WO2022199022A1 - Architecture de dissipation de chaleur et appareil d'affichage - Google Patents

Architecture de dissipation de chaleur et appareil d'affichage Download PDF

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Publication number
WO2022199022A1
WO2022199022A1 PCT/CN2021/127286 CN2021127286W WO2022199022A1 WO 2022199022 A1 WO2022199022 A1 WO 2022199022A1 CN 2021127286 W CN2021127286 W CN 2021127286W WO 2022199022 A1 WO2022199022 A1 WO 2022199022A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
display device
printed circuit
circuit board
dissipation structure
Prior art date
Application number
PCT/CN2021/127286
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English (en)
Chinese (zh)
Inventor
石阳
王建亭
王洁琼
Original Assignee
京东方科技集团股份有限公司
北京京东方显示技术有限公司
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Publication of WO2022199022A1 publication Critical patent/WO2022199022A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans

Definitions

  • the invention relates to the field of display, in particular to a heat dissipation structure and a display device
  • the present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a heat dissipation structure and a display device.
  • an embodiment of the present disclosure provides a heat dissipation structure, which is applied to a display device, including:
  • a heat dissipation structure configured to dissipate heat generated by the light-emitting module in the display device
  • the carrying structure includes: at least one carrying board, the carrying board has a carrying surface for carrying at least one printed circuit board in the display device, the carrying structure is configured to be fixed when assembled and fixed with the heat dissipation structure A space exists between the carrier plate and the heat dissipation plate to form a heat conduction channel.
  • an opening is provided in the carrying area of the carrying plate for carrying the printed circuit board.
  • the bearing structure further includes: a plurality of support columns, one end of the support columns is fixed to a surface of the bearing plate facing away from the bearing surface, and the other end of the support columns is configured to be supported on the heat dissipation structure.
  • the support column is integrally formed with the carrier plate.
  • the heat dissipation architecture further includes:
  • the air outlet fan and the air inlet fan are configured to form airflow in the heat conduction channel and on the bearing surface.
  • an embodiment of the present disclosure further provides a display device, including: the heat dissipation structure provided in the above-mentioned first aspect.
  • the display device further includes: a backplane, one side of the backplane is used for fixing the light-emitting module;
  • the heat dissipation structure is fixed on the side of the backplane facing away from the light emitting module, and the bearing structure is located on the side of the heat dissipation structure facing away from the backplane.
  • the at least one printed circuit board carried on the carrying surface includes: a module printed circuit board for controlling the operation of the light-emitting module, a complete machine for controlling the operation of the display device as a whole At least one of a printed circuit board and a power printed circuit board for controlling the operation of the power supply.
  • the modular printed circuit board is fixed on the heat dissipation structure
  • the whole machine printed circuit board and the power supply printed circuit board are fixed on the bearing surface.
  • the heat dissipation structure includes a light outlet fan and an air inlet fan, and the air outlet fan is fixed on a side of the backplane facing away from the light emitting module.
  • the display device further comprises: a base for supporting the display device;
  • the air outlet fan is located on a side of the heat dissipation structure and the bearing structure away from the base.
  • the at least one printed circuit board carried on the carrying surface includes: a power printed circuit board for controlling the operation of the power supply;
  • the air intake fan is arranged opposite to the power supply printed circuit board.
  • the air intake fan is disposed opposite to a portion of the power supply printed circuit board away from the air outlet fan.
  • the display device further includes: a casing, the casing is located on a side of the bearing structure away from the heat dissipation structure, and between the casing and the printed circuit board carried on the bearing surface Spaces exist to form thermally conductive channels;
  • An air outlet hole is formed in an area of the casing opposite to the air outlet fan, and an air inlet hole is formed on the side of the casing away from the air outlet hole.
  • the air intake fan is fixed on a side surface of the casing facing the bearing surface.
  • the display device further includes: a support frame, the support frame is disposed between the casing and the bearing surface, and an end of the support frame close to the bearing surface and the bearing surface The end of the support frame close to the casing is fixed with the casing.
  • FIG. 1 is a schematic cross-sectional view of a display device involved in the related art
  • FIG. 2 is a schematic diagram of the heat transfer direction of the display device shown in FIG. 1;
