WO2016158168A1 - 化合物、レジスト組成物及びそれを用いるレジストパターン形成方法 - Google Patents
化合物、レジスト組成物及びそれを用いるレジストパターン形成方法 Download PDFInfo
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- WO2016158168A1 WO2016158168A1 PCT/JP2016/056332 JP2016056332W WO2016158168A1 WO 2016158168 A1 WO2016158168 A1 WO 2016158168A1 JP 2016056332 W JP2016056332 W JP 2016056332W WO 2016158168 A1 WO2016158168 A1 WO 2016158168A1
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C37/00—Preparation of compounds having hydroxy or O-metal groups bound to a carbon atom of a six-membered aromatic ring
- C07C37/68—Purification; separation; Use of additives, e.g. for stabilisation
- C07C37/70—Purification; separation; Use of additives, e.g. for stabilisation by physical treatment
- C07C37/72—Purification; separation; Use of additives, e.g. for stabilisation by physical treatment by liquid-liquid treatment
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D307/00—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom
- C07D307/77—Heterocyclic compounds containing five-membered rings having one oxygen atom as the only ring hetero atom ortho- or peri-condensed with carbocyclic rings or ring systems
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D311/00—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings
- C07D311/02—Heterocyclic compounds containing six-membered rings having one oxygen atom as the only hetero atom, condensed with other rings ortho- or peri-condensed with carbocyclic rings or ring systems
- C07D311/78—Ring systems having three or more relevant rings
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D493/00—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system
- C07D493/02—Heterocyclic compounds containing oxygen atoms as the only ring hetero atoms in the condensed system in which the condensed system contains two hetero rings
- C07D493/04—Ortho-condensed systems
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G10/00—Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or halogenated aromatic hydrocarbons only
- C08G10/02—Condensation polymers of aldehydes or ketones with aromatic hydrocarbons or halogenated aromatic hydrocarbons only of aldehydes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
- C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
- C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
- C08G8/14—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with halogenated phenols
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
Definitions
- the present invention relates to a resist composition and a resist pattern forming method using the same. Moreover, this invention relates to the compound which can be used for the said resist composition etc. Furthermore, it is related with the purification method of this compound.
- the conventional general resist material is a polymer resist material capable of forming an amorphous thin film.
- examples thereof include polymer resist materials such as polymethyl methacrylate, polyhydroxystyrene having an acid dissociable reactive group, and polyalkyl methacrylate.
- a resist thin film prepared by applying such a solution of a polymer resist material onto a substrate is irradiated with ultraviolet rays, far ultraviolet rays, electron beams, extreme ultraviolet rays (EUV), X-rays, etc.
- a line pattern of about 100 nm is formed.
- the polymer resist material has a large molecular weight of about 10,000 to 100,000 and a wide molecular weight distribution
- roughness is generated on the surface of the fine pattern, and the pattern dimension can be controlled. It becomes difficult and the yield decreases. Therefore, there is a limit to miniaturization in conventional lithography using a polymer resist material.
- various low molecular weight resist materials have been proposed.
- an alkali development type negative radiation sensitive composition for example, see Patent Document 1 and Patent Document 2 using a low molecular weight polynuclear polyphenol compound as a main component
- a low molecular weight resist material having high heat resistance
- an alkali development negative radiation-sensitive composition using a low molecular weight cyclic polyphenol compound as a main component see, for example, Patent Document 3 and Non-Patent Document 1 has also been proposed.
- Non-Patent Document 2 a polyphenol compound as a base compound for a resist material can impart high heat resistance despite its low molecular weight, and is useful for improving the resolution and roughness of a resist pattern (for example, Non-Patent Document 2). reference).
- compositions of Patent Documents 1 and 2 have insufficient heat resistance, and the shape of the resulting resist pattern may be deteriorated.
- the compositions of Patent Document 3 and Non-Patent Document 1 are not suitable for semiconductor manufacturing processes.
- the solubility in the safety solvent used is not sufficient, the sensitivity is not sufficient, and the resulting resist pattern shape may be deteriorated, and further improvement of the low molecular weight resist material is desired.
- the non-patent document 2 does not describe the solubility, and the heat resistance of the described compound is not yet sufficient. Improvement is demanded.
- An object of the present invention is to provide a resist composition capable of reducing film defects (thin film formation), having good storage stability, high sensitivity, and imparting a good resist pattern shape, and a resist using the resist composition It is to provide a pattern forming method.
- Another object of the present invention is to provide a compound (for example, polyphenol derivative) having high solubility in a safe solvent.
- the present inventors have found that a compound having a specific structure has high solubility in a safe solvent, and a resist composition containing the compound has a high sensitivity and a good resist pattern.
- the present inventors have found that a shape can be imparted and have completed the present invention.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 2 is independently a halogen atom or a carbon atom having 1 to 10 carbon atoms.
- a linear, branched or cyclic alkyl group, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a hydroxyl group or a group in which a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, and the same May be the same or different in the naphthalene ring or the benzene ring, and n is an integer of 1 to 4, and in the general formulas (1) and (2), when n is an integer of 2 or more, n
- the structural formulas of the repeating units may be the same or different.
- m 1 are each independently an integer of 0 to 7, provided that at least one m 1 is 1 to
- each X is independently an oxygen atom or a sulfur atom
- m 2 is each independently an integer of 0 to 6, provided that at least one m 2 is an integer of 1 to 6, and in the general formulas (1) and (2), each q is independently 0 or 1
- at least one of R 2 is a group in which a hydrogen atom of a hydroxyl group is substituted with an acid dissociable group, and is selected from the group consisting of R 1 and R 2 At least one of which is a group containing an iodine atom.
- the compound represented by the general formula (1) is a compound represented by the following general formula (1-1)
- the compound represented by the general formula (2) is a compound represented by the following general formula (2-1).
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom, carbon A linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms, and the same in the same naphthalene ring or benzene ring
- R 4 each independently represents a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- N is an integer of 2 or more, the structural formulas of the n repeating units may be the same or different.
- each m 3 is independently 1 to 7 is an integer
- m 4 are each independently an integer of 0 ⁇ 6
- m 3 + m 4 is an integer of 1-7
- m 5 are each independently an integer of 1-6
- m 6 are each independently an integer of 0 ⁇ 5
- m 5 + m 6 is an integer of 1-6
- q is independently 0 or 1.
- at least one of R 4 is acid dissociable.
- the compound represented by the general formula (1) is a compound represented by the following general formula (1-2), and the compound represented by the general formula (2) is a compound represented by the following general formula (2-2).
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom, carbon A linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms, and the same in the same naphthalene ring or benzene ring
- R 4 is each independently a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- N is an integer of 2 or more, the structural formulas of the n repeating units may be the same or different.
- each of m 4 is independently 0 to 6 is an integer
- m 6 are each independently an integer of 0-5, the general formula (1-2) and formula (2 During 2), q is 0 or 1 each independently.
- at least one of R 4 is an acid-dissociable group
- R 1 and (At least one selected from the group consisting of R 3 is a group containing an iodine atom.)
- [7] [1] to [6] The resist composition according to any one of [6] is coated on a substrate to form a resist film, the formed resist film is exposed, and the exposed resist film is developed. And a resist pattern forming method.
- the compound represented by the general formula (1) is a compound represented by the following general formula (3)
- the compound represented by the general formula (2) is a compound represented by the following general formula (4): [1 ] Or the resist composition according to any one of [4] to [6].
- X ′ is a hydrogen atom, a halogen atom or a monovalent group having 1 to 18 carbon atoms
- R 0 is each independently a group having 1 to 4 carbon atoms.
- R 4 is a hydrogen atom or an acid-dissociable group
- p 1 is Each independently represents an integer of 0 to 5, and in formula (4), p 2 is each independently an integer of 0 to 5, and in formulas (3) and (4)
- q is each independently
- at least one of R 4 is an acid dissociable group, and at least one selected from the group consisting of X ′ and R 0 is A group containing an iodine atom.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 2 is independently a halogen atom, a straight chain having 1 to 10 carbon atoms, A branched or cyclic alkyl group, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a hydroxyl group or a group in which a hydrogen atom of the hydroxyl group is substituted with an acid dissociable group, and the same naphthalene ring or
- the benzene rings may be the same or different, and n is an integer of 1 to 4, and when n is an integer of 2 or more, the structural formulas of the n repeating units are the same or different.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom or a straight chain having 1 to 10 carbon atoms.
- R 4 are each independently a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- n is an integer of 2 or more, the structural formulas of n repeating units are the same.
- M 3 is each independently an integer from 1 to 7
- m 4 is each independently an integer from 0 to 6
- m 3 + m 4 is an integer from 1 to 7.
- q is 0 or 1 each independently.
- at least one acid R 4 A dissociable group, at least one selected from the group consisting of R 1 and R 3 is a group containing an iodine atom.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom or a straight chain having 1 to 10 carbon atoms.
- R 4 are each independently a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- n is an integer of 2 or more, the structural formulas of n repeating units are the same.
- Each of m 4 is independently an integer of 0 to 6, and q is independently of 0 or 1.
- at least R 4 of R 4 One is an acid dissociable group, and at least one selected from the group consisting of R 1 and R 3 is iodine. It is a group containing an elementary atom.
- the compound according to [9], wherein the compound represented by the general formula (1) is a compound represented by the following general formula (3).
- X ′ is a hydrogen atom, a halogen atom or a monovalent group having 1 to 18 carbon atoms
- R 0 is each independently an alkyl group having 1 to 4 carbon atoms or a halogen atom.
- R 4 is a hydrogen atom or an acid dissociable group
- p 1 is each independently an integer of 0 to 5.
- Q are each independently 0 or 1.
- at least one of R 4 is an acid-dissociable group, and is at least 1 selected from the group consisting of X ′ and R 0. Is a group containing an iodine atom.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 2 is independently a halogen atom, a straight chain having 1 to 10 carbon atoms, A branched or cyclic alkyl group, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a hydroxyl group or a group in which a hydrogen atom of the hydroxyl group is substituted with an acid dissociable group, and the same naphthalene ring or
- the benzene rings may be the same or different, and n is an integer of 1 to 4, and when n is an integer of 2 or more, the structural formulas of the n repeating units are the same or different.
- X is each independently an oxygen atom or a sulfur atom
- m 2 is each independently an integer of 0 to 6, provided that at least one m 2 is an integer of 1 to 6, and q is each independently 0 or 1.
- R 2 One is a group in which a hydrogen atom of the hydroxyl group is substituted with an acid dissociable group, at least one selected from the group consisting of R 1 and R 2 is a group containing an iodine atom.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom or a straight chain having 1 to 10 carbon atoms.
- R 4 are each independently a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- n is an integer of 2 or more, the structural formulas of n repeating units are the same.
- M 5 is each independently an integer of 1 to 6
- m 6 is each independently an integer of 0 to 5
- m 5 + m 6 is an integer of 1 to 6
- q is 0 or 1 each independently.
- at least one acid R 4 A dissociable group, at least one selected from the group consisting of R 1 and R 3 is a group containing an iodine atom.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms
- each R 3 is independently a halogen atom or a straight chain having 1 to 10 carbon atoms.
- R 4 are each independently a hydrogen atom or an acid dissociable group
- n is an integer of 1 to 4
- n is an integer of 2 or more, the structural formulas of n repeating units are the same.
- M 6 is each independently an integer of 0 to 5, and q is each independently 0 or 1, provided that in general formula (2-2), at least R 4 of R 4 One is an acid dissociable group, and at least one selected from the group consisting of R 1 and R 3 is iodine. It is a group containing an elementary atom.
- R 4 of R 4 One is an acid dissociable group, and at least one selected from the group consisting of R 1 and R 3 is iodine. It is a group containing an elementary atom.
- X ′ is a hydrogen atom, a halogen atom or a monovalent group having 1 to 18 carbon atoms
- R 0 is each independently an alkyl group having 1 to 4 carbon atoms or a halogen atom.
- R 4 is a hydrogen atom or an acid dissociable group
- p 2 is each independently an integer of 0 to 5.
- Q are each independently 0 or 1.
- at least one of R 4 is an acid-dissociable group, and is at least 1 selected from the group consisting of X ′ and R 0. Is a group containing an iodine atom.
- the acidic aqueous solution is a mineral acid aqueous solution or an organic acid aqueous solution
- the mineral acid aqueous solution is at least one mineral acid aqueous solution selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid
- the organic acid aqueous solution is a group consisting of acetic acid, propionic acid, succinic acid, malonic acid, succinic acid, fumaric acid, maleic acid, tartaric acid, citric acid, methanesulfonic acid, phenolsulfonic acid, p-toluenesulfonic acid and trifluoroacetic acid.
- the purification method according to [20] which is an aqueous solution of one or more organic acids selected from the above.
- the organic solvent that is not arbitrarily miscible with water is at least one organic solvent selected from the group consisting of toluene, 2-heptanone, cyclohexanone, cyclopentanone, methyl isobutyl ketone, propylene glycol monomethyl ether acetate, and ethyl acetate.
- the solution phase containing the compound is further brought into contact with water to extract impurities in the compound (second extraction step), wherein any of [20] to [22] The purification method as described.
- a compound having high solubility in a safe solvent including the compound, capable of reducing film defects (forming a thin film), having good storage stability, high sensitivity, and a good resist pattern.
- a resist composition capable of imparting a shape and a resist pattern forming method using the same can be provided.
- a compound (for example, a polyphenol derivative) having high solubility in a safe solvent can be provided.
- the resist composition of the present embodiment contains at least one selected from the compound represented by the general formula (1), the compound represented by the general formula (2), and a resin obtained using these as monomers.
- resist composition of the first embodiment 1st embodiment of the resist composition of this Embodiment contains the compound shown by following General formula (1).
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms.
- the 2n-valent group having 1 to 30 carbon atoms is an alicyclic hydrocarbon group, It may have a double bond, a hetero atom, or an aromatic group having 6 to 30 carbon atoms
- each R 2 is independently a halogen atom or a carbon atom having 1 to 10 carbon atoms.
- R 2 is a group in which a hydrogen atom of a hydroxyl group is substituted with an acid dissociable group, and at least one selected from the group consisting of R 1 and R 2 is a group containing an iodine atom.
- the chemical structure of the compound contained in the resist composition of the present embodiment can be determined by 1 H-NMR analysis. Since the compound contained in the resist composition of the present embodiment has a benzene skeleton or a naphthalene skeleton as shown in the general formula (1), it has excellent heat resistance.
- n is an integer of 1 to 4, and when n is an integer of 2 or more, the structural formulas of the n repeating units may be the same or different.
- n is preferably 1 to 3 from the viewpoint of resist properties such as heat resistance, resolution, and roughness.
- q is preferably 1. That is, the compound represented by the general formula (1) is preferably a compound represented by the following general formula (1-a).
- R 1 , R 2 , n, and m 1 have the same meaning as in the general formula (1).
- the compound represented by the general formula (1) is not a polymer.
- the structure of the [] moiety bonded to R 1 in the general formula (1) is the structure of a repeating unit.
- R 1 is a single bond or a 2n-valent group having 1 to 30 carbon atoms (hereinafter sometimes referred to as “C1 to 30”), and the group is an alicyclic carbonization. It may have a hydrogen group, a double bond, a hetero atom or a C6-30 aromatic group.
- Examples of the 2n-valent group include those having a linear, branched or cyclic structure.
- the 2n-valent group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or a C6-30 aromatic group.
- the alicyclic hydrocarbon group includes a bridged alicyclic hydrocarbon group.
- R 1 preferably has a condensed polycyclic aromatic group (particularly, a condensed ring structure having 2 to 4 rings) from the viewpoint of heat resistance, and has solubility in a safe solvent and heat resistance. From the viewpoint, it is preferable to have a polyphenyl group such as a biphenyl group.
- each R 2 independently represents a halogen atom, a C1-10 linear, branched or cyclic alkyl group, a C6-10 aryl group, a C2-10 alkenyl group, a hydroxyl group.
- a hydrogen atom of a hydroxyl group is a group substituted with an acid dissociable group, and may be the same or different in the same naphthalene ring or benzene ring, and at least one of R 2 is an acid dissociated group
- Each of m 1 is an integer of 0 to 7 independently. However, at least one of m 1 is an integer of 1 to 7.
- preferred R 2 is a hydrogen atom, a C1-10 linear, branched or cyclic alkyl group, a C6-10 aryl group, a C2-10 alkenyl group, or It is a hydroxyl group.
- at least one selected from the group consisting of R 1 and R 2 is a group containing an iodine atom.
- the compound represented by the formula (1) has high heat resistance due to its rigidity even though it has a low molecular weight, and can be used under high-temperature baking conditions. Further, since the resist composition of the present embodiment has such a low molecular weight and contains a compound that can be baked at a high temperature, it is highly sensitive and can impart a good resist pattern shape.
- the compound represented by the formula (1) is preferably a compound represented by the following general formula (1-1) from the viewpoints of solubility in a safe solvent and characteristics of a resist pattern.
- R 1 is the same as in the general formula (1).
- each R 3 independently represents a halogen atom, a C1-10 linear, branched or cyclic alkyl group, a C6-10 aryl group, or a C2-10 alkenyl. It is a group.
- at least one selected from the group consisting of R 1 and R 3 is a group containing an iodine atom. Incidentally, this means that "at least one selected from the group consisting of R 1 and R 3", and “at least one group selected from the group consisting of R 1 and R 3", "R It does not mean “at least one group selected from the group consisting of 1 and R 3 ”.
- m 3 is each independently an integer of 1 to 7
- m 4 is each independently an integer of 0 to 6
- m 3 + m 4 is an integer of 1 to 7.
- n is an integer of 1 to 4.
- q is each independently 0 or 1, but q is preferably 1. That is, the compound represented by the general formula (1-1) is preferably a compound represented by the following general formula (1-1-a).
- each R 4 is independently an acid-dissociable group or a hydrogen atom, and at least one is an acid-dissociable group.
- an acid-dissociable group refers to a characteristic group that is cleaved in the presence of an acid to cause a change such as an alkali-soluble group.
- an alkali-soluble group For example, a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, a hexafluoroisopropanol group etc. are mentioned, A phenolic hydroxyl group and a carboxyl group are preferable, and a phenolic hydroxyl group is especially preferable.
- the acid-dissociable group is not particularly limited, but examples thereof include those proposed for hydroxystyrene resins and (meth) acrylic resins used in chemically amplified resist compositions for KrF and ArF. It can be appropriately selected and used. Specifically, although not particularly limited, for example, a substituted methyl group, 1-substituted ethyl group, 1-substituted n-propyl group, 1-branched alkyl group, silyl group, acyl group, 1-substituted alkoxymethyl group, Examples thereof include a cyclic ether group, an alkoxycarbonyl group, and an alkoxycarbonylalkyl group. It is preferable that the acid dissociable group does not have a crosslinkable functional group.
- the substituted methyl group is not particularly limited, and examples thereof include a substituted methyl group having 2 to 20 carbon atoms, preferably a substituted methyl group having 4 to 18 carbon atoms, and more preferably a substituted methyl group having 6 to 16 carbon atoms. .
- Examples thereof include a syl group, a piperonyl group, and a substituent represented by the following formula (13-1).
- R 2 is not particularly limited, and examples thereof include a methyl group, an ethyl group, an isopropyl group, an n-propyl group, a t-butyl group, and an n-butyl group. .
- R 2 is an alkyl group having 1 to 4 carbon atoms.
