WO2014020806A1 - Cooling structure and power converter - Google Patents

Cooling structure and power converter Download PDF

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Publication number
WO2014020806A1
WO2014020806A1 PCT/JP2013/003049 JP2013003049W WO2014020806A1 WO 2014020806 A1 WO2014020806 A1 WO 2014020806A1 JP 2013003049 W JP2013003049 W JP 2013003049W WO 2014020806 A1 WO2014020806 A1 WO 2014020806A1
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WO
WIPO (PCT)
Prior art keywords
heat
cooling body
heat transfer
cooling
power conversion
Prior art date
Application number
PCT/JP2013/003049
Other languages
French (fr)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201380024912.6A priority Critical patent/CN104303412A/en
Priority to JP2014527954A priority patent/JPWO2014020806A1/en
Publication of WO2014020806A1 publication Critical patent/WO2014020806A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is joined and cooled on the water cooling jacket.
  • a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the heat generated by the heating element such as the control circuit board is efficiently cooled by water by sandwiching the end of the metal base plate between the power module and the water cooling jacket without interposing the housing.
  • a structure for radiating heat to the jacket is conceivable.
  • a base end storage portion is formed on the outer peripheral side of the joint surface of the power module and the water cooling jacket to store the base end portion while also positioning the end portion of the metal base.
  • the power converter before assembly is transported to an assembly plant or the like by separating a power module unit in which a control circuit board, a heat radiating member and a metal base plate are assembled into a power module, and a water cooling jacket.
  • the metal base plate may be greatly swung and deformed by vibration during transportation.
  • An object of the present invention is to provide a power converter capable of reducing the processing cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.
  • a cooling structure includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element. And a heat transfer plate for transferring the heat of the heat generating body to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the first heat generating body.
  • the first heating element is easy to handle at the time of processing even when assembled to the processing machine as compared with the cooling body that is a large and heavy object, so that the processing cost can be reduced. Can be planned. Then, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
  • the power conversion device includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module. And a heat transfer plate for transferring heat of the mounting board to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the heat dissipation member.
  • the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can.
  • the unitized heat dissipation member stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • a heat transfer support metal plate that contacts the cooling body so as to dissipate the heat generated without passing through the casing, and a storage portion is formed on the outer peripheral side of the joining surface of the heat radiating member, The metal plate for heat transfer support was stored in a storage portion.
  • the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can. And even if the heat dissipation member, the mounting board, and the heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the housing portion in the housing portion. Therefore, deformation of the heat transfer supporting metal plate due to external force is prevented.
  • the storage portion is a stepped surface formed on the outer peripheral side of the joint surface of the heat dissipation member, and the surface exposed from the storage portion of the conductive support metal plate;
  • the surface of the heat radiating member is flush with the joint surface.
  • the surface exposed from the storage portion of the conductive support metal plate flush with each other and the joint surface of the heat radiating member abut against the cooling body. The heat transferred to the metal plate is efficiently radiated to the cooling body.
  • the joint surface of the cooling body is in close contact with the surface of the conductive support metal plate exposed from the storage portion.
  • the adhesion between the conductive support metal plate and the cooling body is enhanced, so that the heat transferred from the mounting substrate to the heat transfer support metal plate is more efficiently transferred to the cooling body. Heat is dissipated.
  • the heat dissipation member is cooled by direct cooling to the cooling body, and a watertight sealing portion is provided between the heat dissipation member and the cooling body.
  • the heat transferred from the mounting substrate to the heat transfer supporting metal plate is efficiently radiated by the direct cooling heat radiating member and the cooling body.
  • the power converter device which concerns on 1 aspect of this invention WHEREIN: While the said heat radiating member was cooled by the said cooling body by indirect cooling, the heat-transfer member was arrange
  • the heat transfer member is grease having good thermal conductivity.
  • the heat transfer member made of grease having good heat conductivity increases the heat conductivity of the heat radiating member and the cooling body, so heat transfer from the mounting board to the heat transfer supporting metal plate. The generated heat is efficiently radiated by the heat radiating member and the cooling body.
  • the first heating element is easy to handle at the time of processing even when assembled to a processing machine, compared with a cooling body that is a large and heavy object. Can be planned. Further, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, the deformation strength of the heat transfer plate can be improved.
  • the heat dissipation member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost is reduced. be able to. Even if the heat dissipation member, mounting board and heat transfer plate, or heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the storage section. Since the heat transfer plate or the heat transfer support metal plate is accommodated, the deformation strength of the heat transfer plate or the heat transfer support metal plate by an external force can be improved.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • a cooling water supply source not shown
  • an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3.
  • a square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat dissipation member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a.
  • a direct cooling method in which a large number of cooling fins 17a are immersed in water is adopted.
  • the stepped portion 18 serves as a storage portion for storing the cooling body contact plate portions 32 c and 33 of the heat transfer supporting metal plates 32 and 33, which will be described later, on the outer periphery of the left and right lower surfaces of the heat dissipation member 13. Is formed.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25 a of the joint screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24, and this male screw portion 25 a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the cooling body contact plate portion 32 c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33 c of the heat transfer support metal plate 33 are provided on the left side and the right side of the heat dissipation member 13 described above. It is housed in a step 18 formed on the outer periphery of the lower surface.
  • the cooling body contact plate portions 32c and 33c housed in the stepped portion 18 have their lower surfaces 32c2 and 33c2 flush with the lower surface 13a as the joining surface of the heat dissipation member 13 with which the O-ring 7 contacts.
  • the distal end portion of the cooling body contact plate portion 33 c is in contact with the rising wall 18 a on the innermost peripheral side of the step portion 18.
  • the tip of the cooling body contact plate portion 32c is also in contact with the rising wall 18a on the innermost peripheral side of the step portion 18.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat dissipation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3. .
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 housed in the stepped portion 18 of the heat radiating member 13 are in close contact with the upper surface 3c as the joint surface of the cooling body 3.
  • the contact plate portions 32 c and 33 c are fixed between the heat radiating member 13 and the cooling body 3.
  • the O-ring 7 attached to the circumferential groove 6 around the immersion part 5 of the cooling body 3 is crushed by the lower surface 13a of the heat radiating member 13, and the cooling water accumulated in the immersion part 5 of the cooling body 3 leaks to the outside. A liquid tight seal is applied to prevent this.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
  • one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60.
  • the crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated, and have a thermal resistance. 5, the heat transferred to the heat transfer support metal plates 32 and 33 is stored in the step portion 18 and directly contacts the upper surface 3c of the cooling body 3 as shown in FIG. The heat is radiated from 32c, 33c to the cooling body 3.
  • corresponds to the heat radiating member 13
  • corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer.
  • the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13, and the cooling body. Since the lower surfaces 32c2 and 33c2 of the contact plate portions 32c and 33c are arranged in a state of being in close contact with the upper surface 3c of the cooling body 3 while being flush with the lower surface 13a as the joining surface of the heat radiating member 13 with which the O-ring 7 contacts.
