WO2018105249A1 - 弾性波装置、高周波フロントエンド回路及び通信装置 - Google Patents
弾性波装置、高周波フロントエンド回路及び通信装置 Download PDFInfo
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
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- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02543—Characteristics of substrate, e.g. cutting angles
- H03H9/02559—Characteristics of substrate, e.g. cutting angles of lithium niobate or lithium-tantalate substrates
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02614—Treatment of substrates, e.g. curved, spherical, cylindrical substrates ensuring closed round-about circuits for the acoustical waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02834—Means for compensation or elimination of undesirable effects of temperature influence
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02818—Means for compensation or elimination of undesirable effects
- H03H9/02944—Means for compensation or elimination of undesirable effects of ohmic loss
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
- H03H9/6483—Ladder SAW filters
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/70—Multiple-port networks for connecting several sources or loads, working on different frequencies or frequency bands, to a common load or source
- H03H9/72—Networks using surface acoustic waves
- H03H9/725—Duplexers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6489—Compensation of undesirable effects
Definitions
- the present invention relates to an elastic wave device used for a resonator, a high frequency filter, and the like, and a high frequency front end circuit and a communication device using the elastic wave device.
- Patent Documents 1 and 2 below disclose an acoustic wave device in which an IDT electrode is provided on a LiNbO 3 substrate.
- a SiO 2 film is provided so as to cover the IDT electrode. It is said that the frequency temperature characteristic can be improved by the SiO 2 film.
- the said IDT electrode is formed with the metal whose density is larger than Al.
- Patent Document 2 describes a laminated metal film in which an Al film is laminated on a Pt film as the IDT electrode.
- an IDT electrode having a single layer structure as in Patent Document 1 when used, electrode finger resistance increases and loss may increase.
- an IDT electrode formed of a laminated metal film sometimes fails to obtain sufficient frequency temperature characteristics.
- an SiO 2 film is provided to improve frequency temperature characteristics, spurious due to higher order modes may occur.
- IMD intermodulation distortion
- An object of the present invention is to use an acoustic wave device and the acoustic wave device that have low loss, excellent frequency temperature characteristics, are less likely to cause spurious due to higher-order modes, and can suppress IMD degradation.
- An acoustic wave device includes a piezoelectric substrate, an IDT electrode provided on the piezoelectric substrate, and a silicon oxide film provided on the piezoelectric substrate so as to cover the IDT electrode.
- the IDT electrode includes a first electrode layer and a second electrode layer stacked on the first electrode layer, and the first electrode layer includes the second electrode layer.
- the piezoelectric substrate is made of LiNbO 3, and the Euler angle of the piezoelectric substrate (0 ° ⁇ 5 °, ⁇ , 0 ° ⁇ 10 °), ⁇ is in the range of 8 ° to 32 °, and the silicon oxide film contains a hydrogen atom, a hydroxyl group, or a silanol group. .
- the elastic wave device uses a Rayleigh wave, and the thickness of the first electrode layer is such that the sound speed of the SH wave is slower than the sound speed of the Rayleigh wave. It is supposed to be a thickness. In this case, unnecessary waves near the pass band can be suppressed.
- the first electrode layer is selected from the group consisting of Pt, W, Mo, Ta, Au, Cu, and alloys containing these metals as main components. At least one kind.
- the thickness of the first electrode layer is as shown in Table 1 below. According to the material of the electrode layer, the thickness is shown in Table 1 below. In this case, unnecessary waves near the passband can be further suppressed.
- the second electrode layer is made of Al, Cu, or an alloy containing Al or Cu as a main component.
- the resistance of the electrode fingers can be reduced and the loss can be further reduced.
- the thickness of the second electrode layer is 0.0175 ⁇ or more. In this case, the resistance of the electrode fingers can be reduced and the loss can be further reduced.
- the thickness of the silicon oxide film is 0.30 ⁇ or more. In this case, the frequency temperature characteristic can be further improved.
- the duty ratio of the IDT electrode is 0.48 or more. In this case, spurious due to the higher order mode can be further suppressed.
- the duty ratio of the IDT electrode is 0.55 or more. In this case, spurious due to the higher order mode can be further suppressed.
- the high-frequency front-end circuit according to the present invention includes an elastic wave device configured according to the present invention and a power amplifier.
- the communication device includes a high-frequency front-end circuit configured according to the present invention and an RF signal processing circuit.
- an elastic wave device that has low loss, excellent frequency temperature characteristics, is unlikely to generate spurious due to higher-order modes, and can suppress IMD degradation.
- FIG. 1A is a schematic front sectional view of an acoustic wave device according to an embodiment of the present invention
- FIG. 1B is a schematic plan view showing an electrode structure thereof
- FIG. 2 is a schematic front cross-sectional view in which an electrode portion of an acoustic wave device according to an embodiment of the present invention is enlarged.
- FIG. 3 is a diagram showing the relationship between the film thickness of the Al film and the sheet resistance in the laminated metal film in which the Al film is laminated on the Pt film.
- FIG. 4 is a diagram showing the relationship between the thickness of the Al film as the second electrode layer and the frequency temperature coefficient (TCF).
- TCF frequency temperature coefficient
- FIG. 5 is a diagram showing the relationship between the thickness of the SiO 2 film, which is a silicon oxide film, and the frequency temperature coefficient (TCF).