- the 1-substituted ethyl group is not particularly limited, and examples thereof include a 1-substituted ethyl group having 3 to 20 carbon atoms, preferably a 1-substituted ethyl group having 5 to 18 carbon atoms, and having 7 to 16 carbon atoms. A substituted ethyl group is more preferred.
- R 2 is the same as in formula (13-1) above.
- the 1-substituted-n-propyl group is not particularly limited, and examples thereof include a 1-substituted-n-propyl group having 4 to 20 carbon atoms, and a 1-substituted-n-propyl group having 6 to 18 carbon atoms.
- a 1-substituted n-propyl group having 8 to 16 carbon atoms is more preferable. Specific examples include, but are not limited to, 1-methoxy-n-propyl group and 1-ethoxy-n-propyl group.
- the 1-branched alkyl group is not particularly limited, and examples thereof include a 1-branched alkyl group having 3 to 20 carbon atoms, preferably a 1-branched alkyl group having 5 to 18 carbon atoms, and having 7 to 16 carbon atoms.
- a branched alkyl group is more preferred.
- the silyl group is not particularly limited, and examples thereof include a silyl group having 1 to 20 carbon atoms, a silyl group having 3 to 18 carbon atoms is preferable, and a silyl group having 5 to 16 carbon atoms is more preferable.
- trimethylsilyl group ethyldimethylsilyl group, methyldiethylsilyl group, triethylsilyl group, tert-butyldimethylsilyl group, tert-butyldiethylsilyl group, tert-butyldiphenylsilyl group
- examples thereof include a tri-tert-butylsilyl group and a triphenylsilyl group.
- the acyl group is not particularly limited, and examples thereof include an acyl group having 2 to 20 carbon atoms, an acyl group having 4 to 18 carbon atoms is preferable, and an acyl group having 6 to 16 carbon atoms is more preferable.
- acetyl group phenoxyacetyl group, propionyl group, butyryl group, heptanoyl group, hexanoyl group, valeryl group, pivaloyl group, isovaleryl group, laurylyl group, adamantylcarbonyl group, benzoyl group and A naphthoyl group etc. can be mentioned.
- the 1-substituted alkoxymethyl group is not particularly limited, and examples thereof include a 1-substituted alkoxymethyl group having 2 to 20 carbon atoms.
- a 1-substituted alkoxymethyl group having 4 to 18 carbon atoms is preferable, and a carbon number of 6 More preferred are 1 to 16 1-substituted alkoxymethyl groups.
- Specific examples include, but are not limited to, for example, 1-cyclopentylmethoxymethyl group, 1-cyclopentylethoxymethyl group, 1-cyclohexylmethoxymethyl group, 1-cyclohexylethoxymethyl group, 1-cyclooctylmethoxymethyl group, and 1-cyclooctylmethoxymethyl group.
- the cyclic ether group is not particularly limited, and examples thereof include a cyclic ether group having 2 to 20 carbon atoms, preferably a cyclic ether group having 4 to 18 carbon atoms, and more preferably a cyclic ether group having 6 to 16 carbon atoms. .
- tetrahydropyranyl group, tetrahydrofuranyl group, tetrahydrothiopyranyl group, tetrahydrothiofuranyl group, 4-methoxytetrahydropyranyl group, 4-methoxytetrahydrothiopyranyl group, etc. Can be mentioned.
- the alkoxycarbonyl group is not particularly limited, and examples thereof include an alkoxycarbonyl group having 2 to 20 carbon atoms, an alkoxycarbonyl group having 4 to 18 carbon atoms is preferable, and an alkoxycarbonyl group having 6 to 16 carbon atoms is more preferable. .
- an acid dissociable group represented by n 0.
- R 3 is a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms, and n is an integer of 0 to 4.
- a substituted methyl group, a 1-substituted ethyl group, a 1-substituted alkoxymethyl group, a cyclic ether group, an alkoxycarbonyl group, and an alkoxycarbonylalkyl group are preferred, and a substituted methyl group, 1-substituted ethyl group Group, an alkoxycarbonyl group and an alkoxycarbonylalkyl group are more preferable because of high sensitivity, and an acid dissociable group having a structure selected from a cycloalkane having 3 to 12 carbon atoms, a lactone and an aromatic ring having 6 to 12 carbon atoms is more preferable. preferable.
- the cycloalkane having 3 to 12 carbon atoms may be monocyclic or polycyclic, but is preferably polycyclic. Specific examples include, but are not limited to, monocycloalkanes, bicycloalkanes, tricycloalkanes, tetracycloalkanes, and the like. More specific examples include, but are not limited to, cyclopropane, cyclobutane, cyclohexane, and the like. Examples include monocycloalkanes such as pentane and cyclohexane, and polycycloalkanes such as adamantane, norbornane, isobornane, tricyclodecane, and tetracyclodecane.
- adamantane, tricyclodecane, and tetracyclodecane are preferable, and adamantane and tricyclodecane are particularly preferable.
- the cycloalkane having 3 to 12 carbon atoms may have a substituent.
- the lactone is not particularly limited, and examples thereof include butyrolactone or a cycloalkane group having 3 to 12 carbon atoms having a lactone group.
- the 6 to 12 aromatic ring is not particularly limited, and examples thereof include a benzene ring, a naphthalene ring, an anthracene ring, a phenanthrene ring, and a pyrene ring.
- a benzene ring and a naphthalene ring are preferable, and a naphthalene ring is particularly preferable.
- an acid dissociable group selected from the group consisting of groups represented by the following formula (13-4) is preferable because of high resolution.
- R 5 is a hydrogen atom or a linear or branched alkyl group having 1 to 4 carbon atoms
- R 6 is hydrogen, a linear or branched alkyl group having 1 to 4 carbon atoms
- n 1 is an integer from 0 to 4
- n 2 is an integer from 1 to 5
- n 0 is an integer from 0 to 4.
- the compound represented by the general formula (1) is preferably a compound represented by the following general formula (1-2) from the viewpoint of sensitivity when a resist composition is used.
- R 1 , R 3 , R 4 , m 4 , n, and q are the same as in the general formula (1-1), and the group consisting of R 1 and R 3 At least one selected from the above is a group containing an iodine atom.
- R 1 , R 3 , R 4 , m 4 and n are the same as those in the general formula (1-1), and the group consisting of R 1 and R 3 At least one selected from the above is a group containing an iodine atom.
- m 3 in the general formula (1-1) is preferably 2.
- the compound represented by the general formula (1-1) is such that n in the general formula (1-1) is 1 It is preferable that Further, from the viewpoint of solubility, in the present embodiment, the compound represented by the general formula (1) is more preferably a compound represented by the following general formula (1-3).
- R 1 , R 3 , R 4 and m 4 are the same as those in the general formula (1-1), and at least 1 selected from the group consisting of R 1 and R 3 One is a group containing an iodine atom.
- R 2 ′ is synonymous with R 2 described in the general formula (1)
- m is synonymous with m 1 described in the general formula (1)
- at least one of R 2 ′ is A monovalent group containing an iodine atom.
- the method for producing the compound represented by the general formula (1) is not particularly limited.
- naphthols or thionaphthols and corresponding aldehydes or ketones are reacted in the presence of an acid catalyst.
- a polyphenol compound is obtained by introducing an acid-dissociable group into the at least one phenolic hydroxyl group of the obtained polyphenol compound by a known method. Is obtained.
- the compound can be synthesized in the same manner by using phenols or thiophenols in combination with the naphthols or thionaphthols. Can do.
- the naphthols are not particularly limited, and examples thereof include naphthol, methyl naphthol, methoxy naphthol, naphthalene diol, and the like. It is more preferable to use naphthalene diol because a xanthene structure can be easily formed.
- the thionaphthols are not particularly limited, and examples thereof include naphthalenethiol, methylnaphthalenethiol, methoxynaphthalenethiol, and naphthalenedithiol.
- the phenols are not particularly limited, and examples thereof include phenol, methylphenol, methoxybenzene, catechol, resorcinol, hydroquinone, and trimethylhydroquinone.
- the thiophenols are not particularly limited, and examples thereof include benzenethiol, methylbenzenethiol, methoxybenzenethiol, benzenedithiol, and trimethylbenzenedithiol.
- aldehydes are not particularly limited, and for example, formaldehyde, trioxane, paraformaldehyde, acetaldehyde, propylaldehyde, butyraldehyde, hexylaldehyde, decylaldehyde, undecylaldehyde, phenylacetaldehyde, phenylpropylaldehyde, furfural, benzaldehyde, hydroxy Benzaldehyde, fluorobenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, dimethylbenzaldehyde, ethylbenzaldehyde, propylbenzaldehyde, butylbenzaldehyde, cyclohexylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarboxalde
- the ketones are not particularly limited, and for example, acetone, methyl ethyl ketone, cyclobutanone, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone It is preferable to use cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone from the viewpoint of giving high heat resistance.
- the acid catalyst is not particularly limited, and can be appropriately selected from known inorganic acids and organic acids.
- inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid, hydrofluoric acid; oxalic acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalene
- Organic acids such as sulfonic acid and naphthalenedisulfonic acid; Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride; or solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid, and phosphomolybdic acid Can be mentioned.
- hydrochloric acid or sulfuric acid from the viewpoint of production such as availability and ease of handling.
- hydrochloric acid or sulfuric acid from the viewpoint of
- a reaction solvent When producing the compound represented by the general formula (1), a reaction solvent may be used.
- the reaction solvent is not particularly limited as long as the reaction of aldehydes or ketones to be used with naphthols or thionaphthols proceeds.
- water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane or a mixed solvent thereof Can be used.
- the amount of the solvent is not particularly limited, and is, for example, in the range of 0 to 2000 parts by mass with respect to 100 parts by mass of the reaction raw material.
- the reaction temperature is not particularly limited and can be appropriately selected according to the reactivity of the reaction raw material, but is preferably in the range of 10 to 200 ° C.
- the lower the reaction temperature the higher the effect and the more preferable the range is 10 to 60 ° C.
- the method for producing the polyphenol compound is not particularly limited. For example, naphthols or thionaphthols, aldehydes or ketones, a method of charging a catalyst in a lump, or naphthols or thionaphthols in the presence of a catalyst, aldehydes or ketones.
- the method of dripping a kind is mentioned. After the polycondensation reaction, in order to remove unreacted raw materials, catalysts, etc. existing in the system, the temperature of the reaction kettle can be raised to 130-230 ° C., and volatile matter can be removed at about 1-50 mmHg. .
- the amount of the raw material for producing the polyphenol compound is not particularly limited.
- naphthols or thionaphthols, aldehydes or ketones are added in an amount of 2 mol to excess with respect to 1 mol of aldehydes or ketones, and The reaction proceeds by using 0.001 to 1 mol of an acid catalyst and reacting at 20 to 60 ° C. for 20 minutes to 100 hours at normal pressure.
- the target product is isolated by a known method.
- the method for isolating the target product is not particularly limited.
- the reaction solution is concentrated, pure water is added to precipitate the reaction product, the solution is cooled to room temperature, filtered, and separated to obtain a solid product.
- a method of separating and purifying from by-products by column chromatography, evaporating the solvent, filtering and drying to obtain the target compound can be mentioned.
- a method for introducing an acid dissociable group into at least one phenolic hydroxyl group of the polyphenol compound is known.
- an acid dissociable group can be introduced into at least one phenolic hydroxyl group of the polyphenol compound as follows.
- a compound for introducing an acid dissociable group can be synthesized or easily obtained by a known method, for example, an active carboxylic acid derivative compound such as acid chloride, acid anhydride, dicarbonate, alkyl halide, vinyl alkyl ether, dihydro Although pyran, halocarboxylic acid alkyl ester, etc. are mentioned, it does not specifically limit.
- the polyphenol compound is dissolved or suspended in an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like.
- an aprotic solvent such as acetone, tetrahydrofuran (THF), propylene glycol monomethyl ether acetate or the like.
- a vinyl alkyl ether such as ethyl vinyl ether or dihydropyran is added, and the mixture is reacted at 20 to 60 ° C. for 6 to 72 hours at atmospheric pressure in the presence of an acid catalyst such as pyridinium-p-toluenesulfonate.
- the reaction solution is neutralized with an alkali compound and added to distilled water to precipitate a white solid, and then the separated white solid is washed with distilled water and dried to obtain the compound represented by the above general formula (1).
- the polyphenol compound is dissolved or suspended in an aprotic solvent such as acetone, THF, propylene glycol monomethyl ether acetate or the like.
- an alkyl halide such as ethyl chloromethyl ether or a halocarboxylic acid alkyl ester such as methyl adamantyl bromoacetate is added, and the reaction is carried out in the presence of an alkali catalyst such as potassium carbonate at 20 to 110 ° C. for 6 to 72 hours.
- the reaction solution is neutralized with an acid such as hydrochloric acid and added to distilled water to precipitate a white solid.
- the separated white solid is washed with distilled water and dried to obtain the compound represented by the above general formula (1). Obtainable.
- an acid-dissociable group refers to a characteristic group that cleaves in the presence of an acid to generate a functional group that changes the solubility of an alkali-soluble group or the like.
- an alkali-soluble group For example, a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, a hexafluoroisopropanol group etc. are mentioned, A phenolic hydroxyl group and a carboxyl group are preferable, and a phenolic hydroxyl group is especially preferable.
- the acid dissociable group preferably has a property of causing a chain cleavage reaction in the presence of an acid in order to enable pattern formation with higher sensitivity and higher resolution.
- the second embodiment of the resist composition of the present embodiment contains a compound represented by the following general formula (2).
- each X is independently an oxygen atom or a sulfur atom
- R 1 is a single bond or a C1-30 2n-valent group.
- the C1-30 2n-valent group may have an alicyclic hydrocarbon group, a double bond, a hetero atom, or a C6-30 aromatic group.
- each R 2 independently represents a halogen atom, a C1-10 linear, branched or cyclic alkyl group, a C6-10 aryl group, a C2-10 alkenyl group, a hydroxyl group, or
- the hydrogen atom of the hydroxyl group is a group substituted by an acid dissociable group, and may be the same or different in the same naphthalene ring or benzene ring
- m 2 is each independently an integer of 0 to 6 However, at least one of m 2 is an integer of 1 to 6, n is an integer of 1 to 4, and in the general formula (2), when n is an integer of 2 or more, n repeating units
- the structural formulas may be the same or different.
- At least one of R 2 is a group in which a hydrogen atom of a hydroxyl group is substituted with an acid dissociable group, and at least one selected from the group consisting of R 1 and R 2 is iodine A group containing an atom.
- R 1 , R 2 , n, and m 2 have the same meaning as in the general formula (2).
- X is preferably an oxygen atom from the viewpoint of suppressing device contamination at the time of resist film exposure.
- the following general formula A compound represented by the formula (2-1) is preferable.
- R 1 , R 3 , R 4 , n, and q are the same as those in the general formula (1-1), and m 5 is independently 1 to 6 M 6 is an integer of 0 to 5 independently, and m 5 + m 6 is an integer of 1 to 6.
- q is 0 or 1, but q is more preferably 1. That is, the compound represented by the general formula (2) is more preferably a compound represented by the following formula (2-1-a).
- R 1 , R 3 , R 4 , n, m 5 and m 6 are the same as those in the general formula (2-1).
- the compound represented by the general formula (2) is more preferably a compound represented by the following general formula (2-2).
- R 1 , R 3 , R 4 , m 6 , n, and q are the same as those in the formula (2-1).
- q is more preferably 1. That is, the compound represented by the general formula (2) is more preferably a compound represented by the following general formula (2-2-a).
- m 5 in the general formula (2-1) is preferably 2.
- the compound represented by the general formula (2-1) is such that n in the general formula (2-1) is 1 It is preferable that
- the compound represented by the general formula (2) is more preferably a compound represented by the following general formula (2-3).
- R 1 , R 3 , R 4 and m 6 are the same as those in the general formula (2-1).
- X is synonymous with the case of the said General formula (2)
- R ⁇ 2 '> is synonymous with R ⁇ 2 > demonstrated by the said General formula (2)
- m was demonstrated by the said General formula (2). It is synonymous with m 2, and at least one of R 2 ′ is a monovalent group containing an iodine atom.
- the compound represented by the general formula (2) is reacted with aldehydes or ketones corresponding to naphthols or thionaphthols in the presence of an acid catalyst.
- a polyphenol compound is obtained by introducing an acid-dissociable functional group into at least one phenolic hydroxyl group of the obtained polyphenol compound by a known method.
- the compound shown is obtained.
- the compound is synthesized in the same manner by using a phenol or thiophenol in combination with the naphthol or thionaphthol. Can do.
- the compound of the present embodiment is a compound represented by the general formula (1) or (2).
- the compound represented by the general formula (1) is preferably a compound represented by the general formula (1-1), and more preferably a compound represented by the general formula (1-2).
- the compound represented by the general formula (2) is preferably a compound represented by the general formula (2-1), and more preferably a compound represented by the general formula (2-2).
- the compound of the present embodiment is particularly preferably a compound represented by the following general formula (3) or (4) (for example, a polyphenol derivative).
- X ′ is a hydrogen atom, a halogen atom or a monovalent group having 1 to 18 carbon atoms
- R 0 is each independently a group having 1 to 4 carbon atoms.
- R 4 is a hydrogen atom or an acid-dissociable group
- p 1 is Each independently represents an integer of 0 to 5, and in formula (4), p 2 is each independently an integer of 0 to 5, and in formulas (3) and (4)
- q is each independently
- at least one of R 4 is an acid dissociable group, and at least one selected from the group consisting of X ′ and R 0 is A group containing an iodine atom.
- X ′ is preferably a hydrogen atom
- the compound represented by the general formula (3) or (4) is preferably a compound represented by the following general formula (3-1) or formula (4-1), respectively.
- X ′ represents a hydrogen atom, a halogen atom or a monovalent group having 1 to 18 carbon atoms
- R 0 each independently represents 1 carbon atom.
- R 4 is a hydrogen atom or an acid dissociable group, and has the general formula (3-1)
- p 1 is each independently an integer of 0 to 5
- p 2 is independently an integer of 0 to 5.
- at least one of R 4 is an acid-dissociable group, and at least one selected from the group consisting of X ′ and R 0 represents an iodine atom. It is a group containing.
- X ′ is preferably a hydrogen atom, a halogen atom, or a monovalent hydrocarbon group having 1 to 18 carbon atoms.
- the compound of the present embodiment (for example, a polyphenol derivative) has an effect of being excellent in heat resistance and having excellent solubility in a safe solvent in addition to heat resistance, particularly by having a naphthalene skeleton.
- the position of the hydroxyl group in the naphthalene ring is not particularly limited. It is preferable that it is in the second and sixth positions from the viewpoint of higher solubility in a safe solvent and lower crystallinity.
- the resist composition of the present embodiment particularly preferably contains a compound represented by the general formula (3) or (4) (for example, a polyphenol derivative).
- the resin of this embodiment is a resin obtained using the compound represented by the above formula (1) or (2) as a monomer.
- the resin of the present embodiment can be obtained, for example, by reacting a compound represented by the above formula (1) or (2) with a compound having crosslinking reactivity.
- a known compound can be used without particular limitation as long as the compound represented by the above formula (1) or (2) can be oligomerized or polymerized. Specific examples thereof include, but are not limited to, aldehydes, ketones, carboxylic acids, carboxylic acid halides, halogen-containing compounds, amino compounds, imino compounds, isocyanates, unsaturated hydrocarbon group-containing compounds, and the like.
