WO2018047672A1 - 接着剤、ブリスターパック用積層体及びそれを用いたブリスターパック - Google Patents

接着剤、ブリスターパック用積層体及びそれを用いたブリスターパック Download PDF

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WO2018047672A1
WO2018047672A1 PCT/JP2017/030887 JP2017030887W WO2018047672A1 WO 2018047672 A1 WO2018047672 A1 WO 2018047672A1 JP 2017030887 W JP2017030887 W JP 2017030887W WO 2018047672 A1 WO2018047672 A1 WO 2018047672A1
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Prior art keywords
adhesive
blister pack
acid
polyol
laminate
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PCT/JP2017/030887
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English (en)
French (fr)
Japanese (ja)
Inventor
倫康 村上
新田　修一
英男 田邊
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Dic株式会社
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Application filed by Dic株式会社 filed Critical Dic株式会社
Priority to CN201780051060.8A priority Critical patent/CN109642141A/zh
Priority to JP2017561023A priority patent/JP6308413B1/ja
Publication of WO2018047672A1 publication Critical patent/WO2018047672A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D65/00—Wrappers or flexible covers; Packaging materials of special type or form
    • B65D65/38—Packaging materials of special type or form
    • B65D65/40—Applications of laminates for particular packaging purposes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D75/00—Packages comprising articles or materials partially or wholly enclosed in strips, sheets, blanks, tubes, or webs of flexible sheet material, e.g. in folded wrappers
    • B65D75/28—Articles or materials wholly enclosed in composite wrappers, i.e. wrappers formed by associating or interconnecting two or more sheets or blanks
    • B65D75/30—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding
    • B65D75/32—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents
    • B65D75/36—Articles or materials enclosed between two opposed sheets or blanks having their margins united, e.g. by pressure-sensitive adhesive, crimping, heat-sealing, or welding one or both sheets or blanks being recessed to accommodate contents one sheet or blank being recessed and the other formed of relatively stiff flat sheet material, e.g. blister packages, the recess or recesses being preformed
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes

Definitions

  • the present invention relates to a laminate for blister packs that can be suitably used for pharmaceutical packaging applications that are subjected to molding processing, and an adhesive used therefor.
  • containers that have been subjected to molding processing typified by blister packs are known as containers for packaging stored items such as drugs and foods such as tablets and capsule preparations.
  • Blister packs (sometimes referred to as press-through packages or PTPs) have a lid provided with a metal foil, such as an aluminum foil, on one side of a resin film in which a plurality of pockets for accommodating stored items are formed. By doing so, each pocket part is sealed and sealed, and by pressing the back side of the pocket part, the contents in the pocket part can break through the metal foil and take out the contents from the pocket part.
  • PTPs press-through packages
  • the stored items can be used for various things such as feeds for dogs and cats, cosmetics, medical equipment, electronic parts, etc. in addition to chemicals and foods that are expected to be stored for a long period of time.
  • feeds for dogs and cats for various things
  • cosmetics, medical equipment, electronic parts, etc. in addition to chemicals and foods that are expected to be stored for a long period of time.
  • blister packs with transparent pockets and visibility there are also known blister packs with metal foil in the pockets in the hope of higher light shielding and moisture resistance (for example, Patent Documents). 3).
  • the laminated body for blister packs is the film or sheet material used for shaping
  • the blister pack provided with metal foil in the pocket is obtained by molding a blister pack laminate in which metal foil and a base material such as a plastic film are laminated with an adhesive.
  • a blister pack laminate in which metal foil and a base material such as a plastic film are laminated with an adhesive.
  • peeling may occur between the metal foil layer or the laminate and the adhesive layer, and the laminate may be broken.
  • Patent Document 4 discloses a base material layer and a barrier layer.
  • an epoxy compound, and a urethane-based adhesive containing polyisocyanate as a curing agent.
  • the ratio of the main agent to the curing agent is 10: 1.269 to 10: 2.885 in terms of solid content mass ratio.
