WO2014024361A1 - Cooling structure and power conversion device - Google Patents

Cooling structure and power conversion device Download PDF

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Publication number
WO2014024361A1
WO2014024361A1 PCT/JP2013/003048 JP2013003048W WO2014024361A1 WO 2014024361 A1 WO2014024361 A1 WO 2014024361A1 JP 2013003048 W JP2013003048 W JP 2013003048W WO 2014024361 A1 WO2014024361 A1 WO 2014024361A1
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WO
WIPO (PCT)
Prior art keywords
ring
heat
cooling body
heat transfer
circumferential groove
Prior art date
Application number
PCT/JP2013/003048
Other languages
French (fr)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP2014529253A priority Critical patent/JPWO2014024361A1/en
Priority to CN201380024913.0A priority patent/CN104303295A/en
Publication of WO2014024361A1 publication Critical patent/WO2014024361A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is arranged on the water cooling jacket for cooling.
  • a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
  • the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can provide a cooling structure, a heat radiating member, and cooling that can ensure a liquid-tight seal between the first heating element and the cooling body. It aims at providing the power converter device which can ensure the liquid-tight sealing between bodies.
  • a cooling structure includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element.
  • a heat transfer plate for transferring the heat of the two heating elements to the cooling body, and the first heating element has a liquid contact portion formed so as to protrude to the side joined to the cooling body,
  • the cooling body is formed so as to open on the side to be joined to the first heating element, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part.
  • the cross-sectional diameter of the O-ring is such that the O-ring is elastically deformed and the first heating element is in close contact with the O-ring, and the O-ring is elastically deformed. It was greater than the distance between the joint surface of the circumferential groove in close contact with.
  • the O-ring is in close contact with the joint surface between the first heating element and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
  • a power conversion device includes a semiconductor power module in which a heat dissipation member is formed on one surface, a cooling body joined to the heat dissipation member, and a heat generating circuit component that drives the semiconductor power module.
  • a heat transfer plate that transfers heat of the mounting board on which the circuit component is mounted to the cooling body, and the heat dissipation member has a liquid contact portion that protrudes toward the side to be joined to the cooling body.
  • the cooling body is formed so as to open on the side to be joined to the heat radiating member, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part.
  • the O-ring has a larger value than the distance between the joint surface of the circumferential groove in close contact while being elastically deformed. According to the power conversion device according to this aspect, the O-ring is in close contact with the joining surface of the heat radiating member and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • the cooling body is formed to open on the side to be joined to the heat radiating member, and is formed on the outer side of the immersion part, an immersion part for immersing the liquid contact part in the flowing coolant.
  • a circumferential groove on which an O-ring is mounted, and the heat dissipation member and the cooling body are joined to each other by sandwiching the metal plate for heat transfer support at a joint surface outside the circumferential groove.
  • the cross-sectional diameter was set to a value larger than the value obtained by adding the thickness of the heat transfer supporting metal plate and the depth of the circumferential groove.
  • the cross-sectional diameter of the O-ring is for heat transfer support. Since the value is larger than the sum of the thickness of the metal plate and the depth of the circumferential groove, the O-ring is in close contact with the heat sink and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount, and is liquid-tightly sealed. I do.
  • an O-ring holding protrusion that holds the O-ring is formed at an edge of the opening of the circumferential groove, and the O-ring holding protrusion is When the O-ring is brought into close contact with the joint surface of the heat dissipation member while being elastically deformed, a gap is provided between the O-ring and the joint surface.
  • the O-ring holding protrusion formed at the edge of the opening of the circumferential groove functions as a guide member for the O-ring that is crushed by the joining surface of the heat dissipation member and the cooling body.
  • the O-ring holding protrusion is formed on at least an outer peripheral edge of the opening of the peripheral groove. According to the cooling structure according to this aspect, since the cooling water sealing O-ring is disposed at a position close to the outer peripheral side of the circumferential groove, the O-ring holding protrusion is not provided with the cooling water sealing O-ring. Make sure to guide when crushing.
  • the height from the bottom of the circumferential groove to the top of the O-ring holding protrusion is set to a value larger than the radius of the O-ring. According to the cooling structure according to this aspect, it is difficult for the O-ring mounted in the circumferential groove to come out, and the circumferential groove installation state of the ring during assembly can be made favorable.
  • the height from the bottom of the circumferential groove to the joint surface of the heat dissipation member when the O-ring is in close contact with the joint surface of the heat dissipation member. Is set to the height when the O-ring is crushed with an allowable crushing rate.
  • the compression set and cracking of the O-ring 7 can be prevented by using the O-ring that is crushed at an allowable crushing rate.
  • the O-ring is in close contact with the joint surface of the first heating element and the cooling body while elastically deforming with an optimal crushing amount and performing liquid-tight sealing, thereby ensuring reliability.
  • High cooling structure can be obtained.
  • the O-ring is in close contact with the heat dissipation member and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing, so that reliability is ensured.
  • a high power conversion device can be provided.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3.
  • a square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6.
  • An O-ring holding projection 8 is formed on the periphery of the opening of the circumferential groove 6 so as to protrude upward from the other flat upper surface (reference numeral 3 c in FIG. 2) of the cooling body 3.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13 and the fixing member insertion holes 32 c 1 and 33 c 1 of the cooling body contact plate portions 32 c and 33 c, and the fixing screw 14 is formed in the cooling body 3. Screwed into the female thread portion.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11. Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a low resistance, as shown in FIG. 5, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
  • FIG. 6 shows the O-ring 7 in a free state, and the cross-sectional diameter is D.
  • FIG. 7 shows the liquid-tight sealing structure of the first embodiment.
  • the cross-sectional diameter D of the O-ring 7 of this embodiment is larger than the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 to which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed. Is set to a value.
  • the cross-sectional diameter D of the O-ring 7 is set such that the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 with which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed.
  • the liquid-tight sealing structure of the cooling liquid according to the present embodiment can ensure the reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1. Can be provided.
  • FIG. 8 shows a liquid-tight sealing structure of the second embodiment.
  • an inexpensive sheet metal member is used for the heat transfer supporting metal plates 32 and 33 of the power converter 1 described above for the purpose of low cost, and the heat transfer supporting metal plates 32 and 32 made of such a sheet metal member are used.
  • No. 33 has a variation of about ⁇ 10% in the plate thickness. If an O-ring having a predetermined cross-sectional diameter is selected without considering variations in the thickness of the cooling body contact plate portions 32c and 33c of the heat transfer support metal plates 32 and 33, the plate thickness of the heat transfer support metal plates 32 and 33 is selected.
  • the cross-sectional diameter D (see FIG. 6) of the O-ring 7 of the present embodiment includes the plate thickness T of the heat transfer support metal plate 33 that causes a variation of about ⁇ 10% and the depth L of the circumferential groove 6. It is set to a value larger than the added value. Further, the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7 (see FIG. 6). Further, an O-ring protrusion 8a is formed on the inner peripheral side of the opening of the circumferential groove 6 and an O-ring protrusion 8b is projected on the outer peripheral side of the opening of the circumferential groove 6 (height from the upper surface 3c of the cooling body 3).
  • the protrusion amount M of the O-ring protrusions 8a and 8b is elastically deformed while the O-ring 7 is in close contact between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6. Sometimes it projects to the extent that a gap is provided between the lower surface 13a.
  • the heat transfer support metal plate 33 has been described with reference to FIG. 8, the heat transfer support metal plate 32 has the same structure.
  • the cross-sectional diameter D of the O-ring 7 is a value obtained by adding the plate thickness T of the heat transfer supporting metal plates 32 and 33 that cause a variation of about ⁇ 10% and the depth L of the circumferential groove 6. Since the larger value is set, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the minus direction, the O-ring 7 is not excessively crushed by the bottom surface 6a and the bottom surface 13a, and is liquid-tightly sealed. In addition, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the plus direction, the O-ring 7 can be liquid-tightly sealed with an optimal crushing amount. Therefore, the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
  • the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7, it becomes difficult for the O-ring 7 mounted in the circumferential groove 6 to go out.