- the purification method of the compound or resin of the present embodiment is A step of obtaining a solution (A) by dissolving, in a solvent, one or more selected from the compound represented by the general formula (1), the compound represented by the general formula (2), and a resin obtained by using these as monomers; , Contacting the obtained solution (A) with an acidic aqueous solution to extract impurities in the compound or the resin (first extraction step),
- the solvent used in the step of obtaining the solution (A) includes an organic solvent that is not arbitrarily miscible with water.
- the resin is preferably a resin obtained by a reaction between a compound represented by the formula (1) or (2) and a compound having a crosslinking reaction.
- the purification method of this Embodiment Since it is comprised as mentioned above, according to the purification method of this Embodiment, content of the various metals which can be contained as an impurity in the compound or resin which has the specific structure mentioned above can be reduced. More specifically, in the purification method of the present embodiment, the compound or the resin is dissolved in an organic solvent that is arbitrarily immiscible with water to obtain a solution (A), and the solution (A) is further acidic. The extraction treatment can be performed in contact with an aqueous solution. Thereby, the metal component contained in the solution (A) containing the compound represented by the general formula (1), the compound represented by the general formula (2) or the resin obtained using these as monomers was transferred to the aqueous phase. Thereafter, a compound represented by the above general formula (1), a compound represented by the above general formula (2), or a resin obtained by using these as monomers, having a reduced metal content by separating the organic phase and the aqueous phase. Obtainable.
- the compound represented by the above general formula (1), the compound represented by the above general formula (2), or the resin obtained using these as monomers may be used alone in the purification method of the present embodiment, but two or more kinds are mixed. You can also.
- the compound represented by the general formula (1), the compound represented by the general formula (2), or a resin obtained using these as a monomer includes various surfactants, various crosslinking agents, various acid generators, and various stabilizers. Etc. may be contained.
- the organic solvent that is not arbitrarily miscible with water used in the purification method of the present embodiment is not particularly limited, but is preferably an organic solvent that can be safely applied to a semiconductor manufacturing process, and specifically, to water at room temperature. Is an organic solvent having a solubility of less than 30%, more preferably less than 20%, and particularly preferably an organic solvent having a solubility of less than 10%.
- the amount of the organic solvent used is 1 to 100 times by mass with respect to the compound represented by the general formula (1), the compound represented by the general formula (2) and the resin obtained using these as monomers. It is preferable.
- toluene, 2-heptanone, cyclohexanone, cyclopentanone, methyl isobutyl ketone, propylene glycol monomethyl ether acetate, ethyl acetate and the like are preferable, methyl isobutyl ketone, ethyl acetate, cyclohexanone, propylene glycol monomethyl ether acetate are more preferable, More preferred are methyl isobutyl ketone and ethyl acetate.
- Methyl isobutyl ketone, ethyl acetate and the like have a relatively high saturation solubility and a relatively low boiling point of the compound represented by the above general formula (1), the compound represented by the above general formula (2) or a resin obtained using these compounds as monomers. Therefore, it is possible to reduce the load in the process of industrially removing the solvent or removing it by drying.
- These organic solvents can be used alone or in combination of two or more.
- the acidic aqueous solution used in the purification method of the present embodiment is appropriately selected from aqueous solutions in which generally known organic compounds or inorganic compounds are dissolved in water.
- a mineral acid aqueous solution in which a mineral acid such as hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid or the like is dissolved in water, or acetic acid, propionic acid, succinic acid, malonic acid, succinic acid, fumaric acid, maleic acid
- acidic aqueous solutions can be used alone or in combination of two or more.
- one or more mineral acid aqueous solutions selected from the group consisting of hydrochloric acid, sulfuric acid, nitric acid and phosphoric acid, or acetic acid, propionic acid, succinic acid, malonic acid, succinic acid, fumaric acid, maleic acid,
- One or more organic acid aqueous solutions selected from the group consisting of tartaric acid, citric acid, methanesulfonic acid, phenolsulfonic acid, p-toluenesulfonic acid and trifluoroacetic acid are preferred, and sulfuric acid, nitric acid, acetic acid, oxalic acid,
- An aqueous solution of carboxylic acid such as tartaric acid and citric acid is more preferable
- an aqueous solution of sulfuric acid, succinic acid, tartaric acid and citric acid is more preferable, and
- the pH of the acidic aqueous solution used in the purification method of the present embodiment is not particularly limited, but the compound represented by the general formula (1), the compound represented by the general formula (2), or a resin obtained using these as monomers. It is preferable to adjust the acidity of the aqueous solution in consideration of the influence on the pH. Usually, the pH range is about 0 to 5, preferably about pH 0 to 3.
- the amount of the acidic aqueous solution used in the purification method of the present embodiment is not particularly limited, from the viewpoint of reducing the number of extractions for metal removal and securing the operability in consideration of the total liquid amount, It is preferable to adjust the amount used. From the above viewpoint, the amount of the acidic aqueous solution used is preferably 10 to 200% by mass, more preferably 20 to 100% by mass with respect to 100% by mass of the solution (A).
- the acidic aqueous solution as described above, the compound represented by the general formula (1), the compound represented by the general formula (2), and a resin obtained using these as monomers are selected.
- the metal component can be extracted from the compound or the resin in the solution (A) by contacting the solution (A) containing one or more kinds and an organic solvent which is not arbitrarily miscible with water.
- the solution (A) further contains an organic solvent that is arbitrarily mixed with water.
- an organic solvent arbitrarily mixed with water included, the amount of the compound represented by the above general formula (1), the compound represented by the above general formula (2), or a resin obtained using these as monomers can be increased.
- the liquid separation property is improved, and there is a tendency that purification can be performed with high pot efficiency.
- the method for adding an organic solvent arbitrarily mixed with water is not particularly limited.
- any of a method of adding to a solution containing an organic solvent in advance, a method of adding to water or an acidic aqueous solution in advance, and a method of adding after bringing a solution containing an organic solvent into contact with water or an acidic aqueous solution may be used.
- the method of adding to the solution containing an organic solvent in advance is preferable from the viewpoint of the workability of the operation and the ease of management of the charged amount.
- the organic solvent arbitrarily mixed with water used in the purification method of the present embodiment is not particularly limited, but an organic solvent that can be safely applied to a semiconductor manufacturing process is preferable.
- the amount of the organic solvent arbitrarily mixed with water is not particularly limited as long as the solution phase and the aqueous phase are separated from each other, but the compound represented by the general formula (1) and the general formula (2) are used. It is preferably 0.1 to 100 times by mass, more preferably 0.1 to 50 times by mass, and more preferably 0.1 to 20 times by mass with respect to the compound obtained and the resin obtained using these as monomers. More preferably.
- organic solvent arbitrarily mixed with water used in the purification method of the present embodiment include, but are not limited to, ethers such as tetrahydrofuran and 1,3-dioxolane; methanol, ethanol, isopropanol and the like. Alcohols; Ketones such as acetone and N-methylpyrrolidone; Aliphatic hydrocarbons such as glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether (PGME), and propylene glycol monoethyl ether Is mentioned.
- ethers such as tetrahydrofuran and 1,3-dioxolane
- Alcohols Ketones such as acetone and N-methylpyrrolidone
- Aliphatic hydrocarbons such as glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol mono
- N-methylpyrrolidone, propylene glycol monomethyl ether and the like are preferable, and N-methylpyrrolidone and propylene glycol monomethyl ether are more preferable.
- These solvents can be used alone or in combination of two or more.
- the temperature when the solution (A) is contacted with the acidic aqueous solution is preferably 20 to 90 ° C., more preferably 30 to 80 ° C. Range.
- extraction operation is not specifically limited, For example, after mixing a solution (A) and acidic aqueous solution thoroughly by stirring etc., it is performed by leaving the obtained mixed solution still.
- the metal content contained is transferred to the aqueous phase.
- the acidity of the solution (A) is reduced by this operation, and the deterioration of the compound represented by the general formula (1), the compound represented by the general formula (2), and the resin obtained using these as monomers is suppressed. can do.
- a solution phase containing an organic solvent and at least one selected from the compound represented by the general formula (1), the compound represented by the general formula (2), and a resin obtained using these as monomers is used. And at least one selected from a compound represented by the above general formula (1), a compound represented by the above general formula (2), and a resin obtained using these as monomers by decantation or the like.
- a solution phase containing an organic solvent is recovered.
- the standing time is not particularly limited, but it is preferable to adjust the standing time from the viewpoint of improving the separation between the solution phase containing the organic solvent and the aqueous phase. Usually, the time for standing is 1 minute or longer, preferably 10 minutes or longer, more preferably 30 minutes or longer.
- the extraction process may be performed only once, but it is also effective to repeat the operations of mixing, standing, and separation a plurality of times.
- the solution phase containing the compound or the resin is further brought into contact with water to extract impurities in the compound or the resin (second extraction) Step).
- the compound represented by the above general formula (1) extracted from the aqueous solution and recovered, and represented by the above general formula (2)
- a solution phase containing one or more compounds selected from compounds and resins obtained using these as monomers and an organic solvent is further subjected to an extraction treatment with water.
- the extraction treatment with water is not particularly limited. For example, after the solution phase and water are mixed well by stirring or the like, the obtained mixed solution can be left still.
- the mixed solution after standing includes one or more selected from the compound represented by the general formula (1), the compound represented by the general formula (2), and a resin obtained using these as monomers, and an organic solvent. Since it is separated into a solution phase and an aqueous phase, one or more selected from a compound represented by the above general formula (1), a compound represented by the above general formula (2), and a resin obtained using these as a monomer by decantation or the like And a solution phase containing an organic solvent can be recovered.
- the water used here is water with a low metal content, for example, ion-exchanged water or the like in accordance with the purpose of the present embodiment.
- the extraction process may be performed only once, but it is also effective to repeat the operations of mixing, standing, and separation a plurality of times. Further, the use ratio of both in the extraction process, conditions such as temperature and time are not particularly limited, but they may be the same as those in the contact process with the acidic aqueous solution.
- the above general formula (1) From the obtained compound represented by the above general formula (1), the compound represented by the above general formula (2), and a solution containing one or more selected from resins obtained by using these as monomers and an organic solvent, the above general formula (
- the method for isolating one or more selected from the compound represented by 1), the compound represented by the general formula (2), and a resin obtained using these as monomers is not particularly limited, and is separated by removal under reduced pressure and reprecipitation. , And combinations thereof can be performed by known methods. If necessary, known processes such as a concentration operation, a filtration operation, a centrifugal separation operation, and a drying operation can be performed.
- the resist composition of this embodiment can form an amorphous film by spin coating. Depending on the type of developer used, either a positive resist pattern or a negative resist pattern can be created.
- the dissolution rate of the amorphous film formed by spin-coating the resist composition of the present embodiment with respect to the developer at 23 ° C. is preferably 5 ⁇ / sec or less, and 0.05 to 5 ⁇ / sec More preferably, 0.0005 to 5 K / sec is even more preferable.
- the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and can be a resist.
- the dissolution rate is 0.0005 kg / sec or more, the resolution may be improved.
- the dissolution rate of the amorphous film formed by spin-coating the resist composition of the present embodiment in a developing solution at 23 ° C. is preferably 10 ⁇ / sec or more. When the dissolution rate is 10 ⁇ / sec or more, it is easily dissolved in a developer and more suitable for a resist. If the dissolution rate is 10 ⁇ / sec or more, the resolution may be improved.
- the dissolution rate can be determined by immersing the amorphous film in a developer at a temperature of 23 ° C. for a predetermined time, and measuring the film thickness before and after the immersion by a known method such as visual observation, an ellipsometer, or a QCM method.
- the dissolution rate with respect to is preferably 10 / sec or more.
- the dissolution rate is 10 ⁇ / sec or more, it is easily dissolved in a developer and more suitable for a resist. If the dissolution rate is 10 ⁇ / sec or more, the resolution may be improved. This is presumably because the micro surface portion of the compound represented by the general formula (1) or (2) is dissolved and LER is reduced. There is also an effect of reducing defects.
- the dissolution rate with respect to is preferably 5 ⁇ / sec or less, more preferably 0.05 to 5 ⁇ / sec, still more preferably 0.0005 to 5 ⁇ / sec.
- the dissolution rate is 5 kg / sec or less, the resist is insoluble in the developer and can be a resist.
- the dissolution rate is 0.0005 kg / sec or more, the resolution may be improved.
- the resist composition of the present embodiment contains the compound represented by the general formula (1) or the compound represented by (2) as a solid component.
- the resist composition of this Embodiment may contain both the compound shown by the said General formula (1), and the compound shown by the said General formula (2).
- the resist composition of the present embodiment preferably further contains a solvent in addition to the compound represented by the general formula (1) or (2).
- the solvent used in the resist composition of the present embodiment is not particularly limited.
- ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-propyl ether acetate, ethylene glycol mono-n Ethylene glycol monoalkyl ether acetates such as butyl ether acetate; ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate (PGMEA), propylene glycol Mono-n-propyl ether acetate, propylene glycol mono-n-butyl Propylene glycol monoalkyl ether acetates such as ether acetate; propylene glycol monoalky
- the solvent used in the resist composition of the present embodiment is preferably a safe solvent, more preferably PGMEA, PGME, CHN, CPN, 2-heptanone, anisole, butyl acetate, ethyl propionate and ethyl lactate. And at least one selected from PGMEA, PGME and CHN.
- the amount of the solid component and the amount of the solvent are not particularly limited, but 1 to 80% by mass of the solid component and 20% of the solvent with respect to 100% by mass of the total mass of the solid component and the solvent.
- It is preferably ⁇ 99% by mass, more preferably 1 to 50% by mass of the solid component and 50 to 99% by mass of the solvent, further preferably 2 to 40% by mass of the solid component and 60 to 98% by mass of the solvent, and particularly preferably. Is 2 to 10% by mass of the solid component and 90 to 98% by mass of the solvent.
- the resist composition of the present embodiment may contain at least one selected from the group consisting of an acid generator (C), an acid diffusion controller (E), and other components (F) as other solid components.
- the content of the compound represented by the general formula (1) and / or the compound represented by the general formula (2) is not particularly limited, but the total mass of the solid component (formula A sum of solid components optionally used such as a compound represented by (1), a compound represented by formula (2), an acid generator (C), an acid diffusion controller (E) and other components (F); The same applies hereinafter) to 50 to 99.4% by mass, more preferably 55 to 90% by mass, still more preferably 60 to 80% by mass, and particularly preferably 60 to 70% by mass.
- the resolution is further improved and the line edge roughness (LER) is further reduced.
- the said content is the compound shown by the said General formula (1), and the said General formula ( It is a total amount with the compound shown by 2).
- the resist composition according to the present embodiment directly or indirectly applies an acid by irradiation with radiation selected from visible light, ultraviolet light, excimer laser, electron beam, extreme ultraviolet light (EUV), X-ray, and ion beam. It is preferable to contain one or more acid generators (C) to be generated.
- the content of the acid generator (C) is preferably 0.001 to 49% by mass, more preferably 1 to 40% by mass, based on the total mass of the solid component. Is more preferably from 30% by weight, and particularly preferably from 10 to 25% by weight.
- the acid generation method is not limited as long as an acid is generated in the system. If an excimer laser is used instead of ultraviolet rays such as g-line and i-line, finer processing is possible, and if high-energy rays are used electron beams, extreme ultraviolet rays, X-rays, ion beams, further fine processing is possible. Is possible.
- the acid generator (C) is not particularly limited, and is preferably at least one selected from the group consisting of compounds represented by the following formulas (8-1) to (8-8).
- R 13 s may be the same or different, and each independently represents a hydrogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group.
- X ⁇ represents a sulfonate ion or a halide ion having an alkyl group, an aryl group, a halogen-substituted alkyl group or a halogen-substituted aryl group.
- the compound represented by the formula (8-1) includes triphenylsulfonium trifluoromethanesulfonate, triphenylsulfonium nonafluoro-n-butanesulfonate, diphenyltolylsulfonium nonafluoro-n-butanesulfonate, triphenylsulfonium perfluoro-n- Octane sulfonate, diphenyl-4-methylphenylsulfonium trifluoromethanesulfonate, di-2,4,6-trimethylphenylsulfonium trifluoromethanesulfonate, diphenyl-4-t-butoxyphenylsulfonium trifluoromethanesulfonate, diphenyl-4-t-butoxyphenyl Sulfonium nonafluoro-n-butanesulfonate, diphenyl-4-hydroxyphenylsulfonium trifluoromethane Sulfon
- R 14 s may be the same or different and each independently represents a hydrogen atom, a linear, branched or cyclic alkyl group, a linear, branched or cyclic alkoxy group.
- a group, a hydroxyl group or a halogen atom, X ⁇ is the same as defined above.
- the compound represented by the formula (8-2) includes bis (4-t-butylphenyl) iodonium trifluoromethanesulfonate, bis (4-t-butylphenyl) iodonium nonafluoro-n-butanesulfonate, bis (4-t -Butylphenyl) iodonium perfluoro-n-octanesulfonate, bis (4-tert-butylphenyl) iodonium, p-toluenesulfonate, bis (4-tert-butylphenyl) iodoniumbenzenesulfonate, bis (4-tert-butylphenyl) Iodonium-2-trifluoromethylbenzenesulfonate, bis (4-tert-butylphenyl) iodonium-4-trifluoromethylbenzenesulfonate, bis (4-tert-butylphenyl) iodonium-2,
- Q is an alkylene group, an arylene group or an alkoxylene group
- R 15 is an alkyl group, an aryl group, a halogen-substituted alkyl group or a halogen-substituted aryl group.
- the compound represented by the formula (8-3) includes N- (trifluoromethylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) phthalimide, N- (trifluoromethylsulfonyloxy) diphenylmaleimide, N- ( Trifluoromethylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N- (trifluoromethylsulfonyloxy) naphthylimide, N- (10-camphorsulfonyloxy) Succinimide, N- (10-camphorsulfonyloxy) phthalimide, N- (10-camphorsulfonyloxy) diphenylmaleimide, N- (10-camphorsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2 , 3-Dicarboximide, N (10-camphorsulfonyloxy) naph
- R 16 may be the same or different, and each independently represents an optionally substituted linear, branched or cyclic alkyl group, an optionally substituted aryl group, optionally A substituted heteroaryl group or an optionally substituted aralkyl group.
- the compound represented by the formula (8-4) is diphenyl disulfone, di (4-methylphenyl) disulfone, dinaphthyl disulfone, di (4-tert-butylphenyl) disulfone, di (4-hydroxyphenyl) disulfone. At least one selected from the group consisting of di (3-hydroxynaphthyl) disulfone, di (4-fluorophenyl) disulfone, di (2-fluorophenyl) disulfone and di (4-trifluoromethylphenyl) disulfone It is preferable.
- R 17 may be the same or different and each independently represents an optionally substituted linear, branched or cyclic alkyl group, an optionally substituted aryl group, optionally A substituted heteroaryl group or an optionally substituted aralkyl group.
- the compound represented by the formula (8-5) is ⁇ - (methylsulfonyloxyimino) -phenylacetonitrile, ⁇ - (methylsulfonyloxyimino) -4-methoxyphenylacetonitrile, ⁇ - (trifluoromethylsulfonyloxyimino).
- R 18 may be the same or different and each independently represents a halogenated alkyl group having one or more chlorine atoms and one or more bromine atoms.
- the halogenated alkyl group preferably has 1 to 5 carbon atoms.
- R 19 and R 20 are each independently a C1-3 alkyl group such as a methyl group, an ethyl group, an n-propyl group, an isopropyl group; a cyclopentyl group, cyclohexyl A cycloalkyl group such as a group; a C1-3 alkoxyl group such as a methoxy group, an ethoxy group, and a propoxy group; or an aryl group such as a phenyl group, a toluyl group, and a naphthyl group; and preferably a C6-10 aryl group.
