JP5794306B2 - Power converter - Google Patents

Power converter Download PDF

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Publication number
JP5794306B2
JP5794306B2 JP2013531059A JP2013531059A JP5794306B2 JP 5794306 B2 JP5794306 B2 JP 5794306B2 JP 2013531059 A JP2013531059 A JP 2013531059A JP 2013531059 A JP2013531059 A JP 2013531059A JP 5794306 B2 JP5794306 B2 JP 5794306B2
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heat transfer
transfer support
plate portion
heat
cooling body
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JPWO2013031147A1 (en
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泰仁 田中
泰仁 田中
美里 柴田
美里 柴田
小高　章弘
章弘 小高
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Fuji Electric Co Ltd
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Fuji Electric Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L3/00—Electric devices on electrically-propelled vehicles for safety purposes; Monitoring operating variables, e.g. speed, deceleration or energy consumption
    • B60L3/0023—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train
    • B60L3/003—Detecting, eliminating, remedying or compensating for drive train abnormalities, e.g. failures within the drive train relating to inverters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2200/00—Type of vehicles
    • B60L2200/26—Rail vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00—Control parameters of input or output; Target parameters
    • B60L2240/10—Vehicle control parameters
    • B60L2240/36—Temperature of vehicle components or parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L2240/00—Control parameters of input or output; Target parameters
    • B60L2240/40—Drive Train control parameters
    • B60L2240/52—Drive Train control parameters related to converters
    • B60L2240/525—Temperature of converter or components thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Description

本発明は、電力変換用の半導体スイッチング素子を内蔵したモジュール上に、所定間隔を保って上記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持するようにした電力変換装置に関する。   The present invention provides a power conversion system for supporting a mounting board on which a circuit component including a heat generating circuit component for driving the semiconductor switching element is mounted at a predetermined interval on a module incorporating a semiconductor switching element for power conversion. Relates to the device.

この種の電力変換装置としては、特許文献１に記載された電力変化装置が知られている。この電力変換装置は、筐体内に、水冷ジャケットを配置し、この水冷ジャケット上に電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵したパワーモジュールを配置して冷却するようにしている。また、筐体内には、パワーモジュールの水冷ジャケットとは反対側に所定距離を保って制御回路基板を配置し、この制御回路基板で発生する熱を、放熱部材を介して制御回路基板を支持する金属ベース板に伝達し、さらに金属ベース板に伝達された熱を、この金属ベース板を支持する筐体の側壁を介して水冷ジャケットに伝達するようにしている。   As this type of power conversion device, a power change device described in Patent Document 1 is known. In this power conversion device, a water cooling jacket is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket for cooling. In addition, a control circuit board is disposed in the housing at a predetermined distance on the side opposite to the water cooling jacket of the power module, and heat generated by the control circuit board is supported through the heat dissipation member. The heat transmitted to the metal base plate and further transferred to the metal base plate is transmitted to the water cooling jacket through the side wall of the casing that supports the metal base plate.

特許第４６５７３２９号公報Japanese Patent No. 4657329

ところで、上記特許文献１に記載された従来例にあっては、制御回路基板で発生する熱を、制御回路基板→放熱部材→金属ベース板→筐体→水冷ジャケットという経路で放熱するようにしている。このため、筐体が伝熱経路の一部として利用されることにより、筐体にも良好な伝熱性が要求されることになり、材料が熱伝導率の高い金属に限定され、小型軽量化の要求される電力変換装置おいて、樹脂等の軽量な材料の選択が不可能となり軽量化が困難となるという未解決の課題がある。   By the way, in the conventional example described in Patent Document 1, the heat generated in the control circuit board is radiated through the path of the control circuit board → the heat radiating member → the metal base plate → the housing → the water cooling jacket. Yes. For this reason, when the casing is used as a part of the heat transfer path, the casing is also required to have good heat transfer properties, and the material is limited to a metal with high thermal conductivity, which is reduced in size and weight. However, there is an unsolved problem that it is difficult to select a lightweight material such as a resin and it is difficult to reduce the weight.

また、筐体には、防水・防塵が要求されることが多いため、金属ベース板と筐体との間、筐体と水冷ジャケットとの間には液状シール剤の塗布やゴム製パッキンの挟み込みなどが一般的に行われている。液状シール剤やゴム製パッキンは熱伝導率が一般的に低く、これらが熱冷却経路に介在することで熱抵抗が増え冷却効率が低下するという未解決の課題もある。この未解決の課題を解決するためには、基板や実装部品の除去しきれない発熱を筐体や筐体蓋からの自然対流による放熱も必要となり、筐体や筐体蓋の表面積を大きくするために、筐体や筐体蓋の外形が大きくなり電力変換装置が大型化することになる。   Also, since the housing is often required to be waterproof and dustproof, apply a liquid sealant or sandwich rubber packing between the metal base plate and the housing and between the housing and the water cooling jacket. Etc. are generally performed. Liquid sealants and rubber packings generally have a low thermal conductivity, and there is an unsolved problem that the thermal resistance increases and the cooling efficiency decreases due to the presence of these in the thermal cooling path. In order to solve this unsolved problem, it is also necessary to dissipate the heat generated by the substrate and mounted components by natural convection from the case and case cover, increasing the surface area of the case and case cover. For this reason, the outer shape of the housing and the housing lid is increased, and the power converter is increased in size.

そこで、本発明は、上記従来例の未解決の課題に着目してなされたものであり、基板に実装された発熱回路部品の熱の放熱経路に筐体を介在させることなく、発熱回路部品の熱を効率よく冷却体に放熱することができる電力変換装置を提供することを目的としている。   Therefore, the present invention has been made paying attention to the unsolved problems of the above-described conventional example, and without having a housing interposed in the heat radiation path of the heat generating circuit component mounted on the substrate, It aims at providing the power converter device which can thermally radiate heat to a cooling body efficiently.

上記目的を達成するために、本発明に係る電力変換装置の第１の態様は、電力変換用の半導体スイッチング素子を内蔵し、一面にフィン付放熱部材を有する半導体パワーモジュールと、前記フィン付放熱部材に接合される冷却体と、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した複数の実装基板と、該複数の実装基板を個別に前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記半導体パワーモジュールの少なくとも一側面側を通って前記冷却体に接触する複数の伝熱支持部材とを備え、前記実装基板と前記伝熱支持部材との組毎に前記伝熱支持部材の伝熱支持側板部の高さを異ならせるとともに、当該伝熱支持側板部が前記半導体パワーモジュールの異なる側面を通って前記冷却体に接触されている。
この構成によると、複数の実装基板に実装されている発熱回路部品の熱を個別の伝熱支持部材によって冷却体に筐体を介することなく直接放熱することができ、実装基板毎に異なる放熱経路を形成することができる。伝熱支持部材がモジュールの一側面を通って冷却体に接触するので、伝熱経路を短くすることができる。 In order to achieve the above object, a first aspect of a power conversion device according to the present invention includes a semiconductor power module that incorporates a semiconductor switching element for power conversion and has a finned heat dissipation member on one surface, and the finned heat dissipation. A cooling body joined to the member, a plurality of mounting boards on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the plurality of mounting boards individually between the semiconductor power modules at a predetermined interval A plurality of heat transfer support members that are in contact with the cooling body through at least one side surface of the semiconductor power module so as to dissipate heat generated by the mounting substrate to the cooling body without passing through a housing. with the door, with varying heat transfer support plate portion of the height of the heat transfer support member Kumigoto of the heat transfer support member and the mounting substrate, the heat transfer support plate portion It is in contact with the cooling body through different aspects of the semiconductor power module.
According to this configuration, the heat of the heat generating circuit components mounted on the plurality of mounting boards can be directly radiated to the cooling body without using the housing by the individual heat transfer support members, and different heat dissipation paths for each mounting board Can be formed. Since the heat transfer support member contacts the cooling body through one side of the module, the heat transfer path can be shortened.

また、本発明に係る電力変換装置の第２の態様は、前記半導体パワーモジュールは、長方形の平面を有する扁平直方体形状を有し、前記複数の伝熱支持部材の少なくとも一つは、前記半導体パワーモジュールの長辺側の一側面を通るように配置され、他の伝熱支持部材の少なくとも一つは前記半導体パワーモジュールの長辺側の他側面を通るように配置されている。
この構成によると、実装基板に実装されている発熱回路部品の熱を伝熱支持部材によって筐体を介することなく冷却体に放熱することができるとともに、伝熱支持部材の伝熱断面積を広くすることができ、放熱効果を向上させることができる。 According to a second aspect of the power conversion device of the present invention, the semiconductor power module has a flat rectangular parallelepiped shape having a rectangular plane, and at least one of the plurality of heat transfer support members is the semiconductor power It arrange | positions so that it may pass along one side surface of the long side of a module, and at least one of the other heat-transfer support members is arrange | positioned so that it may pass through the other side surface of the long side of the said semiconductor power module .
According to this configuration, the heat of the heat generating circuit components mounted on the mounting board can be radiated to the cooling body by the heat transfer support member without going through the casing, and the heat transfer support member has a wide heat transfer cross-sectional area. It is possible to improve the heat dissipation effect.

また、本発明に係る電力変換装置の第３の態様は、前記伝熱支持部材が、前記モジュールのケース体に形成された接続端子に対応する位置に挿通孔を形成した構成とされている。
この構成によると、隣接する挿通孔間に伝熱路を形成することができ、伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。 Moreover, the 3rd aspect of the power converter device which concerns on this invention is set as the structure by which the said heat-transfer support member formed the penetration hole in the position corresponding to the connection terminal formed in the case body of the said module.
According to this configuration, a heat transfer path can be formed between adjacent insertion holes, and heat can be transferred efficiently by increasing the cross-sectional area of the heat transfer path. Also, rigidity against vibration can be ensured.

また、本発明に係る電力変換装置の第４の態様は、電力変換用の半導体スイッチング素子を内蔵し、一面に冷却体に接触するフィン付放熱部材が形成された半導体パワーモジュールと、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した複数の実装基板と、該複数の実装基板を個別に前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記半導体パワーモジュールの少なくとも一部を通って前記冷却体に接触する伝熱支持部材とを備え、前記実装基板と前記伝熱支持部材との組毎に前記伝熱支持部材の伝熱支持側板部の高さを異ならせるとともに、当該伝熱支持側板部が前記半導体パワーモジュールの異なる一部を通って前記冷却体に接触されている。
この構成によると、上記第１の態様と同様に、実装基板に実装されている発熱回路部品の熱を伝熱支持部材によって筐体を介することなく冷却体に放熱することができ、実装基板毎に異なる放熱経路を形成することができる。しかも、伝熱支持部材が半導体パワーモジュールの少なくとも一部を通って冷却体に接触するので、モジュールの外形が大きい場合に、伝熱経路を短くすることができる。 According to a fourth aspect of the power conversion device of the present invention, there is provided a semiconductor power module including a semiconductor switching element for power conversion and having a finned heat dissipation member in contact with a cooling body on one surface, and the semiconductor switching device. A plurality of mounting boards on which circuit components including a heat generating circuit part for driving the elements are mounted, and the plurality of mounting boards are individually supported with a predetermined interval between the semiconductor power modules, and heat generation of the mounting boards is performed. A heat transfer support member that contacts the cooling body through at least a part of the semiconductor power module so as to dissipate heat to the cooling body without passing through a housing, and the mounting substrate and the heat transfer support member While varying the height of the heat transfer support side plate portion of the heat transfer support member for each set, the heat transfer support side plate portion passes through a different part of the semiconductor power module, and It has been in contact with the却体.
According to this configuration, similarly to the first aspect, the heat of the heat generating circuit components mounted on the mounting board can be dissipated to the cooling body by the heat transfer support member without passing through the housing. Different heat dissipation paths can be formed. Moreover, since the heat transfer support member passes through at least a part of the semiconductor power module and contacts the cooling body, the heat transfer path can be shortened when the outer shape of the module is large.

また、本発明に係る電力変換装置の第５の態様は、前記冷却体が水冷ジャケット構成を有している。
この構成によると、冷却体による伝熱支持部材に対する冷却効果を増加させることができる。 Moreover, as for the 5th aspect of the power converter device which concerns on this invention, the said cooling body has a water-cooling jacket structure.
According to this structure, the cooling effect with respect to the heat-transfer support member by a cooling body can be increased .

また、本発明に係る電力変換装置の第６の態様は、前記実装基板が金属ベース回路基板で構成されている。
この構成によると、金属ベース回路基板の放熱板を伝熱支持部材に連結することにより、発熱回路部品の放熱を効率良く行うことができる。
また、本発明に係る電力変換装置の第７の態様は、前記実装基板と前記伝熱支持部材との間に伝熱部材を介挿している。
この構成によると、実装基板の発熱回路部品の熱を、伝熱部材を介して伝熱支持部材に効率よく伝熱することができる。 Moreover, as for the 6th aspect of the power converter device which concerns on this invention, the said mounting board is comprised with the metal base circuit board.
According to this configuration, by connecting the heat radiating plate of the metal base circuit board to the heat transfer support member, it is possible to efficiently radiate the heat generating circuit components.
Moreover, the 7th aspect of the power converter device which concerns on this invention has inserted the heat-transfer member between the said mounting substrate and the said heat-transfer support member.
According to this configuration, the heat of the heat generating circuit component of the mounting board can be efficiently transferred to the heat transfer support member via the heat transfer member.

