WO2015029846A1 - Sealant for display element, and oxime ester initiator - Google Patents
Sealant for display element, and oxime ester initiator Download PDFInfo
- Publication number
- WO2015029846A1 WO2015029846A1 PCT/JP2014/071714 JP2014071714W WO2015029846A1 WO 2015029846 A1 WO2015029846 A1 WO 2015029846A1 JP 2014071714 W JP2014071714 W JP 2014071714W WO 2015029846 A1 WO2015029846 A1 WO 2015029846A1
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- WO
- WIPO (PCT)
- Prior art keywords
- group
- carbon atoms
- groups
- alkyl
- carbon
- Prior art date
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- -1 oxime ester Chemical class 0.000 title claims abstract description 141
- 239000000565 sealant Substances 0.000 title claims abstract description 65
- 239000003999 initiator Substances 0.000 title claims abstract description 26
- 239000000178 monomer Substances 0.000 claims abstract description 101
- 150000001875 compounds Chemical class 0.000 claims abstract description 99
- 125000000524 functional group Chemical group 0.000 claims abstract description 76
- 150000004291 polyenes Chemical class 0.000 claims abstract description 66
- 125000003396 thiol group Chemical group [H]S* 0.000 claims abstract description 57
- 229920006295 polythiol Polymers 0.000 claims abstract description 50
- 239000007870 radical polymerization initiator Substances 0.000 claims abstract description 46
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims abstract description 24
- 238000010438 heat treatment Methods 0.000 claims abstract description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 138
- 125000000217 alkyl group Chemical group 0.000 claims description 48
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 39
- 238000007789 sealing Methods 0.000 claims description 37
- 239000003795 chemical substances by application Substances 0.000 claims description 36
- 238000006243 chemical reaction Methods 0.000 claims description 35
- 150000003568 thioethers Chemical class 0.000 claims description 32
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 31
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 23
- 125000003545 alkoxy group Chemical group 0.000 claims description 19
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 18
- 125000005843 halogen group Chemical group 0.000 claims description 14
- 125000002252 acyl group Chemical group 0.000 claims description 12
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 12
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims description 11
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 125000001424 substituent group Chemical group 0.000 claims description 11
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 claims description 9
- 125000006678 phenoxycarbonyl group Chemical group 0.000 claims description 9
- 125000004434 sulfur atom Chemical group 0.000 claims description 9
- 125000004453 alkoxycarbonyl group Chemical group 0.000 claims description 8
- 239000001257 hydrogen Substances 0.000 claims description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 125000003342 alkenyl group Chemical group 0.000 claims description 7
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 claims description 7
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 5
- 125000003884 phenylalkyl group Chemical group 0.000 claims description 5
- 150000001721 carbon Chemical group 0.000 claims description 4
- 125000004423 acyloxy group Chemical group 0.000 claims description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 claims description 2
- 125000004429 atom Chemical group 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 125000001231 benzoyloxy group Chemical group C(C1=CC=CC=C1)(=O)O* 0.000 claims description 2
- 125000001188 haloalkyl group Chemical group 0.000 claims description 2
- 125000002768 hydroxyalkyl group Chemical group 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 35
- 239000000463 material Substances 0.000 abstract description 28
- 238000011109 contamination Methods 0.000 abstract description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 46
- 239000010408 film Substances 0.000 description 41
- 239000000758 substrate Substances 0.000 description 38
- 239000004593 Epoxy Substances 0.000 description 34
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 27
- 238000006460 hydrolysis reaction Methods 0.000 description 23
- 229910000077 silane Inorganic materials 0.000 description 23
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 22
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- 239000000047 product Substances 0.000 description 21
- 239000003054 catalyst Substances 0.000 description 20
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 239000000243 solution Substances 0.000 description 20
- 239000004973 liquid crystal related substance Substances 0.000 description 19
- 150000003855 acyl compounds Chemical class 0.000 description 17
- 230000000052 comparative effect Effects 0.000 description 17
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- 229910010272 inorganic material Inorganic materials 0.000 description 16
- 239000011147 inorganic material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 16
- 238000006482 condensation reaction Methods 0.000 description 15
- 150000002923 oximes Chemical class 0.000 description 15
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 14
- 230000007062 hydrolysis Effects 0.000 description 14
- 239000002904 solvent Substances 0.000 description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 12
- 238000002834 transmittance Methods 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 11
- 229910052753 mercury Inorganic materials 0.000 description 11
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 11
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 10
- 239000007789 gas Substances 0.000 description 10
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 238000007740 vapor deposition Methods 0.000 description 10
- 229940126062 Compound A Drugs 0.000 description 9
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000002093 peripheral effect Effects 0.000 description 9
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 9
- LVTJOONKWUXEFR-FZRMHRINSA-N protoneodioscin Natural products O(C[C@@H](CC[C@]1(O)[C@H](C)[C@@H]2[C@]3(C)[C@H]([C@H]4[C@@H]([C@]5(C)C(=CC4)C[C@@H](O[C@@H]4[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@@H](O)[C@H](O[C@H]6[C@@H](O)[C@@H](O)[C@@H](O)[C@H](C)O6)[C@H](CO)O4)CC5)CC3)C[C@@H]2O1)C)[C@H]1[C@H](O)[C@H](O)[C@H](O)[C@@H](CO)O1 LVTJOONKWUXEFR-FZRMHRINSA-N 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 8
- 230000001678 irradiating effect Effects 0.000 description 8
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 8
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 8
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 7
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 239000007795 chemical reaction product Substances 0.000 description 7
- 238000005227 gel permeation chromatography Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 230000009257 reactivity Effects 0.000 description 7
- 239000000741 silica gel Substances 0.000 description 7
- 229910002027 silica gel Inorganic materials 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 6
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 6
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical group C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 6
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 229910001873 dinitrogen Inorganic materials 0.000 description 6
- 238000010791 quenching Methods 0.000 description 6
- 230000000171 quenching effect Effects 0.000 description 6
- 239000011342 resin composition Substances 0.000 description 6
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 5
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
- 238000001723 curing Methods 0.000 description 5
- PESYEWKSBIWTAK-UHFFFAOYSA-N cyclopenta-1,3-diene;titanium(2+) Chemical group [Ti+2].C=1C=C[CH-]C=1.C=1C=C[CH-]C=1 PESYEWKSBIWTAK-UHFFFAOYSA-N 0.000 description 5
- 125000003700 epoxy group Chemical group 0.000 description 5
- 235000019253 formic acid Nutrition 0.000 description 5
- OWFXIOWLTKNBAP-UHFFFAOYSA-N isoamyl nitrite Chemical compound CC(C)CCON=O OWFXIOWLTKNBAP-UHFFFAOYSA-N 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 4
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 4
- LBJZZFXUVYHXPH-UHFFFAOYSA-N 3-prop-2-enoxypropanoic acid Chemical compound OC(=O)CCOCC=C LBJZZFXUVYHXPH-UHFFFAOYSA-N 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- 239000005977 Ethylene Substances 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 239000004793 Polystyrene Substances 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 239000007983 Tris buffer Substances 0.000 description 4
- 238000012644 addition polymerization Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000007859 condensation product Substances 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 230000032050 esterification Effects 0.000 description 4
- 238000005886 esterification reaction Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000005525 hole transport Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 125000000962 organic group Chemical group 0.000 description 4
- 150000001451 organic peroxides Chemical class 0.000 description 4
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920002223 polystyrene Polymers 0.000 description 4
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 4
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000001771 vacuum deposition Methods 0.000 description 4
- LOZWAPSEEHRYPG-UHFFFAOYSA-N 1,4-dithiane Chemical group C1CSCCS1 LOZWAPSEEHRYPG-UHFFFAOYSA-N 0.000 description 3
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 3
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- JOBBTVPTPXRUBP-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS JOBBTVPTPXRUBP-UHFFFAOYSA-N 0.000 description 3
- YAAUVJUJVBJRSQ-UHFFFAOYSA-N [3-(3-sulfanylpropanoyloxy)-2-[[3-(3-sulfanylpropanoyloxy)-2,2-bis(3-sulfanylpropanoyloxymethyl)propoxy]methyl]-2-(3-sulfanylpropanoyloxymethyl)propyl] 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(COC(=O)CCS)(COC(=O)CCS)COCC(COC(=O)CCS)(COC(=O)CCS)COC(=O)CCS YAAUVJUJVBJRSQ-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- 235000019437 butane-1,3-diol Nutrition 0.000 description 3
- 230000003197 catalytic effect Effects 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 125000001309 chloro group Chemical group Cl* 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 229910052731 fluorine Inorganic materials 0.000 description 3
- 125000001153 fluoro group Chemical group F* 0.000 description 3
- 230000003301 hydrolyzing effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 125000001160 methoxycarbonyl group Chemical group [H]C([H])([H])OC(*)=O 0.000 description 3
- REEZZSHJLXOIHL-UHFFFAOYSA-N octanoyl chloride Chemical compound CCCCCCCC(Cl)=O REEZZSHJLXOIHL-UHFFFAOYSA-N 0.000 description 3
- 238000010943 off-gassing Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- 229940113165 trimethylolpropane Drugs 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000013585 weight reducing agent Substances 0.000 description 3
- 0 *C(C(c(cc1)ccc1N)=O)=NOC(*)=O Chemical compound *C(C(c(cc1)ccc1N)=O)=NOC(*)=O 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2,2'-azo-bis-isobutyronitrile Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 2
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- BXYWKXBAMJYTKP-UHFFFAOYSA-N 2-[2-[2-[2-(3-sulfanylpropanoyloxy)ethoxy]ethoxy]ethoxy]ethyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCCOCCOCCOCCOC(=O)CCS BXYWKXBAMJYTKP-UHFFFAOYSA-N 0.000 description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 2
- IXOFPUCWZCAFJX-UHFFFAOYSA-N 2-phenylethanethioic s-acid Chemical compound SC(=O)CC1=CC=CC=C1 IXOFPUCWZCAFJX-UHFFFAOYSA-N 0.000 description 2
- QHOGNNXLGUVURK-UHFFFAOYSA-N 2-phenylsulfanylethyl acetate Chemical compound CC(=O)OCCSC1=CC=CC=C1 QHOGNNXLGUVURK-UHFFFAOYSA-N 0.000 description 2
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical group [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- WETWJCDKMRHUPV-UHFFFAOYSA-N acetyl chloride Chemical compound CC(Cl)=O WETWJCDKMRHUPV-UHFFFAOYSA-N 0.000 description 2
- 239000012346 acetyl chloride Substances 0.000 description 2
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 2
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
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Images
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
- C08G75/02—Polythioethers
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C321/00—Thiols, sulfides, hydropolysulfides or polysulfides
- C07C321/24—Thiols, sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
- C07C321/28—Sulfides, hydropolysulfides, or polysulfides having thio groups bound to carbon atoms of six-membered aromatic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/32—Compounds containing nitrogen bound to oxygen
- C08K5/33—Oximes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/22—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterised by the initiator used in polymerisation
- C08G2650/24—Polymeric initiators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
Definitions
- the present invention relates to a sealant for a display element that can suppress generation of outgas and contamination of other materials, and is excellent in adhesiveness and transparency of a cured product. Moreover, this invention relates to the oxime ester initiator which can be used suitably for this sealing agent for display elements.
- liquid crystal display elements In recent years, liquid crystal display elements, organic EL display elements, and the like are widely used as display elements having features such as thinness, light weight, and low power consumption.
- a sealant for a display element is usually used for sealing a liquid crystal or a light emitting layer, bonding a substrate, an optical film, or a protective film.
- Patent Document 1 discloses a pressure-sensitive adhesive for a polarizing film made of an acrylic resin composition.
- Patent Document 2 discloses a method of forming a resin film made of an acrylic resin composition on an inorganic material film.
- the acrylic sealant for display elements as disclosed in Patent Document 1 and Patent Document 2 generates a large amount of outgas due to the acrylic resin remaining in the manufacturing process of the display elements, and exhibits adhesion and curing. There was a problem that the transparency of things was inferior.
- An object of the present invention is to provide a sealant for a display element that can suppress generation of outgas and contamination of other materials and is excellent in adhesiveness and transparency of a cured product. Moreover, an object of this invention is to provide the oxime ester initiator which can be used suitably for this sealing agent for display elements.
- the present invention comprises a polythiol monomer having two or more thiol groups in one molecule, a polyene monomer having two or more carbon-carbon double bonds in one molecule, and a radical polymerization initiator,
- the polymerization initiator is a sealant for a display element, which is a compound having a functional group that generates radicals by light irradiation or heating and a reactive functional group.
- the present inventor uses a polythiol monomer having two or more thiol groups in one molecule instead of an acrylic resin as a sealant for a display element that is excellent in adhesiveness and transparency of a cured product, and in one molecule. It was investigated to use a resin composition containing a polyene monomer having two or more carbon-carbon double bonds. However, even when such a resin composition is used, the problem of outgas generation cannot be completely solved. In addition, when the obtained sealant for display element comes into contact with the liquid crystal of the liquid crystal display element, the liquid crystal is contaminated, or when it comes into contact with the organic light emitting material layer of the organic EL display element, the organic light emitting material layer is damaged. Sometimes happened.
- the sealant for a display element of the present invention includes, as a polymerizable compound, a polythiol monomer having two or more thiol groups in one molecule (hereinafter also simply referred to as “polythiol monomer”) and two or more in one molecule. And a polyene monomer having a carbon-carbon double bond (hereinafter also simply referred to as “polyene monomer”).
- the sealant for display elements of the present invention containing these components is excellent in adhesiveness and transparency of the cured product.
- the “carbon-carbon double bond” means an ethylenically unsaturated bond.
- polythiol monomer examples include aliphatic polythiols such as ethanedithiol, propanedithiol, hexamethylenedithiol and decamethylenedithiol, aromatic polythiols such as tolylene-2,4-dithiol and xylenedithiol, and the following formula (1)
- a cyclic sulfide compound such as a 1,4-dithiane ring-containing polythiol compound, an ester bond-containing polythiol compound, diglycol dimercaptan, triglycol dimercaptan, tetraglycol dimercaptan, thiodiglycol dimercaptan, thiotril Glycol dimercaptan, thiotetraglycol dimercaptan, tris- (3-mercaptopropionyloxy) -ethyl isocyanurate, tetraethylene glycol-bis (3-mercaptop) Pionate), tri
- l represents an integer of 1 to 5.
- 1,4-dithiane ring-containing polythiol compound represented by the above formula (1) examples include 2,5-dimercaptomethyl-1,4-dithiane and 2,5-dimercaptoethyl-1 , 4-dithiane, 2,5-dimercaptopropyl-1,4-dithiane, 2,5-dimercaptobutyl-1,4-dithiane and the like.
- an ester bond-containing polythiol monomer is preferable because the obtained sealant for display elements is excellent in transparency.
- ester bond-containing polythiol monomer examples include trimethylolpropane tris (3-mercaptopropionate), tris-((3-mercaptopropionyloxy) -ethyl) -isocyanurate, pentaerythritol tetrakisthioglycol. Rate, pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), and the like.
- trimethylolpropane tris (3-mercaptopropionate), pentaerythritol-tetrakis (3-mercaptopropionate), dipentaerythritol-hexakis (3-mercaptopropionate), 1,4-dithiane ring included Polythiol compounds are preferred, and trimethylolpropane tris (3-mercaptopropionate) and dipentaerythritol-hexakis (3-mercaptopropionate) are more preferred.
- the said polythiol monomer contains the monomer (trifunctional or more polythiol monomer) which has a 3 or more thiol group in 1 molecule.
- the tri- or higher functional polythiol monomer is preferably a monomer having 3 to 20 thiol groups in one molecule, and more preferably a monomer having 3 to 8 thiol groups in one molecule.
- the preferable lower limit of the content of the polythiol monomer in 100 parts by weight of the whole polymerizable compound is 1 part by weight, and the preferable upper limit is 89 parts by weight.
- the content of the polythiol monomer is less than 1 part by weight, coatability may be deteriorated.
- the content of the polythiol monomer exceeds 89 parts by weight generation of outgas may not be sufficiently suppressed.
- the minimum with more preferable content of the said polythiol monomer is 5 weight part, and a more preferable upper limit is 69 weight part.
- polyene monomer examples include (meth) allyl compounds, (meth) acrylic compounds, divinylbenzene, and the like. These polyene monomers may be used alone or in combination of two or more.
- the “(meth) allyl” means allyl or methallyl
- the “(meth) acryl” means acryl or methacryl.
- Examples of the (meth) allyl compound include triallyl cyanurate, triallyl isocyanurate, trimethallyl isocyanurate, diallyl maleate, diallyl adipate, diallyl phthalate, triallyl trimellitate, tetraallyl pyromellitate, glyceryl diallyl Ether, trimethylolpropane diallyl ether, pentaerythritol, diallyl ether, 1,3-diallyl-5-glycidyl isocyanurate, 1,3,4,6-tetraallylglycoluril, 1,3,4,6-tetraallyl-3a -Methyl glycoluril, 1,3,4,6-tetraallyl-3a, 6a-dimethylglycoluril and the like. Of these, triallyl cyanurate, triallyl isocyanurate, and 1,3,4,6-tetraallylglycoluril are preferable.
- the (meth) acrylic compound is not particularly limited as long as it is a compound having two or more acryloyl groups or methacryloyl groups in one molecule.
- the “(meth) acrylate” means acrylate or methacrylate
- the “epoxy (meth) acrylate” refers to all the epoxy groups in the epoxy compound and (meth) acrylic acid. It represents the reacted compound.
- the epoxy (meth) acrylate is not particularly limited, and examples thereof include those obtained by reacting (meth) acrylic acid and an epoxy compound in the presence of a basic catalyst according to a conventional method.
- examples of the epoxy compound used as a raw material for the epoxy (meth) acrylate include bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, 2,2′-diallyl bisphenol A type epoxy compound, and hydrogenated bisphenol.
- Type epoxy compound propylene oxide-added bisphenol A type epoxy compound, resorcinol type epoxy compound, biphenyl type epoxy compound, sulfide type epoxy compound, diphenyl ether type epoxy compound, dicyclopentadiene type epoxy compound, naphthalene type epoxy compound, phenol novolac type epoxy compound , Orthocresol novolac type epoxy compound, dicyclopentadiene novolac type epoxy compound, biphenyl novolac type epoxy Xyl compounds, naphthalenephenol novolac type epoxy compounds, glycidylamine type epoxy compounds, alkyl polyol type epoxy compounds, rubber-modified epoxy compounds, glycidyl ester compounds, bisphenol A type episulfide compounds, and the like.
- ester compounds obtained by reacting the (meth) acrylic acid with a compound having a hydroxyl group examples of the bifunctional compounds include 1,4-butanediol di (meth) acrylate and 1,3-butanediol.
- those having three or more functional groups include, for example, pentaerythritol tri (meth) acrylate, trimethylolpropane tri (meth) acrylate, propylene oxide-added trimethylolpropane tri (meth) acrylate, and ethylene oxide-added tri Methylolpropane tri (meth) acrylate, caprolactone-modified trimethylolpropane tri (meth) acrylate, ethylene oxide-added isocyanuric acid tri (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, ditrimethylolpropane Tetra (meth) acrylate, pentaerythritol tetra (meth) acrylate, glycerin tri (meth) acrylate, propylene N'okishido added glycer
- the polyene monomer preferably contains a monomer having three or more carbon-carbon double bonds in one molecule (a polyene monomer having three or more functions).
- the trifunctional or higher polyene monomer is preferably a monomer having 3 to 20 carbon-carbon double bonds in one molecule, and a monomer having 3 to 8 carbon-carbon double bonds in one molecule. More preferred.
- the preferable lower limit of the content of the polyene monomer in 100 parts by weight of the total polymerizable compound is 1 part by weight, and the preferable upper limit is 89 parts by weight.
- the content of the polyene monomer is less than 1 part by weight, coatability may be deteriorated.
- the content of the polyene monomer exceeds 89 parts by weight unreacted polyene monomer may remain and outgas may be generated.
- a more preferable lower limit of the content of the polyene monomer is 5 parts by weight, a more preferable upper limit is 79 parts by weight, and a still more preferable upper limit is 69 parts by weight.
- the cured product of the obtained sealant for display elements has a high elastic modulus and is excellent in transparency and adhesiveness, those having a siloxane bond as the polythiol monomer and / or the polyene monomer are also suitable. Used for.
- the siloxane bond is preferably derived from silsesquioxane. That is, the polythiol monomer having a siloxane bond is preferably a silsesquioxane resin having two or more thiol groups in one molecule (hereinafter also referred to as “thiol group-containing silsesquioxane resin”).
- the polyene monomer having a siloxane bond is preferably a silsesquioxane resin having two or more reactive functional groups in one molecule (hereinafter also referred to as “reactive functional group-containing silsesquioxane resin”).
- the thiol group-containing silsesquioxane resin used as the polythiol monomer is a hydrolysis condensate of a thiol group-containing silane compound represented by the following formula (2) (hereinafter also referred to as “hydrolysis condensate (a)”). Preferably there is.
- hydrolysis condensate (a) is used as the polythiol monomer, the transparency, elastic modulus, and adhesiveness of the cured product of the obtained resin composition can be further increased.
- R 1 represents a C 1-8 organic group having a thiol group and no aromatic ring, or an organic group having a thiol group and an aromatic ring
- R 2 represents a hydrogen atom, an organic group having 1 to 8 carbon atoms having no aromatic ring, or an organic group having an aromatic ring.
- R 1 examples include, for example, an aliphatic hydrocarbon group having 1 to 8 carbon atoms having a thiol group, an alicyclic hydrocarbon group having 1 to 8 carbon atoms having a thiol group, and an aromatic having a thiol group.
- Group hydrocarbon group and the like The hydrocarbon group in R 1 is a group containing not only a carbon atom and a hydrogen atom but also a sulfur atom derived from a thiol group.
- R 2 include a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group having 1 to 8 carbon atoms, and an aromatic hydrocarbon group.
- the R 2 may be the same or different.
- a hydrolysis-condensation product (a) can be obtained by hydrolyzing and condensing the thiol group-containing silane compound represented by the above formula (2). That is, a hydrolysis-condensation product (a) can be obtained by a hydrolysis reaction and a condensation reaction.
- Examples of the thiol group-containing silane compound represented by the above formula (2) include 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyltripropoxysilane, and 3-mercaptopropyltributoxysilane.
- thiol group-containing silane compound represented by the above formula (2) may be used alone or in combination of two or more.
- Examples of the other crosslinkable compounds include trialkylalkoxysilane, dialkyldialkoxysilane, alkyltrialkoxysilane, tetraalkoxysilane, tetraalkoxytitanium, tetraalkoxyzirconium and the like.
- a trialkylalkoxysilane, a dialkyldialkoxysilane, or a tetraalkoxysilane is used as the other crosslinkable compound, the crosslink density of the hydrolysis condensate (a) can be easily adjusted.
- alkyltrialkoxysilane is used as the other crosslinkable compound
- the number of thiol groups contained in the hydrolysis condensate (a) can be easily adjusted.
- tetraalkoxytitanium or tetraalkoxyzirconium is used as the other crosslinkable compound, the refractive index of the cured product of the resulting resin composition can be increased.
- Said other crosslinking compound may be used independently and 2 or more types may be used together.
- trialkylalkoxysilane examples include trimethylmethoxysilane, trimethylethoxysilane, triethylmethoxysilane, triethylethoxysilane, triphenylmethoxysilane, triphenylethoxysilane, and the like.