  • the heat transferred from the control circuit board 22 and the power supply circuit board 23 to the heat transfer supporting metal plates 32 and 33 is radiated from the cooling body contact plate portions 32c and 33c to the cooling body 3, and the heat can be efficiently radiated. it can.
  • the heat radiating member 13 is easy to handle during processing even when assembled to a processing machine, the processing cost when forming the stepped portion 18 on the heat radiating member 13 is increased as compared with the cooling body 3 which is a large and heavy object. do not do. Therefore, the processing cost can be reduced by forming the stepped portion 18 only in the heat radiating member 13 without forming the portion for housing the cooling body contact plate portions 32c and 33c on the upper surface 3c that is the joint surface of the cooling body 3. Can be planned.
  • FIG. 6 shows a power module unit in which the drive circuit board 2, the control circuit unit U2, the power circuit unit U3, and the heat transfer supporting metal plates 32 and 33 are assembled to the power module 11 (case body 12, heat dissipation member 13).
  • This power module unit is separated from the cooling body 3 and is transported to a remote place such as an assembly factory.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 assembled in the power module unit are accommodated in the step portion 18 of the heat radiating member 13, and the cooling body contact plate portions 32c and 33c.
  • the front end of the step abuts against the innermost rising wall 18a of the step portion 18.
  • a direct cooling type power conversion device 1 in which a large number of cooling fins constituting the liquid contact portion 17 of the heat radiating member 13 are immersed in the cooling water of the immersion portion 5 provided in the cooling body 3.
  • the heat transfer supporting metal plate 32 of the present embodiment is applied to the indirect cooling type power converter 1 in which the heat radiating member 13 is indirectly cooled by the cooling water of the cooling body 3.
  • 33 can be provided with a structure in which the cooling body contact plate portions 32c and 33c are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists. 1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure according to the present invention is useful for reducing the processing cost and improving the deformation strength of the heat transfer plate during transportation. This is useful for reducing the cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.

Abstract

　Provided is a power converter that reduces manufacturing costs, and that enables an increase in the deformation strength of heat-transfer supporting metal sheets during transportation. The power converter is provided with: a semiconductor power module (11) on which a heat dissipating member (13) is formed on one surface of a case (12); a cooling body (3) joined to the heat dissipating member; mounting boards (22, 23) on which circuit components including heat generating circuit components are mounted; and heat-transfer supporting metal sheets (32, 33) which support the mounting boards at a prescribed distance from the semiconductor power module, and which are in contact with the cooling body so that the heat emitted from the mounting boards to the cooling body is dissipated without passing through the housing. An accommodation part (18), in which heat-transfer supporting metal sheets (32c, 33c) are accommodated, is formed on the outer peripheral side of the joined surface of the heat dissipating member.

Description

冷却構造体及び電力変換装置Cooling structure and power conversion device
　本発明は、発熱体の熱を冷却する冷却構造体と、電力変換用の半導体スイッチング素子を内蔵したモジュール上に、所定間隔を保って上記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持するようにした電力変換装置に関する。 The present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion. The present invention relates to a power conversion device that supports a mounted substrate.
　この種の電力変換装置としては、特許文献１に記載された電力変換装置が知られている。
　この電力変換装置は、筐体内に、冷却液が通過する水冷ジャケットを配置し、この水冷ジャケット上に電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵したパワーモジュールを接合して冷却するようにしている。
　また、筐体内には、パワーモジュールの水冷ジャケットとは反対側に所定距離を保って制御回路基板を配置し、この制御回路基板で発生する熱を、放熱部材を介して制御回路基板を支持する金属ベース板に伝達し、さらに金属ベース板に伝達された熱を、この金属ベース板を支持する筐体の側壁を介して水冷ジャケットに伝達するようにしている。 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
In this power conversion device, a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is joined and cooled on the water cooling jacket. Yes.
In addition, a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
　上記特許文献１に記載された従来例にあっては、制御回路基板で発生する熱を、制御回路基板→放熱部材→金属ベース板→筐体→水冷ジャケットという経路で放熱するようにしている。このため、筐体が伝熱経路の一部として利用されることにより、筐体にも良好な伝熱性が要求されることになり、材料が熱伝導率の高い金属に限定され、小型軽量化の要求される電力変換装置おいて、樹脂等の軽量な材料の選択が不可能となり軽量化が困難となるおそれがある。 In the conventional example described in Patent Document 1, heat generated in the control circuit board is radiated through a path of the control circuit board → the heat radiation member → the metal base plate → the housing → the water cooling jacket. For this reason, when the casing is used as a part of the heat transfer path, the casing is also required to have good heat transfer properties, and the material is limited to a metal with high thermal conductivity, which is reduced in size and weight. In a power conversion device that is required, it is difficult to select a lightweight material such as a resin and it may be difficult to reduce the weight.
　そこで、制御回路基板などの発熱体で発生する熱を、筐体を介在させず、金属ベース板の端部をパワーモジュール及び水冷ジャケットの間で挟持することで、発熱体の熱を効率よく水冷ジャケットに放熱する構造が考えられる。
　その際、パワーモジュール及び水冷ジャケットの接合面の外周側には、金属ベースの端部の位置決めを兼ねてベース端部を収納するためにベース端部収納部を形成する。 Therefore, the heat generated by the heating element such as the control circuit board is efficiently cooled by water by sandwiching the end of the metal base plate between the power module and the water cooling jacket without interposing the housing. A structure for radiating heat to the jacket is conceivable.
At this time, a base end storage portion is formed on the outer peripheral side of the joint surface of the power module and the water cooling jacket to store the base end portion while also positioning the end portion of the metal base.
特開２０１０－３５３４６号JP 2010-35346 A
　ところで、パワーモジュール及び水冷ジャケットの両者の接合面にベース端部収納部を形成するのは、加工コストの面で問題がある。また、水冷ジャケットの接合面にベース端部収納部を形成するのは、大型重量物である水冷ジャケットを加工機械に組付けた加工時の取り扱いが困難であり、加工コストが増大するおそれがある。
　一方、組み立て前の電力変換装置は、パワーモジュールに制御回路基板、放熱部材及び金属ベース板を組み付けたパワーモジュールユニットと、水冷ジャケットとを分離して組立工場等に輸送されるが、パワーモジュールユニットの金属ベースの端部をフリーの状態で輸送すると、輸送時の振動で金属ベース板が大きく揺動して変形するおそれがある。 By the way, it is problematic in terms of processing cost to form the base end accommodating portion on the joint surface between the power module and the water cooling jacket. In addition, forming the base end storage portion on the joint surface of the water-cooled jacket is difficult to handle when the water-cooled jacket, which is a large heavy object, is assembled to a processing machine, and may increase the processing cost. .
