WO2016086855A3 - 一种电子终端 - Google Patents

一种电子终端 Download PDF

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Publication number
WO2016086855A3
WO2016086855A3 PCT/CN2015/096186 CN2015096186W WO2016086855A3 WO 2016086855 A3 WO2016086855 A3 WO 2016086855A3 CN 2015096186 W CN2015096186 W CN 2015096186W WO 2016086855 A3 WO2016086855 A3 WO 2016086855A3
Authority
WO
WIPO (PCT)
Prior art keywords
air
housing
heat
cool
chamber
Prior art date
Application number
PCT/CN2015/096186
Other languages
English (en)
French (fr)
Other versions
WO2016086855A2 (zh
Inventor
郭绪智
张治国
侯志明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2016086855A2 publication Critical patent/WO2016086855A2/zh
Publication of WO2016086855A3 publication Critical patent/WO2016086855A3/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明涉及电子设备技术领域，公开了一种电子终端，包括壳体和安装于壳体内的电路板（7）、散热块（6）以及散热风扇（4）；还包括挡风板（5）；挡风板（5）安装于壳体内以将壳体内空间分隔为冷风入风腔室和散热腔室；电路板（7）以及散热块（6）位于散热腔室内；散热风扇（4）的入风口与冷风入风腔室连通，出风口与散热腔室连通；壳体上设有入风孔（21）和出风孔（13），入风孔（21）设置于壳体的底侧，出风孔（13）设置于壳体的顶侧。上述电子终端中，冷风入风腔室内的冷空气自壳体底侧的入风孔进入，散热腔室内的热空气自壳体顶部的出风孔吹出壳体，散热腔室吹出的热空气无法自壳体底侧设置的入风孔进入冷风入风腔室内，因此散热风扇吹向散热块的空气为冷空气，提高了电子终端的散热效率。
PCT/CN2015/096186 2014-12-03 2015-12-01 一种电子终端 WO2016086855A2 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410729759.3 2014-12-03
CN201410729759.3A CN105658026B (zh) 2014-12-03 2014-12-03 一种电子终端

Publications (2)

Publication Number Publication Date
WO2016086855A2 WO2016086855A2 (zh) 2016-06-09
WO2016086855A3 true WO2016086855A3 (zh) 2016-07-21

Family

ID=56092614

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2015/096186 WO2016086855A2 (zh) 2014-12-03 2015-12-01 一种电子终端

Country Status (2)

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CN (1) CN105658026B (zh)
WO (1) WO2016086855A2 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106639371A (zh) * 2016-11-24 2017-05-10 河北郎尊电力科技有限公司 防涝充电桩
CN108260334A (zh) * 2018-03-22 2018-07-06 四川畅云出行信息技术有限公司 一种车载通信终端的壳体结构
CN111465262A (zh) * 2020-03-23 2020-07-28 珠海精讯知识产权管理有限公司 一种具有强散热功能的设备和基因测序设备
CN112828484B (zh) * 2020-12-30 2023-02-03 江苏沪云激光设备有限公司 一种提高激光设备冷却效率的水冷装置
CN117336236B (zh) * 2023-09-27 2024-05-14 东莞市唯仕达通讯科技有限公司 一种路由器散热调节装置及其方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0282693A (ja) * 1988-09-20 1990-03-23 Matsushita Electric Ind Co Ltd 筺体内冷却装置
CN101072491A (zh) * 2007-07-04 2007-11-14 华为技术有限公司 直通风散热装置及其控制方法
CN201008252Y (zh) * 2007-03-27 2008-01-16 曾国辉 一种热交换器及带热交换器的机柜
US20100181886A1 (en) * 2009-01-21 2010-07-22 Nien-Hui Hsu Heat dissipating module
US7839637B2 (en) * 2008-09-24 2010-11-23 Cisco Technology, Inc. Air-cooling of electronics cards

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Publication number Priority date Publication date Assignee Title
CN2739793Y (zh) * 2004-11-10 2005-11-09 福华电子股份有限公司 热交换式散热器改良结构
CN100470777C (zh) * 2005-08-18 2009-03-18 富准精密工业(深圳)有限公司 散热装置
CN201167281Y (zh) * 2007-02-09 2008-12-17 唐山松下产业机器有限公司 一种逆变焊接电源的整体结构
CN102271478B (zh) * 2011-08-02 2014-05-14 浙江海利普电子科技有限公司 用于容纳电子元件的壳体
CN202455722U (zh) * 2012-02-14 2012-09-26 上海正泰电源***有限公司 一种大功率电力电子设备的布局结构
CN202455251U (zh) * 2012-03-08 2012-09-26 成都希望电子研究所有限公司 小型变频器的散热防尘结构
CN202634974U (zh) * 2012-04-09 2012-12-26 深圳市汇川技术股份有限公司 散热结构及具有该散热结构的功率单元
CN104105378B (zh) * 2013-04-03 2018-01-09 华为技术有限公司 单板散热装置
CN203377798U (zh) * 2013-08-02 2014-01-01 东软飞利浦医疗设备***有限责任公司 大功率高压发生器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0282693A (ja) * 1988-09-20 1990-03-23 Matsushita Electric Ind Co Ltd 筺体内冷却装置
CN201008252Y (zh) * 2007-03-27 2008-01-16 曾国辉 一种热交换器及带热交换器的机柜
CN101072491A (zh) * 2007-07-04 2007-11-14 华为技术有限公司 直通风散热装置及其控制方法
US7839637B2 (en) * 2008-09-24 2010-11-23 Cisco Technology, Inc. Air-cooling of electronics cards
US20100181886A1 (en) * 2009-01-21 2010-07-22 Nien-Hui Hsu Heat dissipating module

Also Published As

Publication number Publication date
CN105658026B (zh) 2018-11-13
WO2016086855A2 (zh) 2016-06-09
CN105658026A (zh) 2016-06-08

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