  • a certain laminated body is described, and this laminated body is described that it is used for the packaging body used for the packaging container suitable for packaging the liquid substance which contains alcohol in high concentration.
  • Patent Document 5 discloses a polyurethane adhesive for battery packaging materials containing a main agent and a curing agent, wherein the main agent has a number average molecular weight of 10,000 to 100,000 and a hydroxyl value of 1.
  • [OH] is 10 to 30, and that the adhesive can be used as an adhesive for PTP packaging.
  • Patent Document 6 discloses a battery packaging material in which an outer layer side resin film layer, an outer layer side adhesive layer, a metal foil layer, an inner layer side adhesive layer, and a heat seal layer are sequentially laminated.
  • a polyurethane adhesive containing a main component containing a polyol component (A) and a curing agent containing a polyisocyanate component (B)
  • the polyol component (A) is a polyester polyol ( A1): 85 to 99% by weight, trifunctional or higher-functional alcohol component (A2): 1 to 15% by weight (provided that the sum of (A1) and (A2) is 100% by weight)
  • the polyol (A1) is a polyester polyol having a number average molecular weight of 5,000 to 50,000 comprising a polybasic acid component and a polyhydric alcohol component, In 100 mol%, the aromatic polybasic acid component is contained in an amount of 45 to 95 mol%, and the equivalent ratio of isocyanate groups contained in the curing
  • An object of the present invention is to provide a laminate having an adhesive layer having a specific composition capable of reducing breakage of a metal foil layer and lifting of a base material layer during molding as a laminate for a blister pack that can be used as a blister pack.
  • the purpose is to provide.
  • the present inventors have a main agent containing a polyol and an epoxy compound, and a curing agent containing an isocyanate compound, and by setting the solid content mass ratio of the polyol and the epoxy compound in the main agent to a specific range, We found that the above problems could be solved.
  • the present invention has a main agent containing a polyol and an epoxy compound and a curing agent containing an isocyanate compound, and the solid content mass ratio of the polyol and the epoxy compound in the main agent is 100/20 to 100/60.
  • Provide adhesive the solid content mass ratio of the polyol and the epoxy compound in the main agent is 100/20 to 100/60.
  • this invention provides the laminated body for blister packs in which the base material layer and the metal foil were laminated
  • the present invention also provides a medical blister pack using the above-described laminate for blister packs.
  • the adhesive of the present invention as an adhesive for a blister pack laminate, it is possible to provide a blister pack in which breakage of the metal foil layer and lifting of the base material layer are reduced during molding.
  • blister pack refers to a container for packaging stored items such as medicines and foods such as tablets and capsule preparations as disclosed in Patent Documents 1 to 3 (here, visually recognized). Whether or not there is sex.
  • a press through package or PTP in this invention, it shall call a blister pack.
  • the main agent used in the present invention contains a polyol and an epoxy compound.
  • polyol As the polyol used in the present invention, any polyol used in the adhesive field can be used without any particular limitation.
  • polyalkylene polyols such as polyethylene glycol and polypropylene glycol
  • polyether polyols such as polyethylene glycol and polypropylene glycol
  • polyester polyols such as polyethylene glycol and polypropylene glycol
  • polyurethane polyols such as polyurethane polyols
  • polyester polyurethane polyols polyester polyurethane polyols, polyether polyurethane polyols
  • blends of the aforementioned polyols can be used.
  • the polyether polyol can be obtained, for example, by polymerizing an oxirane compound such as ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and the like, for example, by using a low molecular weight polyol such as water, ethylene glycol, propylene glycol, trimethylolpropane, glycerin or the like as an initiator.
  • an oxirane compound such as ethylene oxide, propylene oxide, butylene oxide, tetrahydrofuran and the like
  • a low molecular weight polyol such as water, ethylene glycol, propylene glycol, trimethylolpropane, glycerin or the like as an initiator.
  • a polyether polyol is mentioned.
  • Polyester polyol is obtained by reacting a polybasic acid and a polyhydric alcohol. Any known raw material can be used as the polybasic acid.