- FIG. 6A is a diagram showing impedance characteristics when the film thickness of SiO 2 is 0.26 ⁇
- FIG. 6B is a diagram showing phase characteristics thereof.
- FIG. 7A is a diagram showing impedance characteristics when the film thickness of SiO 2 is 0.30 ⁇
- FIG. 7B is a diagram showing phase characteristics thereof.
- FIG. 8A is a diagram showing impedance characteristics when the film thickness of SiO 2 is 0.34 ⁇
- FIG. 8B is a diagram showing phase characteristics thereof.
- FIG. 9A is a diagram showing impedance characteristics when the film thickness of SiO 2 is 0.38 ⁇
- FIG. 9B is a diagram showing phase characteristics thereof.
- FIG. 10 is a diagram showing the relationship between the film thickness of the SiO 2 film and the maximum phase of the higher-order mode.
- FIG. 12B is a diagram showing phase characteristics thereof.
- FIG. 16 is a diagram illustrating the relationship between ⁇ and the maximum phase of the higher-order mode at the Euler angles (0 °, ⁇ , 0 °).
- 17 (a) to 17 (c) show ⁇ and Eu at the Euler angles (0 °, ⁇ , 0 °) when the Pt film thicknesses are 0.015 ⁇ , 0.025 ⁇ , and 0.035 ⁇ , respectively. It is a figure which shows the relationship with the specific band of SH wave.
- 18 (a) to 18 (c) show ⁇ and Eu at the Euler angles (0 °, ⁇ , 0 °) when the thicknesses of the Pt films are 0.055 ⁇ , 0.065 ⁇ , and 0.075 ⁇ , respectively.
- FIG. 19 is a diagram showing the relationship between the film thickness of the Pt film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 19 is a diagram showing the relationship between the film thickness of the Pt film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 20A is a diagram showing impedance characteristics of the acoustic wave device produced in the experimental example
- FIG. 20B is a diagram showing phase characteristics thereof.
- FIG. 21 is a diagram illustrating the relationship between the film thickness of the W film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 22 is a diagram showing the relationship between the film thickness of the Mo film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 23 is a diagram illustrating the relationship between the film thickness of the Ta film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 24 is a diagram showing the relationship between the film thickness of the Au film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 21 is a diagram illustrating the relationship between the film thickness of the W film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 22 is a diagram showing the relationship between the film thickness of the Mo film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 23
- FIG. 25 is a diagram showing the relationship between the film thickness of the Cu film and the sound speeds of the Rayleigh wave and the SH wave.
- FIG. 26A is a diagram showing the impedance characteristic when the duty ratio is 0.50
- FIG. 26B is a diagram showing the phase characteristic.
- FIG. 27A is a diagram showing the impedance characteristic when the duty ratio is 0.60
- FIG. 27B is a diagram showing the phase characteristic.
- FIG. 28A is a diagram showing the impedance characteristic when the duty ratio is 0.70
- FIG. 28B is a diagram showing the phase characteristic.
- FIG. 29 is a diagram showing the relationship between the duty ratio of the IDT electrode and the maximum phase of the higher-order mode.
- FIG. 30 is a diagram illustrating IMD characteristics of the acoustic wave device according to the embodiment of the present invention.
- FIG. 31 is a configuration diagram of a communication device and a high-frequency front-end circuit according to the present invention.
- FIG. 1A is a schematic front sectional view of an acoustic wave device according to an embodiment of the present invention
- FIG. 1B is a schematic plan view showing an electrode structure thereof
- FIG. 2 is a schematic front cross-sectional view in which an electrode portion of an acoustic wave device according to an embodiment of the present invention is enlarged.
- the acoustic wave device 1 has a piezoelectric substrate 2.
- the piezoelectric substrate 2 has a main surface 2a.
- the piezoelectric substrate 2 is made of LiNbO 3 .
- ⁇ is in the range of 8 ° to 32 °. Therefore, the acoustic wave device 1 can further suppress the occurrence of spurious due to the higher-order mode as will be described later.
- the piezoelectric substrate 2 is a substrate having piezoelectricity at least on the surface.
- a piezoelectric thin film may be provided on the surface, and the piezoelectric thin film may be formed of a laminated body of a film having a different sound speed and a supporting substrate.
- the piezoelectric substrate 2 may have piezoelectricity in the whole substrate. In this case, the piezoelectric substrate 2 is composed of a single piezoelectric layer.
- the angle ⁇ is preferably 30 ° or less, more preferably 28 ° or less, and further preferably 12 ° or more and 26 ° or less. In that case, generation of spurious due to the higher order mode can be further suppressed.
- An IDT electrode 3 is provided on the main surface 2 a of the piezoelectric substrate 2.
- the elastic wave device 1 uses a Rayleigh wave as a main mode as an elastic wave excited by the IDT electrode 3.
- the wavelength of the surface acoustic wave which is the fundamental wave of the longitudinal mode determined by the electrode finger pitch of the IDT electrode 3, is ⁇ .
- the electrode structure shown in FIG. 1B is formed on the piezoelectric substrate 2. That is, the IDT electrode 3 and the reflectors 4 and 5 disposed on both sides of the IDT electrode 3 in the elastic wave propagation direction are formed. Thereby, a 1-port elastic wave resonator is configured.
- the electrode structure including the IDT electrode in the present invention is not particularly limited.
- a filter may be configured by combining a plurality of resonators. Examples of such a filter include a ladder type filter, a longitudinally coupled resonator type filter, and a lattice type filter.