- L 19 and L 20 are each independently an organic group having a 1,2-naphthoquinonediazide group.
- Specific examples of the organic group having a 1,2-naphthoquinonediazide group include a 1,2-naphthoquinonediazide-4-sulfonyl group, a 1,2-naphthoquinonediazide-5-sulfonyl group, and a 1,2-naphthoquinonediazide- Preferred examples include 1,2-quinonediazidosulfonyl groups such as a 6-sulfonyl group.
- 1,2-naphthoquinonediazido-4-sulfonyl group and 1,2-naphthoquinonediazide-5-sulfonyl group are preferable.
- s 1 is an integer of 1 to 3
- s 2 is an integer of 0 to 4
- J 19 is a single bond, a polymethylene group of C1 ⁇ 4, a cycloalkylene group, a phenylene group, a group represented by the following formula (8-7-1), a carbonyl group, an ester group, an amide group or an ether group, Y 19 Is a hydrogen atom, an alkyl group or an aryl group, and X 20 is independently a group represented by the following formula (8-8-1).
- Z 22 each independently represents an alkyl group, a cycloalkyl group or an aryl group, R 22 represents an alkyl group, a cycloalkyl group or an alkoxyl group, and r represents 0 to 3) Is an integer.
- Other acid generators include bis (p-toluenesulfonyl) diazomethane, bis (2,4-dimethylphenylsulfonyl) diazomethane, bis (tert-butylsulfonyl) diazomethane, bis (n-butylsulfonyl) diazomethane, bis (isobutylsulfonyl) ) Diazomethane, bis (isopropylsulfonyl) diazomethane, bis (n-propylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (isopropylsulfonyl) diazomethane, 1,3-bis (cyclohexylsulfonylazomethylsulfonyl) propane, 1, 4 -Bis (phenylsulfonylazomethylsulfonyl) butane, 1,6
- an acid generator having an aromatic ring is preferable, and an acid generator represented by the formula (8-1) or (8-2) is more preferable.
- X in formula (8-1) or (8-2) - is an aryl group or halogen-substituted aryl group acid generator having a sulfonic acid ion is more preferably having the acid generator having a sulfonate ion having an aryl group
- diphenyltrimethylphenylsulfonium p-toluenesulfonate, triphenylsulfonium p-toluenesulfonate, triphenylsulfonium trifluoromethanesulfonate, and triphenylsulfonium nonafluoromethanesulfonate are particularly preferred.
- LER can be reduced by using the acid generator.
- the acid generator (C) can be used alone or in combination of two or more.
- the resist composition of the present embodiment controls acid diffusion in the resist film by controlling the diffusion of the acid generated from the acid generator by irradiation to prevent undesirable chemical reactions in the unexposed areas.
- An agent (E) may be contained.
- an acid diffusion controller (E) By using such an acid diffusion controller (E), the storage stability of the resist composition is improved. Further, the resolution is further improved, and a change in the line width of the resist pattern due to fluctuations in the holding time before radiation irradiation and the holding time after radiation irradiation can be suppressed, and the process stability is extremely excellent.
- Such an acid diffusion controller (E) is not particularly limited, and examples thereof include radiation-decomposable basic compounds such as a nitrogen atom-containing basic compound, a basic sulfonium compound, and a basic iodonium compound.
- the acid diffusion controller (E) can be used alone or in combination of two or more.
- the acid diffusion controller is not particularly limited, and examples thereof include nitrogen-containing organic compounds and basic compounds that are decomposed by exposure.
- the nitrogen-containing organic compound is not particularly limited, and for example, the following general formula (11):
- nitrogen-containing compound (I) a diamino compound having two nitrogen atoms in the same molecule
- nitrogen-containing compound (II) a diamino compound having two nitrogen atoms in the same molecule
- nitrogen-containing compound (II) a diamino compound having two nitrogen atoms in the same molecule
- nitrogen-containing compound (III) polyamino compounds and polymers having at least one
- amide group-containing compounds amide group-containing compounds
- urea compounds urea compounds
- nitrogen-containing heterocyclic compounds nitrogen-containing heterocyclic compounds
- an acid diffusion control agent (E) may be used individually by 1 type, and may use 2 or more types together.
- R 61 , R 62 and R 63 each independently represent a hydrogen atom, a linear, branched or cyclic alkyl group, an aryl group or an aralkyl group.
- the alkyl group, aryl group or aralkyl group may be unsubstituted or substituted with a hydroxyl group or the like.
- the linear, branched or cyclic alkyl group is not particularly limited, and examples thereof include C1-15, preferably 1-10, and specifically include a methyl group, an ethyl group, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, t-butyl, n-pentyl, neopentyl, n-hexyl, texyl, n-heptyl, n- Examples include octyl group, n-ethylhexyl group, n-nonyl group, n-decyl group and the like.
- examples of the aryl group include those having C6-12, and specific examples include a phenyl group, a tolyl group, a xylyl group, a cumenyl group, and a 1-naphthyl group.
- the aralkyl group is not particularly limited, and examples thereof include C7-19, preferably 7-13, and specifically include benzyl group, ⁇ -methylbenzyl group, phenethyl group, naphthylmethyl group and the like. It is done.
- the nitrogen-containing compound (I) is not particularly limited. Specifically, for example, n-hexylamine, n-heptylamine, n-octylamine, n-nonylamine, n-decylamine, n-dodecylamine, cyclohexyl Mono (cyclo) alkylamines such as amines; di-n-butylamine, di-n-pentylamine, di-n-hexylamine, di-n-heptylamine, di-n-octylamine, di-n-nonylamine Di (cyclo) alkylamines such as di-n-decylamine, methyl-n-dodecylamine, di-n-dodecylmethyl, cyclohexylmethylamine, dicyclohexylamine; triethylamine, tri-n-propylamine, tri-n- Butylamine, tri-n-p
- the nitrogen-containing compound (II) is not particularly limited. Specifically, for example, ethylenediamine, N, N, N ′, N′-tetramethylethylenediamine, N, N, N ′, N′-tetrakis (2 -Hydroxypropyl) ethylenediamine, tetramethylenediamine, hexamethylenediamine, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether, 4,4'-diaminobenzophenone, 4,4'-diaminodiphenylamine, 2,2- Bis (4-aminophenyl) propane, 2- (3-aminophenyl) -2- (4-aminophenyl) propane, 2- (4-aminophenyl) -2- (3-hydroxyphenyl) propane, 2- ( 4-aminophenyl) -2- (4-hydroxyphenyl) propane, 1,4-bis [1- (4 Aminophen
- the nitrogen-containing compound (III) is not particularly limited, and specific examples thereof include polyethyleneimine, polyallylamine, N- (2-dimethylaminoethyl) acrylamide polymer, and the like.
- the amide group-containing compound is not particularly limited, and specifically, for example, formamide, N-methylformamide, N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, propionamide, Examples thereof include benzamide, pyrrolidone, N-methylpyrrolidone and the like.
- the urea compound is not particularly limited. Specifically, for example, urea, methylurea, 1,1-dimethylurea, 1,3-dimethylurea, 1,1,3,3-tetramethylurea, 1,3 -Diphenylurea, tri-n-butylthiourea and the like can be mentioned.
- the nitrogen-containing heterocyclic compound is not particularly limited, and specifically, for example, imidazoles such as imidazole, benzimidazole, 4-methylimidazole, 4-methyl-2-phenylimidazole, 2-phenylbenzimidazole; Pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, 2-methyl-4-phenylpyridine, nicotine, nicotinic acid, nicotinamide, Pyridines such as quinoline, 8-oxyquinoline, acridine; and pyrazine, pyrazole, pyridazine, quinosaline, purine, pyrrolidine, piperidine, morpholine, 4-methylmorpholine, piperazine, 1,4-dimethylpiperazine, 1,4-diazabicyclo [2.2. ] Octane and the like can be mentioned.
- imidazoles such as imi
- the radiolytic basic compound is not particularly limited, and for example, the following general formula (12-1): And the following general formula (12-2):
- R 71 , R 72 , R 73 , R 74 and R 75 are each independently a hydrogen atom, a C1-6 alkyl group, or a C1-6 alkoxyl.
- Z ⁇ represents HO ⁇ , R—COO ⁇ (wherein R represents a C1-6 alkyl group, a C6-11 aryl group, or a C7-12 alkaryl group) or the following general formula (12-3) :
- the radiation-decomposable basic compound are not particularly limited.
- the content of the acid diffusion controller (E) is preferably 0.001 to 49% by mass, more preferably 0.01 to 10% by mass, and still more preferably 0.01 to 5% by mass, based on the total mass of the solid component. 0.01 to 3% by mass is particularly preferable.
- the content of the acid diffusion control agent (E) is within the above range, it is possible to further suppress deterioration in resolution, pattern shape, dimensional fidelity, and the like. Furthermore, even if the holding time from electron beam irradiation to heating after radiation irradiation becomes longer, the shape of the pattern upper layer portion does not deteriorate. Moreover, a fall of a sensitivity, the developability of an unexposed part, etc.
- an acid diffusion control agent (E) is 10 mass% or less. Further, by using such an acid diffusion control agent, the storage stability of the resist composition is improved, and the resolution is improved. Changes in the line width of the resist pattern can be suppressed, and the process stability is extremely excellent.
- a dissolution accelerator such as an agent and organic carboxylic acid or phosphorus oxo acid or derivatives thereof can be added.
- the low molecular weight dissolution accelerator increases the solubility, and It is a component having an action of appropriately increasing the dissolution rate of the compound, and can be used within a range not impairing the effects of the present invention.
- the dissolution accelerator include low molecular weight phenolic compounds such as bisphenols and tris (hydroxyphenyl) methane. These dissolution promoters can be used alone or in admixture of two or more.
- the content of the dissolution accelerator is appropriately adjusted according to the type of the compound represented by the above formula (1) and / or the compound represented by the formula (2) to be used, but it is 0 to 49 of the total mass of the solid component. % By mass is preferable, 0 to 5% by mass is more preferable, 0 to 1% by mass is further preferable, and 0% by mass is particularly preferable.
- dissolution control agent When the compound represented by the above formula (1) and / or the compound represented by the formula (2) has too high solubility in a developer, the dissolution control agent controls the solubility to increase the dissolution rate during development. It is a component having an action of moderately decreasing. As such a dissolution control agent, those that do not chemically change in steps such as baking of resist film, irradiation with radiation, and development are preferable.
- the dissolution control agent is not particularly limited, and examples thereof include aromatic hydrocarbons such as phenanthrene, anthracene, and acenaphthene; ketones such as acetophenone, benzophenone, and phenylnaphthyl ketone; sulfones such as methylphenylsulfone, diphenylsulfone, and dinaphthylsulfone. And the like. These dissolution control agents can be used alone or in combination of two or more.
- the content of the dissolution control agent is not particularly limited, and is appropriately adjusted according to the type of the compound represented by the formula (1) and / or the compound represented by the formula (2) to be used.
- the mass is preferably 0 to 49% by mass, more preferably 0 to 5% by mass, still more preferably 0 to 1% by mass, and particularly preferably 0% by mass.
- the sensitizer absorbs the energy of the irradiated radiation and transmits the energy to the acid generator (C), thereby increasing the amount of acid generated and improving the apparent sensitivity of the resist. It is a component to be made.
- a sensitizer is not particularly limited, and examples thereof include benzophenones, biacetyls, pyrenes, phenothiazines, and fluorenes. These sensitizers can be used alone or in combination of two or more.
- the content of the sensitizer is appropriately adjusted according to the type of the compound represented by the formula (1) and / or the compound represented by the formula (2) to be used, but is 0 to 49 of the total mass of the solid component. % By mass is preferable, 0 to 5% by mass is more preferable, 0 to 1% by mass is further preferable, and 0% by mass is particularly preferable.
- the surfactant is a component having an action of improving the coating property and striation of the resist composition of the present embodiment, the developing property of the resist, and the like.
- a surfactant is not particularly limited, and may be anionic, cationic, nonionic or amphoteric.
- a preferred surfactant is a nonionic surfactant.
- the nonionic surfactant has a good affinity with the solvent used in the production of the resist composition and is more effective. Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers and higher fatty acid diesters of polyethylene glycol, but are not particularly limited.
- F-top (manufactured by Gemco), Mega-Fac (manufactured by Dainippon Ink and Chemicals), Florard (manufactured by Sumitomo 3M), Asahi Guard, Surflon (manufactured by Asahi Glass)
- Examples include Pepol (manufactured by Toho Chemical Industry Co., Ltd.), KP (manufactured by Shin-Etsu Chemical Co., Ltd.), polyflow (manufactured by Kyoeisha Yushi Chemical Co., Ltd.), and the like.
- the content of the surfactant is not particularly limited and is appropriately adjusted according to the type of the compound represented by the formula (1) and / or the compound represented by the formula (2) to be used.
- the mass is preferably 0 to 49% by mass, more preferably 0 to 5% by mass, still more preferably 0 to 1% by mass, and particularly preferably 0% by mass.
- the resist composition of the present embodiment further contains, as an optional component, an organic carboxylic acid or an oxo acid of phosphorus or a derivative thereof for the purpose of preventing sensitivity deterioration or improving the resist pattern shape, retention stability, and the like. Also good. In addition, it can use together with an acid diffusion control agent, and may be used independently.
- the organic carboxylic acid is not particularly limited, and for example, malonic acid, citric acid, malic acid, succinic acid, benzoic acid, salicylic acid and the like are preferable.
- Examples of the oxo acid of phosphorus or derivatives thereof include phosphoric acid, phosphoric acid di-n-butyl ester, phosphoric acid such as diphenyl ester, or derivatives thereof; phosphonic acid, phosphonic acid dimethyl ester, phosphonic acid di- Derivatives such as phosphonic acids such as n-butyl ester, phenylphosphonic acid, phosphonic acid diphenyl ester, phosphonic acid dibenzyl ester or the like; phosphinic acids such as phosphinic acid, phenylphosphinic acid and derivatives thereof. Of these, phosphonic acid is particularly preferred.
- the organic carboxylic acid or phosphorus oxo acid or derivative thereof may be used alone or in combination of two or more.
- the content of the organic carboxylic acid or phosphorus oxo acid or derivative thereof is appropriately adjusted according to the type of the compound represented by the formula (1) and / or the compound represented by the formula (2) to be used. 0 to 49% by mass of the total mass of the components is preferable, 0 to 5% by mass is more preferable, 0 to 1% by mass is further preferable, and 0% by mass is particularly preferable.
- additives Furthermore, in the resist composition of the present embodiment, one or two additives other than the dissolution control agent, the sensitizer, and the surfactant are added as necessary within the range not impairing the object of the present invention. More than seeds can be contained.
- Such additives are not particularly limited, and examples thereof include dyes, pigments, and adhesion aids.
- it is preferable to contain a dye or pigment because the latent image in the exposed area can be visualized and the influence of halation during exposure can be reduced.
- an adhesion assistant since the adhesion to the substrate can be improved.
- additives are not particularly limited, and examples thereof include an antihalation agent, a storage stabilizer, an antifoaming agent, a shape improving agent, and the like, specifically, 4-hydroxy-4′-methylchalcone and the like. be able to.
- the total content of the optional component (F) is preferably 0 to 49% by mass, more preferably 0 to 5% by mass, still more preferably 0 to 1% by mass, and particularly preferably 0% by mass based on the total mass of the solid component.
- the compound represented by the above formula (1) and / or the compound represented by the formula (2), an acid generator (C), an acid diffusion controller (E), an optional component (F ) Content is a solid % By weight, preferably 50-99.4 / 0.001-49 / 0.001-49 / 0-49, more preferably 55-90 / 1-40 / 0.01-10 / 0-5 More preferably, it is 60 to 80/3 to 30 / 0.01 to 5/0 to 1, and particularly preferably 60 to 70/10 to 25 / 0.01 to 3/0.
- the content ratio of each component is selected from each range so that the sum is 100% by mass. When the content ratio is set, the performance such as sensitivity, resolution, developability and the like is further improved.
- the method for preparing the resist composition of the present embodiment is not particularly limited.
- each component is dissolved in a solvent at the time of use to form a uniform solution, and then, for example, a filter having a pore diameter of about 0.2 ⁇ m is used as necessary. And the like.
- Examples of the solvent used in the preparation of the resist composition of the present embodiment include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol mono-n-propyl ether acetate, ethylene glycol mono-n- Ethylene glycol monoalkyl ether acetates such as butyl ether acetate; ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol mono-n- Propyl ether acetate, propylene glycol mono-n-butyl ether acetate Propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether, propylene glycol monoalkyl ethers such as propylene glycol monoethyl ether; methyl lactate,
- Lactate esters aliphatic carboxylic acid esters such as methyl acetate, ethyl acetate, n-propyl acetate, n-butyl acetate, n-amyl acetate, n-hexyl acetate, methyl propionate, ethyl propionate; Methyl propionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 3-methoxy-2-methylpropionate, 3-methoxybutyl acetate, 3-methyl-3-methoxy Other esters such as butyl acetate, butyl 3-methoxy-3-methylpropionate, butyl 3-methoxy-3-methylbutyrate, methyl acetoacetate, methyl pyruvate and ethyl pyruvate; aromatic carbonization such as toluene and xylene Hydrogens; ketones such as 2-h
- the resist composition of the present embodiment can contain a resin as long as the object of the present invention is not impaired.
- the resin is not particularly limited, and examples thereof include novolak resins, polyvinylphenols, polyacrylic acid, polyvinyl alcohol, styrene-maleic anhydride resins, and polymers containing acrylic acid, vinyl alcohol, or vinyl phenol as monomer units. Or these derivatives are mentioned.
- the content of the resin is not particularly limited, and is appropriately adjusted according to the type of the compound represented by the above formula (1) and / or the compound represented by the formula (2) to be used, but per 100 parts by mass of the compound, 30 mass parts or less are preferable, More preferably, it is 10 mass parts or less, More preferably, it is 5 mass parts or less, Most preferably, it is 0 mass part.
- the method for forming the resist pattern of the present embodiment is not particularly limited, and as a suitable method, a step of applying the above-described resist composition on the substrate to form a resist film, and exposing the formed resist film Examples include a method including a step and a step of developing the exposed resist film to form a resist pattern.
- the resist pattern of this embodiment can also be formed as an upper layer resist in a multilayer process.
- the method for forming a specific resist pattern is not particularly limited, and examples thereof include the following methods.
- a resist film is formed by applying the resist composition onto a conventionally known substrate by a coating means such as spin coating, cast coating, roll coating or the like.
- the conventionally known substrate is not particularly limited, and examples thereof include a substrate for electronic parts and a substrate on which a predetermined wiring pattern is formed. More specifically, although not particularly limited, for example, a silicon substrate, a metal substrate such as copper, chromium, iron, and aluminum, a glass substrate, and the like can be given.
- the material for the wiring pattern is not particularly limited, and examples thereof include copper, aluminum, nickel, and gold. If necessary, an inorganic film and / or an organic film may be provided on the substrate.
- the inorganic film is not particularly limited, and examples thereof include an inorganic antireflection film (inorganic BARC). Although it does not specifically limit as an organic film
- the coated substrate is heated as necessary.
- the heating conditions vary depending on the composition of the resist composition, but are preferably 20 to 250 ° C., more preferably 20 to 150 ° C. Heating may improve the adhesion of the resist to the substrate, which is preferable.
- the resist film is exposed to a desired pattern with any radiation selected from the group consisting of visible light, ultraviolet light, excimer laser, electron beam, extreme ultraviolet light (EUV), X-ray, and ion beam.
