液一体式散热机箱 | |
| CN209170804U (zh) | 功率模块散热装置 | |
| US10502890B2 (en) | Display device and wall-mounted heat dissipation mechanism thereof | |
| CN214897373U (zh) | 箱体及显示屏 | |
| CN218159508U (zh) | 一种拼接式led显示屏 | |
| CN219108023U (zh) | 一种室外led显示屏散热装置 | |
| CN206672004U (zh) | 一种外表面散热装置 | |
| WO2019127741A1 (zh) | 背光模组的散热装置、背光模组和显示装置 | |
| KR20190134570A (ko) | 디스플레이 냉각장치 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21932630 Country of ref document: EP Kind code of ref document: A1 |
|
| NENP | Non-entry into the national phase |
Ref country code: DE |
|
| 32PN | Ep: public notification in the ep bulletin as address of the adressee cannot be established |
Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC DATED 17.01.2024 (EPO FORM 1205A) |