- dialkyl dialkoxysilane examples include dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3- Examples include mercaptopropylmethyldimethoxysilane.
- alkyltrialkoxysilane examples include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane.
- examples of the tetraalkoxysilane include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, and tetrabutoxysilane.
- examples of the tetraalkoxy titanium examples include tetramethoxy titanium, tetraethoxy titanium, tetrapropoxy titanium, and tetrabutoxy titanium.
- examples of the tetraalkoxyzirconium examples include tetraethoxyzirconium, tetrapropoxyzirconium, and tetrabutoxyzirconium.
- a catalyst In the hydrolysis reaction for obtaining the hydrolysis condensate (a), it is preferable to use a catalyst.
- a conventionally known catalyst can be used as the catalyst, and is not particularly limited, but formic acid is preferable because it has high catalytic activity and functions as a catalyst for the condensation reaction.
- the content of the catalyst is preferably 0.1 parts by weight with respect to 100 parts by weight of the thiol group-containing silane compound or 100 parts by weight of the thiol group-containing silane compound and the other crosslinkable compound.
- the preferred upper limit is 25 parts by weight.
- the content of the catalyst is less than 0.1 parts by weight, the catalytic effect may not be sufficiently exhibited.
- the content of the catalyst exceeds 25 parts by weight, the storage stability of the silsesquioxane resin containing a thiol group may be lowered, or the catalyst may not be easily removed in a subsequent step.
- a more preferable lower limit of the content of the catalyst is 1 part by weight, and a more preferable upper limit is 10 parts by weight.
- the reaction temperature and reaction time of the hydrolysis reaction can be arbitrarily set according to the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound.
- the reaction temperature is usually 0 to 100 ° C., preferably 20 to 60 ° C., and the reaction time is about 1 minute to 2 hours.
- a solvent may be used in the hydrolysis reaction.
- the kind of said solvent is not specifically limited, It is preferable that it is the same as the solvent used for the condensation reaction mentioned later.
- the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound is low, it is preferable not to use a solvent during the hydrolysis reaction.
- the hydrolysis reaction is [number of moles of hydroxyl groups generated by the hydrolysis reaction] / [above
- the total number of alkoxy groups in the thiol group-containing silane compound or the composition containing the thiol group-containing silane compound and the other crosslinkable compound] (hereinafter also referred to as “molar ratio A”) is 0.5. It is preferable to make it progress so that it may become the above.
- the molar ratio A is more preferably 0.8 or more.
- condensation reaction water is generated between the hydroxyl groups generated by hydrolysis, and further, alcohol is generated between the hydroxyl group and the alkoxy group.
- the hydrolysis condensate (a) is vitrified.
- condensation catalyst In the condensation reaction, a conventionally known condensation catalyst can be used.
- Formic acid has high catalytic activity and acts not only as a catalyst for hydrolysis reaction but also as a catalyst for condensation reaction. Therefore, the condensation catalyst is preferably formic acid.
- the reaction temperature and reaction time in the condensation reaction can be arbitrarily set according to the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound.
- the reaction temperature is usually about 40 to 150 ° C., preferably 60 to 100 ° C., and the reaction time is about 30 minutes to 12 hours.
- the reaction is included in [the total number of moles of unreacted hydroxyl group and unreacted alkoxy group] / [the thiol group-containing silane compound, or the composition containing the thiol group-containing silane compound and the other crosslinkable compound.
- the total number of moles of alkoxy groups] (hereinafter also referred to as “molar ratio B”) is preferably 0.3 or less.
- the molar ratio B is more preferably 0.2 or less.
- the preferable lower limit of the total concentration of the thiol group-containing silane compound or the thiol group-containing silane compound and the other crosslinkable compound is 2% by weight, and the preferable upper limit is 80% by weight.
- concentration is within the above range, gelation becomes difficult during the reaction, the molecular weight of the hydrolysis condensate (a) does not become too large, and the storage stability of the hydrolysis condensate (a) is further enhanced.
- a more preferred lower limit of the concentration is 15% by weight, and a more preferred upper limit is 60% by weight.
- the condensation reaction it is preferable to use a solvent having a boiling point higher than that of water and alcohol produced by the condensation reaction.
- the solvent can be easily removed from the reaction system.
- the said solvent may be used independently and 2 or more types may be used together.
- the said other crosslinkable compound can also be used as a solvent.
- the catalyst it is preferable to remove the catalyst after the condensation reaction.
- the storage stability of the hydrolysis-condensation product (a) can be enhanced.
- a known method can be appropriately selected according to the type of catalyst, and examples thereof include a method of heating above the boiling point of the catalyst and a method of reducing the pressure.
- the catalyst is formic acid, formic acid can be easily removed by these methods.
- Examples of the reactive functional group-containing silsesquioxane resin that serves as the polyene monomer include those having the thiol group of the thiol group-containing silsesquioxane resin as a group having a carbon-carbon double bond.
- a hydrolytic condensate of a reactive functional group-containing silane compound in which R 1 in the above formula (2) is the reactive functional group or a group containing the reactive functional group (hereinafter referred to as “hydrolytic condensation”). (It is also referred to as a product (b) ”).
- the hydrolysis condensate (b) is used as the polyene monomer, the transparency, elastic modulus, and adhesiveness of the cured product of the resin composition obtained can be further increased.
- the hydrolysis condensate (b) can be produced in the same manner as the hydrolysis condensate (a) except that the thiol group-containing silane compound is a reactive functional group-containing silane compound.
- polyene monomers having a siloxane bond include, for example, 1,3-divinyltetramethyldisiloxane, 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclo Tetrasiloxane, 1,3-divinylpropanedisiloxane, 1,5-bis [2- (2,3-epoxynorbornane-5-yl) ethyl] -1,1,3,3,5,5-hexamethylpentane Trisiloxane, 1,3,5,7,9,11,13,15-octakis [2- (triallylsilyl) ethyl] pentacyclo [9.5.1.13, 9.15, 15.17, 13] Icosan octasiloxane, 1,2-epoxy-4-vinylcyclohexane and 1,3-divinyl-1,1,3,3-tetramethyldisiloxane and 2,4,6,8-tetra 1,3-
- Examples of commercially available polyene monomers having a siloxane bond include AC-SQ series (manufactured by Toagosei Co., Ltd.).
- the sealing agent for display elements of this invention contains a polyene oligomer as said polymeric compound in addition to the said polyene monomer.
- a polyene oligomer as said polymeric compound in addition to the said polyene monomer.
- polyene monomer derived from the polyene oligomer examples include the (meth) allyl compound (meth) acrylic compound and divinylbenzene described above.
- Examples of the method for producing the polyene oligomer include a method of reacting the polyene monomer in the presence of a radical polymerization initiator or the like described later.
- Examples of the radical polymerization initiator include a photo radical polymerization initiator and a thermal radical polymerization initiator, and a thermal radical polymerization initiator is preferably used.
- the minimum with a preferable weight average molecular weight of the said polyene oligomer is 300, and a preferable upper limit is 20,000. If the weight average molecular weight of the polyene oligomer is less than 300, the effect of suppressing the generation of outgas may not be sufficiently improved. When the weight average molecular weight of the polyene oligomer is more than 20,000, the viscosity of the obtained sealant for a display element may be too high and the coatability may be deteriorated.
- the minimum with a more preferable weight average molecular weight of the said polyene oligomer is 400, and a more preferable upper limit is 4000.
- the “weight average molecular weight” is a value determined by polystyrene conversion after measurement by gel permeation chromatography (GPC).
- GPC gel permeation chromatography
- Examples of the column used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko).
- the minimum with preferable content of the said polyene oligomer in 100 weight part of the said whole polymeric compound is 30 weight part, and a preferable upper limit is 90 weight part. If the content of the polyene oligomer is less than 30 parts by weight, the effect of further suppressing the generation of outgas may not be exhibited sufficiently. When content of the said polyene oligomer exceeds 90 weight part, the viscosity of the sealing agent for display elements obtained will become high too much, and coating property may deteriorate.
- the minimum with more preferable content of the said thioether oligomer is 35 weight part, and a more preferable upper limit is 80 weight part.
- the sealing agent for display elements of this invention contains the thioether oligomer formed by reaction of a polythiol monomer and a polyene monomer.
- the thioether oligomer By forming the thioether oligomer, outgassing can be suppressed. Furthermore, by containing the thioether oligomer, the viscosity of the sealant for display elements is appropriately increased, and unevenness is less likely to occur during coating.
- the thioether oligomer is obtained by adding the polythiol monomer and the polyene monomer in a molar ratio of 3: 1 to 1: 3 with respect to the polythiol monomer by light irradiation or heating in the presence of a radical polymerization initiator. By carrying out the polymerization reaction, it is obtained as a polymer in the reaction mixture.
- the radical polymerization initiator include a photo radical polymerization initiator and a thermal radical polymerization initiator, and a thermal radical polymerization initiator is preferably used.
- the thioether oligomer may contain an unreacted thiol group or an unreacted carbon-carbon double bond or may not contain an unreacted thiol group or an unreacted carbon-carbon double bond. That is, it may be an oligomer that does not contain an unreacted thiol group or an unreacted carbon-carbon double bond obtained by sufficiently proceeding an addition polymerization reaction between the polythiol monomer and the polyene monomer. It may be an oligomer containing an unreacted thiol group or an unreacted carbon-carbon double bond obtained by stopping the reaction in the middle.
- thermal radical polymerization initiator what consists of an azo compound, an organic peroxide, etc. is mentioned, for example.
- the azo compound include 2,2′-azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
- the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, diacyl peroxide, and peroxydicarbonate.
- radical photopolymerization initiator the thing similar to the radical photopolymerization initiator contained in the sealing agent for display elements of this invention mentioned later can be used.
- the number of moles of thiol group of polythiol monomer to the number of moles of carbon-carbon double bond of polyene monomer (number of moles of thiol group / mol of carbon-carbon double bond)
- the number is 0.15 or less, the polyene monomer usually remains as an unreacted component in the resulting reaction mixture.
- the sealing agent for display elements of the present invention includes a polythiol monomer, a polyene monomer, and a thioether oligomer obtained by stopping the reaction during the addition polymerization reaction in the addition polymerization reaction of the polythiol monomer and the polyene monomer described above.
- the mixture may contain a radical polymerization initiator.
- the thioether oligomer may be prepared in advance with a polythiol monomer and a polyene monomer.
- the polythiol monomer and polyene monomer that are the raw materials of the thioether oligomer are the same as the polythiol monomer and polyene monomer contained in the display element sealing agent of the present invention described above. It may be different or different.
- a preferable lower limit of the weight average molecular weight of the thioether oligomer is 500.
- the weight average molecular weight of the thioether oligomer is less than 500, the effect of preventing unevenness during application of the obtained sealant for display element may not be sufficiently exhibited.
- the weight average molecular weight of the said thioether oligomer it is more preferable to exceed 1500, and it is still more preferable that it is 2000 or more.
- the preferable upper limit of the weight average molecular weight of the thioether oligomer is 40,000.
- the weight average molecular weight of the thioether oligomer is more than 40,000, the resulting sealant for a display element is too high in viscosity and inferior in coatability.
- a more preferable upper limit of the weight average molecular weight of the thioether oligomer is 10,000, and a more preferable upper limit is 8,000.
- the minimum with preferable content of the said thioether oligomer in 100 weight part of the said whole polymeric compound is 30 weight part.
- the minimum with more preferable content of the said thioether oligomer is 35 weight part, and a still more preferable minimum is 40 weight part.
- the upper limit with preferable content of the said thioether oligomer in 100 weight part of the said whole polymeric compound is 90 weight part.
- the upper limit with more preferable content of the said thioether oligomer is 80 weight part.
- the content of the polythiol monomer is 5 to 40% by weight, the content of the polyene monomer is 5 to 40% by weight, and the content of the thioether oligomer is 30 to 90% in the whole sealant for display elements of the present invention. It is preferable that it is weight%.
- the sealing agent for display elements of the present invention may contain other polymerizable compounds other than the polythiol monomer, the polyene monomer, the polyene oligomer, and the thioether oligomer, as long as the object of the present invention is not impaired. Good.
- the other polymerizable compound is not particularly limited as long as it undergoes a curing reaction with light or heat.
- an epoxy compound or a partially (meth) acryl-modified epoxy compound that is a raw material for the above-described epoxy (meth) acrylate. Etc.
- the “partially (meth) acryl-modified epoxy compound” means a compound having one or more epoxy groups and one (meth) acryloyl group in one molecule.
- the “(meth) acryloyl group” means an acryloyl group or a methacryloyl group.
- the partial (meth) acryl-modified epoxy compound can be obtained, for example, by reacting one epoxy group of an epoxy compound having two or more epoxy groups in one molecule with (meth) acrylic acid.
- the sealing agent for display elements of this invention contains a radical polymerization initiator.
- the radical polymerization initiator is a compound having a functional group that generates radicals upon light irradiation or heating and a reactive functional group (hereinafter also referred to as “radical polymerization initiator according to the present invention”).
- the radical polymerization initiator according to the present invention is incorporated into the cured product by having the reactive functional group while exhibiting the performance as an initiator by the functional group that generates radicals by light irradiation or heating. Outgas generation can be sufficiently suppressed.
- the radical polymerization initiator is preferably a compound having a functional group that generates radicals upon irradiation with light and a reactive functional group.
- the sealing agent for display elements of the present invention contains a photopolymerization initiator, and the photopolymerization initiator has a functional group that generates radicals upon irradiation with light and a reactive functional group. It is more preferable to contain.
- Examples of the functional group that generates radicals upon light irradiation or heating include, for example, acylphosphine oxide functional groups, ⁇ -aminoalkylphenone functional groups, benzyl ketal functional groups, ⁇ -hydroxyalkylphenone functional groups, and benzoin functional groups.
- Examples thereof include a functional group, an oxime ester functional group, a titanocene functional group, an organic peroxide functional group, and an azo compound functional group.
- acylphosphine oxide functional group ⁇ -aminoalkylphenone functional group, benzyl ketal functional group, ⁇ -hydroxyalkylphenone functional group, benzoin functional group, oxime ester functional group It is preferably at least one selected from the group consisting of a group and a titanocene functional group, more preferably an acylphosphine oxide functional group.
- these functional groups may be used independently and 2 or more types may be used in combination.
- the acylphosphine oxide functional group means a group having a structure in which acylphosphine oxide or a part thereof is substituted with another group.
- the ⁇ -aminoalkylphenone functional group means a group having a structure in which ⁇ -aminoalkylphenone or a part thereof is substituted with another group.
- the benzyl ketal functional group means a group having a structure in which ⁇ -dihydroxyacetophenone or a part thereof is substituted with another group.
- the ⁇ -hydroxyalkylphenone functional group means ⁇ -monohydroxyalkylphenone or a group having a structure in which a part other than the hydroxyl group is substituted with another group.
- the benzoin functional group means a group having a structure in which benzoin or a part thereof is substituted with another group.
- the oxime ester functional group means a group having a structure in which N-acetyldimethyloxime or a part thereof is substituted with another group.
- the titanocene functional group means a group having a structure in which titanocene or a part thereof is substituted with another group.
- the organic peroxide functional group means a group having a peroxy group.
- the azo compound functional group means a group having an azo group.
- Examples of the acylphosphine oxide functional group include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, and the like.
- Examples of the ⁇ -aminoalkylphenone functional group include 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4 -Morpholinophenyl) butanone, 1,2- (dimethylamino) -2-((4-methylphenyl) methyl) -1- (4- (4-morpholinyl) phenyl) -1-butanone and the like.
- Examples of the benzyl ketal functional group include 2,2-dimethoxy-1,2-diphenylethane-1-one.
- Examples of the ⁇ -hydroxyalkylphenone functional group include 2-hydroxy-1- (4- (4- (2-hydroxy-2-methyl-propionyl) -benzyl) phenyl) -2-methyl-propane-1 -ON and the like.
- Examples of the benzoin functional group include benzoin isopropyl ether.
- Examples of the oxime ester functional group include 1,2-octanedione-1- (4- (phenylthio) -2- (O-benzoyloxime)), ethanone-1- (9-ethyl-6- (2 -Methylbenzoyl) -9H-carbazol-3-yl) -1- (O-acetyloxime) and the like.
- Examples of the titanocene functional group include bis ( ⁇ 5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, and the like. Is mentioned.
- the reactive functional group is preferably a thiol group and / or a carbon-carbon double bond.
- the radical polymerization initiator according to the present invention is easily incorporated into the cured product.
- the radical polymerization initiator according to the present invention preferably has the reactive functional group in the side chain. By having the reactive functional group in the side chain, the radical polymerization initiator according to the present invention is more easily incorporated into the cured product.
- the radical polymerization initiator according to the present invention preferably has two or more of the reactive functional groups in one molecule. By having two or more of the reactive functional groups in one molecule, the radical polymerization initiator according to the present invention is more easily taken into the cured product.
- the compound having a functional group capable of generating a radical upon irradiation with light or heating and having two or more functional groups having a carbon-carbon double bond as the reactive functional group in one molecule is the polyene. It is not a monomer but a radical polymerization initiator according to the present invention.
- the sealing agent for display elements of the present invention is excellent in photoreactivity and can suppress adverse effects such as outgassing
- the compound represented by the following formula (3) as a radical polymerization initiator according to the present invention It is preferable to contain the oxime ester initiator which is.
- the oxime ester initiator which is a compound represented by the following formula (3) is also one aspect of the present invention.
- R 3 is selected from the group consisting of a phenyl group (an alkyl group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, —OR 10 group, —SR 11 group, and —NR 12 R 13 group).
- R 4 and R 7 are each independently a reactive functional group, a group having a hydrogen bonding functional group, a hydrogen atom, a carboalkoxyalkyl group having 3 to 20 carbon atoms (interrupted by one or more oxygen atoms, and / Or optionally substituted with one or more hydroxyl groups), a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, —SR 11 group, and A benzyl group, a benzoyl group, an alkanoyl group having 2 to 12 carbon atoms, or an alkoxycarbonyl group having 2 to 12 carbon atoms, which may be substituted with at least one selected from the group consisting of —NR 12 R 13 groups) (interrupted by one or more oxygen atoms, and / or may be substituted by one or more hydroxyl groups), a phenoxy
- R 4 and R 7 are a reactive functional group.
- R 5 , R 6 , R 8 , and R 9 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, — SR 11 group, or optionally substituted by —NR 12 R 13 group), benzyl group, benzoyl group, alkanoyl group having 2 to 12 carbon atoms, alkoxycarbonyl group having 2 to 12 carbon atoms (one or more Optionally interrupted by an oxygen atom and / or substituted by one or more hydroxyl groups), a phenoxycarbonyl group, a —OR 10 group, a —SR 11 group, a —SOR 11 group, a —SO 2 R 11 group, or a -NR 12 R 13 groups, 10 groups -OR, -SR, atom,
- R 10 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, alkoxy group having 1 to 4 carbon atoms, 3 to 3 carbon atoms).
- alkeneoxy groups —OCH 2 CH 2 CN groups, —OCH 2 CH 2 (CO) O-alkyl groups having 4 to 7 carbon atoms, —O (CO) -alkyl groups having 2 to 5 carbon atoms, —O (CO) -phenyl group,-(CO) OH group, or a-(CO) O-alkyl group having 2 to 5 carbon atoms), an alkyl group having 2 to 6 carbon atoms (one or more Interrupted by an oxygen atom), — (CH 2 CH 2 O) n H group, alkanoyl group having 2 to 8 carbon atoms, alkenyl group having 3 to 12 carbon atoms, alkenoyl group having 3 to 6 carbon atoms, cyclohexyl group , Phenyl group (halogen atom, alkyl group having 1 to 12 carbon atoms, May be substituted with an alkoxy group having 1 to 4 carbon atoms), a phenylalkyl group
- R 11 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 3 to 12 carbon atoms, a cyclohexyl group, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, carbon C 1-4 alkoxy group, C 3-6 alkeneoxy group, —OCH 2 CH 2 CN group, C 4-7 —OCH 2 CH 2 (CO) O-alkyl group, C 2-5 -O (CO) -alkyl group, -O (CO) -phenyl group,-(CO) OH group, or-(CO) O-alkyl group having 2 to 5 carbon atoms), carbon An alkyl group of 2 to 12 (interrupted by one or more oxygen or sulfur atoms), a phenyl group (a halogen atom, an alkyl group of 1 to 12 carbon atoms, or an alk
- R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a hydroxyalkyl group having 2 to 4 carbon atoms, an alkoxyalkyl group having 2 to 10 carbon atoms, or an alkyl group having 3 to 5 carbon atoms.
- R 12 is a hydrogen atom
- R 13 may be a group represented by the following formula (6)
- R 3 and R 4 are the same as those in formula (3).
- M 1 is a bond or an alkyleneoxy group having 1 to 12 carbon atoms (which may be interrupted by 1 to 5 oxygen atoms, sulfur atoms, and / or —NR 12 — groups).
- R 3 and R 4 may be the same as those in formula (3).
- M 2 is a bond or an alkylene-S— group having 1 to 12 carbon atoms (which may be interrupted by 1 to 5 oxygen atoms, sulfur atoms and / or —NR 12 — groups). is there.
- R 3 and R 4 are the same as those in formula (3).
- M 3 represents a bond, a piperazino group, or an alkylene-NH— group having 1 to 12 carbon atoms (even if interrupted by 1 to 5 oxygen atoms, sulfur atoms, and / or —NR 12 — groups. Good).
- the oxime ester initiator of the present invention is a compound represented by the above formula (3).
- the description of the substituent is common to the corresponding ones of R 3 , R 5 , R 6 , R 8 , R 9 , R 10 , R 11 , R 12 , and R 13. It is an explanation about the matter.
- the phenyl group When the phenyl group is substituted, the phenyl group is substituted with 1 to 4 substituents, preferably 1 to 3 substituents, more preferably 2 substituted. preferable.
- Substituents on the phenyl ring are in the 4-position, 3,4-position, 3,4,5-position, 2,6-position, 2,4-position, or 2,4,6-position of the phenyl ring. It is preferably located, more preferably in the 4-position or 3,4-position.
- alkyl group examples include methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, sec-butyl group, isobutyl group, tert-butyl group, pentyl group, hexyl group, heptyl group, 2,4 1,4-trimethylpentyl, 2-ethylhexyl, octyl, nonyl, decyl, dodecyl, tetradecyl, pentadecyl, hexadecyl, octadecyl, icosyl, etc. Is mentioned.
- examples of the alkyl group having 2 to 20 carbon atoms interrupted by one or more oxygen atoms include —CH 2 — CH 2 —O—CH 2 CH 3 group, — (CH 2 CH 2 O) y —CH 3 group (where y is 1 to 9), — (CH 2 —CH 2 O) 7 —CH 2 CH 3 groups, —CH 2 CH (CH 3 ) —O—CH 2 CH 2 CH 3 groups, —CH 2 CH (CH 3 ) —O—CH 2 CH 3 groups, —CH 2 CH (CH 3 ) —O—CH 2 CH 3 groups, —CH 2 —CH 2 —O— CH 2 —CH 2 —O—CH 2 CH 3 group, —CH 2 —CH 2 —O—CH 2 CH 3 group and the like can be mentioned.