On the other hand, the power converter before assembly is transported to an assembly plant or the like by separating a power module unit in which a control circuit board, a heat radiating member and a metal base plate are assembled into a power module, and a water cooling jacket. When the end of the metal base is transported in a free state, the metal base plate may be greatly swung and deformed by vibration during transportation.
　本発明は、上記従来例の未解決の課題に着目してなされたものであり、加工コストの低減化を図り、輸送時における伝熱板の変形強度を向上させることができる冷却構造体と、加工コストの低減化を図り、輸送時における伝熱板、或いは伝熱支持用金属板の変形強度を向上させることができる電力変換装置を提供することを目的としている。 The present invention has been made paying attention to the unsolved problems of the conventional example, a cooling structure that can reduce the processing cost and can improve the deformation strength of the heat transfer plate during transportation, An object of the present invention is to provide a power converter capable of reducing the processing cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.
　上記目的を達成するために、本発明の一態様に係る冷却構造体は、第１の発熱体と、前記第１の発熱体に接合される冷却体と、第２の発熱体と、前記第２の発熱体の熱を、前記冷却体に伝熱させる伝熱板とを備え、前記第１発熱体の接合面の外周側に前記伝熱板を収納する収納部を形成した。
　この一態様に係る冷却構造体によると、大型重量物である冷却体と比較して第１の発熱体は、加工機械に組付けても加工時の取り扱いが容易なので、加工コストの低減化を図ることができる。そして、第１及び第２の発熱体と伝熱板とをユニット化し、冷却体とは分離して輸送しても、ユニット化された第１の発熱体は収納部で伝熱板を収納しているので、外力による伝熱板の変形が防止される。 In order to achieve the above object, a cooling structure according to an aspect of the present invention includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element. And a heat transfer plate for transferring the heat of the heat generating body to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the first heat generating body.
According to the cooling structure according to this aspect, the first heating element is easy to handle at the time of processing even when assembled to the processing machine as compared with the cooling body that is a large and heavy object, so that the processing cost can be reduced. Can be planned. Then, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
　また、本発明の一態様に係る電力変換装置は、一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体パワーモジュールを駆動する回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板とを備え、前記放熱部材の接合面の外周側に前記伝熱板を収納する収納部を形成した。
　この一態様に係る電力変換装置によると、大型重量物である冷却体と比較して放熱部材は、加工機械に組付けても加工時の取り扱いが容易なので、加工コストの低減化を図ることができる。そして、半導体パワーモジュールに放熱部材、実装基板及び伝熱板とをユニット化し、冷却体とは分離して輸送しても、ユニット化された放熱部材は収納部で伝熱板を収納しているので、外力による伝熱板の変形が防止される。 The power conversion device according to an aspect of the present invention includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module. And a heat transfer plate for transferring heat of the mounting board to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the heat dissipation member.
According to the power conversion device according to this aspect, the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can. And even if the heat dissipation member, the mounting substrate, and the heat transfer plate are unitized in the semiconductor power module and separated and transported, the unitized heat dissipation member stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
　また、本発明の一態様に係る電力変換装置は、電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板とを備え、前記放熱部材の接合面の外周側に収納部を形成し、当該収納部に前記伝熱支持用金属板を収納した。 The power conversion device according to an aspect of the present invention includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board. A heat transfer support metal plate that contacts the cooling body so as to dissipate the heat generated without passing through the casing, and a storage portion is formed on the outer peripheral side of the joining surface of the heat radiating member, The metal plate for heat transfer support was stored in a storage portion.
　この一態様に係る電力変換装置によると、大型重量物である冷却体と比較して放熱部材は、加工機械に組付けても加工時の取り扱いが容易なので、加工コストの低減化を図ることができる。そして、半導体パワーモジュールに放熱部材、実装基板及び伝熱支持用金属板をユニット化し、冷却体とは分離して輸送しても、ユニット化された放熱部材は収納部で伝熱支持用金属板を収納しているので、外力による伝熱支持用金属板の変形が防止される。 According to the power conversion device according to this aspect, the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can. And even if the heat dissipation member, the mounting board, and the heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the housing portion in the housing portion. Therefore, deformation of the heat transfer supporting metal plate due to external force is prevented.
　また、本発明の一態様に係る電力変換装置は、前記収納部を、前記放熱部材の接合面の外周側に形成した段差面とし、前記伝導支持用金属板の前記収納部から露出する面と、前記放熱部材の前記接合面とを面一とした。
　この一態様に係る電力変換装置によると、互いに面一とした伝導支持用金属板の収納部から露出する面と放熱部材の接合面とが冷却体に当接するので、実装基板から伝熱支持用金属板に伝熱された熱は、効率良く冷却体に放熱される。 Further, in the power conversion device according to one aspect of the present invention, the storage portion is a stepped surface formed on the outer peripheral side of the joint surface of the heat dissipation member, and the surface exposed from the storage portion of the conductive support metal plate; The surface of the heat radiating member is flush with the joint surface.
According to the power conversion device according to this aspect, the surface exposed from the storage portion of the conductive support metal plate flush with each other and the joint surface of the heat radiating member abut against the cooling body. The heat transferred to the metal plate is efficiently radiated to the cooling body.
　また、本発明の一態様に係る電力変換装置は、前記伝導支持用金属板の前記収納部から露出する面に、前記冷却体の接合面が密着している。
　この一態様に係る電力変換装置によると、伝導支持用金属板と冷却体との密着性が高まるので、実装基板から伝熱支持用金属板に伝熱された熱が、さらに効率良く冷却体に放熱される。 In the power converter according to an aspect of the present invention, the joint surface of the cooling body is in close contact with the surface of the conductive support metal plate exposed from the storage portion.
According to the power conversion device according to this aspect, the adhesion between the conductive support metal plate and the cooling body is enhanced, so that the heat transferred from the mounting substrate to the heat transfer support metal plate is more efficiently transferred to the cooling body. Heat is dissipated.
　また、本発明の一態様に係る電力変換装置は、前記放熱部材は前記冷却体に直接冷却により冷却されているとともに、前記放熱部材と前記冷却体との間に、水密封止部を設けた。
　この一態様に係る電力変換装置によると、実装基板から伝熱支持用金属板に伝熱された熱が、直接冷却の放熱部材及び冷却体により効率良く放熱される。 Further, in the power conversion device according to one aspect of the present invention, the heat dissipation member is cooled by direct cooling to the cooling body, and a watertight sealing portion is provided between the heat dissipation member and the cooling body. .
According to the power converter according to this aspect, the heat transferred from the mounting substrate to the heat transfer supporting metal plate is efficiently radiated by the direct cooling heat radiating member and the cooling body.