- the exposure conditions and the like are appropriately selected according to the composition of the resist composition.
- the heating conditions vary depending on the composition of the resist composition, but are preferably 20 to 250 ° C., more preferably 20 to 150 ° C.
- the exposed resist film is developed with a developer to form a predetermined resist pattern.
- a solvent having a solubility parameter (SP value) close to that of the compound represented by the above formula (1) and / or the compound represented by the formula (2) it is preferable to select a solvent having a solubility parameter (SP value) close to that of the compound represented by the above formula (1) and / or the compound represented by the formula (2) to be used.
- a polar solvent such as a solvent, an alcohol solvent, an amide solvent, or an ether solvent, a hydrocarbon solvent, or an alkaline aqueous solution can be used.
- polar solvent such as a solvent, an alcohol solvent, an amide solvent, or an ether solvent, a hydrocarbon solvent, or an alkaline aqueous solution can be used.
- polar solvents such as ketone solvents, ester solvents, alcohol solvents, amide solvents, ether solvents, etc.
- a hydrocarbon solvent a negative resist pattern is obtained.
- the ketone solvent is not particularly limited, and examples thereof include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, acetone, 4-heptanone, 1-hexanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, Examples include phenylacetone, methyl ethyl ketone, methyl isobutyl ketone, acetyl acetone, acetonyl acetone, ionone, diacetyl alcohol, acetyl carbinol, acetophenone, methyl naphthyl ketone, isophorone, and propylene carbonate.
- the ester solvent is not particularly limited.
- the alcohol solvent is not particularly limited, and for example, methyl alcohol, ethyl alcohol, n-propyl alcohol, isopropyl alcohol (2-propanol), n-butyl alcohol, sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n Alcohols such as hexyl alcohol, 4-methyl-2-pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol; glycol solvents such as ethylene glycol, diethylene glycol, triethylene glycol; ethylene glycol monomethyl ether, propylene Glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monoethyl ether, diethylene glycol monomethyl ether, tri Chi glycol monoethyl ether, and triethylene glycol monoethyl ether and methoxymethyl butanol.
- the ether solvent is not particularly limited, and examples thereof include dioxane, tetrahydrofuran and the like in addition to the glycol ether solvent.
- the amide solvent is not particularly limited, and for example, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazo Lysinone etc. can be used.
- the hydrocarbon solvent is not particularly limited, and examples thereof include aromatic hydrocarbon solvents such as toluene and xylene; aliphatic hydrocarbon solvents such as pentane, hexane, octane and decane.
- the water content of the developer as a whole is preferably less than 70% by mass, more preferably less than 50% by mass, and more preferably less than 30% by mass. Preferably, it is more preferably less than 10% by mass, and it is particularly preferable that it contains substantially no water. That is, the content of the organic solvent with respect to the developer is not particularly limited, and is preferably 30% by mass or more and 100% by mass or less, more preferably 50% by mass or more and 100% by mass or less, based on the total amount of the developer. More preferably, they are 70 mass% or more and 100 mass% or less, More preferably, they are 90 mass% or more and 100 mass% or less, Especially preferably, they are 95 mass% or more and 100 mass% or less.
- the aqueous alkali solution is not particularly limited, and examples thereof include mono-, di- or trialkylamines, mono-, di- or trialkanolamines, heterocyclic amines, tetramethylammonium hydroxide (TMAH), choline, and the like. Of the alkaline compound.
- the developer is a developer containing at least one solvent selected from ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents, such as resist pattern resolution and roughness. It is preferable for improving the resist performance.
- the vapor pressure of the developer is not particularly limited. For example, at 20 ° C., 5 kPa or less is preferable, 3 kPa or less is more preferable, and 2 kPa or less is particularly preferable.
- the vapor pressure of the developing solution is set to 5 kPa or less, evaporation of the developing solution on the substrate or in the developing cup is suppressed, temperature uniformity in the wafer surface is improved, and as a result, dimensional uniformity in the wafer surface is improved. It improves.
- vapor pressure of 5 kPa or less examples having a vapor pressure of 5 kPa or less include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutyl ketone, cyclohexanone, methylcyclohexanone, phenylacetone, methyl Ketone solvents such as isobutyl ketone; butyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3-ethoxypropionate, 3-methoxy Esters such as butyl acetate, 3-methyl-3-methoxybutyl acetate, butyl formate, propyl formate, ethyl lactate, butyl lactate
- Specific examples having a vapor pressure of 2 kPa or less, which is a particularly preferable range, include 1-octanone, 2-octanone, 1-nonanone, 2-nonanone, 4-heptanone, 2-hexanone, diisobutyl ketone, cyclohexanone, and methylcyclohexanone.
- Ketone solvents such as phenylacetone; butyl acetate, amyl acetate, propylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl-3-ethoxypropionate, 3- Ester solvents such as methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, ethyl lactate, butyl lactate and propyl lactate; n-butyl alcohol alcohol solvents such as sec-butyl alcohol, tert-butyl alcohol, isobutyl alcohol, n-hexyl alcohol, 4-methyl-2-pentanol, n-heptyl alcohol, n-octyl alcohol, n-decanol; ethylene glycol, diethylene glycol Glycol solvents such as triethylene glycol; glycol ether
- the surfactant is not particularly limited, and for example, ionic or nonionic fluorine-based and / or silicon-based surfactants can be used.
- fluorine and / or silicon surfactants include, for example, JP-A-62-36663, JP-A-61-226746, JP-A-61-226745, JP-A-62-170950.
- Nonionic surfactant it is a nonionic surfactant.
- a fluorochemical surfactant or a silicon-type surfactant is more preferable to use.
- the amount of the surfactant used is usually 0.001 to 5% by mass, preferably 0.005 to 2% by mass, and more preferably 0.01 to 0.5% by mass with respect to the total amount of the developer.
- a developing method for example, a method in which a substrate is immersed in a tank filled with a developer for a certain period of time (dip method), a method in which the developer is raised on the surface of the substrate by surface tension and is left stationary for a certain time (paddle) Method), a method of spraying the developer on the substrate surface (spray method), a method of continuously applying the developer while scanning the developer application nozzle at a constant speed on a substrate rotating at a constant speed (dynamic dispensing method) ) Etc.
- the time for developing the pattern is not particularly limited, but is preferably 10 seconds to 90 seconds.
- a step of stopping development may be performed while substituting with another solvent.
- the rinsing liquid used in the rinsing step after development is not particularly limited as long as the resist pattern cured by crosslinking is not dissolved, and a solution or water containing a general organic solvent can be used.
- a rinsing liquid containing at least one organic solvent selected from hydrocarbon solvents, ketone solvents, ester solvents, alcohol solvents, amide solvents and ether solvents.
- a cleaning step is performed using a rinse solution containing at least one organic solvent selected from the group consisting of ketone solvents, ester solvents, alcohol solvents, and amide solvents.
- a cleaning step is performed using a rinse solution containing an alcohol solvent or an ester solvent. Even more preferably, after the development, a step of washing with a rinsing solution containing a monohydric alcohol is performed. Particularly preferably, after the development, a step of washing with a rinsing solution containing a monohydric alcohol of C5 or higher is performed.
- the time for rinsing the pattern is not particularly limited, but is preferably 10 seconds to 90 seconds.
- the monohydric alcohol used in the rinsing step after development is not particularly limited, and examples thereof include linear, branched, and cyclic monohydric alcohols.
- 1-butanol, 2 -Butanol, 3-methyl-1-butanol, tert-butyl alcohol 1-pentanol, 2-pentanol, 1-hexanol, 4-methyl-2-pentanol, 1-heptanol, 1-octanol, 2-hexanol , Cyclopentanol, 2-heptanol, 2-octanol, 3-hexanol, 3-heptanol, 3-octanol, 4-octanol and the like
- particularly preferable C5 or higher monohydric alcohols include 1-hexanol, 2-hexanol, 4-methyl-2-pentanol, 1-pentanol, 3-methyl 1-butanol and the like can be used.
- a plurality of the above components may be mixed, or may be used by mixing with an organic solvent other than the above.
- the water content in the rinsing liquid is not particularly limited, but is preferably 10% by mass or less, more preferably 5% by mass or less, and particularly preferably 3% by mass or less. By setting the water content to 10% by mass or less, better development characteristics can be obtained.
- the vapor pressure of the rinse liquid used after development is preferably 0.05 kPa or more and 5 kPa or less, more preferably 0.1 kPa or more and 5 kPa or less, and further preferably 0.12 kPa or more and 3 kPa or less at 20 ° C.
- An appropriate amount of a surfactant can be added to the rinse solution.
- the developed wafer is cleaned using a rinsing solution containing the organic solvent.
- the method of the cleaning treatment is not particularly limited. For example, a method of continuously applying a rinse liquid onto a substrate rotating at a constant speed (rotary coating method), or immersing the substrate in a tank filled with the rinse liquid for a certain period of time. A method (dip method), a method of spraying a rinsing liquid onto the substrate surface (spray method), etc. can be applied.
- a cleaning process is performed by a spin coating method, and after cleaning, the substrate is rotated at a speed of 2000 rpm to 4000 rpm. It is preferable to rotate and remove the rinse liquid from the substrate.
- the pattern wiring board is obtained by etching.
- the etching can be performed by a known method such as dry etching using plasma gas and wet etching using an alkali solution, a cupric chloride solution, a ferric chloride solution, or the like.
- the plating method is not particularly limited, and examples thereof include copper plating, solder plating, nickel plating, and gold plating.
- the residual resist pattern after etching can be stripped with an organic solvent.
- organic solvent For example, PGMEA (propylene glycol monomethyl ether acetate), PGME (propylene glycol monomethyl ether), EL (ethyl lactate) etc. are mentioned.
- peeling method For example, the immersion method, a spray system, etc. are mentioned.
- the wiring board on which the resist pattern is formed may be a multilayer wiring board or may have a small diameter through hole.
- the wiring board can also be formed by a method of depositing a metal in vacuum after forming a resist pattern and then dissolving the resist pattern with a solution, that is, a lift-off method.
- the resist film was washed with ultrapure water for 30 seconds and dried to form a positive resist pattern.
- the line and space was observed with a scanning electron microscope (S-4800, manufactured by Hitachi High-Technology Corporation), and the reactivity of the resist composition by electron beam irradiation was evaluated.
- reaction solution was added to 1000 g of pure water, and then extracted and concentrated with ethyl acetate to obtain a solution.
- the resulting solution was separated by column chromatography and washed with chloroform to obtain 4.2 g of the objective compound (A-1) represented by the following formula (A-1).
- A-1 represented by the following formula (A-1).
- the obtained compound (A-1) was subjected to NMR measurement under the above-described measurement conditions. As a result, the following peaks were found and confirmed to have a chemical structure represented by the following formula (A-1).
- the reaction liquid was concentrated, 100 g of pure water was added to the concentrated liquid to precipitate a reaction product, cooled to room temperature, and then filtered to separate a solid.
- the obtained solid was filtered and dried, followed by separation and purification by column chromatography to obtain 2 g of the target compound (A-1-BOC) represented by the following formula (A-1-BOC).
- the obtained compound (A-1-BOC) was measured to have a molecular weight of 716 by the above method.
- the obtained compound (A-1-BOC) was subjected to NMR measurement under the above-mentioned measurement conditions. As a result, the following peak was found and confirmed to have a chemical structure of the following formula (A-1-BOC) did.
- reaction liquid was concentrated, 100 g of pure water was added to the concentrated liquid to precipitate a reaction product, cooled to room temperature, and then filtered to separate a solid.
- the obtained solid is filtered and dried, and then separated and purified by column chromatography to obtain 1.8 g of the target compound (A-1-MeBOC) represented by the following formula (A-1-MeBOC). It was.
- the obtained compound (A-1-MeBOC) was measured to have a molecular weight of 694 by the above method.
- the obtained compound (A-1-MeBOC) was subjected to NMR measurement under the above-mentioned measurement conditions.
- reaction solution was added to 1000 g of pure water, and then extracted and concentrated with ethyl acetate to obtain a solution.
- the resulting solution was separated by column chromatography and washed with chloroform to obtain 2.0 g of the desired compound (A-3) represented by the following formula (A-3).
- the molecular weight was measured by the aforementioned method. As a result, it was 562.
- the obtained compound (A-3) was subjected to NMR measurement under the above-described measurement conditions. As a result, the following peak was found and confirmed to have a chemical structure represented by the following formula (A-3).
- the reaction liquid was concentrated, 100 g of pure water was added to the concentrated liquid to precipitate a reaction product, cooled to room temperature, and then filtered to separate a solid.
- the obtained solid is filtered and dried, and then separated and purified by column chromatography to obtain 1.6 g of the target compound (A-3-BOC) represented by the following formula (A-3-BOC). It was.
- the molecular weight was measured by the above method and found to be 862.
- the obtained compound (A-3-BOC) was subjected to NMR measurement under the above-mentioned measurement conditions. As a result, the following peak was found and confirmed to have a chemical structure of the following formula (A-3-BOC) did. ⁇ (ppm) 7.4 to 8.7 (12H, Ph—H), 6.4 (1H, C—H), 3.8 (3H, O—C—H), 1.6 (27H, C -C H 3 )
- reaction liquid was concentrated, 100 g of pure water was added to the concentrated liquid to precipitate a reaction product, cooled to room temperature, and then filtered to separate a solid.
- the obtained solid is filtered, dried, and then separated and purified by column chromatography to obtain 1.8 g of the target compound (A-3-MeBOC) represented by the following formula (A-3-MeBOC). It was.
- the obtained compound (A-3-MeBOC) was measured to have a molecular weight of 904 by the above method.
- the obtained compound (A-3-MeBOC) was subjected to NMR measurement under the above-mentioned measurement conditions.
- the obtained solid was filtered and dried, followed by separation and purification by column chromatography to obtain 7.2 g of a target resin (R1A-1) having a structure represented by the following formula (R1A-1). .
- the molecular weight in terms of polystyrene was measured by the aforementioned method.
- Mn 831
- Mw 1846
- Mw / Mn 2.22.
- the obtained resin (R1A-1) was subjected to NMR measurement under the above measurement conditions. As a result, the following peaks were found and confirmed to have a chemical structure represented by the following formula (R1A-1). ⁇ (ppm) 9.7 (2H, OH), 7.0 to 8.5 (12H, Ph—H), 6.5 (1H, C—H), 4.1 (2H, —CH 2) )
- the obtained resin (R2A-1) was subjected to NMR measurement under the above measurement conditions. As a result, the following peaks were found and confirmed to have the chemical structure of the following formula (R2A-1). ⁇ (ppm) 9.7 (2H, OH), 7.0 to 8.8 (21H, Ph—H), 6.6 (1H, C—H), 4.5 (1H, —CH) Furthermore, the solubility of the obtained resin (R2A-1) in a safe solvent was evaluated by the above method. The results are shown in Table 1.
- the reaction liquid was concentrated, and 50 g of pure water was added to the concentrated liquid to precipitate a reaction product.
- the solid was separated by filtration.
- the obtained solid was filtered and dried, followed by separation and purification by column chromatography to obtain 0.2 g of a target compound (XBisN-1) represented by the following formula (XBisN-1).
- XBisN-1 represented by the following formula (XBisN-1).
- the reaction liquid was concentrated, 100 g of pure water was added to the concentrated liquid to precipitate a reaction product, cooled to room temperature, and then filtered to separate a solid.
- the obtained solid was filtered and dried, followed by separation and purification by column chromatography to obtain 2 g of the target compound (XBisN-1-BOC) represented by the following formula (XBisN-1-BOC).
- the obtained compound (XBisN-1-BOC) was measured to have a molecular weight of 666.
- the obtained compound (XBisN-1-BOC) was subjected to NMR measurement under the above-mentioned measurement conditions. As a result, the following peak was found and confirmed to have the chemical structure of the following formula (XBisN-1-BOC) did.
- resorcinol 22 g, 0.2 mol manufactured by Kanto Chemical Co., Ltd. was placed in a four-necked flask (1000 mL) equipped with a well-dried dropping funnel substituted with nitrogen, Jim Roth condenser, thermometer, and stirring blade. ), The obtained compound (CHBAL) (46.0 g, 0.2 mol) and dehydrated ethanol (200 mL) were added to prepare an ethanol solution. This solution was heated to 85 ° C. with a mantle heater while stirring. Next, 75 mL of concentrated hydrochloric acid (35%) was added dropwise to the solution over 30 minutes using a dropping funnel, and the solution was subsequently stirred at 85 ° C.
- the storage stability of the obtained resist composition was evaluated by the above method. Moreover, thin film formation was evaluated using the resist composition of a uniform state. The obtained results are shown in Table 1.
- the pattern was evaluated by the above method using the resist compositions obtained in Example 1 and Example 2.
- a good resist pattern was obtained by irradiation with an electron beam with a 1: 1 line and space setting at intervals of 50 nm.
- the compound satisfying the requirements of the present invention has high solubility in a safe solvent
- the resist composition containing the compound is a resist containing the comparative compounds (XBisN-1-BOC) and (CR-1-BOC).
- the storage stability was good and a resist pattern shape could be imparted.
- compounds other than the compounds described in the examples also exhibit the same effect.
- Example 9 Production of PGMEA solution of compound represented by general formula (4) with reduced metal content (Example 9) A 1000 mL four-necked flask (bottom mold) was charged with 150 g of a solution (2.5% by mass) in which A-1-BOC was dissolved in PGMEA, and heated to 80 ° C. with stirring. Next, 37.5 g of an aqueous oxalic acid solution (pH 1.3) was added, and the mixture was stirred for 5 minutes and allowed to stand for 30 minutes. Since it separated into the oil phase and the water phase by this, the water phase was removed.
- aqueous oxalic acid solution pH 1.3
- Example 10 Instead of charging 150 g of PGMEA (2.5% by mass) in Example 9, the same treatment was carried out except that 150 g of PGMEA (120 g) / PGME (15 g) (10% by mass) was charged. A PGMEA solution was obtained.
- Example 11 Instead of charging 37.5 g of an aqueous oxalic acid solution (pH 1.3) in Example 10, a PGMEA solution of A-1-BOC was prepared in the same manner except that 130 g of an aqueous citric acid solution (pH 1.8) was charged. Obtained.
- the resist composition of the present invention has a specific structure, contains a compound having high solubility in a safe solvent, has good storage stability, can form a thin film, and can impart a good resist pattern shape. . Therefore, the present invention is useful in the semiconductor field, display field, photomask, thin film magnetic head, compound semiconductor, research and development, etc. in which a resist composition such as an acid amplification type non-polymer resist material is used.
- the present invention can provide a compound (for example, a polyphenol derivative) that has high solubility in a safe solvent, good storage stability, and can form a thin film.
- the present invention provides a photosensitive material substrate such as a semiconductor photoresist, an epoxy resin raw material and curing agent used for an integrated circuit sealing material, and a developer and anti-fading agent used for a thermal recording material.
- a photosensitive material substrate such as a semiconductor photoresist, an epoxy resin raw material and curing agent used for an integrated circuit sealing material, and a developer and anti-fading agent used for a thermal recording material.
- it is suitably used for additives such as bactericides and fungicides.
- the present invention industrially advantageously produces a compound represented by the above general formula (1), a compound represented by the above general formula (2), or a resin obtained using these as a monomer, with a reduced metal content. be able to.