- alkyl group having 2 to 20 carbon atoms When the alkyl group having 2 to 20 carbon atoms is substituted with one or more hydroxyl groups, examples of the alkyl group having 2 to 20 carbon atoms substituted with one or more hydroxyl groups include 2-hydroxyethyl Group, 1-hydroxyethyl group, 1-hydroxypropyl group, 2-hydroxypropyl group, 3-hydroxypropyl group, 1-hydroxybutyl group, 4-hydroxybutyl group, 2-hydroxybutyl group, 3-hydroxybutyl group, Examples include 2,3-dihydroxypropyl group and 2,4-dihydroxybutyl group.
- cycloalkyl group examples include those corresponding to the number of carbon atoms among a cyclopentyl group, a cyclohexyl group, a cyclooctyl group, a cyclododecyl group, and the like. Of these, a cyclopentyl group and a cyclohexyl group are preferable, and a cyclohexyl group is more preferable.
- alkoxy group examples include a methoxy group, an ethoxy group, a propoxy group, an isopropoxy group, an n-butyloxy group, a sec-butyloxy group, an isobutyloxy group, and a tert-butyloxy group. Things.
- alkoxyalkyl group having 2 to 10 carbon atoms examples include a methoxymethyl group, a methoxyethyl group, a methoxypropyl group, an ethoxymethyl group, an ethoxyethyl group, an ethoxypropyl group, a propoxymethyl group, a propoxyethyl group, and a propoxypropyl group.
- alkanoyl group examples include an acetyl group, a propionyl group, a butanoyl group, an isobutanoyl group, a pentanoyl group, a hexanoyl group, a heptanoyl group, an octanoyl group, a nonanoyl group, a decanoyl group, a dodecanoyl group, a tetradecanoyl group, and a pentadecanoyl group.
- alkanoyloxy group having 2 to 4 carbon atoms examples include acetyloxy group, propionyloxy group, butanoyloxy group, isobutanoyloxy group, and the like. Of these, an acetyloxy group is preferable.
- alkoxycarbonyl group having 2 to 12 carbon atoms examples include methoxycarbonyl group, ethoxycarbonyl group, propoxycarbonyl group, n-butyloxyocarbonyl group, isobutyloxycarbonyl group, 1,1-dimethylpropoxycarbonyl group, pentyl.
- Examples include oxycarbonyl group, hexyloxycarbonyl group, heptyloxycarbonyl group, octyloxycarbonyl group, nonyloxycarbonyl group, decyloxycarbonyl group, undecyloxycarbonyl group and the like.
- a methoxycarbonyl group, an ethoxycarbonyl group, a propoxycarbonyl group, an n-butyloxycarbonyl group, and an isobutyloxycarbonyl group are preferable, and a methoxycarbonyl group is more preferable.
- the phenoxycarbonyl group is substituted with 1 to 4 substituents, preferably 1 to 3 are substituted, and 2 are substituted. Is more preferable.
- Substituents on the phenyl ring are the 4-position, 3,4-position, 3,4,5-position, 2,6-position, 2,4-position, or 2,4,6-position of the phenyl ring. It is preferably located, more preferably in the 4-position or 3,4-position.
- phenylalkyl group having 7 to 9 carbon atoms examples include benzyl group, phenylethyl group, ⁇ -methylbenzyl group, ⁇ , ⁇ -dimethylbenzyl group and the like. Of these, a benzyl group is preferable.
- alkenyl group examples include allyl group, methallyl group, 1,1-dimethylallyl group, 1-butenyl group, 3-butenyl group, 2-butenyl group, 1,3-pentadienyl group, 5-hexenyl group, 7 -Of the octenyl group, dodecyl group, etc., the corresponding number of carbon atoms can be mentioned. Of these, an allyl group is preferable.
- alkeneoxy group having 3 to 6 carbon atoms examples include allyloxy group, methallyloxy group, butenyloxy group, penteneoxy group, 1,3-pentadienyloxy group, and 5-hexenyloxy group.
- alkenoyl group having 3 to 6 carbon atoms examples include propenoyl group, 2-methyl-propenoyl group, butenoyl group, pentenoyl group, 1,3-pentadienoyl group, 5-hexenoyl group and the like.
- halogen atom a fluorine atom, a chlorine atom, a bromine atom, an iodine atom etc. are mentioned, for example. Of these, a fluorine atom, a chlorine atom and a bromine atom are preferable, and a fluorine atom and a chlorine atom are more preferable.
- aryl group examples include a phenyl group, a 1-naphthyl group, a 2-naphthyl group, and the like corresponding to the number of carbon atoms. Of these, a phenyl group is preferred.
- R 3 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms. Moreover, in said formula (3), it is preferable that R ⁇ 5 >, R ⁇ 6 >, R ⁇ 8 > and R ⁇ 9 > are hydrogen atoms.
- R 4 and R 7 are each independently a reactive functional group, a group having a hydrogen bonding functional group, a hydrogen atom, a carboalkoxyalkyl group having 3 to 20 carbon atoms (one or more Optionally substituted by one or more hydroxyl groups), halogen atom, alkyl group having 1 to 12 carbon atoms, cyclopentyl group, cyclohexyl group, phenyl group (—OR 10 group) , -SR 11 group, and -NR 12 R 13 group, which may be substituted with at least one selected from the group consisting of a group, benzyl group, benzoyl group, alkanoyl group having 2 to 12 carbon atoms, carbon number 2 to 12 alkoxycarbonyl groups (which may be interrupted by one or more oxygen atoms and / or substituted by one or more hydroxyl groups), phenoxycarbo Nyl group, —OR 10 group, —SR 11 group, —SOR 11 group,
- the reactive functional group possessed by the oxime ester initiator of the present invention means a functional group capable of reacting with the polymerizable compound.
- R 4 and R 7 are preferably both reactive functional groups.
- a vinyl group, a thiol group, an acryloyl group, a methacryloyl group, an epoxy group etc. are mentioned, for example.
- a vinyl group and a thiol group are preferable, and a vinyl group is more preferable.
- the other when one of R 4 and R 7 is a reactive functional group, the other may be a group having a hydrogen bonding functional group.
- the hydrogen bonding functional group means a functional group having hydrogen bonding properties.
- the compatibility with the polymerizable compound is increased, and contamination due to elution into liquid crystal or the like is sufficiently suppressed. can do.
- the hydrogen bonding functional group include an —OH group, —NH 2 group, —NHR group (R represents an aromatic, aliphatic hydrocarbon, or derivative thereof), —COOH group, —CONH.
- functional groups such as two groups and —NHOH group, and residues such as —NHCO— bond, —NH— bond, —CONHCO— bond, and —NH—NH— bond. Of these, —OH group is preferable.
- R 4 or R 7 is a carboalkoxyalkyl group having 3 to 20 carbon atoms
- examples of the carboalkoxyalkyl group include a carbomethoxymethyl group, a carboethoxymethyl group, a carbomethoxyethyl group, a carboxyethoxyethyl group, Carboxymethoxypropyl group, carboxymethoxyoctyl group, carboxymethoxylauryl group, carboxymethoxystearyl group, carboxypropoxymethyl group, carboxypropoxyethyl group, carboxypropoxypropyl group, carboxyoctoxymethyl group, carboxylauroxymethyl group, carboxymyrist Examples thereof include a xymethyl group, a carboxyoctoxyethyl group, a carboxylauroxyethyl group, and a carboxy stearoxyethyl group.
- oxime ester initiator of the present invention compounds represented by the following formulas (7) to (11) are preferable because they are excellent in photoreactivity and particularly excellent in suppressing adverse effects such as outgassing.
- Compounds represented by the following formulas (7) to (10) are more preferable.
- Examples of the method for producing the oxime ester initiator of the present invention are the same as those in the above formula (3) except for the ⁇ N—OC ( ⁇ O) —R 4 group and R 7 in the above formula (3).
- ⁇ N—OC ( ⁇ O) —R 4 oxime is converted to an acyl compound in which the portion of the 4 group is a hydrogen atom to obtain an oxime compound, and then the portion of R 7 in the above formula (3) is formed.
- Examples include a method of reacting acyl chloride having R 4 .
- the compound represented by the above formula (7) can be produced by the following method or the like.
- 2-phenylthiomethanol was reacted with acetyl chloride in dichloromethane in the presence of triethylamine to obtain 2-phenylthioethyl acetate, and then 2-phenylthioethyl acetate was obtained in dichloromethane.
- Reaction with octanoic acid chloride in the presence of aluminum chloride produces an acyl compound represented by the following formula (12-1).
- the obtained acyl compound was reacted with isoamyl nitrite in tetrahydrofuran in the presence of concentrated hydrochloric acid to prepare an oxime compound represented by the following formula (12-2).
- the obtained oxime compound was converted into tetrahydrofuran.
- the compound represented by the above formula (7) can be produced by reacting with 3-allyloxypropionic acid chloride in the presence of triethylamine.
- the radical polymerization initiator according to the present invention has a preferable lower limit of molecular weight of 250 and a preferable upper limit of 1500.
- the sealant for display element of the present invention is further excellent in the effect of suppressing the generation of outgas.
- the molecular weight of the radical polymerization initiator according to the present invention is less than 250, outgas may be generated.
- the molecular weight of the radical polymerization initiator according to the present invention exceeds 1500, curing may be insufficient.
- the more preferable lower limit of the molecular weight of the radical polymerization initiator according to the present invention is 300, the more preferable upper limit is 1050, the still more preferable lower limit is 348, and the further preferable upper limit is 790. .
- a preferable lower limit is 0.1 part by weight and a preferable upper limit is 5 parts by weight with respect to 100 parts by weight of the entire polymerizable compound.
- the content of the radical polymerization initiator according to the present invention is less than 0.1 parts by weight, polymerization of the obtained sealant for display element may not sufficiently proceed.
- the content of the radical polymerization initiator according to the present invention exceeds 5 parts by weight, the curing reaction becomes too fast, the workability is lowered, or the cured product of the obtained sealant for display elements becomes non-uniform.
- the more preferable lower limit of the content of the radical polymerization initiator according to the present invention is 0.5 parts by weight, and the more preferable upper limit is 3 parts by weight.
- the sealing agent for display elements of this invention may contain another polymerization initiator in addition to the radical polymerization initiator concerning this invention.
- the sealant for display elements of the present invention may contain an adhesion promoter.
- the adhesion-imparting agent include 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N- (aminoethyl) aminopropyltrimethoxy
- silane coupling agents such as silane and mercaptopropyltrimethoxysilane, titanium coupling agents, and aluminum coupling agents. These adhesiveness imparting agents may be used alone or in combination of two or more.
- the sealing agent for display elements of the present invention may contain a stabilizer for the purpose of preventing oxidation or the like.
- the stabilizer include 2,2′-methylenebis- (4-methyl-6-tert-butylphenol), 4,4′-butylidenebis- (6-tert-butyl-3-methylphenol), 2,2 Examples include '-methylenebis- (4-ethyl-6-t-butylphenol). These stabilizers may be used independently and 2 or more types may be used together.
- the sealant for display element of the present invention further includes a filler, a curing accelerator, a plasticizer, a surfactant, a flame retardant, an antistatic agent, an antifoaming agent, and a leveling agent as long as the object of the present invention is not impaired. Further, additives such as an ultraviolet absorber and an organic solvent may be contained.
- Examples of the method for producing the sealant for a display element of the present invention include stirring a polythiol monomer, a polyene monomer, a radical polymerization initiator according to the present invention, and an adhesiveness imparting agent added as necessary. The method etc. which mix uniformly using a machine are mentioned.
- the sealing agent for display elements of the present invention has a preferred lower limit of viscosity of 0.4 Pa ⁇ s and a preferred upper limit of 40 Pa ⁇ s measured using a cone rotor viscometer under the conditions of 20 ° C. and 20 rpm.
- the viscosity is less than 0.4 Pa ⁇ s, compositional unevenness occurs in the obtained sealant for display element, coating becomes difficult, or display characteristics of the obtained display element are deteriorated. There is.
- the viscosity exceeds 40 Pa ⁇ s, coating may be difficult.
- the more preferred lower limit of the viscosity is 0.5 Pa ⁇ s
- the more preferred upper limit is 10 Pa ⁇ s
- the still more preferred lower limit is 1 Pa ⁇ s
- the still more preferred upper limit is 6 Pa ⁇ s
- the particularly preferred lower limit is 2 Pa ⁇ s
- the particularly preferred upper limit is 4 Pa. -S.
- the sealant for display element of the present invention preferably has an average visible light transmittance of 80% or more in a region of a cured product having a wavelength of 380 to 780 nm.
- the average transmittance of visible light is 80% or more, it can be suitably used for applications requiring transparency.
- the average transmittance of the visible light is more preferably 95% or more.
- permeability of the said visible light can be obtained by the method of irradiating a 2000mJ / cm ⁇ 2 > ultraviolet-ray with respect to the sealing agent for display elements of this invention.
- the sealant for a display element of the present invention preferably has a weight reduction rate of 0.15% or less when a 100 ⁇ m thick cured product is heated to 130 ° C. at a temperature rising rate of 10 ° C./min. Since the weight reduction rate can be regarded as an outgas generation amount, an adverse effect on the display element can be suppressed by being 0.15% or less.
- the weight reduction rate is more preferably 0.1% or less.
- cured material which measures the said weight decreasing rate can be obtained by the method of irradiating 2000 mJ / cm ⁇ 2 > of ultraviolet-rays with respect to the sealing agent for display elements of this invention apply
- the sealant for display elements of the present invention can be cured by light irradiation or heating, and is preferably cured by light irradiation.
- Examples of the method for photocuring the sealant for display elements of the present invention include a method of irradiating light having a wavelength of 300 to 400 nm and an integrated light amount of 300 to 3000 mJ / cm 2 .
- Examples of the light source for irradiating the sealing agent for display element of the present invention with light include a low pressure mercury lamp, a medium pressure mercury lamp, a high pressure mercury lamp, an ultrahigh pressure mercury lamp, an excimer laser, a chemical lamp, a black light lamp, and a microwave excitation mercury lamp. , Metal halide lamps, sodium lamps, halogen lamps, xenon lamps, LED lamps, fluorescent lamps, sunlight, electron beam irradiation devices, and the like. These light sources may be used independently and 2 or more types may be used together.
- Examples of light irradiation means for the sealant for display elements of the present invention include simultaneous irradiation of various light sources, sequential irradiation with a time difference, combined irradiation of simultaneous irradiation and sequential irradiation, etc. Irradiation means may be used.
- the sealant for display element of the present invention is a sealant for sealing the entire surface, front surface, rear surface, or periphery of the display element, or a seal for sealing an opening provided in the display element. It can be used as an agent, and is particularly preferably used for sealing the entire surface of the display element.
- the “entire surface” does not necessarily mean 100% of the surface having the display element, but means a necessary sealing surface required for the display element.
- the “front surface” means a surface from which light is extracted, that is, a surface on the viewing side.
- the sealant for display elements of the present invention can be used, for example, as a sealant for organic EL display elements, a sealant for liquid crystal display elements, a sealant for electrochromic substrates, a sealant for electronic paper, and the like. .
- the sealing agent for display elements which is excellent in adhesiveness and transparency of hardened
- the oxime ester initiator which can be used suitably for this sealing agent for display elements can be provided.
- 1 is a 1 H-NMR spectrum of a compound represented by formula (7).
- 1 is a 1 H-NMR spectrum of a compound represented by formula (8).
- 1 is a 1 H-NMR spectrum of a compound represented by formula (9).
- 1 is a 1 H-NMR spectrum of a compound represented by formula (10).
- 1 is a 1 H-NMR spectrum of a compound represented by formula (11).
- the weight average molecular weight in terms of polystyrene was measured by gel permeation chromatography (GPC) using Shodex LF-804 (manufactured by Showa Denko KK) as a column.
- GPC gel permeation chromatography
- Shodex LF-804 manufactured by Showa Denko KK
- Examples 1 to 7, Comparative Example 1 According to the blending ratio described in Table 1, each material was mixed using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three One Motor HEIDON BLH300”), so that the display elements of Examples 1 to 7 and Comparative Example 1 A sealing agent was prepared.
- the radical polymerization initiator according to the present invention in Examples 1 to 3, 6, and 7, the initiator A is a compound having an ⁇ -hydroxyalkylphenone functional group and an acryloyl group in the molecule (manufactured by KSM Co., Ltd.).
- the initiator B is represented by the following formula (13) having an ⁇ -aminoalkylphenone functional group and a thiol group: “UV-H-4000”, weight average molecular weight 850).
- a compound (molecular weight 353) was used, and as initiator C, 50 parts by weight of initiator A and 50 parts by weight of trimethylolpropane tris (3-mercaptopropionate) Gradually add 0.2 parts by weight of '-azobis (2,4-dimethylvaleronitrile), pour the resulting reaction mixture into a poor solvent, collect the precipitate, and vacuum the solvent In the compound obtained by removing the (weight-average molecular weight 98,000) was used.
- Adhesiveness 0.05 g of each display element sealant obtained in Examples 1 to 7 and Comparative Example 1 was applied onto a glass substrate using a micropipette. This substrate was bonded to another glass substrate on which a spacer was disposed so as to have a thickness of 50 ⁇ m, and irradiated with 2000 mJ / cm 2 of ultraviolet rays using a high-pressure mercury lamp, to prepare a sample for adhesion test. The obtained adhesion test sample was subjected to a peel test using EZ GRAPH (manufactured by Shimadzu Corporation) at a peel rate of 5 mm / min to measure the adhesive force. The adhesiveness was evaluated as “ ⁇ ” when the adhesive strength was 1.0 N / cm or more, and “X” when the adhesive strength was less than 1.0 N / cm.
- Transparency (transmittance) of the cured product Each display element sealant obtained in Examples 1 to 7 and Comparative Example 1 is sandwiched between PET resin films and irradiated with 2000 mJ / cm 2 of ultraviolet light to produce a 100 ⁇ m thick sample for transmittance measurement. did.
- the obtained transmittance measurement sample was measured for light transmittance at a wavelength of 380 to 780 nm using a spectrophotometer (manufactured by Hitachi, Ltd., “U-3000”, conditions 300 to 800 nm).
- a glass substrate (length 25 mm, width 25 mm, thickness 0.7 mm) on which an ITO electrode was formed to a thickness of 1000 mm was used as the substrate.
- the substrate was ultrasonically washed with acetone, an aqueous alkali solution, ion-exchanged water, and isopropyl alcohol for 15 minutes, respectively, then washed with boiled isopropyl alcohol for 10 minutes, and a UV-ozone cleaner (manufactured by Nippon Laser Electronics Co., Ltd.). The last treatment was performed with “NL-UV253”).
- this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine ( ⁇ -NPD) is put into an unglazed crucible and other different types.
- 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 ⁇ 10 ⁇ 4 Pa. Thereafter, the crucible containing ⁇ -NPD was heated, and ⁇ -NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 ⁇ ⁇ hole transport layer.
- the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 ⁇ at a deposition rate of 15 ⁇ / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added.
- the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 ⁇ 10 ⁇ 4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did.
- the inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm ⁇ 10 mm was arranged was taken out.
- a mask having an opening of 13 mm ⁇ 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0. The test was performed at 9 Torr.
- the formed inorganic material film A had a thickness of about 0.2 ⁇ m.
- Vacuum deposition was performed so that Thereafter, ultraviolet rays having a wavelength of 365 nm were irradiated using a high-pressure mercury lamp in a vacuum environment so that the irradiation amount was 3000 mJ / cm 2 to cure the sealant for display elements to form a resin protective film.
- a mask having an opening of 12 mm ⁇ 12 mm is installed so as to cover the entire 11 mm ⁇ 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed.
- An element organic EL display element
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz), chamber temperature 100 ° C., chamber The test was performed under the condition that the internal pressure was 0.9 Torr.
- the formed inorganic material film B had a thickness of about 1 ⁇ m.
- the prepared organic EL display elements were exposed for 100 hours under conditions of 60 ° C. and 90% RH, respectively, and then a voltage of 3 V was applied, and the light emission state (light emission and dark spots, presence / absence of pixel peripheral quenching) was visually observed. Evaluation was made with “ ⁇ ” when the light was emitted uniformly without dark spots or peripheral quenching, “ ⁇ ” when the dark spots or peripheral quenching was observed, and “X” when the non-light emitting portion was significantly enlarged.
- FIG. 1 shows the 1 H-NMR spectrum of the obtained compound represented by the formula (7).
- FIG. 5 shows the 1 H-NMR spectrum of the obtained compound represented by the formula (11).
- Examples 8 to 14, Comparative Examples 2 and 3 According to the compounding ratio described in Table 2, each material was heated and mixed at 70 ° C. for 3 hours using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three-One Motor HEIDON BLH300”) for 3 hours. Was prepared.
- Display performance of display element (4-1) Display performance of liquid crystal display element (production of liquid crystal display element) Prepare two glass substrates (length 25mm, width 25mm, thickness 0.7mm) on which an ITO electrode with a thickness of 1000mm is formed on the surface and then an orientation film with a thickness of 800mm is applied on the surface by spin coating. Then, using a thermosetting epoxy resin (peripheral sealant) on one substrate, printing of a pattern in which a liquid crystal injection port was provided was performed by screen printing. Next, the substrate on which the pattern was printed was kept at 80 ° C. for 3 minutes to perform preliminary drying and fusion of the peripheral sealant to the substrate, and then returned to room temperature.
- a thermosetting epoxy resin peripheral sealant
- each substrate was bonded, and the peripheral sealant was cured by hot pressing heated to 130 ° C. for 2 hours to obtain an empty cell. .
- the obtained empty cell was vacuumed, and liquid crystal (“ZLI-4792” manufactured by Merck & Co., Inc.) was injected from the injection port.
- the injection port was obtained in each of Examples 8 to 14 and Comparative Examples 2 and 3.
- Sealing was performed using a sealant for display elements, and the sealant was cured by irradiating with 3000 mJ / cm 2 ultraviolet rays using a high-pressure mercury lamp. Thereafter, the liquid crystal was annealed at 120 ° C. for 1 hour to produce a liquid crystal display element.
- the obtained liquid crystal display element was driven in a halftone display state at a voltage of AC 3.5 V, and the alignment disorder of the liquid crystal near the inlet was observed with a polarizing microscope.
- the case where no alignment disorder is confirmed is “ ⁇ ”
- the case where alignment disorder less than 1 mm is confirmed is “ ⁇ ”
- the case where there is a clear alignment disorder (dark color unevenness) of 1 mm or more is “X”.
- the display performance of the liquid crystal display element was evaluated.
- this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine ( ⁇ -NPD) is put into an unglazed crucible and other different types.
- 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 ⁇ 10 ⁇ 4 Pa. Thereafter, the crucible containing ⁇ -NPD was heated, and ⁇ -NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 ⁇ ⁇ hole transport layer.
- the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 ⁇ at a deposition rate of 15 ⁇ / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added.
- the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 ⁇ 10 ⁇ 4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did.
- the inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm ⁇ 10 mm was arranged was taken out.
- a mask having an opening of 13 mm ⁇ 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0.
- the test was performed at 9 Torr.
- the thickness of the formed inorganic material film A of silicon nitride was about 0.2 ⁇ m.
- ultraviolet rays having a wavelength of 365 nm were irradiated using a high-pressure mercury lamp in a vacuum environment so that the irradiation amount was 3000 mJ / cm 2 to cure the sealant for display elements to form a resin protective film.