また、本発明に係る電力変換装置の第８の態様は、前記伝熱部材が、絶縁性を有する絶縁体で構成されている。
この構成によると、伝熱部材が絶縁体で構成されているので、実装基板と伝熱支持板部とを確実に絶縁することができる。
また、本発明に係る電力変換装置の第９の態様は、前記伝熱部材が、伸縮性を有する弾性体で構成されている。
この構成によると、伝熱部材が弾性体で構成されているので、実装基板及び実装された回路部品との接触面積を広くして放熱効果を向上させることができる。 Moreover, as for the 8th aspect of the power converter device which concerns on this invention, the said heat-transfer member is comprised with the insulator which has insulation.
According to this configuration, since the heat transfer member is formed of an insulator, the mounting substrate and the heat transfer support plate can be reliably insulated.
Moreover, the 9th aspect of the power converter device which concerns on this invention is comprised by the elastic body in which the said heat-transfer member has a stretching property.
According to this configuration, since the heat transfer member is formed of an elastic body, the contact area between the mounting substrate and the mounted circuit component can be widened to improve the heat dissipation effect.

また、本発明に係る電力変換装置の第１０の態様は、前記伝熱部材が、伸縮性を有する弾性体で構成され、前記実装基板の前記伝熱板部側実装面に前記発熱回路部品が実装されている。
この構成によると、伝熱部材を実装基板の発熱回路部品に直接接触させることができ、大きな放熱効果を発揮することができる。
また、本発明に係る電力変換装置の第１１の態様は、前記伝熱部材が、前記実装基板と同じ大きさに形成されている。
この構成によると、伝熱部材の大きさが実装基板と同じとされているので、伝熱面積を広くして放熱効果を高めることができる。 The first 0 embodiment of the power converting apparatus of the present invention, the heat transfer member is an elastic member having elasticity, wherein the heat-generating circuit component on the heat transfer plate side mounting surface of the mounting substrate Has been implemented.
According to this configuration, the heat transfer member can be brought into direct contact with the heat generating circuit component of the mounting substrate, and a great heat dissipation effect can be exhibited.
The first one aspect of the power converting apparatus according to the present invention, the heat transfer member is formed to have the same size as the said mounting board.
According to this configuration, since the size of the heat transfer member is the same as that of the mounting substrate, the heat transfer area can be widened to enhance the heat dissipation effect.

また、本発明に係る電力変換装置の第１２の態様は、前記伝熱部材が、前記実装基板に実装される電子回路部品のうち相対的に発熱量又は伝熱密度の大きい発熱回路部品の周囲のみに配置されている。
この構成によると、放熱効果を発揮したい部分にのみ伝熱部材を配置するので、伝熱部材の使用面積を減少させて、低コスト化を図ることができる。 The first and second aspect of the power converting apparatus according to the present invention, the heat transfer member, a large heat generating circuit components relatively calorific or heat transfer density of the electronic circuit components mounted on the mounting substrate It is arranged only around.
According to this configuration, since the heat transfer member is disposed only in a portion where it is desired to exhibit the heat dissipation effect, the use area of the heat transfer member can be reduced and the cost can be reduced.

また、本発明に係る電力変換装置の第１３の態様は、前記実装基板と前記伝熱支持部材の伝熱支持板部とを前記伝熱部材を介して締付固定部材で固定している。
この構成によると、実装基板と伝熱支持部材の伝熱支持板部の間に伝熱部材を挟んだ状態で締付固定部材によって固定するので、組付けを容易に行うことができる。 The first third aspect of the power converting apparatus of the present invention is fixed by a fixing member tightening the heat transfer support plate portion of the heat-transfer support member and the mounting substrate via the heat transfer member .
According to this configuration, since the heat transfer member is sandwiched between the mounting substrate and the heat transfer support plate portion of the heat transfer support member, it is fixed by the tightening fixing member, so that assembly can be easily performed.

また、本発明に係る電力変換装置の第１４の態様は、前記締付固定部材の周囲に前記実装基板と前記伝熱支持部材の伝熱支持板部との間隔を所定値に維持する間隔調整部材が介挿されている。
この構成によると、伝熱部材が弾性体である場合に、伝熱部材の圧縮率を正確に規定することができる。 The first fourth aspect of the power converting apparatus according to the present invention, the distance to maintain the distance between the heat transfer support plate portion of the mounting substrate and the heat transfer support member on the periphery of the fixed member the tightening to a predetermined value An adjustment member is inserted.
According to this configuration, when the heat transfer member is an elastic body, the compression rate of the heat transfer member can be accurately defined.

また、本発明に係る電力変換装置の第１５の態様は、前記伝熱支持部材が、伝熱部材を介して前記実装基板を支持する伝熱支持板部と、該伝熱支持板部の側面を固定支持して前記冷却体に接触される伝熱支持側板部とで構成されている。
この構成によると、実装基板を伝熱支持板部で支持するので、実装基板の剛性を高めることができる。 The first fifth aspect of the power converting apparatus of the present invention, the heat transfer support member, and the heat transfer support plate portion for supporting the mounting board through the heat transfer member, the heat transfer support plate portion The heat transfer support side plate portion is fixedly supported on the side surface and brought into contact with the cooling body.
According to this configuration, since the mounting substrate is supported by the heat transfer support plate portion, the rigidity of the mounting substrate can be increased.

また、本発明に係る電力変換装置の第１６の態様は、前記伝熱支持側板部は、前記実装基板の各側面に対応する側板部を有し、当該各板部に前記伝熱支持板部を支持する支持部を形成している。
この構成によると、１つの伝熱支持側板部によって複数の実装基板を支持することができる。 Also, aspects of the first 6 of the power converter of the present invention, the heat transfer support plate portion has a side plate portion which corresponds to each side of the mounting board, the heat transfer support plate in the respective plate portions The support part which supports a part is formed.
According to this configuration, a plurality of mounting boards can be supported by one heat transfer support side plate.

また、本発明に係る電力変換装置の第１７の態様は、前記伝熱支持板部と前記伝熱支持側板部とが一体に形成されている。
この構成によると、伝熱支持板部と伝熱支持側板部とが一体に形成されているので、両者間の連結部に継ぎ目がなく、連結部での熱抵抗を小さくすることができる。 In a seventeenth aspect of the power conversion device according to the present invention, the heat transfer support plate portion and the heat transfer support side plate portion are integrally formed.
According to this configuration, since the heat transfer support plate portion and the heat transfer support side plate portion are integrally formed, there is no joint at the connection portion between them, and the thermal resistance at the connection portion can be reduced.

また、本発明に係る電力変換装置の第１８の態様は、前記伝熱支持板部は、複数の伝熱支持側板部に固定支持されている。
この構成によると、伝熱支持板部が複数の伝熱支持側板部に固定支持されているので、冷却体への伝熱面積を増加させて、効率の良い放熱を行うことができる。
また、本発明に係る電力変換装置の第１９の態様は、前記伝熱支持部材の伝熱支持側板部が前記半導体パワーモジュールの前記フィン付放熱部材及び前記冷却体間に挿通される冷却体接触板部を有する。
この構成によると、伝熱支持側板部に冷却体に接触する冷却体接触板部を有するので、冷却体への放熱を確実に行うことができる。 In an eighteenth aspect of the power converter according to the present invention, the heat transfer support plate is fixedly supported by a plurality of heat transfer support side plates.
According to this configuration, since the heat transfer support plate portion is fixedly supported by the plurality of heat transfer support side plate portions, the heat transfer area to the cooling body can be increased and efficient heat dissipation can be performed.
The nineteenth aspect of the power converter according to the present invention is the cooling body contact in which the heat transfer support side plate portion of the heat transfer support member is inserted between the finned heat dissipation member and the cooling body of the semiconductor power module. It has a plate part.
According to this structure, since it has the cooling body contact plate part which contacts a cooling body in a heat-transfer support side plate part, heat radiation to a cooling body can be performed reliably.

また、本発明に係る電力変換装置の第２０の態様は、前記冷却体接触板部と前記半導体パワーモジュールの前記フィン付放熱部材との間に板状弾性部材が介挿されている。
この構成によると、板状弾性部材によって冷却体接触板部が冷却体に押し付けされるので、冷却体と冷却体接触板部との接触を確実に行うこと化できる。 The second 0 aspect of the power converting apparatus of the present invention, plate-like elastic member between the finned heat dissipating member of the said cooling body contact plate portions semiconductor power module is inserted.
According to this configuration, since the cooling body contact plate portion is pressed against the cooling body by the plate-like elastic member, the cooling body and the cooling body contact plate portion can be reliably brought into contact with each other.

また、本発明に係る電力変換装置の第２１の態様は、前記冷却体接触板部が、前記半導体パワーモジュールに形成された当該半導体パワーモジュールを前記冷却体に固定する固定部材を挿通する挿通孔に対向する位置に固定部材挿通孔が形成されている。
この構成によると、半導体パワーモジュールと伝熱支持部材とを同時に冷却体に固定することができ、組立工数を減少させることができる。 The second one aspect of the power converting apparatus according to the present invention, through which the cooling body contacting plate portion is inserted through the fixing member for fixing the semiconductor power module is formed in the semiconductor power module to the cooling body A fixing member insertion hole is formed at a position facing the hole.
According to this configuration, the semiconductor power module and the heat transfer support member can be simultaneously fixed to the cooling body, and the number of assembly steps can be reduced.

また、本発明に係る電力変換装置の第２２の態様は、前記半導体パワーモジュールが、冷却部材を当該モジュールの前記冷却部材とは反対側に臨ませる開口部が形成され、前記伝熱支持部材が、前記伝熱部材を介して前記実装基板を支持する伝熱支持板部と、該伝熱支持板部の側面を固定支持して前記モジュールの前記開口部を通じて前記冷却部材に接触される伝熱支持側板部とで構成されている。
この構成によると、伝熱支持側板部がモジュールの開口部を通じて冷却部材に接触されるので、モジュールと伝熱支持側板部とを一体化させることができる。 The second second aspect of the power converting apparatus of the present invention, the semiconductor power module, the openings for exposing the opposite side of the cold却部member and the cooling member of the module is formed, the heat transfer support A member is in contact with the cooling member through the opening of the module while fixing and supporting a heat transfer support plate portion that supports the mounting substrate via the heat transfer member, and a side surface of the heat transfer support plate portion. It is comprised with the heat-transfer support side board part.
According to this configuration, the heat transfer support side plate is brought into contact with the cooling member through the opening of the module, so that the module and the heat transfer support side plate can be integrated.

また、本発明に係る電力変換装置の第２３の態様は、前記伝熱支持板部が、複数の伝熱支持側板部に固定支持されている。
この構成によると、伝熱支持板部が複数の伝熱支持側板部に固定支持されているので、冷却体への伝熱面積を増加させて、効率の良い放熱を行うことができる。 The second third aspect of the power converting apparatus of the present invention, the heat transfer support plate portion is fixedly supported by the plurality of heat transfer support plate portion.
According to this configuration, since the heat transfer support plate portion is fixedly supported by the plurality of heat transfer support side plate portions, the heat transfer area to the cooling body can be increased and efficient heat dissipation can be performed.

また、本発明に係る電力変換装置の第２４の態様は、前記伝熱支持部材が、黒色の表面を有する。
この構成によると、伝熱支持部材の表面を黒色とすることにより、熱の放射率を大きくすることができ、放射伝熱量が増えることで、伝熱支持部材の周囲への放熱が活発化され、基板の熱冷却を効率化することができる。 The second fourth aspect of the power converting apparatus according to the present invention, the heat transfer support member has a black surface.
According to this configuration, by making the surface of the heat transfer support member black, the heat emissivity can be increased, and by increasing the amount of radiant heat transfer, heat dissipation to the periphery of the heat transfer support member is activated. The thermal cooling of the substrate can be made efficient.

また、本発明に係る電力変換装置の第２５態様は、前記実装基板が、相対的に発熱量又は伝熱密度の大きい発熱回路部品を前記冷却体への伝熱距離が短くなる位置に配置されている。
この構成によると、実装基板への発熱回路部品を伝熱距離が短くなるように配置するので、伝熱量を増やして効率的な放熱を行うことができる。 The second 5 aspect of the power converting apparatus according to the present invention, the mounting substrate is disposed a large heat generating circuit components relatively calorific or heat transfer density heat transfer distance becomes short positions to the cooling body Has been.
According to this configuration, since the heat generating circuit components to the mounting substrate are arranged so that the heat transfer distance is shortened, the heat transfer amount can be increased and efficient heat dissipation can be performed.

本発明によれば、発熱回路部品を含む回路部品を実装した実装基板を冷却体に接触する伝熱支持部材で筐体を介することなく支持するので、発熱回路部品で生じる熱を、伝熱支持部材を介して直接冷却体に放熱することができ、熱抵抗を抑えて冷却効率の良い熱冷却を行うことができる。このため、筐体や筐体蓋からの放熱作用との併用を減少させることができ、筐体や筐体蓋の大きさを抑えて小型化されて安価な電力変換装置を提供することができる。
しかも、筐体に良好な伝熱性を要求することがないので、筐体に樹脂等の軽量な材料を用いることができ、筐体を軽量化して安価な電力変換装置の提供が可能となる。According to the present invention, the mounting board on which the circuit component including the heat generating circuit component is mounted is supported without the housing by the heat transfer supporting member that contacts the cooling body, so that the heat generated in the heat generating circuit component is supported by the heat transfer. Heat can be radiated directly to the cooling body via the member, and thermal cooling with good cooling efficiency can be performed while suppressing thermal resistance. For this reason, it is possible to reduce the combined use with the heat dissipation action from the housing and the housing lid, and to provide a power converter that is reduced in size and reduced in price while suppressing the size of the housing and the housing lid. .
In addition, since the casing does not require good heat conductivity, a lightweight material such as a resin can be used for the casing, and the casing can be reduced in weight and an inexpensive power conversion device can be provided.

