TWM523004U - 風扇承載裝置 - Google Patents
風扇承載裝置 Download PDFInfo
- Publication number
- TWM523004U TWM523004U TW104218567U TW104218567U TWM523004U TW M523004 U TWM523004 U TW M523004U TW 104218567 U TW104218567 U TW 104218567U TW 104218567 U TW104218567 U TW 104218567U TW M523004 U TWM523004 U TW M523004U
- Authority
- TW
- Taiwan
- Prior art keywords
- fan
- electronic device
- base
- hole
- disposed
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0096—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the lights guides being of the hollow type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B11/00—Communication cables or conductors
- H01B11/18—Coaxial cables; Analogous cables having more than one inner conductor within a common outer conductor
- H01B11/1895—Particular features or applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H3/00—Mechanisms for operating contacts
- H01H3/02—Operating parts, i.e. for operating driving mechanism by a mechanical force external to the switch
- H01H3/12—Push-buttons
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/94—Holders formed as intermediate parts for linking a counter-part to a coupling part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/03—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections
- H01R9/05—Connectors arranged to contact a plurality of the conductors of a multiconductor cable, e.g. tapping connections for coaxial cables
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0068—Battery or charger load switching, e.g. concurrent charging and load supply
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J9/00—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting
- H02J9/04—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source
- H02J9/06—Circuit arrangements for emergency or stand-by power supply, e.g. for emergency lighting in which the distribution system is disconnected from the normal source and connected to a standby source with automatic change-over, e.g. UPS systems
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/22—Conversion of dc power input into dc power output with intermediate conversion into ac
- H02M3/24—Conversion of dc power input into dc power output with intermediate conversion into ac by static converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
- H04B1/036—Cooling arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/18—Construction of rack or frame
- H05K7/186—Construction of rack or frame for supporting telecommunication equipment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
本創作係指一種用於一電子裝置之風扇承載裝置,尤指一種用於包含有垂直設置電子元件之電子裝置的風扇承載裝置,以有效地提高電子裝置的散熱操效果。
為了便利使用者的操作舒適度,同時為了符合不同的居家與工作環境,許多電子裝置的外型趨向一體化與簡潔設計。在此情形下,針對具有垂直設置元件的電子裝置,如何對應設計適用之散熱裝置,同時兼具良好之電子裝置的操作性能與保護機制,已成為業界努力的目標之一。
因此,本創作之主要目的即在於提供一種可有效地提高電子裝置散熱效果的風扇承載裝置。