  • dimer acid can be used. Dimer acid is a product obtained by Diels-Alder dimerization of C18 unsaturated fatty acids such as oleic acid and linoleic acid, and various products such as those obtained by adding hydrogen to saturated bonds and saturating them are commercially available. . A typical one consists of 0 to 5% by weight of C18 monocarboxylic acid, 70 to 98% of C36 dimer acid and 0 to 30% by weight of C54 trimer acid. The dimer diol is obtained by reducing the dimer acid described above.
  • any known raw material can be used as the polyhydric alcohol.
  • Polyhydric alcohol components such as polyethers obtained by addition polymerization of one or more monomers such as oxide, butylene oxide, styrene oxide, epichlorohydrin, tetrahydrofuran, cyclohexylene and the like by a conventional method are used. Can be used as a mixture of two or more.
  • Polyurethane polyol is obtained by reacting the polyhydric alcohol and isocyanate.
  • Isocyanates used in the reaction, ie, urethanization include aromatic diisocyanates (diphenylmethane diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, tolylene diisocyanate, prepolymers of low molecular glycols and the above-mentioned aromatic diisocyanate, etc.); aliphatic Diisocyanates (1,6-hexamethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, lysine diisocyanate, prepolymers of the above-mentioned aliphatic diisocyanates with low molecular weight glycols such as ethylene glycol and propylene glycol); Diisocyanate (isophorone diisocyanate, hydrogenated 4,4'-diphenylmethane diisocyan
  • polyester polyurethane polyol or polyether polyurethane polyol.
  • polyols having an ester skeleton such as polyester polyol and polyester polyurethane polyol are preferably used because of their excellent flexibility and moldability.
  • epoxy compound As the epoxy compound used in the present invention, commercially available epi-bis type, novolac type, ⁇ -methyl epichloro type, cyclic oxirane type, glycidyl ether type, glycidyl ester type, polyglycol ether type, glycol ether type And various epoxy resins such as epoxidized fatty acid ester type, polycarboxylic acid ester type, aminoglycidyl type, and resorcin type.
  • Epoxy resins include commercially available bisphenol-type epoxy resins, rag-type epoxy resins, cyclic oxirane-type resins, glycidyl ether-type resins, glycidyl ester-type resins, polyglycol ether-type epoxy resins, glycol ether-type epoxy resins.
  • Various epoxy resins such as resin, epoxidized fatty acid ester type resin, polyvalent carboxylic acid ester type epoxy resin, glycidylamine type resin, resorcinol type epoxy resin and the like can be mentioned. Of these, bisphenol-type epoxy resins are preferably used because of their excellent moldability.
  • the mass ratio of the solid content of the polyol and the epoxy compound is 100/20 to 100/60. Within this range, it is possible to obtain a laminate having an adhesive layer that is less prone to breakage of the metal foil layer and lifting of the base material layer during molding.
  • the solid content mass ratio is preferably 100/20 to 100/40, and most preferably 100/20 to 100/30.
  • isocyanate compound used in the present invention known and commonly used isocyanate compounds can be used.
  • Polyisocyanates such as methyl) cyclohexane, 1,5-naphthalene diisocyanate, triphenylmethane triisocyanate; adducts of these polyisocyanates, burettes of these polyisocyanates, or isocyanurates of these polyisocyanates
  • Examples include isocyanate derivatives (modified products).
  • the polyisocyanate is not limited, but the aromatic type isoxylene diisocyanate,
  • the equivalent ratio (NCO / OH) of the hydroxyl group (OH) derived from the polyol and the isocyanate group (NCO) derived from the polyisocyanate compound is not particularly limited, but is preferably in the range of 1 to 30. Within this range, moisture and heat resistance (65 ° C-90% / 72 hours in depth 6.5 mm deep, no floating near the boundary between the molded flange and side wall), heat sealability (190 ° C / 3 seconds) The balance of the fact that there is no float near the boundary between the molded flange portion and the side wall portion with a depth of 6.5 mm is the best.