- the IDT electrode 3 has first and second bus bars and a plurality of first and second electrode fingers.
- the plurality of first and second electrode fingers extend in a direction orthogonal to the elastic wave propagation direction.
- the plurality of first electrode fingers and the plurality of second electrode fingers are interleaved with each other.
- the plurality of first electrode fingers are connected to the first bus bar, and the plurality of second electrode fingers are connected to the second bus bar.
- the IDT electrode 3 has first and second electrode layers 3a and 3b.
- a second electrode layer 3b is stacked on the first electrode layer 3a.
- the first electrode layer 3 a is made of a metal or alloy having a higher density than the metal constituting the second electrode layer 3 b and the silicon oxide constituting the silicon oxide film 6.
- the first electrode layer 3a is made of a metal or alloy such as Pt, W, Mo, Ta, Au, or Cu.
- the first electrode layer 3a is preferably made of Pt or an alloy containing Pt as a main component.
- the thickness of the first electrode layer 3a is preferably set to the thickness shown in Table 2 below according to the material of the first electrode layer 3a shown in Table 2 below.
- the second electrode layer 3b is made of Al or an alloy containing Al as a main component. From the viewpoint of reducing the resistance of the electrode fingers and further reducing the loss, the second electrode layer 3b is preferably made of a metal or alloy having a lower resistance than the first electrode layer 3a. Therefore, the second electrode layer 3b is preferably made of Al, Cu, or an alloy containing Al or Cu as a main component. In the present specification, the main component means a component contained in an amount of 50% by weight or more.
- the thickness of the second electrode layer 3b is preferably 0.0175 ⁇ or more.
- the film thickness of the second electrode layer 3b is desirably 0.2 ⁇ or less.
- the IDT electrode 3 may be a laminated metal film in which other metals are laminated in addition to the first and second electrode layers 3a and 3b. Although it does not specifically limit as said other metal, Metals or alloys, such as Ti, NiCr, and Cr, are mentioned.
- the metal film made of Ti, NiCr, Cr, or the like is preferably an adhesion layer that enhances the bonding force between the first electrode layer 3a and the second electrode layer 3b.
- the IDT electrode 3 can be formed by, for example, a vapor deposition lift-off method.
- a silicon oxide film 6 is provided so as to cover the IDT electrode 3.
- the silicon oxide film 6 is made of silicon oxide. From the viewpoint of further improving the frequency temperature characteristics, the material constituting the silicon oxide film 6 is preferably SiO 2 .
- the silicon oxide film 6 contains a hydrogen atom, a hydroxyl group or a silanol group.
- the silicon oxide film 6 contains a hydrogen atom, a hydroxyl group, or a silanol group, it is possible to suppress degradation of IMD (intermodulation distortion).
- the silicon oxide film 6 can be formed by sputtering, for example, on the main surface 2a of the piezoelectric substrate 2 on which the IDT electrode 3 is formed.
- water (H 2 O) is vaporized by a vaporizer and mixed with the sputtering gas to introduce hydrogen atoms, hydroxyl groups, or silanol groups into the silicon oxide film 6. it can.
- the content of hydrogen atoms, hydroxyl groups, or silanol groups in the silicon oxide film 6 can be adjusted by controlling the vaporization amount of water (H 2 O) using, for example, a mass flow controller. Note that the vaporization amount of water (H 2 O) may be controlled by other methods.
- a sputtering gas for vaporizing and mixing water for example, Ar, O 2, or a mixed gas thereof can be used.
- the sputtering pressure can be set to 0.03 Pa or more and 1.50 Pa or less, for example.
- the substrate heating temperature can be, for example, 100 ° C. or more and 300 ° C. or less.
- the piezoelectric substrate 2 is made of LiNbO 3 as described above, and ⁇ is 32 at the Euler angles (0 ° ⁇ 5 °, ⁇ , 0 ° ⁇ 10 °) of the piezoelectric substrate 2.
- the IDT electrode 3 is configured by a laminated metal film having the first electrode layer 3a having a high density as a lower layer.
- a silicon oxide film 6 is provided so as to cover the IDT electrode 3. Therefore, the acoustic wave device 1 has low loss, excellent frequency temperature characteristics, and is unlikely to generate spurious due to higher-order modes.
- the silicon oxide film 6 contains a hydrogen atom, a hydroxyl group, or a silanol group, it is possible to suppress degradation of IMD (intermodulation distortion).
- the elastic wave device 1 of the present embodiment can suppress the degradation of the IMD, the following elastic wave resonator was designed.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 30, 0 °)
- First electrode layer 3a ... Pt film
- film thickness 0.085 ⁇
- Second electrode layer 3b ...
- Al film film thickness: 0.082 ⁇
- Duty ratio 0.5 Silicon oxide film 6... SiO 2 film containing SiOH group
- film thickness 0.40 ⁇
- Elastic wave ... Main mode: Rayleigh wave
- the silicon oxide film 6 was formed by sputtering after forming the IDT electrode 3 on the piezoelectric substrate 2. Specifically, water (H 2 O) vaporized from liquid to gas using a vaporizer was added to a mixed gas of Ar and O 2 while controlling the flow rate using a mass flow controller. The sputtering pressure was 0.5 Pa and the substrate heating temperature was 220 ° C. The results are shown in FIG.
- FIG. 30 is a diagram showing IMD characteristics of the acoustic wave device 1 according to an embodiment of the present invention.