本発明に係る電力変換装置の第１の実施形態の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of 1st Embodiment of the power converter device which concerns on this invention. 第１の実施形態の要部を示す拡大断面図である。It is an expanded sectional view showing the important section of a 1st embodiment. 実装基板を取り付け状態の具体的構成を示す拡大断面図である。It is an expanded sectional view which shows the specific structure of the mounting state of the mounting substrate. 実装基板の伝熱支持部材への取り付け方法を示す図である。It is a figure which shows the attachment method to the heat-transfer support member of a mounting board | substrate. 実装基板を伝熱支持部材へ取り付けた状態を示す断面図である。It is sectional drawing which shows the state which attached the mounting board | substrate to the heat-transfer support member. 伝熱部材の変形例を示す断面図である。It is sectional drawing which shows the modification of a heat-transfer member. 伝熱支持部材を示す側面図である。It is a side view which shows a heat-transfer support member. 発熱回路部品の基板ユニット内における放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route in the board | substrate unit of a heat generating circuit component. 発熱回路部品の全体の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the whole heat generating circuit components. 電力変換装置に対して上下振動や横揺れが作用した状態を示す図である。It is a figure which shows the state which the vertical vibration and the roll acted with respect to the power converter device. 実装基板への発熱回路部品の配置例を示す模式的斜視図である。It is a typical perspective view which shows the example of arrangement | positioning of the heat generation circuit components to a mounting board | substrate. 実装基板への発熱回路部品の配置例を示す断面図である。It is sectional drawing which shows the example of arrangement | positioning of the heat generating circuit components to a mounting board. 第１の実施形態の変形例の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the modification of 1st Embodiment. 本発明に係る電力変換装置の第２の実施形態の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of 2nd Embodiment of the power converter device which concerns on this invention. 第２の実施形態の要部を示す断面図である。It is sectional drawing which shows the principal part of 2nd Embodiment. 本発明に係る電力変換装置の第３の実施形態の要部を示す断面図である。It is sectional drawing which shows the principal part of 3rd Embodiment of the power converter device which concerns on this invention. 第３の実施形態の変形例を示す断面図である。It is sectional drawing which shows the modification of 3rd Embodiment. 伝熱支持部材の他の例を示す断面図である。It is sectional drawing which shows the other example of a heat-transfer support member. 金属ベース回路基板を適用した場合の変形例を示す断面図である。It is sectional drawing which shows the modification at the time of applying a metal base circuit board. 伝熱支持部材のさらに他の例を示す斜視図である。It is a perspective view which shows the other example of a heat-transfer support member. 図２０の平面図である。It is a top view of FIG. 図２０の正面図である。It is a front view of FIG. 図２０の側面図である。It is a side view of FIG. 図２０における伝熱支持部材のみの斜視図である。It is a perspective view of only the heat-transfer support member in FIG.

以下、本発明の実施の形態を図面について説明する。
図１は本発明に係る電力変換装置の全体構成を示す断面図である。
図中、１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、水冷ジャケットの構成を有する冷却体３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of a power converter according to the present invention.
In the figure, reference numeral 1 denotes a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.

下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が冷却体３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が冷却体３で閉塞されている。この角筒体２ａの下端と冷却体３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。The lower housing 2A is a bottomed rectangular tube. The lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3. Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.

冷却体３は、冷却水の給水口３ａ及び排水口３ｂが筐体２の外方に開口されている。これら給水口３ａ及び排水口３ｂは例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。この冷却体３は例えば熱伝導率の高いアルミニウム、アルミニウム合金を射出成形して形成されている。そして、冷却体３は、下面が平坦面とされ、上面が中央部３ｃを残して角枠状の周溝３ｄが形成されている。また、冷却体３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｅが形成されている。   In the cooling body 3, a cooling water supply port 3 a and a drain port 3 b are opened to the outside of the housing 2. The water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose. The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having high thermal conductivity. And as for the cooling body 3, the lower surface is made into a flat surface, and the upper surface is formed with the square-frame-shaped peripheral groove 3d leaving the center part 3c. Further, the cooling body 3 is formed with an insertion hole 3e through which the positive and negative electrodes 4a covered with insulation of the film capacitor 4 held by the lower housing 2A are inserted vertically.

電力変換装置１は、図２とともに参照して明らかなように、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵したパワーモジュール１１を備えている。このパワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に金属製の放熱部材１３が形成されている。ケース体１２及び放熱部材１３には平面からみて四隅に固定部材としての固定ねじ１４を挿通する挿通孔１５が形成されている。また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。   As is apparent with reference to FIG. 2, the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion. The power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12. The case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which fixing screws 14 as fixing members are inserted at the four corners when viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.

この基板固定部１６の上端には、パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。さらに、制御回路基板２２の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴに電源を供給する発熱回路部品を含む電源回路等を実装した実装基板としての電源回路基板２３が固定されている。   A drive circuit board 21 on which a drive circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing portion 16. In addition, a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval. A control circuit board 22 as a board is fixed. Further, a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.

そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
また、制御回路基板２２は継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に継ぎねじ２５の雄ねじ部２５ａを挿通し、この雄ねじ部２５ａを継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, the control circuit board 22 inserts the male screw portion 25 a of the joint screw 25 into an insertion hole 22 a formed at a position facing the female screw portion 24 b formed at the upper end of the joint screw 24, and this male screw portion 25 a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.

さらに、電源回路基板２３は継ぎねじ２５の上端に形成した雌ねじ部２５ｂに対向する位置に形成した挿通孔２３ａ内に固定ねじ２６を挿通し、この固定ねじ２６を継ぎねじ２５の雌ねじ部２５ｂに螺合することにより固定されている。
また、制御回路基板２２及び電源回路基板２３は、伝熱支持部材３２及び３３によって筐体２を介することなく冷却体３への放熱経路を独自に形成するように支持されている。これら伝熱支持部材３２及び３３は、熱伝導率が高い金属例えばアルミニウム又はアルミニウム合金で形成されている。Further, the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
Further, the control circuit board 22 and the power supply circuit board 23 are supported by the heat transfer support members 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2. These heat transfer support members 32 and 33 are made of a metal having a high thermal conductivity such as aluminum or an aluminum alloy.

また、伝熱支持部材３２及び３３は、制御回路基板２２を支持する冷却体３の周溝３ｄ内に配置されて冷却体接触板部となる角枠状の共通の底板部３４を有する。したがって、伝熱支持部材３２及び３３は底板部３４によって一体に連結されている。   Further, the heat transfer support members 32 and 33 have a square frame-shaped common bottom plate portion 34 that is disposed in the circumferential groove 3 d of the cooling body 3 that supports the control circuit board 22 and serves as a cooling body contact plate portion. Therefore, the heat transfer support members 32 and 33 are integrally connected by the bottom plate portion 34.

そして、伝熱支持部材３２及び３３と底板部３４とは黒色の表面を有する。これら伝熱支持部材３２及び３３と底板部３４との表面を黒色化にするには、表面に黒色樹脂をコーティングしたり、黒色塗料で塗装したりすればよい。このように、伝熱支持部材３２及び３３と底板部３４との表面を黒色とすることにより、金属の素材色と比較し熱放射率が大きくなり、放射伝熱量を増やすことができる。このため、伝熱支持部材３２及び３３と底板部３４との周囲への放熱が活発化され、制御回路基板２２及び電源回路基板２３の熱冷却を効率良く行うことができる。なお、底板部３４を除いて伝熱支持部材３２及び３３のみの表面を黒色にするようにしてもよい。   And the heat-transfer support members 32 and 33 and the baseplate part 34 have a black surface. In order to blacken the surfaces of the heat transfer support members 32 and 33 and the bottom plate portion 34, the surface may be coated with a black resin or painted with a black paint. Thus, by making the surfaces of the heat transfer support members 32 and 33 and the bottom plate portion 34 black, the heat emissivity becomes larger than the metal material color, and the amount of radiant heat transfer can be increased. For this reason, the heat dissipation to the circumference | surroundings of the heat-transfer support members 32 and 33 and the baseplate part 34 is activated, and the heat cooling of the control circuit board 22 and the power supply circuit board 23 can be performed efficiently. In addition, you may make it make the surface of only the heat-transfer support members 32 and 33 black except for the baseplate part 34. FIG.

伝熱支持部材３２は、平板上の伝熱支持板部３２ａと、この伝熱支持板部３２ａの図２で見てパワーモジュール１１の長辺に沿う右端側に固定ねじ３２ｂで固定された伝熱支持側板部３２ｃとで構成されている。そして、伝熱支持側板部３２ｃが共通の底板部３４に連結されている。
伝熱支持板部３２ａには、伝熱部材３５を介して制御回路基板２２が固定ねじ３６によって固定される。伝熱部材３５は、伸縮性を有する弾性体で電源回路基板２３と同じ外形寸法に構成されている。この伝熱部材３５としては、シリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。The heat transfer support member 32 includes a heat transfer support plate portion 32a on a flat plate, and a heat transfer support plate 32a fixed to the right end along the long side of the power module 11 as seen in FIG. It is comprised with the heat | fever support side board part 32c. The heat transfer support side plate portion 32 c is connected to the common bottom plate portion 34.
The control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.

また、伝熱支持側板部３２ｃは、図２に示すように、冷却体３の周溝３ｄ内に配置される共通の底板部３４の長辺側の外周縁に一体に連結されて上方に延長する連結板部３２ｄと、この連結板部３２ｄの上端から左方に延長する上板部３２ｅとで断面逆Ｌ字状に形成されている。連結板部３２ｄは、パワーモジュール１１の長辺側の右側面を通って上方に延長している。   Further, as shown in FIG. 2, the heat transfer support side plate portion 32 c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 arranged in the circumferential groove 3 d of the cooling body 3 and extends upward. The connecting plate portion 32d and the upper plate portion 32e extending leftward from the upper end of the connecting plate portion 32d are formed in an inverted L-shaped cross section. The connecting plate portion 32 d extends upward through the right side of the long side of the power module 11.

伝熱支持部材３３は、平板上の伝熱支持板部３３ａと、この伝熱支持板部３３ａの図２で見てパワーモジュール１１の長辺に沿う左端側に固定ねじ３３ｂで固定された伝熱支持側板部３３ｃとで構成されている。そして、伝熱支持側板部３３ｃが共通の底板部３４に連結されている。
伝熱支持板部３３ａには、前述した伝熱部材３５と同様の伝熱部材３７を介して電源回路基板２３が固定ねじ３８によって固定される。The heat transfer support member 33 includes a heat transfer support plate portion 33a on a flat plate, and a heat transfer support plate 33a fixed to the left end along the long side of the power module 11 with a fixing screw 33b as viewed in FIG. It is comprised with the heat | fever support side board part 33c. The heat transfer support side plate portion 33 c is connected to the common bottom plate portion 34.
The power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.

また、伝熱支持側板部３３ｃは、図２及び図３に示すように、冷却体３の周溝３ｄ内に配置される共通の底板部３４の長辺側の外周縁に一体に連結されて上方に延長する連結板部３３ｄと、この連結板部３３ｄの上端から左方に延長する上板部３３ｅとで断面逆Ｌ字状に形成されている。連結板部３３ｄは、パワーモジュール１１の長辺側の左側面を通って上方に延長している。   Further, as shown in FIGS. 2 and 3, the heat transfer support side plate portion 33 c is integrally connected to the outer peripheral edge on the long side of the common bottom plate portion 34 disposed in the circumferential groove 3 d of the cooling body 3. The connecting plate portion 33d extending upward and the upper plate portion 33e extending leftward from the upper end of the connecting plate portion 33d are formed in an inverted L-shaped cross section. The connecting plate portion 33 d extends upward through the left side surface on the long side of the power module 11.

そして、連結板部３３ｄの底板部３４及び上板部３３ｅとの連結部を例えば円筒面の一部でなる湾曲面３３ｆ及び３３ｇに形成している。このように連結板部３３ｄと底板部３４及び上板部３３ｅとの連結部を円筒状の湾曲面３３ｆ及び３３ｇとすることにより、上下振動や横揺れ等に対する耐振動性を向上することができる。すなわち、電力変換装置１に上下振動や横揺れが伝達されたときに連結板部３３ｄと底板部３４及び上板部３３ｅとの連結部に生じる応力集中を緩和することが可能となる。   And the connection part with the bottom board part 34 and the upper board part 33e of the connection board part 33d is formed in the curved surfaces 33f and 33g which are a part of cylindrical surface, for example. Thus, by making the connecting portions of the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e into cylindrical curved surfaces 33f and 33g, it is possible to improve vibration resistance against vertical vibration and roll. . That is, it is possible to alleviate the stress concentration generated in the connecting portion between the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e when vertical vibration or roll is transmitted to the power conversion device 1.

さらに、連結板部３３ｄと底板部３４及び上板部３３ｅとの連結部を円筒状の湾曲面３３ｆ及び３３ｇとすることにより、連結板部３３ｄと底板部３４及び上板部３３ｅとの連結部を直角のＬ字形状とする場合に比較して熱伝導経路を短くすることができる。このため、伝熱支持板部３３ａから冷却体３までの熱伝導経路を短くして、効率的な熱冷却が可能となる。   Further, by connecting the connecting plate portion 33d to the bottom plate portion 34 and the upper plate portion 33e with cylindrical curved surfaces 33f and 33g, the connecting portion between the connecting plate portion 33d and the bottom plate portion 34 and the upper plate portion 33e. The heat conduction path can be shortened as compared with the case of forming a right-angle L-shape. For this reason, the heat conduction path from the heat transfer support plate portion 33a to the cooling body 3 is shortened, and efficient heat cooling becomes possible.

