WO2014020807A1 - Cooling structure and power converter - Google Patents

Cooling structure and power converter Download PDF

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Publication number
WO2014020807A1
WO2014020807A1 PCT/JP2013/003050 JP2013003050W WO2014020807A1 WO 2014020807 A1 WO2014020807 A1 WO 2014020807A1 JP 2013003050 W JP2013003050 W JP 2013003050W WO 2014020807 A1 WO2014020807 A1 WO 2014020807A1
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WO
WIPO (PCT)
Prior art keywords
cooling body
heat
joined
liquid
heat transfer
Prior art date
Application number
PCT/JP2013/003050
Other languages
French (fr)
Japanese (ja)
Inventor
泰仁 田中
Original Assignee
富士電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士電機株式会社 filed Critical 富士電機株式会社
Priority to JP2014527955A priority Critical patent/JPWO2014020807A1/en
Priority to CN201380024911.1A priority patent/CN104303294A/en
Publication of WO2014020807A1 publication Critical patent/WO2014020807A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion.
  • the present invention relates to a power conversion device that supports a mounted substrate.
  • a power conversion device described in Patent Document 1 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
  • a water cooling jacket through which a coolant passes is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket.
  • this power converter device is provided with an immersion part that opens on the side to be joined to the power module in the water cooling jacket and allows the coolant to flow, and the liquid contact with the power module that protrudes toward the water cooling jacket and is immersed in the immersion part.
  • a direct cooling system with a part is adopted.
  • a circumferential groove is formed on one of the joint surfaces of the power module and the water cooling jacket, an O-ring is attached to the circumferential groove, and the O-ring is crushed between the joint surfaces to achieve liquid-tight sealing.
  • a structure is provided.
  • the general shape of the circumferential groove is a square shape, but the O-ring may come out of the circumferential groove before the O-rings are crushed between the joining surfaces, which is problematic in terms of assembly efficiency.
  • the present invention has been made paying attention to the above-mentioned unsolved problems of the conventional example, and is intended to reduce the machining cost and improve the assembly efficiency by making the O-ring difficult to come out from the circumferential groove. It is an object of the present invention to provide a cooling structure and a power conversion device that can perform the above.
  • a cooling structure includes a heating element and a cooling body bonded to the heating element, and the cooling body is a side bonded to the heating element.
  • the heating element is provided with a dipping part that is formed to open to the cooling liquid.
  • the liquid-tight sealing part which liquid-tightly seals an immersion part is provided.
  • the power converter device which concerns on 1 aspect of this invention is equipped with the semiconductor power module by which the heat radiating member was formed in one surface, and the cooling body joined to the said heat radiating member,
  • the said cooling body is in the said heat radiating member.
  • An immersion part that is open on the side to be joined and has a immersion liquid flowing therethrough is provided, and the heat radiating member is formed by protruding a liquid contact part that is inserted and arranged in the immersion part on the side to be joined to the cooling body.
  • a liquid-tight sealing part that liquid-tightly seals the immersion part is provided.
  • the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
  • the power conversion device includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module.
  • the heat dissipating member includes a protruding liquid contact portion inserted and arranged in the immersion portion on a side to be joined to the cooling body, and a circumferential groove formed so as to surround the opening of the immersion portion and fitted with an O-ring.
  • the heat dissipating member and the cooling body are joined to each other with the heat transfer plate sandwiched between the flat joining surfaces on the outer peripheral side of the circumferential groove, and the cross-sectional diameter of the O-ring is the same as that of the O-ring and the cooling member.
  • the contact surface with the body, the O-ring and the circumferential groove It is greater than the distance between the contact surfaces. According to the power conversion device according to this aspect, the heat dissipating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. The processing cost when forming the groove is reduced.
  • the power conversion device includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board.
  • the cooling body is opened to the side to be joined to the heat radiating member, and an immersion portion is formed to immerse the liquid contact portion in a flowing coolant.
  • Part was provided a liquid-tight seal portion for fluid-tight seal from the outside.
  • the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
  • the power conversion device includes a circumferential groove formed on a side where the liquid-tight sealing portion is joined to the cooling body of the heat radiating member so as to surround an outer side of the immersion portion. And an O-ring mounted on the circumferential groove while being prevented from coming off.
  • the liquid-tight sealing portion can be formed with a simple configuration.
  • the circumferential groove includes a first inclined inner wall extending in an inclined manner from one side in the width direction of the groove bottom to the opening, and a width direction of the groove bottom. It is formed in a dovetail groove shape including a second inclined inner wall that extends from the other side to the opening. According to the power conversion device according to this aspect, the O-ring does not fall out from the dovetail-shaped peripheral groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power conversion device. Can be improved.
  • the circumferential groove has an inclined inner wall that extends from the groove bottom to the opening, and a vertical inner wall that extends vertically from the groove bottom to the opening. It is a one-sided groove shape provided with. According to the power converter according to this aspect, the O-ring does not fall out from the circumferential groove having a single groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power converter. Can be improved.
  • cooling structure and the power conversion device it is possible to reduce the processing cost and improve the assembly efficiency by adopting a structure in which the O-ring does not easily come out from the circumferential groove.
  • FIG. 1 is a cross-sectional view showing the overall configuration of the present invention
  • FIG. 2 is an enlarged view of the main part of FIG.
  • Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2.
  • the casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
  • the lower housing 2A is a bottomed rectangular tube.
  • the lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
  • the upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a.
  • the lower end of the rectangular tube 2a is closed by the cooling body 3.
  • a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
  • the cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open.
  • the water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
  • a dipping part 5 In the center of the upper surface of the cooling body 3 is formed a dipping part 5 that opens in a square shape communicating with the water supply port 3a and the drainage port 3b.
  • An O-ring contact portion 8 that protrudes upward from a flat upper surface (reference numeral 3c in FIG. 2) and that contacts an O-ring 7 described later is formed.
  • the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 ⁇ / b> A are inserted vertically.
  • the power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion.
  • the power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
  • a liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13.
  • the liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
  • a square frame-shaped circumferential groove 18 is formed around the liquid contact portion 17 on the lower surface 13 a of the heat radiating member 13, and an O-ring 19 is attached to the circumferential groove 18.
  • the cross-sectional shape of the circumferential groove 18 includes a first inclined inner wall 18c extending inclined from one side in the width direction of the groove bottom 18a to the opening 18b and the other side in the width direction of the groove bottom 18a. And a second inclined inner wall 18d extending in an inclined manner from the opening 18b to the opening 18b.
  • the cross-sectional diameter of the O-ring 19 is a value larger than the vertical height dimension from the groove bottom 18a of the circumferential groove 18 to the opening 18b.
  • the O-ring 19 has a cross-sectional diameter set to a value larger than the width of the opening 18b, and is mounted inside the dovetail-shaped peripheral groove 18 while being elastically deformed.
  • the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners as viewed from above.
  • substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
  • a driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16.
  • a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval.
  • a control circuit board 22 as a board is fixed.
  • a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
  • the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
  • the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
  • the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
  • the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2.
  • These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
  • the heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
  • the control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35.
  • the heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
  • the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13.
  • the support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
  • the power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
  • connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions.
  • the connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions.
  • the heat circuit component 39 is mounted on the lower surface side of the power circuit board 23, and the power circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38.
  • the insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
  • the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
  • a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36.
  • An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
  • the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency.
  • the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
  • a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG.
  • three rectangular insertion holes 33i are formed.
  • a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
  • the fixing screw 14 is inserted into the insertion hole 15 of the heat radiation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3.
  • the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
  • a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
  • one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55.
  • a crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60.
  • the crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
  • DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state.
  • a gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21.
  • the IGBT built in the power module 11 is controlled to convert DC power into AC power.
  • the converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
  • the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
  • the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
  • heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided.
  • the heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a small resistance, as shown in FIG. 6, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
  • the heating element of the present invention corresponds to the heat radiating member 13.
  • the 0-ring 19 attached to the circumferential groove 18 of the lower surface 13a of the heat radiating member 13 is an O-ring contact portion provided on the periphery of the upper opening of the immersion portion 5 of the cooling body 3. 8 is crushed while being elastically deformed, so that a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3 can be secured, and the highly reliable power conversion device 1 can be provided. .
  • the heat radiating member 13 is easy to handle at the time of processing even when assembled to a processing machine, the processing cost when forming the peripheral groove 18 in the heat radiating member 13 is reduced as compared with the cooling body 3 which is a large and heavy object. Can be achieved.
  • FIG. 7 shows the process of assembling the power module 11 and the cooling body 3, and the heat radiation member 13 of the power module 11 is located at the lower part and is assembled to the cooling body 3 at the lower position.
  • the O-ring 19 mounted while being elastically deformed inside the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18, the crushing operation can be easily performed, and the assembly efficiency of the power conversion device 1 is improved. Can be greatly improved.