- broken lines indicate IMD characteristics when an acoustic wave resonator is designed using the silicon oxide film 6 containing a hydrogen atom, a hydroxyl group, or a silanol group.
- the solid line shows the IMD characteristics when the acoustic wave resonator is designed using the silicon oxide film 6 containing no hydrogen atom, hydroxyl group or silanol group.
- FIG. 30 shows that the IMD characteristics are improved by using the silicon oxide film 6 containing a hydrogen atom, a hydroxyl group, or a silanol group.
- FIG. 3 is a diagram showing the relationship between the film thickness of the Al film and the sheet resistance in the laminated metal film in which the Al film is laminated on the Pt film.
- FIG. 3 shows that the sheet resistance decreases as the thickness of the Al film increases.
- the sheet resistance is preferably 0.5 ( ⁇ / sq.) Or less, more preferably 0.2 ( ⁇ / sq.) Or less, and further preferably 0.1 ( ⁇ / sq.).
- the film thickness of the Al film in the laminated metal film is preferably 70 nm or more, more preferably 175 nm or more, and further preferably 350 nm or more. Note that, from the viewpoint of suppressing deterioration of frequency temperature characteristics described later, the thickness of the Al film in the laminated metal film is desirably 0.2 ⁇ or less.
- FIG. 4 is a diagram showing the relationship between the thickness of the Al film as the second electrode layer and the frequency temperature coefficient (TCF).
- TCF frequency temperature coefficient
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 38 °, 0 °)
- First electrode layer 3a ... Pt film, film thickness: 0.02 ⁇
- Second electrode layer 3b ...
- Al film IDT electrode 3 ...
- Silicon oxide film 6 ... SiO 2 film, film thickness: 0.3 ⁇
- Main mode Rayleigh wave
- FIG. 4 shows that the TCF deteriorates as the thickness of the Al film increases.
- the amount of TCF degradation ( ⁇ TCF) with respect to the thickness of the Al film when the wavelength ⁇ is 2.0 ⁇ m (frequency: equivalent to 1.8 GHz) is as shown in Table 3 below.
- Table 4 below shows the thickness of the Al film and the amount of TCF degradation ( ⁇ TCF) when the wavelength ⁇ is 4.0 ⁇ m (frequency: equivalent to 900 MHz).
- FIG. 5 is a diagram showing the relationship between the thickness of the silicon oxide (SiO 2 ) film and the frequency temperature coefficient (TCF).
- FIG. 5 shows the results when the elastic wave resonator designed as follows is used in the structure shown in FIGS.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 38 °, 0 °)
- First electrode layer 3a Pt film
- Second electrode layer 3b Al film
- film thickness 0.10 ⁇ IDT electrode 3
- Duty ratio 0.50
- Silicon oxide film 6 ... SiO 2 film
- TCF deterioration of about 10 ppm / ° C. or more and 20 ppm / ° C. or less is accompanied in order to obtain a sufficient sheet resistance value.
- 6 to 9 show the magnitude of impedance when the thickness of the SiO 2 film is changed for each figure, and (a) shows the magnitude of impedance when the sound speed represented by the product of frequency and wavelength is changed. It is a figure and (b) is a figure which shows the phase characteristic. 6 to 9, the values obtained by normalizing the film thickness of the SiO 2 film by wavelength are 0.26 ⁇ , 0.30 ⁇ , 0.34 ⁇ , and 0.38 ⁇ , respectively. FIGS. 6 to 9 show results when the elastic wave resonator designed as follows is used in the structure shown in FIGS.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 38 °, 0 °)
- First electrode layer 3a Pt film
- Second electrode layer 3b Al film
- film thickness 0.10 ⁇ IDT electrode 3
- Duty ratio 0.50
- Silicon oxide film 6 ... SiO 2 film
- the maximum phase of the higher order mode needs to be ⁇ 25 ° or less.
- FIG. 10 is a diagram showing the relationship between the film thickness of the SiO 2 film and the maximum phase of the higher-order mode.
- FIG. 10 shows the results when using an acoustic wave resonator having the same design as in FIGS.
- FIG. 11 to 15 (a) is a diagram showing impedance characteristics when ⁇ is changed at Euler angles (0 °, ⁇ , 0 °) of the piezoelectric substrate, and (b) is its phase characteristics.
- FIG. 11 to 15, ⁇ is respectively 24 °, 28 °, 32 °, 36 °, and 38 ° in this order.
- FIGS. 11 to 15 show the results when the acoustic wave resonator designed as follows is used in the structure shown in FIGS. The film thicknesses of the electrode layer and the silicon oxide film are shown normalized by the wavelength ⁇ .
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, ⁇ , 0 °)
- First electrode layer 3a ... Pt film
- film thickness 0.02 ⁇
- Second electrode layer 3b ... Al film
- film thickness 0.10 ⁇
- IDT electrode 3 Duty ratio: 0.50
- Silicon oxide film 6 ... SiO 2 film
- film thickness 0.40 ⁇ Elastic wave
- Main mode Rayleigh wave
- FIG. 16 is a diagram showing the relationship between ⁇ and the maximum phase of the higher-order mode at the Euler angles (0 °, ⁇ , 0 °).
- FIG. 16 shows the results when the acoustic wave resonator having the same design as that of FIGS. 11 to 15 is used.
