WO2014020806A1 - Structure de refroidissement et convertisseur d'énergie - Google Patents

Structure de refroidissement et convertisseur d'énergie Download PDF

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Publication number
WO2014020806A1
WO2014020806A1 PCT/JP2013/003049 JP2013003049W WO2014020806A1 WO 2014020806 A1 WO2014020806 A1 WO 2014020806A1 JP 2013003049 W JP2013003049 W JP 2013003049W WO 2014020806 A1 WO2014020806 A1 WO 2014020806A1
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WO
WIPO (PCT)
Prior art keywords
heat
cooling body
heat transfer
cooling
power conversion
Prior art date
Application number
PCT/JP2013/003049
Other languages
English (en)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to CN201380024912.6A priority Critical patent/CN104303412A/zh
Priority to JP2014527954A priority patent/JPWO2014020806A1/ja
Publication of WO2014020806A1 publication Critical patent/WO2014020806A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/074—Stacked arrangements of non-apertured devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4056—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to additional heatsink
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is joined and cooled on the water cooling jacket.
  • a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the heat generated by the heating element such as the control circuit board is efficiently cooled by water by sandwiching the end of the metal base plate between the power module and the water cooling jacket without interposing the housing.
  • a structure for radiating heat to the jacket is conceivable.
  • a base end storage portion is formed on the outer peripheral side of the joint surface of the power module and the water cooling jacket to store the base end portion while also positioning the end portion of the metal base.
  • the power converter before assembly is transported to an assembly plant or the like by separating a power module unit in which a control circuit board, a heat radiating member and a metal base plate are assembled into a power module, and a water cooling jacket.
  • the metal base plate may be greatly swung and deformed by vibration during transportation.
  • An object of the present invention is to provide a power converter capable of reducing the processing cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.
  • a cooling structure includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element. And a heat transfer plate for transferring the heat of the heat generating body to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the first heat generating body.
  • the first heating element is easy to handle at the time of processing even when assembled to the processing machine as compared with the cooling body that is a large and heavy object, so that the processing cost can be reduced. Can be planned. Then, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
  • the power conversion device includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module. And a heat transfer plate for transferring heat of the mounting board to the cooling body, and a storage portion for storing the heat transfer plate is formed on the outer peripheral side of the joint surface of the heat dissipation member.
  • the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can.
  • the unitized heat dissipation member stores the heat transfer plate in the storage portion. Therefore, deformation of the heat transfer plate due to external force is prevented.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • a heat transfer support metal plate that contacts the cooling body so as to dissipate the heat generated without passing through the casing, and a storage portion is formed on the outer peripheral side of the joining surface of the heat radiating member, The metal plate for heat transfer support was stored in a storage portion.
  • the heat radiating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost can be reduced. it can. And even if the heat dissipation member, the mounting board, and the heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the housing portion in the housing portion. Therefore, deformation of the heat transfer supporting metal plate due to external force is prevented.
  • the storage portion is a stepped surface formed on the outer peripheral side of the joint surface of the heat dissipation member, and the surface exposed from the storage portion of the conductive support metal plate;
  • the surface of the heat radiating member is flush with the joint surface.
  • the surface exposed from the storage portion of the conductive support metal plate flush with each other and the joint surface of the heat radiating member abut against the cooling body. The heat transferred to the metal plate is efficiently radiated to the cooling body.
  • the joint surface of the cooling body is in close contact with the surface of the conductive support metal plate exposed from the storage portion.
  • the adhesion between the conductive support metal plate and the cooling body is enhanced, so that the heat transferred from the mounting substrate to the heat transfer support metal plate is more efficiently transferred to the cooling body. Heat is dissipated.
  • the heat dissipation member is cooled by direct cooling to the cooling body, and a watertight sealing portion is provided between the heat dissipation member and the cooling body.
  • the heat transferred from the mounting substrate to the heat transfer supporting metal plate is efficiently radiated by the direct cooling heat radiating member and the cooling body.
  • the power converter device which concerns on 1 aspect of this invention WHEREIN: While the said heat radiating member was cooled by the said cooling body by indirect cooling, the heat-transfer member was arrange
  • the heat transfer member is grease having good thermal conductivity.
  • the heat transfer member made of grease having good heat conductivity increases the heat conductivity of the heat radiating member and the cooling body, so heat transfer from the mounting board to the heat transfer supporting metal plate. The generated heat is efficiently radiated by the heat radiating member and the cooling body.
  • the first heating element is easy to handle at the time of processing even when assembled to a processing machine, compared with a cooling body that is a large and heavy object. Can be planned. Further, even if the first and second heating elements and the heat transfer plate are unitized and transported separately from the cooling body, the unitized first heating element stores the heat transfer plate in the storage portion. Therefore, the deformation strength of the heat transfer plate can be improved.