　また、本発明の一態様に係る電力変換装置は、前記放熱部材は前記冷却体に間接冷却により冷却されているとともに、前記放熱部材と前記冷却体との間に、伝熱部材を配置した。
　この一態様に係る電力変換装置によると、実装基板から伝熱支持用金属板に伝熱された熱が、間接冷却の放熱部材及び冷却体により放熱される。 Moreover, the power converter device which concerns on 1 aspect of this invention WHEREIN: While the said heat radiating member was cooled by the said cooling body by indirect cooling, the heat-transfer member was arrange | positioned between the said heat radiating member and the said cooling body.
According to the power conversion device according to this aspect, the heat transferred from the mounting substrate to the heat transfer supporting metal plate is radiated by the indirect cooling heat radiating member and the cooling body.
　さらに、本発明の一態様に係る電力変換装置は、前記伝熱部材が、熱伝導性が良好なグリースである。
　この一態様に係る電力変換装置によると、熱伝導性が良好なグリースからなる伝熱部材により放熱部材及び冷却体の熱伝導性が高められるので、実装基板から伝熱支持用金属板に伝熱された熱は、放熱部材及び冷却体により効率良く放熱される。 Furthermore, in the power conversion device according to one embodiment of the present invention, the heat transfer member is grease having good thermal conductivity.
According to the power converter according to this aspect, the heat transfer member made of grease having good heat conductivity increases the heat conductivity of the heat radiating member and the cooling body, so heat transfer from the mounting board to the heat transfer supporting metal plate. The generated heat is efficiently radiated by the heat radiating member and the cooling body.
　本発明に係る冷却構造体によれば、大型重量物である冷却体と比較して第１の発熱体は、加工機械に組付けても加工時の取り扱いが容易なので、加工コストの低減化を図ることができる。また、第１及び第２の発熱体と伝熱板とをユニット化し、冷却体とは分離して輸送しても、ユニット化された第１の発熱体は収納部で伝熱板を収納しているので、伝熱板の変形強度を向上させることができる。 According to the cooling structure according to the present invention, the first heating element is easy to handle at the time of processing even when assembled to a processing machine, compared with a cooling body that is a large and heavy object. Can be planned. Further, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, the deformation strength of the heat transfer plate can be improved.
　また、本発明に係る電力変換装置によれば、大型重量物である冷却体と比較して放熱部材は、加工機械に組付けても加工時の取り扱いが容易なので、加工コストの低減化を図ることができる。そして、半導体パワーモジュールに放熱部材、実装基板及び伝熱板、或いは伝熱支持用金属板とをユニット化し、冷却体とは分離して輸送しても、ユニット化された放熱部材は収納部で伝熱板、或いは伝熱支持用金属板を収納しているので、外力による伝熱板、或いは伝熱支持用金属板の変形強度を向上させることができる。 Further, according to the power conversion device of the present invention, the heat dissipation member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost is reduced. be able to. Even if the heat dissipation member, mounting board and heat transfer plate, or heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the storage section. Since the heat transfer plate or the heat transfer support metal plate is accommodated, the deformation strength of the heat transfer plate or the heat transfer support metal plate by an external force can be improved.
本発明に係る直接冷却方式の電力変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the power converter of the direct cooling system which concerns on this invention. 図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 電力変換装置の放熱部材と冷却体との間で伝熱支持用金属板が挟持されている状態を示す断面図である。It is sectional drawing which shows the state by which the metal plate for heat-transfer support is clamped between the heat radiating member and cooling body of a power converter device. 伝熱支持用金属板を示す側面図である。It is a side view which shows the metal plate for heat transfer support. 発熱回路部品の全体の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the whole heat generating circuit components. 本発明に係るパワーモジュールに実装基板及び伝熱支持用金属板を組み付けたパワーモジュールユニットを示すものである。The power module unit which assembled | attached the mounting board | substrate and the metal plate for heat-transfer support to the power module which concerns on this invention is shown. 本発明に係る間接冷却方式の電力変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the power converter device of the indirect cooling system which concerns on this invention.
　以下、本発明を実施するための形態（以下、実施形態という。）を、図面を参照しながら詳細に説明する。
　図１は本発明に係る電力変換装置の全体構成を示す断面図であり、図２は、図１の要部を拡大して示した図である。
　図１の符号１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、水冷ジャケットの構成を有する冷却体３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。 DESCRIPTION OF EMBODIMENTS Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention, and FIG. 2 is an enlarged view of the main part of FIG.
Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
　下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が冷却体３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
　上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が冷却体３で閉塞されている。
　この角筒体２ａの下端と冷却体３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。 The lower housing 2A is a bottomed rectangular tube. The lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3.
Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
　冷却体３は、例えば熱伝導率の高いアルミニウム、アルミニウム合金を射出成形して形成されており、下面は平坦面とされ、冷却水の給水口３ａ及び排水口３ｂが筐体２の外方に開口されている。これら給水口３ａ及び排水口３ｂは例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。
　図３にも示すように、冷却体３の上面中央には、給水口３ａ及び排水口３ｂに連通する四角形状に開口する浸漬部５が形成され、この浸漬部５の上面開口部の周縁に、四角枠状の周溝６が形成され、この周溝６にＯリング７が装着されている。 The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open. The water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
As shown in FIG. 3, an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3. A square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6.
　また、図１に戻って、冷却体３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｅが形成されている。
　電力変換装置１は、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵したパワーモジュール１１を備えている。このパワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に金属製の放熱部材１３が形成されている。 Returning to FIG. 1, the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 </ b> A are inserted vertically.
The power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion. The power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
　放熱部材１３の下面中央部には、冷却体３の浸漬部５に入り込む接液部１７が形成されている。この接液部１７は、放熱部材１３の下面から互いに均等の間隔をあけながら所定長さで突出している多数の冷却フィン１７ａで構成されており、給水口３ａから浸漬部５に流れ込んできた冷却水に、多数の冷却フィン１７ａが浸される直接冷却方式としている。 A liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat dissipation member 13. The liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. A direct cooling method in which a large number of cooling fins 17a are immersed in water is adopted.
　また、図２に示すように、放熱部材１３の左側及び右側の下面外周に、後述する伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３を収納する収納部として段差部１８が形成されている。
　ケース体１２及び放熱部材１３には平面からみて四隅に固定ねじ１４を挿通する挿通孔１５が形成されている。また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。 Further, as shown in FIG. 2, the stepped portion 18 serves as a storage portion for storing the cooling body contact plate portions 32 c and 33 of the heat transfer supporting metal plates 32 and 33, which will be described later, on the outer periphery of the left and right lower surfaces of the heat dissipation member 13. Is formed.