  • the peel strength and heat-and-heat resistance may be deteriorated, and if it is more than 30, the peel strength and heat sealability may be deteriorated, more preferably 2 to 10, and more preferably 4 to 10 The range of 4 to 7 is most preferable.
  • the adhesive of the present invention can also contain a ketone resin.
  • ketone resin used in the present invention include known and commonly used ones, and formaldehyde resins, cyclohexanone / formaldehyde resins, ketone aldehyde condensation resins, and the like can be preferably used.
  • the adhesive of the present invention may be either a solvent type or a solventless type.
  • the solvent is used as a reaction medium during production of the main agent and the curing agent, and is further used as a diluent during coating.
  • solvents that can be used include esters such as ethyl acetate, butyl acetate and cellosolve acetate, ketones such as acetone, methyl ethyl ketone, isobutyl ketone and cyclohexanone, ethers such as tetrahydrofuran and dioxane, and aromatic hydrocarbons such as toluene and xylene.
  • Halogenated hydrocarbons such as methylene chloride and ethylene chloride, dimethyl sulfoxide, dimethyl sulfoamide and the like. Of these, it is usually preferred to use ethyl acetate or methyl ethyl ketone alone or in combination.
  • the solvent-free type in the present invention is an ester such as ethyl acetate, butyl acetate, cellosolve acetate, etc., which is used as a reaction medium during the production of the above main agent and curing agent, and further used as a diluent during coating.
  • Ketones such as acetone, methyl ethyl ketone, isobutyl ketone, cyclohexanone, ethers such as tetrahydrofuran and dioxane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as methylene chloride and ethylene chloride, dimethyl sulfoxide, Examples thereof include dimethylsulfamide. Of these, it usually refers to a form containing no ethyl acetate or methyl ethyl ketone.
  • known phosphoric acids or derivatives thereof can be used in combination. Thereby, the initial adhesiveness of the adhesive is further improved, and troubles such as tunneling can be solved.
  • phosphoric acids or derivatives thereof used herein include phosphoric acids such as hypophosphorous acid, phosphorous acid, orthophosphoric acid, and hypophosphoric acid, such as metaphosphoric acid, pyrophosphoric acid, tripolyphosphoric acid, polyphosphoric acid, and ultraphosphoric acid.
  • Condensed phosphoric acids such as monomethyl orthophosphate, monoethyl orthophosphate, monopropyl orthophosphate, monobutyl orthophosphate, mono-2-ethylhexyl orthophosphate, monophenyl orthophosphate, monomethyl phosphite, monoethyl phosphite, phosphorous acid
  • the above phosphoric acids or derivatives thereof may be used alone or in combination. As a method of inclusion, it may be simply mixed.
  • an adhesion promoter can be used in the adhesive of the present invention.
  • the adhesion promoter include silane coupling agents, titanate coupling agents, aluminum coupling agents, epoxy resins, and the like.
  • silane coupling agent examples include ⁇ -aminopropyltriethoxysilane, ⁇ -aminopropyltrimethoxysilane, N- ⁇ (aminoethyl) - ⁇ -aminopropyltrimethoxysilane, and N- ⁇ (aminoethyl) - ⁇ .
  • Amino silanes such as aminopropyltrimethyldimethoxysilane, N-phenyl- ⁇ -aminopropyltrimethoxysilane; ⁇ - (3,4-epoxycyclohexyl) ethyltrimethoxysilane, ⁇ -glycidoxypropyltrimethoxysilane, ⁇ -glycyl Epoxy silanes such as Sidoxypropyltriethoxysilane; Vinylsilanes such as Vinyltris ( ⁇ -methoxyethoxy) silane, Vinyltriethoxysilane, Vinyltrimethoxysilane, ⁇ -Methacryloxypropyltrimethoxysilane; Hexamethyldisilazane, ⁇ -Me Mercaptopropyl trimethoxysilane and the like.