  • the O-ring 19 attached to the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18 even when the power module 11 and the cooling body 3 are assembled together from the horizontal direction.
  • the shape of the circumferential groove to which the O-ring 19 is mounted is the dovetail-shaped circumferential groove 18 as shown in FIG. 3, but as shown in FIG. 8, the groove is opened from one side in the width direction of the groove bottom 20a.
  • the inner wall 20c is inclined and extends to the portion 20b, and the vertical inner wall 20d extends vertically from the other widthwise side of the groove bottom 20a to the opening 20b.
  • the O-ring 19 can be held inside the circumferential groove 30 on the inclined inner wall 20c side regardless of the orientation of the heat dissipation member 13.
  • the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists. 1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
  • the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
  • the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive
  • the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
  • the cooling structure and the power conversion device according to the present invention are useful for reducing the machining cost and improving the assembly efficiency by making the O-ring difficult to escape from the circumferential groove. .
  • Insertion hole 16 ... Substrate fixing part, 16a ... Female screw part, 17 ... Liquid contact part, 17a DESCRIPTION OF SYMBOLS Cooling fan, 18 ... Circumferential groove of dovetail shape, 18a ... Groove bottom, 18b ... Opening, 18c ... First inclined inner wall, 18d ... Second inclined inner wall, 19 ... O-ring, 20 ... One-side groove shape 20a ... groove bottom, 20b ... opening, 20c ... inclined inner wall, 20d ... vertical inside 21 ... Drive circuit board, 21a ... insertion hole, 22 ... control circuit board, 22a ... insertion hole, 23 ... power supply circuit board, 23a ... insertion hole, 24a ...

Abstract

　This power converter is provided with: a semiconductor power module (11) in which a heat dissipating member (13) is formed on one surface of a case (12); a cooling body (3) joined to the heat dissipating member; mounting boards (22, 23) on which circuit components including heat-generating circuit components that drive a semiconductor switching element are mounted; and a heat-transfer supporting metal sheet (32) which supports the mounting boards at a prescribed distance from the semiconductor power module, and which makes contact with the cooling body so that the heat transmitted from the mounting boards to the cooling body is dissipated without passing through the housing. The heat dissipating member is provided with fluid contact parts (17) that protrude towards the side where the heat dissipating member is joined to the cooling body. The cooling body is provided with an immersion part (5) that opens toward the side where the cooling body is joined to the heat dissipating member and immerses the fluid contact parts in coolant flowing through the cooling body. The heat dissipating member is provided with fluid-tight seal parts (18, 19) that seal the immersion part from the outside in a fluid-tight manner.

Description

冷却構造体及び電力変換装置Cooling structure and power conversion device
　本発明は、発熱体の熱を冷却する冷却構造体と、電力変換用の半導体スイッチング素子を内蔵したモジュール上に、所定間隔を保って上記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板を支持するようにした電力変換装置に関する。 The present invention provides a circuit component including a heat generating circuit component that drives a semiconductor switching element at a predetermined interval on a cooling structure that cools heat of the heating element and a module that incorporates a semiconductor switching element for power conversion. The present invention relates to a power conversion device that supports a mounted substrate.
　この種の電力変換装置としては、特許文献１に記載された電力変換装置が知られている。
　この電力変換装置は、筐体内に、冷却液が通過する水冷ジャケットを配置し、この水冷ジャケット上に電力変換用の半導体スイッチング素子としてのＩＧＢＴを内蔵したパワーモジュールを配置している。そして、この電力変換装置は、水冷ジャケットに、パワーモジュールに接合する側に開口して冷却液が通流する浸漬部を設け、パワーモジュールに、水冷ジャケット側に突出して浸漬部に浸漬する接液部を設けた直接冷却方式を採用している。 As this type of power conversion device, a power conversion device described in Patent Document 1 is known.
In this power conversion device, a water cooling jacket through which a coolant passes is disposed in a casing, and a power module including an IGBT as a semiconductor switching element for power conversion is disposed on the water cooling jacket. And this power converter device is provided with an immersion part that opens on the side to be joined to the power module in the water cooling jacket and allows the coolant to flow, and the liquid contact with the power module that protrudes toward the water cooling jacket and is immersed in the immersion part. A direct cooling system with a part is adopted.
特開２０１０－３５３４６号JP 2010-35346 A
　直接冷却方式を採用する場合には、パワーモジュール及び水冷ジャケットの接合面の一方に周溝を形成し、その周溝にＯリングを装着し、接合面同士でＯリングを押しつぶすことで液密封止構造を設けている。
　ところで、水冷ジャケットの接合面に周溝を形成するのは、大型重量物である水冷ジャケットを加工機械に組付ける加工時の取り扱いが困難であり、加工コストが増大するおそれがある。 When the direct cooling method is adopted, a circumferential groove is formed on one of the joint surfaces of the power module and the water cooling jacket, an O-ring is attached to the circumferential groove, and the O-ring is crushed between the joint surfaces to achieve liquid-tight sealing. A structure is provided.
By the way, forming the circumferential groove on the joint surface of the water-cooling jacket is difficult to handle when assembling the water-cooling jacket, which is a large and heavy object, to the processing machine, and the processing cost may increase.
　また、周溝の一般的な形状は四角形状であるが、接合面同士でＯリングを押しつぶす前に、Ｏリングが周溝から抜け出るおそれがあり、組立効率の面で問題がある。
　本発明は、上記従来例の未解決の課題に着目してなされたものであり、加工コストの低減化を図るとともに、周溝からＯリングが抜け出にくい構造とすることで組立効率を向上させることができる冷却構造体及び電力変換装置を提供することを目的としている。 In addition, the general shape of the circumferential groove is a square shape, but the O-ring may come out of the circumferential groove before the O-rings are crushed between the joining surfaces, which is problematic in terms of assembly efficiency.
The present invention has been made paying attention to the above-mentioned unsolved problems of the conventional example, and is intended to reduce the machining cost and improve the assembly efficiency by making the O-ring difficult to come out from the circumferential groove. It is an object of the present invention to provide a cooling structure and a power conversion device that can perform the above.
　上記目的を達成するために、本発明の一態様に係る冷却構造体は、発熱体と、前記発熱体に接合される冷却体と、を備え、前記冷却体は、前記発熱体に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、前記発熱体は、前記冷却体に接合する側に前記浸漬部に挿入配置する接液部が突出して形成されるとともに、前記浸漬部を液密封止する液密封止部を備えている。
　この一態様に係る冷却構造体によると、大型重量物である冷却体と比較して、発熱体は加工機械に組付けても加工時の取り扱いが容易なので、発熱体に液密封止部を設ける際の加工コストが低減する。 In order to achieve the above object, a cooling structure according to an aspect of the present invention includes a heating element and a cooling body bonded to the heating element, and the cooling body is a side bonded to the heating element. The heating element is provided with a dipping part that is formed to open to the cooling liquid. The liquid-tight sealing part which liquid-tightly seals an immersion part is provided.
According to the cooling structure according to this aspect, since the heating element is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object, a liquid-tight sealing portion is provided on the heating element. Processing costs are reduced.
　また、本発明の一態様に係る電力変換装置は、一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、を備え、前記冷却体は、前記放熱部材に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、前記放熱部材は、前記冷却体に接合する側に前記浸漬部に挿入配置する接液部が突出して形成されるとともに、前記浸漬部を液密封止する液密封止部を備えている。
　この一態様に係る電力変換装置によると、大型重量物である冷却体と比較して、放熱部材は加工機械に組付けても加工時の取り扱いが容易なので、放熱部材に液密封止部を設ける際の加工コストが低減する。 Moreover, the power converter device which concerns on 1 aspect of this invention is equipped with the semiconductor power module by which the heat radiating member was formed in one surface, and the cooling body joined to the said heat radiating member, The said cooling body is in the said heat radiating member. An immersion part that is open on the side to be joined and has a immersion liquid flowing therethrough is provided, and the heat radiating member is formed by protruding a liquid contact part that is inserted and arranged in the immersion part on the side to be joined to the cooling body. In addition, a liquid-tight sealing part that liquid-tightly seals the immersion part is provided.