- a mask having an opening of 12 mm ⁇ 12 mm is installed so as to cover the entire 11 mm ⁇ 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed.
- An element organic EL display element
- SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz), chamber temperature 100 ° C., chamber The test was performed under the condition that the internal pressure was 0.9 Torr.
- the thickness of the formed inorganic material film B of silicon nitride was about 1 ⁇ m.
- the sealing agent for display elements which is excellent in adhesiveness and transparency of hardened
- the oxime ester initiator which can be used suitably for this sealing agent for display elements can be provided.
Abstract
Description
また、有機EL表示素子では、有機発光材料層や電極が外気に曝されると、その性能が急激に劣化してしまうため、有機EL表示素子の安定性や耐久性を高めるために、有機発光材料層と電極とを、無機材料膜を介して樹脂膜で被覆して封止する方法が提案されている。例えば、特許文献2には、無機材料膜の上にアクリル系の樹脂組成物からなる樹脂膜を形成する方法が開示されている。 In a liquid crystal display element, an optical film such as a polarizing film or a protective film is attached to the surface of a substrate via an adhesive. For example,
In addition, in the organic EL display element, when the organic light emitting material layer and the electrode are exposed to the outside air, the performance of the organic EL display element deteriorates rapidly. Therefore, in order to increase the stability and durability of the organic EL display element, There has been proposed a method in which a material layer and an electrode are covered with a resin film via an inorganic material film and sealed. For example, Patent Document 2 discloses a method of forming a resin film made of an acrylic resin composition on an inorganic material film.
以下に本発明を詳述する。 The present invention comprises a polythiol monomer having two or more thiol groups in one molecule, a polyene monomer having two or more carbon-carbon double bonds in one molecule, and a radical polymerization initiator, The polymerization initiator is a sealant for a display element, which is a compound having a functional group that generates radicals by light irradiation or heating and a reactive functional group.
The present invention is described in detail below.
本発明者は、アウトガスの発生を充分に抑制できなかったり、他材料を汚染したりする原因が、表示素子用封止剤に含有されるラジカル重合開始剤にあると考えた。そこで本発明者は、ポリチオールモノマーとポリエンモノマーとを含有する表示素子用封止剤に特定のラジカル重合開始剤を用いることにより、アウトガスの発生や他材料の汚染を抑制することができ、接着性、及び、硬化物の透明性に優れる表示素子用封止剤を得ることができることを見出し、本発明を完成させるに至った。 The present inventor uses a polythiol monomer having two or more thiol groups in one molecule instead of an acrylic resin as a sealant for a display element that is excellent in adhesiveness and transparency of a cured product, and in one molecule. It was investigated to use a resin composition containing a polyene monomer having two or more carbon-carbon double bonds. However, even when such a resin composition is used, the problem of outgas generation cannot be completely solved. In addition, when the obtained sealant for display element comes into contact with the liquid crystal of the liquid crystal display element, the liquid crystal is contaminated, or when it comes into contact with the organic light emitting material layer of the organic EL display element, the organic light emitting material layer is damaged. Sometimes happened.
The inventor considered that the radical polymerization initiator contained in the sealant for a display element has a cause that the generation of outgas cannot be sufficiently suppressed or the other material is contaminated. Therefore, the present inventor can suppress generation of outgas and contamination of other materials by using a specific radical polymerization initiator for the sealant for a display element containing a polythiol monomer and a polyene monomer, and adhesion. And it discovered that the sealing agent for display elements excellent in transparency of hardened | cured material could be obtained, and came to complete this invention.
なお、本明細書において上記「炭素-炭素二重結合」は、エチレン性不飽和結合を意味する。 The sealant for a display element of the present invention includes, as a polymerizable compound, a polythiol monomer having two or more thiol groups in one molecule (hereinafter also simply referred to as “polythiol monomer”) and two or more in one molecule. And a polyene monomer having a carbon-carbon double bond (hereinafter also simply referred to as “polyene monomer”). The sealant for display elements of the present invention containing these components is excellent in adhesiveness and transparency of the cured product.
In the present specification, the “carbon-carbon double bond” means an ethylenically unsaturated bond.
なかでも、トリメチロールプロパントリス(3-メルカプトプロピオネート)、ペンタエリスリトール-テトラキス(3-メルカプトプロピオネート)、ジペンタエリスリトール-ヘキサキス(3-メルカプトプロピオネート)、1,4-ジチアン環含有ポリチオール化合物が好ましく、トリメチロールプロパントリス(3-メルカプトプロピオネート)、ジペンタエリスリトール-ヘキサキス(3-メルカプトプロピオネート)がより好ましい。 Specific examples of the ester bond-containing polythiol monomer include trimethylolpropane tris (3-mercaptopropionate), tris-((3-mercaptopropionyloxy) -ethyl) -isocyanurate, pentaerythritol tetrakisthioglycol. Rate, pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercaptopropionate), and the like.
Among them, trimethylolpropane tris (3-mercaptopropionate), pentaerythritol-tetrakis (3-mercaptopropionate), dipentaerythritol-hexakis (3-mercaptopropionate), 1,4-dithiane ring included Polythiol compounds are preferred, and trimethylolpropane tris (3-mercaptopropionate) and dipentaerythritol-hexakis (3-mercaptopropionate) are more preferred.
上記3官能以上のポリチオールモノマーとしては、1分子中に3~20個のチオール基を有するモノマーが好ましく、1分子中に3~8個のチオール基を有するモノマーを含有がより好ましい。 Moreover, it is preferable that the said polythiol monomer contains the monomer (trifunctional or more polythiol monomer) which has a 3 or more thiol group in 1 molecule.
The tri- or higher functional polythiol monomer is preferably a monomer having 3 to 20 thiol groups in one molecule, and more preferably a monomer having 3 to 8 thiol groups in one molecule.
なお、本明細書において、上記「(メタ)アリル」とはアリル又はメタリルを意味し、上記「(メタ)アクリル」とは、アクリル又はメタクリルを意味する。 Examples of the polyene monomer include (meth) allyl compounds, (meth) acrylic compounds, divinylbenzene, and the like. These polyene monomers may be used alone or in combination of two or more.
In the present specification, the “(meth) allyl” means allyl or methallyl, and the “(meth) acryl” means acryl or methacryl.
なお、本明細書において、上記「(メタ)アクリレート」とは、アクリレート又はメタクリレートを意味し、上記「エポキシ(メタ)アクリレート」とは、エポキシ化合物中の全てのエポキシ基を(メタ)アクリル酸と反応させた化合物のことを表す。 The (meth) acrylic compound is not particularly limited as long as it is a compound having two or more acryloyl groups or methacryloyl groups in one molecule. For example, an epoxy obtained by reaction of (meth) acrylic acid and an epoxy compound ( (Meth) acrylate, ester compound obtained by reacting a compound having a hydroxyl group with (meth) acrylic acid, urethane (meth) acrylate obtained by reacting a (meth) acrylic acid derivative having a hydroxyl group with isocyanate, etc. It is done.
In the present specification, the “(meth) acrylate” means acrylate or methacrylate, and the “epoxy (meth) acrylate” refers to all the epoxy groups in the epoxy compound and (meth) acrylic acid. It represents the reacted compound.
上記エポキシ(メタ)アクリレートの原料となるエポキシ化合物としては、例えば、ビスフェノールA型エポキシ化合物、ビスフェノールF型エポキシ化合物、ビスフェノールS型エポキシ化合物、2,2’-ジアリルビスフェノールA型エポキシ化合物、水添ビスフェノール型エポキシ化合物、プロピレンオキシド付加ビスフェノールA型エポキシ化合物、レゾルシノール型エポキシ化合物、ビフェニル型エポキシ化合物、スルフィド型エポキシ化合物、ジフェニルエーテル型エポキシ化合物、ジシクロペンタジエン型エポキシ化合物、ナフタレン型エポキシ化合物、フェノールノボラック型エポキシ化合物、オルトクレゾールノボラック型エポキシ化合物、ジシクロペンタジエンノボラック型エポキシ化合物、ビフェニルノボラック型エポキシ化合物、ナフタレンフェノールノボラック型エポキシ化合物、グリシジルアミン型エポキシ化合物、アルキルポリオール型エポキシ化合物、ゴム変性型エポキシ化合物、グリシジルエステル化合物、ビスフェノールA型エピスルフィド化合物等が挙げられる。 The epoxy (meth) acrylate is not particularly limited, and examples thereof include those obtained by reacting (meth) acrylic acid and an epoxy compound in the presence of a basic catalyst according to a conventional method.
Examples of the epoxy compound used as a raw material for the epoxy (meth) acrylate include bisphenol A type epoxy compound, bisphenol F type epoxy compound, bisphenol S type epoxy compound, 2,2′-diallyl bisphenol A type epoxy compound, and hydrogenated bisphenol. Type epoxy compound, propylene oxide-added bisphenol A type epoxy compound, resorcinol type epoxy compound, biphenyl type epoxy compound, sulfide type epoxy compound, diphenyl ether type epoxy compound, dicyclopentadiene type epoxy compound, naphthalene type epoxy compound, phenol novolac type epoxy compound , Orthocresol novolac type epoxy compound, dicyclopentadiene novolac type epoxy compound, biphenyl novolac type epoxy Xyl compounds, naphthalenephenol novolac type epoxy compounds, glycidylamine type epoxy compounds, alkyl polyol type epoxy compounds, rubber-modified epoxy compounds, glycidyl ester compounds, bisphenol A type episulfide compounds, and the like.
上記3官能以上のポリエンモノマーとしては、1分子中に3~20個の炭素-炭素二重結合を有するモノマーが好ましく、1分子中に3~8個の炭素-炭素二重結合を有するモノマーがより好ましい。 The polyene monomer preferably contains a monomer having three or more carbon-carbon double bonds in one molecule (a polyene monomer having three or more functions).
The trifunctional or higher polyene monomer is preferably a monomer having 3 to 20 carbon-carbon double bonds in one molecule, and a monomer having 3 to 8 carbon-carbon double bonds in one molecule. More preferred.
即ち、上記シロキサン結合を有するポリチオールモノマーは、1分子中に2個以上のチオール基を有するシルセスキオキサン樹脂(以下、「チオール基含有シルセスキオキサン樹脂」ともいう)であることが好ましく、上記シロキサン結合を有するポリエンモノマーは、反応性官能基を1分子中に2個以上有するシルセスキオキサン樹脂(以下、「反応性官能基含有シルセスキオキサン樹脂」ともいう)であることが好ましい。 The siloxane bond is preferably derived from silsesquioxane.
That is, the polythiol monomer having a siloxane bond is preferably a silsesquioxane resin having two or more thiol groups in one molecule (hereinafter also referred to as “thiol group-containing silsesquioxane resin”). The polyene monomer having a siloxane bond is preferably a silsesquioxane resin having two or more reactive functional groups in one molecule (hereinafter also referred to as “reactive functional group-containing silsesquioxane resin”). .
上記R2としては、具体的には例えば、水素原子、炭素数1~8の脂肪族炭化水素基、炭素数1~8の脂環式炭化水素基、芳香族炭化水素基等が挙げられる。
上記R2は、それぞれ同一であってもよいし、異なっていてもよい。 Specific examples of R 1 include, for example, an aliphatic hydrocarbon group having 1 to 8 carbon atoms having a thiol group, an alicyclic hydrocarbon group having 1 to 8 carbon atoms having a thiol group, and an aromatic having a thiol group. Group hydrocarbon group and the like. The hydrocarbon group in R 1 is a group containing not only a carbon atom and a hydrogen atom but also a sulfur atom derived from a thiol group.
Specific examples of R 2 include a hydrogen atom, an aliphatic hydrocarbon group having 1 to 8 carbon atoms, an alicyclic hydrocarbon group having 1 to 8 carbon atoms, and an aromatic hydrocarbon group.
The R 2 may be the same or different.
上記他の架橋性化合物として、トリアルキルアルコキシシラン、ジアルキルジアルコキシシラン、テトラアルコキシシランを使用した場合、加水分解縮合物(a)の架橋密度を容易に調整できる。
また、上記他の架橋性化合物としてアルキルトリアルコキシシランを使用した場合、加水分解縮合物(a)に含まれるチオール基の数を容易に調整できる。
上記他の架橋性化合物としてテトラアルコキシチタン又はテトラアルコキシジルコニウムを使用した場合、得られる樹脂組成物の硬化物の屈折率を高めることができる。
上記他の架橋性化合物は、単独で用いられてもよいし、2種以上が併用されてもよい。 Examples of the other crosslinkable compounds include trialkylalkoxysilane, dialkyldialkoxysilane, alkyltrialkoxysilane, tetraalkoxysilane, tetraalkoxytitanium, tetraalkoxyzirconium and the like.
When a trialkylalkoxysilane, a dialkyldialkoxysilane, or a tetraalkoxysilane is used as the other crosslinkable compound, the crosslink density of the hydrolysis condensate (a) can be easily adjusted.
In addition, when alkyltrialkoxysilane is used as the other crosslinkable compound, the number of thiol groups contained in the hydrolysis condensate (a) can be easily adjusted.
When tetraalkoxytitanium or tetraalkoxyzirconium is used as the other crosslinkable compound, the refractive index of the cured product of the resulting resin composition can be increased.
Said other crosslinking compound may be used independently and 2 or more types may be used together.
上記ジアルキルジアルコキシシランとしては、例えば、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジエチルジメトキシシラン、ジエチルジエトキシシラン、ジフェニルジメトキシシラン、ジフェニルジエトキシシラン、メチルフェニルジメトキシシラン、メチルフェニルジエトキシシラン、3-メルカプトプロピルメチルジメトキシシラン等が挙げられる。
上記アルキルトリアルコキシシランとしては、例えば、メチルトリメトキシシラン、メチルトリエトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、フェニルトリメトキシシラン、フェニルトリエトキシシラン等が挙げられる。
上記テトラアルコキシシランとしては、例えば、テトラメトキシシラン、テトラエトキシシラン、テトラプロポキシシラン、テトラブトキシシラン等が挙げられる。
上記テトラアルコキシチタンとしては、例えば、テトラメトキシチタン、テトラエトキシチタン、テトラプロポキシチタン、テトラブトキシチタン等が挙げられる。
上記テトラアルコキシジルコニウムとしては、例えば、テトラエトキシジルコニウム、テトラプロポキシジルコニウム、テトラブトキシジルコニウム等が挙げられる。 Examples of the trialkylalkoxysilane include trimethylmethoxysilane, trimethylethoxysilane, triethylmethoxysilane, triethylethoxysilane, triphenylmethoxysilane, triphenylethoxysilane, and the like.
Examples of the dialkyl dialkoxysilane include dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diphenyldimethoxysilane, diphenyldiethoxysilane, methylphenyldimethoxysilane, methylphenyldiethoxysilane, 3- Examples include mercaptopropylmethyldimethoxysilane.
Examples of the alkyltrialkoxysilane include methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, phenyltrimethoxysilane, and phenyltriethoxysilane.
Examples of the tetraalkoxysilane include tetramethoxysilane, tetraethoxysilane, tetrapropoxysilane, and tetrabutoxysilane.
Examples of the tetraalkoxy titanium include tetramethoxy titanium, tetraethoxy titanium, tetrapropoxy titanium, and tetrabutoxy titanium.
Examples of the tetraalkoxyzirconium include tetraethoxyzirconium, tetrapropoxyzirconium, and tetrabutoxyzirconium.
上記触媒としては、従来公知の触媒を用いることができ、特に限定されないが、触媒活性が高く、縮合反応の触媒としても機能するので、ギ酸であることが好ましい。 In the hydrolysis reaction for obtaining the hydrolysis condensate (a), it is preferable to use a catalyst.
A conventionally known catalyst can be used as the catalyst, and is not particularly limited, but formic acid is preferable because it has high catalytic activity and functions as a catalyst for the condensation reaction.
上記反応温度は、通常0~100℃、好ましくは20~60℃であり、上記反応時間は、1分~2時間程度である。 The reaction temperature and reaction time of the hydrolysis reaction can be arbitrarily set according to the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound.
The reaction temperature is usually 0 to 100 ° C., preferably 20 to 60 ° C., and the reaction time is about 1 minute to 2 hours.
上記溶剤の種類は特に限定されないが、後述する縮合反応に用いられる溶剤と同じであることが好ましい。
上記チオール基含有シラン化合物の反応性、又は、上記チオール基含有シラン化合物及び上記他の架橋性化合物の反応性が低い場合は、上記加水分解反応の際に、溶剤を用いないことが好ましい。 A solvent may be used in the hydrolysis reaction.
Although the kind of said solvent is not specifically limited, It is preferable that it is the same as the solvent used for the condensation reaction mentioned later.
When the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound is low, it is preferable not to use a solvent during the hydrolysis reaction.
上記反応温度は、通常40~150℃程度、好ましくは60~100℃であり、上記反応時間は、30分~12時間程度である。 The reaction temperature and reaction time in the condensation reaction can be arbitrarily set according to the reactivity of the thiol group-containing silane compound or the reactivity of the thiol group-containing silane compound and the other crosslinkable compound.
The reaction temperature is usually about 40 to 150 ° C., preferably 60 to 100 ° C., and the reaction time is about 30 minutes to 12 hours.
具体的には、上記式(2)におけるR1を、上記反応性官能基又は上記反応性官能基を含む基とした反応性官能基含有シラン化合物の加水分解縮合物(以下、「加水分解縮合物(b)」ともいう)であることが好ましい。上記ポリエンモノマーとして、上記加水分解縮合物(b)を用いる場合、得られる樹脂組成物の硬化物の透明性や、弾性率や、接着性を更に高めることができる。
上記加水分解縮合物(b)は、上記チオール基含有シラン化合物を反応性官能基含有シラン化合物とすること以外は、上記加水分解縮合物(a)と同様にして作製することができる。 Examples of the reactive functional group-containing silsesquioxane resin that serves as the polyene monomer include those having the thiol group of the thiol group-containing silsesquioxane resin as a group having a carbon-carbon double bond.
Specifically, a hydrolytic condensate of a reactive functional group-containing silane compound in which R 1 in the above formula (2) is the reactive functional group or a group containing the reactive functional group (hereinafter referred to as “hydrolytic condensation”). (It is also referred to as a product (b) ”). When the hydrolysis condensate (b) is used as the polyene monomer, the transparency, elastic modulus, and adhesiveness of the cured product of the resin composition obtained can be further increased.
The hydrolysis condensate (b) can be produced in the same manner as the hydrolysis condensate (a) except that the thiol group-containing silane compound is a reactive functional group-containing silane compound.
なお、本明細書において、上記「ポリエンオリゴマー」は、上記「ポリエンモノマー」には含まれない。 It is preferable that the sealing agent for display elements of this invention contains a polyene oligomer as said polymeric compound in addition to the said polyene monomer. By containing the said polyene oligomer, the effect and coating property which suppress generation | occurrence | production of outgas can be improved.
In the present specification, the “polyene oligomer” is not included in the “polyene monomer”.
なお、本明細書において、上記「重量平均分子量」は、ゲルパーミエーションクロマトグラフィー(GPC)で測定を行い、ポリスチレン換算により求められる値である。GPCによってポリスチレン換算による重量平均分子量を測定する際に用いるカラムとしては、例えば、Shodex LF-804(昭和電工社製)等が挙げられる。 The minimum with a preferable weight average molecular weight of the said polyene oligomer is 300, and a preferable upper limit is 20,000. If the weight average molecular weight of the polyene oligomer is less than 300, the effect of suppressing the generation of outgas may not be sufficiently improved. When the weight average molecular weight of the polyene oligomer is more than 20,000, the viscosity of the obtained sealant for a display element may be too high and the coatability may be deteriorated. The minimum with a more preferable weight average molecular weight of the said polyene oligomer is 400, and a more preferable upper limit is 4000.
In the present specification, the “weight average molecular weight” is a value determined by polystyrene conversion after measurement by gel permeation chromatography (GPC). Examples of the column used when measuring the weight average molecular weight in terms of polystyrene by GPC include Shodex LF-804 (manufactured by Showa Denko).
なお、上記チオエーテルオリゴマーは、未反応チオール基や未反応炭素-炭素二重結合を含んでいてもよいし、未反応チオール基や未反応炭素-炭素二重結合を含んでいなくてもよい。即ち、上記ポリチオールモノマーと上記ポリエンモノマーとの付加重合反応を充分に進めて得られる未反応チオール基や未反応炭素-炭素二重結合を含まないオリゴマーであってもよいし、該付加重合反応の途中で反応を停止させることにより得られる未反応チオール基や未反応炭素-炭素二重結合を含むオリゴマーであってもよい。 The thioether oligomer is obtained by adding the polythiol monomer and the polyene monomer in a molar ratio of 3: 1 to 1: 3 with respect to the polythiol monomer by light irradiation or heating in the presence of a radical polymerization initiator. By carrying out the polymerization reaction, it is obtained as a polymer in the reaction mixture. Examples of the radical polymerization initiator include a photo radical polymerization initiator and a thermal radical polymerization initiator, and a thermal radical polymerization initiator is preferably used.
The thioether oligomer may contain an unreacted thiol group or an unreacted carbon-carbon double bond or may not contain an unreacted thiol group or an unreacted carbon-carbon double bond. That is, it may be an oligomer that does not contain an unreacted thiol group or an unreacted carbon-carbon double bond obtained by sufficiently proceeding an addition polymerization reaction between the polythiol monomer and the polyene monomer. It may be an oligomer containing an unreacted thiol group or an unreacted carbon-carbon double bond obtained by stopping the reaction in the middle.
上記アゾ化合物としては、例えば、2,2’-アゾビス(2,4-ジメチルバレロニトリル)、アゾビスイソブチロニトリル等が挙げられる。
上記有機過酸化物としては、例えば、過酸化ベンゾイル、ケトンパーオキサイド、パーオキシケタール、ハイドロパーオキサイド、ジアルキルパーオキサイド、パーオキシエステル、ジアシルパーオキサイド、パーオキシジカーボネート等が挙げられる。
また、上記光ラジカル重合開始剤としては、後述する本発明の表示素子用封止剤に含有される光ラジカル重合開始剤と同様のものを用いることができる。 As said thermal radical polymerization initiator, what consists of an azo compound, an organic peroxide, etc. is mentioned, for example.
Examples of the azo compound include 2,2′-azobis (2,4-dimethylvaleronitrile), azobisisobutyronitrile, and the like.
Examples of the organic peroxide include benzoyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxyester, diacyl peroxide, and peroxydicarbonate.
Moreover, as said radical photopolymerization initiator, the thing similar to the radical photopolymerization initiator contained in the sealing agent for display elements of this invention mentioned later can be used.
また、上記チオエーテルオリゴマーは、予め作製したものをポリチオールモノマー及びポリエンモノマーと混合してもよい。
上記チオエーテルオリゴマーを予め作製する場合、上記チオエーテルオリゴマーの原料となるポリチオールモノマー及びポリエンモノマーは、上述した、本発明の表示素子用封止剤に含有されるポリチオールモノマー及びポリエンモノマーと同一のものであってもよいし、異なるものであってもよい。 In addition, the sealing agent for display elements of the present invention includes a polythiol monomer, a polyene monomer, and a thioether oligomer obtained by stopping the reaction during the addition polymerization reaction in the addition polymerization reaction of the polythiol monomer and the polyene monomer described above. The mixture may contain a radical polymerization initiator.