  • titanate coupling agents examples include tetraisopropoxy titanium, tetra-n-butoxy titanium, butyl titanate dimer, tetrastearyl titanate, titanium acetylacetonate, titanium lactate, tetraoctylene glycol titanate, titanium lactate, tetrastearoxy Titanium etc. can be mentioned.
  • examples of the aluminum coupling agent include acetoalkoxyaluminum diisopropylate.
  • the adhesive of the present invention may be applied by any coating method as long as it is known, but is generally applied by a gravure roll coating method.
  • the amount of the adhesive applied is 1.5 to 5 g / m 2 , preferably 2 to 4 g / m 2 in terms of solid content.
  • the solvent type is preferably used at a coating amount of about 1.0 to 4.0 g / m 2
  • the solventless type is used at about 0.5 to 3.0 g / m 2 .
  • the laminate for blister packs of the present invention is characterized in that a base material layer and a metal foil are laminated via the adhesive layer.
  • the blister pack laminate in the present application is a film or sheet material used for forming a blister pack before the stored items are enclosed.
  • the base material used in this case is a blister pack (press-through package). , PTP), food packs, and feed packs that are commonly used in food packs.
  • the structure of the laminated body for blister packs of this invention WHEREIN: Even if the base material layer is adhere
  • the metal foil is preferably a pure aluminum foil or an aluminum alloy foil.
  • the metal foil is preferably a semi-hard material or a soft material.
  • plastic substrate used as the substrate layer examples include polyamide, polyester, polyolefin and the like.
  • polyamide examples include polyamide homopolymers and copolymers.
  • Polyamide homopolymers include poly (4-aminobutyric acid) [nylon 4], poly (6-aminohexanoic acid) [nylon 6 or poly (caprolactam)], poly (7-aminoheptanoic acid) [nylon 7], Poly (8-aminooctanoic acid) [nylon 8], poly (9-aminononanoic acid) [nylon 9], poly (10-aminodecanoic acid) [nylon 10], poly (11-aminoundecanoic acid) [nylon 11], And poly (12-aminododecanoic acid) [nylon 12].
  • Polyamide copolymers include nylon 4,6, poly (hexamethylene adipamide) [nylon 6,6], poly (hexamethylene sebacamide) [nylon 6,10], poly (heptamethylene pimelamide) [Nylon 7,7], poly (octamethylene suberamide) [nylon 8, 8], poly (hexamethylene azelamide) [nylon 6, 9], poly (nonamethylene azelamide) [nylon 9, 9], poly (Decamethylene Azelamide) [Nylon 10,9], Poly (tetramethylenediamine-co-oxalic acid) [Nylon 4,2], n-dodecanedioic acid and hexamethylenediamine polyamide [Nylon 6,12], Dodeca And methylenediamine and polyamide of n-dodecanedioic acid [nylon 12, 12].
  • polyamide copolymers include caprolactam / hexamethylene adipamide copolymer [nylon 6,6 / 6], hexamethylene adipamide / caprolactam copolymer [nylon 6 / 6,6], Methylene adipamide / hexamethylene azelaamide copolymer [nylon trimethyl 6, 2/6, 2], hexamethylene adipamide-hexamethylene-azelayamide caprolactam copolymer [nylon 6, 6/6, 9 / 6], poly (tetramethylenediamine-co-isophthalic acid) [nylon 4, I], polyhexamethylene isophthalamide [nylon 6, 1], hexamethylene adipamide / hexamethylene isophthalamide [nylon 6, 6 / 6I], hexamethylene adipamide / hexamethylene terephthalamide Nylon 6,6 / 6T], poly (2,2,2-trimethylhexamethylene terephthalamide), poly (
  • polyamides not specifically described in the present specification, and combinations described in the present specification may be used.
  • nylon 6, nylon 6,6, nylon 6 / 6,6 or a mixture thereof is more preferable, and nylon 6 is still more preferable.
  • polyester examples include polyethylene terephthalate [PET] and glycol-modified polyethylene terephthalate [PETG].