According to the power conversion device according to this aspect, the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
　また、本発明の一態様に係る電力変換装置は、一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体パワーモジュールを駆動する回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板と、を備え、前記冷却体は、前記放熱部材に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、前記放熱部材は、前記冷却体に接合する側に前記浸漬部に挿入配置する突出した接液部と、前記浸漬部の開口を囲むように形成されてＯリングを装着した周溝と、を備え、前記放熱部材及び前記冷却体は、前記周溝より外周側の互いの平坦な接合面で前記伝熱板を挟持して接合され、前記Ｏリングの断面直径は、前記Ｏリングと前記冷却体との接触面および前記Ｏリングと周溝との接触面との間の距離より大きな値である。
　この一態様に係る電力変換装置によると、大型重量物である冷却体と比較して、放熱部材は加工機械に組付けても加工時の取り扱いが容易なので、放熱部材にＯリングを装着する周溝を形成する際の加工コストが低減する。 The power conversion device according to an aspect of the present invention includes a semiconductor power module having a heat dissipation member formed on one surface, a cooling body bonded to the heat dissipation member, and a circuit component that drives the semiconductor power module. A heat transfer plate that transfers heat of the mounting board to the cooling body, and the cooling body includes an immersion part that is formed to open on the side to be joined to the heat radiating member and through which the coolant flows. The heat dissipating member includes a protruding liquid contact portion inserted and arranged in the immersion portion on a side to be joined to the cooling body, and a circumferential groove formed so as to surround the opening of the immersion portion and fitted with an O-ring. The heat dissipating member and the cooling body are joined to each other with the heat transfer plate sandwiched between the flat joining surfaces on the outer peripheral side of the circumferential groove, and the cross-sectional diameter of the O-ring is the same as that of the O-ring and the cooling member. The contact surface with the body, the O-ring and the circumferential groove It is greater than the distance between the contact surfaces.
According to the power conversion device according to this aspect, the heat dissipating member is easy to handle during processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. The processing cost when forming the groove is reduced.
　また、本発明の一態様に係る電力変換装置は、電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、前記放熱部材に接合される冷却体と、前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板と、を備え、前記放熱部材は、前記冷却体に接合する側に接液部が突出して形成され、前記冷却体は、前記放熱部材に接合する側に開口し、通流される冷却液に前記接液部を浸漬する浸漬部が形成されており、前記放熱部材に、前記浸漬部を外側から液密封止する液密封止部を設けた。
　この一態様に係る電力変換装置によると、大型重量物である冷却体と比較して、放熱部材は加工機械に組付けても加工時の取り扱いが容易なので、放熱部材に液密封止部を設ける際の加工コストが低減する。 The power conversion device according to an aspect of the present invention includes a semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body, and the heat dissipation member And a mounting board on which circuit components including a heat generating circuit part for driving the semiconductor switching element are mounted, and the mounting board is supported with a predetermined interval between the mounting board and the mounting board. A heat transfer supporting metal plate that contacts the cooling body so as to dissipate the heat generated by the cooling body without passing through a housing, and the heat radiating member has a liquid contact portion on the side to be joined to the cooling body The cooling body is opened to the side to be joined to the heat radiating member, and an immersion portion is formed to immerse the liquid contact portion in a flowing coolant. Part was provided a liquid-tight seal portion for fluid-tight seal from the outside.
According to the power conversion device according to this aspect, the heat radiating member is easy to handle at the time of processing even when assembled to a processing machine as compared with a cooling body that is a large and heavy object. Processing costs are reduced.
　また、本発明の一態様に係る電力変換装置は、前記液密封止部が、前記浸漬部の外側を囲むように前記放熱部材の前記冷却体に接合する側に形成された周溝と、この周溝に、抜け止めされながら装着されるＯリングと、を備えている。
　この一態様に係る電力変換装置によると、簡便な構成で液密封止部を形成することができる。 Further, the power conversion device according to one aspect of the present invention includes a circumferential groove formed on a side where the liquid-tight sealing portion is joined to the cooling body of the heat radiating member so as to surround an outer side of the immersion portion. And an O-ring mounted on the circumferential groove while being prevented from coming off.
According to the power conversion device according to this aspect, the liquid-tight sealing portion can be formed with a simple configuration.
　また、本発明の一態様に係る電力変換装置は、前記周溝が、溝底の幅方向の一方から開口部まで傾斜して延在する第１の傾斜内壁と、前記溝底の幅方向の他方から前記開口部まで傾斜して延在する第２の傾斜内壁とを備えたあり溝形状に形成されている。
　この一態様に係る電力変換装置によると、Ｏリングを装着した周溝開口部を下方に向けても、あり溝形状の周溝からＯリングは抜け落ちないので、電力変換装置の組立効率を大幅に向上させることができる。 In the power converter according to one aspect of the present invention, the circumferential groove includes a first inclined inner wall extending in an inclined manner from one side in the width direction of the groove bottom to the opening, and a width direction of the groove bottom. It is formed in a dovetail groove shape including a second inclined inner wall that extends from the other side to the opening.
According to the power conversion device according to this aspect, the O-ring does not fall out from the dovetail-shaped peripheral groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power conversion device. Can be improved.
　さらに、本発明の一態様に係る電力変換装置は、前記周溝が、溝底から開口部まで傾斜して延在する傾斜内壁と、前記溝底から前記開口部まで垂直に延在する垂直内壁とを備えた片あり溝形状である。
　この一態様に係る電力変換装置によると、Ｏリングを装着した周溝開口部を下方に向けても、片あり溝形状の周溝からＯリングは抜け落ちないので、電力変換装置の組立効率を大幅に向上させることができる。 Furthermore, in the power conversion device according to one aspect of the present invention, the circumferential groove has an inclined inner wall that extends from the groove bottom to the opening, and a vertical inner wall that extends vertically from the groove bottom to the opening. It is a one-sided groove shape provided with.
According to the power converter according to this aspect, the O-ring does not fall out from the circumferential groove having a single groove even when the circumferential groove opening portion to which the O-ring is attached is directed downward, greatly increasing the assembly efficiency of the power converter. Can be improved.
　本発明に係る冷却構造体及び電力変換装置によると、加工コストの低減化を図るとともに、周溝からＯリングが抜け出にくい構造とすることで組立効率を向上させることができる。 According to the cooling structure and the power conversion device according to the present invention, it is possible to reduce the processing cost and improve the assembly efficiency by adopting a structure in which the O-ring does not easily come out from the circumferential groove.
本発明に係る電力変換装置の全体構成を示す断面図である。It is sectional drawing which shows the whole structure of the power converter device which concerns on this invention. 図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 本発明に係る第１実施形態の液密封止部の構造を示す図である。It is a figure which shows the structure of the liquid-tight sealing part of 1st Embodiment which concerns on this invention. 図２とは異なる位置の図１の電力変換装置の要部を示す断面図である。It is sectional drawing which shows the principal part of the power converter device of FIG. 1 of the position different from FIG. 伝熱支持用金属板を示す側面図である。It is a side view which shows the metal plate for heat transfer support. 発熱回路部品の全体の放熱経路を説明する図である。It is a figure explaining the heat dissipation path | route of the whole heat generating circuit components. 本発明に係る放熱部材と冷却体とを組付ける前の状態を示す図である。It is a figure which shows the state before attaching the heat radiating member and cooling body which concern on this invention. 本発明に係る第２実施形態の液密封止部の構造を示す図である。It is a figure which shows the structure of the liquid-tight sealing part of 2nd Embodiment which concerns on this invention.
　以下、本発明を実施するための形態（以下、実施形態という。）を、図面を参照しながら詳細に説明する。
　図１は本発明の全体構成を示す断面図であり、図２は、図１の要部を拡大して示した図である。
　図１の符号１は電力変換装置であって、この電力変換装置１は筐体２内に収納されている。筐体２は、合成樹脂材を成形したものであり、水冷ジャケットの構成を有する冷却体３を挟んで上下に分割された下部筐体２Ａ及び上部筐体２Ｂで構成されている。 DESCRIPTION OF EMBODIMENTS Hereinafter, modes for carrying out the present invention (hereinafter referred to as embodiments) will be described in detail with reference to the drawings.
FIG. 1 is a cross-sectional view showing the overall configuration of the present invention, and FIG. 2 is an enlarged view of the main part of FIG.
Reference numeral 1 in FIG. 1 is a power converter, and the power converter 1 is housed in a housing 2. The casing 2 is formed by molding a synthetic resin material, and includes a lower casing 2A and an upper casing 2B that are divided vertically with a cooling body 3 having a water-cooling jacket structure interposed therebetween.
　下部筐体２Ａは有底角筒体で構成されている。この下部筐体２Ａは開放上部が冷却体３で覆われ、内部に平滑用のフィルムコンデンサ４が収納されている。
　上部筐体２Ｂは、上端及び下端を開放した角筒体２ａと、この角筒体２ａの上端を閉塞する蓋体２ｂとを備えている。そして、角筒体２ａの下端が冷却体３で閉塞されている。
　この角筒体２ａの下端と冷却体３との間には、図示しないが、液状シール剤の塗布やゴム製パッキンの挟み込みなどのシール材が介在されている。 The lower housing 2A is a bottomed rectangular tube. The lower casing 2A has an open upper portion covered with a cooling body 3, and a smoothing film capacitor 4 is accommodated therein.
The upper housing 2B includes a rectangular tube 2a having an open upper end and a lower end, and a lid 2b that closes the upper end of the rectangular tube 2a. The lower end of the rectangular tube 2a is closed by the cooling body 3.
Although not shown, a sealing material such as application of a liquid sealant or sandwiching rubber packing is interposed between the lower end of the rectangular tube 2a and the cooling body 3.