The thioether oligomer may be prepared in advance with a polythiol monomer and a polyene monomer.
When the thioether oligomer is prepared in advance, the polythiol monomer and polyene monomer that are the raw materials of the thioether oligomer are the same as the polythiol monomer and polyene monomer contained in the display element sealing agent of the present invention described above. It may be different or different.
また、上記チオエーテルオリゴマーの重量平均分子量の好ましい上限は4万である。上記チオエーテルオリゴマーの重量平均分子量が4万を超えると、得られる表示素子用封止剤が、粘度が高くなりすぎて塗工性に劣るものとなる。上記チオエーテルオリゴマーの重量平均分子量のより好ましい上限は1万、更に好ましい上限は8000である。 A preferable lower limit of the weight average molecular weight of the thioether oligomer is 500. When the weight average molecular weight of the thioether oligomer is less than 500, the effect of preventing unevenness during application of the obtained sealant for display element may not be sufficiently exhibited. As for the weight average molecular weight of the said thioether oligomer, it is more preferable to exceed 1500, and it is still more preferable that it is 2000 or more.
Moreover, the preferable upper limit of the weight average molecular weight of the thioether oligomer is 40,000. When the weight average molecular weight of the thioether oligomer is more than 40,000, the resulting sealant for a display element is too high in viscosity and inferior in coatability. A more preferable upper limit of the weight average molecular weight of the thioether oligomer is 10,000, and a more preferable upper limit is 8,000.
また、上記重合性化合物全体100重量部中における上記チオエーテルオリゴマーの含有量の好ましい上限は90重量部である。上記チオエーテルオリゴマーの含有量が90重量部を超えると、得られる表示素子用封止剤の粘度が高くなりすぎて塗工性が悪化することがある。上記チオエーテルオリゴマーの含有量のより好ましい上限は80重量部である。 The minimum with preferable content of the said thioether oligomer in 100 weight part of the said whole polymeric compound is 30 weight part. When the content of the thioether oligomer is less than 30 parts by weight, it is not possible to sufficiently suppress the generation of outgas, or the effect of preventing unevenness at the time of coating the obtained sealant for display element is sufficiently obtained. It may not be demonstrated. The minimum with more preferable content of the said thioether oligomer is 35 weight part, and a still more preferable minimum is 40 weight part.
Moreover, the upper limit with preferable content of the said thioether oligomer in 100 weight part of the said whole polymeric compound is 90 weight part. When content of the said thioether oligomer exceeds 90 weight part, the viscosity of the sealing agent for display elements obtained will become high too much, and coating property may deteriorate. The upper limit with more preferable content of the said thioether oligomer is 80 weight part.
上記その他の重合性化合物としては、光又は熱で硬化反応するものであれば特に限定されず、例えば、上述したエポキシ(メタ)アクリレートの原料となるエポキシ化合物や、部分(メタ)アクリル変性エポキシ化合物等が挙げられる。
なお、本明細書において上記「部分(メタ)アクリル変性エポキシ化合物」とは、1分子中に1個以上のエポキシ基と1個の(メタ)アクリロイル基とを有する化合物を意味する。また、本明細書において上記「(メタ)アクリロイル基」とは、アクリロイル基又はメタクリロイル基を意味する。
上記部分(メタ)アクリル変性エポキシ化合物は、例えば、1分子中に2個以上のエポキシ基を有するエポキシ化合物の1個のエポキシ基を(メタ)アクリル酸と反応させることによって得ることができる。 The sealing agent for display elements of the present invention may contain other polymerizable compounds other than the polythiol monomer, the polyene monomer, the polyene oligomer, and the thioether oligomer, as long as the object of the present invention is not impaired. Good.
The other polymerizable compound is not particularly limited as long as it undergoes a curing reaction with light or heat. For example, an epoxy compound or a partially (meth) acryl-modified epoxy compound that is a raw material for the above-described epoxy (meth) acrylate. Etc.
In the present specification, the “partially (meth) acryl-modified epoxy compound” means a compound having one or more epoxy groups and one (meth) acryloyl group in one molecule. In the present specification, the “(meth) acryloyl group” means an acryloyl group or a methacryloyl group.
The partial (meth) acryl-modified epoxy compound can be obtained, for example, by reacting one epoxy group of an epoxy compound having two or more epoxy groups in one molecule with (meth) acrylic acid.
上記ラジカル重合開始剤は、光照射又は加熱によりラジカルを発生する官能基と、反応性官能基とを有する化合物(以下、「本発明にかかるラジカル重合開始剤」ともいう)である。本発明にかかるラジカル重合開始剤は、上記光照射又は加熱によりラジカルを発生する官能基により開始剤としての性能を発揮しつつ、上記反応性官能基を有することにより硬化物中に取り込まれるため、アウトガスの発生を充分に抑制することができる。
上記ラジカル重合開始剤は、光照射によりラジカルを発生する官能基と、反応性官能基とを有する化合物であることが好ましい。
また、本発明の表示素子用封止剤は、光重合開始剤を含有することが好ましく、該光重合開始剤として、光照射によりラジカルを発生する官能基と、反応性官能基とを有する化合物を含有することがより好ましい。 The sealing agent for display elements of this invention contains a radical polymerization initiator.
The radical polymerization initiator is a compound having a functional group that generates radicals upon light irradiation or heating and a reactive functional group (hereinafter also referred to as “radical polymerization initiator according to the present invention”). The radical polymerization initiator according to the present invention is incorporated into the cured product by having the reactive functional group while exhibiting the performance as an initiator by the functional group that generates radicals by light irradiation or heating. Outgas generation can be sufficiently suppressed.
The radical polymerization initiator is preferably a compound having a functional group that generates radicals upon irradiation with light and a reactive functional group.
Moreover, it is preferable that the sealing agent for display elements of the present invention contains a photopolymerization initiator, and the photopolymerization initiator has a functional group that generates radicals upon irradiation with light and a reactive functional group. It is more preferable to contain.
ここで、上記アシルホスフィンオキサイド系官能基とは、アシルホスフィンオキサイド又はその一部が別の基に置換した構造を有する基を意味する。上記α-アミノアルキルフェノン系官能基とは、α-アミノアルキルフェノン又はその一部が別の基に置換した構造を有する基を意味する。上記ベンジルケタール系官能基とは、α-ジヒドロキシアセトフェノン又はその一部が別の基に置換した構造を有する基を意味する。上記α-ヒドロキシアルキルフェノン系官能基とは、α-モノヒドロキシアルキルフェノン又はその水酸基以外の一部が別の基に置換した構造を有する基を意味する。上記ベンゾイン系官能基とは、ベンゾイン又はその一部が別の基に置換した構造を有する基を意味する。上記オキシムエステル系官能基とは、N-アセチルジメチルオキシム又はその一部が別の基に置換した構造を有する基を意味する。上記チタノセン系官能基とは、チタノセン又はその一部が別の基に置換した構造を有する基を意味する。上記有機過酸化物系官能基とは、ペルオキシ基を有する基を意味する。上記アゾ化合物系官能基とは、アゾ基を有する基を意味する。 Examples of the functional group that generates radicals upon light irradiation or heating include, for example, acylphosphine oxide functional groups, α-aminoalkylphenone functional groups, benzyl ketal functional groups, α-hydroxyalkylphenone functional groups, and benzoin functional groups. Examples thereof include a functional group, an oxime ester functional group, a titanocene functional group, an organic peroxide functional group, and an azo compound functional group. Among these, from the viewpoint of photocurability, acylphosphine oxide functional group, α-aminoalkylphenone functional group, benzyl ketal functional group, α-hydroxyalkylphenone functional group, benzoin functional group, oxime ester functional group It is preferably at least one selected from the group consisting of a group and a titanocene functional group, more preferably an acylphosphine oxide functional group. These functional groups may be used independently and 2 or more types may be used in combination.
Here, the acylphosphine oxide functional group means a group having a structure in which acylphosphine oxide or a part thereof is substituted with another group. The α-aminoalkylphenone functional group means a group having a structure in which α-aminoalkylphenone or a part thereof is substituted with another group. The benzyl ketal functional group means a group having a structure in which α-dihydroxyacetophenone or a part thereof is substituted with another group. The α-hydroxyalkylphenone functional group means α-monohydroxyalkylphenone or a group having a structure in which a part other than the hydroxyl group is substituted with another group. The benzoin functional group means a group having a structure in which benzoin or a part thereof is substituted with another group. The oxime ester functional group means a group having a structure in which N-acetyldimethyloxime or a part thereof is substituted with another group. The titanocene functional group means a group having a structure in which titanocene or a part thereof is substituted with another group. The organic peroxide functional group means a group having a peroxy group. The azo compound functional group means a group having an azo group.
上記α-アミノアルキルフェノン系官能基としては、例えば、2-メチル-1-(4-メチルチオフェニル)-2-モルフォリノプロパン-1-オン、2-ベンジル-2-ジメチルアミノ-1-(4-モルフォリノフェニル)ブタノン、1,2-(ジメチルアミノ)-2-((4-メチルフェニル)メチル)-1-(4-(4-モルホリニル)フェニル)-1-ブタノン等が挙げられる。
上記ベンジルケタール系官能基としては、例えば、2,2-ジメトキシ-1,2-ジフェニルエタン-1-オン等が挙げられる。
上記α-ヒドロキシアルキルフェノン系官能基としては、例えば、2-ヒロドキシ-1-(4-(4-(2-ヒドロキシ-2-メチル-プロピオニル)-ベンジル)フェニル)-2-メチル-プロパン-1-オン等が挙げられる。
上記ベンゾイン系官能基としては、例えば、ベンゾインイソプロピルエーテル等が挙げられる。
上記オキシムエステル系官能基としては、例えば、1,2-オクタンジオン-1-(4-(フェニルチオ)-2-(O-ベンゾイルオキシム))、エタノン-1-(9-エチル-6-(2-メチルベンゾイル)-9H-カルバゾール-3-イル)-1-(O-アセチルオキシム)等が挙げられる。
上記チタノセン系官能基としては、例えば、ビス(η5-2,4-シクロペンタジエン-1-イル)-ビス(2,6-ジフルオロ-3-(1H-ピロール-1-イル)-フェニル)チタニウム等が挙げられる。 Examples of the acylphosphine oxide functional group include 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, and the like.
Examples of the α-aminoalkylphenone functional group include 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4 -Morpholinophenyl) butanone, 1,2- (dimethylamino) -2-((4-methylphenyl) methyl) -1- (4- (4-morpholinyl) phenyl) -1-butanone and the like.
Examples of the benzyl ketal functional group include 2,2-dimethoxy-1,2-diphenylethane-1-one.
Examples of the α-hydroxyalkylphenone functional group include 2-hydroxy-1- (4- (4- (2-hydroxy-2-methyl-propionyl) -benzyl) phenyl) -2-methyl-propane-1 -ON and the like.
Examples of the benzoin functional group include benzoin isopropyl ether.
Examples of the oxime ester functional group include 1,2-octanedione-1- (4- (phenylthio) -2- (O-benzoyloxime)), ethanone-1- (9-ethyl-6- (2 -Methylbenzoyl) -9H-carbazol-3-yl) -1- (O-acetyloxime) and the like.
Examples of the titanocene functional group include bis (η5-2,4-cyclopentadien-1-yl) -bis (2,6-difluoro-3- (1H-pyrrol-1-yl) -phenyl) titanium, and the like. Is mentioned.
なお、上記光照射又は加熱によりラジカルを発生する官能基を有し、かつ、上記反応性官能基として炭素-炭素二重結合を有する官能基を1分子中に2個以上有する化合物は、上記ポリエンモノマーではなく、本発明にかかるラジカル重合開始剤とする。 The radical polymerization initiator according to the present invention preferably has two or more of the reactive functional groups in one molecule. By having two or more of the reactive functional groups in one molecule, the radical polymerization initiator according to the present invention is more easily taken into the cured product.
The compound having a functional group capable of generating a radical upon irradiation with light or heating and having two or more functional groups having a carbon-carbon double bond as the reactive functional group in one molecule is the polyene. It is not a monomer but a radical polymerization initiator according to the present invention.
R4及びR7は、それぞれ独立して、反応性官能基、水素結合性官能基を有する基、水素原子、炭素数3~20のカルボアルコキシアルキル基(1個以上の酸素原子により中断、及び/又は、1個以上のヒドロキシル基により置換されていてもよい)、ハロゲン原子、炭素数1~12のアルキル基、シクロペンチル基、シクロヘキシル基、フェニル基(-OR10基、-SR11基、及び、-NR12R13基からなる群より選択される少なくとも1種により置換されていてもよい)、ベンジル基、ベンゾイル基、炭素数2~12のアルカノイル基、炭素数2~12のアルコキシカルボニル基(1個以上の酸素原子により中断、及び/又は、1個以上のヒドロキシル基により置換されていてもよい)、フェノキシカルボニル基、-OR10基、-SR11基、-SOR11基、-SO2R11基、或いは、-NR12R13基(ここで、-OR10基、-SR11基、及び、-NR12R13基は、フェニル環の有する置換基若しくはフェニル環の炭素原子の一つと、R10、R11、R12、及び/若しくは、R13を介して5員環又は6員環を形成していてもよい)である。ただし、R4及びR7の少なくとも一方は、反応性官能基である。
R5、R6、R8、及び、R9は、それぞれ独立して、水素原子、ハロゲン原子、炭素数1~12のアルキル基、シクロペンチル基、シクロヘキシル基、フェニル基(-OR10基、-SR11基、若しくは、-NR12R13基により置換されていてもよい)、ベンジル基、ベンゾイル基、炭素数2~12のアルカノイル基、炭素数2~12のアルコキシカルボニル基(1個以上の酸素原子により中断、及び/若しくは、1個以上のヒドロキシル基により置換されていてもよい)、フェノキシカルボニル基、-OR10基、-SR11基、-SOR11基、-SO2R11基、又は、-NR12R13基であり、-OR10基、-SR11基、及び、-NR12R13基は、フェニル環の有する置換基又はフェニル環の炭素原子の一つと、R10、R11、R12、及び/又は、R13を介して5員環又は6員環を形成していてもよい。
R10は、水素原子、炭素数1~12のアルキル基、炭素数2~6のアルキル基(-OH基、-SH基、-CN基、炭素数1~4のアルコキシ基、炭素数3~6のアルケンオキシ基、-OCH2CH2CN基、炭素数4~7の-OCH2CH2(CO)O-アルキル基、炭素数2~5の-O(CO)-アルキル基、-O(CO)-フェニル基、-(CO)OH基、若しくは、炭素数2~5の-(CO)O-アルキル基で置換されている)、炭素数2~6のアルキル基(1個以上の酸素原子により中断されている)、-(CH2CH2O)nH基、炭素数2~8のアルカノイル基、炭素数3~12のアルケニル基、炭素数3~6のアルケノイル基、シクロヘキシル基、フェニル基(ハロゲン原子、炭素数1~12のアルキル基、若しくは、炭素数1~4のアルコキシ基で置換されていてもよい)、炭素数7~9のフェニルアルキル基、-Si(炭素数1~8のアルキル)r(フェニル)3-r基、又は、下記式(4)で表される基のいずれかである。nは、1~20であり、rは、1~3である。
R11は、水素原子、炭素数1~12のアルキル基、炭素数3~12のアルケニル基、シクロヘキシル基、炭素数2~6のアルキル基(-OH基、-SH基、-CN基、炭素数1~4のアルコキシ基、炭素数3~6のアルケンオキシ基、-OCH2CH2CN基、炭素数4~7の-OCH2CH2(CO)O-アルキル基、炭素数2~5の-O(CO)-アルキル基、-O(CO)-フェニル基、-(CO)OH基、若しくは、炭素数2~5の-(CO)O-アルキル基で置換されている)、炭素数2~12のアルキル基(1個以上の酸素原子若しくは硫黄原子により中断されている)、フェニル基(ハロゲン原子、炭素数1~12のアルキル基、若しくは、炭素数1~4のアルコキシ基で置換されていてもよい)、炭素数7~9のフェニルアルキル基、又は、下記式(5)で表される基のいずれかである。
R12及びR13は、それぞれ独立して、水素原子、炭素数1~12のアルキル基、炭素数2~4のヒドロキシアルキル基、炭素数2~10のアルコキシアルキル基、炭素数3~5のアルケニル基、炭素数5~12のシクロアルキル基、炭素数7~9のフェニルアルキル基、フェニル基(炭素数1~12のアルキル基若しくは炭素数1~4のアルコキシ基により置換されている)、炭素数2~3のアルカノイル基、炭素数3~6のアルケノイル基、ベンゾイル基、或いは、R12及びR13が1つの基となった炭素数2~6のアルキレン基(酸素原子若しくは-NR10-基により中断、及び/又は、ヒドロキシル基、炭素数1~4のアルコキシ基、炭素数2~4のアルカノイルオキシ基、若しくは、ベンゾイルオキシ基で置換されていてもよい)である。R12が水素原子である場合、R13は、下記式(6)で表される基であってもよい。 In the formula (3), R 3 is selected from the group consisting of a phenyl group (an alkyl group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, —OR 10 group, —SR 11 group, and —NR 12 R 13 group). Optionally substituted by at least one selected), an alkyl group having 1 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms (interrupted by one or more oxygen atoms, and / or one or more Optionally substituted with a hydroxyl group), a cycloalkyl group having 5 to 8 carbon atoms, an alkanoyl group having 2 to 20 carbon atoms, a benzoyl group (an alkyl group having 1 to 6 carbon atoms, a phenyl group, an —OR 10 group, -SR 11 groups, and, -NR 12 may be substituted by at least one selected from the group consisting of R 13 groups), the alkoxycarbonyl group (one or more oxygen atoms of 2 to 12 carbon atoms Interruption, and / or may be substituted by one or more hydroxyl groups), a phenoxycarbonyl group (an alkyl group having 1 to 6 carbon atoms, a phenyl group, a halogen atom, -OR 10 groups, and, -NR 12 Optionally substituted by at least one selected from the group consisting of R 13 groups), —CONR 12 R 13 group, —CN group, —NO 2 group, haloalkyl group having 1 to 4 carbon atoms, carbon number 1 -S (O) m -alkyl group having 6 to 6, -S (O) m -aryl group having 6 to 12 carbon atoms (which may be substituted with an alkyl group having 1 to 12 carbon atoms), 1 to carbon atoms 6 —SO 2 O-alkyl group, 6 to 10 carbon atoms —SO 2 O-aryl group, or diphenylphosphinoyl group, and m is 1 or 2.
R 4 and R 7 are each independently a reactive functional group, a group having a hydrogen bonding functional group, a hydrogen atom, a carboalkoxyalkyl group having 3 to 20 carbon atoms (interrupted by one or more oxygen atoms, and / Or optionally substituted with one or more hydroxyl groups), a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, —SR 11 group, and A benzyl group, a benzoyl group, an alkanoyl group having 2 to 12 carbon atoms, or an alkoxycarbonyl group having 2 to 12 carbon atoms, which may be substituted with at least one selected from the group consisting of —NR 12 R 13 groups) (interrupted by one or more oxygen atoms, and / or may be substituted by one or more hydroxyl groups), a phenoxycarbonyl group, -OR 0 group, -SR 11 group, -SOR 11 group, -SO 2 R 11 group, or, -NR 12 R 13 group (herein, 10 group -OR, -SR 11 groups, and, -NR 12 R 13 group May form a 5-membered or 6-membered ring with R 10 , R 11 , R 12 , and / or R 13 with one of the substituents of the phenyl ring or the carbon atom of the phenyl ring. ). However, at least one of R 4 and R 7 is a reactive functional group.
R 5 , R 6 , R 8 , and R 9 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, — SR 11 group, or optionally substituted by —NR 12 R 13 group), benzyl group, benzoyl group, alkanoyl group having 2 to 12 carbon atoms, alkoxycarbonyl group having 2 to 12 carbon atoms (one or more Optionally interrupted by an oxygen atom and / or substituted by one or more hydroxyl groups), a phenoxycarbonyl group, a —OR 10 group, a —SR 11 group, a —SOR 11 group, a —SO 2 R 11 group, or a -NR 12 R 13 groups, 10 groups -OR, -SR 11 groups, and, -NR 12 R 13 groups, the substituent or the phenyl ring with a phenyl ring And one atom, R 10, R 11, R 12, and / or may form a 5- or 6-membered ring via the R 13.
R 10 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, alkoxy group having 1 to 4 carbon atoms, 3 to 3 carbon atoms). 6 alkeneoxy groups, —OCH 2 CH 2 CN groups, —OCH 2 CH 2 (CO) O-alkyl groups having 4 to 7 carbon atoms, —O (CO) -alkyl groups having 2 to 5 carbon atoms, —O (CO) -phenyl group,-(CO) OH group, or a-(CO) O-alkyl group having 2 to 5 carbon atoms), an alkyl group having 2 to 6 carbon atoms (one or more Interrupted by an oxygen atom), — (CH 2 CH 2 O) n H group, alkanoyl group having 2 to 8 carbon atoms, alkenyl group having 3 to 12 carbon atoms, alkenoyl group having 3 to 6 carbon atoms, cyclohexyl group , Phenyl group (halogen atom, alkyl group having 1 to 12 carbon atoms, May be substituted with an alkoxy group having 1 to 4 carbon atoms), a phenylalkyl group having 7 to 9 carbon atoms, -Si (alkyl having 1 to 8 carbon atoms) r (phenyl) 3-r groups, or Or any one of groups represented by the following formula (4). n is 1 to 20, and r is 1 to 3.
R 11 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 3 to 12 carbon atoms, a cyclohexyl group, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, carbon C 1-4 alkoxy group, C 3-6 alkeneoxy group, —OCH 2 CH 2 CN group, C 4-7 —OCH 2 CH 2 (CO) O-alkyl group, C 2-5 -O (CO) -alkyl group, -O (CO) -phenyl group,-(CO) OH group, or-(CO) O-alkyl group having 2 to 5 carbon atoms), carbon An alkyl group of 2 to 12 (interrupted by one or more oxygen or sulfur atoms), a phenyl group (a halogen atom, an alkyl group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 4 carbon atoms) Which may be substituted), Niruarukiru group, or any one of groups represented by the following formula (5).
R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a hydroxyalkyl group having 2 to 4 carbon atoms, an alkoxyalkyl group having 2 to 10 carbon atoms, or an alkyl group having 3 to 5 carbon atoms. An alkenyl group, a cycloalkyl group having 5 to 12 carbon atoms, a phenylalkyl group having 7 to 9 carbon atoms, a phenyl group (substituted by an alkyl group having 1 to 12 carbon atoms or an alkoxy group having 1 to 4 carbon atoms), An alkanoyl group having 2 to 3 carbon atoms, an alkenoyl group having 3 to 6 carbon atoms, a benzoyl group, or an alkylene group having 2 to 6 carbon atoms in which R 12 and R 13 form one group (oxygen atom or —NR 10 -Interrupted by a group and / or substituted with a hydroxyl group, an alkoxy group having 1 to 4 carbon atoms, an alkanoyloxy group having 2 to 4 carbon atoms, or a benzoyloxy group It is also may). When R 12 is a hydrogen atom, R 13 may be a group represented by the following formula (6).
以下、置換基についての説明は、特に指定しない限り、R3、R5、R6、R8、R9、R10、R11、R12、及び、R13のそれぞれ該当するものに共通する事項についての説明である。 The oxime ester initiator of the present invention is a compound represented by the above formula (3).