  • the ring 7 of the circumferential groove 6 can be installed well.
  • the O-ring 7 of the present embodiment for sealing the cooling water is disposed at a position close to the outer peripheral side of the circumferential groove 6, but the O-ring protrusion 8 b is at least on the outer peripheral side of the opening of the circumferential groove 6.
  • This O-ring protrusion 8b is formed so as to make the O-ring 7 installed in the circumferential groove 6 in the middle of assembling good, and when the O-ring 7 is crushed, it can be used as a crushing guide. Function.
  • FIG. 9 shows a liquid-tight sealing structure of the coolant according to the third embodiment.
  • the recommended value of the allowable crushing rate of the O-ring 7 ((cross-sectional diameter in the free state ⁇ cross-sectional diameter in the assembled state) / cross-sectional diameter in the free state) is generally 8% or more and 30% or less. Therefore, in the O-ring 7 of the present embodiment, the distance F2 between the lower surface 13a of the heat radiating member 13 that the O-ring 7 attached to the circumferential groove 6 contacts and the bottom surface 6a of the circumferential groove 6 has an allowable crushing rate (8%). More than 30%) is selected as the dimensions when squeezed.
  • the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
  • corresponds to the heat radiating member 13
  • corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer.
  • the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
  • the control circuit unit U2 and the power supply circuit unit U3 shown in FIGS. 1 and 2 the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power supply circuit board 23 has been described.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.
  • the heating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back side by the control circuit board 22 and the power circuit board 23 has been described.
  • the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure according to the present invention is useful for securing a liquid-tight seal between the first heating element and the cooling body
  • the power conversion device according to the present invention includes the heat dissipation member and the cooling member. Useful for ensuring a fluid tight seal with the body.
  • SYMBOLS 1 Power converter device, 2 ... Housing
  • Case body 13 ... Radiation member, 14 ... Fixing screw, 15 ... Insertion hole, 16 ... Substrate fixing
  • Cooling body contact plate, 32c1, 33c1 Fixed member insertion hole, 32i ... Insertion hole 33a ... Heat transfer support plate portion, 33b ... Heat transfer support side plate portion, 33c ... Cooling body contact plate portion, 33i ... Insertion hole, 35 ... Heat transfer member, 37 ... Heat transfer member, 39 ... Heat generation circuit component, 42 ... Insulating sheet, 43 ... Insulating sheet, 51 ... Fixing screw, 52 ... Connection cord, 53, 59 ... Crimp terminal, 55 ... Bus bar, 57 ... Current sensor, 58 ... Motor connection cable, 60 ... Fixing screw

Abstract

This power conversion device is equipped with: a semiconductor power module (11) in which a heat dissipation member (13) is formed on one surface of a case body; a cooling body (3) that is joined to the heat dissipation member; mounting boards (22, 23) that include heat-generating circuit components; and heat-transmitting metal support plates (32, 33) for supporting the mounting boards at prescribed gaps from the semiconductor power module. The heat dissipation member is provided with a protruding liquid-contact section (17) that is formed on the side joined to the cooling body, and the cooling body is provided with an immersion section (5) for immersing the liquid-contact section in a coolant and a circumferential groove (6) that is formed on the outer side of the immersion section and has an O-ring fitted therein. The heat dissipation member and the cooling body sandwich the heat-transmitting metal support plates with the joining surfaces located on the outer side of the circumferential groove. The cross-sectional diameter of the O-ring is set to a value larger than the value of the thickness of the heat-transmitting metal support plates and the depth of the circumferential groove combined.

Description

冷却構造体及び電力変換装置Cooling structure and power conversion device
　本発明は、発熱体の熱を冷却する冷却構造体と、電力変換用の半導体スイッチング素子を内蔵したモジュール上に、所定間隔を保って上記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持するようにした電力変換装置に関する。 The present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion. The present invention relates to a power conversion device that supports a mounted substrate.
　この種の電力変換装置としては、特許文献１に記載された電力変換装置が知られている。
　この電力変換装置は、筐体内に、冷却液が通過する水冷ジャケットを配置し、この水冷ジャケット上に電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵したパワーモジュールを配置して冷却するようにしている。また、筐体内には、パワーモジュールの水冷ジャケットとは反対側に所定距離を保って制御回路基板を配置し、この制御回路基板で発生する熱を、放熱部材を介して制御回路基板を支持する金属ベース板に伝達し、さらに金属ベース板に伝達された熱を、この金属ベース板を支持する筐体の側壁を介して水冷ジャケットに伝達するようにしている。 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
In this power conversion device, a water cooling jacket through which a coolant passes is arranged in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is arranged on the water cooling jacket for cooling. Yes. In addition, a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.
　上記特許文献１に記載された従来例にあっては、制御回路基板で発生する熱を、制御回路基板→放熱部材→金属ベース板→筐体→水冷ジャケットという経路で放熱するようにしている。このため、筐体が伝熱経路の一部として利用されることにより、筐体にも良好な伝熱性が要求されることになり、材料が熱伝導率の高い金属に限定され、小型軽量化の要求される電力変換装置おいて、樹脂等の軽量な材料の選択が不可能となり軽量化が困難となるおそれがある。
　そこで、制御回路基板などの発熱体で発生する熱を、筐体を介在させず、金属ベース板の端部をパワーモジュールと水冷ジャケットとの間で挟持することで、発熱体の熱を効率よく水冷ジャケットに放熱する構造が考えられる。 In the conventional example described in Patent Document 1, heat generated in the control circuit board is radiated through a path of the control circuit board → the heat radiation member → the metal base plate → the housing → the water cooling jacket. For this reason, when the casing is used as a part of the heat transfer path, the casing is also required to have good heat transfer properties, and the material is limited to a metal with high thermal conductivity, which is reduced in size and weight. In a power conversion device that is required, it is difficult to select a lightweight material such as a resin and it may be difficult to reduce the weight.
Therefore, the heat generated by the heating element such as the control circuit board is efficiently sandwiched between the power module and the water cooling jacket without interposing the housing, so that the heat of the heating element can be efficiently obtained. A structure that dissipates heat to the water-cooled jacket can be considered.
特開２０１０－３５３４６号JP 2010-35346 A
　ところで、パワーモジュールの一部を、水冷ジャケットを通過する冷却液に直接接触させて冷却する直接冷却方式を採用すると、パワーモジュールと水冷ジャケットとの間にＯリングが装着されるが、Ｏリングのつぶし量が変化すると、パワーモジュールと水冷ジャケットとの間の液密封止が低下するおそれがある。
　本発明は、上記従来例の未解決の課題に着目してなされたものであり、第１の発熱体及び冷却体の間の液密封止を確保することができる冷却構造体と放熱部材及び冷却体との間の液密封止を確保することができる電力変換装置を提供することを目的としている。 By the way, when a direct cooling method is adopted in which a part of the power module is cooled by directly contacting the coolant passing through the water cooling jacket, an O-ring is mounted between the power module and the water cooling jacket. If the crushing amount changes, the liquid-tight seal between the power module and the water cooling jacket may be reduced.
The present invention has been made paying attention to the unsolved problems of the above-described conventional example, and can provide a cooling structure, a heat radiating member, and cooling that can ensure a liquid-tight seal between the first heating element and the cooling body. It aims at providing the power converter device which can ensure the liquid-tight sealing between bodies.