The case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
　図２に示すように、基板固定部１６の上端に、パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。さらに、制御回路基板２２の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴに電源を供給する発熱回路部品を含む電源回路等を実装した実装基板としての電源回路基板２３が固定されている。 As shown in FIG. 2, a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16. In addition, a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval. A control circuit board 22 as a board is fixed. Further, a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
　そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
　また、制御回路基板２２は継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に継ぎねじ２５の雄ねじ部２５ａを挿通し、この雄ねじ部２５ａを継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。 Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, the control circuit board 22 inserts the male screw portion 25 a of the joint screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24, and this male screw portion 25 a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
　さらに、電源回路基板２３は継ぎねじ２５の上端に形成した雌ねじ部２５ｂに対向する位置に形成した挿通孔２３ａ内に固定ねじ２６を挿通し、この固定ねじ２６を継ぎねじ２５の雌ねじ部２５ｂに螺合することにより固定されている。
　また、制御回路基板２２及び電源回路基板２３は、伝熱支持用金属板３２，３３によって筐体２を介することなく冷却体３への放熱経路を独自に形成するように支持されている。これら伝熱支持用金属板３２及び３３は、熱伝導率が高い金属板例えばアルミニウム又はアルミニウム合金製の金属板で形成されている。 Further, the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
Further, the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2. These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
　伝熱支持用金属板３２は、平板形状の伝熱支持板部３２ａと、この伝熱支持板部３２ａの右側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３２ｂと、伝熱支持側板部３２ｂの下端部から左側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３２ｃとを一体に備えた部品である。
　伝熱支持板部３２ａには、伝熱部材３５を介して制御回路基板２２が固定ねじ３６によって固定される。伝熱部材３５は、伸縮性を有する弾性体で電源回路基板２３と同じ外形寸法に構成されている。この伝熱部材３５としては、シリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。 The heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
The control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
　また、伝熱支持用金属板３３は、平板形状の伝熱支持板部３３ａと、この伝熱支持板部３３ａの左側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３３ｂと、伝熱支持側板部３３ｂの下端部から右側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３３ｃとを一体に備えた部品である。
　伝熱支持板部３３ａには、前述した伝熱部材３５と同様の伝熱部材３７を介して電源回路基板２３が固定ねじ３８によって固定される。 Further, the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13. The support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
The power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
　これら伝熱支持用金属板３２，３３を一体部品とすることで、熱抵抗を小さくしてより効率の良い放熱を行うことができる。また、伝熱支持用金属板３２の伝熱支持板部３２ａと伝熱支持側板部３２ｂとの連結部及び伝熱支持側板部３２ｂと冷却体接触板部３２ｃとの連結部とを湾曲部とし、伝熱支持用金属板３３の伝熱支持板部３３ａと伝熱支持側板部３３ｂとの連結部及び伝熱支持側板部３３ｂと冷却体接触板部３３ｃとの連結部とを湾曲部とすることで、電力変換装置１に伝達される上下振動や横揺れ等に対する耐振動性を向上することができる。 By using these heat transfer supporting metal plates 32 and 33 as an integral part, it is possible to reduce heat resistance and perform more efficient heat dissipation. Further, the connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions. The connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions. Thus, it is possible to improve the vibration resistance against the vertical vibration and roll transmitted to the power conversion device 1.
　図３に示すように、電源回路基板２３には、発熱回路部品３９が下面側に実装されており、電源回路基板２３、伝熱部材３７及び伝熱支持板部３３ａが、固定ねじ３８により積層状態で固定されており、伝熱支持板部３３ａの下面には、絶縁距離を短くするために絶縁シート４３が貼着されている。なお、これらの積層状態の部品を電源回路ユニットＵ３と称する。 As shown in FIG. 3, a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38. The insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
　この際、電源回路基板２３の下面側に実装された発熱回路部品３９が伝熱部材３７の弾性によって伝熱部材３７内に埋め込まれる。このため、発熱回路部品３９と伝熱部材３７との接触が過不足なく行われるとともに、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの接触が良好に行われ、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの間の熱抵抗を減少させることができる。 At this time, the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
　また、図示しないが、制御回路基板２２の下面側にも発熱回路部品が実装されており、制御回路基板２２、伝熱部材３５及び伝熱支持板部３２ａが、固定ねじ３６により積層状態で固定されており、伝熱支持板部３２ａの下面には、絶縁距離を短くするために絶縁シート４２が貼着されている。なお、これらの積層状態の部品を制御回路ユニットＵ２と称する。 Although not shown, a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36. An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
　そして、制御回路基板２２の下面側に実装された発熱回路部品が伝熱部材３５の弾性によって伝熱部材３５内に埋め込まれ、制御回路基板２２と伝熱部材３５との接触が過不足なく行われるとともに、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの接触が良好に行われ、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの間の熱抵抗を減少させることができる。 Then, the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency. In addition, the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
　また、伝熱支持用金属板の伝熱支持側板部３３ｂには、図４に示すように、パワーモジュール１１の図１に示す３相交流出力端子１１ｂに対応する位置に後述するブスバー５５を挿通する例えば方形の３つの挿通孔３３ｉが形成されている。このように、３つの挿通孔３３ｉを形成することにより、隣接する挿通孔３３ｉ間に比較的幅広の伝熱路Ｌｈを形成することができ、全体の伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。 Further, as shown in FIG. 4, a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG. For example, three rectangular insertion holes 33i are formed. Thus, by forming the three insertion holes 33i, a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
　同様に、伝熱支持用金属板３２の伝熱支持側板部３２ｂにも、パワーモジュール１１の正極及び負極端子１１ａに対向する位置にそれぞれ同様の挿通孔３２ｉが形成されている。この挿通孔３２ｉを形成することにより、上述した挿通孔３３ｉと同様の作用効果を得ることができる。
　また、伝熱支持用金属板３２の冷却体接触板部３２ｃ及び伝熱支持用金属板３３の冷却体接触板部３３ｃには、図２に示すように、パワーモジュール１１の固定ねじ１４を挿通する挿通孔１５に対向する位置に固定部材挿通孔３２ｃ１，３３ｃ１が形成されている。 Similarly, in the heat transfer support side plate portion 32b of the heat transfer support metal plate 32, similar insertion holes 32i are formed at positions facing the positive electrode and the negative electrode terminal 11a of the power module 11, respectively. By forming the insertion hole 32i, the same effect as that of the insertion hole 33i described above can be obtained.
Further, as shown in FIG. 2, the fixing screw 14 of the power module 11 is inserted into the cooling body contact plate portion 32c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33c of the heat transfer support metal plate 33. Fixing member insertion holes 32c1 and 33c1 are formed at positions facing the insertion holes 15 to be formed.
　そして、図２に示すように、伝熱支持用金属板３２の冷却体接触板部３２ｃ及び伝熱支持用金属板３３の冷却体接触板部３３ｃは、前述した放熱部材１３の左側及び右側の下面外周に形成した段差部１８に収納されている。
　段差部１８に収納された冷却体接触板部３２ｃ，３３ｃは、その下面３２ｃ２，３３ｃ２が、Ｏリング７が接触する放熱部材１３の接合面としての下面１３ａに対して面一とされている。 As shown in FIG. 2, the cooling body contact plate portion 32 c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33 c of the heat transfer support metal plate 33 are provided on the left side and the right side of the heat dissipation member 13 described above. It is housed in a step 18 formed on the outer periphery of the lower surface.