　冷却体３は、例えば熱伝導率の高いアルミニウム、アルミニウム合金を射出成形して形成されており、下面は平坦面とされ、冷却水の給水口３ａ及び排水口３ｂが筐体２の外方に開口されている。これら給水口３ａ及び排水口３ｂは例えばフレキシブルホースを介して図示しない冷却水供給源に接続されている。
　冷却体３の上面中央には、給水口３ａ及び排水口３ｂに連通する四角形状に開口する浸漬部５が形成され、そして、浸漬部５の上部開口部の周縁に、冷却体３の他の平坦な上面（図２の符号３ｃ）より上方に突出し、後述するＯリング７が当接するＯリング当接部８が形成されている。 The cooling body 3 is formed, for example, by injection molding aluminum or aluminum alloy having a high thermal conductivity, the lower surface is a flat surface, and the water supply port 3 a and the water discharge port 3 b are disposed outside the housing 2. It is open. The water supply port 3a and the drainage port 3b are connected to a cooling water supply source (not shown) via, for example, a flexible hose.
In the center of the upper surface of the cooling body 3 is formed a dipping part 5 that opens in a square shape communicating with the water supply port 3a and the drainage port 3b. An O-ring contact portion 8 that protrudes upward from a flat upper surface (reference numeral 3c in FIG. 2) and that contacts an O-ring 7 described later is formed.
　また、図１に戻って、冷却体３には、下部筐体２Ａに保持されたフィルムコンデンサ４の絶縁被覆された正負の電極４ａを上下に挿通する挿通孔３ｅが形成されている。
　電力変換装置１は、電力変換用の例えばインバータ回路を構成する半導体スイッチング素子として例えば絶縁ゲートバイポーラトランジスタ（ＩＧＢＴ）を内蔵したパワーモジュール１１を備えている。このパワーモジュール１１は、扁平な直方体状の絶縁性のケース体１２内にＩＧＢＴを内蔵しており、ケース体１２の下面に金属製の放熱部材１３が形成されている。 Returning to FIG. 1, the cooling body 3 is formed with an insertion hole 3 e through which the positive and negative electrodes 4 a covered with insulation of the film capacitor 4 held in the lower housing 2 </ b> A are inserted vertically.
The power conversion device 1 includes a power module 11 that incorporates, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element that forms, for example, an inverter circuit for power conversion. The power module 11 includes an IGBT in a flat rectangular parallelepiped insulating case body 12, and a metal heat dissipating member 13 is formed on the lower surface of the case body 12.
　放熱部材１３の下面中央部には、冷却体３の浸漬部５に入り込む接液部１７が形成されている。この接液部１７は、放熱部材１３の下面から互いに均等の間隔をあけながら所定長さで突出している多数の冷却フィン１７ａで構成されており、給水口３ａから浸漬部５に流れ込んできた冷却水に、多数の冷却フィン１７ａが浸されるようになっている。
　また、放熱部材１３の下面１３ａの接液部１７の周囲には、四角枠状の周溝１８が形成され、この周溝１８にＯリング１９が装着されている。 A liquid contact portion 17 that enters the immersion portion 5 of the cooling body 3 is formed at the center of the lower surface of the heat radiating member 13. The liquid contact part 17 is composed of a large number of cooling fins 17a protruding from the lower surface of the heat radiating member 13 at a predetermined length while being equally spaced from each other, and the cooling that has flowed into the immersion part 5 from the water supply port 3a. Many cooling fins 17a are immersed in water.
A square frame-shaped circumferential groove 18 is formed around the liquid contact portion 17 on the lower surface 13 a of the heat radiating member 13, and an O-ring 19 is attached to the circumferential groove 18.
　周溝１８の断面形状は、図３に示すように、溝底１８ａの幅方向の一方から開口部１８ｂまで傾斜して延在する第１の傾斜内壁１８ｃと、溝底１８ａの幅方向の他方から開口部１８ｂまで傾斜して延在する第２の傾斜内壁１８ｄとを備えた、あり溝形状の周溝である。Ｏリング１９の断面直径は、この周溝１８の溝底１８ａから開口部１８ｂまでの垂直な高さ寸法より大きな値である。また、このＯリング１９は、その断面直径が開口部１８ｂの幅より大きな値に設定されており、あり溝形状の周溝１８の内部に弾性変形されながら装着されている。 As shown in FIG. 3, the cross-sectional shape of the circumferential groove 18 includes a first inclined inner wall 18c extending inclined from one side in the width direction of the groove bottom 18a to the opening 18b and the other side in the width direction of the groove bottom 18a. And a second inclined inner wall 18d extending in an inclined manner from the opening 18b to the opening 18b. The cross-sectional diameter of the O-ring 19 is a value larger than the vertical height dimension from the groove bottom 18a of the circumferential groove 18 to the opening 18b. The O-ring 19 has a cross-sectional diameter set to a value larger than the width of the opening 18b, and is mounted inside the dovetail-shaped peripheral groove 18 while being elastically deformed.
　図２に戻って、ケース体１２及び放熱部材１３には平面からみて四隅に固定ねじ１４を挿通する挿通孔１５が形成されている。また、ケース体１２の上面には、挿通孔１５の内側における４箇所に所定高さの基板固定部１６が突出形成されている。
　基板固定部１６の上端には、パワーモジュール１１に内蔵されたＩＧＢＴを駆動する駆動回路等が実装された駆動回路基板２１が固定されている。また、駆動回路基板２１の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴを制御する相対的に発熱量の大きい、又は発熱密度の大きい発熱回路部品を含む制御回路等を実装した実装基板としての制御回路基板２２が固定されている。さらに、制御回路基板２２の上方に所定間隔を保ってパワーモジュール１１に内蔵されたＩＧＢＴに電源を供給する発熱回路部品を含む電源回路等を実装した実装基板としての電源回路基板２３が固定されている。 Returning to FIG. 2, the case body 12 and the heat radiating member 13 are formed with insertion holes 15 through which the fixing screws 14 are inserted at the four corners as viewed from above. In addition, on the upper surface of the case body 12, substrate fixing portions 16 having a predetermined height are formed to protrude at four locations inside the insertion hole 15.
A driving circuit board 21 on which a driving circuit for driving an IGBT built in the power module 11 is mounted is fixed to the upper end of the board fixing unit 16. In addition, a mounting in which a control circuit including a heat generating circuit component having a relatively large heat generation amount or a high heat generation density is mounted on the drive circuit board 21 to control the IGBT built in the power module 11 with a predetermined interval. A control circuit board 22 as a board is fixed. Further, a power supply circuit board 23 as a mounting board on which a power supply circuit including a heating circuit component for supplying power to the IGBT built in the power module 11 is mounted at a predetermined interval above the control circuit board 22 is fixed. Yes.
　そして、駆動回路基板２１は、基板固定部１６に対向する位置に形成した挿通孔２１ａ内に継ぎねじ２４の雄ねじ部２４ａを挿通し、この雄ねじ部２４ａを基板固定部１６の上面に形成した雌ねじ部１６ａに螺合することにより固定されている。
　また、制御回路基板２２は継ぎねじ２４の上端に形成した雌ねじ部２４ｂに対向する位置に形成した挿通孔２２ａ内に継ぎねじ２５の雄ねじ部２５ａを挿通し、この雄ねじ部２５ａを継ぎねじ２４の雌ねじ部２４ｂに螺合することにより固定されている。 Then, the drive circuit board 21 is inserted into the insertion hole 21 a formed at a position facing the board fixing part 16, and the male screw part 24 a of the joint screw 24 is inserted, and the male screw part 24 a is formed on the upper surface of the board fixing part 16. It is fixed by screwing into the part 16a.
Further, the control circuit board 22 inserts the male screw portion 25a of the joint screw 25 into an insertion hole 22a formed at a position facing the female screw portion 24b formed at the upper end of the joint screw 24, and this male screw portion 25a is inserted into the joint screw 24. It is fixed by screwing into the female screw portion 24b.
　さらに、電源回路基板２３は継ぎねじ２５の上端に形成した雌ねじ部２５ｂに対向する位置に形成した挿通孔２３ａ内に固定ねじ２６を挿通し、この固定ねじ２６を継ぎねじ２５の雌ねじ部２５ｂに螺合することにより固定されている。
　また、制御回路基板２２及び電源回路基板２３は、伝熱支持用金属板３２，３３によって筐体２を介することなく冷却体３への放熱経路を独自に形成するように支持されている。これら伝熱支持用金属板３２及び３３は、熱伝導率が高い金属板例えばアルミニウム又はアルミニウム合金製の金属板で形成されている。 Further, the power supply circuit board 23 inserts a fixing screw 26 into an insertion hole 23 a formed at a position facing the female screw portion 25 b formed at the upper end of the joint screw 25, and this fixing screw 26 is inserted into the female screw portion 25 b of the joint screw 25. It is fixed by screwing.