- FIG. 16 shows that when ⁇ is 8 ° or more and 32 ° or less, the maximum phase of the higher-order mode is ⁇ 25 ° or less. That is, it can be seen that when ⁇ is 8 ° or more and 32 ° or less, even if the thickness of the SiO 2 film is as large as 0.40 ⁇ , the occurrence of high-order mode spurious can be sufficiently suppressed.
- the Euler angle ⁇ is preferably 12 ° or more and 26 ° or less, and in that case, higher-order mode spurious can be further suppressed.
- ⁇ is 8 ° or more and 32 ° or less at Euler angles (0 °, ⁇ , 0 °). Therefore, an elastic wave device that satisfies all the out-of-band characteristics can be obtained.
- FIGS. 17 (a) to 17 (c) and 18 (a) to 18 (c) show ⁇ and Eu at the Euler angles (0 °, ⁇ , 0 °) when the film thickness of the Pt film is changed. It is a figure which shows the relationship with the specific band of SH wave.
- the thicknesses of the Pt films are 0.015 ⁇ , 0.025 ⁇ , 0.035 ⁇ ,. 055 ⁇ , 0.065 ⁇ , and 0.075 ⁇ .
- FIGS. 17 and 18 show the results when the acoustic wave resonator designed as follows is used in the structure shown in FIGS. 1 and 2.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, ⁇ , 0 °) First electrode layer 3a ... Pt film Second electrode layer 3b ... Al film, film thickness: 0.10 ⁇ IDT electrode 3 Duty ratio: 0.50 Silicon oxide film 6 ... SiO 2 film, film thickness: 0.35 ⁇ Elastic wave ... Main mode: Rayleigh wave
- the ratio band (%) is proportional to the electromechanical coupling coefficient (K 2 ).
- FIG. 17A to FIG. 17C when the film thickness of the Pt film is in the range of 0.015 ⁇ to 0.035 ⁇ , the electromechanical coupling coefficient of the SH wave is minimized as the film thickness of the Pt film increases. It can be seen that ⁇ is larger.
- FIG. 18A shows that when the film thickness of the Pt film is 0.055 ⁇ , ⁇ at which the electromechanical coupling coefficient of the SH wave becomes a minimum value is as small as 27 °.
- FIG. 18B shows that ⁇ is 29 ° when the thickness of the Pt film is 0.065 ⁇ .
- FIG. 18C shows that ⁇ is 30 ° when the thickness of the Pt film is 0.075 ⁇ .
- the film thickness of the Pt film needs to be larger than 0.035 ⁇ .
- FIG. 19 is a diagram showing the relationship between the film thickness of the Pt film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- the vertical axis represents the speed of sound (Vsaw) (the same applies to FIGS. 21 to 25).
- FIG. 19 shows the results when the elastic wave resonator designed as follows is used in the structure shown in FIGS.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 28 °, 0 °)
- First electrode layer 3a ...
- Second electrode layer 3b ... Al film, film thickness: 0.10 ⁇
- IDT electrode 3 Duty ratio: 0.60 Silicon oxide film 6 ... SiO 2 film, film thickness: 0.35 ⁇ Elastic wave ...
- Main mode Rayleigh wave
- FIG. 19 shows that when the thickness of the Pt film is smaller than 0.047 ⁇ , the speed of Rayleigh wave ⁇ the speed of SH wave.
- the sound speed of the SH wave ⁇ the speed of the Rayleigh wave. From this, the sound velocity relationship between the SH wave and the Rayleigh wave changes when the film thickness of the Pt film is 0.047 ⁇ , and as a result, the ⁇ at which the electromechanical coupling coefficient of the SH wave is minimized is lowered.
- ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient of the SH wave can be minimized.
- the film thickness of the first electrode layer 3a is preferably set such that the sound speed of the SH wave is lower than that of the Rayleigh wave.
- the film thickness of the Pt film is preferably 0.047 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band (sound speed: around 3700 m / s) can be suppressed.
- the aspect ratio of an electrode will become large and formation will become difficult if the total thickness of an electrode becomes thick, it is desirable that the total film thickness of the electrode containing Al is 0.25 or less.
- FIG. 21 is a diagram showing the relationship between the film thickness of the W film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- FIG. 21 shows the results when using an acoustic wave resonator designed in the same manner as in FIG. 19 except that a W film having a predetermined thickness is formed as the first electrode layer 3a.
- FIG. 21 shows that when the W film is used, the sound speed of the Rayleigh wave and the sound speed of the SH wave are reversed when the film thickness of the W film is 0.062 ⁇ . Therefore, when the W film is used, when the film thickness of the W film is 0.062 ⁇ or more, the Euler angle ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient can be minimized.
- the thickness of the W film is preferably 0.062 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band (sound speed: around 3700 m / s) can be suppressed.
- FIG. 22 is a diagram showing the relationship between the film thickness of the Mo film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- FIG. 22 shows the results when an elastic wave resonator designed in the same manner as in FIG. 19 is used except that the Mo film is formed with a predetermined thickness as the first electrode layer 3a.
- FIG. 22 shows that when the Mo film is used, the sound speed of the Rayleigh wave and the sound speed of the SH wave are reversed when the film thickness of the Mo film is 0.144 ⁇ . Therefore, when the Mo film is used, when the film thickness of the Mo film is 0.144 ⁇ or more, the Euler angle ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient can be minimized.
- the film thickness of the Mo film is preferably 0.144 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band can be suppressed.