The cooling body contact plate portions 32c and 33c housed in the stepped portion 18 have their lower surfaces 32c2 and 33c2 flush with the lower surface 13a as the joining surface of the heat dissipation member 13 with which the O-ring 7 contacts.
　また、図３に示すように、冷却体接触板部３３ｃの先端部は、段差部１８の最も内周側の立上がり壁１８ａに当接している。なお、冷却体接触板部３２ｃの先端部も、段差部１８の最も内周側の立上がり壁１８ａに当接している。
　そして、放熱部材１３の挿通孔１５及び冷却体接触板部３２ｃ，３３ｃの固定部材挿通孔３２ｃ１，３３ｃ１に固定ねじ１４を挿通し、固定ねじ１４を冷却体３に形成した雌ねじ部に螺合させる。 As shown in FIG. 3, the distal end portion of the cooling body contact plate portion 33 c is in contact with the rising wall 18 a on the innermost peripheral side of the step portion 18. The tip of the cooling body contact plate portion 32c is also in contact with the rising wall 18a on the innermost peripheral side of the step portion 18.
Then, the fixing screw 14 is inserted into the insertion hole 15 of the heat dissipation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3. .
　これにより、放熱部材１３の段差部１８に収納した伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃが冷却体３の接合面としての上面３ｃに密着した状態で、冷却体接触板部３２ｃ，３３ｃが放熱部材１３及び冷却体３の間に固定される。
　この際、冷却体３の浸漬部５の周囲の周溝６に装着したＯリング７が放熱部材１３の下面１３ａに押しつぶされ、冷却体３の浸漬部５に溜まった冷却水が外部に漏れるのを防止する液密封止が施される。 Thus, the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 housed in the stepped portion 18 of the heat radiating member 13 are in close contact with the upper surface 3c as the joint surface of the cooling body 3. The contact plate portions 32 c and 33 c are fixed between the heat radiating member 13 and the cooling body 3.
At this time, the O-ring 7 attached to the circumferential groove 6 around the immersion part 5 of the cooling body 3 is crushed by the lower surface 13a of the heat radiating member 13, and the cooling water accumulated in the immersion part 5 of the cooling body 3 leaks to the outside. A liquid tight seal is applied to prevent this.
　また、図１に示すように、パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５５が接続され、ブスバー５５の他端に冷却体３を貫通するフィルムコンデンサ４の正負の電極４ａが固定ねじ５１で連結されている。また、パワーモジュール１１の負極端子１１ａに、外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３が固定されている。 Further, as shown in FIG. 1, a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
　さらに、パワーモジュール１１の３相交流出力端子１１ｂに、ブスバー５５の一端を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７が配置されている。そして、ブスバー５５の他端に圧着端子５９が固定ねじ６０で接続されている。圧着端子５９は、外部の３相電動モータ（図示せず）に接続したモータ接続ケーブル５８に固定されている。 Furthermore, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
　この状態で、外部のコンバータ（図示せず）から直流電力を供給するとともに、電源回路基板２３に実装された電源回路、制御回路基板２２に実装された制御回路を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介してパワーモジュール１１に供給する。これによって、パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介してモータ接続ケーブル５８に供給し、３相電動モータ（図示せず）を駆動制御する。 In this state, DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state. A gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
　このとき、パワーモジュール１１に内蔵されたＩＧＢＴで発熱するが、パワーモジュール１１の放熱部材１３の下面中央部に設けた接液部１７が冷却体３に設けた浸漬部５に入り込んで冷却液に浸漬されているので、パワーモジュール１１は効率良く冷却される。
　一方、制御回路基板２２及び電源回路基板２３に実装されている制御回路及び電源回路には発熱回路部品３９が含まれており、これら発熱回路部品３９で発熱を生じる。このとき、発熱回路部品３９は制御回路基板２２及び電源回路基板２３の下面側に実装されている。 At this time, the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
　そして、これら制御回路基板２２及び電源回路基板２３の下面側には、熱伝導率が高く弾性を有する伝熱部材３５及び３７を介して伝熱支持用金属板３２，３３の伝熱支持板部３２ａ，３３ａが設けられている。伝熱支持用金属板３２，３３は、伝熱支持板部３２ａ，３３ａと、伝熱支持側板部３２ｂ，３３ｂと、冷却体接触板部３２ｃ，３３ｃとを一体化した部品であって熱抵抗が小さい部材なので、図５に示すように、伝熱支持用金属板３２，３３に伝達された熱は、段差部１８に収納され、冷却体３の上面３ｃに直接接触した冷却体接触板部３２ｃ，３３ｃから冷却体３に放熱される。 And on the lower surface side of these control circuit board 22 and power supply circuit board 23, heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided. The heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated, and have a thermal resistance. 5, the heat transferred to the heat transfer support metal plates 32 and 33 is stored in the step portion 18 and directly contacts the upper surface 3c of the cooling body 3 as shown in FIG. The heat is radiated from 32c, 33c to the cooling body 3.
　なお、本発明の第１の発熱体が放熱部材１３に対応し、本発明の第２の発熱体が制御回路基板２２及び電源回路基板２３に対応し、本発明の伝熱板が伝熱支持用金属板３２，３３に対応し、本発明の第１の発熱体及び冷却体の接合面で挟持される伝熱板が伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ、３３ｃに対応している。 In addition, the 1st heat generating body of this invention respond | corresponds to the heat radiating member 13, the 2nd heat generating body of this invention respond | corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer. Corresponding to the metal plates 32 and 33 for cooling, the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
　本実施形態の電力変換装置１によると、伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃは、放熱部材１３の下面外周に形成した段差部１８に収納され、その冷却体接触板部３２ｃ，３３ｃの下面３２ｃ２，３３ｃ２が、Ｏリング７が接触する放熱部材１３の接合面としての下面１３ａに面一とされながら冷却体３の上面３ｃに密着した状態で配置されるので、制御回路基板２２及び電源回路基板２３から伝熱支持用金属板３２，３３に伝達された熱は冷却体接触板部３２ｃ，３３ｃから冷却体３に放熱され、効率の良い放熱を行うことができる。 According to the power conversion device 1 of the present embodiment, the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13, and the cooling body. Since the lower surfaces 32c2 and 33c2 of the contact plate portions 32c and 33c are arranged in a state of being in close contact with the upper surface 3c of the cooling body 3 while being flush with the lower surface 13a as the joining surface of the heat radiating member 13 with which the O-ring 7 contacts. The heat transferred from the control circuit board 22 and the power supply circuit board 23 to the heat transfer supporting metal plates 32 and 33 is radiated from the cooling body contact plate portions 32c and 33c to the cooling body 3, and the heat can be efficiently radiated. it can.