Further, the control circuit board 22 and the power circuit board 23 are supported by the heat transfer supporting metal plates 32 and 33 so as to independently form a heat radiation path to the cooling body 3 without going through the housing 2. These heat transfer supporting metal plates 32 and 33 are formed of a metal plate having high thermal conductivity, for example, a metal plate made of aluminum or an aluminum alloy.
　伝熱支持用金属板３２は、平板形状の伝熱支持板部３２ａと、この伝熱支持板部３２ａの右側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３２ｂと、伝熱支持側板部３２ｂの下端部から左側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３２ｃとを一体に備えた部品である。
　伝熱支持板部３２ａには、伝熱部材３５を介して制御回路基板２２が固定ねじ３６によって固定される。伝熱部材３５は、伸縮性を有する弾性体で電源回路基板２３と同じ外形寸法に構成されている。この伝熱部材３５としては、シリコンゴムの内部に金属フィラーを介在させることにより絶縁性能を発揮しながら伝熱性を高めたものが適用されている。 The heat transfer support metal plate 32 includes a plate-shaped heat transfer support plate portion 32 a and a heat transfer support side plate that is bent downward from the right end portion of the heat transfer support plate portion 32 a and extends toward the heat radiating member 13. It is a component that integrally includes a portion 32b and a cooling body contact plate portion 32c that is bent leftward from the lower end portion of the heat transfer support side plate portion 32b and extends along the lower surface of the heat dissipation member 13.
The control circuit board 22 is fixed to the heat transfer support plate portion 32 a by a fixing screw 36 via a heat transfer member 35. The heat transfer member 35 is an elastic body having elasticity, and has the same outer dimensions as the power circuit board 23. As this heat transfer member 35, a member having improved heat transfer performance while exhibiting insulating performance by interposing a metal filler inside silicon rubber is applied.
　また、伝熱支持用金属板３３は、平板形状の伝熱支持板部３３ａと、この伝熱支持板部３３ａの左側端部から下方に折り曲げられて放熱部材１３に向けて延在する伝熱支持側板部３３ｂと、伝熱支持側板部３３ｂの下端部から右側に折り曲げられて放熱部材１３の下面に沿って延在する冷却体接触板部３３ｃとを一体に備えた部品である。
　伝熱支持板部３３ａには、前述した伝熱部材３５と同様の伝熱部材３７を介して電源回路基板２３が固定ねじ３８によって固定される。 Further, the heat transfer support metal plate 33 includes a flat plate-shaped heat transfer support plate portion 33 a and heat transfer that is bent downward from the left end portion of the heat transfer support plate portion 33 a and extends toward the heat radiating member 13. The support side plate portion 33b and the cooling body contact plate portion 33c that is bent rightward from the lower end portion of the heat transfer support side plate portion 33b and extends along the lower surface of the heat radiating member 13 are integrally provided.
The power supply circuit board 23 is fixed to the heat transfer support plate portion 33a by a fixing screw 38 via a heat transfer member 37 similar to the heat transfer member 35 described above.
　これら伝熱支持用金属板３２，３３を一体部品とすることで、熱抵抗を小さくしてより効率の良い放熱を行うことができる。また、伝熱支持用金属板３２の伝熱支持板部３２ａと伝熱支持側板部３２ｂとの連結部及び伝熱支持側板部３２ｂと冷却体接触板部３２ｃとの連結部とを湾曲部とし、伝熱支持用金属板３３の伝熱支持板部３３ａと伝熱支持側板部３３ｂとの連結部及び伝熱支持側板部３３ｂと冷却体接触板部３３ｃとの連結部とを湾曲部とすることで、電力変換装置１に伝達される上下振動や横揺れ等に対する耐振動性を向上することができる。 By using these heat transfer supporting metal plates 32 and 33 as an integral part, it is possible to reduce heat resistance and perform more efficient heat dissipation. Further, the connection portion between the heat transfer support plate portion 32a and the heat transfer support side plate portion 32b of the heat transfer support metal plate 32 and the connection portion between the heat transfer support side plate portion 32b and the cooling body contact plate portion 32c are set as curved portions. The connecting portion between the heat transfer support plate portion 33a and the heat transfer support side plate portion 33b of the heat transfer support metal plate 33 and the connection portion between the heat transfer support side plate portion 33b and the cooling body contact plate portion 33c are curved portions. Thus, it is possible to improve the vibration resistance against the vertical vibration and roll transmitted to the power conversion device 1.
　図４に示すように、電源回路基板２３には、発熱回路部品３９が下面側に実装されており、電源回路基板２３、伝熱部材３７及び伝熱支持板部３３ａが、固定ねじ３８により積層状態で固定されており、伝熱支持板部３３ａの下面には、絶縁距離を短くするために絶縁シート４３が貼着されている。なお、これらの積層状態の部品を電源回路ユニットＵ３と称する。 As shown in FIG. 4, the heat circuit component 39 is mounted on the lower surface side of the power circuit board 23, and the power circuit board 23, the heat transfer member 37, and the heat transfer support plate portion 33 a are stacked by the fixing screw 38. The insulating sheet 43 is stuck to the lower surface of the heat transfer support plate portion 33a in order to shorten the insulation distance. Note that these stacked components are referred to as a power supply circuit unit U3.
　この際、電源回路基板２３の下面側に実装された発熱回路部品３９が伝熱部材３７の弾性によって伝熱部材３７内に埋め込まれる。このため、発熱回路部品３９と伝熱部材３７との接触が過不足なく行われるとともに、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの接触が良好に行われ、伝熱部材３７と電源回路基板２３及び伝熱支持板部３３ａとの間の熱抵抗を減少させることができる。 At this time, the heat generating circuit component 39 mounted on the lower surface side of the power circuit board 23 is embedded in the heat transfer member 37 by the elasticity of the heat transfer member 37. For this reason, the contact between the heat generating circuit component 39 and the heat transfer member 37 is performed without excess or deficiency, and the contact between the heat transfer member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a is performed satisfactorily. The thermal resistance between the member 37 and the power supply circuit board 23 and the heat transfer support plate portion 33a can be reduced.
　また、図示しないが、制御回路基板２２の下面側にも発熱回路部品が実装されており、制御回路基板２２、伝熱部材３５及び伝熱支持板部３２ａが、固定ねじ３６により積層状態で固定されており、伝熱支持板部３２ａの下面には、絶縁距離を短くするために絶縁シート４２が貼着されている。なお、これらの積層状態の部品を制御回路ユニットＵ２と称する。 Although not shown, a heat generating circuit component is also mounted on the lower surface side of the control circuit board 22, and the control circuit board 22, the heat transfer member 35, and the heat transfer support plate portion 32 a are fixed in a stacked state by a fixing screw 36. An insulating sheet 42 is attached to the lower surface of the heat transfer support plate portion 32a in order to shorten the insulation distance. Note that these stacked components are referred to as a control circuit unit U2.
　そして、制御回路基板２２の下面側に実装された発熱回路部品が伝熱部材３５の弾性によって伝熱部材３５内に埋め込まれ、制御回路基板２２と伝熱部材３５との接触が過不足なく行われるとともに、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの接触が良好に行われ、伝熱部材３５と制御回路基板２２及び伝熱支持板部３２ａとの間の熱抵抗を減少させることができる。 Then, the heat generating circuit component mounted on the lower surface side of the control circuit board 22 is embedded in the heat transfer member 35 by the elasticity of the heat transfer member 35, so that the contact between the control circuit board 22 and the heat transfer member 35 is performed without excess or deficiency. In addition, the heat transfer member 35 and the control circuit board 22 and the heat transfer support plate part 32a are satisfactorily contacted, and the heat resistance between the heat transfer member 35, the control circuit board 22 and the heat transfer support plate part 32a is improved. Can be reduced.
　また、伝熱支持用金属板の伝熱支持側板部３３ｂには、図５に示すように、パワーモジュール１１の図１に示す３相交流出力端子１１ｂに対応する位置に後述するブスバー５５を挿通する例えば方形の３つの挿通孔３３ｉが形成されている。このように、３つの挿通孔３３ｉを形成することにより、隣接する挿通孔３３ｉ間に比較的幅広の伝熱路Ｌｈを形成することができ、全体の伝熱路の断面積を増加させて効率よく伝熱することができる。また、振動に対する剛性も確保することができる。 Further, as shown in FIG. 5, a bus bar 55 described later is inserted into the heat transfer support side plate portion 33b of the heat transfer support metal plate at a position corresponding to the three-phase AC output terminal 11b shown in FIG. For example, three rectangular insertion holes 33i are formed. Thus, by forming the three insertion holes 33i, a relatively wide heat transfer path Lh can be formed between the adjacent insertion holes 33i, and the cross-sectional area of the entire heat transfer path is increased to improve efficiency. Can conduct heat well. Also, rigidity against vibration can be ensured.