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Abstract
Description
また、前記非特許文献2には溶解性について記載がなく、記載された化合物の耐熱性はいまだ十分ではなく、耐熱性、耐水性、耐薬品性、電気特性、機械特性等の諸特性の一段の向上が求められている。
本発明の目的は、膜の欠陥低減(薄膜形成)が可能で、保存安定性が良好で、高感度で、かつ良好なレジストパターン形状を付与できるレジスト組成物、及び該レジスト組成物を用いるレジストパターン形成方法を提供することにある。
また、本発明の別の目的は、安全溶媒に対する溶解性の高い化合物(例えば、ポリフェノール誘導体)を提供することにある。
[1]
下記一般式(1)で示される化合物、下記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上を含有するレジスト組成物。
[2]
前記一般式(1)で示される化合物が下記一般式(1-1)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(2-1)で示される化合物である、[1]に記載のレジスト組成物。
[3]
前記一般式(1)で示される化合物が下記一般式(1-2)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(2-2)で示される化合物である、[1]に記載のレジスト組成物。
[4]
溶媒をさらに含有する、[1]~[3]のいずれかに記載のレジスト組成物。
[5]
酸発生剤をさらに含有する、[1]~[4]のいずれかに記載のレジスト組成物。
[6]
酸拡散制御剤をさらに含有する、[1]~[5]のいずれかに記載のレジスト組成物。
[7]
[1]~[6]のいずれかに記載のレジスト組成物を基板上に塗布してレジスト膜を形成する工程と、形成されたレジスト膜を露光する工程と、露光したレジスト膜を現像する工程とを含む、レジストパターン形成方法。
[8]
前記一般式(1)で示される化合物が下記一般式(3)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(4)で示される化合物である、[1]又は[4]~[6]のいずれかに記載のレジスト組成物。
[9]
下記一般式(1)で示される化合物。
[10]
前記一般式(1)で示される化合物が下記一般式(1-1)で示される化合物である、[9]に記載の化合物。
[11]
前記一般式(1)で示される化合物が下記一般式(1-2)で示される化合物である、[9]に記載の化合物。
[12]
前記一般式(1)で示される化合物が下記一般式(3)で示される化合物である、[9]に記載の化合物。
[13]
下記一般式(2)で示される化合物。
[14]
前記一般式(2)で示される化合物が下記一般式(2-1)で示される化合物である、[13]に記載の化合物。
[15]
前記一般式(2)で示される化合物が下記一般式(2-2)で示される化合物である、[13]に記載の化合物。
[16]
前記一般式(2)で示される化合物が下記一般式(4)で示される化合物である、[13]に記載の化合物。
[17]
[9]~[16]のいずれかに記載の化合物をモノマーとして得られる樹脂。
[18]
[9]~[16]のいずれかに記載の化合物と架橋反応性のある化合物とを反応させることによって得られる、[17]に記載の樹脂。
[19]
前記架橋反応性にある化合物が、アルデヒド、ケトン、カルボン酸、カルボン酸ハライド、ハロゲン含有化合物、アミノ化合物、イミノ化合物、イソシアネート又は不飽和炭化水素基含有化合物である、[18]に記載の樹脂。
[20]
[9]~[16]のいずれかに記載の化合物、又[17]~[19]のいずれかに記載の樹脂を、溶媒に溶解させて溶液(A)を得る工程と、
得られた溶液(A)と酸性の水溶液とを接触させて、前記化合物中の不純物を抽出する工程(第一抽出工程)とを含み、
前記溶液(A)を得る工程で用いる溶媒が、水と任意に混和しない有機溶媒を含む、精製方法。
[21]
前記酸性の水溶液が、鉱酸水溶液又は有機酸水溶液であり、
前記鉱酸水溶液が、塩酸、硫酸、硝酸及びリン酸からなる群より選ばれる1種以上の鉱酸水溶液であり、
前記有機酸水溶液が、酢酸、プロピオン酸、蓚酸、マロン酸、コハク酸、フマル酸、マレイン酸、酒石酸、クエン酸、メタンスルホン酸、フェノールスルホン酸、p-トルエンスルホン酸及びトリフルオロ酢酸からなる群より選ばれる1種以上の有機酸水溶液である、[20]に記載の精製方法。
[22]
前記水と任意に混和しない有機溶媒が、トルエン、2-ヘプタノン、シクロヘキサノン、シクロペンタノン、メチルイソブチルケトン、プロピレングリコールモノメチルエーテルアセテート及び酢酸エチルからなる群より選ばれる1種以上の有機溶媒である、[20]又は[21]に記載の精製方法。
[23]
前記第一抽出工程後、前記化合物を含む溶液相を、さらに水に接触させて、前記化合物中の不純物を抽出する工程(第二抽出工程)含む、[20]~[22]のいずれかに記載の精製方法。
また、本発明により、安全溶媒に対する溶解性の高い化合物(例えば、ポリフェノール誘導体)を提供できる。
本実施の形態のレジスト組成物は、前記一般式(1)で示される化合物、前記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上を含有する。
本実施の形態のレジスト組成物の第一の実施形態は、下記一般式(1)で示される化合物を含有する。
なお、「R1及びR2からなる群より選択される少なくとも1つ」とは、「R1及びR2からなる群より選択される少なくとも1個の基」であることを意味し、「R1及びR2からなる群より選択される少なくとも1種の基」であることを意味するものではない。
本実施の形態のレジスト組成物に含有させる上記化合物は、前記一般式(1)のとおり、ベンゼン骨格又はナフタレン骨格を有するため、耐熱性に優れる。
前記一般式(1)中、nは1~4の整数であり、nが2以上の整数の場合、n個の繰り返し単位の構造式は同一であっても、異なっていてもよい。耐熱性や解像度、ラフネス等のレジスト特性の点から、前記一般式(1)中、nは1~3であることが好ましい。また、前記一般式(1)中、qは1であることが好ましい。すなわち、上記一般式(1)で示される化合物は、下記一般式(1-a)で示される化合物であることが好ましい。
なお、本実施の形態において、上記一般式(1)で示される化合物はポリマーではないが、便宜上、前記一般式(1)中のR1に結合する[ ]部分の構造を、繰り返し単位の構造式と称する(以下、一般式(2)についても同様である)。
前記一般式(1)中、R1は、単結合、又は炭素数1~30(以下、「C1~30」と称する場合がある)の2n価の基であり、該基は脂環式炭化水素基、二重結合、ヘテロ原子若しくはC6~30の芳香族基を有していてもよい。
前記2n価の基とは、n=1のときには、C1~30のアルキレン基、n=2のときには、C1~30のアルカンテトライル基、n=3のときには、C2~30のアルカンヘキサイル基、n=4のときには、C3~30のアルカンオクタイル基のことを示す。前記2n価の基としては、例えば、直鎖状、分岐状又は環状構造を有するものが挙げられる。
また、前記2n価の基は、脂環式炭化水素基、二重結合、ヘテロ原子若しくはC6~30の芳香族基を有していてもよい。ここで、前記脂環式炭化水素基については、有橋脂環式炭化水素基も含まれる。
前記一般式(1)中、R1は、耐熱性の点から、縮合多環芳香基(特に2~4環の縮合環構造)を有することが好ましく、安全溶媒への溶解性や耐熱性の点から、ビフェニル基等のポリフェニル基を有することが好ましい。
前記一般式(1)中、R2は各々独立して、ハロゲン原子、C1~10の直鎖状、分岐状若しくは環状のアルキル基、C6~10のアリール基、C2~10のアルケニル基、水酸基又は水酸基の水素原子が酸解離性基で置換された基であり、同一のナフタレン環又はベンゼン環において同一であっても異なっていてもよく、R2の少なくとも1つが水酸基の水素原子が酸解離性基で置換された基であり、m1は各々独立して0~7の整数である。但し、m1の少なくとも1つは1~7の整数である。
レジスト膜露光時の装置汚染抑制の点から、好ましいR2は、水素原子、C1~10の直鎖状、分岐状若しくは環状のアルキル基、C6~10のアリール基、C2~10のアルケニル基又は水酸基である。
但し、前記一般式(1)中、R1及びR2からなる群より選択される少なくとも1つはヨウ素原子を含む基である。
なお、「R1及びR3からなる群より選択される少なくとも1つ」とは、「R1及びR3からなる群より選択される少なくとも1個の基」であることを意味し、「R1及びR3からなる群より選択される少なくとも1種の基」であることを意味するものではない。
一般式(1-1)中、m3はそれぞれ独立して1~7の整数であり、m4はそれぞれ独立して0~6の整数であり、m3+m4は1~7の整数である。一般式(1-1)中、nは1~4の整数である。一般式(1-1)中、qは各々独立して0又は1であるが、qは1であることが好ましい。すなわち、一般式(1-1)で示される化合物は、下記一般式(1-1-a)で示される化合物であることが好ましい。
1-分岐アルキル基としては、特に限定されないが、例えば、炭素数3~20の1-分岐アルキル基が挙げられ、炭素数5~18の1-分岐アルキル基が好ましく、炭素数7~16の分岐アルキル基がさらに好ましい。具体的には、特に限定されないが、例えば、イソプロピル基、sec-ブチル基、tert-ブチル基、1,1-ジメチルプロピル基、1-メチルブチル基、1,1-ジメチルブチル基、2-メチルアダマンチル基、及び2-エチルアダマンチル基等を挙げることができる。
アシル基としては、特に限定されないが、例えば、炭素数2~20のアシル基が挙げられ、炭素数4~18のアシル基が好ましく、炭素数6~16のアシル基がさらに好ましい。具体的には、特に限定されないが、例えば、アセチル基、フェノキシアセチル基、プロピオニル基、ブチリル基、ヘプタノイル基、ヘキサノイル基、バレリル基、ピバロイル基、イソバレリル基、ラウリロイル基、アダマンチルカルボニル基、ベンゾイル基及びナフトイル基等を挙げることができる。
環状エーテル基としては、特に限定されないが、例えば、炭素数2~20の環状エーテル基が挙げられ、炭素数4~18の環状エーテル基が好ましく、炭素数6~16の環状エーテル基がさらに好ましい。具体的には、特に限定されないが、例えば、テトラヒドロピラニル基、テトラヒドロフラニル基、テトラヒドロチオピラニル基、テトラヒドロチオフラニル基、4-メトキシテトラヒドロピラニル基及び4-メトキシテトラヒドロチオピラニル基等を挙げることができる。
特に下記式(13-4)で示される各基からなる群から選ばれる酸解離性基が、解像性が高く好ましい。
また、前記一般式(1-2)中、q=1の場合がより好ましい。すなわち、前記一般式(1)で示される化合物は、下記一般式(1-2-a)で示される化合物であることがより好ましい。
耐熱性や感度、解像度、ラフネス等のレジスト特性の点からは、本実施の形態において、前記一般式(1-1)で示される化合物は、前記一般式(1-1)中のnが1であることが好ましい。
また、溶解性の点から、本実施の形態において、前記一般式(1)で示される化合物は、下記一般式(1-3)で示される化合物であることがさらに好ましい。
前記ポリフェノール化合物を製造する際、反応温度は、特に限定されず、反応原料の反応性に応じて適宜選択することができるが、10~200℃の範囲であることが好ましい。本実施の形態に用いる前記一般式(1)で示される化合物を選択性よく合成するには、反応温度が低い方が効果が高く、10~60℃の範囲がより好ましい。
前記ポリフェノール化合物の製造方法は、特に限定されないが、例えば、ナフトール類あるいはチオナフトール類、アルデヒド類あるいはケトン類、触媒を一括で仕込む方法や、触媒存在下ナフトール類あるいはチオナフトール類、アルデヒド類あるいはケトン類を滴下していく方法が挙げられる。重縮合反応終了後、系内に存在する未反応原料、触媒等を除去するために、反応釜の温度を130~230℃にまで上昇させ、1~50mmHg程度で揮発分を除去することもできる。
本実施の形態のレジスト組成物の第二の実施形態は、下記一般式(2)で示される化合物を含有する。
なお、「R1及びR3からなる群より選択される少なくとも1つ」とは、「R1及びR3からなる群より選択される少なくとも1個の基」であることを意味し、「R1及びR3からなる群より選択される少なくとも1種の基」であることを意味するものではない。
また、一般式(2)中、qは0又は1であるが、q=1の場合が好ましい。すなわち、上記一般式(2)で示される化合物は、下記一般式(2-a)で示される化合物であることが好ましい。
上記一般式(2-1)中、qは0又は1であるが、qは1であることがより好ましい。すなわち、前記一般式(2)で示される化合物は、下記式(2-1-a)で示される化合物であることがより好ましい。
前記一般式(2-2)中、qは1であることがより好ましい。すなわち、前記一般式(2)で示される化合物は、下記一般式(2-2-a)で示される化合物であることがより好ましい。
耐熱性や感度、解像度、ラフネス等のレジスト特性の点からは、本実施の形態において、前記一般式(2-1)で示される化合物は、前記一般式(2-1)中のnが1であることが好ましい。
本実施の形態の化合物は、上記一般式(1)又は(2)で示される化合物である。上記一般式(1)で示される化合物は上記一般式(1-1)で示される化合物であることが好ましく、上記一般式(1-2)で示される化合物であることがより好ましい。また、上記一般式(2)で示される化合物は上記一般式(2-1)で示される化合物であることが好ましく、上記一般式(2-2)で示される化合物であることがより好ましい。
さらに、本実施の形態の化合物は、下記一般式(3)又は(4)で示される化合物(例えば、ポリフェノール誘導体)であることが特に好ましい。
一般式(3)及び(4)中、X´は、水素原子、ハロゲン原子又は炭素数1~18の一価の炭化水素基であることが好ましい。
また、上記一般式(3)又は(4)で示される化合物(例えば、ポリフェノール誘導体)は、それぞれ順に下記一般式(3-1)又は式(4-1)で示される化合物であることが好ましい。
一般式(3-1)及び(4-1)中、X´は、水素原子、ハロゲン原子又は炭素数1~18の一価の炭化水素基であることが好ましい。
ナフタレン環における水酸基の位置は、特に限定されないが、原料の産業利用性の点から、1,5位、1,6位、1,7位、2,3位、2,7位、2,6位であることが好ましく、安全溶媒への溶解性が一層高く、結晶性が低い点から、2,6位であることがより好ましい。
本実施の形態のレジスト組成物は、上記一般式(3)又は(4)で示される化合物(例えば、ポリフェノール誘導体)を含有することが特に好ましい。
本実施形態の樹脂は、上記式(1)又は(2)で示される化合物をモノマーとして得られる樹脂である。
また、本実施形態の樹脂は、例えば、上記式(1)又は(2)で示される化合物と架橋反応性のある化合物とを反応させることによって得られる。
架橋反応性のある化合物としては、上記式(1)又は(2)で示される化合物をオリゴマー化又はポリマー化し得るものである限り、公知のものを特に制限なく使用することができる。その具体例としては、例えば、アルデヒド、ケトン、カルボン酸、カルボン酸ハライド、ハロゲン含有化合物、アミノ化合物、イミノ化合物、イソシアネート、不飽和炭化水素基含有化合物等が挙げられるが、これらに特に限定されない。
本実施の形態の化合物又は樹脂の精製方法は、
上記一般式(1)で示される化合物、上記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上を、溶媒に溶解させて溶液(A)を得る工程と、
得られた溶液(A)と酸性の水溶液とを接触させて、前記化合物又は前記樹脂中の不純物を抽出する工程(第一抽出工程)とを含み、
前記溶液(A)を得る工程で用いる溶媒が、水と任意に混和しない有機溶媒を含む。
当該第一抽出工程において、上記樹脂は、上記式(1)又は(2)で表される化合物と架橋反応性のある化合物との反応によって得られる樹脂であることが好ましい。
上記のように構成されているため、本実施の形態の精製方法によれば、上述した特定の構造を有する化合物又は樹脂に不純物として含まれうる種々の金属の含有量を低減することができる。
より詳細には、本実施の形態の精製方法においては、前記化合物又は前記樹脂を、水と任意に混和しない有機溶媒に溶解させて溶液(A)を得て、さらにその溶液(A)を酸性水溶液と接触させて抽出処理を行うことができる。これにより、上記一般式(1)で示される化合物、上記一般式(2)で示される化合物又はこれらをモノマーとして得られる樹脂を含む溶液(A)に含まれる金属分を水相に移行させたのち、有機相と水相とを分離して金属含有量の低減された、上記一般式(1)で示される化合物、上記一般式(2)で示される化合物又はこれらをモノマーとして得られる樹脂を得ることができる。
これらの有機溶媒はそれぞれ単独で用いることもできるし、また2種以上を混合して用いることもできる。
具体的には、例えば、酸性の水溶液を用いて上記抽出処理を行った後に、該水溶液から抽出され、回収された上記一般式(1)で示される化合物、上記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上と有機溶媒を含む溶液相を、さらに水による抽出処理に供することが好ましい。上記の水による抽出処理は、特に限定されないが、例えば、前記溶液相と水とを、撹拌等により、よく混合させたあと、得られた混合溶液を、静置することにより行うことができる。当該静置後の混合溶液は、上記一般式(1)で示される化合物、上記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上と有機溶媒とを含む溶液相と、水相とに分離するのでデカンテーション等により上記一般式(1)で示される化合物、上記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上と有機溶媒とを含む溶液相を回収することができる。
また、ここで用いる水は、本実施の形態の目的に沿って、金属含有量の少ない水、例えばイオン交換水等であることが好ましい。抽出処理は1回だけでもかまわないが、混合、静置、分離という操作を複数回繰り返して行うのも有効である。また、抽出処理における両者の使用割合や、温度、時間等の条件は特に限定されないが、先の酸性の水溶液との接触処理の場合と同様で構わない。
本実施の形態のレジスト組成物は、スピンコートによりアモルファス膜を形成することができる。用いる現像液の種類によって、ポジ型レジストパターン及びネガ型レジストパターンのいずれかを作り分けることができる。
ポジ型レジストパターンの場合、本実施の形態のレジスト組成物をスピンコートして形成したアモルファス膜の23℃における現像液に対する溶解速度は、5Å/sec以下が好ましく、0.05~5Å/secがより好ましく、0.0005~5Å/secがさらに好ましい。当該溶解速度が5Å/sec以下であると現像液に不溶で、レジストとすることができる。また0.0005Å/sec以上の溶解速度を有すると、解像性が向上する場合もある。これは、前記一般式(1)又は(2)で示される化合物の露光前後の溶解性の変化により、現像液に溶解する露光部と、現像液に溶解しない未露光部との界面のコントラストが大きくなるからと推測される。またLERの低減、ディフェクトの低減効果がある。
ネガ型レジストパターンの場合、本実施の形態のレジスト組成物をスピンコートして形成したアモルファス膜の23℃における現像液に対する溶解速度は、10Å/sec以上であることが好ましい。当該溶解速度が10Å/sec以上であると現像液に易溶で、レジストに一層向いている。また10Å/sec以上の溶解速度を有すると、解像性が向上する場合もある。これは、前記一般式(1)又は(2)で示される化合物のミクロの表面部位が溶解し、LERを低減するからと推測される。またディフェクトの低減効果がある。
前記溶解速度は、23℃にて、アモルファス膜を所定時間現像液に浸漬させ、その浸漬前後の膜厚を、目視、エリプソメーター又はQCM法等の公知の方法によって測定し決定できる。
ネガ型レジストパターンの場合、本実施の形態のレジスト組成物をスピンコートして形成したアモルファス膜のKrFエキシマレーザー、極端紫外線、電子線又はX線等の放射線により露光した部分の23℃における現像液に対する溶解速度は、5Å/sec以下が好ましく、0.05~5Å/secがより好ましく、0.0005~5Å/secがさらに好ましい。当該溶解速度が5Å/sec以下であると現像液に不溶で、レジストとすることができる。また0.0005Å/sec以上の溶解速度を有すると、解像性が向上する場合もある。これは、前記一般式(1)又は(2)で示される化合物の露光前後の溶解性の変化により、現像液に溶解する未露光部と、現像液に溶解しない露光部との界面のコントラストが大きくなるからと推測される。またLERの低減、ディフェクトの低減効果がある。
本実施の形態のレジスト組成物は、前記一般式(1)で示される化合物又は(2)で示される化合物を固形成分として含有する。なお、本実施の形態のレジスト組成物は、前記一般式(1)で示される化合物と前記一般式(2)で示される化合物との両方を含有してもよい。