さらに、制御回路基板２２及び電源回路基板２３には、発熱回路部品３９が、図４及び図５に示すように、下面側に実装されている。
そして、制御回路基板２２及び電源回路基板２３と、伝熱部材３５，３７及び伝熱支持板部３２ａ，３３ａとの連結が図４に示すように行われる。これら制御回路基板２２及び電源回路基板２３と、伝熱支持板部３２ａ及び３３ａとの連結は左右が逆となることを除いては実質的に同じであるので、電源回路基板２３及び伝熱支持板部３３ａを代表として説明する。Further, on the control circuit board 22 and the power circuit board 23, a heat generating circuit component 39 is mounted on the lower surface side as shown in FIGS.
Then, the control circuit board 22 and the power supply circuit board 23 are connected to the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a as shown in FIG. The connection between the control circuit board 22 and the power circuit board 23 and the heat transfer support plate portions 32a and 33a is substantially the same except that the left and right are reversed. The plate portion 33a will be described as a representative.

この電源回路基板２３と伝熱支持板部３３ａとの連結には、図４及び図５に示すように、伝熱部材３７の厚みＴより低い伝熱板部管理高さＨを有する間隔調整部材としての間座４０が用いられる。この間座４０は、伝熱支持板部３３ａに形成された固定ねじ３８が螺合する雌ねじ部４１の外周側に接着等によって仮止めされている。ここで、間座４０の伝熱板部管理高さＨは、伝熱部材３７の圧縮率が約５〜３０％となるように設定されている。このように、伝熱部材３７を約５〜３０％程度に圧縮することにより、熱抵抗が減り効率良い伝熱効果を発揮することができる。   As shown in FIGS. 4 and 5, the power supply circuit board 23 and the heat transfer support plate portion 33 a are connected to each other by an interval adjusting member having a heat transfer plate portion management height H lower than the thickness T of the heat transfer member 37. A spacer 40 is used. The spacer 40 is temporarily fixed by bonding or the like to the outer peripheral side of the female screw portion 41 into which the fixing screw 38 formed on the heat transfer support plate portion 33a is screwed. Here, the heat transfer plate part management height H of the spacer 40 is set so that the compression rate of the heat transfer member 37 is about 5 to 30%. Thus, by compressing the heat transfer member 37 to about 5 to 30%, the heat resistance can be reduced and an efficient heat transfer effect can be exhibited.

一方、伝熱部材３７には、継ぎねじ２５を挿通可能な挿通孔３７ａと、間座４０を挿通可能な挿通孔３７ｂとが形成されている。
そして、伝熱支持板部３３ａに仮止めされた間座４０を挿通孔３７ｂに挿通されるように伝熱部材３７を伝熱支持板部３３ａに載置し、この伝熱支持板部３３ａの上に電源回路基板２３を発熱回路部品３９が伝熱部材３７に接するように載置する。On the other hand, the heat transfer member 37 is formed with an insertion hole 37 a through which the joint screw 25 can be inserted and an insertion hole 37 b through which the spacer 40 can be inserted.
The heat transfer member 37 is placed on the heat transfer support plate 33a so that the spacer 40 temporarily fixed to the heat transfer support plate 33a is inserted into the insertion hole 37b. The power supply circuit board 23 is placed thereon so that the heat generating circuit component 39 is in contact with the heat transfer member 37.

この状態で、固定ねじ３８を電源回路基板２３の挿通孔２３ｂを通じ、間座４０の中心開口を通じて伝熱支持板部３３ａの雌ねじ部４１に螺合させる。そして、固定ねじ３８を伝熱部材３７の上面が間座４０の上面と略一致するまで締め付ける。
このため、伝熱部材３７が５〜３０％程度の圧縮率で圧縮されることになり、熱抵抗が減って効率の良い伝熱効果を発揮することができる。このとき、伝熱部材３７の圧縮率は間座４０の高さＨによって管理されるので、締め付け不足や締め付け過剰が生じることなく、適切な締め付けが行われる。In this state, the fixing screw 38 is screwed into the female screw portion 41 of the heat transfer support plate portion 33a through the insertion hole 23b of the power circuit board 23 and the central opening of the spacer 40. Then, the fixing screw 38 is tightened until the upper surface of the heat transfer member 37 substantially coincides with the upper surface of the spacer 40.
For this reason, the heat transfer member 37 is compressed at a compression rate of about 5 to 30%, so that the heat resistance is reduced and an efficient heat transfer effect can be exhibited. At this time, since the compression rate of the heat transfer member 37 is managed by the height H of the spacer 40, appropriate tightening is performed without causing insufficient tightening or excessive tightening.

また、電源回路基板２３の下面側に実装された発熱回路部品３９が伝熱部材３７の弾性によって伝熱部材３７内に埋め込まれる。このため、発熱回路部品３９と伝熱部材３７との接触が過不足なく行われるとともに、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの接触が良好に行われ、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの間の熱抵抗を減少させることができる。
制御回路基板２２と伝熱支持板部３２ａとの伝熱部材３５を介在させた連結も上記と同様にして行われる。Further, the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
The connection through the heat transfer member 35 between the control circuit board 22 and the heat transfer support plate portion 32a is performed in the same manner as described above.

なお、伝熱支持部材３２及び３３の伝熱支持板部３２ａ及び３３ａの下面には、絶縁距離を短くするために絶縁シート４２及び４３が貼着されている。
また、伝熱支持部材３３の伝熱支持側板部３３ｃにおける連結板部３３ｄには、図７に示すように、パワーモジュール１１の図１に示す３相交流出力端子１１ｂに対応する位置に後述するブスバー５５を挿通する例えば方形の３つの挿通孔３３ｉが形成されている。このように、３つの挿通孔３３ｉを形成することにより、隣接する挿通孔３３ｉ間に比較的幅広の伝熱路Ｌｈを形成することができ、全体の伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。Insulating sheets 42 and 43 are attached to the lower surfaces of the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33 in order to shorten the insulation distance.
Further, as shown in FIG. 7, the connecting plate portion 33d of the heat transfer support side plate portion 33c of the heat transfer support member 33 will be described later at a position corresponding to the three-phase AC output terminal 11b shown in FIG. For example, three rectangular insertion holes 33 i through which the bus bars 55 are inserted are formed. Thus, by forming the three insertion holes 33i, a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.

同様に、伝熱支持部材３２の伝熱支持側板部３２ｃの連結部にも、図１に示すように、パワーモジュール１１の正極及び負極端子１１ａに対向する位置にそれぞれ同様の挿通孔３２ｉが形成されている。この挿通孔３２ｉを形成することにより、上述した挿通孔３３ｉと同様の作用効果を得ることができる。   Similarly, also in the connection part of the heat-transfer support side plate part 32c of the heat-transfer support member 32, the same insertion hole 32i is formed in the position facing the positive electrode and negative electrode terminal 11a of the power module 11, respectively, as shown in FIG. Has been. By forming the insertion hole 32i, the same effect as that of the insertion hole 33i described above can be obtained.

また、伝熱支持部材３２及び３３の共通の底板部３４には、図２及び図３に示すように、パワーモジュール１１の固定ねじ１４を挿通する挿通孔１５に対向する位置に固定部材挿通孔３４ａが形成されている。さらに、底板部３４の上面とパワーモジュール１１に形成された放熱部材１３の下面との間に板状弾性部材４５が介在されている。
そして、パワーモジュール１１及び放熱部材１３の挿通孔１５及び底板部３４の固定部材挿通孔３４ａに固定ねじ１４を挿通し、この固定ねじ１４を冷却体３に形成された雌ねじ部３ｆに螺合させることにより、パワーモジュール１１と底板部３４とが冷却体３に固定されている。Further, as shown in FIGS. 2 and 3, the common bottom plate portion 34 of the heat transfer support members 32 and 33 has a fixing member insertion hole at a position facing the insertion hole 15 through which the fixing screw 14 of the power module 11 is inserted. 34a is formed. Further, a plate-like elastic member 45 is interposed between the upper surface of the bottom plate portion 34 and the lower surface of the heat dissipation member 13 formed in the power module 11.
Then, the fixing screw 14 is inserted into the insertion hole 15 of the power module 11 and the heat radiating member 13 and the fixing member insertion hole 34 a of the bottom plate portion 34, and the fixing screw 14 is screwed into the female screw portion 3 f formed in the cooling body 3. Thus, the power module 11 and the bottom plate portion 34 are fixed to the cooling body 3.

次に、上記第１の実施形態の電力変換装置１の組立方法を説明する。
先ず、図４で前述したように、電源回路基板２３を伝熱支持部材３３の伝熱支持板部３３ａに伝熱部材３７を介して重ね合わせ、固定ねじ３８によって伝熱部材３７を５〜３０％程度の圧縮率で圧縮した状態で電源回路基板２３、伝熱部材３７及び伝熱支持板部３３ａを固定して、電源回路ユニットＵ３を形成しておく。
同様に、制御回路基板２２を伝熱支持部材３２の伝熱支持板部３２ａに伝熱部材３５を介して重ね合わせ、固定ねじ３６によって伝熱部材３５を５〜３０％程度の圧縮率で圧縮した状態で制御回路基板２２、伝熱部材３５及び伝熱支持板部３２ａを固定して制御回路ユニットＵ２を形成しておく。Next, a method for assembling the power conversion device 1 according to the first embodiment will be described.
First, as described above with reference to FIG. 4, the power supply circuit board 23 is superposed on the heat transfer support plate portion 33 a of the heat transfer support member 33 via the heat transfer member 37, and the heat transfer member 37 is placed 5-30 by the fixing screw 38. The power supply circuit board 23, the heat transfer member 37, and the heat transfer support plate 33a are fixed in a state compressed at a compression rate of about% to form the power supply circuit unit U3.
Similarly, the control circuit board 22 is superposed on the heat transfer support plate portion 32a of the heat transfer support member 32 via the heat transfer member 35, and the heat transfer member 35 is compressed at a compression rate of about 5 to 30% by the fixing screw 36. In this state, the control circuit board 22, the heat transfer member 35, and the heat transfer support plate 32a are fixed to form the control circuit unit U2.

一方、冷却体３の周溝３ｄ内に、伝熱支持部材３２及び３３に共通の底板部３４を、その上面とパワーモジュール１１に形成した放熱部材１３の下面との間に板状弾性部材４５を介在させた状態で、パワーモジュール１１とともに固定ねじ１４で固定する。このように、パワーモジュール１１と伝熱支持部材３２及び３３の共通の底板部３４とを同時に冷却体３に固定することができるので、組立工数を減少させることができる。   On the other hand, in the circumferential groove 3 d of the cooling body 3, a bottom plate portion 34 common to the heat transfer support members 32 and 33 is provided between the upper surface thereof and the lower surface of the heat radiating member 13 formed in the power module 11. Is fixed with the fixing screw 14 together with the power module 11. Thus, since the power module 11 and the common bottom plate part 34 of the heat transfer support members 32 and 33 can be simultaneously fixed to the cooling body 3, the number of assembling steps can be reduced.

また、底板部３４を冷却体３に固定する際に板状弾性部材４５を底板部３４とパワーモジュール１１の放熱部材１３との間に介在させるので、この板状弾性部材４５によって底板部３４が冷却体３の周溝３ｄの底部に押し付けられて、底板部３４が冷却体３に確実に接触されて、広い接触面積を確保することができる。
また、パワーモジュール１１には、冷却体３に固定する前又は固定した後に、その上面に形成された基板固定部１６に駆動回路基板２１を載置する。そして、この駆動回路基板２１をその上方から４本の継ぎねじ２４によって基板固定部１６に固定する。そして、伝熱支持板部３２ａを伝熱支持側板部３２ｃに固定ねじ３２ｂで連結する。Further, since the plate-like elastic member 45 is interposed between the bottom plate portion 34 and the heat radiation member 13 of the power module 11 when the bottom plate portion 34 is fixed to the cooling body 3, the plate-like elastic member 45 causes the bottom plate portion 34 to be disposed. It is pressed against the bottom of the circumferential groove 3d of the cooling body 3, and the bottom plate portion 34 is reliably brought into contact with the cooling body 3, thereby ensuring a wide contact area.
Further, in the power module 11, the drive circuit board 21 is mounted on the board fixing part 16 formed on the upper surface thereof before or after being fixed to the cooling body 3. Then, the drive circuit board 21 is fixed to the board fixing portion 16 by four joint screws 24 from above. And the heat-transfer support plate part 32a is connected with the heat-transfer support side plate part 32c with the fixing screw 32b.