　同様に、伝熱支持用金属板３２の伝熱支持側板部３２ｂにも、パワーモジュール１１の正極及び負極端子１１ａに対向する位置にそれぞれ同様の挿通孔３２ｉが形成されている。この挿通孔３２ｉを形成することにより、上述した挿通孔３３ｉと同様の作用効果を得ることができる。
　また、伝熱支持用金属板３２の冷却体接触板部３２ｃ及び伝熱支持用金属板３３の冷却体接触板部３３ｃには、図２に示すように、パワーモジュール１１の固定ねじ１４を挿通する挿通孔１５に対向する位置に固定部材挿通孔３２ｃ１，３３ｃ１が形成されている。 Similarly, in the heat transfer support side plate portion 32b of the heat transfer support metal plate 32, similar insertion holes 32i are formed at positions facing the positive electrode and the negative electrode terminal 11a of the power module 11, respectively. By forming the insertion hole 32i, the same effect as that of the insertion hole 33i described above can be obtained.
Further, as shown in FIG. 2, the fixing screw 14 of the power module 11 is inserted into the cooling body contact plate portion 32c of the heat transfer support metal plate 32 and the cooling body contact plate portion 33c of the heat transfer support metal plate 33. Fixing member insertion holes 32c1 and 33c1 are formed at positions facing the insertion holes 15 to be formed.
　そして放熱部材１３の挿通孔１５及び冷却体接触板部３２ｃ，３３ｃの固定部材挿通孔３２ｃ１，３３ｃ１に固定ねじ１４を挿通し、固定ねじ１４を冷却体３に形成した雌ねじ部に螺合させる。
　これにより、伝熱支持用金属板３２，３３の冷却体接触板部３２ｃ，３３ｃを、パワーモジュール１１の放熱部材１３の下面１３ａと冷却体３の上面３ｃとに当接し、放熱部材１３及び冷却体３で挟持して固定する。 Then, the fixing screw 14 is inserted into the insertion hole 15 of the heat radiation member 13 and the fixing member insertion holes 32c1 and 33c1 of the cooling body contact plate portions 32c and 33c, and the fixing screw 14 is screwed into the female screw portion formed in the cooling body 3.
As a result, the cooling body contact plate portions 32c and 33c of the heat transfer supporting metal plates 32 and 33 are brought into contact with the lower surface 13a of the heat radiating member 13 of the power module 11 and the upper surface 3c of the cooling body 3, thereby It is clamped by the body 3 and fixed.
　この際、放熱部材１３の下面１３ａの周溝１８に装着した０リング１９が、冷却体３の浸漬部５の上部開口部の周縁に設けたＯリング当接部８に弾性変形しながら押しつぶされ、冷却体３の浸漬部５に溜まった冷却水が外部に漏れるのを防止する液密封止が施される。
　また、図１に示すように、パワーモジュール１１の正負の直流入力端子に１１ａに、ブスバー５５が接続され、ブスバー５５の他端に冷却体３を貫通するフィルムコンデンサ４の正負の電極４ａが固定ねじ５１で連結されている。また、パワーモジュール１１の負極端子１１ａに、外部のコンバータ（図示せず）に接続する接続コード５２の先端に固定された圧着端子５３が固定されている。 At this time, the 0-ring 19 attached to the circumferential groove 18 of the lower surface 13a of the heat radiating member 13 is crushed while being elastically deformed to the O-ring contact portion 8 provided at the periphery of the upper opening of the immersion portion 5 of the cooling body 3. Liquid-tight sealing is performed to prevent the cooling water accumulated in the immersion part 5 of the cooling body 3 from leaking to the outside.
Further, as shown in FIG. 1, a bus bar 55 is connected to the positive and negative DC input terminals of the power module 11 to 11 a, and the positive and negative electrodes 4 a of the film capacitor 4 penetrating the cooling body 3 are fixed to the other end of the bus bar 55. They are connected by screws 51. Further, a crimp terminal 53 fixed to the tip of a connection cord 52 connected to an external converter (not shown) is fixed to the negative electrode terminal 11 a of the power module 11.
　さらに、パワーモジュール１１の３相交流出力端子１１ｂに、ブスバー５５の一端を固定ねじ５６で接続し、このブスバー５５の途中に電流センサ５７が配置されている。そして、ブスバー５５の他端に圧着端子５９が固定ねじ６０で接続されている。圧着端子５９は、外部の３相電動モータ（図示せず）に接続したモータ接続ケーブル５８に固定されている。 Furthermore, one end of the bus bar 55 is connected to the three-phase AC output terminal 11 b of the power module 11 with a fixing screw 56, and a current sensor 57 is disposed in the middle of the bus bar 55. A crimp terminal 59 is connected to the other end of the bus bar 55 with a fixing screw 60. The crimp terminal 59 is fixed to a motor connection cable 58 connected to an external three-phase electric motor (not shown).
　この状態で、外部のコンバータ（図示せず）から直流電力を供給するとともに、電源回路基板２３に実装された電源回路、制御回路基板２２に実装された制御回路を動作状態とし、制御回路から例えばパルス幅変調信号でなるゲート信号を駆動回路基板２１に実装された駆動回路を介してパワーモジュール１１に供給する。これによって、パワーモジュール１１に内蔵されたＩＧＢＴが制御されて、直流電力を交流電力に変換する。変換した交流電力は３相交流出力端子１１ｂからブスバー５５を介してモータ接続ケーブル５８に供給し、３相電動モータ（図示せず）を駆動制御する。 In this state, DC power is supplied from an external converter (not shown), and the power supply circuit mounted on the power supply circuit board 23 and the control circuit mounted on the control circuit board 22 are set in an operating state. A gate signal that is a pulse width modulation signal is supplied to the power module 11 via a drive circuit mounted on the drive circuit board 21. As a result, the IGBT built in the power module 11 is controlled to convert DC power into AC power. The converted AC power is supplied from the three-phase AC output terminal 11b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase electric motor (not shown).
　このとき、パワーモジュール１１に内蔵されたＩＧＢＴで発熱するが、パワーモジュール１１の放熱部材１３の下面中央部に設けた接液部１７が冷却体３に設けた浸漬部５に入り込んで冷却液に浸漬されているので、パワーモジュール１１は効率良く冷却される。
　一方、制御回路基板２２及び電源回路基板２３に実装されている制御回路及び電源回路には発熱回路部品３９が含まれており、これら発熱回路部品３９で発熱を生じる。このとき、発熱回路部品３９は制御回路基板２２及び電源回路基板２３の下面側に実装されている。 At this time, the IGBT built in the power module 11 generates heat, but the liquid contact portion 17 provided at the center of the lower surface of the heat radiating member 13 of the power module 11 enters the immersion portion 5 provided in the cooling body 3 and becomes the coolant. Since it is immersed, the power module 11 is efficiently cooled.
On the other hand, the control circuit and the power supply circuit mounted on the control circuit board 22 and the power supply circuit board 23 include a heat generating circuit component 39, and the heat generating circuit component 39 generates heat. At this time, the heat generating circuit component 39 is mounted on the lower surface side of the control circuit board 22 and the power supply circuit board 23.
　そして、これら制御回路基板２２及び電源回路基板２３の下面側には、熱伝導率が高く弾性を有する伝熱部材３５及び３７を介して伝熱支持用金属板３２，３３の伝熱支持板部３２ａ，３３ａが設けられている。伝熱支持用金属板３２，３３は、伝熱支持板部３２ａ，３３ａと、伝熱支持側板部３２ｂ，３３ｂと、冷却体接触板部３２ｃ，３３ｃとを一体化した部品であって、熱抵抗が小さい部材なので、図６に示すように、伝熱支持用金属板３２，３３に伝達された熱は、冷却体３の上面３ｃに直接接触した冷却体接触板部３２ｃ，３３ｃから冷却体３に放熱され、効率の良い放熱を行うことができる。 And on the lower surface side of these control circuit board 22 and power supply circuit board 23, heat transfer support plate portions of metal plates 32, 33 for heat transfer support are provided through heat transfer members 35 and 37 having high thermal conductivity and elasticity. 32a and 33a are provided. The heat transfer support metal plates 32 and 33 are components in which the heat transfer support plate portions 32a and 33a, the heat transfer support side plate portions 32b and 33b, and the cooling body contact plate portions 32c and 33c are integrated. Since the member has a small resistance, as shown in FIG. 6, the heat transferred to the heat transfer supporting metal plates 32 and 33 is cooled from the cooling body contact plate portions 32c and 33c that are in direct contact with the upper surface 3c of the cooling body 3. The heat is dissipated by 3 and efficient heat dissipation can be performed.