本実施の形態のレジスト組成物で使用される溶媒は、特に限定されないが、例えば、エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノ-n-プロピルエーテルアセテート、エチレングリコールモノ-n-ブチルエーテルアセテート等のエチレングリコールモノアルキルエーテルアセテート類;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテルなどのエチレングリコールモノアルキルエーテル類;プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート(PGMEA)、プロピレングリコールモノ-n-プロピルエーテルアセテート、プロピレングリコールモノ-n-ブチルエーテルアセテート等のプロピレングリコールモノアルキルエーテルアセテート類;プロピレングリコールモノメチルエーテル(PGME)、プロピレングリコールモノエチルエーテルなどのプロピレングリコールモノアルキルエーテル類;乳酸メチル、乳酸エチル、乳酸n-プロピル、乳酸n-ブチル、乳酸n-アミル等の乳酸エステル類;酢酸メチル、酢酸エチル、酢酸n-プロピル、酢酸n-ブチル、酢酸n-アミル、酢酸n-ヘキシル、プロピオン酸メチル、プロピオン酸エチル等の脂肪族カルボン酸エステル類;3-メトキシプロピオン酸メチル、3-メトキシプロピオン酸エチル、3-エトキシプロピオン酸メチル、3-エトキシプロピオン酸エチル、3-メトキシ-2-メチルプロピオン酸メチル、3-メトキシブチルアセテート、3-メチル-3-メトキシブチルアセテート、3-メトキシ-3-メチルプロピオン酸ブチル、3-メトキシ-3-メチル酪酸ブチル、アセト酢酸メチル、ピルビン酸メチル、ピルビン酸エチル等の他のエステル類;トルエン、キシレン等の芳香族炭化水素類;メチルエチルケトン、2-ヘプタノン、3-ヘプタノン、4-ヘプタノン、シクロペンタノン(CPN)、シクロヘキサノン(CHN)等のケトン類;N,N-ジメチルホルムアミド、N-メチルアセトアミド、N,N-ジメチルアセトアミド、N-メチルピロリドン等のアミド類;γ-ラクトン等のラクトン類等を挙げることができる。これらの溶媒は、単独で又は2種以上を使用することができる。
本実施の形態のレジスト組成物で使用される溶媒は、安全溶媒であることが好ましく、より好ましくは、PGMEA、PGME、CHN、CPN、2-ヘプタノン、アニソール、酢酸ブチル、プロピオン酸エチル及び乳酸エチルから選ばれる少なくとも一種であり、さらに好ましくはPGMEA、PGME及びCHNから選ばれる少なくとも一種である。
本実施の形態のレジスト組成物において、固形成分の量と溶媒の量とは、特に限定されないが、固形成分及び溶媒の合計質量100質量%に対して、固形成分1~80質量%及び溶媒20~99質量%であることが好ましく、より好ましくは固形成分1~50質量%及び溶媒50~99質量%、さらに好ましくは固形成分2~40質量%及び溶媒60~98質量%であり、特に好ましくは固形成分2~10質量%及び溶媒90~98質量%である。
本実施の形態のレジスト組成物において、上記一般式(1)で示される化合物及び/又は上記一般式(2)で示される化合物の含有量は、特に限定されないが、固形成分の全質量(式(1)で示される化合物、式(2)で示される化合物、酸発生剤(C)、酸拡散制御剤(E)及びその他の成分(F)などの任意に使用される固形成分の総和、以下同様)の50~99.4質量%であることが好ましく、より好ましくは55~90質量%、さらに好ましくは60~80質量%、特に好ましくは60~70質量%である。前記含有量の場合、解像度が一層向上し、ラインエッジラフネス(LER)が一層小さくなる。
なお、前記一般式(1)で示される化合物と前記一般式(2)で示される化合物の両方を含有する場合、前記含有量は、前記一般式(1)で示される化合物と前記一般式(2)で示される化合物との合計量である。
この場合、本実施の形態のレジスト組成物において、酸発生剤(C)の含有量は、固形成分の全質量の0.001~49質量%が好ましく、1~40質量%がより好ましく、3~30質量%がさらに好ましく、10~25質量%が特に好ましい。前記含有量の範囲内で酸発生剤(C)を使用することにより、一層高感度でかつ一層低エッジラフネスのパターンプロファイルが得られる。
本実施の形態のレジスト組成物では、系内に酸が発生すれば、酸の発生方法は限定されない。g線、i線などの紫外線の代わりにエキシマレーザーを使用すれば、より微細加工が可能であるし、また高エネルギー線として電子線、極端紫外線、X線、イオンビームを使用すればさらに微細加工が可能である。
前記酸発生剤(C)は、単独で又は2種以上を使用することができる。
このような酸拡散制御剤(E)は、特に限定されず、例えば、窒素原子含有塩基性化合物、塩基性スルホニウム化合物、塩基性ヨードニウム化合物等の放射線分解性塩基性化合物が挙げられる。酸拡散制御剤(E)は、単独で又は2種以上を使用することができる。
低分子量溶解促進剤は、上記式(1)で示される化合物及び/又は式(2)で示される化合物の現像液に対する溶解性が低すぎる場合に、その溶解性を高めて、現像時の前記化合物の溶解速度を適度に増大させる作用を有する成分であり、本発明の効果を損なわない範囲で使用することができる。前記溶解促進剤としては、例えば、低分子量のフェノール性化合物を挙げることができ、例えば、ビスフェノール類、トリス(ヒドロキシフェニル)メタン等を挙げることができる。これらの溶解促進剤は、単独で又は2種以上を混合して使用することができる。溶解促進剤の含有量は、使用する上記式(1)で示される化合物及び/又は式(2)で示される化合物の種類に応じて適宜調節されるが、固形成分の全質量の0~49質量%が好ましく、0~5質量%がより好ましく、0~1質量%がさらに好ましく、0質量%が特に好ましい。
溶解制御剤は、上記式(1)で示される化合物及び/又は式(2)で示される化合物が現像液に対する溶解性が高すぎる場合に、その溶解性を制御して現像時の溶解速度を適度に減少させる作用を有する成分である。このような溶解制御剤としては、レジスト被膜の焼成、放射線照射、現像等の工程において化学変化しないものが好ましい。
溶解制御剤の含有量は、特に限定されず、使用する前記式(1)で示される化合物及び/又は式(2)で示される化合物の種類に応じて適宜調節されるが、固形成分の全質量の0~49質量%が好ましく、0~5質量%がより好ましく、0~1質量%がさらに好ましく、0質量%が特に好ましい。
増感剤は、照射された放射線のエネルギーを吸収して、そのエネルギーを酸発生剤(C)に伝達し、それにより酸の生成量を増加する作用を有し、レジストの見掛けの感度を向上させる成分である。このような増感剤は、特に限定されず、例えば、ベンゾフェノン類、ビアセチル類、ピレン類、フェノチアジン類、フルオレン類等を挙げることができる。これらの増感剤は、単独で又は2種以上を使用することができる。増感剤の含有量は、使用する前記式(1)で示される化合物及び/又は式(2)で示される化合物の種類に応じて適宜調節されるが、固形成分の全質量の0~49質量%が好ましく、0~5質量%がより好ましく、0~1質量%がさらに好ましく、0質量%が特に好ましい。
界面活性剤は、本実施の形態のレジスト組成物の塗布性やストリエーション、レジストの現像性等を改良する作用を有する成分である。このような界面活性剤は、特に限定されず、アニオン系、カチオン系、ノニオン系あるいは両性のいずれでもよい。好ましい界面活性剤はノニオン系界面活性剤である。ノニオン系界面活性剤は、レジスト組成物の製造に用いる溶媒との親和性がよく、より効果がある。ノニオン系界面活性剤の例としては、ポリオキシエチレン高級アルキルエーテル類、ポリオキシエチレン高級アルキルフェニルエーテル類、ポリエチレングリコールの高級脂肪酸ジエステル類等が挙げられるが、特に限定はされない。市販品としては、以下商品名で、エフトップ(ジェムコ社製)、メガファック(大日本インキ化学工業社製)、フロラード(住友スリーエム社製)、アサヒガード、サーフロン(以上、旭硝子社製)、ペポール(東邦化学工業社製)、KP(信越化学工業社製)、ポリフロー(共栄社油脂化学工業社製)等を挙げることができる。界面活性剤の含有量は、特に限定されず、使用する前記式(1)で示される化合物及び/又は式(2)で示される化合物の種類に応じて適宜調節されるが、固形成分の全質量の0~49質量%が好ましく、0~5質量%がより好ましく、0~1質量%がさらに好ましく、0質量%が特に好ましい。
本実施の形態のレジスト組成物は、感度劣化防止又はレジストパターン形状、引き置き安定性等の向上の目的で、さらに任意の成分として、有機カルボン酸又はリンのオキソ酸若しくはその誘導体を含有してもよい。なお、酸拡散制御剤と併用することもできるし、単独で用いてもよい。有機カルボン酸としては、特に限定されず、例えば、マロン酸、クエン酸、リンゴ酸、コハク酸、安息香酸、サリチル酸などが好適である。リンのオキソ酸若しくはその誘導体としては、リン酸、リン酸ジ-n-ブチルエステル、リン酸ジフェニルエステルなどのリン酸又はそれらのエステルなどの誘導体;ホスホン酸、ホスホン酸ジメチルエステル、ホスホン酸ジ-n-ブチルエステル、フェニルホスホン酸、ホスホン酸ジフェニルエステル、ホスホン酸ジベンジルエステルなどのホスホン酸又はそれらのエステルなどの誘導体;ホスフィン酸、フェニルホスフィン酸などのホスフィン酸及びそれらのエステルなどの誘導体が挙げられ、これらの中で特にホスホン酸が好ましい。
有機カルボン酸又はリンのオキソ酸若しくはその誘導体は、単独で又は2種以上を使用することができる。有機カルボン酸又はリンのオキソ酸若しくはその誘導体の含有量は、使用する前記式(1)で示される化合物及び/又は式(2)で示される化合物の種類に応じて適宜調節されるが、固形成分の全質量の0~49質量%が好ましく、0~5質量%がより好ましく、0~1質量%がさらに好ましく、0質量%が特に好ましい。
さらに、本実施の形態のレジスト組成物には、本発明の目的を阻害しない範囲で、必要に応じて、前記溶解制御剤、増感剤、及び界面活性剤以外の添加剤を1種又は2種以上含有できる。そのような添加剤としては、特に限定されず、例えば、染料、顔料、及び接着助剤等が挙げられる。例えば、染料又は顔料を含有すると、露光部の潜像を可視化させて、露光時のハレーションの影響を緩和できるので好ましい。また、接着助剤を含有すると、基板との接着性を改善することができるので好ましい。さらに、他の添加剤としては、、特に限定されず、例えば、ハレーション防止剤、保存安定剤、消泡剤、形状改良剤等、具体的には4-ヒドロキシ-4’-メチルカルコン等を挙げることができる。
各成分の含有割合は、その総和が100質量%になるように各範囲から選ばれる。前記含有割合にすると、感度、解像度、現像性等の性能に一層優れる。
本実施の形態のレジストパターンの形成方法は、特に限定されず、好適な方法として、上述したレジスト組成物を基板上に塗布してレジスト膜を形成する工程と、形成されたレジスト膜を露光する工程と、前記露光したレジスト膜を現像してレジストパターンを形成する工程とを含む方法が挙げられる。
本実施の形態のレジストパターンは多層プロセスにおける上層レジストとして形成することもできる。
本実施の形態のレジストパターンの形成方法においては、露光における高精度の微細パターンを安定して形成するために、放射線照射後に加熱するのが好ましい。加熱条件は、レジスト組成物の配合組成等により変わるが、20~250℃が好ましく、より好ましくは20~150℃である。
前記現像液としては、使用する上記式(1)の化合物及び/又は式(2)で示される化合物に対して溶解度パラメーター(SP値)の近い溶剤を選択することが好ましく、ケトン系溶剤、エステル系溶剤、アルコール系溶剤、アミド系溶剤、エーテル系溶剤等の極性溶剤、炭化水素系溶剤又はアルカリ水溶液を用いることができる。
現像液の種類によって、ポジ型レジストパターン又はネガ型レジストパターンを作り分けることができるが、一般的に、ケトン系溶剤、エステル系溶剤、アルコール系溶剤、アミド系溶剤、エーテル系溶剤等の極性溶剤、炭化水素系溶剤の場合はネガ型レジストパターン、アルカリ水溶液の場合はポジ型レジストパターンが得られる。
以下に、実施例における化合物の測定方法及びレジスト性能等の評価方法を示す。
(1)化合物の構造
化合物の構造は、Bruker社製Advance600II spectrometerを用いて、以下の条件で、1H-NMR測定を行い、確認した。
周波数:400MHz
溶媒:d6-DMSO(合成例4以外)
内部標準:TMS
測定温度:23℃
化合物の分子量は、GC-MS分析により、Agilent社製Agilent5975/6890Nを用いて測定した。あるいは、LC-MS分析により、Water社製Acquity UPLC/MALDI-Synapt HDMSを用いて測定した。または、ゲル浸透クロマトグラフィー(GPC)分析により、ポリスチレン換算の重量平均分子量(Mw)、数平均分子量(Mn)を求め、分散度(Mw/Mn)を求めた。
装置:Shodex GPC-101型(昭和電工(株)製)
カラム:KF-80M×3
溶離液:THF 1ml/min
温度:40℃
(3)化合物の金属含有量
化合物の含有金属量は、ICP-MS分析により、PerkinElmer社製ELAN DRCIIを用いて測定した。
(1)化合物の安全溶媒溶解度試験
化合物のCHN、PGME及びPGMEAへの溶解性は、各溶媒への溶解量を用いて以下の基準で評価した。なお、溶解量の測定は23℃にて、化合物を試験管に精秤し、対象となる溶媒を所定の濃度となるよう加え、超音波洗浄機にて30分間超音波をかけ、その後の液の状態を目視にて観察することにより測定した。
A:5.0質量% ≦ 溶解量
B:3.0質量%≦ 溶解量 <5.0質量%
C:溶解量 <3.0質量%
化合物を含むレジスト組成物の保存安定性は、レジスト組成物を作成後、23℃にて3日間静置し、析出の有無を目視にて観察することにより評価した。3日間静置後のレジスト組成物において、均一溶液であり析出がない場合には○、析出がある場合は×と評価した。また、均一状態のレジスト組成物を清浄なシリコンウェハー上に回転塗布した後、110℃のオーブン中で露光前ベーク(PB)して、厚さ40nmのレジスト膜を形成した。作成したレジスト組成物について、薄膜形成が良好な場合には○、形成した膜に欠陥がある場合には×と評価した。
均一なレジスト組成物を清浄なシリコンウェハー上に回転塗布した後、110℃のオーブン中で露光前ベーク(PB)して、厚さ60nmのレジスト膜を形成した。得られたレジスト膜に対して、電子線描画装置(ELS-7500、(株)エリオニクス社製)を用いて、50nm、40nm及び30nm間隔の1:1のラインアンドスペース設定の電子線を照射した。当該照射後に、レジスト膜を、それぞれ所定の温度で、90秒間加熱し、TMAH2.38質量%アルカリ現像液に60秒間浸漬して現像を行った。その後、レジスト膜を、超純水で30秒間洗浄、乾燥して、ポジ型のレジストパターンを形成した。形成されたレジストパターンについて、ラインアンドスペースを走査型電子顕微鏡((株)日立ハイテクノロジー製S-4800)により観察し、レジスト組成物の電子線照射による反応性を評価した。
(合成例1)A-1(キサンテン化合物)の合成
攪拌機、冷却管及びビュレットを備えた内容積300mLの容器において、2,6-ナフタレンジオール(シグマ-アルドリッチ社製試薬)7.0g(40mmol)と3-ヨードベンズアルデヒド(東京化成工業社製試薬)4.6g(20mmol)とを100mLγ―ブチロラクトンに仕込み、p-トルエンスルホン酸0.5gを加えて、内容物をを90℃で23時間撹拌して反応を行って反応液を得た。次に反応液を純水1000gに加えたあと、酢酸エチルにより抽出、濃縮を行って溶液を得た。
得られた溶液を、カラムクロマトによる分離後、クロロホルム洗浄を行い、下記式(A-1)で示される目的化合物(A-1)が4.2g得られた。
得られた化合物(A-1)について、前記方法により分子量を測定した結果、516であった。
得られた化合物(A-1)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-1)の化学構造を有することを確認した。
δ(ppm)9.7(2H,O-H)、7.0~8.5(14H,Ph-H)、6.5(1H,C-H)
なお、得られた化合物(A-1)において、2,6-ナフタレンジオールの置換位置が1位であることは、3位及び4位のプロトンのシグナルがダブレットであることから確認した。
(合成実施例1)A-1-BOCの合成
攪拌機、冷却管及びビュレットを備えた内容積200mLの容器において、上記得られた化合物(A-1)6.5g(12.5mmol)とジ-t-ブチルジカーボネート(アルドリッチ社製)5.5g(25mmol)とをアセトン100mLに仕込み、炭酸カリウム(アルドリッチ社製)3.45g(25mmol)を加えて、内容物を20℃で6時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水100gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(A-1-BOC)で示される目的化合物(A-1-BOC)を2g得た。
得られた化合物(A-1-BOC)について、前記方法により分子量を測定した結果、716であった。
得られた化合物(A-1-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-1-BOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.7(14H,Ph-H)、6.8(1H,C-H)、1.6(18H,C-CH 3)
攪拌機、冷却管及びビュレットを備えた内容積200mLの容器において、上記得られた化合物(A-1)6.4g(12.4mmol)とブロモ酢酸t-ブチル(アルドリッチ社製)5.4g(27mmol)とをアセトン100mLに仕込み、炭酸カリウム(アルドリッチ社製)3.8g(27mmol)及び18-クラウン-6 0.8gを加えて、内容物を還流下で3時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水100gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(A-1-MeBOC)で示される目的化合物(A-1-MeBOC)を1.8g得た。
得られた化合物(A-1-MeBOC)について、前記方法により分子量を測定した結果、694であった。
得られた化合物(A-1-MeBOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-1-MeBOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.7(14H,Ph-H)、6.7(1H,C-H)、4.7~4.8(4H,C-CH 2-C)、1.3~1.4(18H,C-CH 3)
攪拌機、冷却管及びビュレットを備えた内容積300mLの容器において、2,6-ナフタレンジオール(シグマ-アルドリッチ社製試薬)7.0g(40mmol)と5-ヨードバニリン(東京化成工業社製試薬)5.6g(20mmol)とを100mLγ―ブチロラクトンに仕込み、p-トルエンスルホン酸0.5gを加えて、内容物を90℃で87時間撹拌して反応を行って反応液を得た。次に反応液を純水1000gに加えたあと、酢酸エチルにより抽出、濃縮を行って溶液を得た。
得られた溶液を、カラムクロマトによる分離後、クロロホルム洗浄を行い、下記式(A-3)で示される目的化合物(A-3)が2.0g得た。
得られた化合物(A-3)について、前記方法により分子量を測定した結果、562であった。
得られた化合物(A-3)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-3)の化学構造を有することを確認した。
δ(ppm)9.7,9.3(3H,O-H)、7.2~8.5(12H,Ph-H)、6.4(1H,C-H)、3.7(3H,O-C-H)
なお、得られた化合物(A-3)において、2,6-ナフタレンジオールの置換位置が1位であることは、3位及び4位のプロトンのシグナルがダブレットであることから確認した。
攪拌機、冷却管及びビュレットを備えた内容積200mLの容器において、上記得られた化合物(A-3)7.0g(12.5mmol)とジ-t-ブチルジカーボネート(アルドリッチ社製)8.2g(37.5mmol)とをアセトン100mLに仕込み、炭酸カリウム(アルドリッチ社製)5.2g(37.5mmol)を加えて、内容物を20℃で6時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水100gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(A-3-BOC)で示される目的化合物(A-3-BOC)を1.6g得た。
得られた化合物(A-3-BOC)について、前記方法により分子量を測定した結果、862であった。