　上記目的を達成するために、本発明の一態様に係る冷却構造体は、第１の発熱体と、前記第１の発熱体に接合される冷却体と、第２の発熱体と、前記第２の発熱体の熱を前記冷却体に伝熱させる伝熱板と、を備え、前記第１の発熱体は、前記冷却体に接合する側に突出して形成された接液部を有し、前記冷却体は、前記第１の発熱体に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の開口を囲むように形成されてＯリングを装着した周溝と、を設け、前記第１の発熱体及び前記冷却体は、前記周溝より外周側の互いの平坦な接合面で前記伝熱板を挟持して接合され、前記Ｏリングの断面直径は、前記Ｏリングが弾性変形しながら密着する前記第１の発熱体の接合面と、前記Ｏリングが弾性変形しながら密着する前記周溝の接合面との間の距離より大きな値とした。
　この一態様に係る冷却構造体によると、Ｏリングが、第１の発熱体及び冷却体の接合面に最適な押し潰し量で弾性変形しながら密着して液密封止を行う。 In order to achieve the above object, a cooling structure according to an aspect of the present invention includes a first heating element, a cooling body joined to the first heating element, a second heating element, and the first heating element. A heat transfer plate for transferring the heat of the two heating elements to the cooling body, and the first heating element has a liquid contact portion formed so as to protrude to the side joined to the cooling body, The cooling body is formed so as to open on the side to be joined to the first heating element, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part. A circumferential groove on which an O-ring is mounted, and the first heating element and the cooling body are joined by sandwiching the heat transfer plate at a flat joining surface on the outer peripheral side of the circumferential groove, The cross-sectional diameter of the O-ring is such that the O-ring is elastically deformed and the first heating element is in close contact with the O-ring, and the O-ring is elastically deformed. It was greater than the distance between the joint surface of the circumferential groove in close contact with.
According to the cooling structure according to this aspect, the O-ring is in close contact with the joint surface between the first heating element and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
　また、本発明の一態様に係る電力変換装置は、一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体パワーモジュールを駆動する発熱回路部品を含む回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板と、を備え、前記放熱部材は、前記冷却体に接合する側に突出して形成された接液部を有し、前記冷却体は、前記放熱部材に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の開口を囲むように形成されてＯリングを装着した周溝と、を設け、前記放熱部材及び前記冷却体は、前記周溝より外周側の互いの接合面で前記伝熱板を挟持して接合され、前記Ｏリングの断面直径は、前記Ｏリングが弾性変形しながら密着する前記放熱部材の接合面と、前記Ｏリングが弾性変形しながら密着する前記周溝の接合面との間の距離より大きな値とした。
　この一態様に係る電力変換装置によると、Ｏリングが、放熱部材及び冷却体の接合面に最適な押し潰し量で弾性変形しながら密着して液密封止を行う。 In addition, a power conversion device according to an aspect of the present invention includes a semiconductor power module in which a heat dissipation member is formed on one surface, a cooling body joined to the heat dissipation member, and a heat generating circuit component that drives the semiconductor power module. A heat transfer plate that transfers heat of the mounting board on which the circuit component is mounted to the cooling body, and the heat dissipation member has a liquid contact portion that protrudes toward the side to be joined to the cooling body. The cooling body is formed so as to open on the side to be joined to the heat radiating member, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part. A circumferential groove on which a ring is mounted, and the heat dissipating member and the cooling body are joined by sandwiching the heat transfer plate at the joint surfaces on the outer peripheral side of the circumferential groove, and the cross-sectional diameter of the O-ring is Before the O-ring comes into close contact with elastic deformation And bonding surface of the heat radiating member, the O-ring has a larger value than the distance between the joint surface of the circumferential groove in close contact while being elastically deformed.
According to the power conversion device according to this aspect, the O-ring is in close contact with the joining surface of the heat radiating member and the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing.
　また、本発明の一態様に係る電力変換装置は、電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板と、を備え、前記放熱部材は、前記冷却体に接合する側に接液部が突出して形成され、前記冷却体は、前記放熱部材に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の外側に形成されてＯリングを装着した周溝と、を設け、前記放熱部材及び前記冷却体は、前記周溝より外側の互いの接合面で前記伝熱支持用金属板を挟持して接合され、前記Ｏリングの断面直径は、伝熱支持用金属板の厚みと前記周溝の深さとを足した値より大きな値とした。 The power conversion device according to an aspect of the present invention includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member is bonded to the heat dissipation member. And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board. A heat transfer supporting metal plate that contacts the cooling body so as to dissipate the heat generated by the cooling body without passing through a housing, and the heat radiating member has a liquid contact portion on the side to be joined to the cooling body The cooling body is formed to open on the side to be joined to the heat radiating member, and is formed on the outer side of the immersion part, an immersion part for immersing the liquid contact part in the flowing coolant. A circumferential groove on which an O-ring is mounted, and the heat dissipation member and the cooling body are joined to each other by sandwiching the metal plate for heat transfer support at a joint surface outside the circumferential groove. The cross-sectional diameter was set to a value larger than the value obtained by adding the thickness of the heat transfer supporting metal plate and the depth of the circumferential groove.
　この一態様に係る電力変換装置によると、放熱部材及び冷却体の間で挟持している伝熱支持用金属板の板厚にばらつきが生じても、Ｏリングの断面直径が、伝熱支持用金属板の厚みと周溝の深さとを足した値より大きな値としているので、Ｏリングが、放熱部材及び冷却体の接合面に最適な押し潰し量で弾性変形しながら密着して液密封止を行う。 According to the power converter according to this aspect, even if the thickness of the metal plate for heat transfer support sandwiched between the heat radiating member and the cooling body varies, the cross-sectional diameter of the O-ring is for heat transfer support. Since the value is larger than the sum of the thickness of the metal plate and the depth of the circumferential groove, the O-ring is in close contact with the heat sink and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount, and is liquid-tightly sealed. I do.
　また、本発明の一態様に係る電力変換装置は、前記周溝の開口部の縁部に、前記Ｏリングを保持するＯリング保持用突起が形成されており、当該Ｏリング保持用突起は、前記Ｏリングが前記放熱部材の接合面に弾性変形しながら密着するときに前記接合面との間に隙間を設けるようにした。
　この一態様に係る電力変換装置によると、周溝の開口部の縁部に形成したＯリング保持用突起は、放熱部材及び冷却体の接合面に押しつぶされるＯリングのガイド部材として機能する。 Further, in the power conversion device according to one aspect of the present invention, an O-ring holding protrusion that holds the O-ring is formed at an edge of the opening of the circumferential groove, and the O-ring holding protrusion is When the O-ring is brought into close contact with the joint surface of the heat dissipation member while being elastically deformed, a gap is provided between the O-ring and the joint surface.
According to the power conversion device according to this aspect, the O-ring holding protrusion formed at the edge of the opening of the circumferential groove functions as a guide member for the O-ring that is crushed by the joining surface of the heat dissipation member and the cooling body.
　また、本発明の一態様に係る電力変換装置は、前記Ｏリング保持用突起が、前記周溝の開口部の少なくとも外周側の縁部に形成されている。
　この一態様に係る冷却構造体によると、冷却水封止用Ｏリングは、周溝の外周側に寄った位置に配置されるので、Ｏリング保持用突起は、冷却水封止用Ｏリングが押しつぶされる際のガイドを確実に行う。 In the power conversion device according to one aspect of the present invention, the O-ring holding protrusion is formed on at least an outer peripheral edge of the opening of the peripheral groove.
According to the cooling structure according to this aspect, since the cooling water sealing O-ring is disposed at a position close to the outer peripheral side of the circumferential groove, the O-ring holding protrusion is not provided with the cooling water sealing O-ring. Make sure to guide when crushing.
　さらに、本発明の一態様に係る電力変換装置は、前記周溝の底からＯリング保持用突起の頂部までの高さが、前記Ｏリングの半径より大きな値に設定されている。
　この一態様に係る冷却構造体によると、周溝内に装着したＯリングが外に出にくくなり、組み立ての途中のリングの周溝据え付け状態を良好とすることができる。 Furthermore, in the power converter according to one aspect of the present invention, the height from the bottom of the circumferential groove to the top of the O-ring holding protrusion is set to a value larger than the radius of the O-ring.
According to the cooling structure according to this aspect, it is difficult for the O-ring mounted in the circumferential groove to come out, and the circumferential groove installation state of the ring during assembly can be made favorable.