  • FIG. 3 is a schematic cross-sectional view of a display device according to an embodiment of the present disclosure.
  • FIG. 4 is a schematic cross-sectional view of a heat dissipation structure provided by the implementation of the present disclosure
  • FIG. 5 is a schematic diagram of a heat transfer direction of a display device having a heat dissipation structure provided by an embodiment of the present disclosure
  • FIG. 6 is a schematic top view of a heat dissipation structure and an air outlet fan in an embodiment of the disclosure
  • FIG. 7 is a schematic top view of a module printed circuit fixed on a heat dissipation structure in an embodiment of the disclosure
  • FIG. 8 is a schematic top view when the bearing structure and the heat dissipation structure are fixed in an embodiment of the disclosure
  • Fig. 9 is a schematic top view when the printed circuit board of the whole machine and the power printed circuit board are fixed on the bearing surface.
  • the pure electrical energy converted into heat energy after the power is increased not only is the pure electrical energy converted into heat energy after the power is increased, but also the blocked light energy or cannot pass through when the light radiation encounters the film or glass with low transmittance.
  • the light energy accumulated continuously on the surface of the film or glass causing the temperature of the entire light-emitting module to rise continuously.
  • the working temperature of the light-emitting module (normal working temperature is 20 °C ⁇ 80 °C) is a key parameter affecting the performance of the display product.
  • the index parameters of the performance of various optical film materials are closely related to the temperature. Liquid crystal particles are extremely sensitive to temperature. Too high or high temperature will cause changes in the performance of liquid crystal particles, which in turn will cause changes in display performance, increase the color coordinate shift of the display device, and decrease color accuracy. The final display effect of the device is adversely affected.
  • each printed circuit board inside the display device is generally provided with structures such as chips and capacitors.
  • structures such as chips and capacitors.
  • FIG. 1 is a schematic cross-sectional view of a display device involved in the related art.
  • the display device includes: a light-emitting module 21 , a backplane 22 , various printed circuit boards 24 and a casing 25 ; in order to improve heat dissipation efficiency, a heat-dissipating plate 23 is generally installed in the display device, and the light-emitting module 21
  • the heat dissipation plate 23 and the heat dissipation plate 23 are fixed on different sides of the back plate 22 , and various printed circuit boards 24 are fixed on the heat dissipation plate 23 .
  • FIG. 2 is a schematic diagram of a heat transfer direction of the display device shown in FIG. 1 .
  • the main direction of heat transfer in the display device shown in FIG. 1 is as follows: the heat dissipation plate 23 conducts the heat generated by the light emitting module 21 and various printed circuit boards 24 to the heat dissipation plate 23 between the casing 25 and the heat dissipation plate 23 .
  • the heat is dissipated to the external environment through the heat dissipation holes on the casing 25 .
  • the light-emitting modules 21 and various types of printed circuit boards 24 are located in relatively concentrated locations, and the heat dissipation space (including: the heat dissipation plate 23 and the extremely small interior space near the printed circuit board 24 ) is small.
  • the light-emitting module 21 mainly dissipates heat through the heat-dissipating plate 23.
  • the light-emitting module 21 will be affected by the heat-dissipating plate 23 to dissipate heat;
  • the heat exchange is only carried out by relying on the free flow of ambient wind, and the heat dissipation efficiency is low. Therefore, in the display device related to the related art, the temperature of the light emitting module 21 and various printed circuit boards 24 is still relatively high during operation, which adversely affects the normal operation of the display device.
  • the embodiments of the present disclosure provide a corresponding solution.
  • FIG. 3 is a schematic cross-sectional view of a display device provided by an embodiment of the present disclosure
  • FIG. 4 is a schematic cross-sectional view of a heat dissipation structure provided by an embodiment of the present disclosure
  • FIG. 5 is a display device having the heat dissipation structure provided by the embodiment of the present disclosure.
  • FIG. 6 is a schematic top view of a heat dissipation structure and an air outlet fan in an embodiment of the disclosure.
  • FIG. 7 is a top schematic diagram of a module printed circuit fixed on the heat dissipation structure in an embodiment of the disclosure.
  • 8 is a schematic top view when the carrying structure and the heat dissipation structure are fixed in the embodiment of the disclosure, and FIG.
  • the display device includes: a light emitting module 21 , a backplane 22 , various printed circuit boards and a heat dissipation structure.
  • the light-emitting module 21 generally includes a light bar (generally including a plurality of LED lights), a light guide plate, an optical film layer (such as a diffuser sheet, a prism sheet, etc.), and the light-emitting module 21 belongs to the conventional structure in the display device, and is not described here. Describe in detail.