Hereinafter, unless otherwise specified, the description of the substituent is common to the corresponding ones of R 3 , R 5 , R 6 , R 8 , R 9 , R 10 , R 11 , R 12 , and R 13. It is an explanation about the matter.
また、上記式(3)中、R5、R6、R8、及び、R9は、水素原子であることが好ましい。 R 3 is preferably an alkyl group having 1 to 20 carbon atoms, and more preferably an alkyl group having 1 to 6 carbon atoms.
Moreover, in said formula (3), it is preferable that R < 5 >, R < 6 >, R < 8 > and R < 9 > are hydrogen atoms.
上記式(3)中、R4及びR7の少なくとも一方が反応性官能基であることにより、本発明のオキシムエステル開始剤を重合性化合物の重合反応に用いた際に、該重合反応を開始させるとともに、重合性化合物と反応して硬化物中に取り込まれるため、アウトガスの発生や、液晶等へ溶出することによる汚染を充分に抑制することができる。
R4及びR7は、両方が反応性官能基であることが好ましい。 The reactive functional group possessed by the oxime ester initiator of the present invention means a functional group capable of reacting with the polymerizable compound.
In the above formula (3), when at least one of R 4 and R 7 is a reactive functional group, the polymerization reaction starts when the oxime ester initiator of the present invention is used for the polymerization reaction of the polymerizable compound. In addition, since it reacts with the polymerizable compound and is taken into the cured product, it is possible to sufficiently suppress the occurrence of outgas and contamination due to elution into the liquid crystal.
R 4 and R 7 are preferably both reactive functional groups.
上記水素結合性官能基は、水素結合性を有する官能基を意味する。
上記式(3)中、R4及びR7の一方が水素結合性官能基を有する基である場合、重合性化合物との相溶性が高くなり、液晶等へ溶出することによる汚染を充分に抑制することができる。
上記水素結合性官能基としては、例えば、-OH基、-NH2基、-NHR基(Rは、芳香族、脂肪族炭化水素、又は、これらの誘導体を表す)、-COOH基、-CONH2基、-NHOH基等の官能基や、-NHCO-結合、-NH-結合、-CONHCO-結合、-NH-NH-結合等の残基が挙げられる。なかでも、-OH基が好ましい。 In the above formula (3), when one of R 4 and R 7 is a reactive functional group, the other may be a group having a hydrogen bonding functional group.
The hydrogen bonding functional group means a functional group having hydrogen bonding properties.
In the above formula (3), when one of R 4 and R 7 is a group having a hydrogen bondable functional group, the compatibility with the polymerizable compound is increased, and contamination due to elution into liquid crystal or the like is sufficiently suppressed. can do.
Examples of the hydrogen bonding functional group include an —OH group, —NH 2 group, —NHR group (R represents an aromatic, aliphatic hydrocarbon, or derivative thereof), —COOH group, —CONH. And functional groups such as two groups and —NHOH group, and residues such as —NHCO— bond, —NH— bond, —CONHCO— bond, and —NH—NH— bond. Of these, —OH group is preferable.
具体的には例えば、上記式(7)で表される化合物は、以下の方法等により製造することができる。即ち、まず、2-フェニルチオメタノールを、ジクロロメタン中、トリエチルアミンの存在下で塩化アセチルと反応させて酢酸2-フェニルチオエチルを得た後、得られた酢酸2-フェニルチオエチルを、ジクロロメタン中、塩化アルミニウムの存在下でオクタン酸クロリドと反応させて下記式(12-1)で表されるアシル化合物を作製する。次いで、得られたアシル化合物を、テトラヒドロフラン中、濃塩酸の存在下でイソアミルナイトライトと反応させて下記式(12-2)で表されるオキシム化合物を作製し、得られたオキシム化合物を、テトラヒドロフラン中、トリエチルアミンの存在下で3-アリルオキシプロピオン酸クロリドと反応させることにより、上記式(7)で表される化合物を製造することができる。 Examples of the method for producing the oxime ester initiator of the present invention are the same as those in the above formula (3) except for the ═N—OC (═O) —R 4 group and R 7 in the above formula (3). , ═N—OC (═O) —R 4 oxime is converted to an acyl compound in which the portion of the 4 group is a hydrogen atom to obtain an oxime compound, and then the portion of R 7 in the above formula (3) is formed. Examples include a method of reacting acyl chloride having R 4 .
Specifically, for example, the compound represented by the above formula (7) can be produced by the following method or the like. That is, first, 2-phenylthiomethanol was reacted with acetyl chloride in dichloromethane in the presence of triethylamine to obtain 2-phenylthioethyl acetate, and then 2-phenylthioethyl acetate was obtained in dichloromethane. Reaction with octanoic acid chloride in the presence of aluminum chloride produces an acyl compound represented by the following formula (12-1). Next, the obtained acyl compound was reacted with isoamyl nitrite in tetrahydrofuran in the presence of concentrated hydrochloric acid to prepare an oxime compound represented by the following formula (12-2). The obtained oxime compound was converted into tetrahydrofuran. The compound represented by the above formula (7) can be produced by reacting with 3-allyloxypropionic acid chloride in the presence of triethylamine.
上記接着性付与剤としては、例えば、3-メタクリロキシプロピルトリメトキシシラン、3-グリシドキシプロピルトリメトキシシラン、3-グリシドキシプロピルメチルジエトキシシラン、N-(アミノエチル)アミノプロピルトリメトキシシラン、メルカプトプロピルトリメトキシシラン等のシランカップリング剤や、チタンカップリング剤や、アルミニウムカップリング剤等が挙げられる。これらの接着性付与剤は単独で用いられてもよいし、2種以上が併用されてもよい。 The sealant for display elements of the present invention may contain an adhesion promoter.
Examples of the adhesion-imparting agent include 3-methacryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N- (aminoethyl) aminopropyltrimethoxy Examples include silane coupling agents such as silane and mercaptopropyltrimethoxysilane, titanium coupling agents, and aluminum coupling agents. These adhesiveness imparting agents may be used alone or in combination of two or more.
上記安定剤としては、例えば、2,2’-メチレンビス-(4-メチル-6-t-ブチルフェノール)、4,4’-ブチリデンビス-(6-t-ブチル-3-メチルフェノール)、2,2’-メチレンビス-(4-エチル-6-t-ブチルフェノール)等が挙げられる。これらの安定剤は単独で用いられてもよいし、2種以上が併用されてもよい。 The sealing agent for display elements of the present invention may contain a stabilizer for the purpose of preventing oxidation or the like.
Examples of the stabilizer include 2,2′-methylenebis- (4-methyl-6-tert-butylphenol), 4,4′-butylidenebis- (6-tert-butyl-3-methylphenol), 2,2 Examples include '-methylenebis- (4-ethyl-6-t-butylphenol). These stabilizers may be used independently and 2 or more types may be used together.
なお、上記可視光の平均透過率を測定する硬化物は、本発明の表示素子用封止剤に対して、2000mJ/cm2の紫外線を照射する方法により得ることができる。 The sealant for display element of the present invention preferably has an average visible light transmittance of 80% or more in a region of a cured product having a wavelength of 380 to 780 nm. When the average transmittance of visible light is 80% or more, it can be suitably used for applications requiring transparency. The average transmittance of the visible light is more preferably 95% or more.
In addition, the hardened | cured material which measures the average transmittance | permeability of the said visible light can be obtained by the method of irradiating a 2000mJ / cm < 2 > ultraviolet-ray with respect to the sealing agent for display elements of this invention.
なお、上記重量減少率を測定する硬化物は、厚さ100μmとなるように塗布した本発明の表示素子用封止剤に対して、2000mJ/cm2の紫外線を照射する方法により得ることができる。 The sealant for a display element of the present invention preferably has a weight reduction rate of 0.15% or less when a 100 μm thick cured product is heated to 130 ° C. at a temperature rising rate of 10 ° C./min. Since the weight reduction rate can be regarded as an outgas generation amount, an adverse effect on the display element can be suppressed by being 0.15% or less. The weight reduction rate is more preferably 0.1% or less.
In addition, the hardened | cured material which measures the said weight decreasing rate can be obtained by the method of irradiating 2000 mJ / cm < 2 > of ultraviolet-rays with respect to the sealing agent for display elements of this invention apply | coated so that it may become
本発明の表示素子用封止剤を光硬化させる方法としては、例えば、300~400nmの波長及び300~3000mJ/cm2の積算光量の光を照射する方法等が挙げられる。 The sealant for display elements of the present invention can be cured by light irradiation or heating, and is preferably cured by light irradiation.
Examples of the method for photocuring the sealant for display elements of the present invention include a method of irradiating light having a wavelength of 300 to 400 nm and an integrated light amount of 300 to 3000 mJ / cm 2 .
なお、本明細書において上記「全面」とは、表示素子を有する面の必ずしも100%を意味するものではなく、表示素子に求められる必要な封止面を意味する。また、上記「前面」とは、光線を取り出す側、即ち、視認側の面を意味する The sealant for display element of the present invention is a sealant for sealing the entire surface, front surface, rear surface, or periphery of the display element, or a seal for sealing an opening provided in the display element. It can be used as an agent, and is particularly preferably used for sealing the entire surface of the display element.
In the present specification, the “entire surface” does not necessarily mean 100% of the surface having the display element, but means a necessary sealing surface required for the display element. The “front surface” means a surface from which light is extracted, that is, a surface on the viewing side.
ポリチオールモノマーとしてトリメチロールプロパントリス(3-メルカプトプロピオネート)63重量部と、ポリエンモノマーとしてトリアリルイソシアヌレート37重量部とを加熱撹拌しながら、熱ラジカル重合開始剤として2,2’-アゾビス(2,4-ジメチルバレロニトリル)0.2重量部を徐々に添加し、得られた反応混合物を貧溶媒に流し、沈殿したオリゴマーを集め、溶媒を真空下で除去することにより、チオエーテルオリゴマーを得た。
得られたチオエーテルオリゴマーについて、カラムとしてShodex LF-804(昭和電工社製)を用いたゲルパーミエーションクロマトグラフィー(GPC)にてポリスチレン換算による重量平均分子量を測定した。その結果、チオエーテルオリゴマーの重量平均分子量は5000であった。 (Production of thioether oligomer)
While heating and stirring 63 parts by weight of trimethylolpropane tris (3-mercaptopropionate) as a polythiol monomer and 37 parts by weight of triallyl isocyanurate as a polyene monomer, 2,2′-azobis ( 2,4-dimethylvaleronitrile) is gradually added, the resulting reaction mixture is poured into a poor solvent, the precipitated oligomer is collected, and the solvent is removed under vacuum to obtain a thioether oligomer. It was.
For the obtained thioether oligomer, the weight average molecular weight in terms of polystyrene was measured by gel permeation chromatography (GPC) using Shodex LF-804 (manufactured by Showa Denko KK) as a column. As a result, the weight average molecular weight of the thioether oligomer was 5000.
ポリエンモノマーとしてトリアリルイソシアヌレート100重量部を加熱撹拌しながら、熱ラジカル重合開始剤として2,2’-アゾビス(2,4-ジメチルバレロニトリル)0.2重量部を徐々に添加し、得られた反応混合物を貧溶媒に流し、沈殿したオリゴマーを集め、溶媒を真空下で除去することにより、ポリエンオリゴマーを得た。
得られたポリエンオリゴマーについて、カラムとしてShodex LF-804(昭和電工社製)を用いたゲルパーミエーションクロマトグラフィー(GPC)にてポリスチレン換算による重量平均分子量を測定した。その結果、チオエーテルオリゴマーの重量平均分子量は1250であった。 (Preparation of polyene oligomer)
While heating and stirring 100 parts by weight of triallyl isocyanurate as a polyene monomer, 0.2 part by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) is gradually added as a thermal radical polymerization initiator. The reaction mixture was poured into a poor solvent, the precipitated oligomer was collected, and the solvent was removed under vacuum to obtain a polyene oligomer.
About the obtained polyene oligomer, the weight average molecular weight by polystyrene conversion was measured with the gel permeation chromatography (GPC) using Shodex LF-804 (made by Showa Denko KK) as a column. As a result, the weight average molecular weight of the thioether oligomer was 1250.
表1に記載された配合比に従い、各材料を、撹拌機(新東科学社製、「スリーワンモーター HEIDON BLH300」)を用いて混合することにより、実施例1~7及び比較例1の表示素子用封止剤を調製した。
なお、本発明にかかるラジカル重合開始剤として、実施例1~3、6、7では、開始剤Aとして、分子内にα-ヒドロキシアルキルフェノン系官能基とアクリロイル基とを有する化合物(ケーエスエム社製、「UV-H-4000」、重量平均分子量850)を用い、実施例4では、開始剤Bとして、α-アミノアルキルフェノン系官能基とチオール基とを有する下記式(13)で表される化合物(分子量353)を用い、実施例5では、開始剤Cとして、開始剤A50重量部とトリメチロールプロパントリス(3-メルカプトプロピオネート)50重量部とに熱ラジカル重合開始剤として2,2’-アゾビス(2,4-ジメチルバレロニトリル)0.2重量部を徐々に添加し、得られた反応混合物を貧溶媒に流し、沈殿物を集め、溶媒を真空下で除去することにより得られた化合物(重量平均分子量9万8000)を用いた。また、その他の光重合開始剤として、比較例1では、開始剤Dとして、1-(4-(2-ヒドロキシエトキシ)-フェニル)-2-ヒドロキシ-2-メチル-1-プロパン-1-オン(BASF Japan社製、「IRGACURE2959」)を用いた。 (Examples 1 to 7, Comparative Example 1)
According to the blending ratio described in Table 1, each material was mixed using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three One Motor HEIDON BLH300”), so that the display elements of Examples 1 to 7 and Comparative Example 1 A sealing agent was prepared.
As the radical polymerization initiator according to the present invention, in Examples 1 to 3, 6, and 7, the initiator A is a compound having an α-hydroxyalkylphenone functional group and an acryloyl group in the molecule (manufactured by KSM Co., Ltd.). In Example 4, the initiator B is represented by the following formula (13) having an α-aminoalkylphenone functional group and a thiol group: “UV-H-4000”, weight average molecular weight 850). In Example 5, a compound (molecular weight 353) was used, and as initiator C, 50 parts by weight of initiator A and 50 parts by weight of trimethylolpropane tris (3-mercaptopropionate) Gradually add 0.2 parts by weight of '-azobis (2,4-dimethylvaleronitrile), pour the resulting reaction mixture into a poor solvent, collect the precipitate, and vacuum the solvent In the compound obtained by removing the (weight-average molecular weight 98,000) was used. As another photopolymerization initiator, in Comparative Example 1, 1- (4- (2-hydroxyethoxy) -phenyl) -2-hydroxy-2-methyl-1-propan-1-one was used as the initiator D. ("IRGACURE2959" manufactured by BASF Japan) was used.
実施例1~7及び比較例1で得られた各表示素子用封止剤について、以下の方法により評価を行った。結果を表1に示した。 <Evaluation>
The sealants for display elements obtained in Examples 1 to 7 and Comparative Example 1 were evaluated by the following methods. The results are shown in Table 1.
コーンローター式粘度計(東機産業社製、「TV-22型」)を用いて、20℃、20rpmの条件で実施例1~7及び比較例1で得られた各表示素子用封止剤の粘度を測定した。 (1) Each display element obtained in Examples 1 to 7 and Comparative Example 1 under the conditions of 20 ° C. and 20 rpm using a viscosity cone rotor viscometer (“TV-22 type” manufactured by Toki Sangyo Co., Ltd.) The viscosity of the sealing agent was measured.
ディスペンサー(武蔵エンジニアリング社製、「SHOTMASTER300」)を用いて、ガラス基板上に実施例1~7及び比較例1で得られた各表示素子用封止剤を塗工した際の塗工性を評価した。ディスペンスノズルを400μm、ノズルギャップを30μm、塗出圧を300kPaに固定して塗工したとき、かすれやダレがなく塗工できた場合「○」、かすれやダレが生じた場合「△」、大きな塗工切れや塗工ムラが生じたり、全く塗工できなかったりした場合「×」として塗工性を評価した。 (2) When the sealants for display elements obtained in Examples 1 to 7 and Comparative Example 1 were applied on a glass substrate using a coatable dispenser (manufactured by Musashi Engineering Co., Ltd., “SHOTMASTER300”) The coating property was evaluated. When coating with a dispensing nozzle of 400 μm, a nozzle gap of 30 μm, and a coating pressure of 300 kPa, it was possible to apply without fading or sagging, “◯”, when fading or sagging occurred, “△”, large The coating property was evaluated as “×” when the coating was cut off, coating unevenness occurred, or coating could not be performed at all.
実施例1~7及び比較例1で得られた各表示素子用封止剤を、バーコーターを用いて塗工後の厚さが100μmとなるように塗工し、超高圧水銀灯を用いて2000mJ/cm2の紫外線を照射してフィルムを形成した。
得られたフィルムを熱分析装置(Seiko Instruments社製、「TG/DTA6200」)を用いて、昇温速度10℃/minで150℃まで加熱したときの重量減少率を測定し、これをアウトガス発生量とした。 (3) Outgas generation amount Each sealant for display element obtained in Examples 1 to 7 and Comparative Example 1 was applied using a bar coater so that the thickness after coating was 100 μm. A film was formed by irradiating ultraviolet light of 2000 mJ / cm 2 using a high-pressure mercury lamp.
Using a thermal analyzer (“TG / DTA6200” manufactured by Seiko Instruments, Inc.), the resulting film was measured for weight loss rate when heated to 150 ° C. at a rate of temperature increase of 10 ° C./min, and this was generated as outgas. The amount.
実施例1~7及び比較例1で得られた各表示素子用封止剤をマイクロピペットを用いてガラス基板上に0.05g塗工した。この基板を、スペーサーを配置した別のガラス基板と50μmの厚みとなるように貼り合わせ、高圧水銀灯を用いて2000mJ/cm2の紫外線を照射して、接着力試験用試料を作製した。得られた接着力試験用試料について、EZ GRAPH(島津製作所社製)を用いて、剥離速度5mm/minの条件で剥離試験を行い、接着力を測定した。接着力が1.0N/cm以上であったものを「○」、接着力が1.0N/cm未満であったものを「×」として接着性を評価した。 (4) Adhesiveness 0.05 g of each display element sealant obtained in Examples 1 to 7 and Comparative Example 1 was applied onto a glass substrate using a micropipette. This substrate was bonded to another glass substrate on which a spacer was disposed so as to have a thickness of 50 μm, and irradiated with 2000 mJ / cm 2 of ultraviolet rays using a high-pressure mercury lamp, to prepare a sample for adhesion test. The obtained adhesion test sample was subjected to a peel test using EZ GRAPH (manufactured by Shimadzu Corporation) at a peel rate of 5 mm / min to measure the adhesive force. The adhesiveness was evaluated as “◯” when the adhesive strength was 1.0 N / cm or more, and “X” when the adhesive strength was less than 1.0 N / cm.
実施例1~7及び比較例1で得られた各表示素子用封止剤を、PET樹脂フィルムに挟み、2000mJ/cm2の紫外線を照射して、厚さ100μmの透過率測定用サンプルを作製した。得られた透過率測定用サンプルについて、分光光度計(日立製作所社製、「U-3000」、条件300~800nm)を用いて、波長380~780nmにおける光線透過率を測定した。 (5) Transparency (transmittance) of the cured product
Each display element sealant obtained in Examples 1 to 7 and Comparative Example 1 is sandwiched between PET resin films and irradiated with 2000 mJ / cm 2 of ultraviolet light to produce a 100 μm thick sample for transmittance measurement. did. The obtained transmittance measurement sample was measured for light transmittance at a wavelength of 380 to 780 nm using a spectrophotometer (manufactured by Hitachi, Ltd., “U-3000”, conditions 300 to 800 nm).
(有機発光材料層を含む積層体が配置された基板の作製)
ガラス基板(長さ25mm、幅25mm、厚さ0.7mm)にITO電極を1000Åの厚さで成膜したものを基板とした。上記基板をアセトン、アルカリ水溶液、イオン交換水、イソプロピルアルコールにてそれぞれ15分間超音波洗浄した後、煮沸させたイソプロピルアルコールにて10分間洗浄し、更に、UV-オゾンクリーナ(日本レーザー電子社製、「NL-UV253」)にて直前処理を行った。
次に、この基板を真空蒸着装置の基板フォルダに固定し、素焼きの坩堝にN,N’-ジ(1-ナフチル)-N,N’-ジフェニルベンジジン(α-NPD)を200mg、他の異なる素焼き坩堝にトリス(8-ヒドロキシキノリラ)アルミニウム(Alq3)を200mg入れ、真空チャンバー内を、1×10-4Paまで減圧した。その後、α-NPDの入った坩堝を加熱し、α-NPDを蒸着速度15Å/sで基板に堆積させ、膜厚600Åの正孔輸送層を成膜した。次いで、Alq3の入った坩堝を加熱し、15Å/sの蒸着速度で膜厚600Åの有機発光材料層を成膜した。その後、正孔輸送層及び有機発光材料層が形成された基板を別の真空蒸着装置に移し、この真空蒸着装置内のタングステン製抵抗加熱ボートにフッ化リチウム200mgを、別のタングステン製ボートにアルミニウム線1.0gを入れた。その後、真空蒸着装置の蒸着器内を2×10-4Paまで減圧してフッ化リチウムを0.2Å/sの蒸着速度で5Å成膜した後、アルミニウムを20Å/sの速度で1000Å成膜した。窒素により蒸着器内を常圧に戻し、10mm×10mmの有機発光材料層を含む積層体が配置された基板を取り出した。 (6) Display performance of display element (production of a substrate on which a laminate including an organic light emitting material layer is disposed)
A glass substrate (
Next, this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine (α-NPD) is put into an unglazed crucible and other different types. 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 × 10 −4 Pa. Thereafter, the crucible containing α-NPD was heated, and α-NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 正 孔 hole transport layer. Next, the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 で at a deposition rate of 15 Å / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added. After that, the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 × 10 −4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did. The inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm × 10 mm was arranged was taken out.
得られた有機発光材料層を含む積層体が配置された基板の、該積層体の全体を覆うように、13mm×13mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Aを形成した。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量を10sccm及び200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。
形成された無機材料膜Aの厚さは、約0.2μmであった。 (Coating with inorganic material film A)
A mask having an opening of 13 mm × 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0. The test was performed at 9 Torr.
The formed inorganic material film A had a thickness of about 0.2 μm.
真空装置内に、無機材料膜Aで被覆された積層体が配置された基板を設置し、真空装置の中に設置された加熱ボートに実施例1~7及び比較例1で得られた各表示素子用封止剤を0.5g入れ、10Paに減圧して、積層体を含む11mm×11mmの四角形の部分に、表示素子用封止剤を200℃にて加熱し、厚さが0.5μmになるように真空蒸着を行った。その後、真空環境下で高圧水銀灯を用いて波長365nmの紫外線を照射量が3000mJ/cm2となるように照射して、表示素子用封止剤を硬化させて樹脂保護膜を形成した。 (Formation of resin protective film)
In the vacuum apparatus, a substrate on which a laminated body coated with the inorganic material film A is arranged, and each display obtained in Examples 1 to 7 and Comparative Example 1 is placed on a heating boat installed in the vacuum apparatus. 0.5 g of element sealant was put, pressure was reduced to 10 Pa, and the sealant for display element was heated at 200 ° C. to a 11 mm × 11 mm square portion including the laminate, and the thickness was 0.5 μm. Vacuum deposition was performed so that Thereafter, ultraviolet rays having a wavelength of 365 nm were irradiated using a high-pressure mercury lamp in a vacuum environment so that the irradiation amount was 3000 mJ / cm 2 to cure the sealant for display elements to form a resin protective film.