そして、継ぎねじ２４の上面に制御回路ユニットＵ２の制御回路基板２２を載置し、４本の継ぎねじ２５によって固定する。さらに、継ぎねじ２５の上面に電源回路ユニットＵ３の電源回路基板２３を載置し、４本の固定ねじ２６によって固定する。そして、伝熱支持板部３３ａを伝熱支持側板部３３ｃに固定ねじ３３ｂによって連結する。
その後、図１に示すように、パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５０を接続し、このブスバー５０の他端に冷却体３を貫通するフィルムコンデンサ４の正負の電極４ａを固定ねじ５１で連結する。さらに、パワーモジュール１１の直流入力端子１１ａに外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３を固定する。Then, the control circuit board 22 of the control circuit unit U <b> 2 is placed on the upper surface of the joint screw 24 and is fixed by the four joint screws 25. Further, the power supply circuit board 23 of the power supply circuit unit U 3 is placed on the upper surface of the joint screw 25 and fixed by the four fixing screws 26. And the heat-transfer support plate part 33a is connected with the heat-transfer support side plate part 33c by the fixing screw 33b.
After that, as shown in FIG. 1, a bus bar 50 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are connected to the other end of the bus bar 50. Connect with the fixing screw 51. Furthermore, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the DC input terminal 11 a of the power module 11.

さらに、パワーモジュール１１の３相交流出力端子１１ｂにブスバー５５を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７を配置する。そして、ブスバー５５の他端に外部の３相電動モータ（図示せず）に接続したモータ接続ケーブル５８の先端に固定した圧着端子５９を固定ねじ６０で固定して接続する。
その後、冷却体３の下面及び上面に、下部筐体２Ａ及び上部筐体２Ｂを、シール材を介して固定して電力変換装置１の組立を完了する。Further, a bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is arranged in the middle of the bus bar 55. Then, a crimp terminal 59 fixed to the tip of a motor connection cable 58 connected to an external three-phase electric motor (not shown) is fixed to the other end of the bus bar 55 with a fixing screw 60.
Thereafter, the lower housing 2A and the upper housing 2B are fixed to the lower surface and the upper surface of the cooling body 3 via a sealing material, and the assembly of the power conversion device 1 is completed.

この状態で、外部のコンバータ（図示せず）から直流電力を供給するとともに、電源回路基板２３に実装された電源回路、制御回路基板２２に実装された制御回路を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介してパワーモジュール１１に供給する。これによって、パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介してモータ接続ケーブル５８に供給し、３相電動モータ（図示せず）を駆動制御する。   In this state, DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state. A gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).

このとき、パワーモジュール１１に内蔵されたＩＧＢＴで発熱する。この発熱はパワーモジュール１１に形成された放熱部材１３が冷却体３の中央部３ｃに直接接触されているので、冷却体３に供給されている冷却水によって冷却される。
一方、制御回路基板２２及び電源回路基板２３に実装されている制御回路及び電源回路には発熱回路部品３９が含まれており、これら発熱回路部品３９で発熱を生じる。このとき、発熱回路部品３９は制御回路基板２２及び電源回路基板２３の下面側に実装されている。At this time, the IGBT built in the power module 11 generates heat. This heat generation is cooled by the cooling water supplied to the cooling body 3 because the heat radiating member 13 formed in the power module 11 is in direct contact with the central portion 3 c of the cooling body 3.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.

そして、これら制御回路基板２２及び電源回路基板２３の下面側には、熱伝導率が高く弾性を有する伝熱部材３５及び３７を介して伝熱支持部材３２及び３３の伝熱支持板部３２ａ及び３３ａが設けられている。
このため、発熱回路部品３９が伝熱部材３５及び３７で覆われ、発熱回路部品３９と伝熱部材３５及び３７との接触面積が大きくなるとともに密着して発熱回路部品３９と伝熱部材３５及び３７との熱抵抗が小さくなる。したがって、発熱回路部品３９の発熱が伝熱部材３５及び３７に効率よく伝熱される。そして、伝熱部材３５及び３７自体は５〜３０％程度の圧縮率で圧縮されて熱伝導率が高められているので、図８に示すように、伝熱部材３５及び３７に伝熱された熱が効率良く伝熱支持部材３２及び３３の伝熱支持板部３２ａ及び３３ａに伝達される。Then, on the lower surface side of the control circuit board 22 and the power circuit board 23, the heat transfer support plate portions 32a of the heat transfer support members 32 and 33 and the heat transfer members 35 and 37 having high thermal conductivity and elasticity are provided. 33a is provided.
Therefore, the heat generating circuit component 39 is covered with the heat transfer members 35 and 37, the contact area between the heat generating circuit component 39 and the heat transfer members 35 and 37 is increased, and the heat generating circuit component 39 and the heat transfer members 35 and 37 are in close contact with each other. The thermal resistance with 37 is reduced. Therefore, the heat generated by the heat generating circuit component 39 is efficiently transferred to the heat transfer members 35 and 37. Since the heat transfer members 35 and 37 themselves are compressed at a compression rate of about 5 to 30% to increase the thermal conductivity, the heat transfer members 35 and 37 are transferred to the heat transfer members 35 and 37 as shown in FIG. Heat is efficiently transmitted to the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33.

そして、伝熱支持板部３２ａ及び３３ａには、伝熱支持側板部３２ｃ及び３３ｃが連結されているので、伝熱支持板部３２ａ及び３３ａに伝達された熱は、図９に示すように、伝熱支持側板部３２ｃ及び３３ｃを通って共通の底板部３４に伝達される。この底板部３４は、冷却体３の周溝３ｄ内に直接接触されているので、伝達された熱は冷却体３に放熱される。   And since the heat transfer support side plate portions 32c and 33c are connected to the heat transfer support plate portions 32a and 33a, the heat transferred to the heat transfer support plate portions 32a and 33a is as shown in FIG. It is transmitted to the common bottom plate portion 34 through the heat transfer support side plate portions 32c and 33c. Since the bottom plate portion 34 is in direct contact with the circumferential groove 3 d of the cooling body 3, the transmitted heat is radiated to the cooling body 3.

さらに、底板部３４に伝達された熱は、その上面側から板状弾性部材４５を介してパワーモジュール１１の放熱部材１３に伝達され、この放熱部材１３を介して冷却体３の中央部３ｃに伝達されて放熱される。
このように、上記第１の実施形態によると、制御回路基板２２及び電源回路基板２３に実装された発熱回路部品３９の発熱が熱抵抗の大きな制御回路基板２２及び電源回路基板２３を介することなく直接伝熱部材３５及び３７に伝熱されるので、効率の良い放熱を行うことができる。Further, the heat transmitted to the bottom plate portion 34 is transmitted from the upper surface side to the heat radiating member 13 of the power module 11 via the plate-like elastic member 45, and to the central portion 3 c of the cooling body 3 via the heat radiating member 13. It is transmitted and dissipated.
As described above, according to the first embodiment, heat generated by the heat generating circuit component 39 mounted on the control circuit board 22 and the power circuit board 23 does not pass through the control circuit board 22 and the power circuit board 23 having a large thermal resistance. Since heat is directly transferred to the heat transfer members 35 and 37, efficient heat dissipation can be performed.

そして、伝熱部材３５及び３７に伝達された熱は伝熱支持板部３２ａ及び３３ａに伝熱され、さらに伝熱支持側板部３２ｃ及び３３ｃに伝達される。このとき、伝熱支持側板部３２ｃ及び３３ｃがパワーモジュール１１の長辺に沿って設けられている。
このため、伝熱面積を広くとることができ、広い放熱経路を確保することができる。しかも、伝熱支持側板部３２ｃ及び３３ｃは折れ曲がり部が円筒状の湾曲部とされているので、折れ曲がり部をＬ字状にする場合に比較して冷却体３までの伝熱距離を短くすることができる。ここで、熱輸送量Ｑは、下記（１）式で表すことができる。
Ｑ＝λ×（Ａ／Ｌ）×Ｔ …………（１）The heat transferred to the heat transfer members 35 and 37 is transferred to the heat transfer support plate portions 32a and 33a, and further transferred to the heat transfer support side plate portions 32c and 33c. At this time, the heat transfer support side plate portions 32 c and 33 c are provided along the long side of the power module 11.
For this reason, a wide heat transfer area can be taken, and a wide heat dissipation path can be secured. Moreover, since the bent portions of the heat transfer support side plate portions 32c and 33c are cylindrical curved portions, the heat transfer distance to the cooling body 3 is shortened as compared with the case where the bent portions are L-shaped. Can do. Here, the heat transport amount Q can be expressed by the following equation (1).
Q = λ × (A / L) × T (1)

ただし、λは熱伝導率［Ｗ／ｍ℃］、Ｔは温度差［℃］基板温度Ｔ１−冷却体温度Ｔ２、Ａは伝熱最小断面積［ｍ2］、Ｌは伝熱長さ［ｍ］である。
この（１）式から明らかなように、伝熱長さＬが短くなると、熱輸送量Ｑは増加することになり、良好な冷却効果を発揮することができる。Where λ is the thermal conductivity [W / m ° C.], T is the temperature difference [° C.] substrate temperature T 1 -cooling body temperature T 2, A is the minimum heat transfer cross section [m 2 ], and L is the heat transfer length [m]. ].
As is clear from the equation (1), when the heat transfer length L is shortened, the heat transport amount Q is increased, and a good cooling effect can be exhibited.

また、伝熱支持部材３２及び３３の伝熱支持側板部３２ｃ及び３３ｃが共通の底板部３４で一体化されているので、伝熱支持側板部３２ｃ及び３３ｃと底板部３４との間に部品同士の継ぎ目がなく、熱抵抗を抑制することができる。
さらに、発熱回路部品３９が実装された制御回路基板２２及び電源回路基板２３から冷却体３までの放熱経路に筐体２が含まれていないので、筐体２に伝熱性が要求されることがない。したがって、筐体２の構成材料としてアルミニウム等の高熱伝導率の金属を使用する必要がなく、合成樹脂材で筐体２を構成することが可能となり、軽量化を図ることができる。Further, since the heat transfer support side plate portions 32c and 33c of the heat transfer support members 32 and 33 are integrated by the common bottom plate portion 34, the components are arranged between the heat transfer support side plate portions 32c and 33c and the bottom plate portion 34. The heat resistance can be suppressed.
Furthermore, since the housing 2 is not included in the heat dissipation path from the control circuit board 22 and the power circuit board 23 on which the heat generating circuit component 39 is mounted to the cooling body 3, the housing 2 is required to have heat conductivity. Absent. Therefore, it is not necessary to use a metal having a high thermal conductivity such as aluminum as a constituent material of the casing 2, and the casing 2 can be configured with a synthetic resin material, and the weight can be reduced.

また、放熱経路が筐体２に依存することなく、電力変換装置１単独で放熱経路を形成することができるので、パワーモジュール１１と、駆動回路基板２１、制御回路基板２２及び電源回路基板２３を一体化した構成の電力変換装置１を種々の異なる形態の筐体２や冷却体３に適用することができる。このため、単体としての電力変換装置１の剛性及び放熱性とハンドリングとを向上させることができる。   Further, since the heat dissipation path can be formed by the power converter 1 alone without the heat dissipation path being dependent on the housing 2, the power module 11, the drive circuit board 21, the control circuit board 22, and the power supply circuit board 23 can be connected. The integrated power converter 1 can be applied to the housing 2 and the cooling body 3 in various different forms. For this reason, the rigidity, heat dissipation, and handling of the power converter 1 as a single unit can be improved.

また、制御回路基板２２及び電源回路基板２３に金属製の伝熱支持板部３２ａ及び３３ａが固定されているので、制御回路基板２２及び電源回路基板２３の剛性を高めることができる。すなわち、伝熱支持板部３２ａ及び３３ａで伝熱機能と剛性強化機能を発揮することができる。このため、電力変換装置１を車両の走行用モータを駆動するモータ駆動回路として適用する場合のように、電力変換装置１に図１０に示す上下振動や横揺れが作用する場合でも、伝熱支持部材３２及び３３で剛性を高めることができる。したがって、上下振動や横揺れ等の影響が少ない電力変換装置１を提供することができる。   Further, since the metal heat transfer support plates 32a and 33a are fixed to the control circuit board 22 and the power circuit board 23, the rigidity of the control circuit board 22 and the power circuit board 23 can be increased. That is, the heat transfer support plate portions 32a and 33a can exhibit a heat transfer function and a rigidity enhancement function. For this reason, even when the power converter 1 is applied as a motor drive circuit for driving a motor for driving a vehicle, even when the vertical vibration or roll shown in FIG. The members 32 and 33 can increase the rigidity. Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibration and roll.

なお、上記第１の実施形態においては、制御回路ユニットＵ２及び電源回路ユニットＵ３で、伝熱部材３５及び３７を制御回路基板２２及び電源回路基板２３と同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材３５及び３７を図６に示すように発熱回路部品３９が存在する箇所にのみ設けるようにしてもよい。   In the first embodiment, the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power supply circuit board 23 in the control circuit unit U2 and the power supply circuit unit U3 has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only at a location where the heat generating circuit component 39 exists as shown in FIG.

また、上記第１の実施形態においては、制御回路基板２２及び電源回路基板２３で発熱回路部品３９を裏面側の伝熱部材３５及び３７側に実装する場合について説明した。しかしながら、本発明は上記構成に限定されるものではない。すなわち、図１１に示すように、制御回路基板２２及び電源回路基板２３の伝熱部材３５及び３７とは反対側の外周領域Ａｏに実装するようにしてよい。この場合には、発熱量の大きい発熱回路部品３９が外周部側に配置されるので、発熱回路部品３９を中央に配置して他の回路部品で囲まれる場合に比較して発熱回路部品の空間への放熱を行うことが可能となる。このため、効率的な熱冷却を行うことができる。   In the first embodiment, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, as shown in FIG. 11, the control circuit board 22 and the power supply circuit board 23 may be mounted in the outer peripheral area Ao on the opposite side to the heat transfer members 35 and 37. In this case, since the heat generating circuit component 39 having a large heat generation amount is arranged on the outer peripheral side, the heat generating circuit component space is larger than the case where the heat generating circuit component 39 is arranged in the center and surrounded by other circuit components. It is possible to dissipate heat. For this reason, efficient thermal cooling can be performed.