　また、大型重量物である冷却体３と比較して、放熱部材１３は加工機械に組付けても加工時の取り扱いが容易なので、放熱部材１３に段差部１８を形成する際の加工コストが増大しない。したがって、冷却体３の接合面である上面３ｃに冷却体接触板部３２ｃ，３３ｃを収納する部位を形成せず、放熱部材１３のみに段差部１８を形成することで、加工コストの低減化を図ることができる。 Further, since the heat radiating member 13 is easy to handle during processing even when assembled to a processing machine, the processing cost when forming the stepped portion 18 on the heat radiating member 13 is increased as compared with the cooling body 3 which is a large and heavy object. do not do. Therefore, the processing cost can be reduced by forming the stepped portion 18 only in the heat radiating member 13 without forming the portion for housing the cooling body contact plate portions 32c and 33c on the upper surface 3c that is the joint surface of the cooling body 3. Can be planned.
　また、図６は、パワーモジュール１１（ケース体１２、放熱部材１３）に駆動回路基板２、制御回路ユニットＵ２、電源回路ユニットＵ３、伝熱支持用金属板３２，３３を組み付けたパワーモジュールユニットを示すものであり、このパワーモジュールユニットは、冷却体３とは分離されて組立工場等の遠隔地に輸送される。このパワーモジュールユニットに組付けられている伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃは、放熱部材１３の段差部１８に収納され、それら冷却体接触板部３２ｃ，３３ｃの先端部は段差部１８の最も内周側の立上がり壁１８ａに当接している。 6 shows a power module unit in which the drive circuit board 2, the control circuit unit U2, the power circuit unit U3, and the heat transfer supporting metal plates 32 and 33 are assembled to the power module 11 (case body 12, heat dissipation member 13). This power module unit is separated from the cooling body 3 and is transported to a remote place such as an assembly factory. The cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 assembled in the power module unit are accommodated in the step portion 18 of the heat radiating member 13, and the cooling body contact plate portions 32c and 33c. The front end of the step abuts against the innermost rising wall 18a of the step portion 18.
　このパワーモジュールユニットに、輸送時に、図６の矢印方向の外力が作用しても、冷却体接触板部３２ｃ，３３ｃが立上がり壁１８ａに当接した状態で段差部１８に収納されているので、伝熱支持用金属板３２，３３の揺動を抑制することができる。
　したがって、輸送時における伝熱支持用金属板３２，３３の変形強度を向上させることができる。 Even if an external force in the direction of the arrow in FIG. 6 acts on the power module unit during transportation, the cooling body contact plate portions 32c and 33c are stored in the stepped portion 18 in contact with the rising wall 18a. The swinging of the heat transfer supporting metal plates 32 and 33 can be suppressed.
Therefore, the deformation strength of the heat transfer supporting metal plates 32 and 33 during transportation can be improved.
　なお、図１から図６では、冷却体３に設けた浸漬部５の冷却水に放熱部材１３の接液部１７を構成する多数の冷却フィンが浸されている直接冷却方式の電力変換装置１を示したが、図７に示すように、冷却体３の冷却水に放熱部材１３が間接的に冷却される間接冷却方式の電力変換装置１に、本実施形態の伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃを、放熱部材１３の下面外周に形成した段差部１８に収納される構造を提供しても同様の効果を得ることができる。この構造の場合には、冷却体３の接合面（上面）３ａ及び放熱部材１３の接合面（下面）１３ａとの間に、熱伝導性が良好なグリースなどの伝熱部材１９を介在させると、放熱部材１３の冷却効率をさらに高めることができる。 1 to 6, a direct cooling type power conversion device 1 in which a large number of cooling fins constituting the liquid contact portion 17 of the heat radiating member 13 are immersed in the cooling water of the immersion portion 5 provided in the cooling body 3. However, as shown in FIG. 7, the heat transfer supporting metal plate 32 of the present embodiment is applied to the indirect cooling type power converter 1 in which the heat radiating member 13 is indirectly cooled by the cooling water of the cooling body 3. , 33 can be provided with a structure in which the cooling body contact plate portions 32c and 33c are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13. In the case of this structure, when a heat transfer member 19 such as grease having good thermal conductivity is interposed between the joint surface (upper surface) 3a of the cooling body 3 and the joint surface (lower surface) 13a of the heat radiating member 13. The cooling efficiency of the heat radiating member 13 can be further increased.
　また、図１及び図２で示した制御回路ユニットＵ２及び電源回路ユニットＵ３において、伝熱部材３５及び３７を制御回路基板２２及び電源回路基板２３と同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材３５及び３７を発熱回路部品３９が存在する箇所にのみ設けるようにしてもよい。
　また、図１及び図２においては、制御回路基板２２及び電源回路基板２３で発熱回路部品３９を裏面側の伝熱部材３５及び３７側に実装する場合について説明した。しかしながら、本発明は上記構成に限定されるものではない。すなわち、制御回路基板２２及び電源回路基板２３の伝熱部材３５及び３７とは反対側の外周領域に、発熱回路部品３９を実装するようにしてよい。 In the control circuit unit U2 and the power supply circuit unit U3 shown in FIGS. 1 and 2, the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.
1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
　さらに、図１及び図２においては、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。
　また、本発明に係る電力変換装置１を、電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置１としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置１を適用することができる。 Furthermore, although the case where the film capacitor 4 is applied as a smoothing capacitor has been described in FIGS. 1 and 2, the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
Moreover, although the case where the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive | works a rail, and is arbitrary. It can be applied to an electrically driven vehicle. Furthermore, the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
　以上のように、本発明に係る冷却構造体は、加工コストの低減化を図り、輸送時における伝熱板の変形強度を向上させるのに有用であり、本発明に係る電力変換装置は、加工コストの低減化を図り、輸送時における伝熱板、或いは伝熱支持用金属板の変形強度を向上させるのに有用である。 As described above, the cooling structure according to the present invention is useful for reducing the processing cost and improving the deformation strength of the heat transfer plate during transportation. This is useful for reducing the cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.