  • the cyclic olefin copolymer [COC] is preferably a copolymer of ethylene and norbornene.
  • the polyolefin is selected from the group consisting of polyethylene [PE], polypropylene [PP], polyvinyl chloride [PVC], polyvinylidene chloride [PVdC], cyclic olefin copolymer [COC], polystyrene [PS], and acrylic resin.
  • polyethylene [PE], polyester, and polyvinyl chloride [PVC] are preferable.
  • the polyethylene include low density polyethylene [LDPE], linear low density polyethylene [LLDPE], linear medium density polyethylene [LMDPE], linear and very low density polyethylene [VLDPE], and linear very low density polyethylene [ ULDPE] and high-density polyethylene [HDPE], and low-density polyethylene is preferred.
  • the blister pack of the present invention is provided with a lid on the blister pack laminate of the present invention, and a predetermined number of recesses are formed on the blister pack laminate (bottom material) of the present invention, and then each molded It can be manufactured by storing the contents such as tablets in the recess and heat-sealing the lid material to the flange part of the laminated body for blister packs, which is the bottom material, using a molding filling sealing machine for blister pack packaging. it can.
  • the lid member preferably has a heat-sealable resin layer because the contained contents can be sealed by heat sealing.
  • the heat-sealable resin layer is not particularly limited as long as the heat-sealing resin layer is a layer that is fused to the surface of the bottom material in which the contents are accommodated.
  • Examples include a seed or a layer containing two or more.
  • cover material contains metal layers, such as metal vapor deposition film layers, such as an aluminum layer, and a metal foil layer, from the point that low water vapor permeability is favorable, and it is more preferable that an aluminum foil layer is included.
  • attached cover material is especially preferable.
  • Adhesive (1) was applied to a soft aluminum foil (thickness: 45 ⁇ m) with a dry laminator at a solid content of 3.0 g. After apply
  • the adhesive (1) was applied to a biaxially stretched polyamide film (thickness 25 ⁇ m) with a dry laminator at a coating amount of solid content of 3.0 g, and the solvent was stripped, and then bonded to the aluminum surface of the laminate. The adhesive was cured by incubating at 40 ° C. for 96 hours to obtain a blister pack laminate (1).
  • Example 2 Blister pack laminates (2) to (6) were obtained in the same manner as in Example 1 except that the adhesives (2) to (6) were used in place of the adhesive (1).
  • the blister pack laminate (1) obtained in Example (1) was cut into 60 mm length and width. This was press-molded to a depth of 6.0 mm in a vertical direction with respect to the laminate using a precision die machine with square molds of 30 mm in length and breadth to obtain a bottom material (1).
  • the punch shape of the mold used was a square with a side of 30 mm, a corner R2 mm, and a punch shoulder R1 mm.
  • the die hole shape of the die used is a square of 34 mm per piece, a die hole corner R2 mm, a die hole shoulder R: 1 mm, and the clearance between the punch and the die hole is 0.3 mm on one side. An inclination corresponding to the molding height is generated by the clearance.
  • the polyamide side is the convex side, and a molding process is performed in a 3 cm square and a depth of 6 mm by using a press machine (1) to (6 ) And molded products (H1) to (H2) were obtained.
  • Polyamide floating area About the corner
  • Polyamide floating area of less than 5 mm Small polyamide floating area of 5 mm or more and less than 10 mm: Medium polyamide floating area of 10 mm or more: Large.
  • the blister pack laminates using the adhesives of the examples were good with no float between the polyamide and the aluminum surface even after molding or after manufacture of the blister pack.
  • the blister pack laminate using the adhesive of the comparative example floating occurred.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Composite Materials (AREA)
  • Laminated Bodies (AREA)
  • Wrappers (AREA)
  • Packages (AREA)
  • Adhesives Or Adhesive Processes (AREA)
PCT/JP2017/030887 2016-09-06 2017-08-29 接着剤、ブリスターパック用積層体及びそれを用いたブリスターパック WO2018047672A1 (ja)

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