　なお、本発明の発熱体が放熱部材１３に対応している。
　本実施形態の電力変換装置１によると、放熱部材１３の下面１３ａの周溝１８に装着した０リング１９が、冷却体３の浸漬部５の上部開口部の周縁に設けたＯリング当接部８に弾性変形しながら押しつぶされるので、冷却体３の浸漬部５に溜まっている冷却水の確実な液密封止を確保することができ、信頼性の高い電力変換装置１を提供することができる。
　また、大型重量物である冷却体３と比較して、放熱部材１３は加工機械に組付けても加工時の取り扱いが容易なので、放熱部材１３に周溝１８を形成する際の加工コストの低減化を図ることができる。 The heating element of the present invention corresponds to the heat radiating member 13.
According to the power conversion device 1 of the present embodiment, the 0-ring 19 attached to the circumferential groove 18 of the lower surface 13a of the heat radiating member 13 is an O-ring contact portion provided on the periphery of the upper opening of the immersion portion 5 of the cooling body 3. 8 is crushed while being elastically deformed, so that a reliable liquid-tight sealing of the cooling water accumulated in the immersion part 5 of the cooling body 3 can be secured, and the highly reliable power conversion device 1 can be provided. .
Further, since the heat radiating member 13 is easy to handle at the time of processing even when assembled to a processing machine, the processing cost when forming the peripheral groove 18 in the heat radiating member 13 is reduced as compared with the cooling body 3 which is a large and heavy object. Can be achieved.
　また、図７は、パワーモジュール１１と冷却体３の組立途中を示すものであるが、パワーモジュール１１の放熱部材１３を下部に位置し、下方位置の冷却体３に対して組付ける動作を行っても、あり溝形状の周溝１８内部に弾性変形させながら装着されたＯリング１９は、周溝１８から抜け落ちないので、押し潰し動作を容易に行うことができ、電力変換装置１の組立効率を大幅に向上させることができる。また、図示しないが、パワーモジュール１１と冷却体３を互いに水平方向から組付ける動作を行っても、あり溝形状の周溝１８に装着されたＯリング１９は、周溝１８から抜け落ちない。 FIG. 7 shows the process of assembling the power module 11 and the cooling body 3, and the heat radiation member 13 of the power module 11 is located at the lower part and is assembled to the cooling body 3 at the lower position. However, since the O-ring 19 mounted while being elastically deformed inside the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18, the crushing operation can be easily performed, and the assembly efficiency of the power conversion device 1 is improved. Can be greatly improved. Although not shown, the O-ring 19 attached to the dovetail-shaped circumferential groove 18 does not fall out of the circumferential groove 18 even when the power module 11 and the cooling body 3 are assembled together from the horizontal direction.
　なお、Ｏリング１９を装着する周溝の形状を、図３に示したように、あり溝形状の周溝１８としたが、図８に示すように、溝底２０ａの幅方向の一方から開口部２０ｂまで傾斜して延在する傾斜内壁２０ｃと、溝底２０ａの幅方向の他方から開口部２０ｂまで垂直に延在する垂直内壁２０ｄとを備えた、片あり溝形状の周溝２０にすると、放熱部材１３がどのような向きで配置されても、傾斜内壁２０ｃ側の周溝３０の内部で、Ｏリング１９を保持することができる。 In addition, the shape of the circumferential groove to which the O-ring 19 is mounted is the dovetail-shaped circumferential groove 18 as shown in FIG. 3, but as shown in FIG. 8, the groove is opened from one side in the width direction of the groove bottom 20a. When the peripheral groove 20 has a one-sided groove shape, the inner wall 20c is inclined and extends to the portion 20b, and the vertical inner wall 20d extends vertically from the other widthwise side of the groove bottom 20a to the opening 20b. The O-ring 19 can be held inside the circumferential groove 30 on the inclined inner wall 20c side regardless of the orientation of the heat dissipation member 13.
　なお、図１及び図２で示した制御回路ユニットＵ２及び電源回路ユニットＵ３において、伝熱部材３５及び３７を制御回路基板２２及び電源回路基板２３と同じ外形とした場合について説明した。しかしながら、本発明は上記構成に限定されるものではなく、伝熱部材３５及び３７を発熱回路部品３９が存在する箇所にのみ設けるようにしてもよい。
　また、図１及び図２においては、制御回路基板２２及び電源回路基板２３で発熱回路部品３９を裏面側の伝熱部材３５及び３７側に実装する場合について説明した。しかしながら、本発明は上記構成に限定されるものではない。すなわち、制御回路基板２２及び電源回路基板２３の伝熱部材３５及び３７とは反対側の外周領域に、発熱回路部品３９を実装するようにしてよい。 In the control circuit unit U2 and the power circuit unit U3 shown in FIGS. 1 and 2, the case where the heat transfer members 35 and 37 have the same outer shape as the control circuit board 22 and the power circuit board 23 has been described. However, the present invention is not limited to the above-described configuration, and the heat transfer members 35 and 37 may be provided only where the heat generating circuit component 39 exists.
1 and 2, the case where the heat generating circuit component 39 is mounted on the heat transfer members 35 and 37 on the back surface side using the control circuit board 22 and the power supply circuit board 23 has been described. However, the present invention is not limited to the above configuration. That is, the heat generating circuit component 39 may be mounted on the outer peripheral area of the control circuit board 22 and the power supply circuit board 23 on the opposite side to the heat transfer members 35 and 37.
　さらに、図１及び図２においては、平滑用のコンデンサとしてフィルムコンデンサ４を適用した場合について説明したが、これに限定されるものではなく、円柱状の電解コンデンサを適用するようにしてもよい。
　また、本発明に係る電力変換装置１を、電気自動車に適用する場合について説明したが、これに限定されるものではなく、軌条を走行する鉄道車両にも本発明を適用することができ、任意の電気駆動車両に適用することができる。さらに電力変換装置１としては電気駆動車両に限らず、他の産業機器における電動モータ等のアクチュエータを駆動する場合に本発明の電力変換装置１を適用することができる。 Furthermore, although the case where the film capacitor 4 is applied as a smoothing capacitor has been described in FIGS. 1 and 2, the present invention is not limited to this, and a cylindrical electrolytic capacitor may be applied.
Moreover, although the case where the power converter device 1 which concerns on this invention is applied to an electric vehicle was demonstrated, it is not limited to this, This invention can be applied also to the rail vehicle which drive | works a rail, and is arbitrary. It can be applied to an electrically driven vehicle. Furthermore, the power conversion device 1 is not limited to an electrically driven vehicle, and the power conversion device 1 of the present invention can be applied when driving an actuator such as an electric motor in other industrial equipment.
　以上のように、本発明に係る冷却構造体及び電力変換装置は、加工コストの低減化を図るとともに、周溝からＯリングが抜け出にくい構造とすることで組立効率を向上させるのに有用である。 As described above, the cooling structure and the power conversion device according to the present invention are useful for reducing the machining cost and improving the assembly efficiency by making the O-ring difficult to escape from the circumferential groove. .