　さらにまた、本発明の一態様に係る電力変換装置は、前記Ｏリングが前記放熱部材の前記接合面に密着しているときの前記周溝の底から前記放熱部材の前記接合面までの高さが、前記Ｏリングを許容つぶし率でつぶしたときの高さに設定されている。
　この一態様に係る冷却構造体によると、許容つぶし率で押しつぶれるＯリングを使用したことで、Ｏリング７の圧縮永久ひずみ、圧縮割れを防止することができる。 Furthermore, in the power conversion device according to one aspect of the present invention, the height from the bottom of the circumferential groove to the joint surface of the heat dissipation member when the O-ring is in close contact with the joint surface of the heat dissipation member. Is set to the height when the O-ring is crushed with an allowable crushing rate.
According to the cooling structure according to this aspect, the compression set and cracking of the O-ring 7 can be prevented by using the O-ring that is crushed at an allowable crushing rate.
　本発明に係る冷却構造体によれば、Ｏリングが、第１の発熱体及び冷却体の接合面に最適な押し潰し量で弾性変形しながら密着して液密封止を行うことで、信頼性の高い冷却構造体を得ることができる。
　また、本発明に係る電力変換装置によれば、Ｏリングが、放熱部材及び冷却体の接合面に最適な押し潰し量で弾性変形しながら密着して液密封止を行うことで、信頼性の高い電力変換装置を提供することができる。 According to the cooling structure according to the present invention, the O-ring is in close contact with the joint surface of the first heating element and the cooling body while elastically deforming with an optimal crushing amount and performing liquid-tight sealing, thereby ensuring reliability. High cooling structure can be obtained.
In addition, according to the power conversion device of the present invention, the O-ring is in close contact with the heat dissipation member and the joint surface of the cooling body while being elastically deformed with an optimal crushing amount to perform liquid-tight sealing, so that reliability is ensured. A high power conversion device can be provided.
本発明に係る電力変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the power converter device which concerns on this invention. 図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 電力変換装置の放熱部材と冷却体との間で伝熱支持用金属板が挟持されている状態を示す断面図である。It is sectional drawing which shows the state by which the metal plate for heat-transfer support is clamped between the heat radiating member and cooling body of a power converter device. 伝熱支持用金属板を示す側面図である。It is a side view which shows the metal plate for heat transfer support. 発熱回路部品の全体の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the whole heat generating circuit components. 本発明で使用されているＯリングの断面を示す図である。It is a figure which shows the cross section of the O-ring used by this invention. 本発明に係る第１実施形態の液密封止構造を示す図である。It is a figure which shows the liquid-tight sealing structure of 1st Embodiment which concerns on this invention. 本発明に係る第２実施形態の液密封止構造を示す図である。It is a figure which shows the liquid-tight sealing structure of 2nd Embodiment which concerns on this invention. 本発明に係る第３実施形態の液密封止構造を示す図である。It is a figure which shows the liquid-tight sealing structure of 3rd Embodiment which concerns on this invention.
　以下、本発明を実施するための形態（以下、実施形態という。）を、図面を参照しながら詳細に説明する。
　図１は本発明の全体構成を示す断面図であり、図２は、図１の要部を拡大して示した図である。
　図１の符号１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、水冷ジャケットの構成を有する冷却体３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。 DESCRIPTION OF EMBODIMENTS Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of the present invention, and FIG. 2 is an enlarged view of the main part of FIG.
Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
　下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が冷却体３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
　上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が冷却体３で閉塞されている。
　この角筒体２ａの下端と冷却体３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。 The lower housing 2A is a bottomed rectangular tube. The lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3.
Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
　冷却体３は、例えば熱伝導率の高いアルミニウム、アルミニウム合金を射出成形して形成されており、下面は平坦面とされ、冷却水の給水口３ａ及び排水口３ｂが筐体２の外方に開口されている。これら給水口３ａ及び排水口３ｂは例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。
　図３にも示すように、冷却体３の上面中央には、給水口３ａ及び排水口３ｂに連通する四角形状に開口する浸漬部５が形成され、この浸漬部５の上面開口部の周縁に、四角枠状の周溝６が形成され、この周溝６にＯリング７が装着されている。そして、周溝６の開口部の周縁に、冷却体３の他の平坦な上面（図２の符号３ｃ）より上方に突出するＯリング保持用突起８が形成されている。 The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open. The water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
As shown in FIG. 3, an immersion part 5 that opens in a square shape communicating with the water supply port 3 a and the drainage port 3 b is formed at the center of the upper surface of the cooling body 3. A square frame-shaped circumferential groove 6 is formed, and an O-ring 7 is attached to the circumferential groove 6. An O-ring holding projection 8 is formed on the periphery of the opening of the circumferential groove 6 so as to protrude upward from the other flat upper surface (reference numeral 3 c in FIG. 2) of the cooling body 3.
　また、図１に戻って、冷却体３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｅが形成されている。
　電力変換装置１は、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵したパワーモジュール１１を備えている。このパワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に金属製の放熱部材１３が形成されている。 Returning to FIG. 1, the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 </ b> A are inserted vertically.
The power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion. The power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
　放熱部材１３の下面中央部には、冷却体３の浸漬部５に入り込む接液部１７が形成されている。この接液部１７は、放熱部材１３の下面から互いに均等の間隔をあけながら所定長さで突出している多数の冷却フィン１７ａで構成されており、給水口３ａから浸漬部５に流れ込んできた冷却水に、多数の冷却フィン１７ａが浸されるようになっている。
　ケース体１２及び放熱部材１３には平面からみて四隅に固定ねじ１４を挿通する挿通孔１５が形成されている。また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。 A liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13. The liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
The case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners when viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
　図２に示すように、基板固定部１６の上端に、パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。さらに、制御回路基板２２の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴに電源を供給する発熱回路部品を含む電源回路等を実装した実装基板としての電源回路基板２３が固定されている。 As shown in FIG. 2, a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16. In addition, a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval. A control circuit board 22 as a board is fixed. Further, a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
　そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
　また、制御回路基板２２は継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に継ぎねじ２５の雄ねじ部２５ａを挿通し、この雄ねじ部２５ａを継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。 Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
　さらに、電源回路基板２３は継ぎねじ２５の上端に形成した雌ねじ部２５ｂに対向する位置に形成した挿通孔２３ａ内に固定ねじ２６を挿通し、この固定ねじ２６を継ぎねじ２５の雌ねじ部２５ｂに螺合することにより固定されている。
　また、制御回路基板２２及び電源回路基板２３は、伝熱支持用金属板３２，３３によって筐体２を介することなく冷却体３への放熱経路を独自に形成するように支持されている。これら伝熱支持用金属板３２及び３３は、熱伝導率が高い金属板例えばアルミニウム又はアルミニウム合金製の金属板で形成されている。 Further, the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
Further, the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2. These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
　伝熱支持用金属板３２は、平板形状の伝熱支持板部３２ａと、この伝熱支持板部３２ａの右側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３２ｂと、伝熱支持側板部３２ｂの下端部から左側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３２ｃとを一体に備えた部品である。
　伝熱支持板部３２ａには、伝熱部材３５を介して制御回路基板２２が固定ねじ３６によって固定される。伝熱部材３５は、伸縮性を有する弾性体で電源回路基板２３と同じ外形寸法に構成されている。この伝熱部材３５としては、シリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。 The heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
The control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
　また、伝熱支持用金属板３３は、平板形状の伝熱支持板部３３ａと、この伝熱支持板部３３ａの左側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３３ｂと、伝熱支持側板部３３ｂの下端部から右側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３３ｃとを一体に備えた部品である。
　伝熱支持板部３３ａには、前述した伝熱部材３５と同様の伝熱部材３７を介して電源回路基板２３が固定ねじ３８によって固定される。 Further, the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13. The support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
The power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
　これら伝熱支持用金属板３２，３３を一体部品とすることで、熱抵抗を小さくしてより効率の良い放熱を行うことができる。また、伝熱支持用金属板３２の伝熱支持板部３２ａと伝熱支持側板部３２ｂとの連結部及び伝熱支持側板部３２ｂと冷却体接触板部３２ｃとの連結部とを湾曲部とし、伝熱支持用金属板３３の伝熱支持板部３３ａと伝熱支持側板部３３ｂとの連結部及び伝熱支持側板部３３ｂと冷却体接触板部３３ｃとの連結部とを湾曲部とすることで、電力変換装置１に伝達される上下振動や横揺れ等に対する耐振動性を向上することができる。 By using these heat transfer supporting metal plates 32 and 33 as an integral part, it is possible to reduce heat resistance and perform more efficient heat dissipation. Further, the connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions. The connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions. Thus, it is possible to improve the vibration resistance against the vertical vibration and roll transmitted to the power conversion device 1.