得られた化合物(A-3-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-3-BOC)の化学構造を有することを確認した。
δ(ppm)7.4~8.7(12H,Ph-H)、6.4(1H,C-H)、3.8(3H,O-C-H)、1.6(27H,C-CH 3)
攪拌機、冷却管及びビュレットを備えた内容積200mLの容器において、上記得られた化合物(A-3)7.0g(12.4mmol)とブロモ酢酸t-ブチル(アルドリッチ社製)7.9g(40.5mmol)とをアセトン100mLに仕込み、炭酸カリウム(アルドリッチ社製)5.6g(40.5mmol)及び18-クラウン-6 1.2gを加えて、内容物を還流下で3時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水100gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(A-3-MeBOC)で示される目的化合物(A-3-MeBOC)を1.8g得た。
得られた化合物(A-3-MeBOC)について、前記方法により分子量を測定した結果、904であった。
得られた化合物(A-3-MeBOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(A-3-MeBOC)の化学構造を有することを確認した。
δ(ppm)7.4~8.7(12,Ph-H)、6.3(1H,C-H)、4.7~4.8(6H,C-CH 2-C)、3.7(3H,O-C-H)、1.3~1.4(27H,C-CH 3)
2,6-ナフタレンジオール7.0g(40mmol)に代えて2,7-ナフタレンジオール(シグマ-アルドリッチ社製試薬)7.0g(40mmol)を用いること以外は、合成例1同様に操作することにより、下記式(B-1)で示される構造を有する目的化合物(B-1)が4.0g得られた。
得られた化合物(B-1)について、前記方法により分子量を測定した結果、516であった。
得られた化合物(B-1)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(B-1)の化学構造を有することを確認した。
δ(ppm)9.9(2H,O-H)、7.0~7.8(14H,Ph-H)、6.1(1H,C-H)
なお、得られた化合物(B-1)において、2,7-ナフタレンジオールの置換位置が1位であることは、3位及び4位のプロトンのシグナルがダブレットであることから確認した。
化合物(A-1)6.5g(12.5mmol)に代えて化合物(B-1)6.5g(12.5mmol)を用いること以外は合成実施例1と同様に操作することにより、下記式(B-1-BOC)で示される構造を有する目的化合物(B-1-BOC)を2.0g得た。
得られた化合物(B-1-BOC)について、前記方法により分子量を測定した結果、716であった。
得られた化合物(B-1-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(B-1-BOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.0(14H,Ph-H)、6.4(1H,C-H)、1.6(18H,C-CH 3)
化合物(A-1)6.4g(12.4mmol)に代えて化合物(B-1)6.4g(12.4mmol)を用いること以外は合成実施例2と同様に操作することにより、下記式(B-1-MeBOC)で示される構造を有する目的化合物(B-1-MeBOC)を1.6g得た。
得られた化合物(B-1-MeBOC)について、前記方法により分子量を測定した結果、694であった。
得られた化合物(B-1-MeBOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(B-1-MeBOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.0(14H,Ph-H)、6.3(1H,C-H)、4.7~4.8(4H,C-CH 2-C)、1.3~1.4(18H,C-CH 3)
攪拌機、冷却管及びビュレットを備えた内容積100mlの容器に、化合物(A-1) 10.8g(21mmol)と、パラホルムアルデヒド0.7g(42mmol)、氷酢酸50mlとPGME50mlとを仕込み、95%の硫酸8mlを加えて、反応液を100℃で6時間撹拌して反応を行った。次に、反応液を濃縮し、メタノール1000mlを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って分離した。得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことにより、下記式(R1A-1)で示される構造を有する目的樹脂(R1A-1)7.2gを得た。
得られた樹脂(R1A-1)について、前記方法によりポリスチレン換算分子量を測定した結果、Mn:831、Mw:1846、Mw/Mn:2.22であった。
得られた樹脂(R1A-1)について、前記測定条件でNMR測定を行ったところ、以下のピークが見出され、下記式(R1A-1)の化学構造を有することを確認した。
δ(ppm)9.7(2H,O-H)、7.0~8.5(12H,Ph-H)、6.5(1H,C-H)、4.1(2H,-CH2)
化合物(A-1)6.5g(12.5mmol)に代えて樹脂(R1A-1)23.1gを用いること以外は合成実施例1と同様に操作することにより、下記式(R1A-1-BOC)で示される構造を有する目的樹脂(R1A-1-BOC)を7.5g得た。
得られた樹脂(R1A-1-BOC)について、前記方法によりポリスチレン換算分子量を測定した結果、Mn:1031、Mw:2299、Mw/Mn:2.23であった。
得られた樹脂(R1A-1-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(R1A-1-BOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.7(14H,Ph-H)、6.8(1H,C-H)、1.6(18H,C-CH 3)
パラホルムアルデヒド 0.7g(42mmol)に代えて4-ビフェニルカルボキシアルデヒド(三菱瓦斯化学社製)7.6g(42mmol)用いること以外は、合成例4と同様に操作することにより、下記式(R2A-1)で示される構造を有する目的樹脂(R2A-1)を7.6g得た。
得られた樹脂(R2A-1)について、前記方法によりポリスチレン換算分子量を測定した結果、Mn:614、Mw:1338、Mw/Mn:2.18であった。
得られた樹脂(R2A-1)について、前記測定条件でNMR測定を行ったところ、以下のピークが見出され、下記式(R2A-1)の化学構造を有することを確認した。
δ(ppm)9.7(2H,O-H)、7.0~8.8(21H,Ph-H)、6.6(1H,C-H)、4.5(1H,-CH)
さらに、得られた樹脂(R2A-1)について、前記方法により安全溶媒への溶解性を評価した。結果を表1に示す。
化合物(A-1)6.5g(12.5mmol)に代えて樹脂(R2A-1)16.8gを用いること以外は合成実施例1と同様に操作することにより、下記式(R1A-1-BOC)で示される構造を有する目的樹脂(R1A-1-BOC)を5.0g得た。
得られた樹脂(R1A-1-BOC)について、前記方法によりポリスチレン換算分子量を測定した結果、Mn:910、Mw:2002、Mw/Mn:2.20であった。
得られた樹脂(R1A-1-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(R1A-1-BOC)の化学構造を有することを確認した。
δ(ppm)7.2~9.0(21H,Ph-H)、6.9(1H,C-H)、4.6(1H,-CH)、1.6(18H,C-CH 3)
攪拌機、冷却管及びビュレットを備えた内容積100mLの容器において、2,6-ナフタレンジオール(シグマ-アルドリッチ社製試薬)3.20g(20mmol)と4-ビフェニルカルボキシアルデヒド(三菱瓦斯化学社製)1.82g(10mmol)とを30mLメチルイソブチルケトンに仕込み、95%の硫酸5mLを加えて、内容物を30℃で6時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水50gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(XBisN-1)で示される目的化合物(XBisN-1)を0.2g得た。
得られた化合物(XBisN-1)について、前記方法により分子量を測定した結果、466であった。
得られた化合物(XBisN-1)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(XBisN-1)の化学構造を有することを確認した。
δ(ppm)9.3~9.4(4H,O-H)、7.0~8.5(19H,Ph-H)、6.8(1H,C-H)
なお、得られた化合物(XBisN-1)において、2,6-ナフタレンジオールの置換位置が1位であることは、3位及び4位のプロトンのシグナルがダブレットであることから確認した。
攪拌機、冷却管及びビュレットを備えた内容積200mLの容器において、上記得られた化合物(XBisN-1)5.8g(12.5mmol)とジ-t-ブチルジカーボネート(アルドリッチ社製)5.5g(25mmol)とをアセトン100mLに仕込み、炭酸カリウム(アルドリッチ社製)3.45g(25mmol)を加えて、内容物を20℃で6時間撹拌して反応を行って反応液を得た。次に反応液を濃縮し、濃縮液に純水100gを加えて反応生成物を析出させ、室温まで冷却した後、濾過を行って固形物を分離した。
得られた固形物を濾過し、乾燥させた後、カラムクロマトによる分離精製を行うことで、下記式(XBisN-1-BOC)で示される目的化合物(XBisN-1-BOC)を2g得た。
得られた化合物(XBisN-1-BOC)について、前記方法により分子量を測定した結果、666であった。
得られた化合物(XBisN-1-BOC)について、前記測定条件で、NMR測定を行ったところ、以下のピークが見出され、下記式(XBisN-1-BOC)の化学構造を有することを確認した。
δ(ppm)7.2~8.7(19H,Ph-H)、6.8(1H,C-H)、1.6(18H,C-CH 3)
温度を制御できる内容積500mLの電磁撹拌装置付オートクレーブ(SUS316L製)に、無水HF 74.3g(3.71モル)、BF3 50.5g(0.744モル)を仕込み、内容物を撹拌し、液温を-30℃に保ったまま一酸化炭素により圧力を2MPaまで昇圧した。その後、オートクレーブにおいて、圧力を2MPa、液温を-30℃に保ったまま、4-シクロヘキシルベンゼン57.0g(0.248モル)とn-ヘプタン50.0gとを混合した原料を供給し、1時間保った後、氷の中に内容物を採取した。採取した内容物を、ベンゼンで希釈後、中和処理をして油層を得た。得られた油層をガスクロマトグラフィーで分析して反応成績を求めたところ、4-シクロヘキシルベンゼン転化率100%、4-シクロヘキシルベンズアルデヒド選択率97.3%であった。
得られた油層から単蒸留により目的成分を単離し、GC-MSで分析した結果、下記式(CHBAL)の4-シクロヘキシルベンズアルデヒド(CHBAL)の分子量は、188を示した。また得られた化合物(CHBAL)について、前記測定条件で、NMR測定を行い、下記式(CHBAL)の化学構造を有することを確認した。
続いて合成実施例1同様に、CR-1とジ-t-ブチルジカーボネートとを反応させ、下記式(CR-1-BOC)で示される目的化合物(CR-1-BOC)を25g得た。
得られた化合物(CR-1-BOC)について、前記測定条件で、NMR測定を行い、下記式(CR-1-BOC)の化学構造を有することを確認した。
レジスト組成物の合成
上記で合成した各化合物を用いて、表1に示す配合でレジスト組成物を調製した。なお、表1中のレジスト組成物の各成分のうち、酸発生剤(C)、酸拡散制御剤(E)及び溶媒については、以下のものを用いた。
酸発生剤(C)
P-1:トリフェニルベンゼンスルホニウム トリフルオロメタンスルホネート(みどり化学(株))
酸拡散制御剤(E)
Q-1:トリオクチルアミン(東京化成工業(株))
溶媒
S-1:プロピレングリコールモノメチルエーテル(東京化成工業(株))
また、実施例1~8で得られたレジスト組成物は析出が無く保存安定性が良好であることを確認した(評価:○)。一方、比較例1及び2で得られたレジスト組成物は析出があり保存安定性は不良であることを確認した(評価:×)。
さらに、実施例1~8、比較例1で得られたレジスト組成物では薄膜の形成が良好であることを確認した(評価:○)。一方、比較例2で得られたレジスト組成物では膜に欠陥があり、薄膜形成が不良であることを確認した(評価:×)。
(実施例9)
1000mL容量の四つ口フラスコ(底抜き型)に、A-1-BOCをPGMEAに溶解させた溶液(2.5質量%)を150g仕込み、攪拌しながら80℃まで加熱した。次いで、蓚酸水溶液(pH1.3)37.5gを加え、5分間攪拌後、30分静置した。これにより油相と水相に分離したので、水相を除去した。この操作を1回繰り返した後、得られた油相に、超純水37.5gを仕込み、5分間攪拌後、30分静置し、水相を除去した。この操作を3回繰り返すことにより、金属含有量の低減されたA-1-BOCのPGMEA溶液を得た。
実施例9におけるPGMEA(2.5質量%)150gを仕込む代わりに、PGMEA(120g)/PGME(15g)(10質量%)150gを仕込んだこと以外は同様に処理してA-1-BOCのPGMEA溶液を得た。
実施例10における蓚酸水溶液(pH 1.3)37.5gを仕込む代わりに、クエン酸水溶液(pH 1.8)130gを仕込んだこと以外は同様に処理してA-1-BOCのPGMEA溶液を得た。
イオン交換樹脂(三菱化学ダイヤイオン:SMT100-ミックス樹脂)25gをシクロヘキサノンで膨潤後、テフロン(登録商標)カラムに充填し、1,3-ジオキソランを500mL通液することで溶媒置換した。次いでA-1-BOCを1,3-ジオキソランに溶解させた溶液(1.7質量%)500gを通液することでA-1-BOCのジオキソラン溶液を得た。
また、本発明により、安全溶媒に対する溶解性が高く、保存安定性が良好で、薄膜形成が可能な化合物(例えば、ポリフェノール誘導体)を提供できる。したがって、本発明は、半導体用フォトレジスト等の感光性材料の基材、集積回路の封止材料等に用いられるエポキシ樹脂の原料や硬化剤、感熱記録材料に用いられる顕色剤や退色防止剤、このほか、殺菌剤、防菌防カビ剤等の添加剤などに好適に利用される。
また、本発明は、金属含有量の低減された上記一般式(1)で示される化合物、上記一般式(2)で示される化合物又はこれらをモノマーとして得られる樹脂を工業的に有利に製造することができる。
Claims (23)
- 下記一般式(1)で示される化合物、下記一般式(2)で示される化合物及びこれらをモノマーとして得られる樹脂から選ばれる1種以上を含有するレジスト組成物。
- 前記一般式(1)で示される化合物が下記一般式(1-1)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(2-1)で示される化合物である、請求項1に記載のレジスト組成物。
- 前記一般式(1)で示される化合物が下記一般式(1-2)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(2-2)で示される化合物である、請求項1に記載のレジスト組成物。
- 溶媒をさらに含有する、請求項1~3のいずれか1項に記載のレジスト組成物。
- 酸発生剤をさらに含有する、請求項1~4のいずれか1項に記載のレジスト組成物。
- 酸拡散制御剤をさらに含有する、請求項1~5のいずれか1項に記載のレジスト組成物。
- 請求項1~6のいずれか1項に記載のレジスト組成物を基板上に塗布してレジスト膜を形成する工程と、形成されたレジスト膜を露光する工程と、露光したレジスト膜を現像する工程とを含む、レジストパターン形成方法。
- 前記一般式(1)で示される化合物が下記一般式(3)で示される化合物であり、前記一般式(2)で示される化合物が下記一般式(4)で示される化合物である、請求項1又は請求項4~6のいずれか1項に記載のレジスト組成物。
- 下記一般式(1)で示される化合物。
- 前記一般式(1)で示される化合物が下記一般式(1-1)で示される化合物である、請求項9に記載の化合物。
- 前記一般式(1)で示される化合物が下記一般式(1-2)で示される化合物である、請求項9に記載の化合物。
- 下記一般式(2)で示される化合物。
- 前記一般式(2)で示される化合物が下記一般式(2-1)で示される化合物である、請求項13に記載の化合物。
- 前記一般式(2)で示される化合物が下記一般式(2-2)で示される化合物である、請求項13に記載の化合物。
- 請求項9~16のいずれか1項に記載の化合物をモノマーとして得られる樹脂。
- 請求項9~16のいずれか1項に記載の化合物と架橋反応性のある化合物とを反応させることによって得られる、請求項17に記載の樹脂。
- 前記架橋反応性にある化合物が、アルデヒド、ケトン、カルボン酸、カルボン酸ハライド、ハロゲン含有化合物、アミノ化合物、イミノ化合物、イソシアネート又は不飽和炭化水素基含有化合物である、請求項18に記載の樹脂。
- 請求項9~16のいずれか1項に記載の化合物、又は請求項17~19のいずれか1項に記載の樹脂を、溶媒に溶解させて溶液(A)を得る工程と、
得られた溶液(A)と酸性の水溶液とを接触させて、前記化合物中の不純物を抽出する工程(第一抽出工程)とを含み、
前記溶液(A)を得る工程で用いる溶媒が、水と任意に混和しない有機溶媒を含む、精製方法。 - 前記酸性の水溶液が、鉱酸水溶液又は有機酸水溶液であり、
前記鉱酸水溶液が、塩酸、硫酸、硝酸及びリン酸からなる群より選ばれる1種以上の鉱酸水溶液であり、
前記有機酸水溶液が、酢酸、プロピオン酸、蓚酸、マロン酸、コハク酸、フマル酸、マレイン酸、酒石酸、クエン酸、メタンスルホン酸、フェノールスルホン酸、p-トルエンスルホン酸及びトリフルオロ酢酸からなる群より選ばれる1種以上の有機酸水溶液である、請求項20に記載の精製方法。 - 前記水と任意に混和しない有機溶媒が、トルエン、2-ヘプタノン、シクロヘキサノン、シクロペンタノン、メチルイソブチルケトン、プロピレングリコールモノメチルエーテルアセテート及び酢酸エチルからなる群より選ばれる1種以上の有機溶媒である、請求項20又は21に記載の精製方法。
- 前記第一抽出工程後、前記化合物を含む溶液相を、さらに水に接触させて、前記化合物中の不純物を抽出する工程(第二抽出工程)含む、請求項20~22のいずれか1項に記載の精製方法。
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US20210331994A1 (en) * | 2018-08-24 | 2021-10-28 | Mitsubishi Gas Chemical Company, Inc. | Compound, composition containing the same, method for forming resist pattern and method for forming insulating film |
WO2020040161A1 (ja) * | 2018-08-24 | 2020-02-27 | 三菱瓦斯化学株式会社 | 化合物、及びそれを含む組成物、並びに、レジストパターンの形成方法及び絶縁膜の形成方法 |
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JP7420002B2 (ja) | 2020-01-08 | 2024-01-23 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
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TW202032270A (zh) | 2020-09-01 |
EP3279727A4 (en) | 2018-10-31 |
KR102548109B1 (ko) | 2023-06-27 |
SG11201706306SA (en) | 2017-09-28 |
US20180074406A1 (en) | 2018-03-15 |
EP3279727A1 (en) | 2018-02-07 |
KR20170132777A (ko) | 2017-12-04 |
CN107533291B (zh) | 2021-06-11 |
JPWO2016158168A1 (ja) | 2018-01-25 |
TWI761818B (zh) | 2022-04-21 |
EP3279727B1 (en) | 2021-06-09 |
JP6845991B2 (ja) | 2021-03-24 |
US11256170B2 (en) | 2022-02-22 |
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