- FIG. 23 is a diagram showing the relationship between the film thickness of the Ta film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- FIG. 23 shows the results when an acoustic wave resonator designed in the same manner as in FIG. 19 is used except that a Ta film is formed as the first electrode layer 3a with a predetermined thickness.
- the Euler angle ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient can be minimized.
- the thickness of the Ta film is preferably 0.074 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band can be suppressed.
- FIG. 24 is a diagram showing the relationship between the film thickness of the Au film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- FIG. 24 shows the results when an acoustic wave resonator designed in the same manner as in FIG. 19 is used except that an Au film having a predetermined thickness is formed as the first electrode layer 3a.
- FIG. 24 shows that when the Au film is used, the sound speed of the Rayleigh wave and the sound speed of the SH wave are reversed when the film thickness of the Au film is 0.042 ⁇ . Therefore, when the Au film is used, when the film thickness of the Au film is 0.042 ⁇ or more, the Euler angle ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient can be minimized.
- the film thickness of the Au film is preferably 0.042 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band can be suppressed.
- FIG. 25 is a diagram showing the relationship between the film thickness of the Cu film and the sound speeds of the Rayleigh wave and the SH wave.
- the solid line indicates the result of the Rayleigh wave that is the main mode
- the broken line indicates the result of the SH wave that becomes an unnecessary wave.
- FIG. 25 shows the results when an acoustic wave resonator designed in the same manner as in FIG. 19 is used except that a Cu film having a predetermined thickness is formed as the first electrode layer 3a.
- FIG. 25 shows that when the Cu film is used, the sound speed of the Rayleigh wave and the sound speed of the SH wave are reversed when the film thickness of the Cu film is 0.136 ⁇ . Therefore, when a Cu film is used, when the film thickness of the Cu film is 0.136 ⁇ or more, the Euler angle ⁇ can be set to 32 ° or less, and the electromechanical coupling coefficient can be minimized.
- the film thickness of the Cu film is preferably 0.136 ⁇ or more.
- the electromechanical coupling coefficient of the SH wave can be reduced, and generation of unnecessary waves in the vicinity of the pass band can be suppressed.
- FIG. 26 to 28 (a) is a diagram showing impedance characteristics when the duty ratio is changed, and (b) is a diagram showing phase characteristics thereof.
- the results are obtained when the duty ratios are 0.50, 0.60, and 0.70, respectively.
- FIG. 26 to FIG. 28 show the results when the elastic wave resonator designed as follows is used in the structure shown in FIG. 1 and FIG.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 28 °, 0 °)
- First electrode layer 3a Pt film
- Second electrode layer 3b Al film
- film thickness 0.10 ⁇ Silicon oxide film 6 ... SiO 2 film
- film thickness 0.32 ⁇ Elastic wave
- Main mode Rayleigh wave
- FIG. 26 to FIG. 28 show that the higher-order mode spurious is suppressed as the duty ratio increases.
- FIG. 29 is a diagram showing the relationship between the duty ratio of the IDT electrode and the maximum phase of the higher-order mode. Note that FIG. 29 shows the results when an elastic wave resonator having the same design as that shown in FIGS. 26 to 28 is used. From FIG. 29, it can be seen that when the duty ratio is 0.48 or more, the maximum phase of the higher-order mode is ⁇ 25 ° or less. It can also be seen that when the duty ratio is 0.55 or more, the maximum phase of the higher-order mode is ⁇ 60 ° or less. Therefore, from the viewpoint of further suppressing high-order mode spurious, the duty ratio of the IDT electrode 3 is preferably 0.48 or more, and more preferably 0.55 or more. Note that the duty ratio is desirably 0.80 or less because the gap between the adjacent electrode fingers decreases as the duty ratio increases.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 28 °, 0 °)
- First electrode layer 3a ... Pt film
- Second electrode layer 3b ... Al film
- film thickness 0.10 ⁇ IDT electrode 3
- Duty ratio 0.50 Silicon oxide film 6 ... SiO 2 film
- film thickness 0.40 ⁇ Elastic wave ...
- Main mode Rayleigh wave
- FIG. 20A is a diagram showing impedance characteristics of an acoustic wave device using the acoustic wave resonator designed as described above, and FIG. 20B is a diagram showing phase characteristics thereof.
- the silicon oxide film 6 containing a hydrogen atom, a hydroxyl group, or a silanol group it is possible to further improve the frequency temperature characteristics, and to confirm that the equivalent results can be obtained for other characteristics.
- the following acoustic wave resonators were designed.
- Piezoelectric substrate 2 ... LiNbO 3 substrate, Euler angles (0 °, 30, 0 °) First electrode layer 3a ... Pt film, film thickness: 0.085 ⁇ Second electrode layer 3b ... Al film, film thickness: 0.082 ⁇ IDT electrode 3 Duty ratio: 0.50 Silicon oxide film 6... SiO 2 film containing hydrogen atom, hydroxyl group or silanol group, film thickness: 0.40 ⁇ Elastic wave ... Main mode: Rayleigh wave
- the silicon oxide film 6 was formed by sputtering after forming the IDT electrode 3 on the piezoelectric substrate 2. Specifically, a mixed gas of Ar and O 2, water (H 2 O) which was vaporized from a liquid to a gas with a vaporizer, H 2 O in the chamber while controlling the flow rate using a mass flow controller Partial pressure was added until 0.5-20%. The sputtering pressure was 0.5 Pa and the substrate heating temperature was 220 ° C.