さらには、図１２に示すように、制御回路基板２２及び電源回路基板２３のそれぞれにおいて、発熱回路部品３９を伝熱支持側板部３２ｃ及び３３ｃに近い部分に配置することにより、冷却体３迄の放熱経路の距離を短くするようにしてもよい。この場合でも、発熱回路部品３９の冷却体３までの放熱経路の距離が短くなるので、効率良い放熱を行うことができる。   Furthermore, as shown in FIG. 12, in each of the control circuit board 22 and the power supply circuit board 23, the heating circuit component 39 is disposed in a portion close to the heat transfer support side plates 32c and 33c, so You may make it shorten the distance of a thermal radiation path | route. Even in this case, since the distance of the heat radiation path to the cooling body 3 of the heat generating circuit component 39 is shortened, efficient heat radiation can be performed.

また、上記第１の実施形態においては、発熱回路部品３９を実装した基板が２種類存在する場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、発熱回路部品３９を実装した基板が例えば制御回路基板２２の一枚だけである場合には、図１３（ａ）に示すように構成してもよい。すなわち、制御回路基板２２の左右両側にそれぞれ伝熱支持側板部３２ｃ及び３２ｆを設けて、伝熱支持板部３２ａの両側に放熱経路を形成する。このように構成することにより、伝熱支持板部３２ａの両側に放熱経路が形成されることにより、放熱効果をより向上させることができる。
さらには、図１３（ｂ）に示すように伝熱支持側板部３２ｃに各回路ユニットＵ２及びＵ３を支持する上板部３２ｅを複数形成して、複数の回路基板を支持するようにしてもよい。In the first embodiment, the case where there are two types of substrates on which the heat generating circuit component 39 is mounted has been described. However, the present invention is not limited to the above-described configuration. For example, when the substrate on which the heat generating circuit component 39 is mounted is only one piece of the control circuit substrate 22, the configuration as shown in FIG. May be. That is, the heat transfer support side plates 32c and 32f are provided on the left and right sides of the control circuit board 22, respectively, and heat dissipation paths are formed on both sides of the heat transfer support plate 32a. By comprising in this way, the thermal radiation effect can be improved more by forming the thermal radiation path in the both sides of the heat-transfer support plate part 32a.
Furthermore, as shown in FIG. 13B, a plurality of upper plate portions 32e that support the circuit units U2 and U3 may be formed on the heat transfer support side plate portion 32c to support a plurality of circuit boards. .

次に、本発明の第２の実施形態を図１４及び図１５について説明する。
この第２の実施形態は、パワーモジュール１１に形成されている放熱部材１３が冷却体３に流れる冷却水に直接接触する冷却フィン６１を備えた構成とされている。これに応じて、冷却体３の中央部に冷却フィン６１を冷却水の通路に浸漬させる浸漬部６２を形成している。
そして、浸漬部６２を囲む周壁６３と放熱部材１３との間にＯリング等のシール部材６６が配設されている。Next, a second embodiment of the present invention will be described with reference to FIGS.
In the second embodiment, the heat dissipating member 13 formed in the power module 11 includes the cooling fins 61 that are in direct contact with the cooling water flowing in the cooling body 3. Accordingly, an immersion part 62 is formed in the central part of the cooling body 3 so that the cooling fins 61 are immersed in the passage of the cooling water.
A seal member 66 such as an O-ring is disposed between the peripheral wall 63 surrounding the immersion part 62 and the heat dissipation member 13.

その他の構成については前述した第１の実施形態と同様の構成を有し、図１及び図２との対応部分には同一符号を付しその詳細説明はこれを省略する。
この第２の実施形態によると、パワーモジュール１１の放熱部材１３に冷却フィン６１が形成され、この冷却フィン６１が冷却水に浸漬部６２で冷却水に浸漬されているので、パワーモジュール１１をより効率良く冷却することができる。The other configurations are the same as those of the first embodiment described above, and the same reference numerals are given to the corresponding portions to those in FIGS. 1 and 2, and the detailed description thereof will be omitted.
According to the second embodiment, the cooling fins 61 are formed in the heat dissipation member 13 of the power module 11, and the cooling fins 61 are immersed in the cooling water in the cooling water at the immersion part 62. It can be cooled efficiently.

次に、本発明の第3の実施形態を図１６について説明する。
この第３の実施形態は、伝熱支持側板部３２ｃ及び３３ｃをパワーモジュール１１内を通って冷却体３に接触するようにしたものである。
すなわち、第３の実施形態では、パワーモジュール１１の左右端部側に伝熱支持側板部３２ｃ及び３３ｃを挿通させる開口部としての貫通孔８１ａ及び８１ｂが前後方向に延長して形成されている。
ここで、貫通孔８１ａ及び８１ｂのそれぞれは、伝熱支持部材３２及び３３の伝熱支持側板部３２ｃ及び３２３ｃにおける上板部３２ｅ及び３３ｅを挿通することができるように位置及び幅が設定されている。Next, a third embodiment of the present invention will be described with reference to FIG.
In the third embodiment, the heat transfer support side plate portions 32 c and 33 c are brought into contact with the cooling body 3 through the power module 11.
That is, in the third embodiment, the through holes 81a and 81b as openings through which the heat transfer support side plates 32c and 33c are inserted are formed on the left and right ends of the power module 11 so as to extend in the front-rear direction.
Here, the positions and widths of the through holes 81a and 81b are set so that the upper plate portions 32e and 33e of the heat transfer support side plate portions 32c and 323c of the heat transfer support members 32 and 33 can be inserted. Yes.

そして、底板部３４で連結された伝熱支持部材３２及び３３の上方に、パワーモジュール１１を、その貫通孔８１ａ及び８１ｂが伝熱支持側板部３２ｃ及び３３ｃの上板部３２ｅ及び３３ｅに対向するように位置合わせした状態とする。この状態で、パワーモジュール１１を下方に降下させることにより、貫通孔８１ａ及び８１ｂ内に伝熱支持側板部３２ｃの上板部３２ｅ及び伝熱支持側板部３３ｃの上板部３３ｅが挿通される。そして、パワーモジュール１１の冷却部材１３の下面を底板部３４の上面に形成した板状弾性部材４５の上面に接触させる。   The power module 11 is disposed above the heat transfer support members 32 and 33 connected by the bottom plate portion 34, and the through holes 81a and 81b face the upper plate portions 32e and 33e of the heat transfer support side plate portions 32c and 33c. Thus, the state is aligned. In this state, the power module 11 is lowered to insert the upper plate portion 32e of the heat transfer support side plate portion 32c and the upper plate portion 33e of the heat transfer support side plate portion 33c into the through holes 81a and 81b. Then, the lower surface of the cooling member 13 of the power module 11 is brought into contact with the upper surface of the plate-like elastic member 45 formed on the upper surface of the bottom plate portion 34.

この状態で、パワーモジュール１１及び底板部３４を固定ねじ１４で共に冷却体３にねじ止めすることより、伝熱支持部材３２及び３３を冷却体３にパワーモジュール１１と共に固定する。
その後、パワーモジュール１１の上面に駆動回路基板２１、制御回路ユニットＵ２及び電源回路ユニットをＵ３を前述した第１の実施形態と同様に順次取り付け、制御回路ユニットＵ２側の伝熱支持板部３２ａを伝熱支持側板部３２ｃの上板部３２ｅに固定ねじ３２ｂでねじ止めする。また、電源回路ユニットＵ３側の伝熱支持板部３３ａを伝熱支持側板部３３ｃの上板部３３ｅに固定ねじ３３ｂでねじ止めする。In this state, the power module 11 and the bottom plate portion 34 are both screwed to the cooling body 3 with the fixing screws 14, whereby the heat transfer support members 32 and 33 are fixed to the cooling body 3 together with the power module 11.
Thereafter, the drive circuit board 21, the control circuit unit U2, and the power supply circuit unit are sequentially attached to the upper surface of the power module 11 in the same manner as in the first embodiment, and the heat transfer support plate 32a on the control circuit unit U2 side is attached. The upper plate portion 32e of the heat transfer support side plate portion 32c is screwed with a fixing screw 32b. Further, the heat transfer support plate portion 33a on the power circuit unit U3 side is screwed to the upper plate portion 33e of the heat transfer support side plate portion 33c with a fixing screw 33b.

この第３の実施形態によると、上記第１の実施形態の作用効果に加えて、共通の底板部３４で連結された伝熱支持部材３２及び３３の上方にパワーモジュール１１の貫通孔８１ａ及び８１ｂを対向させた状態で、パワーモジュール１１と伝熱支持部材３２及び３３とを相対移動させることにより、パワーモジュール１１と伝熱支持部材３２及び３３との組付けることができ、組付作業を容易に行うことができる。   According to the third embodiment, in addition to the operational effects of the first embodiment, the through holes 81a and 81b of the power module 11 are disposed above the heat transfer support members 32 and 33 connected by the common bottom plate portion 34. By moving the power module 11 and the heat transfer support members 32 and 33 relative to each other in a state of facing each other, the power module 11 and the heat transfer support members 32 and 33 can be assembled, and assembly work is easy. Can be done.

なお、上記第３の実施形態においては、パワーモジュール１１に形成した貫通孔８１ａ及び１８ｂ内に共通の底板部３４で連結された伝熱支持部材３２及び３３を挿通して、底板部３４を冷却体３にパワーモジュール１１と共に固定する場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、図１７に示すように、伝熱支持部材３２及び３３を貫通孔８１ａ及び８１ｂ内で冷却部材１３に直接固定するようにしてもよい。
すなわち、パワーモジュール１１を、その冷却部材１３を貫通孔８１ａ及び８１ｂを通じてパワーモジュール１１の上方側に臨ませるように延長した構成とする。In the third embodiment, the heat transfer support members 32 and 33 connected by the common bottom plate portion 34 are inserted into the through holes 81 a and 18 b formed in the power module 11 to cool the bottom plate portion 34. The case where it fixes to the body 3 with the power module 11 was demonstrated. However, the present invention is not limited to the above configuration, and as shown in FIG. 17, the heat transfer support members 32 and 33 may be directly fixed to the cooling member 13 in the through holes 81a and 81b.
That is, the power module 11 is configured to extend so that the cooling member 13 faces the upper side of the power module 11 through the through holes 81a and 81b.

一方、伝熱支持部材３２及び３３を連結する底板部３４を左右両端部を残して切断した形状に構成する。
そして、伝熱支持部材３２及び３３の伝熱支持部材３２及び３３の伝熱支持側板部３２ｃ及び３３ｃの底板部３２ｈ及び３３ｈを貫通孔８１ａ及び８１内に挿通して冷却部材１３の上面に当接させた状態で、ろう付け、ねじ止め等の固定手段によって冷却部材１３に固定する。この場合には、予め伝熱支持部材３２及び３３をパワーモジュール１１に一体化させておくことにより、組付工数を減少させて、組付作業をより容易に行うことができる。この場合には、パワーモジュール１１に形成する貫通孔８１ａ及び８１ｂの幅は、伝熱支持側板部３２ｃ及び３３ｃの底板部３２ｈ及び３３ｈを挿通可能な幅に設定すればよい。On the other hand, the bottom plate part 34 that connects the heat transfer support members 32 and 33 is formed in a shape that is cut leaving both left and right ends.
Then, the heat transfer support members 32 and 33 of the heat transfer support members 32 and 33 are inserted into the through holes 81a and 81 through the bottom plate portions 32h and 33h of the heat transfer support side plates 32c and 33c of the heat transfer support members 32 and 33 and contact the upper surface of the cooling member 13. In the contacted state, it is fixed to the cooling member 13 by fixing means such as brazing or screwing. In this case, by assembling the heat transfer support members 32 and 33 with the power module 11 in advance, the number of assembling steps can be reduced and the assembling work can be performed more easily. In this case, the width of the through holes 81a and 81b formed in the power module 11 may be set to a width that allows the bottom plate portions 32h and 33h of the heat transfer support side plate portions 32c and 33c to be inserted.

また、上記第３の実施形態においては、パワーモジュール１１に形成した貫通孔８１ａ及び１８ｂを形成する場合について説明したが、これに限定されるものではなく、貫通孔８１ａ及び８１ｂに代えて、パワーモジュール１１の左右端部から内方に切欠を形成するようにしてもよい。要は、伝熱支持部材３２及び３３の伝熱支持側板部３２ｃ及び３３ｃが挿通可能な開口部が形成されていればよい。   Moreover, in the said 3rd Embodiment, although the case where the through-holes 81a and 18b formed in the power module 11 were formed was demonstrated, it is not limited to this and it replaces with the through-holes 81a and 81b, and a power Cutouts may be formed inward from the left and right ends of the module 11. In short, it is only necessary to form openings through which the heat transfer support side plates 32c and 33c of the heat transfer support members 32 and 33 can be inserted.

また、上記第３の実施形態においては、パワーモジュール１１の左右端部側に貫通孔８１ａ及び８１ｂを形成した場合について説明したが、これに限らず、前後端部側に貫通孔を形成するようにしてもよく、さらにはパワーモジュール１１の隣接する辺の一方に貫通孔８１ａを形成し、他方に貫通孔８１ｂを形成するようにしてもよい。   Moreover, in the said 3rd Embodiment, although the case where the through-holes 81a and 81b were formed in the right-and-left end part side of the power module 11 was demonstrated, it is not restricted to this but a through-hole is formed in the front-and-rear end part side. Alternatively, the through hole 81a may be formed in one of the adjacent sides of the power module 11, and the through hole 81b may be formed in the other.