　図３に示すように、電源回路基板２３には、発熱回路部品３９が下面側に実装されており、電源回路基板２３、伝熱部材３７及び伝熱支持板部３３ａが、固定ねじ３８により積層状態で固定されており、伝熱支持板部３３ａの下面には、絶縁距離を短くするために絶縁シート４３が貼着されている。なお、これらの積層状態の部品を電源回路ユニットＵ３と称する。 As shown in FIG. 3, a heat generating circuit component 39 is mounted on the lower surface side of the power supply circuit board 23, and the power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are laminated by a fixing screw 38. The insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
　この際、電源回路基板２３の下面側に実装された発熱回路部品３９が伝熱部材３７の弾性によって伝熱部材３７内に埋め込まれる。このため、発熱回路部品３９と伝熱部材３７との接触が過不足なく行われるとともに、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの接触が良好に行われ、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの間の熱抵抗を減少させることができる。 At this time, the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
　また、図示しないが、制御回路基板２２の下面側にも発熱回路部品が実装されており、制御回路基板２２、伝熱部材３５及び伝熱支持板部３２ａが、固定ねじ３６により積層状態で固定されており、伝熱支持板部３２ａの下面には、絶縁距離を短くするために絶縁シート４２が貼着されている。なお、これらの積層状態の部品を制御回路ユニットＵ２と称する。 Although not shown, a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36. An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
　そして、制御回路基板２２の下面側に実装された発熱回路部品が伝熱部材３５の弾性によって伝熱部材３５内に埋め込まれ、制御回路基板２２と伝熱部材３５との接触が過不足なく行われるとともに、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの接触が良好に行われ、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの間の熱抵抗を減少させることができる。 Then, the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency. In addition, the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
　また、伝熱支持用金属板の伝熱支持側板部３３ｂには、図４に示すように、パワーモジュール１１の図１に示す３相交流出力端子１１ｂに対応する位置に後述するブスバー５５を挿通する例えば方形の３つの挿通孔３３ｉが形成されている。このように、３つの挿通孔３３ｉを形成することにより、隣接する挿通孔３３ｉ間に比較的幅広の伝熱路Ｌｈを形成することができ、全体の伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。 Further, as shown in FIG. 4, a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG. For example, three rectangular insertion holes 33i are formed. Thus, by forming the three insertion holes 33i, a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
　同様に、伝熱支持用金属板３２の伝熱支持側板部３２ｂにも、パワーモジュール１１の正極及び負極端子１１ａに対向する位置にそれぞれ同様の挿通孔３２ｉが形成されている。この挿通孔３２ｉを形成することにより、上述した挿通孔３３ｉと同様の作用効果を得ることができる。
　また、伝熱支持用金属板３２の冷却体接触板部３２ｃ及び伝熱支持用金属板３３の冷却体接触板部３３ｃには、図２に示すように、パワーモジュール１１の固定ねじ１４を挿通する挿通孔１５に対向する位置に固定部材挿通孔３２ｃ１，３３ｃ１が形成されている。 Similarly, in the heat transfer support side plate portion 32b of the heat transfer support metal plate 32, similar insertion holes 32i are formed at positions facing the positive electrode and the negative electrode terminal 11a of the power module 11, respectively. By forming the insertion hole 32i, the same effect as that of the insertion hole 33i described above can be obtained.
Further, as shown in FIG. 2, the fixing screw 14 of the power module 11 is inserted into the cooling body contact plate portion 32c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33c of the heat transfer support metal plate 33. Fixing member insertion holes 32c1 and 33c1 are formed at positions facing the insertion holes 15 to be formed.
　そして、図２に示すように、放熱部材１３の挿通孔１５及び冷却体接触板部３２ｃ，３３ｃの固定部材挿通孔３２ｃ１，３３ｃ１に固定ねじ１４を挿通し、固定ねじ１４を冷却体３に形成した雌ねじ部に螺合させる。
　これにより、伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃを、パワーモジュール１１の放熱部材１３の下面１３ａと冷却体３の上面３ｃとに当接し、放熱部材１３及び冷却体３で挟持して固定する。
　この際、冷却体３の浸漬部５の周囲の周溝６に装着したＯリング７が放熱部材１３の下面１３ａに押しつぶされ、冷却体３の浸漬部５に溜まった冷却水が外部に漏れるのを防止する液密封止が施されている。 Then, as shown in FIG. 2, the fixing screw 14 is inserted into the insertion hole 15 of the heat radiating member 13 and the fixing member insertion holes 32 c 1 and 33 c 1 of the cooling body contact plate portions 32 c and 33 c, and the fixing screw 14 is formed in the cooling body 3. Screwed into the female thread portion.
As a result, the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
At this time, the O-ring 7 attached to the circumferential groove 6 around the immersion part 5 of the cooling body 3 is crushed by the lower surface 13a of the heat radiating member 13, and the cooling water accumulated in the immersion part 5 of the cooling body 3 leaks to the outside. The liquid-tight seal | sticker which prevents that is given.
　また、図１に示すように、パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５５が接続され、ブスバー５５の他端に冷却体３を貫通するフィルムコンデンサ４の正負の電極４ａが固定ねじ５１で連結されている。また、パワーモジュール１１の負極端子１１ａに、外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３が固定されている。
　さらに、パワーモジュール１１の３相交流出力端子１１ｂに、ブスバー５５の一端を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７が配置されている。そして、ブスバー５５の他端に圧着端子５９が固定ねじ６０で接続されている。圧着端子５９は、外部の３相電動モータ（図示せず）に接続したモータ接続ケーブル５８に固定されている。 Further, as shown in FIG. 1, a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
Further, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
　この状態で、外部のコンバータ（図示せず）から直流電力を供給するとともに、電源回路基板２３に実装された電源回路、制御回路基板２２に実装された制御回路を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介してパワーモジュール１１に供給する。これによって、パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介してモータ接続ケーブル５８に供給し、３相電動モータ（図示せず）を駆動制御する。 In this state, DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state. A gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
　このとき、パワーモジュール１１に内蔵されたＩＧＢＴで発熱するが、パワーモジュール１１の放熱部材１３の下面中央部に設けた接液部１７が冷却体３に設けた浸漬部５に入り込んで冷却液に浸漬されているので、パワーモジュール１１は効率良く冷却される。
　一方、制御回路基板２２及び電源回路基板２３に実装されている制御回路及び電源回路には発熱回路部品３９が含まれており、これら発熱回路部品３９で発熱を生じる。このとき、発熱回路部品３９は制御回路基板２２及び電源回路基板２３の下面側に実装されている。 At this time, the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
　そして、これら制御回路基板２２及び電源回路基板２３の下面側には、熱伝導率が高く弾性を有する伝熱部材３５及び３７を介して伝熱支持用金属板３２，３３の伝熱支持板部３２ａ，３３ａが設けられている。伝熱支持用金属板３２，３３は、伝熱支持板部３２ａ，３３ａと、伝熱支持側板部３２ｂ，３３ｂと、冷却体接触板部３２ｃ，３３ｃとを一体化した部品であって、熱抵抗が小さい部材なので、図５に示すように、伝熱支持用金属板３２，３３に伝達された熱は、冷却体３の上面３ｃに直接接触した冷却体接触板部３２ｃ，３３ｃから冷却体３に放熱され、効率の良い放熱を行うことができる。
　ここで、図６は、自由状態のＯリング７を示すものであり、断面直径がＤである。 And on the lower surface side of these control circuit board 22 and power supply circuit board 23, heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided. The heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a low resistance, as shown in FIG. 5, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
Here, FIG. 6 shows the O-ring 7 in a free state, and the cross-sectional diameter is D.