本創作揭露一種風扇承載裝置,用於一電子裝置,該風扇承載裝置包含有一底座,包含有至少一槽孔;至少一風扇,設置於該底座之該至少一槽孔;以及一導流模組,設置於該底座上,包含有至少一穿透孔,以讓該至少一風扇所對應之氣流能穿透該至少一穿透孔,進而協助該電子裝置之散熱。
請參考第1圖到第3圖,其中,第1圖為本創作實施例一電子裝置1的整體示意圖,第2圖為第1圖中電子裝置1之一風扇承載裝置10的局部示意圖,而第3圖為第1圖中電子裝置1之風扇承載裝置10的***示意圖。
如第1圖所示,本創作實施例中的電子裝置1包含有複數個電子元件PB以及風扇承載裝置10。較佳地,複數個電子元件PB分別為印刷電路板,且係垂直圍繞設置於風扇承載裝置10之外圍結構(即設置於風扇承載裝置10之一底座的邊緣)。在此情形下,將印刷電路板PB間彼此緊鄰設置則可形成一柱狀風道,而風扇承載裝置10則位於柱狀風道的一端,據此,於電子裝置1運作且複數個電子元件PB產生熱能時,本創作可透過風扇承載裝置10中之至少一風扇,並結合柱狀風道之結構設計,以適性地提高電子裝置1的散熱效果來將熱能排出。
詳細來說,如第2圖與第3圖所示,本創作中的風扇承載裝置10包含有一底座100、雙風扇102與一導流模組104。其中,本創作的底座100包含有多個槽孔1000,而雙風扇102係分別對應設置於底座100之多個槽孔1000上,即風扇102內旋轉葉面的結構係對應槽孔1000之大小,以讓風扇102可排出或吸入氣體,以引導熱能排出電子裝置1,當然,本實施例中所用風扇的數量僅為示範性說明,且根據不同電子裝置1的操作方式與耗能需求,風扇的數量可對應減少或增加,皆屬於本創作的範疇。此外,導流模組104設置於底座100上,且包含有至少一穿透孔1040來對應風扇102之位置,以讓風扇102所對應之氣流能穿透至少一穿透孔1040,進而協助電子裝置1之散熱操作。至於本實施例中槽孔1000或穿透孔1040的設置數量或相對位置,在此僅為示範性說明,只要讓兩者的相對位置為上下設置,且配合風扇102之數量與設置來協助氣流的導通,皆屬於本創作的範疇。
再者,本創作的導流模組104還包含有至少一氣流導片1042,鄰近設置於穿透孔1040之一周圍,並用來導引風扇102所對應氣流的流動方向。換句話說,本創作的氣流導片1042可形成一環狀隔板,且環狀隔板的高度可適性調整而無須統一高度,據此,環狀隔板一方面可防止組裝者拆裝風扇承載裝置10時異物***至穿透孔1040內,另一方面氣流導片1042的環狀隔板還可引導風扇102氣流為垂直由下往上流動,而不致使氣流隨意形成局部的小漩渦且亂竄於電子裝置1的柱狀風道中,進而提高電子裝置1內整體的散熱效果。
當然,本創作中風扇承載裝置10之一殼體還可設置有至少一散熱孔(圖中未示),且散熱孔的位置可根據電子裝置1的組成元件適性調整。據此,當風扇102所對應氣流的流動方向係由下往上時,風扇102可透過槽孔1000吸入外在氣體(例如一溫度較低的空氣),且通過氣流導片1042之環狀隔板引導氣流垂直由下往上流動,以讓至少一散熱孔可對應排出風扇承載裝置10的內在氣體(例如一溫度較高的空氣),在此情況下,由於槽孔1000吸入外在氣體之流量可對應至少一散熱孔排出電子裝置1的內在氣體,並藉由該些空氣流體的對流效應,本實施例即可加快電子裝置1的散熱效率。
除此之外,由於熱空氣密度較低而有向上流動的趨勢,本創作實施例的風扇承載裝置10係設置於電子裝置1的底層,以讓風扇102由底層的槽孔1000吸入外在氣體,並藉由電子裝置1的柱狀風道來將熱能由下往上排出電子裝置1。當然,本創作實施例中的風扇承載裝置10亦可設置於電子裝置1之殼體的一側邊或一頂部,並維持電子裝置1柱狀風道內有快速流動之空氣流體者,此亦屬於本創作的範疇。於其他實施例中,本領域具通常知識者還可對應增設至少一輔助風扇於電子裝置1之殼體的側邊/頂部,且可適性取代(或合作)於原本設置於底層的風扇102,以操作輔助風扇來直接抽出電子裝置1的內在氣體,並與電子裝置1殼體上至少一散熱孔間形成良好之氣體流動。
舉例來說,請參考第4圖與第5圖,第4圖與第5圖所示為本創作實施例另一電子裝置4、5的簡單透視圖。如第4圖所示,電子裝置4中的風扇100將設置於殼體的至少一側邊上,且電子裝置1的殼體上亦可設置有散熱孔或進氣孔HL,並透過風扇100的旋轉操作來快速排出內在氣體,並形成空氣流體之流動效果。此外,如第5圖所示,電子裝置5中的風扇100將設置於電子裝置1的頂部處,且電子裝置1的殼體上亦設置有散熱孔或進氣孔HL,再透過風扇100的旋轉操作,亦可達成快速排出電子裝置1內在氣體之散熱效果。當然,以上實施例中風扇100、散熱孔或進氣孔HL的設置數量或相對位置,在此僅為示範性說明,而本領域具通常知識者還可適性結合/修改/設計以上多個實施例中風扇的使用數量與設置位置,以達到電子裝置的最佳散熱效果者,此皆屬於本創作的範疇。
綜上所述,本創作實施例可提供一種用於電子裝置的風扇承載裝置,其可透過電子裝置的柱狀風道以及導流模組之結構設計,對應讓風扇旋轉所引導之氣流可由下往上,來將電子裝置所產生的熱能統一排出,以提高電子裝置的散熱效果,同時,再搭配其他數量之輔助風扇的使用,還可解決電子裝置操作於不同工作狀況下的熱能排出效率與速度。
1、4、5‧‧‧電子裝置
10‧‧‧風扇承載裝置
100‧‧‧底座
1000‧‧‧槽孔
102‧‧‧風扇
104‧‧‧導流模組
1040‧‧‧穿透孔
1042‧‧‧氣流導片
PB‧‧‧印刷電路板
HL‧‧‧散熱孔
10‧‧‧風扇承載裝置
100‧‧‧底座
1000‧‧‧槽孔
102‧‧‧風扇
104‧‧‧導流模組
1040‧‧‧穿透孔
1042‧‧‧氣流導片
PB‧‧‧印刷電路板
HL‧‧‧散熱孔
第1圖所示為本創作實施例一電子裝置的整體示意圖。 第2圖所示為第1圖中電子裝置之一風扇承載裝置的局部示意圖。 第3圖所示為第1圖中電子裝置之一風扇承載裝置的***示意圖。 第4圖與第5圖所示為本創作實施例另一電子裝置的透視圖。
10‧‧‧風扇承載裝置
100‧‧‧底座
1000‧‧‧槽孔
102‧‧‧風扇
104‧‧‧導流模組
1040‧‧‧穿透孔
1042‧‧‧氣流導片
Claims (6)
- 一種風扇承載裝置,用於一電子裝置,該風扇承載裝置包含有: 一底座,包含有至少一槽孔; 至少一風扇,設置於該底座之該至少一槽孔;以及 一導流模組,設置於該底座上,包含有至少一穿透孔,以讓該至少一風扇所對應之氣流能穿透該至少一穿透孔,進而協助該電子裝置之散熱。
- 如請求項1所述之風扇承載裝置,其中該導流模組還包含有至少一氣流導片,鄰近設置於該穿透孔,用來導引該至少一風扇所對應之氣流的流動方向。
- 如請求項2所述之風扇承載裝置,其中該電子裝置包含有複數個電子元件,每一電子元件垂直設置於該底座之一邊緣,並產生熱能,而該至少一風扇所對應之氣流用以排除該複數個電子元件所產生之熱能。