  • the back plate 22 is used for fixing the light emitting module 21, and the material of the back plate 22 is generally a metal material, such as aluminum.
  • the display device is generally provided with the following three types of printed circuit boards: (1) the module printed circuit board 5 used to control the operation of the light-emitting module 21; (2) the whole machine printed circuit board used to control the operation of the display device circuit board 6; (3) a power supply printed circuit board 7 for controlling the operation of the power supply.
  • the modular printed circuit board 5 generally includes two printed circuit boards, one of which is mounted with a Field Programmable Gate Array (FPGA for short) corresponding to the control of the light-emitting module 21 ) chip (also called “module FPGA”), and another printed circuit board is mounted with a logic board (also called module T-con) corresponding to the control of the light-emitting module 21 .
  • FPGA Field Programmable Gate Array
  • the printed circuit board 6 of the whole machine generally includes two printed circuit boards, one of which is installed with an FPGA chip (also called “complete machine FPGA”) corresponding to the control of the whole machine, and the other printed circuit board.
  • FPGA chip also called “complete machine FPGA”
  • a system-on-chip also called “complete machine SOC”
  • the above three types of printed circuit boards are generally arranged on a heat dissipation structure.
  • the heat dissipation structure can provide a larger heat dissipation space than the existing heat dissipation plate, which can provide a better heat dissipation effect, which will be described in detail later with reference to specific embodiments.
  • an embodiment of the present disclosure provides a heat dissipation structure, which includes: a heat dissipation structure 1 and a bearing structure; wherein, the heat dissipation structure 1 is configured to dissipate heat generated by the light emitting module 21 in the display device;
  • the structure includes: at least one carrying board 2, the carrying board 2 has a carrying surface for carrying at least one printed circuit board in the display device, and the carrying structure is configured to be between the carrying board 2 and the heat dissipating structure 1 when it is assembled and fixed with the heat sink Spaces exist to form thermally conductive channels.
  • the heat dissipation structure 1 may adopt the heat dissipation plate involved in the related art; of course, other structures may also be adopted.
  • the heat dissipation structure 1 includes a bottom heat dissipation plate 101 and a plurality of parallel heat dissipation fins 102 disposed on the bottom heat dissipation plate 101 , and the heat dissipation fins 102 are perpendicular to the bottom heat dissipation plate 101 .
  • the material of the heat dissipation structure 1 can be a material with better thermal conductivity, such as aluminum, copper, and the like.
  • the printed circuit board carried on the bearing surface may include: a modular printed circuit board 5 for controlling the operation of the light-emitting module 21, a complete printed circuit board 6 for controlling the operation of the display device as a whole, and a complete printed circuit board 6 for controlling the operation of the display device. At least one of the power supply printed circuit boards 7 for power supply operation.
  • the printed circuit board can be fixed on the bearing surface by screws.
  • the main transfer directions of heat in the display device are as follows: the heat dissipation structure 1 conducts the heat generated by the light emitting module 21 and the printed circuit board located on the heat dissipation structure 1 to the heat conduction channel, and the heat dissipation structure located on the carrier board 2
  • the printed circuit board exchanges heat with the air to conduct the heat to the internal space environment, and then dissipates the heat to the external environment through the heat dissipation holes on the casing 25 .
  • the heat dissipation structure is The corresponding heat dissipation space includes: the heat dissipation structure 1, the heat conduction channel between the heat dissipation structure 1 and the carrier board 2, and the space on the side of the carrier surface away from the heat dissipation structure 1. Therefore, compared with the related art, the heat dissipation provided by the embodiment of the present disclosure is The architecture has a larger space for heat dissipation, which is conducive to improving heat dissipation efficiency.
  • the number of the bearing boards 2 included in the bearing structure may be one, two or more.
  • the disclosed technical solutions create limitations.
  • the two or more carrier boards 2 may be stacked and arranged, and there is a gap between adjacent carrier boards 2 to form a heat conduction channel, so as to further increase the Large heat dissipation space; however, with the increase of the number of carrier plates 2, the overall size (thickness) of the heat dissipation structure 1 will also increase accordingly, and the overall thickness of the display device will be too large when the heat dissipation structure 1 is applied to a display device.