　次に、図７は、第１実施形態の液密封止構造である。
　本実施形態のＯリング７の断面直径Ｄは、周溝６に装着したＯリング７が弾性変形しながら密着する放熱部材１３の下面１３ａと周溝６の底面６ａとの間の距離Ｆ１より大きな値に設定されている。
　本実施形態によると、Ｏリング７の断面直径Ｄを、周溝６に装着したＯリング７が弾性変形しながら密着する放熱部材１３の下面１３ａと周溝６の底面６ａとの間の距離Ｆ１より大きな値に設定したので、Ｏリング７は最適な押しつぶし量で弾性変形する。
　したがって、本実施形態の冷却液の液密封止構造は、冷却体３の浸漬部５に溜まっている冷却水の確実な液密封止を確保することができ、信頼性の高い電力変換装置１を提供することができる。 Next, FIG. 7 shows the liquid-tight sealing structure of the first embodiment.
The cross-sectional diameter D of the O-ring 7 of this embodiment is larger than the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 to which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed. Is set to a value.
According to the present embodiment, the cross-sectional diameter D of the O-ring 7 is set such that the distance F1 between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6 with which the O-ring 7 attached to the circumferential groove 6 comes into close contact while being elastically deformed. Since the larger value is set, the O-ring 7 is elastically deformed with an optimal crushing amount.
Therefore, the liquid-tight sealing structure of the cooling liquid according to the present embodiment can ensure the reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1. Can be provided.
　次に、図８は、第２実施形態の液密封止構造である。
　上述した電力変換装置１の伝熱支持用金属板３２，３３は、一般に、低コストを目的として安価な板金部材が使用されており、このような板金部材からなる伝熱支持用金属板３２，３３は、板厚に±１０％程度の範囲のばらつきがある。
　伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃの板厚のばらつきを考慮せずに所定断面直径のＯリングを選択すると、伝熱支持用金属板３２，３３の板厚が薄い（マイナス方向のばらつきがある）場合には、Ｏリングが周溝６の底面６ａと放熱部材１３の下面１３ａとに過度に押しつぶされ、Ｏリングの圧縮永久ひずみや圧縮割れにより液密封止が不可能となるおそれがある。逆に、伝熱支持用金属板３２，３３の板厚が厚い（プラス方向のばらつきがある）場合には、Ｏリングが周溝６の底面６ａと放熱部材１３の下面１３ａとによる押しつぶし量が低下し、十分な液密封止が行われないおそれがある。 Next, FIG. 8 shows a liquid-tight sealing structure of the second embodiment.
In general, an inexpensive sheet metal member is used for the heat transfer supporting metal plates 32 and 33 of the power converter 1 described above for the purpose of low cost, and the heat transfer supporting metal plates 32 and 32 made of such a sheet metal member are used. No. 33 has a variation of about ± 10% in the plate thickness.
If an O-ring having a predetermined cross-sectional diameter is selected without considering variations in the thickness of the cooling body contact plate portions 32c and 33c of the heat transfer support metal plates 32 and 33, the plate thickness of the heat transfer support metal plates 32 and 33 is selected. Is thin (there is a variation in the minus direction), the O-ring is excessively crushed by the bottom surface 6a of the circumferential groove 6 and the lower surface 13a of the heat radiating member 13, and liquid-tight sealing is caused by compression set or compression cracking of the O-ring. May not be possible. On the contrary, when the thickness of the heat transfer supporting metal plates 32 and 33 is thick (there is variation in the plus direction), the O-ring is crushed by the bottom surface 6a of the circumferential groove 6 and the lower surface 13a of the heat radiating member 13. There is a risk that sufficient liquid-tight sealing may not be performed.
　そこで、本実施形態のＯリング７の断面直径Ｄ（図６参照）は、±１０％程度のばらつきを生じる伝熱支持用金属板３３の板厚Ｔと、周溝６の深さＬとを足した値より大きな値に設定されている。
　また、周溝６の深さＬは、Ｏリング７の半径Ｒ（図６参照）より大きな値に設定されている。
　また、周溝６の開口部の内周側にＯリング用突起８ａ、周溝６の開口部の外周側にＯリング用突起８ｂが突出量Ｍ（冷却体３の上面３ｃからの高さ）で突出して形成されているが、これらＯリング用突起８ａ，８ｂの突出量Ｍは、Ｏリング７が放熱部材１３の下面１３ａと周溝６の底面６ａとの間に密着しながら弾性変形するときに、下面１３ａとの間に隙間を設ける程度に突出している。
　なお、図８では伝熱支持用金属板３３について説明したが、伝熱支持用金属板３２側も同様の構造である。 Therefore, the cross-sectional diameter D (see FIG. 6) of the O-ring 7 of the present embodiment includes the plate thickness T of the heat transfer support metal plate 33 that causes a variation of about ± 10% and the depth L of the circumferential groove 6. It is set to a value larger than the added value.
Further, the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7 (see FIG. 6).
Further, an O-ring protrusion 8a is formed on the inner peripheral side of the opening of the circumferential groove 6 and an O-ring protrusion 8b is projected on the outer peripheral side of the opening of the circumferential groove 6 (height from the upper surface 3c of the cooling body 3). The protrusion amount M of the O- ring protrusions 8a and 8b is elastically deformed while the O-ring 7 is in close contact between the lower surface 13a of the heat radiating member 13 and the bottom surface 6a of the circumferential groove 6. Sometimes it projects to the extent that a gap is provided between the lower surface 13a.
Although the heat transfer support metal plate 33 has been described with reference to FIG. 8, the heat transfer support metal plate 32 has the same structure.
　本実施形態によると、Ｏリング７の断面直径Ｄは、±１０％程度のばらつきを生じる伝熱支持用金属板３２，３３の板厚Ｔと、周溝６の深さＬとを足した値より大きな値に設定されているので、伝熱支持用金属板３２，３３の板厚Ｔがマイナス方向にばらついても、Ｏリング７が底面６ａと下面１３ａとに過度に押しつぶされずに液密封止を行うとともに、伝熱支持用金属板３２，３３の板厚Ｔがプラス方向にばらついても、Ｏリング７は最適な押しつぶし量で液密封止を行うことができる。したがって、本実施形態の冷却液の液密封止構造も、冷却体３の浸漬部５に溜まっている冷却水の確実な液密封止を確保することができ、信頼性の高い電力変換装置１を提供することができる。 According to this embodiment, the cross-sectional diameter D of the O-ring 7 is a value obtained by adding the plate thickness T of the heat transfer supporting metal plates 32 and 33 that cause a variation of about ± 10% and the depth L of the circumferential groove 6. Since the larger value is set, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the minus direction, the O-ring 7 is not excessively crushed by the bottom surface 6a and the bottom surface 13a, and is liquid-tightly sealed. In addition, even if the thickness T of the heat transfer supporting metal plates 32 and 33 varies in the plus direction, the O-ring 7 can be liquid-tightly sealed with an optimal crushing amount. Therefore, the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
　また、本実施形態では、周溝６の深さＬを、Ｏリング７の半径Ｒより大きな値に設定したことから、周溝６内に装着されたＯリング７が外に出にくくなり、電力変換装置１の組み立ての途中において周溝６のリング７の据え付けを良好とすることができる。
　また、冷却水を封止する本実施形態のＯリング７は、周溝６の外周側に寄った位置に配置されるが、少なくとも周溝６の開口部の外周側にＯリング用突起８ｂが突出して形成されおり、このＯリング用突起８ｂが、組み立ての途中の周溝６のＯリング７の据え付け状態を良好とするとともに、Ｏリング７が押しつぶされる際に接触することで押しつぶしガイドとしても機能する。 In this embodiment, since the depth L of the circumferential groove 6 is set to a value larger than the radius R of the O-ring 7, it becomes difficult for the O-ring 7 mounted in the circumferential groove 6 to go out. In the middle of the assembly of the conversion device 1, the ring 7 of the circumferential groove 6 can be installed well.