- 如請求項3所述之風扇承載裝置,其中該電子裝置之一殼體還設置有至少一散熱孔,該至少一風扇透過該至少一槽孔吸入一外在氣體,並透過該至少一散熱孔排出,以對該複數個電子元件進行散熱。
- 如請求項3所述之風扇承載裝置,其中該複數個電子元件為複數個印刷電路板,且該複數個印刷電路板係圍繞該風扇承載裝置。
- 如請求項1所述之風扇承載裝置,其還包含有至少一輔助風扇,設置於該電子裝置之一側邊或一頂部,來抽出該電子裝置之一內在氣體,並結合該電子裝置之一殼體之至少一散熱孔來形成該內在氣體之流動。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW104218567U TWM523004U (zh) | 2015-07-16 | 2015-11-19 | 風扇承載裝置 |
US15/140,487 US20170020031A1 (en) | 2015-07-16 | 2016-04-28 | Fan Carrier Apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562193099P | 2015-07-16 | 2015-07-16 | |
TW104218567U TWM523004U (zh) | 2015-07-16 | 2015-11-19 | 風扇承載裝置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM523004U true TWM523004U (zh) | 2016-06-01 |
Family
ID=57965068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104218567U TWM523004U (zh) | 2015-07-16 | 2015-11-19 | 風扇承載裝置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20170020031A1 (zh) |
TW (1) | TWM523004U (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6074395B2 (ja) * | 2014-09-12 | 2017-02-01 | 富士フイルム株式会社 | コンテンツ管理システム、管理コンテンツ生成方法、管理コンテンツ再生方法、プログラムおよび記録媒体 |
US10325391B2 (en) * | 2016-11-21 | 2019-06-18 | Qualcomm Incorporated | Oriented image stitching for spherical image content |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7500911B2 (en) * | 2002-11-25 | 2009-03-10 | American Power Conversion Corporation | Exhaust air removal system |
CN101848621B (zh) * | 2009-03-24 | 2012-06-20 | 鸿富锦精密工业(深圳)有限公司 | 散热器 |
TW201205026A (en) * | 2010-07-27 | 2012-02-01 | Hon Hai Prec Ind Co Ltd | Air duct and electronic device using the same |
-
2015
- 2015-11-19 TW TW104218567U patent/TWM523004U/zh not_active IP Right Cessation
-
2016
- 2016-04-28 US US15/140,487 patent/US20170020031A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US20170020031A1 (en) | 2017-01-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI573519B (zh) | 可攜帶式電子裝置及其散熱模組 | |
JP2007047998A (ja) | 電子部品冷却構造及び情報処理装置 | |
JP2012019212A (ja) | 導風カバー及び該導風カバーを有する電子装置 | |
JP2018045913A (ja) | 誘導加熱調理器 | |
TW201305794A (zh) | 電子裝置 | |
JP2011034309A (ja) | 電子機器 | |
TWM523004U (zh) | 風扇承載裝置 | |
CN102316700A (zh) | 适用同时对多个电子元件散热的导风罩及具有该导风罩的电子装置 | |
TWI461607B (zh) | 抽氣式散熱裝置 | |
TW201639432A (zh) | 電子裝置殼體 | |
TW201422135A (zh) | 電子裝置 | |
JP4466640B2 (ja) | 電子機器の放熱構造 | |
TW201248371A (en) | Heat dissipating system for computer | |
JP2019054055A (ja) | ファンユニット及び電子機器 | |
TWI564699B (zh) | 散熱組件及顯示卡模組 | |
TWM505789U (zh) | 導風結構 | |
JP5823444B2 (ja) | 電子機器 | |
JP4897107B2 (ja) | 電子機器 | |
JP5733144B2 (ja) | 電子機器 | |
JPWO2021193879A5 (zh) | ||
CN2929814Y (zh) | 一种电脑机箱散热装置 | |
TW201427582A (zh) | 擴充底座散熱裝置 | |
TW201630518A (zh) | 電子裝置 | |
TW201431478A (zh) | 擴充底座散熱裝置 | |
TW201343059A (zh) | 伺服器散熱組件 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4K | Annulment or lapse of a utility model due to non-payment of fees |