- TCF tetrachloro-2,4-butanediol
- impedance Z ratio tetrachloro-2,4-butanediol
- ratio band acoustic wave resonator.
- Table 5 shows the results when using a silicon oxide film 6 that does not contain a hydrogen atom, a hydroxyl group, or a silanol group.
- the elastic wave device of the above embodiment can be used as a duplexer for a high-frequency front end circuit. This example is described below.
- FIG. 31 is a configuration diagram of the communication device and the high-frequency front-end circuit.
- components connected to the high-frequency front-end circuit 230 for example, the antenna element 202 and the RF signal processing circuit (RFIC) 203 are also shown.
- the high-frequency front end circuit 230 and the RF signal processing circuit 203 constitute a communication device 240.
- the communication device 240 may include a power supply, a CPU, and a display.
- the high-frequency front-end circuit 230 includes a switch 225, duplexers 201A and 201B, filters 231, 232, low-noise amplifier circuits 214, 224, and power amplifier circuits 234a, 234b, 244a, 244b. Note that the high-frequency front-end circuit 230 and the communication device 240 in FIG. 31 are examples of the high-frequency front-end circuit and the communication device, and are not limited to this configuration.
- the duplexer 201A includes filters 211 and 212.
- the duplexer 201B includes filters 221 and 222.
- the duplexers 201 ⁇ / b> A and 201 ⁇ / b> B are connected to the antenna element 202 via the switch 225.
- the said elastic wave apparatus may be duplexers 201A and 201B, and may be filters 211, 212, 221 and 222.
- the elastic wave device may be an elastic wave resonator constituting the duplexers 201A, 201B and the filters 211, 212, 221, 222.
- the elastic wave device can also be applied to a multiplexer including three or more filters, such as a triplexer in which the antenna terminals of three filters are shared or a hexaplexer in which the antenna terminals of six filters are shared. .
- the acoustic wave device includes an acoustic wave resonator, a filter, a duplexer, and a multiplexer including three or more filters.
- the multiplexer is not limited to the configuration including both the transmission filter and the reception filter, and may be configured to include only the transmission filter or only the reception filter.
- the switch 225 connects the antenna element 202 and a signal path corresponding to a predetermined band in accordance with a control signal from a control unit (not shown), and is configured by, for example, a SPDT (Single Pole Double Throw) type switch. .
- a SPDT Single Pole Double Throw
- the number of signal paths connected to the antenna element 202 is not limited to one and may be plural. That is, the high frequency front end circuit 230 may support carrier aggregation.
- the low noise amplifier circuit 214 is a reception amplification circuit that amplifies a high frequency signal (here, a high frequency reception signal) via the antenna element 202, the switch 225, and the duplexer 201A and outputs the amplified signal to the RF signal processing circuit 203.
- the low noise amplifier circuit 224 is a reception amplification circuit that amplifies a high-frequency signal (here, a high-frequency reception signal) that has passed through the antenna element 202, the switch 225, and the duplexer 201B, and outputs the amplified signal to the RF signal processing circuit 203.
- the power amplifier circuits 234a and 234b are transmission amplifier circuits that amplify the high frequency signal (here, the high frequency transmission signal) output from the RF signal processing circuit 203 and output the amplified signal to the antenna element 202 via the duplexer 201A and the switch 225.
- the power amplifier circuits 244a and 244b are transmission amplifier circuits that amplify the high-frequency signal (here, the high-frequency transmission signal) output from the RF signal processing circuit 203 and output the amplified signal to the antenna element 202 via the duplexer 201B and the switch 225. .
- the RF signal processing circuit 203 processes the high-frequency reception signal input from the antenna element 202 via the reception signal path by down-conversion or the like, and outputs a reception signal generated by the signal processing.
- the RF signal processing circuit 203 performs signal processing on the input transmission signal by up-conversion or the like, and outputs a high-frequency transmission signal generated by the signal processing to the low noise amplifier circuit 224.
- the RF signal processing circuit 203 is, for example, an RFIC.
- the communication apparatus may include a BB (baseband) IC. In this case, the BBIC processes the received signal processed by the RFIC.
- the BBIC processes the transmission signal and outputs it to the RFIC.
- the transmission signal before the signal processing by the BBIC is, for example, an image signal or an audio signal.
- the high-frequency front end circuit 230 may include other circuit elements between the above-described components.
- the high-frequency front end circuit 230 may include a duplexer according to a modification of the duplexers 201A and 201B instead of the duplexers 201A and 201B.
- the filters 231 and 232 in the communication device 240 are connected between the RF signal processing circuit 203 and the switch 225 without passing through the low noise amplifier circuits 214 and 224 and the power amplifier circuits 234a, 234b, 244a and 244b.
- the filters 231 and 232 are also connected to the antenna element 202 via the switch 225, similarly to the duplexers 201A and 201B.
- the high-frequency front-end circuit 230 and the communication device 240 configured as described above, by including the elastic wave device of the present invention, an acoustic wave resonator, a filter, a duplexer, a multiplexer including three or more filters, and the like. Therefore, it is possible to reduce the loss, improve the temperature characteristics of the frequency, make it difficult to generate spurious due to the higher order mode, and suppress the deterioration of the IMD.
- the elastic wave device, the high-frequency front-end circuit, and the communication device according to the embodiment of the present invention have been described with reference to the embodiment and the modified examples thereof.