The O-ring 7 of the present embodiment for sealing the cooling water is disposed at a position close to the outer peripheral side of the circumferential groove 6, but the O-ring protrusion 8 b is at least on the outer peripheral side of the opening of the circumferential groove 6. This O-ring protrusion 8b is formed so as to make the O-ring 7 installed in the circumferential groove 6 in the middle of assembling good, and when the O-ring 7 is crushed, it can be used as a crushing guide. Function.
　さらに、図９は、第３実施形態の冷却液の液密封止構造である。
　Ｏリング７の許容つぶし率（（自由状態の断面直径－組付け状態の断面直径）／自由状態の断面直径）の推奨値は、一般的に８％以上３０％以下である。
　そこで、本実施形態のＯリング７は、周溝６に装着したＯリング７が当接する放熱部材１３の下面１３ａと周溝６の底面６ａとの間の距離Ｆ２が、許容つぶし率（８％以上３０％以下）で押しつぶしたときの寸法となるものを選択している。 Furthermore, FIG. 9 shows a liquid-tight sealing structure of the coolant according to the third embodiment.
The recommended value of the allowable crushing rate of the O-ring 7 ((cross-sectional diameter in the free state−cross-sectional diameter in the assembled state) / cross-sectional diameter in the free state) is generally 8% or more and 30% or less.
Therefore, in the O-ring 7 of the present embodiment, the distance F2 between the lower surface 13a of the heat radiating member 13 that the O-ring 7 attached to the circumferential groove 6 contacts and the bottom surface 6a of the circumferential groove 6 has an allowable crushing rate (8%). More than 30%) is selected as the dimensions when squeezed.
　本実施形態の許容つぶし率（８％以上３０％以下）で押しつぶれるＯリング７を使用したことで、Ｏリング７の圧縮永久ひずみ、圧縮割れを防止することができる。
　したがって、本実施形態の冷却液の液密封止構造も、冷却体３の浸漬部５に溜まっている冷却水の確実な液密封止を確保することができ、信頼性の高い電力変換装置１を提供することができる。 By using the O-ring 7 that is crushed at the allowable crushing rate (8% or more and 30% or less) of the present embodiment, compression set and compression cracking of the O-ring 7 can be prevented.
Therefore, the liquid-tight sealing structure of the cooling liquid of the present embodiment can also ensure a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3, and the highly reliable power conversion device 1 can be obtained. Can be provided.
　なお、本発明の第１の発熱体が放熱部材１３に対応し、本発明の第２の発熱体が制御回路基板２２及び電源回路基板２３に対応し、本発明の伝熱板が伝熱支持用金属板３２，３３に対応し、本発明の第１の発熱体及び冷却体の接合面で挟持される伝熱板が伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ、３３ｃに対応している。
　また、図１及び図２で示した制御回路ユニットＵ２及び電源回路ユニットＵ３において、伝熱部材３５及び３７を制御回路基板２２及び電源回路基板２３と同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材３５及び３７を発熱回路部品３９が存在する箇所にのみ設けるようにしてもよい。 In addition, the 1st heat generating body of this invention respond | corresponds to the heat radiating member 13, the 2nd heat generating body of this invention respond | corresponds to the control circuit board 22 and the power supply circuit board 23, and the heat exchanger plate of this invention supports heat transfer. Corresponding to the metal plates 32 and 33 for cooling, the heat transfer plate sandwiched between the joining surfaces of the first heating element and the cooling body of the present invention is the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33. It corresponds to.
In the control circuit unit U2 and the power supply circuit unit U3 shown in FIGS. 1 and 2, the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.
　また、図１及び図２においては、制御回路基板２２及び電源回路基板２３で発熱回路部品３９を裏面側の伝熱部材３５及び３７側に実装する場合について説明した。しかしながら、本発明は上記構成に限定されるものではない。すなわち、制御回路基板２２及び電源回路基板２３の伝熱部材３５及び３７とは反対側の外周領域に、発熱回路部品３９を実装するようにしてよい。 1 and 2, the case where the heating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back side by the control circuit board 22 and the power circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
　さらに、図１及び図２においては、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。
　また、本発明に係る電力変換装置１を、電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置１としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置１を適用することができる。 Furthermore, although the case where the film capacitor 4 is applied as a smoothing capacitor has been described in FIGS. 1 and 2, the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
Moreover, although the case where the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive | works a rail, and is arbitrary. It can be applied to an electrically driven vehicle. Furthermore, the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
　以上のように、本発明に係る冷却構造体は、第１の発熱体及び冷却体の間の液密封止を確保するのに有用であり、本発明に係る電力変換装置は、放熱部材及び冷却体との間の液密封止を確保するのに有用である。 As described above, the cooling structure according to the present invention is useful for securing a liquid-tight seal between the first heating element and the cooling body, and the power conversion device according to the present invention includes the heat dissipation member and the cooling member. Useful for ensuring a fluid tight seal with the body.
　１…電力変換装置、２…筐体、２Ａ…下部筐体、２Ｂ…上部筐体、２ａ…角筒体、２ｂ…蓋体、３…冷却体、３ａ…給水口、３ｂ…排水口、３ｃ…冷却体の上面、３ｅ…挿通孔、４…フィルムコンデンサ、４ａ…正負の電極、５…浸漬部、６…周溝、７…Ｏリング、８…Ｏリング保持用突起、１１…パワーモジュール、１１ａ…負極端子、１１ｂ…３相交流出力端子、１２…ケース体、１３…放熱部材、１４…固定ねじ、１５…挿通孔、１６…基板固定部、１６ａ…雌ねじ部、１７…接液部、１７ａ…冷却フィン、２１…駆動回路基板、２１ａ…挿通孔、２２…制御回路基板、２２ａ…挿通孔、２３…電源回路基板、２３ａ…挿通孔、２４ａ…雄ねじ部、２４ｂ…雌ねじ部、２５ａ…雄ねじ部、２５ｂ…雌ねじ部、３２，３３…伝熱支持用金属板、３２ａ…伝熱支持板部、３２ｂ…伝熱支持側板部、３２ｃ…冷却体接触板部、３２ｃ，３３ｃ…冷却体接触板部、３２ｃ１，３３ｃ１…固定部材挿通孔、３２ｉ…挿通孔、３３ａ…伝熱支持板部、３３ｂ…伝熱支持側板部、３３ｃ…冷却体接触板部、３３ｉ…挿通孔、３５…伝熱部材、３７…伝熱部材、３９…発熱回路部品、４２…絶縁シート、４３…絶縁シート、５１…固定ねじ、５２…接続コード、５３，５９…圧着端子、５５…ブスバー、５７…電流センサ、５８…モータ接続ケーブル、６０…固定ねじ DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 2A ... Lower housing | casing, 2B ... Upper housing | casing, 2a ... Square cylinder body, 2b ... Cover body, 3 ... Cooling body, 3a ... Water supply port, 3b ... Drainage port, 3c ... upper surface of cooling body, 3e ... insertion hole, 4 ... film capacitor, 4a ... positive and negative electrodes, 5 ... immersion part, 6 ... circumferential groove, 7 ... O-ring, 8 ... O-ring holding projection, 11 ... power module, DESCRIPTION OF SYMBOLS 11a ... Negative electrode terminal, 11b ... Three-phase alternating current output terminal, 12 ... Case body, 13 ... Radiation member, 14 ... Fixing screw, 15 ... Insertion hole, 16 ... Substrate fixing | fixed part, 16a ... Female screw part, 17 ... Liquid contact part, 17a ... Cooling fins, 21 ... Drive circuit board, 21a ... Insertion hole, 22 ... Control circuit board, 22a ... Insertion hole, 23 ... Power supply circuit board, 23a ... Insertion hole, 24a ... Male screw part, 24b ... Female screw part, 25a ... Male thread part, 25b ... Female thread part, 32, 33 ... For heat transfer support Metal plate, 32a ... Heat transfer support plate, 32b ... Heat transfer support side plate, 32c ... Cooling body contact plate, 32c, 33c ... Cooling body contact plate, 32c1, 33c1 ... Fixed member insertion hole, 32i ... Insertion hole 33a ... Heat transfer support plate portion, 33b ... Heat transfer support side plate portion, 33c ... Cooling body contact plate portion, 33i ... Insertion hole, 35 ... Heat transfer member, 37 ... Heat transfer member, 39 ... Heat generation circuit component, 42 ... Insulating sheet, 43 ... Insulating sheet, 51 ... Fixing screw, 52 ... Connection cord, 53, 59 ... Crimp terminal, 55 ... Bus bar, 57 ... Current sensor, 58 ... Motor connection cable, 60 ... Fixing screw