また、上記第３の実施形態においては、パワーモジュール１１に２つの貫通孔８１ａ及び８１ｂを形成した場合について説明したが、パワーモジュール１１の寸法によっては、貫通孔８１ａ及び８１ｂの一方のみを形成し、他方の貫通孔に挿通する伝熱支持側板部については第１の実施形態のようにパワーモジュール１１の側面を通って冷却体３に固定するようにしてもよい。   In the third embodiment, the case where the two through holes 81a and 81b are formed in the power module 11 has been described. However, depending on the size of the power module 11, only one of the through holes 81a and 81b is formed. The heat transfer support side plate portion inserted through the other through hole may be fixed to the cooling body 3 through the side surface of the power module 11 as in the first embodiment.

なお、上記第１〜第３の実施形態においては、伝熱支持部材３２及び３３の伝熱支持板部３２ａ及び３３ａと伝熱支持側板部３２ｃ及び３３ｃとを別体で構成する場合について説明した。しかしながら、本発明は、上記構成に限定されるものでなく、図１８に示すように、伝熱支持板部３２ａ及び３３ａと伝熱支持側板部３２ｃ及び３３ｃとを一体に構成するようにしてもよい。この場合には、伝熱支持板部３２ａ及び３３ａと伝熱支持側板部３２ｃ及び３２ｃとの間に継ぎ目が形成されることがなくなるので、熱抵抗を小さくしてより効率の良い放熱を行うことができる。   In the first to third embodiments, the case where the heat transfer support plate portions 32a and 33a of the heat transfer support members 32 and 33 and the heat transfer support side plate portions 32c and 33c are configured separately has been described. . However, the present invention is not limited to the above configuration, and as shown in FIG. 18, the heat transfer support plate portions 32a and 33a and the heat transfer support side plate portions 32c and 33c may be configured integrally. Good. In this case, since no seam is formed between the heat transfer support plate portions 32a and 33a and the heat transfer support side plate portions 32c and 32c, the heat resistance is reduced and more efficient heat dissipation is performed. Can do.

また、上記第１〜第３の実施形態においては、制御回路基板２２及び電源回路基板２３に伝熱部材３５及び３７を介して伝熱支持板部３２ａ及び３３ａを結合した場合について説明した。しかしながら、本発明は、上記構成に限定されるものではなく、制御回路基板２２及び電源回路基板として、図１９に示すように、アルミニウム又はアルミニウム合金を主体とした放熱板７１上に絶縁層７２を介して回路パターン７３を形成した金属ベース回路基板７４を適用することができる。この場合には、図１９に示すように、伝熱部材３５及び３７と伝熱支持板部３２ａ及び３３ａを省略して、金属ベース回路基板７４の放熱板７１を直接伝熱支持側板部３２ｃ及び３３ｃに接続するようにすればよい。   Moreover, in the said 1st-3rd embodiment, the case where the heat-transfer support plate part 32a and 33a were couple | bonded with the control circuit board 22 and the power supply circuit board 23 via the heat-transfer members 35 and 37 was demonstrated. However, the present invention is not limited to the above configuration, and as shown in FIG. 19, an insulating layer 72 is formed on a heat dissipation plate 71 mainly composed of aluminum or an aluminum alloy as the control circuit board 22 and the power supply circuit board. A metal base circuit board 74 on which a circuit pattern 73 is formed can be applied. In this case, as shown in FIG. 19, the heat transfer members 35 and 37 and the heat transfer support plate portions 32a and 33a are omitted, and the heat dissipation plate 71 of the metal base circuit board 74 is directly connected to the heat transfer support side plate portion 32c and What is necessary is just to make it connect to 33c.

また、上記第１〜第３の実施形態においては、制御回路基板２２と電源回路基板２３とを個別の伝熱支持部材で支持する場合について説明した。しかしながら、本発明は、上記構成に限定されるものではなく、伝熱支持部材を図２０〜図２４に示す構造とすることができる。   Moreover, in the said 1st-3rd embodiment, the case where the control circuit board 22 and the power circuit board 23 were supported by the separate heat-transfer support member was demonstrated. However, this invention is not limited to the said structure, A heat-transfer support member can be made into the structure shown in FIGS.

すなわち、前述した第１〜第３の実施形態における伝熱支持側板部３２及び３３を省略し、これらに代えて例えば矩形の制御回路規範２２及び電源回路基板２３の各側面に対応する４つの前側板部９１ａ、後側板部９１ｂ、左側板部９１ｃ及び右側板部９１ｄを共通の底板部３４から立ち上げて伝熱支持側板部９０を構成する。これら各板部９１ａ〜９１ｄの内、前側板部９１ａ及び後側板部９１ｂには、制御回路基板２２を支持する伝熱支持板部３２ａに対向する位置に左右一対の幅広の逆Ｕ字状スリット９２ａ，９２ｂを形成し、これら逆Ｕ字状スリット９２ａ，９２ｂで囲まれる板部を内側に９０度折り曲げて支持部９３ａ，９３ｂが形成されている。   That is, the heat transfer support side plates 32 and 33 in the first to third embodiments described above are omitted, and instead of these, for example, four fronts corresponding to the respective sides of the rectangular control circuit standard 22 and the power supply circuit board 23 are used. The side plate portion 91a, the rear side plate portion 91b, the left side plate portion 91c and the right side plate portion 91d are raised from the common bottom plate portion 34 to constitute the heat transfer support side plate portion 90. Among these plate portions 91a to 91d, the front plate portion 91a and the rear plate portion 91b have a pair of left and right wide inverted U-shaped slits at positions facing the heat transfer support plate portion 32a that supports the control circuit board 22. 92a and 92b are formed, and the support portions 93a and 93b are formed by bending the plate portion surrounded by the inverted U-shaped slits 92a and 92b inward by 90 degrees.

また、前側板部９１ａ及び後側板部９１ｂには、電源回路基板２３に対向する上端が内方に９０度折り曲げられて支持部９４ａ及び９４ｂが形成されている。
さらに、左側板部９１ｃ及び右側板部９１ｄにも、前側板部９１ａ及び後側板部９１ｂと同様に１つの逆Ｕ字状スリット９５ａ及び９５ｂが形成され、これら逆Ｕ字状スリット９５ａ及び９５ｂに囲まれる板部を内側に９０度折り曲げられて支持部９６ａ及び９６ｂが形成されている。また、左側板部９１ｃ及び右側板部９１ｄにも、電源回路基板２３に対向する上端が内方に９０度折り曲げられて支持部９７ａ及び９７ｂが形成されている。In addition, support portions 94a and 94b are formed on the front plate portion 91a and the rear plate portion 91b by bending the upper ends facing the power circuit board 23 inward by 90 degrees.
Further, the left side plate portion 91c and the right side plate portion 91d are formed with one inverted U-shaped slits 95a and 95b similarly to the front side plate portion 91a and the rear side plate portion 91b. Supporting parts 96a and 96b are formed by bending the enclosed plate part 90 degrees inward. Further, the left plate portion 91c and the right plate portion 91d are also formed with support portions 97a and 97b by bending the upper end facing the power circuit board 23 inward by 90 degrees.

そして、図２０〜図２３に示すように、側板部９１ａ〜８１ｄの中間部に形成された支持板部９３ａ，９３ｂ、９６ａ及び９６ｂ上に伝熱部材３５を介して制御回路基板２２を支持する伝熱支持板部３２ａを載置して、図示しない固定ねじで固定する。同様に、各側板部９１ａ〜９１ｄの上端に形成された支持板部９４ａ，９４ｂ，９７ａ及び９７ｂに伝熱部材３５を介して電源回路基板２３を支持する伝熱支持板部３３ａを載置して、図示しない固定ねじで固定する。
このようにして、制御回路基板２２及び電源回路基板２３を支持した伝熱支持側板部９０を、前述した第１及び第２の実施形態と同様に半導体パワーモジュール１２とともに、冷却体３に固定する。20 to 23, the control circuit board 22 is supported via the heat transfer member 35 on the support plate portions 93a, 93b, 96a, and 96b formed in the intermediate portion of the side plate portions 91a to 81d. The heat transfer support plate portion 32a is placed and fixed with a fixing screw (not shown). Similarly, a heat transfer support plate portion 33a that supports the power supply circuit board 23 via the heat transfer member 35 is placed on the support plate portions 94a, 94b, 97a, and 97b formed at the upper ends of the side plate portions 91a to 91d. And fix with a fixing screw (not shown).
In this way, the heat transfer support side plate 90 supporting the control circuit board 22 and the power supply circuit board 23 is fixed to the cooling body 3 together with the semiconductor power module 12 as in the first and second embodiments. .

伝熱支持側板部９０を上記のように構成することにより、制御回路基板２２及び電源回路基板２３に実装された発熱回路部品で発生する発熱を伝熱支持板部３２ａ及び３３ａと伝熱支持側板部９０を介して冷却体３に確実に放熱することができる。したがって、上記第１及び第２の実施形態と同様の作用効果を得ることができる。しかも、伝熱支持側板部９０を図２０〜図２４のように構成することにより、制御回路基板２２及び電源回路基板２３を支持する伝熱支持側板部を１つの部材で構成することができるとともに、複数の伝熱経路を確保することができ、放熱効率を向上させることができる。さらに、支持部８３ａ，８３ｂ及び８６ａ，８６ｂを逆Ｕ字状スリット８２ａ，８２ｂ及び８５ａ，８５ｂで囲まれる板部を折り曲げて形成している。このため、折り曲げ後に伝熱支持側板部９０の内外を通じる空間部が形成されることになり、この空間部を放熱路として利用することができ、放熱効果をより向上させることができる。なお、図２０〜図２４の構成では、支持部８３ａ，８３ｂ，８４ａ，８４ｂ、８６ａ，８６ｂ，８７ａ，８７ｂを折曲支持部として形成した場合について説明したが、内側に突出する板状の支持部を溶接等の固着手段で固定するようにしてもよい。   By configuring the heat transfer support side plate 90 as described above, the heat transfer support plate portions 32a and 33a and the heat transfer support side plate generate heat generated by the heat generating circuit components mounted on the control circuit board 22 and the power circuit board 23. Heat can be reliably radiated to the cooling body 3 via the portion 90. Therefore, the same effect as the first and second embodiments can be obtained. Moreover, by configuring the heat transfer support side plate portion 90 as shown in FIGS. 20 to 24, the heat transfer support side plate portion that supports the control circuit board 22 and the power supply circuit board 23 can be formed of a single member. A plurality of heat transfer paths can be secured, and the heat radiation efficiency can be improved. Further, the support portions 83a, 83b and 86a, 86b are formed by bending the plate portions surrounded by the inverted U-shaped slits 82a, 82b and 85a, 85b. For this reason, the space part which passes the inside and outside of the heat-transfer support side board part 90 after bending will be formed, this space part can be utilized as a thermal radiation path, and the thermal radiation effect can be improved more. In the configuration of FIGS. 20 to 24, the case where the support portions 83a, 83b, 84a, 84b, 86a, 86b, 87a, 87b are formed as the bending support portions has been described. The part may be fixed by fixing means such as welding.

また、上記第１〜第３の実施形態では、制御回路基板２２及び電源回路基板２３と伝熱支持板部３２ａ及び３３ａとの間に介挿した伝熱部材３５及び３７が弾性を有する場合について説明した。しかしながら、本発明では上記構成に限定されるものではなく、絶縁被覆した金属板等の弾性を有さない伝熱部材を適用することもできる。
さらに、上記第１〜第３の実施形態では、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。Moreover, in the said 1st-3rd embodiment, about the case where the heat-transfer members 35 and 37 inserted between the control circuit board 22 and the power circuit board 23, and the heat-transfer support-plate parts 32a and 33a have elasticity. explained. However, in this invention, it is not limited to the said structure, The heat-transfer member which does not have elasticity, such as an insulating-coated metal plate, can also be applied.
Furthermore, in the first to third embodiments, the case where the film capacitor 4 is applied as a smoothing capacitor has been described. However, the present invention is not limited to this, and a cylindrical electrolytic capacitor is applied. Also good.

また、上記第１〜第３の実施形態においては、本発明による電力変換装置を電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置を適用することができる。   Moreover, in the said 1st-3rd embodiment, although the case where the power converter device by this invention was applied to an electric vehicle was demonstrated, it is not limited to this, This is applied also to the rail vehicle which drive | works a rail. The invention can be applied and can be applied to any electric drive vehicle. Furthermore, the power conversion device is not limited to an electrically driven vehicle, and the power conversion device of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.

本発明によれば、基板に実装された発熱回路部品の熱の放熱経路に筐体を介在させることなく、発熱回路部品の熱を効率よく冷却体に放熱することができる電力変換装置を提供することができる。   According to the present invention, there is provided a power conversion device capable of efficiently dissipating heat of a heat generating circuit component to a cooling body without interposing a housing in a heat dissipation path of the heat generating circuit component mounted on a substrate. be able to.