　１…電力変換装置、２…筐体、２Ａ…下部筐体、２Ｂ…上部筐体、２ａ…角筒体、２ｂ…蓋体、３…冷却体、３ａ…給水口、３ｂ…排水口、３ｃ…冷却体の上面、３ｅ…挿通孔、４…フィルムコンデンサ、４ａ…正負の電極、５…浸漬部、６…周溝、７…Ｏリング、１１…パワーモジュール、１１ａ…負極端子、１１ｂ…３相交流出力端子、１２…ケース体、１３…放熱部材、１４…固定ねじ、１５…挿通孔、１６…基板固定部、１６ａ…雌ねじ部、１７…接液部、１７ａ…冷却フィン、１８…段差部、１８ａ…立上がり壁、１９…伝熱部材、２１…駆動回路基板、２１ａ…挿通孔、２２…制御回路基板、２２ａ…挿通孔、２３…電源回路基板、２３ａ…挿通孔、２４ａ…雄ねじ部、２４ｂ…雌ねじ部、２５ａ…雄ねじ部、２５ｂ…雌ねじ部、３２，３３…伝熱支持用金属板、３２ａ…伝熱支持板部、３２ｂ…伝熱支持側板部、３２ｃ…冷却体接触板部、３２ｃ，３３ｃ…冷却体接触板部、３２ｃ１，３３ｃ１…固定部材挿通孔、３２ｉ…挿通孔、３３ａ…伝熱支持板部、３３ｂ…伝熱支持側板部、３３ｃ…冷却体接触板部、３３ｉ…挿通孔、３５…伝熱部材、３７…伝熱部材、３９…発熱回路部品、４２…絶縁シート、４３…絶縁シート、５１…固定ねじ、５２…接続コード、５３，５９…圧着端子、５５…ブスバー、５７…電流センサ、５８…モータ接続ケーブル、６０…固定ねじ、Ｕ２…制御回路ユニット、Ｕ３…電源回路ユニット DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 2A ... Lower housing | casing, 2B ... Upper housing | casing, 2a ... Square cylinder body, 2b ... Cover body, 3 ... Cooling body, 3a ... Water supply port, 3b ... Drainage port, 3c ... upper surface of the cooling body, 3e ... insertion hole, 4 ... film capacitor, 4a ... positive and negative electrodes, 5 ... immersion part, 6 ... circumferential groove, 7 ... O-ring, 11 ... power module, 11a ... negative electrode terminal, 11b ... 3 Phase alternating current output terminal, 12 ... Case body, 13 ... Heat dissipation member, 14 ... Fixing screw, 15 ... Insertion hole, 16 ... Substrate fixing part, 16a ... Female screw part, 17 ... Wetted part, 17a ... Cooling fin, 18 ... Step , 18a: rising wall, 19 ... heat transfer member, 21 ... drive circuit board, 21a ... insertion hole, 22 ... control circuit board, 22a ... insertion hole, 23 ... power supply circuit board, 23a ... insertion hole, 24a ... male screw part , 24b ... female screw part, 25a ... male screw part, 25b ... female screw part 32, 33 ... Heat transfer support metal plate, 32a ... Heat transfer support plate portion, 32b ... Heat transfer support side plate portion, 32c ... Cooling body contact plate portion, 32c, 33c ... Cooling body contact plate portion, 32c1, 33c1 ... Fixing member insertion hole, 32i ... insertion hole, 33a ... heat transfer support plate, 33b ... heat transfer support side plate, 33c ... cooling body contact plate, 33i ... insertion hole, 35 ... heat transfer member, 37 ... heat transfer member 39 ... Heat generating circuit parts, 42 ... Insulating sheet, 43 ... Insulating sheet, 51 ... Fixing screw, 52 ... Connection cord, 53, 59 ... Crimp terminal, 55 ... Bus bar, 57 ... Current sensor, 58 ... Motor connection cable, 60 ... Fixing screw, U2 ... Control circuit unit, U3 ... Power supply circuit unit

Claims (8)

  1. 　第１の発熱体と、
    　前記第１の発熱体に接合される冷却体と、
    　第２の発熱体と、
    　前記第２の発熱体の熱を、前記冷却体に伝熱させる伝熱板と、を備え、
    　前記第１の発熱体の接合面の外周側に前記伝熱板を収納する収納部を形成したことを特徴とする冷却構造体。     A first heating element;
    A cooling body joined to the first heating element;
    A second heating element;
    A heat transfer plate for transferring heat of the second heating element to the cooling body,
    The cooling structure characterized by forming the accommodating part which accommodates the said heat exchanger plate in the outer peripheral side of the joint surface of a said 1st heat generating body.
  2. 　一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体パワーモジュールを駆動する回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板と、を備え、
    　前記放熱部材の接合面の外周側に前記伝熱板を収納する収納部を形成したことを特徴とする電力変換装置。     A semiconductor power module having a heat dissipation member formed on one surface;
    A cooling body joined to the heat dissipation member;
    A heat transfer plate for transferring the heat of the mounting board on which the circuit components for driving the semiconductor power module are mounted to the cooling body,
    A power conversion device characterized in that a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the heat dissipation member.
  3. 　電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、
    　当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板と、を備え、
    　前記放熱部材の接合面の外周側に収納部を形成し、当該収納部に前記伝熱支持用金属板を収納したことを特徴とする電力変換装置。     A semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body,
    A cooling body joined to the heat dissipation member;
    A mounting board on which circuit components including a heat generating circuit component for driving the semiconductor switching element are mounted;
    Supporting the mounting board with the semiconductor power module at a predetermined interval, and supporting heat transfer to contact the cooling body so as to dissipate heat generated by the mounting board to the cooling body without passing through a housing. A metal plate,
    A power conversion device, wherein a storage portion is formed on an outer peripheral side of a joint surface of the heat radiating member, and the heat transfer supporting metal plate is stored in the storage portion.
  4. 　前記収納部を、前記放熱部材の接合面の外周側に形成した段差面とし、前記伝導支持用金属板の前記収納部から露出する面と、前記放熱部材の前記接合面とを面一としたことを特徴とする請求項３記載の電力変換装置。 The storage portion is a stepped surface formed on the outer peripheral side of the joint surface of the heat dissipation member, and the surface exposed from the storage portion of the conductive support metal plate is flush with the joint surface of the heat dissipation member. The power conversion device according to claim 3.
  5. 　前記伝導支持用金属板の前記収納部から露出する面に、前記冷却体の接合面が密着していることを特徴とする請求項４記載の電力変換装置。 The power conversion device according to claim 4, wherein a joint surface of the cooling body is in close contact with a surface exposed from the storage portion of the conductive support metal plate.
  6. 　前記放熱部材は前記冷却体に直接冷却により冷却されているとともに、
    　前記放熱部材と前記冷却体との間に、水密封止部を設けたことを特徴とする請求項３記載の電力変換装置。     The heat radiating member is cooled by direct cooling to the cooling body,
    The power conversion device according to claim 3, wherein a watertight sealing portion is provided between the heat dissipation member and the cooling body.
  7. 　前記放熱部材は前記冷却体に間接冷却により冷却されているとともに、
    　前記放熱部材と前記冷却体との間に、伝熱部材を配置したことを特徴とする請求項３記載の電力変換装置。     The heat radiating member is cooled by indirect cooling to the cooling body,
    The power conversion device according to claim 3, wherein a heat transfer member is disposed between the heat dissipation member and the cooling body.
  8. 　前記伝熱部材は、熱伝導性が良好なグリースであることを特徴とする請求項７記載の電力変換装置。 The power conversion device according to claim 7, wherein the heat transfer member is a grease having good thermal conductivity.
PCT/JP2013/003049 2012-08-03 2013-05-13 Cooling structure and power converter WO2014020806A1 (en)

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