  • the heat dissipation member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, so that the processing cost is reduced. be able to. Even if the heat dissipation member, mounting board and heat transfer plate, or heat transfer support metal plate are unitized in the semiconductor power module and transported separately from the cooling body, the unitized heat dissipation member is stored in the storage section. Since the heat transfer plate or the heat transfer support metal plate is accommodated, the deformation strength of the heat transfer plate or the heat transfer support metal plate by an external force can be improved.
  • FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • a cooling water supply source not shown
  • an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3.
  • a square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat dissipation member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a.
  • a direct cooling method in which a large number of cooling fins 17a are immersed in water is adopted.
  • the stepped portion 18 serves as a storage portion for storing the cooling body contact plate portions 32 c and 33 of the heat transfer supporting metal plates 32 and 33, which will be described later, on the outer periphery of the left and right lower surfaces of the heat dissipation member 13. Is formed.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25 a of the joint screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24, and this male screw portion 25 a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the cooling body contact plate portion 32 c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33 c of the heat transfer support metal plate 33 are provided on the left side and the right side of the heat dissipation member 13 described above. It is housed in a step 18 formed on the outer periphery of the lower surface.
  • the cooling body contact plate portions 32c and 33c housed in the stepped portion 18 have their lower surfaces 32c2 and 33c2 flush with the lower surface 13a as the joining surface of the heat dissipation member 13 with which the O-ring 7 contacts.
  • the distal end portion of the cooling body contact plate portion 33 c is in contact with the rising wall 18 a on the innermost peripheral side of the step portion 18.
  • the tip of the cooling body contact plate portion 32c is also in contact with the rising wall 18a on the innermost peripheral side of the step portion 18.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat dissipation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3. .
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 housed in the stepped portion 18 of the heat radiating member 13 are in close contact with the upper surface 3c as the joint surface of the cooling body 3.
  • the contact plate portions 32 c and 33 c are fixed between the heat radiating member 13 and the cooling body 3.
  • the O-ring 7 attached to the circumferential groove 6 around the immersion part 5 of the cooling body 3 is crushed by the lower surface 13a of the heat radiating member 13, and the cooling water accumulated in the immersion part 5 of the cooling body 3 leaks to the outside. A liquid tight seal is applied to prevent this.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
  • one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60.
  • the crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated, and have a thermal resistance. 5, the heat transferred to the heat transfer support metal plates 32 and 33 is stored in the step portion 18 and directly contacts the upper surface 3c of the cooling body 3 as shown in FIG. The heat is radiated from 32c, 33c to the cooling body 3.
  • corresponds to the heat radiating member 13
  • corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer.
  • the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13, and the cooling body. Since the lower surfaces 32c2 and 33c2 of the contact plate portions 32c and 33c are arranged in a state of being in close contact with the upper surface 3c of the cooling body 3 while being flush with the lower surface 13a as the joining surface of the heat radiating member 13 with which the O-ring 7 contacts.
  • the heat transferred from the control circuit board 22 and the power supply circuit board 23 to the heat transfer supporting metal plates 32 and 33 is radiated from the cooling body contact plate portions 32c and 33c to the cooling body 3, and the heat can be efficiently radiated. it can.
  • the heat radiating member 13 is easy to handle during processing even when assembled to a processing machine, the processing cost when forming the stepped portion 18 on the heat radiating member 13 is increased as compared with the cooling body 3 which is a large and heavy object. do not do. Therefore, the processing cost can be reduced by forming the stepped portion 18 only in the heat radiating member 13 without forming the portion for housing the cooling body contact plate portions 32c and 33c on the upper surface 3c that is the joint surface of the cooling body 3. Can be planned.
  • FIG. 6 shows a power module unit in which the drive circuit board 2, the control circuit unit U2, the power circuit unit U3, and the heat transfer supporting metal plates 32 and 33 are assembled to the power module 11 (case body 12, heat dissipation member 13).
  • This power module unit is separated from the cooling body 3 and is transported to a remote place such as an assembly factory.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 assembled in the power module unit are accommodated in the step portion 18 of the heat radiating member 13, and the cooling body contact plate portions 32c and 33c.
  • the front end of the step abuts against the innermost rising wall 18a of the step portion 18.
  • a direct cooling type power conversion device 1 in which a large number of cooling fins constituting the liquid contact portion 17 of the heat radiating member 13 are immersed in the cooling water of the immersion portion 5 provided in the cooling body 3.
  • the heat transfer supporting metal plate 32 of the present embodiment is applied to the indirect cooling type power converter 1 in which the heat radiating member 13 is indirectly cooled by the cooling water of the cooling body 3.
  • 33 can be provided with a structure in which the cooling body contact plate portions 32c and 33c are accommodated in the stepped portion 18 formed on the outer periphery of the lower surface of the heat radiating member 13.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists. 1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure according to the present invention is useful for reducing the processing cost and improving the deformation strength of the heat transfer plate during transportation. This is useful for reducing the cost and improving the deformation strength of the heat transfer plate or the heat transfer supporting metal plate during transportation.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Inverter Devices (AREA)