- a high-frequency front-end circuit according to the present invention a modification obtained by making various modifications conceived by those skilled in the art without departing from the gist of the present invention, and a high-frequency front-end circuit according to the present invention.
- Various devices incorporating the communication device are also included in the present invention.
- the present invention can be widely used in communication devices such as mobile phones as an elastic wave resonator, a filter, a multiplexer applicable to a multiband system, a front-end circuit, and a communication device.
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Abstract
Description
図1(a)は、本発明の一実施形態に係る弾性波装置の模式的正面断面図であり、図1(b)は、その電極構造を示す模式的平面図である。図2は、本発明の一実施形態に係る弾性波装置の電極部を拡大した模式的正面断面図である。
第1の電極層3a…Pt膜、膜厚:0.085λ
第2の電極層3b…Al膜、膜厚:0.082λ
IDT電極3…デューティ比:0.5
酸化ケイ素膜6…SiOH基を含有するSiO2膜、膜厚:0.40λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.02λ
第2の電極層3b…Al膜
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜、膜厚:0.3λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.02λ
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.02λ
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.02λ
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜、膜厚:0.40λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜、膜厚:0.35λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.60
酸化ケイ素膜6…SiO2膜、膜厚:0.35λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.06λ
第2の電極層3b…Al膜、膜厚:0.10λ
酸化ケイ素膜6…SiO2膜、膜厚:0.32λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.06λ
第2の電極層3b…Al膜、膜厚:0.10λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…SiO2膜、膜厚:0.40λ
弾性波…主モード:レイリー波
第1の電極層3a…Pt膜、膜厚:0.085λ
第2の電極層3b…Al膜、膜厚:0.082λ
IDT電極3…デューティ比:0.50
酸化ケイ素膜6…水素原子、水酸基またはシラノール基を含有するSiO2膜、膜厚:0.40λ
弾性波…主モード:レイリー波
上記実施形態の弾性波装置は、高周波フロントエンド回路のデュプレクサなどとして用いることができる。この例を下記において説明する。
2…圧電基板
2a…主面
3…IDT電極
3a,3b…第1,第2の電極層
4,5…反射器
6…酸化ケイ素膜
201A,201B…デュプレクサ
202…アンテナ素子
203…RF信号処理回路
211,212…フィルタ
214…ローノイズアンプ回路
221,222…フィルタ
224…ローノイズアンプ回路
225…スイッチ
230…高周波フロントエンド回路
231,232…フィルタ
234a,234b…パワーアンプ回路
240…通信装置
244a,244b…パワーアンプ回路
Claims (11)
- 圧電基板と、
前記圧電基板上に設けられたIDT電極と、
前記圧電基板上において、前記IDT電極を覆うように設けられている、酸化ケイ素膜と、
を備え、
前記IDT電極が、
第1の電極層と、
該第1の電極層上に積層された第2の電極層と、
を有し、
前記第1の電極層が、前記第2の電極層を構成している金属及び前記酸化ケイ素膜を構成している酸化ケイ素よりも密度の高い金属若しくは合金により構成されており、
前記圧電基板が、LiNbO3により構成されており、前記圧電基板のオイラー角(0°±5°,θ,0°±10°)において、θが8°以上、32°以下の範囲内にあり、
前記酸化ケイ素膜が、水素原子、水酸基またはシラノール基を含有している、弾性波装置。 - 前記弾性波装置は、レイリー波を利用しており、
前記第1の電極層の厚みが、SH波の音速が前記レイリー波の音速より遅くなる厚みとされている、請求項1に記載の弾性波装置。 - 前記第1の電極層が、Pt、W、Mo、Ta、Au、Cu及びこれらの金属を主成分とする合金からなる群から選択された少なくとも1種である、請求項1又は2に記載の弾性波装置。
- 前記第2の電極層が、Al、Cu、又はAl若しくはCuを主成分とする合金により構成されている、請求項1~4のいずれか1項に記載の弾性波装置。
- 前記IDT電極の電極指ピッチで定まる波長をλとしたときに、前記第2の電極層の厚みが、0.0175λ以上である、請求項5に記載の弾性波装置。
- 前記IDT電極の電極指ピッチで定まる波長をλとしたときに、前記酸化ケイ素膜の厚みが、0.30λ以上である、請求項1~6のいずれか1項に記載の弾性波装置。
- 前記IDT電極のデュ-ティ比が、0.48以上である、請求項1~7のいずれか1項に記載の弾性波装置。
- 前記IDT電極のデュ-ティ比が、0.55以上である、請求項1~8のいずれか1項に記載の弾性波装置。
- 請求項1~9のいずれか1項に記載の弾性波装置と、
パワーアンプと、
を備える、高周波フロントエンド回路。 - 請求項10に記載の高周波フロントエンド回路と、
RF信号処理回路と、
を備える、通信装置。
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Also Published As
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US11595024B2 (en) | 2023-02-28 |
US20190288668A1 (en) | 2019-09-19 |
KR102311837B1 (ko) | 2021-10-13 |
KR20190066053A (ko) | 2019-06-12 |
JP6922931B2 (ja) | 2021-08-18 |
CN110024287A (zh) | 2019-07-16 |
CN110024287B (zh) | 2023-09-26 |
WO2018105249A9 (ja) | 2019-11-28 |
JPWO2018105249A1 (ja) | 2019-07-11 |
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