  • the number of the carrier plates 2 can be set according to actual needs.
  • openings 201 are provided in the carrying area of the carrier board 2 for carrying the printed circuit board. These openings 201 are designed to facilitate heat dissipation of the printed circuit on the carrier board 2 .
  • one end of the support columns 11 is fixed to the side surface of the carrier plate 2 facing away from the bearing surface, and the other end of the support columns 11 is configured to be supported on the heat dissipation structure 1 .
  • the support column 11 is integrally formed with the carrier plate 2 .
  • the material of the bearing structure may be a metal material, such as aluminum; the one-piece bearing structure may be prepared by a stamping process.
  • screw holes are also provided on at least one of the support column 11 and the carrier plate 2 , so that the carrier structure and the heat dissipation structure 1 can be fixed by screws.
  • the heat dissipation structure further includes: an air outlet fan 3 and an air inlet fan 4, and the two types of fans are configured to form airflow in the heat conduction channel and on the bearing surface.
  • the air outlet fan 3 and the air inlet fan 4 By arranging the air outlet fan 3 and the air inlet fan 4, the air circulation speed of the heat conduction channel and the surface of the bearing surface can be accelerated, so that the cold air is introduced while the hot air is exported, which is beneficial to the exchange of heat, and the heat dissipation efficiency is improved.
  • the air outlet fan 3 and the air inlet fan 4 the flow direction of the air flow in the display device can be limited (from the air inlet fan 4 to the air outlet fan 3), thereby limiting the heat transfer direction.
  • FIGS. 7-9 only the case of four air outlet fans 3 is exemplarily drawn, which will not limit the technical solution of the present disclosure. In practical applications, an appropriate model and quantity of fans can be selected according to the actual heat dissipation requirements of the display device as a whole.
  • the thermal power W heat of the circuit board 7 is generally 87%, so the power supply printed
  • the air outlet fan 3 and the air inlet fan 4 configured for the power supply printed circuit board 7 need to satisfy the formed air flow of 0.3 m 2 /min.
  • an embodiment of the present invention further provides a display device, which includes the heat dissipation structure provided in the previous embodiment.
  • a display device which includes the heat dissipation structure provided in the previous embodiment.
  • the heat dissipation structure refer to the corresponding content in the previous embodiment. It is not repeated here.
  • the heat dissipation structure 1 is fixed on the side of the backplane 22 facing away from the light emitting module 21 , and the bearing structure is located on the side of the heat dissipation structure 1 facing away from the backplane 22 .
  • At least one of the modular printed circuit board 5 , the complete printed circuit board 6 and the power printed circuit board 7 is carried on the carrying surface of the carrying board 2 .
  • the printed circuit boards that are not carried on the carrier board 2 among the above three types of printed circuit boards can be fixed on the heat dissipation structure 1 .
  • the module printed circuit board 5 is fixed on the heat dissipation structure 1; the whole machine printed circuit board 6 and the power supply printed circuit board 7 are fixed on the bearing surface.
  • the module printed circuit The board 5 can be fixed on the heat dissipation structure 1 without being moved to the bearing surface; the whole printed circuit board 6 and the power supply printed circuit board 7 generate more heat, and either of the two is fixed on the heat dissipation structure. 1 will seriously affect the heat dissipation of the light emitting module 21 through the heat dissipation structure 1, so the printed circuit board 6 of the whole machine and the power printed circuit board 7 are fixed on the bearing surface.
  • the printed circuit board to be placed on the bearing surface can also be adjusted according to actual needs.
  • the air outlet fan 3 when the air inlet fan 4 and the air outlet fan 3 are arranged in the heat dissipation structure, the air outlet fan 3 is fixed on the side of the back panel 22 facing away from the light emitting module 21 .
  • the display device further includes: a base 8 for supporting the display device; the air outlet fan 3 is located on the side of the heat dissipation structure 1 and the bearing structure away from the base 8 . That is, the air outlet fan 3 is provided at a relatively upper position in the entire display device.
  • the air outlet fan 3 in view of the principle of cold air sinking and hot air rising, the air outlet fan 3 is arranged at a relatively upper position in the entire display device, so that the hot air that has undergone heat exchange can be removed from the interior space in time. Blow out, always ensure the continuous circulation and exchange of air to improve the heat dissipation efficiency.
  • the power supply printed circuit board 7 is carried on the bearing surface, and the air intake fan 4 is disposed opposite to the power supply printed circuit board 7 .