Abstract

L'invention porte sur un convertisseur d'énergie, lequel convertisseur réduit les coûts de fabrication, et permet une augmentation de la résistance à la déformation de tôles métalliques supportant un transfert de chaleur pendant le transport. Le convertisseur d'énergie comporte : un module d'alimentation à semi-conducteurs (11) sur lequel un élément de dissipation de chaleur (13) est formé sur une surface d'un boîtier (12) ; un corps de refroidissement (3) réuni à l'élément de dissipation de chaleur ; des plaques de montage (22, 23) sur lesquels des composants de circuit comprenant des composants de circuit générant de la chaleur sont montés ; et des tôles métalliques supportant un transfert de chaleur (32, 33), qui supportent les plaques de montage à une distance prescrite vis-à-vis du module d'alimentation à semi-conducteurs, et qui sont en contact avec le corps de refroidissement, de telle sorte que la chaleur émise à partir des plaques de montage vers le corps de refroidissement est dissipée sans passer à travers le boîtier. Une partie de réception (18), dans laquelle des tôles métalliques supportant un transfert de chaleur (32c, 33c) sont reçues, est formée sur le côté périphérique externe de la surface jointe de l'élément de dissipation de chaleur.
PCT/JP2013/003049 2012-08-03 2013-05-13 Structure de refroidissement et convertisseur d'énergie WO2014020806A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201380024912.6A CN104303412A (zh) 2012-08-03 2013-05-13 冷却构造体和电力转换装置
JP2014527954A JPWO2014020806A1 (ja) 2012-08-03 2013-05-13 冷却構造体及び電力変換装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012173140 2012-08-03
JP2012-173140 2012-08-03

Publications (1)

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WO2014020806A1 true WO2014020806A1 (fr) 2014-02-06

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CN (1) CN104303412A (fr)
WO (1) WO2014020806A1 (fr)

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JP2017060293A (ja) * 2015-09-16 2017-03-23 富士電機株式会社 電力変換装置
CN110731009A (zh) * 2017-06-28 2020-01-24 株式会社自动网络技术研究所 电路装置
US10867980B2 (en) 2018-10-15 2020-12-15 Fuji Electric Co., Ltd. Semiconductor equipment
JP2021158904A (ja) * 2020-03-30 2021-10-07 富士電機株式会社 電力変換装置
JPWO2022044093A1 (fr) * 2020-08-24 2022-03-03

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CN109154845A (zh) * 2016-05-16 2019-01-04 株式会社ExaScaler 液浸冷却用电子设备
JP7233026B2 (ja) * 2018-04-25 2023-03-06 パナソニックＩｐマネジメント株式会社 電源装置
CN110505785B (zh) 2018-05-17 2021-01-12 光宝电子(广州)有限公司 适用不同尺寸功率元件的功率转换器
TWI672880B (zh) * 2018-05-17 2019-09-21 大陸商光寶電子（廣州）有限公司 適用不同尺寸功率元件之功率轉換器
CN113273322A (zh) * 2019-01-18 2021-08-17 比泽尔电子股份公司 传热组件和电子功率设备

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JP2017060293A (ja) * 2015-09-16 2017-03-23 富士電機株式会社 電力変換装置
CN110731009A (zh) * 2017-06-28 2020-01-24 株式会社自动网络技术研究所 电路装置
CN110731009B (zh) * 2017-06-28 2023-08-01 株式会社自动网络技术研究所 电路装置
US10867980B2 (en) 2018-10-15 2020-12-15 Fuji Electric Co., Ltd. Semiconductor equipment
JP2021158904A (ja) * 2020-03-30 2021-10-07 富士電機株式会社 電力変換装置
JP7452184B2 (ja) 2020-03-30 2024-03-19 富士電機株式会社 電力変換装置
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JP7226640B2 (ja) 2020-08-24 2023-02-21 日産自動車株式会社 電力変換装置
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CN104303412A (zh) 2015-01-21

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