１…電力変換装置、２…筐体、３…冷却体、４…フィルムコンデンサ、５…蓄電池収納部、１１…パワーモジュール、１２…ケース体、１３…放熱部材、２１…駆動回路基板、２２…制御回路基板、２３…電源回路基板、２４，２５…継ぎねじ、３２…伝熱支持部材、３２ａ…伝熱支持板部、３２ｂ…固定ねじ、３２ｃ…伝熱支持側板部、３３…伝熱支持部材、３３ａ…伝熱支持板部、３３ｂ…固定ねじ、３３ｃ…伝熱支持側板部、３４…底板部、３５，３７…伝熱部材、３９…発熱回路部品、４０…間座（間隔調整部材）、４５…板状弾性部材、６１…冷却フィン、７１…放熱板、７２…絶縁層、７３…回路パターン、７４…金属ベース回路基板、８１ａ，８１ｂ…貫通孔、９０…伝熱支持側板部、９１ａ…前側板部、９１ｂ…後側板部、９１ｃ…左側板部、９１ｄ…右側板部、９３ａ，９３ｂ，９４ａ，９４ｂ、９６ａ，９６ｂ，９７ａ，９７ｂ…支持部   DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 3 ... Cooling body, 4 ... Film capacitor, 5 ... Storage battery storage part, 11 ... Power module, 12 ... Case body, 13 ... Heat dissipation member, 21 ... Drive circuit board, 22 ... Control circuit board, 23 ... Power supply circuit board, 24, 25 ... Joint screw, 32 ... Heat transfer support member, 32a ... Heat transfer support plate part, 32b ... Fixing screw, 32c ... Heat transfer support side plate part, 33 ... Heat transfer support Member 33a ... Heat transfer support plate portion 33b ... Fixing screw 33c ... Heat transfer support side plate portion 34 ... Bottom plate portion 35, 37 ... Heat transfer member 39 ... Heat generating circuit component 40 ... Spacer (space adjustment member , 45 ... Plate-like elastic member, 61 ... Cooling fin, 71 ... Heat sink, 72 ... Insulating layer, 73 ... Circuit pattern, 74 ... Metal base circuit board, 81a, 81b ... Through hole, 90 ... Heat transfer support side plate 91a ... front side plate part, 91b ... rear side plate part, 1c ... left side plate portion, 91d ... right side plate portion, 93a, 93b, 94a, 94b, 96a, 96b, 97a, 97b ... support section

Claims (25)

電力変換用の半導体スイッチング素子を内蔵し、一面にフィン付放熱部材を有する半導体パワーモジュールと、
前記フィン付放熱部材に接合される冷却体と、
前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した複数の実装基板と、
該複数の実装基板を個別に前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記半導体パワーモジュールの少なくとも一側面側を通って前記冷却体に接触する複数の伝熱支持部材とを備え、
前記実装基板と前記伝熱支持部材との組毎に前記伝熱支持部材の伝熱支持側板部の高さを異ならせるとともに、当該伝熱支持側板部が前記半導体パワーモジュールの異なる側面を通って前記冷却体に接触されていることを特徴とする電力変換装置。 A semiconductor power module incorporating a semiconductor switching element for power conversion and having a finned heat dissipation member on one surface;
A cooling body joined to the finned heat dissipation member;
A plurality of mounting boards on which circuit components including heat generating circuit components for driving the semiconductor switching element are mounted;
The plurality of mounting substrate support with a predetermined distance between individual said semiconductor power module, at least of the semiconductor power module to the heat radiation without the intervention of a housing of the heating of the mounting substrate to the cooling body A plurality of heat transfer support members that contact the cooling body through one side surface ;
The height of the heat transfer support side plate portion of the heat transfer support member is made different for each set of the mounting substrate and the heat transfer support member, and the heat transfer support side plate portion passes through different side surfaces of the semiconductor power module. A power conversion device being in contact with the cooling body . 前記半導体パワーモジュールは、長方形の平面を有する扁平直方体形状を有し、前記複数の伝熱支持部材の少なくとも一つは、前記半導体パワーモジュールの長辺側の一側面を通るように配置され、他の伝熱支持部材の少なくとも一つは前記半導体パワーモジュールの長辺側の他側面を通るように配置されていることを特徴とする請求項１に記載の電力変換装置。 The semiconductor power module has a rectangular parallelepiped shape having a rectangular plane, and at least one of the plurality of heat transfer support members is disposed so as to pass through one side surface of the long side of the semiconductor power module. at least one power converter according to claim 1, characterized that you have been arranged to pass through the other side of the long side of the semiconductor power module of heat transfer support member. 前記伝熱支持部材は、前記半導体パワーモジュールに形成された接続端子に対応する位置に挿通孔を形成したことを特徴とする請求項１又は２に記載の電力変換装置。 The power conversion device according to claim 1 , wherein the heat transfer support member has an insertion hole formed at a position corresponding to a connection terminal formed in the semiconductor power module . 電力変換用の半導体スイッチング素子を内蔵し、一面に冷却体に接触するフィン付放熱部材が形成された半導体パワーモジュールと、
前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した複数の実装基板と、
該複数の実装基板を個別に前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記半導体パワーモジュールの少なくとも一部を通って前記冷却体に接触する伝熱支持部材とを備え、
前記実装基板と前記伝熱支持部材との組毎に前記伝熱支持部材の伝熱支持側板部の高さを異ならせるとともに、当該伝熱支持側板部が前記半導体パワーモジュールの異なる一部を通って前記冷却体に接触されている
ことを特徴とする電力変換装置。 A semiconductor power module that incorporates a semiconductor switching element for power conversion and has a finned heat dissipation member in contact with the cooling body on one surface;
A plurality of mounting boards on which circuit components including heat generating circuit components for driving the semiconductor switching element are mounted;
The plurality of mounting boards are individually supported at a predetermined distance from the semiconductor power module, and at least the semiconductor power module is configured to dissipate heat generated by the mounting board to the cooling body without passing through a housing. A heat transfer support member in contact with the cooling body through a part,
The height of the heat transfer support side plate portion of the heat transfer support member is varied for each set of the mounting substrate and the heat transfer support member, and the heat transfer support side plate portion passes through a different part of the semiconductor power module. it characterized in that it is in contact with the cooling body Te power converter. 前記冷却体は水冷ジャケット構成を有することを特徴とする請求項１乃至４の何れか１項に記載の電力変換装置。 The cooling body power converter according to any one of claims 1 to 4, characterized in Rukoto to have a water-cooling jacket structure. 前記実装基板は金属ベース回路基板で構成されていることを特徴とする請求項１乃至５の何れか１項に記載の電力変換装置。 The mounting board power converter according to any one of claims 1 to 5, characterized in that it is constituted by a metal base circuit board. 前記実装基板と前記伝熱支持部材との間に伝熱部材を介挿したことを特徴とする請求項１乃至５の何れか１項に記載の電力変換装置。 The power converter according to any one of claims 1 to 5, wherein a heat transfer member is interposed between the mounting substrate and the heat transfer support member . 前記伝熱部材は、絶縁性を有する絶縁体で構成されていることを特徴とする請求項７に記載の電力変換装置。 The power conversion device according to claim 7, wherein the heat transfer member is made of an insulating material . 前記伝熱部材は、伸縮性を有する弾性体で構成されていることを特徴とする請求項７に記載の電力変換装置。 The power conversion device according to claim 7 , wherein the heat transfer member is formed of an elastic body having elasticity . 前記伝熱部材は、伸縮性を有する弾性体で構成され、前記実装基板の前記伝熱板部側実装面に前記発熱回路部品が実装されていることを特徴とする請求項７に記載の電力変換装置。 The electric power according to claim 7 , wherein the heat transfer member is formed of an elastic body having elasticity, and the heat generating circuit component is mounted on the mounting surface of the mounting board on the heat transfer plate part side. Conversion device. 前記伝熱部材は、前記実装基板と同じ大きさに形成されていることを特徴とする請求項７に記載の電力変換装置。 The power conversion device according to claim 7 , wherein the heat transfer member is formed in the same size as the mounting substrate . 前記伝熱部材は、前記実装基板に実装される電子回路部品のうち相対的に発熱量又は伝熱密度の大きい発熱回路部品の周囲のみに配置したことを特徴とする請求項７に記載の電力変換装置。 The electric power according to claim 7 , wherein the heat transfer member is disposed only around a heat generation circuit component having a relatively large heat generation amount or heat transfer density among electronic circuit components mounted on the mounting substrate. Conversion device. 前記実装基板と前記伝熱支持部材の伝熱支持板部とを前記伝熱部材を介して締付固定部材で固定したことを特徴とする請求項７に記載の電力変換装置。 The power converter according to claim 7 , wherein the mounting substrate and a heat transfer support plate portion of the heat transfer support member are fixed by a tightening fixing member via the heat transfer member . 前記締付固定部材の周囲に前記実装基板と前記伝熱支持部材の伝熱支持板部との間隔を所定値に維持する間隔調整部材が介挿されていることを特徴とする請求項１３に記載の電力変換装置。 Claims 1 to 3, characterized in that the spacing adjustment member to maintain the distance between the heat transfer support plate portion of the mounting substrate and the heat transfer support member on the periphery of the fixed member the tightening to a predetermined value is interposed The power converter device described in 1. 前記伝熱支持部材は、伝熱部材を介して前記実装基板を支持する伝熱支持板部と、該伝熱支持板部の側面を固定支持して前記冷却体に接触される伝熱支持側板部とで構成されていることを特徴とする請求項１乃至５の何れか１項に記載の電力変換装置。 The heat transfer support member includes a heat transfer support plate portion that supports the mounting substrate via the heat transfer member, and a heat transfer support side plate that is fixedly supported on a side surface of the heat transfer support plate portion and is in contact with the cooling body. parts and be composed of a power converter according to any one of claims 1 to 5, characterized in. 前記伝熱支持側板部は、前記実装基板の各側面に対応する板部を有し、当該各板部に前記伝熱支持板部を支持する支持部を形成したことを特徴とする請求項１５に記載の電力変換装置。 2. The heat transfer support side plate portion includes a plate portion corresponding to each side surface of the mounting substrate, and a support portion that supports the heat transfer support plate portion is formed on each plate portion. 5. The power conversion device according to 5 . 前記伝熱支持板部と前記伝熱支持側板部とが一体に形成されていることを特徴とする請求項１５又は１６に記載の電力変換装置。 The power conversion device according to claim 15 or 16, wherein the heat transfer support plate portion and the heat transfer support side plate portion are integrally formed . 前記伝熱支持板部は、複数の伝熱支持側板部に固定支持されていることを特徴とする請求項１７に記載の電力変換装置。 The power conversion device according to claim 17 , wherein the heat transfer support plate portion is fixedly supported by a plurality of heat transfer support side plate portions . 前記伝熱支持部材の伝熱支持側板部は前記半導体パワーモジュールの前記フィン付放熱部材及び前記冷却体間に挿通される冷却体接触板部を有することを特徴とする請求項１５又は１６に記載の電力変換装置。 Heat transfer support plate portion of the heat transfer support member to claim 1 5 or 16 which comprises said cooling body contacting plate portion to be inserted between the finned heat radiating member and the cooling body of the semiconductor power module The power converter described. 前記冷却体接触板部と前記半導体パワーモジュールの前記フィン付放熱部材との間に板状弾性部材が介挿されていることを特徴とする請求項１９に記載の電力変換装置。 Power converter according to claim 1 9, characterized in that the plate-like elastic member is interposed between said finned heat dissipating member of the cooling body contacting plate portion and the semiconductor power module. 前記冷却体接触板部は、前記半導体パワーモジュールに形成された当該半導体パワーモジュールを前記冷却体に固定する固定部材を挿通する挿通孔に対向する位置に固定部材挿通孔が形成されていることを特徴とする請求項２０に記載の電力変換装置。 The cooling body contact plate portion has a fixing member insertion hole formed at a position facing an insertion hole through which a fixing member for fixing the semiconductor power module formed on the semiconductor power module to the cooling body is inserted. The power converter according to claim 20, wherein 前記半導体パワーモジュールは、前記冷却体を当該半導体パワーモジュールの前記冷却体とは反対側に臨ませる開口部が形成され、
前記伝熱支持部材は、伝熱部材を介して前記実装基板を支持する伝熱支持板部と、該伝熱支持板部の側面を固定支持して前記半導体パワーモジュールの前記開口部を通じて前記冷却体に接触される伝熱支持側板部とで構成されている
ことを特徴とする請求項４に記載の電力変換装置。 The semiconductor power module is formed with an opening that allows the cooling body to face the opposite side of the cooling body of the semiconductor power module,
The heat transfer support member includes a heat transfer support plate portion that supports the mounting substrate via the heat transfer member, and fixedly supports a side surface of the heat transfer support plate portion, and the cooling through the opening of the semiconductor power module. power converter according to claim 4, characterized in that that consists of a heat transfer support plate portion to be contacted with the body. 前記伝熱支持板部は、複数の伝熱支持側板部に固定支持されていることを特徴とする請求項２２に記載の電力変換装置。 The power conversion device according to claim 22, wherein the heat transfer support plate portion is fixedly supported by a plurality of heat transfer support side plate portions . 前記伝熱支持部材は、黒色の表面を有することを特徴とする請求項１乃至１６の何れか１項に記載の電力変換装置。 The heat transfer support member, a power conversion apparatus according to any one of claims 1 to 16, wherein the Rukoto to have a black surface. 前記実装基板は、相対的に発熱量又は伝熱密度の大きい発熱回路部品を前記冷却体への伝熱距離が短くなる位置に配置したことを特徴とする請求項１乃至１６の何れか１項に記載の電力変換装置。 The mounting board, relatively calorific value or claims 1 to 16 any one of a large heat generating circuit components of the heat transfer density heat transfer distance to the cooling body, characterized in that arranged in shortened position The power converter device described in 1.
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