  • the heat generated by the power printed circuit board 7 during the working process is far more than the module printed circuit board 5 and the whole machine printed circuit board 6, and the heat dissipation requirement of the power printed circuit board 7 is greater than that of the module. Due to the heat dissipation requirements of the printed circuit board 5 and the printed circuit board 6 of the whole machine, the air intake fan 4 is arranged opposite the power printed circuit board 7 to improve the heat dissipation efficiency of the power printed circuit board 7 (the intake fan 4 The nearby heat dissipation efficiency is relatively high).
  • the air inlet fan 4 is disposed opposite to a part of the power supply printed circuit board 7 that is far away from the air outlet fan 3 . That is, the air intake fan 4 is arranged at a relatively lower position in the entire display device; this design can suck as much cold air as possible into the display device.
  • the display device further includes: a casing 25, the casing 25 is located on the side of the bearing structure away from the heat dissipation structure 1, and a space exists between the casing 25 and the printed circuit board carried on the bearing surface to form a heat conduction channel; the casing The area on the 25 opposite to the air outlet fan 3 is formed with an air outlet hole 9, and the side of the casing 25 away from the air outlet hole 9 is formed with an air inlet hole 10 to ensure that the display device can efficiently suck the ambient air into the machine, and The hot air inside the display device is effectively exhausted to achieve high-efficiency heat exchange.
  • the air outlet 9 is disposed toward one side of the base 9 in the form of a "blind shutter” to prevent falling water from directly above the display device from entering the interior of the display device.
  • the air intake fan 4 is fixed on the side surface of the casing 25 facing the carrier plate 2 .
  • the support frame 12 is disposed between the housing 25 and the bearing surface, the end of the support frame 12 near the bearing surface is fixed to the bearing surface, and the end of the support frame 12 near the housing 25 is fixed to the housing 25 .
  • the casing 25 can be effectively prevented from being deformed by the temperature change.
  • the heat sources in the display device can be more dispersed, and the heat exchange space is enlarged, which is beneficial to improve the heat dissipation efficiency.
  • the air outlet fan 3/inlet fan 4 the air flow velocity in the display device can be increased, and the heat dissipation efficiency can be further improved.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente divulgation concerne une architecture de dissipation de chaleur, qui est appliquée à un appareil d'affichage. L'architecture de dissipation de chaleur comprend une structure de dissipation de chaleur, qui est configurée pour guider la chaleur générée par un module électroluminescent dans un appareil d'affichage ; et une structure de support, comprenant au moins une plaque de support, la plaque de support étant pourvue d'une face d'appui pour supporter au moins une carte de circuit imprimé dans l'appareil d'affichage, et la structure de palier étant configurée de telle sorte que, lorsque la structure de palier est assemblée de manière fixe sur une plaque de dissipation de chaleur, la plaque de support et la plaque de dissipation de chaleur sont espacées pour former un canal de transfert de chaleur. Au moyen de la disposition de la structure de support et de l'utilisation de la structure de support pour porter la ou les cartes de circuit imprimé dans l'appareil d'affichage, les positions d'agencement du module électroluminescent et de diverses cartes de circuit imprimé sont relativement dispersées. Un espace de dissipation de chaleur correspondant à l'architecture de dissipation de chaleur comprend la structure de dissipation de chaleur, un canal de transfert de chaleur situé entre la structure de dissipation de chaleur et la plaque de support, et un espace situé sur le côté de la face d'appui qui est éloigné de la structure de dissipation de chaleur. Par conséquent, par rapport à l'état de la technique, l'architecture de dissipation de chaleur fournie dans les modes de réalisation de la présente divulgation a un espace de dissipation de chaleur plus grand, ce qui facilite l'amélioration de l'efficacité de dissipation de chaleur.
PCT/CN2021/127286 2021-03-22 2021-10-29 Architecture de dissipation de chaleur et appareil d'affichage WO2022199022A1 (fr)

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CN202110303341.6A CN113056176B (zh) 2021-03-22 2021-03-22 散热架构和显示装置
CN202110303341.6 2021-03-22

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CN115840312A (zh) * 2022-12-26 2023-03-24 合肥鑫晟光电科技有限公司 背板、背光模组和显示装置
CN117320422A (zh) * 2023-11-28 2023-12-29 合众新能源汽车股份有限公司 一种智能座舱域控制器及车辆

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CN113056176B (zh) * 2021-03-22 2023-03-14 京东方科技集团股份有限公司 散热架构和显示装置
CN113835488B (zh) * 2021-09-24 2024-03-26 北京百度网讯科技有限公司 处理器模组及服务器
CN115574303B (zh) * 2022-09-26 2023-06-16 深圳市瀚达美电子有限公司 一种具有高散热性的大尺寸led背光源

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CN208445667U (zh) * 2018-08-01 2019-01-29 广州长嘉电子有限公司 一种直下式发光电视
CN210130059U (zh) * 2019-06-29 2020-03-06 Oppo（重庆）智能科技有限公司 散热装置及电子设备
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CN117320422A (zh) * 2023-11-28 2023-12-29 合众新能源汽车股份有限公司 一种智能座舱域控制器及车辆

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