樹脂保護膜が形成された基板の11mm×11mmの樹脂保護膜の全体を覆うように、12mm×12mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Bを形成して表示素子(有機EL表示素子)を得た。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量をSiH4ガス10sccm、窒素ガス200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。
形成された無機材料膜Bの厚さは、約1μmであった。 (Coating with inorganic material film B)
A mask having an opening of 12 mm × 12 mm is installed so as to cover the entire 11 mm × 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed. An element (organic EL display element) was obtained.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz),
The formed inorganic material film B had a thickness of about 1 μm.
作製した有機EL表示素子をそれぞれ60℃、90%RHの条件下に100時間暴露した後、3Vの電圧を印加し、発光状態(発光及びダークスポット、画素周辺消光の有無)を目視で観察し、ダークスポットや周辺消光が無く均一に発光した場合を「○」、ダークスポットや周辺消光が認められた場合を「△」、非発光部が著しく拡大した場合を「×」として評価した。 (Light emission state of organic EL display element)
The prepared organic EL display elements were exposed for 100 hours under conditions of 60 ° C. and 90% RH, respectively, and then a voltage of 3 V was applied, and the light emission state (light emission and dark spots, presence / absence of pixel peripheral quenching) was visually observed. Evaluation was made with “◯” when the light was emitted uniformly without dark spots or peripheral quenching, “Δ” when the dark spots or peripheral quenching was observed, and “X” when the non-light emitting portion was significantly enlarged.
(アシル化合物Aの製造)
ジクロロメタン200mLとトリエチルアミン29mLとを含有する溶液に、2-フェニルチオエタノール104mmol及び塩化アセチル8.2mLを添加し、0℃で撹拌し、水洗浄した。次いで、ジクロロメタン200mLに溶解した塩化アルミニウム12gを添加した後に、ジクロロメタン360mLと塩化アルミニウム14.8gとオクタン酸クロリド18.4mLとを含む溶液を0℃で滴下した。0℃で撹拌して反応を進行させた後、反応液を水で洗浄した。次いで、ジイソプロピルエチルエーテルで粉砕し、21.6gのアシル化合物Aを得た。 (Production Example 1 (Production of compound represented by formula (7)))
(Production of acyl compound A)
To a solution containing 200 mL of dichloromethane and 29 mL of triethylamine, 104 mmol of 2-phenylthioethanol and 8.2 mL of acetyl chloride were added, stirred at 0 ° C., and washed with water. Next, 12 g of aluminum chloride dissolved in 200 mL of dichloromethane was added, and then a solution containing 360 mL of dichloromethane, 14.8 g of aluminum chloride and 18.4 mL of octanoic acid chloride was added dropwise at 0 ° C. After stirring at 0 ° C. to advance the reaction, the reaction solution was washed with water. Then, it was pulverized with diisopropylethyl ether to obtain 21.6 g of acyl compound A.
上記「(アシル化合物Aの製造)」で得られたアシル化合物A14gをテトラヒドロフラン240mLに溶解し、濃塩酸7.2mL及びイソアミルナイトライト9.2mLを室温下で加えた。52時間撹拌して反応を進行させた後、反応液を水洗浄した。次いで、シリカゲルカラムで濾過して9.2gのオキシム化合物Aを得た。 (Production of oxime compound A)
14 g of the acyl compound A obtained in the above “(production of acyl compound A)” was dissolved in 240 mL of tetrahydrofuran, and 7.2 mL of concentrated hydrochloric acid and 9.2 mL of isoamyl nitrite were added at room temperature. After stirring for 52 hours to allow the reaction to proceed, the reaction solution was washed with water. Next, the mixture was filtered through a silica gel column to obtain 9.2 g of oxime compound A.
トリエチルアミン18.8mLとテトラヒドロフラン200mLとを含有する溶液に、上記「(オキシム化合物Aの製造)」で得られたオキシム化合物A9.2gを加え、3-アリルオキシプロピオン酸クロリド9.6gを-10℃の温度下で滴下し、撹拌した。得られた反応物を、0.5mol/Lの塩酸で洗浄し、シリカゲルカラムで濾過して上記式(7)で表される化合物を得た。得られた式(7)で表される化合物の1H-NMRスペクトルを図1に示す。 (Oxime esterification of oxime compound A)
To a solution containing 18.8 mL of triethylamine and 200 mL of tetrahydrofuran, 9.2 g of the oxime compound A obtained in the above-mentioned “(Preparation of oxime compound A)” was added, and 9.6 g of 3-allyloxypropionic acid chloride was added at −10 ° C. The solution was added dropwise at a temperature of and stirred. The obtained reaction product was washed with 0.5 mol / L hydrochloric acid and filtered through a silica gel column to obtain a compound represented by the above formula (7). FIG. 1 shows the 1 H-NMR spectrum of the obtained compound represented by the formula (7).
(アシル化合物Bの製造)
ジクロロメタン450mLと塩化アルミニウム25.8gとオクタン酸クロリド31.7mLとを含有する溶液に、0℃で、ジクロロメタン250mLとフェニルチオ酢酸25gと塩化アルミニウム19.8gとを含む溶液を加えて撹拌した。水で洗浄した後、ジエチルエーテルで粉砕して38.5gのアシル化合物Bを得た。 (Production Example 2 (Production of Compound Represented by Formula (8)))
(Production of acyl compound B)
To a solution containing 450 mL of dichloromethane, 25.8 g of aluminum chloride and 31.7 mL of octanoic acid chloride, a solution containing 250 mL of dichloromethane, 25 g of phenylthioacetic acid and 19.8 g of aluminum chloride was added and stirred at 0 ° C. After washing with water, the mixture was triturated with diethyl ether to obtain 38.5 g of acyl compound B.
上記「(アシル化合物Bの製造)」で得られたアシル化合物B10gをテトラヒドロフラン100mLに溶解し、濃塩酸5.7mLに溶解したイソアミルナイトライト7.2mLを室温下で加え、12時間撹拌して反応を進行させた。次いで、水で洗浄した後、トルエンにて再結晶化して5.2gの反応物を得た。次いで、得られた反応物3.5gに18mol/Lの硫酸0.17mL及びアリルアルコール17mLを加え、室温で12時間撹拌し、反応液を得た。得られた反応液を水洗浄した後、シリカゲルカラムで濾過し、3.3gのオキシム化合物B-1を得た。 (Production of oxime compound B-1)
10 g of the acyl compound B obtained in the above “(Production of acyl compound B)” was dissolved in 100 mL of tetrahydrofuran, 7.2 mL of isoamyl nitrite dissolved in 5.7 mL of concentrated hydrochloric acid was added at room temperature, and the reaction was stirred for 12 hours. Made progress. Subsequently, after washing with water, recrystallization was performed with toluene to obtain 5.2 g of a reaction product. Next, 0.17 mL of 18 mol / L sulfuric acid and 17 mL of allyl alcohol were added to 3.5 g of the obtained reaction product, and the mixture was stirred at room temperature for 12 hours to obtain a reaction solution. The resulting reaction solution was washed with water and then filtered through a silica gel column to obtain 3.3 g of oxime compound B-1.
トリエチルアミン3.15mLとテトラヒドロフラン50mLとを含有する溶液に、-10℃にて上記「(オキシム化合物B-1の製造)」で得られたオキシム化合物B-1を3.3g加え、3-アリルオキシプロピオン酸クロリド1.7gを-10℃の温度下で滴下し撹拌した。得られた反応物を、0.5mol/Lの塩酸で洗浄し、シリカゲルカラムで濾過して上記式(8)で表される化合物を得た。得られた式(8)で表される化合物の1H-NMRスペクトルを図2に示す。 (Oxime esterification of oxime compound B-1)
To a solution containing 3.15 mL of triethylamine and 50 mL of tetrahydrofuran was added 3.3 g of oxime compound B-1 obtained in the above “(Production of oxime compound B-1)” at −10 ° C. 1.7 g of propionic acid chloride was added dropwise at a temperature of −10 ° C. and stirred. The obtained reaction product was washed with 0.5 mol / L hydrochloric acid and filtered through a silica gel column to obtain a compound represented by the above formula (8). FIG. 2 shows the 1 H-NMR spectrum of the obtained compound represented by the formula (8).
(オキシム化合物B-2及びオキシム化合物B-3の製造)
上記製造例2における「(アシル化合物Bの製造)」と同様にして得られたアシル化合物B28.3gをテトラヒドロフラン280mLに溶解し、濃塩酸16.2mL及びイソアミルナイトライト20.4mLを室温下で加え、12時間撹拌して反応を進行させ、水で洗浄した後、トルエンにて再結晶化して11.6gの反応物を得た。次いで、18mol/Lの硫酸0.57mL及び1,3-ブタンジオール55mLを加え撹拌し、反応液を得た。得られた反応液を水洗浄後、シリカゲルカラムで濾過し、オキシム化合物B-2とオキシム化合物B-3との混合物8.6gを得た。 (Production Example 3 (Production of Compound Represented by Formula (9) and Compound Represented by Formula (10)))
(Production of oxime compound B-2 and oxime compound B-3)
28.3 g of the acyl compound B obtained in the same manner as “(Production of acyl compound B)” in the above Production Example 2 was dissolved in 280 mL of tetrahydrofuran, and 16.2 mL of concentrated hydrochloric acid and 20.4 mL of isoamyl nitrite were added at room temperature. The reaction was allowed to proceed with stirring for 12 hours, washed with water, and recrystallized with toluene to obtain 11.6 g of a reaction product. Next, 0.57 mL of 18 mol / L sulfuric acid and 55 mL of 1,3-butanediol were added and stirred to obtain a reaction solution. The resulting reaction solution was washed with water and then filtered through a silica gel column to obtain 8.6 g of a mixture of oxime compound B-2 and oxime compound B-3.
トリエチルアミン9.1mLとテトラヒドロフラン170mLとを含有する溶液に、上記「(オキシム化合物B-2及びオキシム化合物B-3の製造)」で得られたオキシム化合物B-2とオキシム化合物B-3との混合物8.6gを加え、3-アリルオキシプロピオン酸クロリド4.85gを-10℃の温度下で滴下し、撹拌した。得られた反応物を水洗浄後、カラム濾過により式(9)で表される化合物と式(10)で表される化合物とを分離した。得られた上記式(9)で表される化合物及び上記式(10)で表される化合物の1H-NMRスペクトルをそれぞれ図3及び図4に示す。 (Oxime esterification of oxime compound B-2 and oxime compound B-3)
In a solution containing 9.1 mL of triethylamine and 170 mL of tetrahydrofuran, a mixture of the oxime compound B-2 and the oxime compound B-3 obtained in the above “(Production of oxime compound B-2 and oxime compound B-3)” 8.6 g was added, and 4.85 g of 3-allyloxypropionic acid chloride was added dropwise at a temperature of −10 ° C. and stirred. The obtained reaction product was washed with water, and the compound represented by formula (9) and the compound represented by formula (10) were separated by column filtration. FIGS. 3 and 4 show the 1 H-NMR spectra of the compound represented by the above formula (9) and the compound represented by the above formula (10), respectively.
(アシル化合物Cの製造)
ジクロロメタン100mLと塩化アルミニウム9.2gとプロピオン酸クロリド5.8mLとを含有する溶液に、フェニルチオ酢酸10g、塩化アルミニウム8gとジクロロメタン180mLとを含有する溶液を0℃で加え、撹拌して反応を進行させた後、水洗浄し、10.6gのアシル化合物Cを得た。 (Production Example 4 (Production of Compound Represented by Formula (11)))
(Production of acyl compound C)
To a solution containing 100 mL of dichloromethane, 9.2 g of aluminum chloride and 5.8 mL of propionic acid chloride, a solution containing 10 g of phenylthioacetic acid, 8 g of aluminum chloride and 180 mL of dichloromethane was added at 0 ° C., and the reaction was allowed to proceed by stirring. And then washed with water to obtain 10.6 g of acyl compound C.
上記「(アシル化合物Cの製造)」で得られたアシル化合物C10.6gをテトラヒドロフラン10mLに溶解し、濃塩酸5.64mL及びイソアミルナイトライト0.96mLを室温下で加え、12時間撹拌して反応を進行させた。次いで、水洗浄後、トルエンにて再結晶化して7.2gのオキシム化合物Cを得た。 (Production of oxime compound C)
10.6 g of the acyl compound C obtained in the above “(Production of acyl compound C)” is dissolved in 10 mL of tetrahydrofuran, 5.64 mL of concentrated hydrochloric acid and 0.96 mL of isoamyl nitrite are added at room temperature, and the reaction is stirred for 12 hours. Made progress. Then, after washing with water, recrystallization from toluene yielded 7.2 g of oxime compound C.
上記「(オキシム化合物Cの製造)」で得られたオキシム化合物C7.2gを、エタノール72mLと濃硫酸2.8mLとを含有する溶液に添加して溶解させた。室温で12時間撹拌後、水洗浄した後にシリカゲルカラムで濾過して7.2gのエステル化合物を得た。
得られたエステル化合物7.2gをトリエチルアミン9mLとテトラヒドロフラン180mLとを含有する溶液に加え、テトラヒドロフラン18mLに溶解した3-アリルオキシプロピオン酸クロリド4.68gを-5℃の温度下で滴下し、90分撹拌した。得られた反応物を、0.5mol/Lの塩酸で洗浄し、シリカゲルカラムで濾過して、上記式(11)で表される化合物を得た。得られた式(11)で表される化合物の1H-NMRスペクトルを図5に示す。 (Oxime esterification of oxime compound C)
7.2 g of the oxime compound C obtained in the above “(Production of oxime compound C)” was added and dissolved in a solution containing 72 mL of ethanol and 2.8 mL of concentrated sulfuric acid. The mixture was stirred at room temperature for 12 hours, washed with water, and then filtered through a silica gel column to obtain 7.2 g of an ester compound.
7.2 g of the obtained ester compound was added to a solution containing 9 mL of triethylamine and 180 mL of tetrahydrofuran, and 4.68 g of 3-allyloxypropionic acid chloride dissolved in 18 mL of tetrahydrofuran was added dropwise at a temperature of −5 ° C. for 90 minutes. Stir. The obtained reaction product was washed with 0.5 mol / L hydrochloric acid and filtered through a silica gel column to obtain a compound represented by the above formula (11). FIG. 5 shows the 1 H-NMR spectrum of the obtained compound represented by the formula (11).
表2に記載された配合比に従い、各材料を、攪拌機(新東科学社製、「スリーワンモーター HEIDON BLH300」)を用いて70℃にて3時間加熱混合することにより、表示素子用封止剤を調製した。 (Examples 8 to 14, Comparative Examples 2 and 3)
According to the compounding ratio described in Table 2, each material was heated and mixed at 70 ° C. for 3 hours using a stirrer (manufactured by Shinto Kagaku Co., Ltd., “Three-One Motor HEIDON BLH300”) for 3 hours. Was prepared.
実施例8~14及び比較例2、3で得られた各表示素子用封止剤について以下の評価を行った。結果を表2に示した。 <Evaluation>
The following evaluations were performed on the sealants for display elements obtained in Examples 8 to 14 and Comparative Examples 2 and 3. The results are shown in Table 2.
実施例8~14及び比較例2、3で得られた各表示素子用封止剤をガラス基板上に塗工し、波長365nmのLEDランプを用いて、積算光量が1000mJ/cm2となるように光を照射した。その後、FT-IRを用いた分析方法により、アリル基の反応率を測定した。アリル基の反応率が70%を超えた場合を「○」、50~70%であった場合を「△」、50%未満であった場合を「×」として光硬化性を評価した。 (1) Photocurability Each sealant for display elements obtained in Examples 8 to 14 and Comparative Examples 2 and 3 was coated on a glass substrate, and the integrated light quantity was 1000 mJ using an LED lamp with a wavelength of 365 nm. Light was irradiated so as to be / cm 2 . Thereafter, the reaction rate of the allyl group was measured by an analysis method using FT-IR. Photocurability was evaluated by assuming that the reaction rate of the allyl group exceeded 70% as “◯”, the case of 50 to 70% as “Δ”, and the case of less than 50% as “X”.
実施例8~14及び比較例2、3で得られた各表示素子用封止剤を、PET樹脂フィルムに挟み、2000mJ/cm2の紫外線を照射して、厚さ100μmの透過率測定用サンプルを作製した。得られた透過率測定用サンプルについて、分光光度計(日立製作所社製、「U-3000」、条件300~800nm)を用いて、波長380~780nmにおける光線透過率を測定した。 (2) Transparency (transmittance) of the cured product
Samples for measuring transmittance having a thickness of 100 μm are obtained by sandwiching the sealants for display elements obtained in Examples 8 to 14 and Comparative Examples 2 and 3 between PET resin films and irradiating with 2000 mJ / cm 2 ultraviolet rays. Was made. The obtained transmittance measurement sample was measured for light transmittance at a wavelength of 380 to 780 nm using a spectrophotometer (manufactured by Hitachi, Ltd., “U-3000”, conditions 300 to 800 nm).
実施例8~14及び比較例2、3で得られた各表示素子用封止剤を、バーコーターを用いて塗工後の厚さが100μmとなるように塗工し、超高圧水銀灯を用いて2000mJ/cm2の紫外線を照射してフィルムを形成した。得られたフィルムを熱分析装置(Seiko Instruments社製、「TG/DTA6200」)を用いて、昇温速度10℃/minで150℃まで加熱したときの重量減少率を測定し、これをアウトガス発生量とした。 (3) Outgas generation amount Each sealant for display element obtained in Examples 8 to 14 and Comparative Examples 2 and 3 was coated using a bar coater so that the thickness after coating was 100 μm. A film was formed by irradiating ultraviolet rays of 2000 mJ / cm 2 using an ultrahigh pressure mercury lamp. Using a thermal analyzer (“TG / DTA6200” manufactured by Seiko Instruments, Inc.), the resulting film was measured for weight loss rate when heated to 150 ° C. at a rate of temperature increase of 10 ° C./min, and this was generated as outgas. The amount.
(4-1)液晶表示素子の表示性能
(液晶表示素子の作製)
厚さ1000ÅのITO電極を表面に成膜した後、更にスピンコートにて厚さ800Åの配向膜を表面に塗布したガラス基板(長さ25mm、幅25mm、厚さ0.7mm)を2枚用意し、一方の基板に熱硬化性エポキシ樹脂(周辺シール剤)を用いて、液晶注入口部を設けるようにしたパターンの印刷をスクリーン印刷にて行った。次に、パターンの印刷を行った基板を80℃で3分間保持することにより予備乾燥と基板への周辺シール剤の融着とを行った後、室温に戻した。次いで、もう一方の基板に5μmのスペーサーを散布した後、それぞれの基板を貼り合わせ、130℃に加熱した熱プレスで2時間の圧着を行って周辺シール剤を硬化させ、空のセルを得た。得られた空のセルを真空吸引した後、注入口より液晶(メルク社製、「ZLI-4792」)を注入し、注入口を実施例8~14及び比較例2、3で得られた各表示素子用封止剤を用いて封止し、高圧水銀灯を用いて3000mJ/cm2の紫外線を照射して封止剤を硬化させた。その後、120℃で1時間液晶のアニールを行い、液晶表示素子を作製した。 (4) Display performance of display element (4-1) Display performance of liquid crystal display element (production of liquid crystal display element)
Prepare two glass substrates (length 25mm, width 25mm, thickness 0.7mm) on which an ITO electrode with a thickness of 1000mm is formed on the surface and then an orientation film with a thickness of 800mm is applied on the surface by spin coating. Then, using a thermosetting epoxy resin (peripheral sealant) on one substrate, printing of a pattern in which a liquid crystal injection port was provided was performed by screen printing. Next, the substrate on which the pattern was printed was kept at 80 ° C. for 3 minutes to perform preliminary drying and fusion of the peripheral sealant to the substrate, and then returned to room temperature. Next, after spraying a spacer of 5 μm on the other substrate, each substrate was bonded, and the peripheral sealant was cured by hot pressing heated to 130 ° C. for 2 hours to obtain an empty cell. . The obtained empty cell was vacuumed, and liquid crystal (“ZLI-4792” manufactured by Merck & Co., Inc.) was injected from the injection port. The injection port was obtained in each of Examples 8 to 14 and Comparative Examples 2 and 3. Sealing was performed using a sealant for display elements, and the sealant was cured by irradiating with 3000 mJ / cm 2 ultraviolet rays using a high-pressure mercury lamp. Thereafter, the liquid crystal was annealed at 120 ° C. for 1 hour to produce a liquid crystal display element.
得られた液晶表示素子を、AC3.5Vの電圧にて中間調の表示状態で駆動させ、注入口近傍の液晶の配向乱れを偏光顕微鏡で観察した。配向乱れが確認されなかった場合を「○」、1mm未満の配向乱れが確認された場合を「△」、1mm以上のはっきりとした配向乱れ(濃い色むら)があった場合を「×」として液晶表示素子の表示性能を評価した。 (Liquid crystal orientation disorder)
The obtained liquid crystal display element was driven in a halftone display state at a voltage of AC 3.5 V, and the alignment disorder of the liquid crystal near the inlet was observed with a polarizing microscope. The case where no alignment disorder is confirmed is “◯”, the case where alignment disorder less than 1 mm is confirmed is “Δ”, and the case where there is a clear alignment disorder (dark color unevenness) of 1 mm or more is “X”. The display performance of the liquid crystal display element was evaluated.