Claims (7)

  1. 　第１の発熱体と、
    　前記第１の発熱体に接合される冷却体と、
    　第２の発熱体と、
    　前記第２の発熱体の熱を前記冷却体に伝熱させる伝熱板と、を備え、
    　前記第１の発熱体は、前記冷却体に接合する側に突出して形成された接液部を有し、
    　前記冷却体は、前記第１の発熱体に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の開口を囲むように形成されてＯリングを装着した周溝と、を設け、
    　前記第１の発熱体及び前記冷却体は、前記周溝より外周側の互いの接合面で前記伝熱板を挟持して接合され、
    　前記Ｏリングの断面直径は、前記Ｏリングが弾性変形しながら密着する前記第１の発熱体の接合面と、前記Ｏリングが弾性変形しながら密着する前記周溝の接合面との間の距離より大きな値であることを特徴とする冷却構造体。     A first heating element;
    A cooling body joined to the first heating element;
    A second heating element;
    A heat transfer plate for transferring heat of the second heating element to the cooling body,
    The first heating element has a liquid contact portion formed so as to protrude to the side to be joined to the cooling body,
    The cooling body is formed so as to open on the side to be joined to the first heating element, and is formed so as to surround the immersion part in which the liquid contact part is immersed in the flowing coolant and the opening of the immersion part. And a circumferential groove fitted with an O-ring,
    The first heating element and the cooling body are joined by sandwiching the heat transfer plate at a joining surface on the outer peripheral side of the circumferential groove,
    The cross-sectional diameter of the O-ring is the distance between the joint surface of the first heating element that is in close contact with the O-ring while being elastically deformed, and the joint surface of the peripheral groove that is in close contact with the O-ring while being elastically deformed. A cooling structure characterized by a larger value.
  2. 　一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体パワーモジュールを駆動する発熱回路部品を含む回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板と、を備え、
    　前記放熱部材は、前記冷却体に接合する側に突出して形成された接液部を有し、
    　前記冷却体は、前記放熱部材に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の開口を囲むように形成されてＯリングが装着された周溝と、を設け、
    　前記放熱部材及び前記冷却体は、前記周溝より外周側の互いの接合面で前記伝熱板を挟持して接合され、
    　前記Ｏリングの断面直径は、前記Ｏリングが弾性変形しながら密着する前記放熱部材の接合面と、前記Ｏリングが弾性変形しながら密着する前記周溝の接合面との間の距離より大きな値であることを特徴とする電力変換装置。     A semiconductor power module having a heat dissipation member formed on one surface;
    A cooling body joined to the heat dissipation member;
    A heat transfer plate for transferring the heat of the mounting substrate on which the circuit components including the heat generating circuit components for driving the semiconductor power module are mounted to the cooling body,
    The heat dissipating member has a liquid contact portion formed so as to protrude to the side to be joined to the cooling body
    The cooling body is formed to be open on the side to be joined to the heat radiating member, and is formed so as to surround the liquid contact portion in the flowing coolant, and to surround the opening of the immersion portion. Provided with a circumferential groove,
    The heat radiating member and the cooling body are joined by sandwiching the heat transfer plate at the joint surfaces on the outer peripheral side from the circumferential groove,
    The cross-sectional diameter of the O-ring is larger than the distance between the joint surface of the heat radiating member that is in close contact with the O-ring while being elastically deformed and the joint surface of the peripheral groove that is in close contact with the O-ring while being elastically deformed. The power converter characterized by being.
  3. 　電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、
    　当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板と、を備え、
    　前記放熱部材は、前記冷却体に接合する側に接液部が突出して形成され、
    　前記冷却体は、前記放熱部材に接合する側に開口して形成され、通流される冷却液に前記接液部を浸漬する浸漬部と、当該浸漬部の外側に形成されてＯリングを装着した周溝とを設け、
    　前記放熱部材及び前記冷却体は、前記周溝より外側の互いの接合面で前記伝熱支持用金属板を挟持して接合され、
    　前記Ｏリングの断面直径は、前記伝熱支持用金属板の厚みと前記周溝の深さとを足した値より大きな値であることを特徴とする電力変換装置。     A semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body,
    A cooling body joined to the heat dissipation member;
    A mounting board on which circuit components including a heat generating circuit component for driving the semiconductor switching element are mounted;
    Supporting the mounting board with the semiconductor power module at a predetermined interval, and supporting heat transfer to contact the cooling body so as to dissipate heat generated by the mounting board to the cooling body without passing through a housing. A metal plate,
    The heat dissipating member is formed with a liquid contact portion protruding on the side to be joined to the cooling body,
    The cooling body is formed with an opening on the side to be joined to the heat radiating member, an immersion part for immersing the liquid contact part in a flowing coolant, and an O-ring attached to the outside of the immersion part. A circumferential groove,
    The heat dissipating member and the cooling body are joined by sandwiching the heat transfer supporting metal plate at the joint surfaces outside the circumferential groove,
    The cross-sectional diameter of the O-ring is a value larger than a value obtained by adding the thickness of the metal plate for heat transfer support and the depth of the peripheral groove.
  4. 　前記周溝の開口部の縁部に、前記Ｏリングを保持するＯリング保持用突起が形成されており、当該Ｏリング保持用突起は、前記Ｏリングが前記放熱部材の接合面に弾性変形しながら密着するときに前記接合面との間に隙間を設けることを特徴とする請求項３記載の電力変換装置。 An O-ring holding projection for holding the O-ring is formed at the edge of the opening of the circumferential groove, and the O-ring holding projection is elastically deformed to the joint surface of the heat radiating member. The power converter according to claim 3, wherein a gap is provided between the joint surface when closely contacting with each other.
  5. 　前記Ｏリング保持用突起は、前記周溝の開口部の少なくとも外周側の縁部に形成されていることを特徴とする請求項４記載の電力変換装置。 5. The power conversion device according to claim 4, wherein the O-ring holding protrusion is formed on at least an outer peripheral edge of the opening of the peripheral groove.
  6. 　前記周溝の底からＯリング保持用突起の頂部までの高さは、前記Ｏリングの半径より大きな値であることを特徴とする請求項４又は５に記載の電力変換装置。 The power converter according to claim 4 or 5, wherein a height from a bottom of the circumferential groove to a top of the O-ring holding projection is larger than a radius of the O-ring.
  7. 　前記Ｏリングが前記放熱部材の前記接合面に密着しているときの前記周溝の底から前記放熱部材の前記接合面までの高さは、前記Ｏリングを許容つぶし率でつぶしたときの高さに設定されていることを特徴とする請求項３に記載の電力変換装置。 The height from the bottom of the circumferential groove when the O-ring is in close contact with the joint surface of the heat radiating member to the joint surface of the heat radiating member is the height when the O-ring is crushed with an allowable crushing rate. The power conversion device according to claim 3, wherein the power conversion device is set as described above.
PCT/JP2013/003048 2012-08-08 2013-05-13 Cooling structure and power conversion device WO2014024361A1 (en)

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