　１…電力変換装置、２…筐体、２Ａ…下部筐体、２Ｂ…上部筐体、２ａ…角筒体、２ｂ…蓋体、３…冷却体、３ａ…給水口、３ｂ…排水口、３ｃ…冷却体の上面、３ｅ…挿通孔、４…フィルムコンデンサ、４ａ…正負の電極、５…浸漬部、６…周溝、８…Ｏリング当接部、１１…パワーモジュール、１１ａ…負極端子、１１ｂ…３相交流出力端子、１２…ケース体、１３…放熱部材、１３ａ…下面、１４…固定ねじ、１５…挿通孔、１６…基板固定部、１６ａ…雌ねじ部、１７…接液部、１７ａ…冷却ファン、１８…あり溝形状の周溝、１８ａ…溝底、１８ｂ…開口部、１８ｃ…第１の傾斜内壁、１８ｄ…第２の傾斜内壁、１９…Ｏリング、２０…片あり溝形状の周溝、２０ａ…溝底、２０ｂ…開口部、２０ｃ…傾斜内壁、２０ｄ…垂直内壁、２１…駆動回路基板、２１ａ…挿通孔、２２…制御回路基板、２２ａ…挿通孔、２３…電源回路基板、２３ａ…挿通孔、２４ａ…雄ねじ部、２４ｂ…雌ねじ部、２５ａ…雄ねじ部、２５ｂ…雌ねじ部、３２，３３…伝熱支持用金属板、３２ａ…伝熱支持板部、３２ｂ…伝熱支持側板部、３２ｃ…冷却体接触板部、３２ｃ，３３ｃ…冷却体接触板部、３２ｃ１，３３ｃ１…固定部材挿通孔、３２ｉ…挿通孔、３３ａ…伝熱支持板部、３３ｂ…伝熱支持側板部、３３ｃ…冷却体接触板部、３３ｉ…挿通孔、３５…伝熱部材、３７…伝熱部材、３９…発熱回路部品、４２…絶縁シート、４３…絶縁シート、５１…固定ねじ、５２…接続コード、５３，５９…圧着端子、５５…ブスバー、５７…電流センサ、５８…モータ接続ケーブル、６０…固定ねじ DESCRIPTION OF SYMBOLS 1 ... Power converter device, 2 ... Housing | casing, 2A ... Lower housing | casing, 2B ... Upper housing | casing, 2a ... Square cylinder body, 2b ... Cover body, 3 ... Cooling body, 3a ... Water supply port, 3b ... Drainage port, 3c ... upper surface of cooling body, 3e ... insertion hole, 4 ... film capacitor, 4a ... positive and negative electrodes, 5 ... immersion part, 6 ... circumferential groove, 8 ... O-ring contact part, 11 ... power module, 11a ... negative electrode terminal, 11b: Three-phase AC output terminal, 12: Case body, 13: Heat radiating member, 13a: Lower surface, 14: Fixing screw, 15 ... Insertion hole, 16 ... Substrate fixing part, 16a ... Female screw part, 17 ... Liquid contact part, 17a DESCRIPTION OF SYMBOLS Cooling fan, 18 ... Circumferential groove of dovetail shape, 18a ... Groove bottom, 18b ... Opening, 18c ... First inclined inner wall, 18d ... Second inclined inner wall, 19 ... O-ring, 20 ... One-side groove shape 20a ... groove bottom, 20b ... opening, 20c ... inclined inner wall, 20d ... vertical inside 21 ... Drive circuit board, 21a ... insertion hole, 22 ... control circuit board, 22a ... insertion hole, 23 ... power supply circuit board, 23a ... insertion hole, 24a ... male screw part, 24b ... female screw part, 25a ... male screw part, 25b ... Female screw part, 32, 33 ... Heat transfer support metal plate, 32a ... Heat transfer support plate part, 32b ... Heat transfer support side plate part, 32c ... Cooling body contact plate part, 32c, 33c ... Cooling body contact plate part, 32c1 33c1 ... fixing member insertion hole, 32i ... insertion hole, 33a ... heat transfer support plate, 33b ... heat transfer support side plate, 33c ... cooling body contact plate, 33i ... insertion hole, 35 ... heat transfer member, 37 ... Heat transfer member, 39 ... heat generating circuit component, 42 ... insulating sheet, 43 ... insulating sheet, 51 ... fixing screw, 52 ... connection cord, 53,59 ... crimp terminal, 55 ... bus bar, 57 ... current sensor, 58 ... motor connection Cable, 60 ... solid A screw

Claims (7)

  1. 　発熱体と、
    　前記発熱体に接合される冷却体と、を備え、
    　前記冷却体は、前記発熱体に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、
    　前記発熱体は、前記冷却体に接合する側に前記浸漬部に挿入配置する接液部が突出して形成されるとともに、前記浸漬部を液密封止する液密封止部を備えたことを特徴とする冷却構造体。     A heating element;
    A cooling body joined to the heating element,
    The cooling body is formed with an opening formed on the side to be joined to the heating element, and includes an immersion part through which a coolant flows.
    The heating element is provided with a liquid-tight sealing part for liquid-tightly sealing the immersion part while being formed with a liquid-contact part inserted and arranged in the immersion part protruding from the side to be joined to the cooling body. Cooling structure.
  2. 　一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、を備え、
    　前記冷却体は、前記放熱部材に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、
    前記放熱部材は、前記冷却体に接合する側に前記浸漬部に挿入配置する接液部が突出して形成されるとともに、前記浸漬部を液密封止する液密封止部を備えたことを特徴とする電力変換装置。     A semiconductor power module having a heat dissipation member formed on one surface;
    A cooling body joined to the heat radiating member,
    The cooling body is formed to be open on the side to be joined to the heat radiating member, and includes a dipping portion through which a coolant flows.
    The heat dissipating member is provided with a liquid-tight sealing part for liquid-tightly sealing the immersion part, while a liquid contact part inserted and arranged in the immersion part protrudes on a side to be joined to the cooling body. Power converter.
  3. 　一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体パワーモジュールを駆動する回路部品を実装した実装基板の熱を、前記冷却体に伝熱させる伝熱板と、を備え、
    　前記冷却体は、前記放熱部材に接合する側に開口して形成され、冷却液を通流する浸漬部を備え、
    　前記放熱部材は、前記冷却体に接合する側に前記浸漬部に挿入配置する突出した接液部と、前記浸漬部の開口を囲むように形成されてＯリングを装着した周溝と、を備え、
    　前記放熱部材及び前記冷却体は、前記周溝より外周側の互いの平坦な接合面で前記伝熱板を挟持して接合され、
    　前記Ｏリングの断面直径は、前記Ｏリングと前記冷却体との接触面および前記Ｏリングと周溝との接触面との間の距離より大きな値であることを特徴とする電力変換装置。     A semiconductor power module having a heat dissipation member formed on one surface;
    A cooling body joined to the heat dissipation member;
    A heat transfer plate for transferring the heat of the mounting board on which the circuit components for driving the semiconductor power module are mounted to the cooling body,
    The cooling body is formed to be open on the side to be joined to the heat radiating member, and includes a dipping portion through which a coolant flows.
    The heat dissipating member includes a protruding liquid contact portion that is inserted and disposed in the immersion portion on a side to be joined to the cooling body, and a circumferential groove that is formed so as to surround the opening of the immersion portion and is fitted with an O-ring. ,
    The heat dissipating member and the cooling body are joined by sandwiching the heat transfer plate at a flat joining surface on the outer peripheral side from the circumferential groove,
    The cross-sectional diameter of the O-ring is a value greater than the distance between the contact surface between the O-ring and the cooling body and the contact surface between the O-ring and the circumferential groove.
  4. 　電力変換用の半導体スイッチング素子をケース体に内蔵し、当該ケース体の一面に放熱部材が形成された半導体パワーモジュールと、
    　前記放熱部材に接合される冷却体と、
    　前記半導体スイッチング素子を駆動する発熱回路部品を含む回路部品を実装した実装基板と、
    　当該実装基板を前記半導体パワーモジュールとの間に所定間隔を保って支持し、当該実装基板の発熱を前記冷却体に筐体を介することなく放熱するように前記冷却体に接触させる伝熱支持用金属板と、を備え、
    　前記放熱部材は、前記冷却体に接合する側に接液部が突出して形成され、
    　前記冷却体は、前記放熱部材に接合する側に開口し、通流される冷却液に前記接液部を浸漬する浸漬部が形成されており、
    　前記放熱部材に、前記浸漬部を外側から液密封止する液密封止部を設けたことを特徴とする電力変換装置。     A semiconductor power module in which a semiconductor switching element for power conversion is built in a case body, and a heat dissipation member is formed on one surface of the case body,
    A cooling body joined to the heat dissipation member;
    A mounting board on which circuit components including a heat generating circuit component for driving the semiconductor switching element are mounted;
    Supporting the mounting board with the semiconductor power module at a predetermined interval, and supporting heat transfer to contact the cooling body so as to dissipate heat generated by the mounting board to the cooling body without passing through a housing. A metal plate,
    The heat dissipating member is formed with a liquid contact portion protruding on the side to be joined to the cooling body,
    The cooling body is opened on the side to be joined to the heat dissipating member, and an immersion part is formed for immersing the liquid contact part in a flowing coolant.
    A power conversion device, wherein the heat radiating member is provided with a liquid-tight sealing portion that liquid-tightly seals the immersion portion from the outside.
  5. 　前記液密封止部は、前記浸漬部の外側を囲むように前記放熱部材の前記冷却体に接合する側に形成された周溝と、
    　この周溝に、抜け止めされながら装着されるＯリングと、を備えていることを特徴とする請求項４記載の電力変換装置。     The liquid-tight sealing portion is a circumferential groove formed on the side of the heat radiating member joined to the cooling body so as to surround the outside of the immersion portion,
    The power converter according to claim 4, further comprising an O-ring attached to the circumferential groove while being prevented from coming off.
  6. 　前記周溝は、溝底の幅方向の一方から開口部まで傾斜して延在する第１の傾斜内壁と、前記溝底の幅方向の他方から前記開口部まで傾斜して延在する第２の傾斜内壁とを備えたあり溝形状に形成されていることを特徴とする請求項５記載の電力変換装置。 The circumferential groove has a first inclined inner wall extending inclined from one of the width directions of the groove bottom to the opening, and a second extending inclined from the other of the width directions of the groove bottom to the opening. The power conversion device according to claim 5, wherein the power conversion device is formed in a dovetail groove shape having an inclined inner wall.
  7. 　前記周溝は、溝底から開口部まで傾斜して延在する傾斜内壁と、前記溝底から前記開口部まで垂直に延在する垂直内壁とを備えた片あり溝形状であることを特徴とする請求項５記載の電力変換装置。 The circumferential groove has a one-sided groove shape including an inclined inner wall extending inclined from the groove bottom to the opening and a vertical inner wall extending vertically from the groove bottom to the opening. The power conversion device according to claim 5.
PCT/JP2013/003050 2012-08-03 2013-05-13 Cooling structure and power converter WO2014020807A1 (en)

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