(有機発光材料層を含む積層体が配置された基板の作製)
ガラス基板(長さ25mm、幅25mm、厚さ0.7mm)にITO電極を1000Åの厚さで成膜したものを基板とした。上記基板をアセトン、アルカリ水溶液、イオン交換水、イソプロピルアルコールにてそれぞれ15分間超音波洗浄した後、煮沸させたイソプロピルアルコールにて10分間洗浄し、更に、UV-オゾンクリーナ(日本レーザー電子社製、「NL-UV253」)にて直前処理を行った。
次に、この基板を真空蒸着装置の基板フォルダに固定し、素焼きの坩堝にN,N’-ジ(1-ナフチル)-N,N’-ジフェニルベンジジン(α-NPD)を200mg、他の異なる素焼き坩堝にトリス(8-ヒドロキシキノリラ)アルミニウム(Alq3)を200mg入れ、真空チャンバー内を、1×10-4Paまで減圧した。その後、α-NPDの入った坩堝を加熱し、α-NPDを蒸着速度15Å/sで基板に堆積させ、膜厚600Åの正孔輸送層を成膜した。次いで、Alq3の入った坩堝を加熱し、15Å/sの蒸着速度で膜厚600Åの有機発光材料層を成膜した。その後、正孔輸送層及び有機発光材料層が形成された基板を別の真空蒸着装置に移し、この真空蒸着装置内のタングステン製抵抗加熱ボートにフッ化リチウム200mgを、別のタングステン製ボートにアルミニウム線1.0gを入れた。その後、真空蒸着装置の蒸着器内を2×10-4Paまで減圧してフッ化リチウムを0.2Å/sの蒸着速度で5Å成膜した後、アルミニウムを20Å/sの速度で1000Å成膜した。窒素により蒸着器内を常圧に戻し、10mm×10mmの有機発光材料層を含む積層体が配置された基板を取り出した。 (4-2) Display performance of organic EL display device (production of a substrate on which a laminate including an organic light emitting material layer is disposed)
A glass substrate (
Next, this substrate is fixed to the substrate folder of the vacuum deposition apparatus, and 200 mg of N, N′-di (1-naphthyl) -N, N′-diphenylbenzidine (α-NPD) is put into an unglazed crucible and other different types. 200 mg of tris (8-hydroxyquinola) aluminum (Alq 3 ) was put in an unglazed crucible, and the pressure in the vacuum chamber was reduced to 1 × 10 −4 Pa. Thereafter, the crucible containing α-NPD was heated, and α-NPD was deposited on the substrate at a deposition rate of 15 s / s to form a 600 正 孔 hole transport layer. Next, the crucible containing Alq 3 was heated to form an organic light emitting material layer having a thickness of 600 で at a deposition rate of 15 Å / s. Thereafter, the substrate on which the hole transport layer and the organic light emitting material layer are formed is transferred to another vacuum vapor deposition apparatus, and 200 mg of lithium fluoride is added to a tungsten resistance heating boat in the vacuum vapor deposition apparatus, and aluminum is added to another tungsten boat. 1.0 g of wire was added. After that, the inside of the vapor deposition unit of the vacuum vapor deposition apparatus is depressurized to 2 × 10 −4 Pa to form a lithium fluoride film with a thickness of 5 mm at a deposition rate of 0.2 kg / s, and then aluminum with a film thickness of 1000 mm at a rate of 20 kg / s. did. The inside of the vapor deposition apparatus was returned to normal pressure with nitrogen, and the substrate on which the laminate including the organic light emitting material layer of 10 mm × 10 mm was arranged was taken out.
得られた有機発光材料層を含む積層体が配置された基板の、該積層体の全体を覆うように、13mm×13mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Aを形成した。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量を10sccm及び200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。
形成されたシリコンナイトライドの無機材料膜Aの厚さは、約0.2μmであった。 (Coating with inorganic material film A)
A mask having an opening of 13 mm × 13 mm is installed so as to cover the entire laminate of the substrate on which the laminate including the obtained organic light emitting material layer is disposed, and the inorganic material film A is formed by plasma CVD. Formed.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates are 10 sccm and 200 sccm, RF power is 10 W (frequency: 2.45 GHz), chamber temperature is 100 ° C., and chamber pressure is 0. The test was performed at 9 Torr.
The thickness of the formed inorganic material film A of silicon nitride was about 0.2 μm.
真空装置内に、無機材料膜Aで被覆された積層体が配置された基板を設置し、真空装置の中に設置された加熱ボートに実施例8~14及び比較例2、3で得られた各表示素子用封止剤を0.5g入れ、10Paに減圧して、積層体を含む11mm×11mmの四角形の部分に、表示素子用封止剤を200℃にて加熱し、厚さが0.5μmになるように真空蒸着を行った。その後、真空環境下で高圧水銀灯を用いて波長365nmの紫外線を照射量が3000mJ/cm2となるように照射して、表示素子用封止剤を硬化させて樹脂保護膜を形成した。 (Formation of resin protective film)
The substrate on which the laminate coated with the inorganic material film A was placed in the vacuum device, and obtained in Examples 8 to 14 and Comparative Examples 2 and 3 on the heating boat installed in the vacuum device. 0.5 g of each sealant for display element is put in, reduced in pressure to 10 Pa, and the sealant for display element is heated at 200 ° C. to a 11 mm × 11 mm square part including the laminate, and the thickness is 0 Vacuum deposition was performed to a thickness of 5 μm. Thereafter, ultraviolet rays having a wavelength of 365 nm were irradiated using a high-pressure mercury lamp in a vacuum environment so that the irradiation amount was 3000 mJ / cm 2 to cure the sealant for display elements to form a resin protective film.
樹脂保護膜が形成された基板の11mm×11mmの樹脂保護膜の全体を覆うように、12mm×12mmの開口部を有するマスクを設置し、プラズマCVD法にて無機材料膜Bを形成して表示素子(有機EL表示素子)を得た。
プラズマCVD法は、原料ガスとしてSiH4ガス及び窒素ガスを用い、各々の流量をSiH4ガス10sccm、窒素ガス200sccmとし、RFパワーを10W(周波数2.45GHz)、チャンバー内温度を100℃、チャンバー内圧力を0.9Torrとする条件で行った。
形成されたシリコンナイトライドの無機材料膜Bの厚さは、約1μmであった。 (Coating with inorganic material film B)
A mask having an opening of 12 mm × 12 mm is installed so as to cover the entire 11 mm × 11 mm resin protective film of the substrate on which the resin protective film is formed, and an inorganic material film B is formed by plasma CVD and displayed. An element (organic EL display element) was obtained.
In the plasma CVD method, SiH 4 gas and nitrogen gas are used as source gases, the flow rates of each are SiH 4 gas 10 sccm, nitrogen gas 200 sccm, RF power 10 W (frequency 2.45 GHz),
The thickness of the formed inorganic material film B of silicon nitride was about 1 μm.
作製した有機EL表示素子をそれぞれ60℃、90%RHの条件下に100時間暴露した後、3Vの電圧を印加し、発光状態(発光及びダークスポット、画素周辺消光の有無)を目視で観察し、ダークスポットや周辺消光が無く均一に発光した場合を「○」、ダークスポットや周辺消光が認められた場合を「△」、非発光部が著しく拡大した場合を「×」として有機EL表示素子の表示性能を評価した。 (Light emission state of organic EL display element)
The prepared organic EL display elements were exposed for 100 hours under conditions of 60 ° C. and 90% RH, respectively, and then a voltage of 3 V was applied, and the light emission state (light emission and dark spots, presence / absence of pixel peripheral quenching) was visually observed. Organic light emitting diode display element where “○” indicates that there is no dark spot or peripheral quenching, “◯” indicates that dark spot or peripheral quenching is observed, and “X” indicates that the non-light emitting portion is significantly enlarged. The display performance of was evaluated.
Claims (9)
- 1分子中に2個以上のチオール基を有するポリチオールモノマー、1分子中に2個以上の炭素-炭素二重結合を有するポリエンモノマー、及び、ラジカル重合開始剤を含有し、
前記ラジカル重合開始剤は、光照射又は加熱によりラジカルを発生する官能基と、反応性官能基とを有する化合物である
ことを特徴とする表示素子用封止剤。 A polythiol monomer having two or more thiol groups in one molecule, a polyene monomer having two or more carbon-carbon double bonds in one molecule, and a radical polymerization initiator,
The sealing agent for a display element, wherein the radical polymerization initiator is a compound having a functional group that generates radicals by light irradiation or heating and a reactive functional group. - ポリチオールモノマーは、1分子中に3個以上のチオール基を有するモノマーを含有することを特徴とする請求項1記載の表示素子用封止剤。 The polythiol monomer contains a monomer having three or more thiol groups in one molecule, and the sealant for display elements according to claim 1.
- ポリエンモノマーは、1分子中に3個以上の炭素-炭素二重結合を有するモノマーを含有することを特徴とする請求項1又は2記載の表示素子用封止剤。 3. The sealant for a display element according to claim 1, wherein the polyene monomer contains a monomer having 3 or more carbon-carbon double bonds in one molecule.
- ポリエンオリゴマーを含有することを特徴とする請求項1、2又は3記載の表示素子用封止剤。 The sealing agent for display elements according to claim 1, 2 or 3, characterized by containing a polyene oligomer.
- ポリチオールモノマーとポリエンモノマーとの反応により形成されるチオエーテルオリゴマーを含有する請求項1、2、3又は4記載の表示素子用封止剤。 The sealing agent for display elements of Claim 1, 2, 3, or 4 containing the thioether oligomer formed by reaction of a polythiol monomer and a polyene monomer.
- チオエーテルオリゴマーの重量平均分子量が500~4万であることを特徴とする請求項5記載の表示素子用封止剤。 6. The sealant for a display element according to claim 5, wherein the thioether oligomer has a weight average molecular weight of 500 to 40,000.
- ラジカル重合開始剤の有する反応性官能基は、チオール基及び/又は炭素-炭素二重結合であることを特徴とする請求項1、2、3、4、5又は6記載の表示素子用封止剤。 7. The sealing for a display device according to claim 1, wherein the reactive functional group of the radical polymerization initiator is a thiol group and / or a carbon-carbon double bond. Agent.
- ラジカル重合開始剤は、反応性官能基を1分子中に2個以上有することを特徴とする請求項1、2、3、4、5、6又は7記載の表示素子用封止剤。 The sealing agent for display elements according to claim 1, 2, 3, 4, 5, 6 or 7, wherein the radical polymerization initiator has two or more reactive functional groups in one molecule.
- 下記式(3)で表される化合物であることを特徴とするオキシムエステル開始剤。
R4及びR7は、それぞれ独立して、反応性官能基、水素結合性官能基を有する基、水素原子、炭素数3~20のカルボアルコキシアルキル基(1個以上の酸素原子により中断、及び/又は、1個以上のヒドロキシル基により置換されていてもよい)、ハロゲン原子、炭素数1~12のアルキル基、シクロペンチル基、シクロヘキシル基、フェニル基(-OR10基、-SR11基、及び、-NR12R13基からなる群より選択される少なくとも1種により置換されていてもよい)、ベンジル基、ベンゾイル基、炭素数2~12のアルカノイル基、炭素数2~12のアルコキシカルボニル基(1個以上の酸素原子により中断、及び/又は、1個以上のヒドロキシル基により置換されていてもよい)、フェノキシカルボニル基、-OR10基、-SR11基、-SOR11基、-SO2R11基、或いは、-NR12R13基(ここで、-OR10基、-SR11基、及び、-NR12R13基は、フェニル環の有する置換基若しくはフェニル環の炭素原子の一つと、R10、R11、R12、及び/若しくは、R13を介して5員環又は6員環を形成していてもよい)である。ただし、R4及びR7の少なくとも一方は、反応性官能基である。
R5、R6、R8、及び、R9は、それぞれ独立して、水素原子、ハロゲン原子、炭素数1~12のアルキル基、シクロペンチル基、シクロヘキシル基、フェニル基(-OR10基、-SR11基、若しくは、-NR12R13基により置換されていてもよい)、ベンジル基、ベンゾイル基、炭素数2~12のアルカノイル基、炭素数2~12のアルコキシカルボニル基(1個以上の酸素原子により中断、及び/若しくは、1個以上のヒドロキシル基により置換されていてもよい)、フェノキシカルボニル基、-OR10基、-SR11基、-SOR11基、-SO2R11基、又は、-NR12R13基であり、-OR10基、-SR11基、及び、-NR12R13基は、フェニル環の有する置換基又はフェニル環の炭素原子の一つと、R10、R11、R12、及び/又は、R13を介して5員環又は6員環を形成していてもよい。
R10は、水素原子、炭素数1~12のアルキル基、炭素数2~6のアルキル基(-OH基、-SH基、-CN基、炭素数1~4のアルコキシ基、炭素数3~6のアルケンオキシ基、-OCH2CH2CN基、炭素数4~7の-OCH2CH2(CO)O-アルキル基、炭素数2~5の-O(CO)-アルキル基、-O(CO)-フェニル基、-(CO)OH基、若しくは、炭素数2~5の-(CO)O-アルキル基で置換されている)、炭素数2~6のアルキル基(1個以上の酸素原子により中断されている)、-(CH2CH2O)nH基、炭素数2~8のアルカノイル基、炭素数3~12のアルケニル基、炭素数3~6のアルケノイル基、シクロヘキシル基、フェニル基(ハロゲン原子、炭素数1~12のアルキル基、若しくは、炭素数1~4のアルコキシ基で置換されていてもよい)、炭素数7~9のフェニルアルキル基、-Si(炭素数1~8のアルキル)r(フェニル)3-r基、又は、下記式(4)で表される基のいずれかである。nは、1~20であり、rは、1~3である。
R11は、水素原子、炭素数1~12のアルキル基、炭素数3~12のアルケニル基、シクロヘキシル基、炭素数2~6のアルキル基(-OH基、-SH基、-CN基、炭素数1~4のアルコキシ基、炭素数3~6のアルケンオキシ基、-OCH2CH2CN基、炭素数4~7の-OCH2CH2(CO)O-アルキル基、炭素数2~5の-O(CO)-アルキル基、-O(CO)-フェニル基、-(CO)OH基、若しくは、炭素数2~5の-(CO)O-アルキル基で置換されている)、炭素数2~12のアルキル基(1個以上の酸素原子若しくは硫黄原子により中断されている)、フェニル基(ハロゲン原子、炭素数1~12のアルキル基、若しくは、炭素数1~4のアルコキシ基で置換されていてもよい)、炭素数7~9のフェニルアルキル基、又は、下記式(5)で表される基のいずれかである。
R12及びR13は、それぞれ独立して、水素原子、炭素数1~12のアルキル基、炭素数2~4のヒドロキシアルキル基、炭素数2~10のアルコキシアルキル基、炭素数3~5のアルケニル基、炭素数5~12のシクロアルキル基、炭素数7~9のフェニルアルキル基、フェニル基(炭素数1~12のアルキル基若しくは炭素数1~4のアルコキシ基により置換されている)、炭素数2~3のアルカノイル基、炭素数3~6のアルケノイル基、ベンゾイル基、或いは、R12及びR13が1つの基となった炭素数2~6のアルキレン基(酸素原子若しくは-NR10-基により中断、及び/又は、ヒドロキシル基、炭素数1~4のアルコキシ基、炭素数2~4のアルカノイルオキシ基、若しくは、ベンゾイルオキシ基で置換されていてもよい)である。R12が水素原子である場合、R13は、下記式(6)で表される基であってもよい。
R 4 and R 7 are each independently a reactive functional group, a group having a hydrogen bonding functional group, a hydrogen atom, a carboalkoxyalkyl group having 3 to 20 carbon atoms (interrupted by one or more oxygen atoms, and / Or optionally substituted with one or more hydroxyl groups), a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, —SR 11 group, and A benzyl group, a benzoyl group, an alkanoyl group having 2 to 12 carbon atoms, or an alkoxycarbonyl group having 2 to 12 carbon atoms, which may be substituted with at least one selected from the group consisting of —NR 12 R 13 groups) (interrupted by one or more oxygen atoms, and / or may be substituted by one or more hydroxyl groups), a phenoxycarbonyl group, -OR 0 group, -SR 11 group, -SOR 11 group, -SO 2 R 11 group, or, -NR 12 R 13 group (herein, 10 group -OR, -SR 11 groups, and, -NR 12 R 13 group May form a 5-membered or 6-membered ring with R 10 , R 11 , R 12 , and / or R 13 with one of the substituents of the phenyl ring or the carbon atom of the phenyl ring. ). However, at least one of R 4 and R 7 is a reactive functional group.
R 5 , R 6 , R 8 , and R 9 are each independently a hydrogen atom, a halogen atom, an alkyl group having 1 to 12 carbon atoms, a cyclopentyl group, a cyclohexyl group, a phenyl group (—OR 10 group, — SR 11 group, or optionally substituted by —NR 12 R 13 group), benzyl group, benzoyl group, alkanoyl group having 2 to 12 carbon atoms, alkoxycarbonyl group having 2 to 12 carbon atoms (one or more Optionally interrupted by an oxygen atom and / or substituted by one or more hydroxyl groups), a phenoxycarbonyl group, a —OR 10 group, a —SR 11 group, a —SOR 11 group, a —SO 2 R 11 group, or a -NR 12 R 13 groups, 10 groups -OR, -SR 11 groups, and, -NR 12 R 13 groups, the substituent or the phenyl ring with a phenyl ring And one atom, R 10, R 11, R 12, and / or may form a 5- or 6-membered ring via the R 13.
R 10 is a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, alkoxy group having 1 to 4 carbon atoms, 3 to 3 carbon atoms). 6 alkeneoxy groups, —OCH 2 CH 2 CN groups, —OCH 2 CH 2 (CO) O-alkyl groups having 4 to 7 carbon atoms, —O (CO) -alkyl groups having 2 to 5 carbon atoms, —O (CO) -phenyl group,-(CO) OH group, or a-(CO) O-alkyl group having 2 to 5 carbon atoms), an alkyl group having 2 to 6 carbon atoms (one or more Interrupted by an oxygen atom), — (CH 2 CH 2 O) n H group, alkanoyl group having 2 to 8 carbon atoms, alkenyl group having 3 to 12 carbon atoms, alkenoyl group having 3 to 6 carbon atoms, cyclohexyl group , Phenyl group (halogen atom, alkyl group having 1 to 12 carbon atoms, May be substituted with an alkoxy group having 1 to 4 carbon atoms), a phenylalkyl group having 7 to 9 carbon atoms, -Si (alkyl having 1 to 8 carbon atoms) r (phenyl) 3-r groups, or Or any one of groups represented by the following formula (4). n is 1 to 20, and r is 1 to 3.
R 11 represents a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, an alkenyl group having 3 to 12 carbon atoms, a cyclohexyl group, an alkyl group having 2 to 6 carbon atoms (—OH group, —SH group, —CN group, carbon C 1-4 alkoxy group, C 3-6 alkeneoxy group, —OCH 2 CH 2 CN group, C 4-7 —OCH 2 CH 2 (CO) O-alkyl group, C 2-5 -O (CO) -alkyl group, -O (CO) -phenyl group,-(CO) OH group, or-(CO) O-alkyl group having 2 to 5 carbon atoms), carbon An alkyl group of 2 to 12 (interrupted by one or more oxygen or sulfur atoms), a phenyl group (a halogen atom, an alkyl group of 1 to 12 carbon atoms, or an alkoxy group of 1 to 4 carbon atoms) Which may be substituted), Niruarukiru group, or any one of groups represented by the following formula (5).
R 12 and R 13 are each independently a hydrogen atom, an alkyl group having 1 to 12 carbon atoms, a hydroxyalkyl group having 2 to 4 carbon atoms, an alkoxyalkyl group having 2 to 10 carbon atoms, or an alkyl group having 3 to 5 carbon atoms. An alkenyl group, a cycloalkyl group having 5 to 12 carbon atoms, a phenylalkyl group having 7 to 9 carbon atoms, a phenyl group (substituted by an alkyl group having 1 to 12 carbon atoms or an alkoxy group having 1 to 4 carbon atoms), An alkanoyl group having 2 to 3 carbon atoms, an alkenoyl group having 3 to 6 carbon atoms, a benzoyl group, or an alkylene group having 2 to 6 carbon atoms in which R 12 and R 13 form one group (oxygen atom or —NR 10 -Interrupted by a group and / or substituted with a hydroxyl group, an alkoxy group having 1 to 4 carbon atoms, an alkanoyloxy group having 2 to 4 carbon atoms, or a benzoyloxy group It is also may). When R 12 is a hydrogen atom, R 13 may be a group represented by the following formula (6).
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017040763A (en) * | 2015-08-19 | 2017-02-23 | 積水化学工業株式会社 | Sealant for display element |
JP2017044969A (en) * | 2015-08-28 | 2017-03-02 | 積水化学工業株式会社 | Sealing agent for display element |
WO2022048699A1 (en) * | 2019-12-12 | 2022-03-10 | Heliatek Gmbh | Coating for an optoelectronic component, method for producing such a coating, and optoelectronic component comprising such a coating |
WO2024090339A1 (en) * | 2022-10-25 | 2024-05-02 | デンカ株式会社 | Photocurable resin composition for display device, and display device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002285156A (en) * | 2001-03-26 | 2002-10-03 | Sharp Corp | Liquid crystal display cell, agent for sealing liquid crystal injection opening and liquid crystal composition |
JP2004107450A (en) * | 2002-09-17 | 2004-04-08 | Sekisui Chem Co Ltd | Photocurable resin for sealing agent, liquid-crystal display element or organic electroluminescent element |
JP2005015758A (en) * | 2003-06-04 | 2005-01-20 | Sekisui Chem Co Ltd | Curable resin composition, sealing agent for liquid crystal display element, encapsulating agent for liquid crystal display element, vertical conduction material for liquid crystal display element, and liquid crystal display element |
WO2006027982A1 (en) * | 2004-09-06 | 2006-03-16 | Nippon Kayaku Kabushiki Kaisha | Liquid crystal sealing material and liquid crystal display cell using same |
JP2007065349A (en) * | 2005-08-31 | 2007-03-15 | Sekisui Chem Co Ltd | Liquid crystal injection hole sealing agent and liquid crystal cell |
JP2007310317A (en) * | 2006-05-22 | 2007-11-29 | Fujifilm Corp | Photopolymerization composition, color filter, and manufacturing method therefor |
WO2012132558A1 (en) * | 2011-03-25 | 2012-10-04 | 株式会社Adeka | Oxime ester compound and photoinitiator containing said compound |
JP5337293B1 (en) * | 2012-11-13 | 2013-11-06 | 積水化学工業株式会社 | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
-
2014
- 2014-08-20 WO PCT/JP2014/071714 patent/WO2015029846A1/en active Application Filing
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Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002285156A (en) * | 2001-03-26 | 2002-10-03 | Sharp Corp | Liquid crystal display cell, agent for sealing liquid crystal injection opening and liquid crystal composition |
JP2004107450A (en) * | 2002-09-17 | 2004-04-08 | Sekisui Chem Co Ltd | Photocurable resin for sealing agent, liquid-crystal display element or organic electroluminescent element |
JP2005015758A (en) * | 2003-06-04 | 2005-01-20 | Sekisui Chem Co Ltd | Curable resin composition, sealing agent for liquid crystal display element, encapsulating agent for liquid crystal display element, vertical conduction material for liquid crystal display element, and liquid crystal display element |
WO2006027982A1 (en) * | 2004-09-06 | 2006-03-16 | Nippon Kayaku Kabushiki Kaisha | Liquid crystal sealing material and liquid crystal display cell using same |
JP2007065349A (en) * | 2005-08-31 | 2007-03-15 | Sekisui Chem Co Ltd | Liquid crystal injection hole sealing agent and liquid crystal cell |
JP2007310317A (en) * | 2006-05-22 | 2007-11-29 | Fujifilm Corp | Photopolymerization composition, color filter, and manufacturing method therefor |
WO2012132558A1 (en) * | 2011-03-25 | 2012-10-04 | 株式会社Adeka | Oxime ester compound and photoinitiator containing said compound |
JP5337293B1 (en) * | 2012-11-13 | 2013-11-06 | 積水化学工業株式会社 | Sealant for liquid crystal display element, vertical conduction material, and liquid crystal display element |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017040763A (en) * | 2015-08-19 | 2017-02-23 | 積水化学工業株式会社 | Sealant for display element |
JP2017044969A (en) * | 2015-08-28 | 2017-03-02 | 積水化学工業株式会社 | Sealing agent for display element |
WO2022048699A1 (en) * | 2019-12-12 | 2022-03-10 | Heliatek Gmbh | Coating for an optoelectronic component, method for producing such a coating, and optoelectronic component comprising such a coating |
WO2024090339A1 (en) * | 2022-10-25 | 2024-05-02 | デンカ株式会社 | Photocurable resin composition for display device, and display device |
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